Floor tile polishing robot polishing control method, device, equipment and medium

Abstract

The present application relates to the technical field of floor tile polishing, and specifically discloses a polishing control method, device, equipment and medium for a floor tile polishing robot, wherein the method comprises the following steps: in the process of polishing based on the movement of the polishing path of the floor tile polishing robot, obtaining the first light reflectivity information of the floor tile surface on the tail side of the floor tile polishing robot based on the reflectivity sensor; generating a light reflectivity curve according to the first light reflectivity information; analyzing the to-be-repaired polishing path segment and generating corresponding polishing repair parameters according to the change of the light reflectivity curve and the polishing path; and controlling the floor tile polishing robot to perform repair polishing on the to-be-repaired polishing path segment according to the polishing repair parameters. The method can determine the to-be-repaired polishing path segment and the polishing repair parameters to control the floor tile polishing robot to perform automatic repair polishing, thereby ensuring high consistency of the floor tile polishing process, eliminating the manual inspection and repair process, and greatly reducing the labor cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of floor tile polishing, in particular to a polishing control method and device of a floor tile polishing robot, equipment and medium. BACKGROUND

[0002] Floor tiles need to be polished after being laid or used for a long time to ensure a smooth surface.

[0003] In related art, the floor tile polishing robot is a self-guided polishing device that can polish floor tiles based on manually set polishing parameters and movement paths. After the polishing process is completed, workers need to inspect the site to determine whether there are any unqualified floor tiles, and then re-set the program or manually control the floor tile polishing robot to repair the unqualified floor tiles, which has the disadvantage of high labor cost.

[0004] At present, there is no effective technical solution to the above problems. SUMMARY

[0005] The purpose of the present application is to provide a polishing control method, device, equipment and medium of a floor tile polishing robot, so that the floor tile polishing robot can automatically repair and polish the floor tiles, reducing labor costs.

[0006] In a first aspect, the present application provides a polishing control method of a floor tile polishing robot, applied to a floor tile polishing robot, wherein the tail side of the floor tile polishing robot is provided with a reflectivity sensor pointing downward;

[0007] The method comprises the following steps:

[0008] S1. During the polishing process of the floor tile polishing robot based on the polishing path movement, the first light reflectivity information of the floor tile surface at the tail side of the floor tile polishing robot is obtained based on the reflectivity sensor;

[0009] S2. A light reflectivity curve is generated according to the first light reflectivity information;

[0010] S3. The change of the light reflectivity curve and the polishing path are analyzed to obtain a to-be-repaired polishing path segment and generate corresponding polishing repair parameters;

[0011] S4. The floor tile polishing robot is controlled according to the polishing repair parameters to repair and polish the to-be-repaired polishing path segment.

[0012] The polishing control method of the tile polishing robot in the application can ensure high consistency of tile polishing treatment, and eliminates the manual inspection and repair process, thereby greatly reducing labor costs.

[0013] The polishing control method of the tile polishing robot, wherein step S4 comprises the following steps:

[0014] S41, controlling the tile polishing robot to move reversely based on the polishing path;

[0015] S42, when the tile polishing robot passes through the to-be-repaired polishing path segment, controlling the tile polishing robot to perform repair polishing based on the corresponding repair polishing parameter.

[0016] In this example, in order to simplify the repair polishing strategy of the tile polishing robot, step S41 directly controls the tile polishing robot to move reversely according to the polishing path used in the first polishing, and the node of the unqualified first light reflectance information in the light reflectance curve corresponds to a moving distance or a moving time, so that the tile polishing robot can judge whether it has arrived at the tile that needs to be repaired based on the moving distance or the moving time, and then perform repair polishing on the unqualified tile according to the repair polishing parameter; this embodiment does not need to rely on the map layout to plan a new polishing path.

[0017] The polishing control method of the tile polishing robot, wherein step S4 comprises a step executed between step S41 and step S42:

[0018] S411, when the tile polishing robot arrives at the to-be-repaired polishing path segment, acquiring second light reflectance information, and when the difference between the second light reflectance information and the first light reflectance information of the to-be-repaired polishing path segment is greater than a preset threshold, marking the to-be-repaired polishing path segment as an abnormal area, and skipping the repair polishing process of the to-be-repaired polishing path segment.

[0019] In this example, the tile polishing robot moves reversely, so the reflectance sensor arrives above the tile with unqualified first light reflectance information before the grinding disc, and therefore can first verify whether the tile needs to be repaired by using the second light reflectance information, and then controls the tile polishing robot to continue to move reversely so that the grinding disc arrives above the unqualified tile to perform repair polishing on the tile.

[0020] The polishing control method of the floor tile polishing robot, wherein step S4 comprises the following steps:

[0021] S41', based on the polishing path and the to-be-repaired polishing path segment, obtaining a to-be-repaired polishing area;

[0022] S42', based on the to-be-repaired polishing area, generating a repair polishing path;

[0023] S43', according to the polishing repair parameter and the repair polishing path, controlling the floor tile polishing robot to perform repair polishing on the to-be-repaired polishing path segment.

[0024] The polishing control method of the floor tile polishing robot, wherein step S3 comprises the following steps:

[0025] S31, based on a preset reflectivity threshold, intercepting an abnormal curve segment from the light reflectivity curve;

[0026] S32, based on the polishing path and the abnormal curve segment, obtaining a to-be-repaired polishing path segment, and based on the size of the abnormal curve segment and a pre-constructed repair parameter mapping table, obtaining a polishing repair parameter.

[0027] The polishing control method of the floor tile polishing robot, wherein the reflectivity threshold is set based on the material of the floor tile.

[0028] The polishing control method of the floor tile polishing robot, wherein each to-be-repaired polishing path segment corresponds to at least one set of polishing repair parameters.

[0029] In a second aspect, the application further provides a polishing control device of a floor tile polishing robot, applied to a floor tile polishing robot, the tail side of the floor tile polishing robot being provided with a downwardly arranged reflectivity sensor;

[0030] The device comprises:

[0031] An acquisition module, configured to, in a process in which the floor tile polishing robot moves based on a polishing path to perform polishing, acquire first light reflectivity information of a floor tile surface at the tail side of the floor tile polishing robot based on the reflectivity sensor;

[0032] A curve construction module, configured to generate a light reflectivity curve according to the first light reflectivity information;

[0033] An analysis module, configured to analyze and acquire a to-be-repaired polishing path segment and generate a corresponding polishing repair parameter according to the change of the light reflectivity curve and the polishing path;

[0034] A repair module, configured to control the floor tile polishing robot to perform repair polishing on the to-be-repaired polishing path segment according to the polishing repair parameter.

[0035] The polishing control device of the tile polishing robot provided by the application can obtain first light reflectivity information representing polishing processing effect based on a reflectivity sensor and construct a light reflectivity curve during polishing processing of the tile polishing robot, quickly determine the tile that needs to be polished and the degree of repair based on the light reflectivity curve and a polishing path, determine a polishing path segment to be repaired and polishing repair parameters based on the same, and control the tile polishing robot to perform automatic repair polishing, thereby ensuring high consistency of tile polishing processing, eliminating manual inspection and repair processes, and greatly reducing labor costs.

[0036] In a third aspect, the application further provides an electronic device including a processor and a memory, the memory storing computer readable instructions that, when executed by the processor, perform the steps of the method provided in the first aspect.

[0037] In a fourth aspect, the application further provides a computer readable storage medium having a computer program stored thereon, the computer program, when executed by a processor, performing the steps of the method provided in the first aspect.

[0038] As can be seen from the above, the application provides a polishing control method, device, equipment and medium of a tile polishing robot, wherein the polishing control method of the tile polishing robot can obtain first light reflectivity information representing polishing processing effect based on a reflectivity sensor and construct a light reflectivity curve during polishing processing of the tile polishing robot, quickly determine the tile that needs to be polished and the degree of repair based on the light reflectivity curve and a polishing path, determine a polishing path segment to be repaired and polishing repair parameters based on the same, and control the tile polishing robot to perform automatic repair polishing, thereby ensuring high consistency of tile polishing processing, eliminating manual inspection and repair processes, and greatly reducing labor costs. BRIEF DESCRIPTION OF DRAWINGS

[0039] Figure 1 A flowchart of the polishing control method of the tile polishing robot provided by the embodiment of the application.

[0040] Figure 2 A structural schematic diagram of the tile polishing robot.

[0041] Figure 3 A structural schematic diagram of the polishing control device of the tile polishing robot provided by the embodiment of the application.

[0042] Figure 4 A structural schematic diagram of the electronic device provided by the embodiment of the application.

[0043] 101, reflectivity sensor; 102, light shield; 103, blowing assembly; 201, acquisition module; 202, curve construction module; 203, analysis module; 204, repair module; 301, processor; 302, memory; 303, communication bus. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0045] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. Meanwhile, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0046] In a first aspect, referring to Figure 1 Some embodiments of the present application provide a polishing control method of a floor tile polishing robot, applied to a floor tile polishing robot, the tail side of the floor tile polishing robot having a reflectivity sensor arranged downward;

[0047] The method comprises the following steps:

[0048] S1, in the process of polishing by the floor tile polishing robot moving based on a polishing path, acquiring first light reflectivity information of the floor tile surface at the tail side of the floor tile polishing robot based on the reflectivity sensor;

[0049] S2, generating a light reflectivity curve according to the first light reflectivity information;

[0050] S3, acquiring a to-be-repaired polishing path segment and generating corresponding polishing repair parameters according to the change of the light reflectivity curve and the polishing path analysis;

[0051] S4, controlling the floor tile polishing robot to perform repair polishing on the to-be-repaired polishing path segment according to the polishing repair parameters.

[0052] Specifically, the tile polishing robot is a robot with a polishing disc for polishing tiles and capable of self-guided navigation movement, which can move in the area to be polished based on a preset or real-time analysis determined movement path, and can polish the tiles based on the set polishing parameters during the movement, which can be used for polishing and polishing new tile floors or polishing and renovating old tile floors; the reflectivity sensor includes a light emitting component and a detection component, wherein the detection component can be a photodiode, a photoresistor, a photosensitive diode, or a CCD photoelectric detector, etc. When the light of the light emitting component shines on the surface of the object, it will be reflected to the detection component after reflection. The detection component detects the difference between the electrical signal before irradiation and the electrical signal after irradiation, and calculates the spectral reflectivity of the object according to the size of the difference. In the embodiment of the present application, as shown in Figure 2 The tail side (the side away from the polishing disc) of the tile polishing robot has a reflectivity sensor 101 arranged downward, which continuously or intermittently projects detection light on the tiles at the tail side of the tile polishing robot and receives reflected light to calculate the light reflectivity of the tile surface at the tail side of the tile polishing robot (i.e. the first light reflectivity information), which reflects the surface finish and surface roughness of the tiles at the tail side of the tile polishing robot (tiles that have been polished once). The greater the value of the first light reflectivity information, the better the surface finish and the lower the surface roughness.

[0053] More specifically, during the polishing process of the tile polishing robot based on the polishing path movement, the first light reflectivity information continuously or intermittently obtained by the reflectivity sensor can reflect the polishing processing effect of the tiles at different positions, so the light reflectivity curve constructed based on these first light reflectivity information can comprehensively reflect the quality of the polishing processing of the tiles at different positions in the field, wherein the light reflectivity curve is a two-dimensional curve graph, since the tile polishing robot moves according to the preset polishing path, the horizontal coordinate of the two-dimensional curve graph can be the movement distance or the movement time, and the light reflectivity curve can locate the specific position of the tiles corresponding to the corresponding first light reflectivity information in combination with the polishing path.

[0054] More specifically, the fluctuation of the light reflectivity curve can directly reflect the consistency of the floor tile polishing and whether the floor tile polishing is qualified. The corresponding first light reflectivity information of the floor tile with better polishing effect is higher. Therefore, the polishing control method of the floor tile polishing robot can analyze whether there is floor tile with unqualified polishing according to the change of the light reflectivity curve, and find out the floor tile with first light reflectivity information lower than the expected value (unqualified polishing processing), and determine the actual position of the floor tile combined with the polishing path. In step S3, the curve segment lower than the expected value can be cut out from the light reflectivity curve, and the polishing path segment to be repaired can be analyzed combined with the polishing path. The polishing path segment to be repaired is the path segment of the floor tile with unqualified polishing in the first polishing process of the floor tile polishing robot, which can be used to locate the floor tile that needs to be repaired. In step S3, the difference between the actual first light reflectivity information of the floor tile and the expected first light reflectivity information of the qualified floor tile can be analyzed according to the numerical value of the first light reflectivity information of the curve segment lower than the expected value in the light reflectivity curve. Then, appropriate polishing repair parameters can be set according to the difference to ensure that the floor tile polishing robot can polish the floor tile to be qualified based on the polishing repair parameters in the subsequent repair process.

[0055] More specifically, the polishing repair parameters are set parameters for controlling the floor tile polishing robot to perform polishing processing, which can include polishing speed, grinding disc speed, vertical force, etc.

[0056] More specifically, step S4 can be performed after the polishing processing of all floor tiles in the field is completed, or can be performed after the polishing processing is performed based on a preset time interval, that is, step S3 is performed based on a preset time interval during the polishing processing of the floor tile polishing robot to obtain the polishing path segment to be repaired and the corresponding polishing repair parameters, and then step S4 is performed to repair the floor tiles with unqualified polishing generated in the preset time interval.

[0057] More specifically, step S4 can control the floor tile polishing robot to move to the position of the floor tile that needs to be repaired based on the polishing path segment to be repaired, and control the floor tile polishing robot to repair the unqualified floor tiles based on the polishing repair parameters, so as to ensure that the entire field has good consistency after polishing processing.

[0058] The polishing control method of the tile polishing robot in the embodiments of the present application can ensure high consistency of tile polishing treatment, and greatly reduces labor costs.

[0059] In some preferred embodiments, as shown in Figure 2 The reflectivity sensor 101 is fixed in the light shield 102.

[0060] Specifically, the polishing control method of the tile polishing robot in the embodiments of the present application is applied to the tile polishing robot provided with the light shield 102, which can avoid the influence of light in the field on the accuracy of the first light reflectivity information measured by the reflectivity sensor 101, thereby ensuring that the step S3 can accurately obtain the place that needs to be repaired and set appropriate polishing repair parameters.

[0061] In some preferred embodiments, as shown in Figure 2 The light shield 102 is provided with a blowing assembly 103 arranged downward below the inside of the light shield 102.

[0062] Specifically, the polishing control method of the tile polishing robot in the embodiments of the present application is applied to the tile polishing robot provided with the blowing assembly 103, which can avoid the dust generated in the tile polishing process from depositing on the surface of the tile and affecting the accuracy of the first light reflectivity information measured by the reflectivity sensor 101, thereby ensuring that the step S3 can more accurately obtain the place that needs to be repaired and set appropriate polishing repair parameters.

[0063] In some preferred embodiments, as shown in Figure 2 The bottom edge of the light shield 102 is bent outward.

[0064] Specifically, the light shield 102 with the bent bottom edge can guide the airflow generated by the blowing assembly 103 to diffuse outward, ensuring that the blowing assembly 103 can blow the dust on the tile directly below the reflectivity sensor 101 outward, avoiding the dust from being raised to the inside of the light shield 102 and affecting the light transmission.

[0065] In some preferred embodiments, the step S4 comprises the following steps:

[0066] S41, control the tile polishing robot to move reversely based on the polishing path;

[0067] S42, when the floor tile polishing robot passes the to-be-repaired polishing path segment, controlling the floor tile polishing robot to perform repair polishing based on the corresponding polishing repair parameters.

[0068] Specifically, the abscissa of the two-dimensional curve graph where the light reflectivity curve is located is the moving distance or the moving time. In the embodiments of the present application, in order to simplify the repair polishing strategy of the floor tile polishing robot, step S41 directly controls the floor tile polishing robot to move reversely according to the polishing path used for the first polishing. The node of the unqualified first light reflectivity information in the light reflectivity curve corresponds to the moving distance or the moving time. The floor tile polishing robot can judge whether it reaches the floor tile that needs to be repaired based on the moving distance or the moving time, and then performs repair polishing on the unqualified floor tile according to the polishing repair parameters. This implementation does not need to rely on the map layout to plan a new polishing path.

[0069] In some preferred embodiments, step S4 includes a step performed between step S41 and step S42:

[0070] S411, when the floor tile polishing robot reaches the to-be-repaired polishing path segment, acquiring second light reflectivity information. If the difference between the second light reflectivity information and the first light reflectivity information of the to-be-repaired polishing path segment is greater than a preset threshold, marking the to-be-repaired polishing path segment as an abnormal area, and skipping the repair polishing process of the to-be-repaired polishing path segment.

[0071] Specifically, the first light reflectivity information measured by the reflectivity sensor during the polishing process of the floor tile polishing robot may have certain deviation. The polishing control method of the floor tile polishing robot in the embodiments of the present application re-acquires the light reflectivity of the floor tile that failed the last polishing (second light reflectivity information) based on the reflectivity sensor before repair polishing, and determines whether the floor tile needs to be repaired by comparing whether the first light reflectivity information and the second light reflectivity information are similar, thereby avoiding repeated polishing of the floor tile that passed the polishing process due to the deviation in the measurement of the first reflectivity information.

[0072] More specifically, the preset threshold is a compensation value set according to the use requirements. There is generally a small deviation in the on-site measurement of light reflectivity. Therefore, when the difference between the first light reflectivity information and the second light reflectivity information is less than the preset threshold, it can be considered that the two are consistent, i.e., the corresponding floor tile needs to be repaired.

[0073] More specifically, in this implementation, the floor tile polishing robot is moving reversely, so the reflectivity sensor reaches the position above the floor tile with unqualified first light reflectivity information before the grinding disc. Therefore, the second light reflectivity information can be used to verify whether the floor tile needs to be repaired, and then the floor tile polishing robot is controlled to continue to move reversely so that the grinding disc reaches the position above the unqualified floor tile to perform repair polishing on the floor tile.

[0074] It should be noted that the repair grinding process of skipping the to-be-repaired grinding path segment does not perform step S42 on the abnormal area.

[0075] More specifically, after completing the repair grinding process, the tile grinding robot sorts the abnormal area data into the warehouse for workers to find these abnormal areas and analyze them.

[0076] In some preferred embodiments, step S4 comprises the following steps:

[0077] S41', obtaining a to-be-repaired grinding area based on the grinding path and the to-be-repaired grinding path segment;

[0078] S42', generating a repair grinding path based on the to-be-repaired grinding area;

[0079] S43', controlling the tile grinding robot to perform repair grinding on the to-be-repaired grinding path segment according to the grinding repair parameters and the repair grinding path.

[0080] Specifically, the strategy of using reverse movement for repair grinding makes the tile grinding robot pass through too many useless areas during the repair grinding process, affecting the efficiency of the repair grinding process. Therefore, the grinding control method of the tile grinding robot in the embodiments of the present application analyzes and obtains the to-be-repaired grinding area based on step S41', and re-plans a repair grinding path that passes through these to-be-repaired grinding areas based on step S42' to control the tile grinding robot to efficiently complete the repair grinding process.

[0081] More specifically, in step S41', the to-be-repaired grinding area can be a path segment, a path point, or a two-dimensional graphical area, and its design form is related to the path planning software of the tile grinding robot. For example, if the tile grinding robot plans the path based on a grid map, the to-be-repaired grinding area is an area composed of several grids.

[0082] More specifically, in the embodiments of the present application, the tile grinding robot preferably plans the grinding path and the repair grinding path based on a two-dimensional map, and the grinding area is preferably a two-dimensional graph. Step S41' is further preferably based on the grinding path, the radius of the grinding disc, and the to-be-repaired grinding path segment to obtain the to-be-repaired grinding area. In this embodiment, the to-be-repaired grinding path segment in the two-dimensional map is widened to both sides based on the radius of the grinding disc to generate the to-be-repaired grinding area. After confirming the to-be-repaired grinding area, step S42' can plan a repair grinding path that traverses the to-be-repaired grinding area based on the path planning algorithm of the tile grinding robot or manually.

[0083] In some preferred embodiments, step S3 comprises the following steps:

[0084] S31, intercepting an abnormal curve segment from the light reflectivity curve based on a preset reflectivity threshold;

[0085] S32, based on the polishing path and the abnormal curve segment, obtain a to-be-repaired polishing path segment, and based on the size of the abnormal curve segment and a pre-constructed repair parameter mapping table, obtain a polishing repair parameter.

[0086] Specifically, in this embodiment, the first light reflectivity information below the reflectivity threshold is the light reflectivity of the unqualified floor tile, and the light reflectivity curve is intercepted based on the reflectivity threshold, so that the to-be-repaired polishing path segment can be quickly separated out.

[0087] More specifically, the size of each node of the abnormal curve segment is the size corresponding to the first light reflectivity information.

[0088] More specifically, the repair parameter mapping table is a pre-set data matching table, in which different polishing repair parameters corresponding to different size distribution intervals of the first light reflectivity information are matched, and the polishing repair parameters can include one or more types of input parameters that can be set in the floor tile polishing robot, so that the polishing control method of the floor tile polishing robot in this embodiment can match the appropriate polishing repair parameters for the unqualified floor tile based on the size of the abnormal curve segment to perform repair polishing processing.

[0089] In some preferred embodiments, the reflectivity threshold is set based on the floor tile material.

[0090] Specifically, the reflectivity threshold is the critical value of the light reflectivity of the qualified floor tile, so it needs to be set according to the polishing process. Since floor tiles of different materials have different light reflection characteristics, the reflectivity threshold needs to be set based on the floor tile material to ensure that the to-be-repaired polishing path segment is obtained accurately.

[0091] In some preferred embodiments, the reflectivity threshold is set based on the floor tile material and the size of the grinding disc grit.

[0092] Specifically, since the size of the grinding disc grit directly affects the surface roughness and surface finish of the polishing process, the reflectivity threshold needs to be set in combination with the floor tile material and the size of the grinding disc grit to further ensure that the to-be-repaired polishing path segment is obtained accurately.

[0093] In some preferred embodiments, each to-be-repaired polishing path segment corresponds to at least one set of polishing repair parameters.

[0094] Specifically, based on the foregoing, in the repair parameter mapping table, different polishing repair parameters are matched to different size distribution intervals based on the first light reflectivity information. Thus, for a to-be-repaired polishing path segment with a large numerical fluctuation range, the first light reflectivity information of the to-be-repaired polishing path segment is distributed in multiple size distribution intervals in the repair parameter mapping table. Therefore, different polishing repair parameters can be configured for different positions of the to-be-repaired polishing path segment, thereby ensuring accurate repair polishing processing and optimizing the tile polishing effect.

[0095] In the second aspect, referring to Figure 3 Some embodiments of the present application also provide a polishing control device of a tile polishing robot, which is applied to the tile polishing robot, and the tail side of the tile polishing robot is provided with a reflectivity sensor downwardly.

[0096] The device comprises:

[0097] The acquisition module 201 is configured to acquire first light reflectivity information of a tile surface at the tail side of the tile polishing robot based on the reflectivity sensor during polishing of the tile polishing robot based on movement of a polishing path.

[0098] The curve construction module 202 is configured to generate a light reflectivity curve based on the first light reflectivity information.

[0099] The analysis module 203 is configured to analyze the to-be-repaired polishing path segment and generate corresponding polishing repair parameters based on changes in the light reflectivity curve and the polishing path.

[0100] The repair module 204 is configured to control the tile polishing robot to perform repair polishing on the to-be-repaired polishing path segment based on the polishing repair parameters.

[0101] The polishing control device of the tile polishing robot according to the embodiments of the present application can acquire first light reflectivity information representing the polishing processing effect based on the reflectivity sensor and construct a light reflectivity curve during polishing processing of the tile polishing robot. The to-be-repaired tile and the degree of repair are quickly determined based on the light reflectivity curve and the polishing path. The to-be-repaired polishing path segment and the polishing repair parameters are determined based on this to control the tile polishing robot to perform automatic repair polishing, thereby ensuring high consistency of tile polishing processing and eliminating the manual inspection and repair process, which greatly reduces labor costs.

[0102] In some preferred embodiments, the polishing control device of the tile polishing robot according to the embodiments of the present application is used to perform the polishing control method of the tile polishing robot provided in the first aspect.

[0103] In the third aspect, referring to Figure 4Some embodiments of the present application also provide a structural diagram of an electronic device. The present application provides an electronic device, comprising: a processor 301 and a memory 302, the processor 301 and the memory 302 are interconnected and communicate with each other through a communication bus 303 and / or other forms of connection mechanism (not marked), the memory 302 stores computer readable instructions executable by the processor 301, when the electronic device is running, the processor 301 executes the computer readable instructions to execute the method in any optional implementation manner of the above-mentioned embodiments.

[0104] In a fourth aspect, the embodiments of the present application provide a computer readable storage medium having a computer program stored thereon, which, when executed by a processor, performs the method in any optional implementation manner of the above-mentioned embodiments. The computer readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.

[0105] In summary, the embodiments of the present application provide a polishing control method, device, equipment and medium of a floor tile polishing robot. In the process of polishing treatment of the floor tile polishing robot, the first light reflectivity information representing the polishing treatment effect is obtained based on the reflectivity sensor and a light reflectivity curve is constructed. The floor tile and the degree of repair polishing that need to be repaired are quickly determined in combination with the light reflectivity curve and the polishing path. The polishing path segment to be repaired and the polishing repair parameters are determined based on this to control the floor tile polishing robot to perform automatic repair polishing, thereby ensuring high consistency of the floor tile polishing treatment and eliminating the manual inspection and repair process, greatly reducing the labor cost.

[0106] In the embodiments of the present application, it should be understood that the disclosed apparatus and method can be implemented in other manners. The embodiments described above are merely exemplary, for example, the division of the units is only a logical function division, and there can be another division manner in actual implementation; for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed mutual couplings or direct couplings or communication connections can be indirect couplings or communication connections through some interfaces, devices or units, and can be in electrical, mechanical or other forms.

[0107] In addition, the units described as separate components can or can not be physically separate, and the components displayed as units can or can not be physical units, i.e., can be located in one place, or can be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purposes of the embodiments of the present application.

[0108] In addition, the functional modules in the various embodiments of the present application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0109] In this document, the terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations.

[0110] The above only describes the embodiments of the present application, and is not used to limit the protection scope of the present application. For those skilled in the art, various modifications and changes can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A grinding control method for a floor tile grinding robot, applied to a floor tile grinding robot, characterized in that, The tile grinding robot has a downward-facing reflectivity sensor on its tail side. The method includes the following steps: S1. During the process of the tile grinding robot moving based on the grinding path to grind, the first light reflectance information of the tile surface on the tail side of the tile grinding robot is obtained based on the reflectance sensor. S2. Generate a light reflectance curve based on the first light reflectance information; S3. Based on the changes in the light reflectance curve and the analysis of the polishing path, obtain the polishing path segment to be repaired and generate the corresponding polishing repair parameters. S4. Control the floor tile grinding robot to perform repair grinding on the grinding path section to be repaired according to the grinding and repair parameters.

2. The grinding control method for the tile grinding robot according to claim 1, characterized in that, Step S4 includes the following steps: S41. Control the tile grinding robot to move in reverse based on the grinding path; S42. When the tile grinding robot passes through the repair and grinding path section, the tile grinding robot is controlled to perform repair and grinding based on the corresponding grinding and repair parameters.

3. The polishing control method for the tile polishing robot according to claim 2, characterized in that, Step S4 includes the steps performed between steps S41 and S42: S411. When the tile grinding robot arrives at the grinding path segment to be repaired, the second light reflectivity information is obtained. When the difference between the second light reflectivity information and the first light reflectivity information of the grinding path segment to be repaired is greater than a preset threshold, the grinding path segment to be repaired is marked as an abnormal area, and the repair grinding process of the grinding path segment to be repaired is skipped.

4. The grinding control method for the tile grinding robot according to claim 1, characterized in that, Step S4 includes the following steps: S41' Obtain the area to be repaired and polished based on the polishing path and the polishing path segment to be repaired; S42': Generate a repair and polishing path based on the area to be repaired and polished; S43': Control the floor tile grinding robot to repair and grind the section of the path to be repaired according to the grinding and repair parameters and the repair and grinding path.

5. The grinding control method for the tile grinding robot according to claim 1, characterized in that, Step S3 includes the following steps: S31. Extract abnormal curve segments from the light reflectance curve based on a preset reflectance threshold; S32. Obtain the grinding path segment to be repaired based on the grinding path and the abnormal curve segment, and obtain the grinding repair parameters based on the size of the abnormal curve segment and the pre-constructed repair parameter mapping table.

6. The grinding control method for the tile grinding robot according to claim 5, characterized in that, The reflectivity threshold is set based on the tile material.

7. The grinding control method for the tile grinding robot according to claim 5, characterized in that, Each of the aforementioned grinding and repair path segments corresponds to at least one set of grinding and repair parameters.

8. A grinding control device for a floor tile grinding robot, characterized in that, The tile grinding robot has a downward-facing reflectivity sensor on its tail side. The device includes: The acquisition module is used to acquire the first light reflectance information of the surface of the floor tile on the tail side of the floor tile grinding robot based on the reflectance sensor during the process of the floor tile grinding robot moving based on the grinding path. A curve construction module is used to generate a light reflectance curve based on the first light reflectance information; The analysis module is used to analyze the changes in the light reflectance curve and the polishing path to obtain the polishing path segment to be repaired and generate the corresponding polishing repair parameters. The repair module is used to control the tile grinding robot to repair and grind the path segment to be repaired according to the grinding and repair parameters.

9. An electronic device, characterized in that, It includes a processor and a memory, the memory storing computer-readable instructions that, when executed by the processor, perform the steps of the method as described in any one of claims 1-7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it performs the steps of the method as described in any one of claims 1-7.

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