A three-dimensional automatic semiconductor wafer cleaning machine

Abstract

The present invention belongs to the technical field of semiconductor wafers, and in particular, to a three-dimensional semiconductor wafer automatic cleaning machine, which includes a cleaning tank and a vertical conveyor belt. A plurality of cleaning tanks are movably arranged and vertically distributed in a hinged manner on the outer surface of the vertical conveyor belt. The cleaning machine also includes a pushing mechanism installed on one side of the vertical conveyor belt for locking the cleaning tank, a filtering device installed on the cleaning tank, and an anti-volatilization device. In this three-dimensional semiconductor wafer automatic cleaning machine, by setting the filtering device, the cleaning liquid in the cleaning tank can be filtered and reused, reducing the number of times of cleaning liquid replacement, preventing the cleaning effect on the wafer from being affected after the cleaning liquid is used multiple times. Through the deflection of the filtering arc plate, impurities in the cleaning liquid can be filtered, so that the filtered water is located above the filtering arc plate, facilitating the cleaning of the wafer, thereby reducing the damage to the wafer, and solving the technical problem that the cleaning liquid in the cleaning tank needs to be replaced regularly, resulting in waste of the cleaning liquid.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafers, and in particular to a three-dimensional automatic semiconductor wafer cleaning machine. Background Art

[0002] A wafer refers to the silicon chip used to manufacture silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer to become IC products with specific electrical functions.

[0003] Existing single-chip semiconductor wafer cleaning requires the use of a robotic arm to repeatedly clamp the wafer and place it in different cleaning tanks for cleaning, which reduces work efficiency, is time-consuming and labor-intensive, and multiple clamping can easily cause irreversible damage to the wafer, greatly delaying cleaning time and efficiency. At the same time, the cleaning fluid in the cleaning tank needs to be replaced regularly, resulting in waste of cleaning fluid. Summary of the Invention

[0004] Based on the technical problems that the existing single-piece semiconductor wafer cleaning is time-consuming and labor-intensive, and multiple clamping can easily cause irreversible damage to the wafer, which will greatly delay the cleaning time and cleaning efficiency, and the cleaning liquid in the cleaning tank needs to be replaced regularly, resulting in waste of cleaning liquid, the present invention proposes a three-dimensional semiconductor wafer automatic cleaning machine.

[0005] The present invention proposes a three-dimensional semiconductor wafer automatic cleaning machine, which includes a cleaning tank and a vertical conveyor belt. A plurality of the cleaning tanks are movably arranged on the outer surface of the vertical conveyor belt and are hinged and vertically distributed. The machine also includes a pushing mechanism installed on one side of the vertical conveyor belt for locking the cleaning tank, a filtering device installed on the cleaning tank, and an anti-volatile device.

[0006] The pushing mechanism includes a pushing hydraulic cylinder and a locking block. The pushing hydraulic cylinder is inserted into the locking block to achieve a locking action on the cleaning tank.

[0007] A filtering device is provided inside the cleaning tank on the vertical conveyor belt, and filters the cleaning liquid in the cleaning tank and then guides it into the inside of the cleaning tank. The filtering device includes a micro water pump, a filter, an annular nozzle and a salvage mechanism. When the cleaning liquid cleans the wafers, the salvage mechanism deflects and salvages impurities in the cleaning liquid, and the impurities are then sucked into the filter by the micro water pump for filtration.

[0008] An anti-volatility device includes a sealing sheet and a gear ring for sealing the cleaning tank. The anti-volatility device is located on the upper surface of the cleaning tank. The gear ring deflects multiple sealing sheets to block and seal the upper surface of the cleaning tank.

[0009] Preferably, the outer surface of the pushing hydraulic cylinder is fixedly installed with the outer surface of the frame of the vertical conveyor belt through a bracket, and the outer surface of the locking block is fixedly installed with the outer side surface of the cleaning tank located on the vertical conveyor belt.

[0010] Through the above technical solution, by inserting the pushing hydraulic cylinder into the locking block on the cleaning tank in use, the cleaning tank can be limited, preventing the cleaning tank from shaking when the cleaning head clamps the wafer and cleans it in the cleaning tank. By switching the cleaning tank, the clamping of the wafer by the mechanical claw can be reduced, and at the same time, the vertical conveyor belt can reduce the area occupied by the cleaning machine.

[0011] Preferably, a counterweight is fixedly installed on the lower surface of the cleaning tank. The outer surface of the counterweight is hemispherical, and an installation groove is opened on the lower surface of the counterweight.

[0012] Through the above technical solution, when the vertical conveyor belt drives the cleaning tank to rotate, the counterweight can keep the center of gravity of the cleaning tank downward, preventing the cleaning tank from shaking and tilting significantly.

[0013] Preferably, the outer surface of the micro water pump is fixedly installed with the outer surface of the cleaning tank, and the water inlet end of the micro water pump is fixedly communicated with the upper end of the filter.

[0014] Through the above technical solution, the cleaning liquid or clean water inside the cleaning tank fixed to it is sucked by the micro water pump, and the cleaning liquid is filtered by the filter, and the impurities contained in the cleaning liquid are retained in the filter. The filter and the micro water pump are connected by bolts, which facilitates the removal of the filter to clean the impurities inside.

[0015] Preferably, the lower end of the filter is fixedly communicated with the outer surface of the cleaning tank through a connecting pipe, the outer surface of the annular spray pipe is fixedly installed on the inner wall of the cleaning tank, and the water outlet end of the micro water pump is fixedly communicated with the outer surface of the annular spray pipe.

[0016] Through the above technical solution, the cleaning liquid in the cleaning tank is circulated by spraying through the annular spray pipe, and at the same time, the cleaning liquid sprayed by the annular spray pipe can clean the wafer again.

[0017] Preferably, the fishing mechanism includes an electric push rod, and the outer surface of the electric push rod is fixedly installed on the inner wall of the installation groove.

[0018] Through the above technical solution, the electric push rod can push the filter arc plate to lift, drive the filter arc plate to lift, complete the fishing work, and retain the impurities below the cleaning tank without affecting the cleaning of the wafer.

[0019] Preferably, one end of the electric push rod is fixedly installed with a support housing. The upper inner wall of the support housing is fixedly installed with an upper gear disk through a bearing. The lower inner wall of the support housing is fixedly installed with a driving motor, and the driving motor drives the upper gear disk to rotate through a gear set.

[0020] Through the above technical solution, the rotation of the upper gear disk can drive multiple filter arc plates to deflect in the same direction. After the filter arc plates are tilted, the impurities on the upper surface can flow into the cleaning tank under the cleaning of the annular nozzle, reducing the impurities on the upper surface of the filter arc plates. By enabling the filter arc plates to form an umbrella shape after resetting, it is convenient to filter the water in the cleaning tank, and the impurities are retained below the filter arc plates.

[0021] Preferably, the outer surface of the support housing is fixedly installed with filter arc plates distributed in an annular array. The multiple filter arc plates enclose an umbrella shape. One end of the filter arc plate located on the support housing is fixedly installed with a driven gear, and the outer surface of the driven gear meshes with the upper surface of the upper gear disk.

[0022] Through the above technical solution, the filter arc plates are used to filter the water in the cleaning tank. When the filter arc plates enclose an umbrella shape and descend, they can filter the cleaning liquid in the cleaning tank. The impurities contained in the cleaning liquid cannot pass through the filter holes on the filter arc plates, while the cleaning liquid can pass through the filter holes and be located above the filter arc plates, so that the cleaning liquid in contact with the wafer remains clean. The cleaning liquid containing impurities is located below, which is convenient for the micro water pump to suck. The inner diameter of the upper half end inner wall of the cleaning tank is larger than that of the lower half end inner wall, which is convenient for the expansion of the filter arc plates and also convenient for the cleaning of the wafer.

[0023] Preferably, a limit ring is fixedly installed on the upper surface of the cleaning tank. The inner wall of the limit ring is rotatably connected to the outer surface of the tooth ring. One end of the sealing sheet is fixedly installed with the inner wall of the limit ring through a bearing. A deflection gear is fixedly installed on the upper surface of the sealing sheet, and the outer surface of the deflection gear meshes with the inner wall of the tooth ring.

[0024] Through the above technical solution, the multiple sealing sheets have a certain inclination angle, which is convenient for overlapping after deflection. The sealing sheet can prevent the volatilization of the cleaning liquid in the cleaning tank and prevent dust from entering the cleaning tank during the rotation process, causing pollution of the cleaning liquid.

[0025] Preferably, a sealing motor is fixedly installed on the outer surface of the limit ring, and the output shaft of the sealing motor drives the rotation of the tooth ring through a gear.

[0026] Through the above technical solution, the sealing motor drives the tooth ring to rotate through a gear. After the tooth ring drives the multiple sealing sheets to deflect, the effects of expansion and sealing are achieved.

[0027] The beneficial effects in the present invention are:

[0028] 1. By setting up a vertical conveyor belt, the number of times the robotic arm picks up the wafer is reduced. The rotation of the cleaning tank is driven by the vertical conveyor belt to realize the switching of the cleaning tank, enabling the same wafer to be cleaned with different cleaning liquids to complete the cleaning work without the need to pick up the wafer multiple times. At the same time, the vertical conveyor belt can save the occupied space, thereby reducing the damage to the wafer, solving the technical problems that the existing single-piece semiconductor wafer cleaning requires the robotic arm to repeatedly pick up the wafer, which is time-consuming and laborious, and multiple pick-ups are likely to cause irreversible damage to the wafer, and it will also seriously delay the cleaning time and cleaning efficiency.

[0029] 2. By setting up a pushing mechanism, the cleaning tank can be fixed to prevent the cleaning tank from shaking during the wafer cleaning process, which affects the cleaning process and causes damage to the wafer. The pushing hydraulic cylinder is inserted into the locking block to fix the cleaning tank, thereby maintaining the stability of the cleaning tank.

[0030] 3. By setting up a filtering device, the cleaning liquid in the cleaning tank can be filtered and reused, reducing the number of times the cleaning liquid is replaced, preventing the cleaning effect on the wafer from being affected after the cleaning liquid is used multiple times. Through the deflection of the filtering arc plate, the impurities in the cleaning liquid can be filtered, and the filtered water is located above the filtering arc plate, facilitating the cleaning of the wafer, thereby reducing the damage to the wafer, and solving the technical problem that the cleaning liquid in the cleaning tank needs to be replaced regularly, resulting in waste of the cleaning liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 Schematic diagram of a three-dimensional semiconductor wafer automatic cleaning machine proposed by the present invention;

[0032] Figure 2 Three-dimensional view of the cleaning tank structure of a three-dimensional semiconductor wafer automatic cleaning machine proposed by the present invention;

[0033] Figure 3 Three-dimensional view of the filtering arc plate structure of a three-dimensional semiconductor wafer automatic cleaning machine proposed by the present invention;

[0034] Figure 4 Three-dimensional view of the upper gear disk structure of a three-dimensional semiconductor wafer automatic cleaning machine proposed by the present invention;

[0035] Figure 5 Three-dimensional view of the gear ring structure of a three-dimensional semiconductor wafer automatic cleaning machine proposed by the present invention;

[0036] Figure 6 Three-dimensional view of the sealing piece structure of a three-dimensional semiconductor wafer automatic cleaning machine proposed by the present invention.

[0037] In the figure: 1. Cleaning tank; 10. Limit ring; 101. Tooth ring; 102. Sealing sheet; 103. Deflection gear; 104. Sealing motor; 2. Vertical conveyor belt; 3. Pushing hydraulic cylinder; 31. Locking block; 32. Counterweight; 33. Installation groove; 4. Micro water pump; 41. Filter; 42. Annular spray pipe; 5. Electric push rod; 51. Support housing; 52. Upper tooth disc; 53. Driving motor; 54. Driven gear; 55. Filter arc plate. Detailed implementation manner

[0038] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0039] Refer to Figures 1-6 As shown, a three-dimensional semiconductor wafer automatic cleaning machine includes a vertical cleaning tank 1 and a vertical conveyor belt. A plurality of cleaning tanks 1 are movably arranged on the outer surface of the vertical conveyor belt 2 and are vertically distributed by hinges. In order to facilitate the rotation of the cleaning tank 1 and reduce the floor area of the device, the vertical conveyor belt 2 also includes a pushing mechanism installed on one side of the vertical conveyor belt 2 for locking the cleaning tank 1, a filtering device installed on the cleaning tank 1, and an anti-volatilization device.

[0040] As Figure 1 and 3 shown, in order to fix and limit the cleaning tank 1, the pushing mechanism includes a pushing hydraulic cylinder 3 and a locking block 31. The pushing mechanism is located on the outer surface of the frame of the vertical conveyor belt 2. After the piston rod of the pushing hydraulic cylinder 3 is inserted into the inside of the locking block 31, the cleaning tank 1 is fixed.

[0041] Specifically, the outer surface of the pushing hydraulic cylinder 3 is fixedly installed on the outer surface of the frame of the vertical conveyor belt 2 through a bracket, and then the outer surface of the locking block 31 is fixedly installed on the outer side surface of the cleaning tank 1.

[0042] Furthermore, in order to reduce the shaking of the cleaning tank 1, a counterweight 32 is fixedly installed on the lower surface of the cleaning tank 1, and then an installation groove 33 is opened on the lower surface of the counterweight 32.

[0043] As Figure 2 and Figures 3-4 shown, in order to filter the impurities during the reuse process of the cleaning liquid in the cleaning tank 1 and at the same time not affect the cleaning process of the wafer, a filtering device for dynamically filtering the cleaning liquid is provided on the lower surface of the cleaning tank 1. The filtering device salvages and aggregates the impurities contained in the cleaning liquid in the cleaning tank 1 and then filters and diverts them into the cleaning tank 1.

[0044] Specifically, the filtering device includes a micro water pump 4 for pumping water in a cycle, a filter 41 for filtering, an annular nozzle 42 for rinsing the wafer, and a salvage mechanism. When the wafer is being cleaned, the lifting of the salvage mechanism aggregates the impurities in the cleaning liquid at the bottom of the cleaning tank 1. The micro water pump 4 sucks the water in the cleaning tank 1 and filters it through the filter 41. The filtered cleaning liquid is sprayed by the annular nozzle 42 onto the wafer being cleaned in the cleaning tank 1.

[0045] Further, to facilitate sucking the cleaning liquid in the cleaning tank 1, the outer surface of the micro water pump 4 is fixedly installed on the outer surface of the cleaning tank 1, and the water inlet end of the micro water pump 4 is fixedly connected to the upper end of the filter 41.

[0046] Further, to facilitate cleaning the filter, the filter 41 can be fixedly installed on the micro water pump 4 through bolts, facilitating the disassembly and cleaning of the impurities filtered in the filter 41. To filter the cleaning liquid in the cleaning tank 1, the lower end of the filter 41 is fixedly connected to the outer surface of the cleaning tank 1 through a connecting pipe. To facilitate cleaning the wafer, the outer surface of the annular nozzle 42 is fixedly installed on the inner wall of the cleaning tank 1, and then the water outlet end of the micro water pump 4 is fixedly connected to the outer surface of the annular nozzle 42.

[0047] The salvage mechanism is installed inside the cleaning tank 1. To salvage and filter the impurities in the cleaning tank 1, an electric push rod 5 is fixedly installed on the inner wall of the installation groove 33.

[0048] Further, a support housing 51 is fixedly installed at one end of the electric push rod 5. The support housing 51 is made of waterproof material. One end of the support housing 51 penetrates through the inner bottom wall of the cleaning tank 1 and extends into the interior of the cleaning tank 1. A sealing ring is provided at the connection between the cleaning tank 1 and the support housing 51 to prevent the leakage of the cleaning liquid during the lifting of the support housing 51. To automatically perform the salvage and filtering work, an upper gear disk 52 is fixedly installed on the inner wall of the upper end of the support housing 51 at one end of the support housing 51 through a bearing. To drive the upper gear disk 52 to rotate, a driving motor 53 is fixedly installed on the inner wall of the lower end of the support housing 51, and the driving motor 53 drives the upper gear disk 52 to rotate through a gear set.

[0049] Further, in order to filter the cleaning liquid, filter arc plates 55 made of filter material are fixedly installed on the outer surface of the support housing 51 in an annular array around the bearing. A plurality of filter arc plates 55 enclose an open umbrella shape. In order to drive the deflection of the filter arc plates 55, a driven gear 54 is fixedly installed at one end of the filter arc plate 55 located inside the support housing 51. Then, the outer surface of the driven gear 54 meshes with the upper surface of the upper gear disk 52. In order to facilitate the cleaning of the wafer and the opening and closing of the filter arc plates 55, the inner diameter of the upper end inner wall of the cleaning tank 1 is larger than that of the lower end inner wall. The filter arc plates 55 are located at the upper end for opening and closing. The water level of the cleaning liquid in the cleaning tank 1 is at the lower end inner wall, reducing the impurities contained in the cleaning liquid at the upper end.

[0050] As Figures 5-6 shown, the anti-volatilization device includes a sealing sheet 102 for sealing the cleaning tank 1 and a toothed ring 101. The anti-volatilization device is located on the upper surface of the cleaning tank 1. The toothed ring 101 deflects a plurality of sealing sheets 102 and then shields and seals the upper surface of the cleaning tank 1.

[0051] Further, in order to perform the sealing work on the cleaning tank 1, a limit ring 10 is fixedly installed on the upper surface of the cleaning tank 1. Then, the inner wall of the limit ring 10 is rotatably connected to the outer surface of the toothed ring 101 for limiting. One end of the sealing sheet 102 is fixedly installed on the inner wall of the limit ring 10 through a bearing. A plurality of sealing sheets 102 are distributed in an annular array. A plurality of sealing sheets 102 have a certain inclination angle, facilitating stacking after deflection. In order to drive the deflection of the sealing sheet 102, a deflection gear 103 is fixedly installed on the upper surface of the sealing sheet 102. The outer surface of the deflection gear 103 meshes with the inner wall of the toothed ring 101. In order to automatically drive the rotation of the toothed ring 101, the outer surface of the limit ring 10 is fixedly installed with a sealing motor 104. Then, the output shaft of the sealing motor 104 drives the rotation of the toothed ring 101 through a gear.

[0052] Working principle: When the cleaning head holds the wafer to be cleaned and moves to the cleaning tank 1 above the vertical conveyor belt 2, the sealing motor 104 in the limit ring 10 drives the rotation of the toothed ring 101 through the gear on the output shaft. The rotation of the toothed ring 101 drives the rotation of the deflection gear 103. A plurality of deflection gears 103 can drive the sealing sheets 102 to rotate at the same speed and in the same direction, opening the cleaning tank 1. Then, the hydraulic cylinder 3 is pushed into the locking block 31 to fix the cleaning tank 1 and prevent it from shaking. The cleaning head can place the wafer in the cleaning tank 1. By controlling the rotation of the toothed ring 101 through the sealing motor 104 and driving the sealing sheets 102 to rotate back, it can seal the periphery of the cleaning head, preventing the splashing of the cleaning liquid or the entry of dust into the cleaning tank 1 during the cleaning process;

[0053] Meanwhile, the drive motor 53 inside the support housing 51 starts, driving the upper gear disc 52 to rotate. The rotation of the upper gear disc 52 drives the outwardly deployed filter arc plate 55 to deflect in the same direction through the transmission of the driven gear 54, and then they are combined into an umbrella shape. At the same time, the electric push rod 5 in the installation groove 33 pulls the support housing 51 downward, and the filter arc plate 55 filters the cleaning liquid, so that the filtered cleaning liquid is located above the filter arc plate 55, and the water containing impurities is located below the filter arc plate 55. The wafer enters the cleaning tank 1 for cleaning. At the same time, the micro water pump 4 works, sucks the cleaning liquid at the lower end of the cleaning tank 1 and enters the filter 41 for filtering, and sprays the filtered cleaning liquid onto the wafer in the cleaning tank 1 through the annular nozzle 42.

[0054] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, making equivalent substitutions or changes, should be covered by the protection scope of the present invention.

Claims

1. A three-dimensional semiconductor wafer automatic cleaning machine, characterized in that: It includes a cleaning tank (1) and a vertical conveyor belt (2). A plurality of the cleaning tanks (1) are movably arranged and vertically distributed in a hinged manner on the outer surface of the vertical conveyor belt (2). It further includes a pushing mechanism installed on one side of the vertical conveyor belt (2) for locking the cleaning tank (1), a filtering device installed on the cleaning tank (1), and an anti-volatilization device. Pushing mechanism, the pushing mechanism includes a pushing hydraulic cylinder (3) and a locking block (31). The pushing hydraulic cylinder (3) is inserted into the locking block (31) to lock the cleaning tank (1). Filtering device, the filtering device is arranged inside the cleaning tank (1) located on the vertical conveyor belt (2), filters the cleaning liquid in the cleaning tank (1), and then diverts it back into the cleaning tank (1). The filtering device includes a micro water pump (4), a filter (41), an annular spray pipe (42), and a salvage mechanism. When the cleaning liquid is used to clean the wafer, the salvage mechanism deflects and salvages the impurities in the cleaning liquid, and then the impurities are sucked into the filter (41) by the micro water pump (4) for filtering. Anti-volatilization device, the anti-volatilization device includes a sealing sheet (102) for sealing the cleaning tank (1) and a toothed ring (101). The anti-volatilization device is located on the upper surface of the cleaning tank (1). The toothed ring (101) deflects a plurality of the sealing sheets (102) to cover and seal the upper surface of the cleaning tank (1).

2. The automatic three-dimensional semiconductor wafer cleaning machine according to claim 1, wherein: The outer surface of the pushing hydraulic cylinder (3) is fixedly installed on the outer surface of the frame of the vertical conveyor belt (2) through a bracket, and the outer surface of the locking block (31) is fixedly installed on the outer side surface of the cleaning tank (1) located on the vertical conveyor belt (2).

3. The automatic cleaning machine for three-dimensional semiconductor wafers according to claim 1, characterized in that: A counterweight block (32) is fixedly installed on the lower surface of the cleaning tank (1). The outer surface of the counterweight block (32) is hemispherical, and an installation groove (33) is opened on the lower surface of the counterweight.

4. A three-dimensional semiconductor wafer automatic cleaning machine according to claim 1, characterized in that: The outer surface of the micro water pump (4) is fixedly installed on the outer surface of the cleaning tank (1), and the water inlet end of the micro water pump (4) is fixedly communicated with the upper end of the filter (41).

5. The automatic cleaning machine for three-dimensional semiconductor wafers according to claim 1, wherein: The lower end of the filter (41) is fixedly communicated with the outer surface of the cleaning tank (1) through a connecting pipe. The outer surface of the annular spray pipe (42) is fixedly installed on the inner wall of the cleaning tank (1), and the water outlet end of the micro water pump (4) is fixedly communicated with the outer surface of the annular spray pipe (42).

6. The automatic cleaning machine for three-dimensional semiconductor wafers according to claim 3, wherein: The salvage mechanism includes an electric push rod (5). The outer surface of the electric push rod (5) is fixedly installed on the inner wall of the installation groove (33).

7. The automatic cleaning machine for three-dimensional semiconductor wafers according to claim 6, characterized in that: One end of the electric push rod (5) is fixedly installed with a support housing (51). The upper inner wall of the support housing (51) is fixedly installed with an upper toothed disc (52) through a bearing. The lower inner wall of the support housing (51) is fixedly installed with a driving motor (53). The driving motor (53) drives the upper toothed disc (52) to rotate through a gear set.

8. The automatic cleaning machine for three-dimensional semiconductor wafers according to claim 7, characterized in that: The outer surface of the support housing (51) is fixedly installed with filter arc plates (55) distributed in an annular array through bearings. A plurality of the filter arc plates (55) enclose an umbrella shape. One end of the filter arc plate (55) located on the support housing (51) is fixedly installed with a driven gear (54), and the outer surface of the driven gear (54) meshes with the upper surface of the upper tooth disc (52).

9. The automatic cleaning machine for a three-dimensional semiconductor wafer according to claim 1, characterized in that: A limit ring (10) is fixedly installed on the upper surface of the cleaning tank (1). The inner wall of the limit ring (10) is rotatably connected to the outer surface of the tooth ring (101). One end of the sealing piece (102) is fixedly installed on the inner wall of the limit ring (10) through a bearing. A deflection gear (103) is fixedly installed on the upper surface of the sealing piece (102), and the outer surface of the deflection gear (103) meshes with the inner wall of the tooth ring (101).

10. A three-dimensional semiconductor wafer automatic cleaning machine according to claim 9, characterized in that: A sealing motor (104) is fixedly installed on the outer surface of the limit ring (10), and the output shaft of the sealing motor (104) drives the rotation of the tooth ring (101) through a gear.

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