Wafer surface low-damage efficient repairing method based on grinding wheel optimization

By optimizing the grinding wheel combination and process parameters on a multi-axis grinding equipment, and combining porous negative pressure adsorption, reverse differential cutting, and online detection, the problems of low efficiency and deep damage in wafer re-scratching repair have been solved, achieving a high-efficiency, low-damage wafer repair effect suitable for industrial mass production.

CN122008041APending Publication Date: 2026-05-12ANHUI FULLERDE CHANGJIANG SEMICON MATERIALS CO LTD
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Patent Information

Application Number
CN202610381717.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-03-26
Publication Date
2026-05-12

AI Technical Summary

Technical Problem

Existing technologies for wafer re-scratching repair suffer from low processing efficiency, deep damage layers, and incomplete repair. In particular, traditional biaxial grinding processes, when dealing with re-scratching, result in deep damage layers during coarse grinding and low efficiency during fine grinding, leading to low overall processing efficiency and increased material removal and costs in downstream polishing processes.

Method used

By employing multi-axis grinding equipment and optimizing different combinations of grit sizes for coarse and fine grinding wheels and process parameters, combined with a porous uniform negative pressure adsorption design, a nested limiting structure of rotating ring and positioning groove, a reverse differential cutting design, a series arrangement of multi-mesh grinding wheels, and online detection technology, we can achieve efficient and low-damage repair of heavy scratches on wafer surfaces.

Benefits of technology

It significantly improves the processing efficiency and yield of wafer repair, reduces the depth of the subsurface damage layer, reduces wafer surface scratches and thermal deformation, and achieves seamless process connection and real-time quality control, adapting to the needs of industrial mass production.

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Abstract

The invention discloses a wafer surface low-damage efficient repair method based on grinding wheel optimization, and relates to the technical field of wafer regeneration processing, and the method comprises the following steps: S1, wafer placement; s2, multi-stage grinding is conducted; and S3, stability verification. The multi-mesh grinding wheels are arranged in series, the design of coarse-to-fine gradient grinding is adopted, the tedious processes of single-grinding-wheel reciprocating grinding and frequent mesh number switching in the prior art are omitted, seamless connection of procedures is achieved, and the machining efficiency is greatly improved. And meanwhile, real-time water injection cooling of the grinding wheel in the polishing process is achieved through cooperation of the liquid storage cavity and the liquid leakage opening, the machining temperature is effectively controlled, and wafer thermal deformation and subsurface damage caused by local overheating in the prior art are avoided.
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