Arc source mechanism for multi-arc ion plating and cooling method thereof

Abstract

The present application relates to a kind of arc source mechanism for multi-arc ion plating and its cooling method, by water storage, spray circulation, fast electric cooling and water-cooling air-cooled composite heat dissipation mode, high-efficiency intelligent cooling to arc source is realized.The arc source mechanism includes arc source assembly, water collection mechanism, circulating spray mechanism, cooling mechanism, heat dissipation mechanism, water cooling mechanism and temperature control mechanism.Water collection mechanism stores cooling water, and temperature insulation board realizes heat preservation and insulation.Circulating spray mechanism uses pump and nozzle to realize the circulating spray of cooling water, and enhances the heat absorption effect of target material.Cooling mechanism is provided with refrigeration chip with the function of quickly absorbing and releasing a large amount of heat, and the water is cooled down.Water cooling mechanism uses external water cooling auxiliary heat dissipation.Temperature control mechanism monitors water temperature and controls the work of each mechanism.Each unit module in the arc source mechanism works together to form a closed loop, can quickly absorb the heat of target material, cool down the cooling water, and ensure the efficient and stable cooling support of arc source.

Description

Technical Field

[0001] This invention relates to the field of vacuum coating equipment technology, and in particular to an arc source cooling mechanism for multi-arc ion coating processes, which is a novel, efficient and intelligent arc source cooling mechanism. Background Technology

[0002] Decorative coating, as a type of vacuum coating technology, is widely used in various hardware, tableware, sanitary ware, jewelry and other products. Moreover, the variety of coating colors is gradually increasing with the development of the manufacturing process.

[0003] In vacuum coating technology, multi-arc ion plating is an important coating method. Multi-arc ion plating uses an electric arc discharge method to directly evaporate metal onto a solid cathode target. The evaporated material consists of ions of cathode material emitted from the glowing point of the cathode arc, which are then deposited on the substrate surface to form a thin film.

[0004] Ion plating is a process that takes place in a vacuum chamber. It utilizes gas discharge or partial ionization of the evaporated material, where the evaporated material or reactants are deposited onto a substrate simultaneously under the bombardment of gas ions or particles. Ion plating organically combines glow discharge, plasma technology, and vacuum evaporation, significantly improving film quality and expanding the application range of thin films. It boasts advantages such as strong film adhesion, good diffraction, and a wide range of applicable materials. However, multi-arc ion plating differs significantly from conventional ion plating. Multi-arc ion plating employs arc discharge, not the glow discharge of traditional ion plating. Simply put, the principle of multi-arc ion plating is to use the cathode target as the evaporation source. Through arc discharge between the target and the anode shell, the target material evaporates, creating plasma in space, which then deposits onto the substrate.

[0005] Chinese patented invention CN217324259U discloses a small arc source for multi-arc ion plating, including a mounting flange with an automatic arc-initiating device installed on one side. A target base is installed on the top of the mounting flange, and a cooling water circulation assembly is provided inside the target base. The cooling water circulation assembly includes multiple arc-shaped pipes, with connecting pipes at both ends. Inlet and outlet pipes are connected to the bottom of the connecting pipes at both ends. Cooling water enters the arc-shaped pipes through the inlet pipe and the connecting pipes, and then flows out through the arc-shaped pipes, the connecting pipes, and the outlet pipe. As the cooling water flows within the arc-shaped pipes, it carries heat within the stepped grooves, thus cooling the target material. The multiple arc-shaped pipes, fully laid within the stepped grooves, improve the cooling effect. Furthermore, the cooling water flows within the pipes without contacting the target base, preventing leakage and ensuring the overall operation of the device.

[0006] However, although the arc source mechanism can use cooling water for cooling and avoids the cooling water from seeping out of the target, the cooling water is mostly at room temperature and has limited heat absorption. Moreover, during the circulation process, the temperature of the cooling water will gradually rise, affecting the heat absorption efficiency and the cooling effect on the target material. Therefore, an arc source mechanism for multi-arc ion plating is proposed. Summary of the Invention

[0007] In view of this, the present invention provides an arc source mechanism for multi-arc ion plating, which achieves efficient and intelligent cooling of the arc source for multi-arc ion plating through the organic combination of water collection and storage, spray circulation, electric cooling heat absorption and water cooling and air cooling heat dissipation.

[0008] The technical solution of this invention is implemented as follows: an arc source mechanism for multi-arc ion plating, comprising an arc source assembly and a water collection mechanism, wherein the arc source assembly comprises an arc source flange, a target holder and a target material shielding cover;

[0009] The target holder is installed at the bottom of the arc source flange, the target material shield is installed at the bottom of the target holder, the water collection mechanism is installed on the inner wall of the arc source flange, a circulating spray mechanism is installed on one side of the water collection mechanism, a heat insulation plate is installed at the bottom of the inner wall of the water collection mechanism, a cooling mechanism is installed at the top of the inner wall of the water collection mechanism, a heat dissipation mechanism is evenly installed on the top of the water collection mechanism, a water cooling mechanism is installed at the top of the outer wall of the water collection mechanism, and a temperature control mechanism is provided above the arc source flange.

[0010] The water collection mechanism is used to store cooling water.

[0011] The circulating spray mechanism is used to circulate the cooling water in the water collection mechanism in the form of atomized spray.

[0012] The cooling mechanism is used to absorb heat from the cooling water in the water collection mechanism under the action of electric current and to transfer the heat.

[0013] The heat dissipation mechanism is used to dissipate the heat transferred by the cooling mechanism;

[0014] The water cooling mechanism is used to inject external cooling water into the water collection mechanism, and to assist the heat dissipation mechanism in absorbing the heat transferred by the cooling mechanism.

[0015] The temperature control mechanism is used to monitor the temperature of the cooling water in the water collection mechanism.

[0016] More preferably, the water collection mechanism includes a water collection hood, a water-cooling chamber, a water storage chamber, and a spray chamber;

[0017] The bottom of the outer side wall of the water collection hood is fixedly connected to the inner side wall of the arc source flange. The water cooling cavity is located at the top of the inner side wall of the water collection hood. The water storage cavity is located in the middle of the inner side wall of the water collection hood. The spray cavity is located at the bottom of the inner side wall of the water collection hood. The heat insulation plate is located between the water storage cavity and the spray cavity. The outer side wall of the heat insulation plate is fixedly connected to the inner side wall of the water collection hood.

[0018] More preferably, the circulating spraying mechanism includes a circulating pump, a water pumping pipe, a pressure plate, several atomizing nozzles, and a heat-conducting plate;

[0019] The circulating pump is installed on one side of the outer wall of the water collection hood. The inlet of the circulating pump is connected to a water pumping pipe. One end of the water pumping pipe is connected to the inside of the spray chamber. The outlet of the circulating pump is connected to the inside of the water storage chamber. The pressure plate is connected to the bottom of the heat insulation plate. Several atomizing nozzles are connected to the bottom of the pressure plate. The heat-conducting plate is fixedly connected to the bottom of the inner wall of the water collection hood.

[0020] More preferably, the cooling mechanism includes a first ceramic substrate, a plurality of bismuth telluride N-type elements, a plurality of bismuth telluride P-type elements, a plurality of connecting pieces, two electrode rings, and a second ceramic substrate.

[0021] The first ceramic substrate is fixedly connected to the bottom of the inner wall of the water collection cover. Several bismuth telluride N-type elements and bismuth telluride P-type elements are disposed above the first ceramic substrate. Several connecting pieces are connected between several bismuth telluride N-type elements and bismuth telluride P-type elements. Two electrode rings are respectively installed on the top of the bismuth telluride N-type elements and bismuth telluride P-type elements. The second ceramic substrate is fixedly connected to the top of the electrode rings and connecting pieces.

[0022] More preferably, the heat dissipation mechanism includes several water-proof covers and several cooling fans;

[0023] The bottom of each of the several water-proof covers is fixedly connected to the upper surface of the second ceramic substrate, and the several cooling fans are respectively installed on the inner sidewalls of the several water-proof covers.

[0024] More preferably, the water-cooling mechanism includes a water supply connector and a drain connector;

[0025] One end of the water supply connector is connected to one side of the interior of the water-cooled cavity, and one end of the drain connector is connected to the other side of the interior of the water-cooled cavity.

[0026] More preferably, the temperature control mechanism includes an electrical control box, a controller, several relays, and a temperature sensor;

[0027] The electrical control box is installed on one side of the upper surface of the arc source flange, the controller is installed on one side of the inner wall of the electrical control box, several relays are installed on the other side of the inner wall of the electrical control box, the temperature sensor is installed on the outer wall of the water collection hood, and one end of the temperature sensor extends into the interior of the water storage chamber.

[0028] More preferably, the signal output terminal of the temperature sensor is electrically connected to the signal input terminal of the controller via a wire, the electrical output terminal of the controller is electrically connected to the electrical input terminal of the relay via a wire, and the electrical output terminal of the relay is electrically connected to the electrical input terminals of the electrode ring and the cooling fan via a wire.

[0029] More preferably, an arc source power terminal is fixedly connected to the middle of the inner wall of the water collection hood, a connecting frame is installed on one side of the upper surface of the arc source flange, a cylinder is installed on the top of the connecting frame, a sleeve is fixedly connected to the bottom of the connecting frame, the piston rod of the cylinder is slidably connected to the inner wall of the sleeve, and an arc-initiating needle is slidably connected to the bottom of the inner wall of the sleeve.

[0030] More preferably, a heat-conducting rod is uniformly fixedly connected to the bottom of the first ceramic substrate, and the heat-conducting rod is located inside the water storage cavity.

[0031] This invention also provides a cooling method using the aforementioned arc source mechanism for multi-arc ion plating, comprising the following steps: S1 collecting and storing cooling water; S2 circulating the cooling water using a circulating spray mechanism; S3 activating a cooling mechanism to electrically cool the cooling water; S4 dissipating the heat transferred by the cooling mechanism using a heat dissipation mechanism and a water cooling mechanism; and S5 monitoring the cooling water temperature and controlling the operation of the cooling system using a temperature control mechanism. This method achieves the effects of cooling water recycling, electric cooling heat absorption, and water cooling heat dissipation.

[0032] The embodiments of the present invention have the following advantages due to the adoption of the above technical solutions: The present invention uses a cooling mechanism to quickly absorb the heat of the cooling water in the water collecting mechanism under the action of an electric current, so as to cool the cooling water and transfer the absorbed heat. Then, a heat dissipation mechanism and a water cooling mechanism are used to dissipate the heat transferred by the cooling mechanism, ensuring the heat absorption efficiency of the cooling mechanism on the water collecting mechanism. Then, a circulating spray mechanism is used to make the cooled water in the water collecting mechanism circulate in the form of atomized spray, so that the low temperature cooling water sprayed out by atomization can quickly absorb the heat of the target material, improving the heat absorption and cooling effect. Moreover, the circulating spray mechanism can be used to inject the water after heat absorption back into the water collecting mechanism, so that the cooling mechanism can continuously cool the cooling water, avoiding the gradual increase of the cooling water temperature.

[0033] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a structural diagram of the present invention;

[0036] Figure 2 This is a cross-sectional view of the structure from a first perspective of the present invention;

[0037] Figure 3 This is a cross-sectional view of the structure from a second perspective of the present invention;

[0038] Figure 4 This is a cross-sectional view of the electrical control box of the present invention;

[0039] Figure 5 This is an axial view of the first ceramic substrate of the present invention;

[0040] Figure 6 This is a bottom view of the pressure plate structure of the present invention;

[0041] Figure 7 This is an axonometric view of the water collection cover of the present invention.

[0042] Reference numerals: 1. Arc source assembly; 2. Water collection mechanism; 3. Circulating spray mechanism; 4. Insulation plate; 5. Cooling mechanism; 6. Heat dissipation mechanism; 7. Water cooling mechanism; 8. Temperature control mechanism; 101. Arc source flange; 102. Target holder; 103. Target material shield; 201. Water collection cover; 202. Water cooling cavity; 203. Water storage cavity; 204. Spray cavity; 301. Circulating pump; 302. Pumping pipe; 303. Pressure plate; 304. Atomizing nozzle; 305. Heat conducting plate; 501. First Ceramic substrate; 502, Bismuth telluride N-type element; 503, Bismuth telluride P-type element; 504, Connecting piece; 505, Electrode ring; 506, Second ceramic substrate; 601, Waterproof cover; 602, Cooling fan; 701, Water supply connector; 702, Drain connector; 801, Electrical control box; 802, Controller; 803, Relay; 804, Temperature sensor; 91, Arc source power terminal; 92, Connecting bracket; 93, Cylinder; 94, Sleeve; 95, Arc ignition pin; 96, Heat conduction rod. Implementation

[0043] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0044] It is important to note that terms such as "first," "second," "symmetric," and "array" are used only to distinguish between descriptive and positional descriptions and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features specified with terms such as "first" or "symmetric" may explicitly or implicitly include one or more of that feature; similarly, when the quantity of certain features is not limited by words such as "two" or "three," it should be noted that such features also explicitly or implicitly include one or more features.

[0045] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0046] like Figure 1-7 As shown, this embodiment of the invention provides an arc source mechanism for multi-arc ion plating, including an arc source assembly 1 and a water collection mechanism 2. The arc source assembly 1 includes an arc source flange 101, a target holder 102, and a target material shielding cover 103.

[0047] Among them, the target holder 102 is installed at the bottom of the arc source flange 101, the target material shield 103 is installed at the bottom of the target holder 102, the water collection mechanism 2 is installed on the inner wall of the arc source flange 101, a circulating spray mechanism 3 is installed on one side of the water collection mechanism 2, a heat insulation plate 4 is installed at the bottom of the inner wall of the water collection mechanism 2, a cooling mechanism 5 is installed at the top of the inner wall of the water collection mechanism 2, a heat dissipation mechanism 6 is evenly installed at the top of the water collection mechanism 2, a water cooling mechanism 7 is installed at the top of the outer wall of the water collection mechanism 2, and a temperature control mechanism 8 is provided above the arc source flange 101.

[0048] The water collection mechanism 2 is used to store cooling water;

[0049] Among them, the circulating spray mechanism 3 is used to make the cooling water in the water collection mechanism 2 circulate in the form of atomized spray;

[0050] The cooling mechanism 5 is used to absorb heat from the cooling water in the water collection mechanism 2 under the action of electric current and to transfer the heat.

[0051] Among them, the heat dissipation mechanism 6 is used to dissipate the heat transferred by the cooling mechanism 5;

[0052] Among them, the water cooling mechanism 7 is used to inject external cooling water into the water collection mechanism 2, and the auxiliary heat dissipation mechanism 6 absorbs the heat transferred by the cooling mechanism 5.

[0053] Among them, the temperature control mechanism 8 is used to monitor the temperature of the cooling water in the water collection mechanism 2.

[0054] In one embodiment, the water collection mechanism 2 includes a water collection cover 201, a water cooling chamber 202, a water storage chamber 203, and a spray chamber 204;

[0055] The bottom of the outer side wall of the water collection cover 201 is fixedly connected to the inner side wall of the arc source flange 101. The water cooling cavity 202 is located at the top of the inner side wall of the water collection cover 201. The water storage cavity 203 is located in the middle of the inner side wall of the water collection cover 201. The spray cavity 204 is located at the bottom of the inner side wall of the water collection cover 201. The heat insulation plate 4 is located between the water storage cavity 203 and the spray cavity 204. The outer side wall of the heat insulation plate 4 is fixedly connected to the inner side wall of the water collection cover 201.

[0056] The insulation plate 4 separates the water storage chamber 203 and the spray chamber 204, and can keep the cooling water in the water storage chamber 203 warm.

[0057] In one embodiment, the circulating spray mechanism 3 includes a circulating pump 301, a water pumping pipe 302, a pressure plate 303, a plurality of atomizing nozzles 304 and a heat-conducting plate 305;

[0058] The circulating pump 301 is installed on one side of the outer wall of the water collection cover 201. The inlet of the circulating pump 301 is connected to the water pump pipe 302. One end of the water pump pipe 302 is connected to the inside of the spray chamber 204. The outlet of the circulating pump 301 is connected to the inside of the water storage chamber 203. The pressure plate 303 is connected to the bottom of the heat insulation plate 4. Several atomizing nozzles 304 are connected to the bottom of the pressure plate 303. The heat conduction plate 305 is fixedly connected to the bottom of the inner wall of the water collection cover 201.

[0059] The circulating pump 301 uses the water pumping pipe 302 to draw water out of the spray chamber 204 and inject it into the water storage chamber 203, so as to create a pressure difference between the water storage chamber 203 and the spray chamber 204. When the pressure in the water storage chamber 203 reaches the pressure limit of the atomizing nozzle 304, the low-temperature cooling water flowing into the pressure plate 303 in the water storage chamber 203 is atomized and sprayed out through the atomizing nozzle 304.

[0060] In one embodiment, the cooling mechanism 5 includes a first ceramic substrate 501, a plurality of bismuth telluride N-type elements 502, a plurality of bismuth telluride P-type elements 503, a plurality of connecting pieces 504, two electrode rings 505, and a second ceramic substrate 506.

[0061] The first ceramic substrate 501 is fixedly connected to the bottom of the inner wall of the water collection cover 201. Several bismuth telluride N-type elements 502 and bismuth telluride P-type elements 503 are disposed above the first ceramic substrate 501. Several connecting pieces 504 are connected between several bismuth telluride N-type elements 502 and bismuth telluride P-type elements 503. Two electrode rings 505 are respectively installed on the top of the bismuth telluride N-type elements 502 and bismuth telluride P-type elements 503. The second ceramic substrate 506 is fixedly connected to the top of the electrode rings 505 and the connecting pieces 504.

[0062] When current flows from the bismuth telluride N-type element 502 to the bismuth telluride P-type element 503, the first ceramic substrate 501 and the heat-conducting rod 96 absorb the heat of the cooling water in the water storage chamber 203 to perform heat absorption and cooling treatment on the cooling water; when current flows from the bismuth telluride P-type element 503 to another bismuth telluride N-type element 502, heat is released, and then the released heat is absorbed by the second ceramic substrate 506, and the absorbed heat is transferred.

[0063] In one embodiment, the heat dissipation mechanism 6 includes a plurality of water-proof covers 601 and a plurality of cooling fans 602;

[0064] The bottom of several water-proof covers 601 are fixedly connected to the upper surface of the second ceramic substrate 506, and several cooling fans 602 are respectively installed on the inner sidewalls of several water-proof covers 601.

[0065] The cooling fan 602 uses the water shield 601 to promote the rapid flow of outside air on the surface of the second ceramic substrate 506, so as to dissipate heat from the second ceramic substrate 506.

[0066] In one embodiment, the water cooling mechanism 7 includes a water supply connector 701 and a drain connector 702;

[0067] One end of the water supply connector 701 is connected to one side of the interior of the water-cooled cavity 202, and one end of the drain connector 702 is connected to the other side of the interior of the water-cooled cavity 202.

[0068] External cooling water is injected into the water-cooled chamber 202 through the water supply connector 701 and discharged through the drain connector 702, so that the heat of the second ceramic substrate 506 can be quickly absorbed by the external cooling water.

[0069] In one embodiment, the temperature control mechanism 8 includes an electronic control box 801, a controller 802, a plurality of relays 803 and a temperature sensor 804;

[0070] The control box 801 is installed on one side of the upper surface of the arc source flange 101, the controller 802 is installed on one side of the inner wall of the control box 801, several relays 803 are installed on the other side of the inner wall of the control box 801, the temperature sensor 804 is installed on the outer wall of the water collection cover 201, one end of the temperature sensor 804 extends into the interior of the water storage chamber 203, the signal output terminal of the temperature sensor 804 is electrically connected to the signal input terminal of the controller 802 through a wire, the electrical output terminal of the controller 802 is electrically connected to the electrical input terminal of the relay 803 through a wire, and the electrical output terminal of the relay 803 is electrically connected to the electrical input terminal of the electrode ring 505 and the cooling fan 602 through a wire.

[0071] The temperature sensor 804 detects the cooling water temperature in the water storage chamber 203, and then the controller 802 receives the data detected by the temperature sensor 804. The controller 802 then uses the relay 803 to control the opening or closing of the electrode ring 505 and the cooling fan 602.

[0072] In one embodiment, an arc source power terminal 91 is fixedly connected to the middle of the inner wall of the water collection cover 201, a connecting frame 92 is installed on one side of the upper surface of the arc source flange 101, a cylinder 93 is installed on the top of the connecting frame 92, a sleeve 94 is fixedly connected to the bottom of the connecting frame 92, the piston rod of the cylinder 93 is slidably connected to the inner wall of the sleeve 94, and an arc-initiating needle 95 is slidably connected to the bottom of the inner wall of the sleeve 94.

[0073] The air pressure inside the sleeve 94 is controlled by the piston rod of the cylinder 93, so that the movement of the arc-starting needle 95 can be controlled by the change in air pressure inside the sleeve 94.

[0074] In one embodiment, a heat-conducting rod 96 is uniformly fixedly connected to the bottom of the first ceramic substrate 501, and the heat-conducting rod 96 is located inside the water storage cavity 203.

[0075] The heat-conducting rod 96 increases the contact area between the first ceramic substrate 501 and the cooling water in the water storage cavity 203, so that the first ceramic substrate 501 can quickly absorb the heat of the cooling water.

[0076] In one embodiment, the temperature sensor 804 is model D6T-1A-01; the controller 802 is model DF-96D.

[0077] When the present invention is in operation: the arc source mechanism is installed in the vacuum chamber, the temperature data of the cooling water in the water storage chamber 203 is detected by the temperature sensor 804, and then the controller 802 receives the data detected by the temperature sensor 804. When the data detected by the temperature sensor 804 is higher than the first threshold and lower than the maximum threshold, the controller 802 uses the relay 803 to supply power to the electrode ring 505 and starts the cooling fan 602.

[0078] By supplying power to the electrode ring 505, current flows between the bismuth telluride N-type element 502 and the bismuth telluride P-type element 503 via the connecting piece 504. When current flows from the bismuth telluride N-type element 502 to the bismuth telluride P-type element 503, the first ceramic substrate 501 and the heat-conducting rod 96 absorb heat from the cooling water in the water storage chamber 203, thus cooling the water. When current flows from the bismuth telluride P-type element 503 to another bismuth telluride N-type element 502, heat is released, and the released heat is absorbed by the second ceramic substrate 506 while transferring the absorbed heat. Then, the operating cooling fan 602 promotes rapid airflow over the surface of the second ceramic substrate 506 to dissipate heat from the second ceramic substrate 506, ensuring the absorption efficiency of the first ceramic substrate 501.

[0079] When the temperature data detected by the temperature sensor 804 reaches the maximum threshold, the controller 802 uses the relay 803 to control the external solenoid valve to open, so that external cooling water can be injected into the water-cooled cavity 202 through the water supply connector 701, and the cooling water can be discharged through the drain connector 702. This allows the external cooling water to quickly absorb the heat of the second ceramic substrate 506, so that the first ceramic substrate 501 and the heat-conducting rod 96 can absorb the heat of the cooling water in the water storage cavity 203 more quickly, and quickly cool down the cooling water in the water storage cavity 203.

[0080] When the temperature data detected by the temperature sensor 804 is lower than the first threshold, the controller 802 uses the relay 803 to stop the power supply to the electrode ring 505 and shuts off the external solenoid valve and cooling fan 602, so that the cooling water in the relay 803 is kept at a low temperature.

[0081] The insulation plate 4 separates the water storage chamber 203 and the spray chamber 204, and can keep the cooling water in the water storage chamber 203 warm.

[0082] When the magnetron target is turned off and cooling of the target material is required, the heat-conducting plate 305 absorbs the heat of the target material. Then, the circulating pump 301 uses the water pumping pipe 302 to draw water out of the spray chamber 204 and inject it into the water storage chamber 203, so as to create a pressure difference between the water storage chamber 203 and the spray chamber 204. When the pressure in the water storage chamber 203 reaches the pressure limit of the atomizing nozzle 304, the low-temperature cooling water flowing into the pressure plate 303 in the water storage chamber 203 is atomized and sprayed out through the atomizing nozzle 304. This allows the atomized low-temperature cooling water to quickly absorb the heat of the heat-conducting plate 305, improving the heat absorption effect of the heat-conducting plate 305 and the cooling effect on the target material, so that the target material can be cooled quickly.

[0083] Then, the water absorbed in the spray chamber 204 is injected back into the water storage chamber 203 by the circulating pump 301, so that the cooling mechanism 5 can continuously cool the cooling water in the water storage chamber 203, thus avoiding the gradual increase of the circulating cooling water temperature.

[0084] In one embodiment:

[0085] Based on the aforementioned embodiments, this embodiment proposes an improved scheme to further enhance the heat dissipation effect of the cooling system.

[0086] This solution replaces the cooling fan with heat dissipation fins in the heat dissipation mechanism. Specifically, multiple copper heat dissipation fins are evenly distributed and welded onto the upper surface of the second ceramic substrate. This fin structure has a large surface area, which is beneficial for air convection heat dissipation.

[0087] Compared to rotating cooling fans, fixed heat sink fins are simpler and more reliable. They do not require power to drive the system, yet still achieve good airflow and convection cooling, thereby improving the efficiency of the cooling system.

[0088] In one embodiment:

[0089] Based on the aforementioned embodiments, this embodiment proposes an improved scheme to expand the applicability of the cooling system.

[0090] This solution replaces the bismuth telluride cooling device in the cooling mechanism with a more common semiconductor cooling chip. This chip integrates a large number of miniature cooling structures, which can absorb and release a large amount of heat under current drive.

[0091] Compared to specific bismuth telluride PN junctions, semiconductor cooling chips are simpler and more versatile to manufacture, lower in cost, and easier to mass-produce. Their cooling performance and stability have also been verified.

[0092] By using general-purpose semiconductor cooling chips, the reliance on special components can be reduced, the procurement difficulty can be lowered, and the application of cooling systems can be promoted.

[0093] In one embodiment:

[0094] Based on the aforementioned embodiments, this embodiment proposes an improved solution to reduce the power consumption of the cooling system.

[0095] The solution is to activate the cooling system only when the cooling water temperature is too high, and shut down the system when the temperature is normal.

[0096] Specifically, the operating mode of the temperature control mechanism is set to intermittent, and its control cycle is as follows:

[0097] Temperature sensors detect cooling water temperature;

[0098] When the temperature reaches the upper limit threshold, the cooling system will start operating;

[0099] When the temperature drops to the lower threshold, the cooling system shuts down. This intermittent operation mode avoids the cooling system from operating at high power for extended periods, activating only when the temperature is too high and shutting down into standby mode the rest of the time. This significantly reduces the overall energy consumption of the system.

[0100] The cooling method for the arc source mechanism used in this multi-arc ion plating is as follows:

[0101] S1: Water collection and storage

[0102] A water collection mechanism is installed, which includes a water-cooling chamber, a water storage chamber, and a spray chamber for storing cooling water. Insulation plates insulate the water storage chamber, which helps maintain its temperature.

[0103] S2: Circulating spray

[0104] The cooling water is circulated using a circulating pump and a water extraction pipe. The spray mechanism sprays the cooling water in the water storage chamber into the spray chamber in an atomized form, and then flows into the heat conduction plate to rapidly absorb heat and cool the target material.

[0105] S3: Electric cooling

[0106] A bismuth telluride cooling chip is used to absorb heat from the cooling water in the water storage chamber under the drive of an electric current, thereby cooling the water. The heat is then released through structures such as heat-conducting rods.

[0107] S4: Heat dissipation

[0108] The second ceramic substrate absorbs the heat released by the cooling chip, and then the absorbed heat is quickly dissipated through a heat dissipation fan or heat dissipation chip, supplemented by external water cooling of the water cooling cavity.

[0109] S5: Temperature Control Adjustment

[0110] The temperature control mechanism collects the cooling water temperature and automatically controls the electric cooling and heat dissipation system accordingly to adjust the cooling effect reasonably based on the target material condition and ensure that the temperature is within the optimal range.

[0111] S6: Intermittent operation

[0112] By using an intermittent operation mode, the cooling system is activated only when necessary and shut down the rest of the time to reduce overall energy consumption.

[0113] The cooling method as a whole realizes the processes of cooling water recycling, electric cooling heat absorption, heat dissipation, and temperature control. Through the coordinated work of each unit, the arc source mechanism obtains continuous and efficient cooling support.

[0114] The arc source mechanism for multi-arc ion plating of this invention, through the rational arrangement and coordination of modules such as a water collection mechanism, a circulating spray mechanism, a cooling mechanism, a heat dissipation mechanism, and a water-cooling mechanism, achieves the storage of cooling water, atomized spray circulation, rapid electric cooling heat absorption, and rapid heat dissipation combining water cooling and air cooling. The temperature control mechanism monitors and controls the water temperature in real time, and can activate the cooling system as needed. The entire system works collaboratively to form a closed-loop circulation, effectively absorbing heat from the target material and rapidly cooling the cooling water, ensuring continuous and effective cooling support for the arc source.

[0115] Compared with the prior art, the present invention has the following beneficial effects:

[0116] 1. It realizes the closed-loop recycling of cooling water, and the circulating spray enhances the heat absorption effect on the target material and improves the cooling efficiency.

[0117] 2. The cooling mechanism rapidly absorbs heat and lowers the temperature, while the heat dissipation system removes heat, ensuring continuous and efficient cooling.

[0118] 3. The temperature control system provides precise control and real-time adjustment of the cooling effect to meet the needs of the target material.

[0119] 4. The system has a reasonable structure and precise control, which can provide stable and continuous output and extend the equipment life.

[0120] 5. Improved cooling performance and stability of the arc source, suitable for the needs of multi-arc ion plating.

[0121] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in the present invention, and these should all be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. An arc source mechanism for multi-arc ion plating, characterized in that... The system includes: an arc source assembly and a water collection mechanism. The arc source assembly includes an arc source flange, a target base, and a target material shield. The water collection mechanism is installed on the inner wall of the arc source flange. A circulating spray mechanism is installed on one side of the water collection mechanism. A heat insulation plate is installed at the bottom of the inner wall of the water collection mechanism. A cooling mechanism is installed at the top of the inner wall of the water collection mechanism. A heat dissipation mechanism is evenly installed on the top of the top of the outer wall of the water collection mechanism. A water cooling mechanism is installed on the top of the outer wall of the water collection mechanism. A temperature control mechanism is provided above the arc source flange. The water collection mechanism includes a water collection cover, a water-cooling chamber, a water storage chamber, and a spray chamber; the heat insulation plate is disposed between the water storage chamber and the spray chamber, and the outer side wall of the heat insulation plate is fixedly connected to the inner side wall of the water collection cover. The circulating spray mechanism includes a circulating pump, a water suction pipe, a pressure plate, several atomizing nozzles, and a heat-conducting plate. The water inlet of the circulating pump is connected to the water suction pipe, one end of which is connected to the interior of the spray chamber. The water outlet of the circulating pump is connected to the interior of the water storage chamber. The several atomizing nozzles are all connected to the bottom of the pressure plate. The heat-conducting plate is fixedly connected to the bottom of the inner wall of the water collection mechanism.

2. The arc source mechanism for multi-arc ion plating as described in claim 1, characterized in that... The cooling mechanism includes a first ceramic substrate, a plurality of semiconductor cooling chips, a plurality of connecting pieces, two electrode rings, and a second ceramic substrate; the plurality of semiconductor cooling chips are disposed above the first ceramic substrate, and the second ceramic substrate is fixedly connected to the top of the electrode rings and connecting pieces.

3. The arc source mechanism for multi-arc ion plating as described in claim 2, characterized in that... The heat dissipation mechanism includes a plurality of heat dissipation fins; the heat dissipation fins are fixedly connected to the upper surface of the second ceramic substrate.

4. The arc source mechanism for multi-arc ion plating as described in claim 1, characterized in that... The water-cooling mechanism includes a water supply connector and a drain connector; one end of the water supply connector is connected to one side of the interior of the water-cooling cavity, and one end of the drain connector is connected to the other side of the interior of the water-cooling cavity.

5. The arc source mechanism for multi-arc ion plating as described in claim 1, characterized in that... The temperature control mechanism includes an electrical control box, a controller, several relays, and a temperature sensor; the electrical output terminal of the controller is electrically connected to the electrical input terminal of the relays via wires, and the electrical output terminal of the relays is electrically connected to the electrical input terminals of the cooling mechanism and the heat dissipation mechanism via wires.

6. The arc source mechanism for multi-arc ion plating as described in claim 5, characterized in that... The temperature control mechanism operates in an intermittent mode, used to control the intermittent operation of the cooling mechanism and the heat dissipation mechanism.

7. The arc source mechanism for multi-arc ion plating as described in claim 1, characterized in that... An arc source power terminal is fixedly connected to the middle of the inner wall of the water collection mechanism. A connecting frame is installed on one side of the upper surface of the arc source flange. A cylinder is installed on the top of the connecting frame. A sleeve is fixedly connected to the bottom of the connecting frame. The piston rod of the cylinder is slidably connected to the inner wall of the sleeve. An arc-initiating needle is slidably connected to the bottom of the inner wall of the sleeve.

8. The arc source mechanism for multi-arc ion plating as described in claim 2, characterized in that... A heat-conducting rod is uniformly fixedly connected to the bottom of the first ceramic substrate, and the heat-conducting rod is located inside the water storage cavity.

9. A cooling method using the arc source mechanism for multi-arc ion plating according to any one of claims 1-8, characterized in that... The process includes the following steps: S1 collecting and storing cooling water; S2 circulating the cooling water using a circulating spray mechanism; S3 activating the cooling mechanism to electrically cool the cooling water; S4 dissipating the heat transferred by the cooling mechanism using a heat dissipation mechanism and a water cooling mechanism; and S5 monitoring the cooling water temperature and controlling the operation of the cooling system through a temperature control mechanism.

10. The cooling method as described in claim 9, characterized in that... The steps of circulating cooling water using the circulating spray mechanism specifically include: starting the circulating pump to draw cooling water from the spray chamber and inject it into the storage chamber, creating a pressure difference between the two chambers; when the pressure in the storage chamber reaches the pressure limit of the atomizing nozzle, the nozzle sprays the cooling water in the storage chamber into the spray chamber in an atomized form to rapidly cool the target material on the heat-conducting plate.

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