Method for preparing high-thickness low-temperature binder grinding roll ceramic abrasive tool

Abstract

The application provides a preparation method of a high-thickness low-temperature binder grinding roller needle ceramic grinding tool, and the binder is composed of 10-17% of superfine black clay powder, 35-45% of low-melting-point superfine glass material, 5-10% of nano silicon dioxide, 1-3% of superfine spodumene and 25-49% of superfine feldspar powder, and the low-melting-point superfine glass material is composed of 44-46% of silicon dioxide, 18-20% of aluminum oxide, 1-2% of magnesium oxide, 11-13% of sodium oxide and 16-20% of boron trioxide; the preparation method of the high-thickness low-temperature binder grinding roller needle ceramic grinding tool can reduce the sintering temperature during the production of the grinding tool, realize low-temperature sintering of the binder, avoid the situation that the high-thickness grinding tool is prone to collapse and black core at 1200-1300 DEG C, and reduce the production energy consumption.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of grinding tools, in particular to a preparation method of a high-thickness low-temperature binder grinding roll pin ceramic grinding tool. BACKGROUND

[0002] Roller bearings are widely used in machine tool processing, automobile manufacturing, aerospace, industrial machinery, medical devices and other fields. With the continuous development of industrial technology, the application range of roller bearings will continue to expand. The roller refers to the rotating body on the roller bearing. This kind of roller bearing has high load bearing capacity. The production and processing of the roller requires high precision, and the metal surface needs to be deburred and descaled, so as to obtain a smoother and flatter surface. The technical requirements of the processed roller are generally: Ra≤0.10mm, roundness≤0.0006mm, parallelism≤0.0006mm, and straightness≤0.0005mm. Such high precision requirements require high-thickness grinding wheels that are sharp and have good shape retention. Silicon carbide ceramic grinding wheels are widely used in the grinding processing of industrial parts. High-thickness low-temperature ceramic grinding wheels are mainly used for the processing of precision parts on centerless grinding machines, especially for the precision processing of rollers.

[0003] Currently, the main problems of high-thickness ceramic grinding wheels are:

[0004] 1. High-temperature sintering, high sintering temperature, high energy consumption, the heat energy consumption continues to rise when the temperature rises from 1050℃ to 1320℃, and during the entire temperature rising stage, the time before 1000℃ accounts for about the same time as the temperature rising 300℃ after 1000℃, so the cooling time will be prolonged, which will also affect the turnover rate and the service life of the kiln. At the same time, due to the high sintering temperature, the binder is in a molten or semi-molten state at high temperature. The high-thickness silicon carbide grinding wheel is prone to collapse and waste due to its own gravity at high temperature. In addition, due to the high temperature and the violent reaction of the binder, the high-thickness ceramic grinding wheel is prone to foaming and waste.

[0005] 2. Silicon carbide abrasive generates decomposition and oxidation reaction when heated. First, silicon carbide decomposes, and then the decomposition products oxidize. This reaction accelerates with the increase of temperature and the increase of specific surface area of silicon carbide abrasive. The decomposition reaction is most intense at about 1200℃-1300℃. If the decomposition rate of silicon carbide is greater than its oxidation rate at this time, the product will not be completely oxidized, resulting in black core waste, especially high-thickness ceramic grinding wheel.

[0006] The Chinese patent with the authorization publication number CN102363578B discloses a ceramic bond abrasive steel ball grinding wheel, which is made of clay, feldspar, boron-containing glass, bentonite, water manganite to form high-strength high-shrinkage engineering ceramic bond, and then combined with mixed material abrasive, utilizes the opalescence effect of boron glass to promote glass nucleation, and bentonite and water manganite powder promote the formation of high-strength high-shrinkage engineering ceramic structure, cold-presses high-pressure forming, and is fired at a certain temperature to obtain the ceramic bond abrasive steel ball grinding wheel. The ceramic bond abrasive steel ball grinding wheel needs to be fired at 1250 DEG C, needs high energy consumption, causes waste of resources, increases production cost, affects the turnover rate and service life of the kiln, and increases the probability of black core waste products due to the increase of the thickness of the grinding tool.

[0007] To solve the above problems, it is necessary to develop a preparation method of high-thickness low-temperature bond abrasive needle ceramic grinding tool to solve the problems mentioned above. SUMMARY

[0008] In view of the above situation, to overcome the defects of the prior art,

[0009] The present application provides a preparation method of high-thickness low-temperature bond abrasive needle ceramic grinding tool, by mass percentage, 22%-25% of bond, 75%-78% of abrasive, wherein,

[0010] The bond is composed of 10%-17% of superfine black clay powder, 35%-45% of low-melting-point superfine glass material, 5%-10% of nano-silicon dioxide, 1%-3% of superfine spodumene, and 25%-49% of superfine feldspar powder;

[0011] The abrasive is silicon carbide;

[0012] The preparation of the bond includes the following steps:

[0013] (1) mixing: mixing the superfine black clay powder, the low-melting-point superfine glass material, the nano-silicon dioxide, the superfine spodumene, and the superfine feldspar powder to obtain the bond mixture;

[0014] (2) ball milling: placing the bond mixture in a ball mill and ball milling for 4-5 hours, and then passing through a 100# sieve to obtain the finished product of the bond;

[0015] The preparation method of the high-thickness low-temperature bond abrasive needle ceramic grinding tool includes the following steps:

[0016] (1) ball milling: placing the bond and the abrasive in a ball mill and ball milling for 3-4 hours, and then passing through a 100# sieve;

[0017] (2) mixing: adding a wetting agent after ball milling and mixing in a mixer for 40-50 minutes;

[0018] (3) Molding: After mixing, the material is passed through a 60# sieve and is molded for 72 hours;

[0019] (4) Pressing: The molded material is placed in a mold of a specified size, and a press is used to press the material at a pressure of 10-15 MPa for 30-60 seconds to obtain a grinding wheel blank;

[0020] (5) Drying: The grinding wheel blank is dried at a temperature of 50-60 °C for 168 hours;

[0021] (6) Sintering: After drying, the grinding wheel blank is placed in a car kiln, and the kiln is loaded in the form of a channel and a surrounding tile, and sintering is performed at a temperature of 900-1000 °C. After sintering, the temperature is maintained for 120-144 hours, and then the temperature is cooled to room temperature. Thus, a grinding wheel part is obtained.

[0022] Preferably, the low-melting-point superfine glass frit is composed of 44-46% of silicon dioxide, 18-20% of aluminum oxide, 1-2% of magnesium oxide, 11-13% of sodium oxide, and 16-20% of boron trioxide.

[0023] Preferably, the wetting agent is a dextrin solution, and the mass of the wetting agent is 1.5-2.5% of the mass of the mixture.

[0024] Preferably, the particle size of the superfine black clay powder, the low-melting-point superfine glass frit, the nano-silicon dioxide, the superfine spodumene, and the superfine feldspar powder is 1000 mesh.

[0025] Preferably, the particle size of the silicon carbide is 220 mesh.

[0026] Compared with the prior art, the present application provides a method for preparing a high-thickness low-temperature binder grinding roller ceramic abrasive tool, which has the following beneficial effects:

[0027] By controlling the ratio of the superfine black clay powder, the low-melting-point superfine glass frit, the nano-silicon dioxide, the superfine spodumene, and the superfine feldspar powder, a binder required for a high-thickness abrasive tool is prepared. The sintering temperature during the production of the abrasive tool is reduced, and low-temperature sintering is achieved. The sintering temperature is reduced from a high temperature of about 1300 °C to a low temperature of 900-1000 °C. The situation that a high-thickness abrasive tool is prone to collapse and black core at a temperature of 1200-1300 °C is avoided. For every 100 °C reduction in the sintering temperature, the average energy saving is 1 / 6. In the entire temperature rising stage, the time before 1000 °C is equivalent to the time for rising the temperature by 300 °C after 1000 °C. When the sintering temperature is reduced to 1100 °C, the temperature rising time is shortened by about 1 / 3, and the cooling time is also reduced. Therefore, the turnover rate of the kiln is increased, and the service life of the refractory material and the kiln is prolonged. DETAILED DESCRIPTION

[0028] The specific embodiments of the present application are further described in detail below.

[0029] Example 1

[0030] In terms of mass percentage, 24% of binder and 76% of abrasive, wherein,

[0031] The binder is composed of 17% of superfine black clay powder, 35% of low-melting-point superfine glass frit, 10% of nano-silicon dioxide, 1% of superfine spodumene, and 37% of superfine feldspar powder, and the particle size is 1000 mesh;

[0032] The low-melting-point superfine glass frit is composed of 45% of silicon dioxide, 20% of aluminum oxide, 2% of magnesium oxide, 13% of sodium oxide, and 20% of boron trioxide;

[0033] The abrasive is silicon carbide with a particle size of 220 mesh;

[0034] The preparation of the binder includes the following steps:

[0035] (1) Mixing: mix the superfine black clay powder, low-melting-point superfine glass frit, nano-silicon dioxide, superfine spodumene, and superfine feldspar powder to obtain a binder mixture;

[0036] (2) Ball milling: place the binder mixture in a ball mill and ball mill for 5 hours. After ball milling, pass through a 100# sieve to obtain a binder finished product;

[0037] The preparation method of the high-thickness low-temperature binder grinding roll ceramic abrasive tool includes the following steps:

[0038] (1) Ball milling: place the binder and abrasive in a ball mill and ball mill for 3.5 hours, then pass through a 100# sieve;

[0039] (2) Mixing: after ball milling, add 2% of a dextrin solution by mass of the mixture and mix in a mixer for 50 minutes;

[0040] (3) Steaming: after mixing, pass through a 60# sieve and steam for 72 hours;

[0041] (4) Pressing: place the steamed material in a mold with a specified size, and press it in a press machine at 12 MPa for 60 seconds to obtain a grinding wheel blank;

[0042] (5) Drying: dry the grinding wheel blank at 60°C for 168 hours;

[0043] (6) Sintering: after drying, place it in a car-type kiln, load it in the form of a channel and surrounding tiles, and sinter it at 950°C. After sintering, keep it at temperature for 130 hours, and then cool it to room temperature to obtain a grinding wheel piece.

[0044] Example 2

[0045] In terms of mass percentage, 24% of binder and 76% of abrasive, wherein,

[0046] The binder is composed of 15% ultra-fine black clay powder, 40% low-melting-point ultra-fine glass frit, 8% nano-silicon dioxide, 2% ultra-fine spodumene, and 35% ultra-fine feldspar powder, and the particle size is 1000 mesh;

[0047] The low-melting-point ultra-fine glass frit is composed of 45% silicon dioxide, 20% aluminum oxide, 2% magnesium oxide, 13% sodium oxide, and 20% boron trioxide;

[0048] The abrasive is silicon carbide with a particle size of 220 mesh;

[0049] The preparation of the binder includes the following steps:

[0050] (1) Mixing: Mix the ultra-fine black clay powder, low-melting-point ultra-fine glass frit, nano-silicon dioxide, ultra-fine spodumene, and ultra-fine feldspar powder to obtain a binder mixture;

[0051] (2) Ball milling: Place the binder mixture in a ball mill and mill for 5 hours. After ball milling, pass through a 100# sieve to obtain the finished binder;

[0052] The preparation method of the high-thickness low-temperature binder grinding roller ceramic abrasive tool includes the following steps:

[0053] (1) Ball milling: Place the binder and abrasive in a ball mill and mill for 3.5 hours, then pass through a 100# sieve;

[0054] (2) Mixing: After ball milling, add 2% of the mass of the mixture to a pectin solution, and mix in a mixer for 50 minutes;

[0055] (3) Steaming: After mixing, pass through a 60# sieve and steam for 72 hours;

[0056] (4) Pressing: Place the steamed material in a mold with a specified size, and press it with a press machine at 12 MPa for 60 seconds to obtain a grinding wheel blank;

[0057] (5) Drying: Dry the grinding wheel blank at 60°C for 168 hours;

[0058] (6) Sintering: After drying, place it in a car-type kiln, load it in the form of a channel and a surrounding tile, and sinter it at 950°C. After sintering, keep it at temperature for 130 hours, and then cool it to room temperature to obtain a grinding wheel piece.

[0059] Example 2 differs from Example 1 in that the percentage configuration of the binder is different, and the remaining proportions and steps remain the same.

[0060] Example 3:

[0061] According to the mass percentage, the binder is 24% and the abrasive is 76%, wherein,

[0062] The binder is composed of 10% ultra-fine black clay powder, 45% low-melting-point ultra-fine glass frit, 5% nano-silicon dioxide, 3% ultra-fine spodumene, and 37% ultra-fine feldspar powder, and the particle size is 1000 mesh;

[0063] The low-melting-point ultra-fine glass frit is composed of 45% silicon dioxide, 20% aluminum oxide, 2% magnesium oxide, 13% sodium oxide, and 20% boron trioxide;

[0064] The abrasive is silicon carbide with a particle size of 220 mesh;

[0065] The preparation of the binder includes the following steps:

[0066] (1) Mixing: Mix the ultra-fine black clay powder, low-melting-point ultra-fine glass frit, nano-silicon dioxide, ultra-fine spodumene, and ultra-fine feldspar powder to obtain a binder mixture;

[0067] (2) Ball milling: Place the binder mixture in a ball mill and mill for 5 hours. After ball milling, pass through a 100# sieve to obtain the finished binder;

[0068] The preparation method of the high-thickness low-temperature binder grinding roller ceramic abrasive tool includes the following steps:

[0069] (1) Ball milling: Place the binder and abrasive in a ball mill and mill for 3.5 hours, then pass through a 100# sieve;

[0070] (2) Mixing: After ball milling, add 2% of the mass of the mixture to the paste solution, and mix in a mixer for 50 minutes;

[0071] (3) Soaking: After mixing, pass through a 60# sieve and soak for 72 hours;

[0072] (4) Pressing: Place the soaked material in a mold with a specified size, and press it with a press machine at 12 MPa for 60 seconds to obtain a grinding wheel blank;

[0073] (5) Drying: Dry the grinding wheel blank at 60°C for 168 hours;

[0074] (6) Sintering: After drying, place it in a car-type kiln, adopt the form of channeling and surrounding tiles, and sinter it at 950°C. After sintering, keep it at temperature for 130 hours, and then cool it to room temperature to obtain a grinding wheel piece.

[0075] Example 3 differs from Examples 1 and 2 in that the percentage configuration of the binder is different, and the remaining proportions and steps remain the same.

[0076] Comparative Example 1:

[0077] According to the mass percentage, the binder is 24% and the abrasive is 76%, wherein,

[0078] The binder is composed of clay powder 15%, low-melting glass 40%, silicon dioxide 8%, spodumene 2%, and feldspar powder 35%, and the particle size is 240 mesh;

[0079] The low-melting glass is composed of silicon dioxide 71%, aluminum oxide 2%, magnesium oxide 0.4%, calcium oxide 0.3%, potassium oxide 3.3%, sodium oxide 5%, and boron trioxide 18%.

[0080] The abrasive is silicon carbide with a particle size of 220 mesh;

[0081] The preparation of the binder includes the following steps:

[0082] (1) Mixing: clay powder, low-melting glass, silicon dioxide, spodumene, and feldspar powder are mixed to obtain a binder mixture;

[0083] (2) Ball milling: the binder mixture is placed in a ball mill and ball milled for 5 hours. After ball milling, the product binder is obtained by passing through a 100# sieve;

[0084] The preparation of the abrasive tool includes the following steps:

[0085] (1) Ball milling: the binder and abrasive are placed in a ball mill and ball milled for 3 hours, then passed through a 100# sieve;

[0086] (2) Mixing: after ball milling, 2% of a dextrin solution by mass of the mixture is added and mixed in a mixer for 40 minutes;

[0087] (3) Soaking: after mixing, pass through a 60# sieve and soak for 72 hours;

[0088] (4) Pressing: place the soaked material in a mold of the specified size, and press it in a press machine at 12 MPa for 60 seconds to obtain a grinding wheel blank;

[0089] (5) Drying: dry the grinding wheel blank at 60°C for 168 hours;

[0090] (6) Sintering: after drying, place it in a car-type kiln, with one piece naked and one piece buried in sand, and sinter it at 1300°C. After sintering, keep it at temperature for 130 hours, and then cool it to room temperature to obtain a grinding wheel piece.

[0091] Comparative Example 1 differs from Examples 1, 2, and 3 in that the particle size of the binder is 240 mesh instead of 1000 mesh, the low-melting glass uses a conventional ratio of 240 mesh, and one piece is naked and one piece is buried in sand when loading into the kiln. The sintering temperature is adjusted to 1300°C, and the rest of the abrasive material ratio and steps remain unchanged.

[0092] The following comparative analysis is made on Examples 1, 2, 3, and Comparative Example 1:

[0093] Under the same parameters, the Rockwell hardness, collapse and black heart condition, sintering temperature, roughness, durability, and service life of the formed abrasive tools of Example 1, Example 2, Example 3, and Comparative Example 1 were compared.

[0094] Table 1 Performance comparison of high-thickness low-temperature binder abrasive roll pin ceramic grinding wheels

[0095]

[0096] As can be seen from the data in Table 1, the binder made by using superfine black clay powder, low-melting-point superfine glass frit, nanosilica, superfine spodumene, and superfine feldspar powder in Example 1, Example 2, and Example 3 can produce sintering at 950℃, without collapse and black heart condition, and the overall data of Rockwell hardness, roughness, durability, and service life are good.

[0097] As can be seen from the data in Table 1, although Comparative Example 1 produced sintering at 1300℃, it had collapse and black heart condition, making the entire product unusable.

[0098] Therefore, by controlling the ratio of superfine black clay powder, low-melting-point superfine glass frit, nanosilica, superfine spodumene, and superfine feldspar powder, the binder can be used to make high-thickness low-temperature binder abrasive roll pin ceramic grinding tools, which can produce sintering at 950℃ without collapse and black heart condition, effectively reduce energy consumption, save energy consumption and time from 1000℃ to 1300℃, increase the turnover rate of the kiln, and prolong the service life of the refractory and the kiln.

[0099] As can be seen from the data in Table 1, the high-thickness low-temperature binder abrasive roll pin ceramic grinding tool has good self-sharpening during grinding, which can improve grinding efficiency, has high strength, and can appropriately increase the use speed. During grinding, the self-sharpening of the grinding wheel is strong, which can maintain the sharp cutting edge of the abrasive particles, reduce the grinding force, and reduce the grinding heat. In addition, the grinding wheel has a high porosity, good heat dissipation conditions, and basically no crack burning phenomenon, and the number of dressing is greatly reduced.

Claims

1. A method for preparing high-thickness, low-temperature bonded grinding needle ceramic abrasives, characterized in that, By weight percentage, it consists of 22%-25% binder and 75%-78% abrasive, of which... The binder consists of 10%-17% ultrafine black clay powder, 35%-45% low-melting-point ultrafine glass frit, 5%-10% nano-silica, 1%-3% ultrafine spodumene, and 25%-49% ultrafine feldspar powder. The abrasive is silicon carbide; The preparation of the binder includes the following steps: (1) Mixing: Mix ultrafine black clay powder, low melting point ultrafine glass material, nano silica, ultrafine spodumene and ultrafine feldspar powder to obtain binder mixture; (2) Ball milling: Place the binder mixture in a ball mill and ball mill for 4-5 hours. After ball milling, pass it through a 100# sieve to obtain the finished binder product. The preparation method of the high-thickness low-temperature bonded grinding needle ceramic abrasive includes the following steps: (1) Ball milling: Place the binder and abrasive in a ball mill, and mill for 3-4 hours before passing through a 100# sieve; (2) Mixing: After ball milling, add wetting agent and mix in a mixer for 40-50 minutes; (3) Curing: After mixing, the mixture is passed through a 60# sieve and then cured for 72 hours; (4) Pressing: Place the blank material into a standard mold and press it with a press at 10-15MPa for 30-60s to obtain a grinding wheel blank; (5) Drying: Place the grinding wheel blank at 50-60℃ for 168 hours to dry it; (6) Sintering: After drying, the parts are placed in a car kiln. The kiln is loaded with grooves and tiles. Sintering is carried out at 900-1000℃. After sintering, the parts are kept at the temperature for 120-144 hours and then cooled to room temperature to obtain grinding wheels.

2. The method for preparing high-thickness low-temperature bonded grinding needle ceramic abrasive according to claim 1, characterized in that, The low-melting-point ultrafine glass material is composed of 44%-46% silicon dioxide, 18%-20% aluminum oxide, 1%-2% magnesium oxide, 11%-13% sodium oxide, and 16%-20% boron trioxide.

3. The method for preparing high-thickness low-temperature bonded grinding needle ceramic abrasive according to claim 1, characterized in that, The wetting agent is a dextrin solution, and its mass is 1.5-2.5% of the mass of the mixture.

4. The method for preparing high-thickness low-temperature bonded grinding needle ceramic abrasive according to claim 1, characterized in that, The particle size of the ultrafine black clay powder, low-melting-point ultrafine glass material, nano-silica, ultrafine spodumene, and ultrafine feldspar powder is 1000 mesh.

5. The method for preparing high-thickness low-temperature bonded grinding needle ceramic abrasive according to claim 1, characterized in that, The silicon carbide has a particle size of 220 mesh.

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