A preparation process of inconel-copper composite plate

Abstract

The application relates to the technical field of metal plate composite technology and discloses a preparation process of a Kovar alloy-copper composite plate, which comprises the following steps: a preparation process of an Invar alloy-copper composite plate, which comprises the following steps: s1, taking one Invar alloy plate and two copper plates; s2, immersing the Invar alloy plate into liquid copper after the Invar alloy plate is heated to 250-300 DEG C; s3, positioning the two copper plates and the Invar alloy plate to form a group of initial composite plate materials; s4, heating the whole in a heating furnace, the heating temperature is 700-850 DEG C, and the heating time is 20-40 min; s5, taking out and cooling to 500-650 DEG C, and then performing hot rolling; s6, performing stress relieving annealing on the composite blank; s7, naturally cooling to normal temperature after annealing, and cold rolling to form an Invar alloy-copper composite plate with a preset thickness. The Invar alloy-copper composite plate prepared through the process is more stable and not easy to separate between the plates, the composite plate has the physical properties of the Kovar alloy and good thermal conductivity.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of metal plate composite, in particular to a preparation process of invar-copper composite plate. BACKGROUND

[0002] Invar (Chinese brand 4J36) is a nickel-iron alloy, its composition mainly includes about 36% of nickel and 64% of iron. It has high electrical conductivity, high magnetic permeability, low thermal expansion coefficient and good corrosion resistance, etc. Therefore, it is widely used in electronic, building and aerospace fields. Due to its excellent performance, it is widely used in high-precision instruments and electronic equipment. The thermal expansion coefficient of Invar is very low, and the thermal expansion coefficient (0-100℃) is 1.2×10-6 / ℃, which means that Kovar will maintain dimensional stability when the temperature changes, so it becomes an ideal material for manufacturing high-precision electronic components such as vacuum tubes, semiconductor devices, capacitors, etc. Kovar material is widely used in the field of electronic packaging, but its thermal conductivity is only about 10W / m.K, and the heat conduction efficiency is relatively low.

[0003] Therefore, people try to cover a layer of copper on the surface of Invar to solve the problem of poor thermal conductivity. However, the hardness and physical properties of Invar and copper are very different, and no matter hot rolling or welding, the interface bonding performance between the two is poor, which cannot meet the demand. SUMMARY

[0004] In order to solve the above problems existing in the prior art, the present application provides a preparation process of invar-copper composite plate with stronger interface bonding performance and good composite effect.

[0005] In order to achieve the above purpose, the present application adopts the following technical scheme:

[0006] A preparation process of invar-copper composite plate, comprising the following steps:

[0007] s1, taking an invar plate and two copper plates, cleaning the surfaces of the invar plate and the copper plates respectively;

[0008] s2, heating the invar plate to 250-300℃, then immersing the invar plate in liquid copper, keeping for 3-5min, then taking out and cooling to 500-650℃, the liquid copper on both sides of the invar plate is cooled to form a copper film;

[0009] s3, the two copper plates and the invar plate are stacked together and positioned by a clamp to form a group of initial composite plate materials, and the invar plate is located between the two copper plates;

[0010] s4, heating the whole in a heating furnace, the heating temperature is 700-850℃, the heating time is 20-40min;

[0011] s5, after taking out, cooling to 500-650℃, then hot rolling, after hot rolling, a composite blank is made, the thickness of the composite blank is 25-30% of the initial composite blank;

[0012] s6, stress relief annealing is performed on the composite blank, the annealing temperature is 300-500℃, the annealing time is 40-60min;

[0013] s7, after annealing, natural cooling to room temperature, cold rolling, cold rolling to a predetermined thickness of the invar alloy-copper composite plate.

[0014] As preferred, in step s1, the thickness of the two copper plates is equal, the ratio of the total thickness of the two copper plates to the thickness of the invar alloy plate is 0.75-1.5; in step s3, the total thickness of the initial composite blank is 6-10mm.

[0015] As preferred, in step s1, the surface of the invar alloy plate and the copper plate is cleaned as follows:

[0016] s1-1, alkali washing is performed on the surface of the plate to remove oil stains, after alkali washing, ultrasonic deionized water is used for cleaning;

[0017] s1-2, pickling is performed on the surface of the plate to remove the oxide film, after pickling, ultrasonic deionized water is used for cleaning again;

[0018] s1-3, the plate is dried in a nitrogen-filled oven.

[0019] As preferred, in step s4, graphite separators are added to both sides of the initial composite blank, and a load perpendicular to the direction of the plate is added to the outermost side, the load is 0.5-1kN / m, then heating is performed.

[0020] As preferred, in step s4, hydrogen atmosphere is used for heating in the heating furnace.

[0021] As preferred, in step s5, the deformation amount of the hot rolling pass is 30-80%.

[0022] As preferred, in step s7, the deformation amount of the cold rolling pass is 10%-20%.

[0023] Therefore, the process has the following beneficial effects: (1) the inconel alloy plate is heated to above the curie temperature, so that the inconel alloy plate expands, the interatomic gap increases, and then immersed in liquid copper (about 1100℃), so that the copper atoms better penetrate into the interatomic gap of the surface layer of the inconel alloy to form an interfacial diffusion layer, and at the same time, the inconel alloy plate is heated to about 1100℃ by the liquid copper, so that the subsequent heating time and heating energy requirement are reduced; (2) the copper plate-inconel alloy plate is heated and pressed in the heating furnace, and the copper film on the surface of the inconel alloy and the copper plate can be more stably compounded because they are made of the same material; (3) then hot rolling is performed, so that the grains at the bonding surface of the plate are further mixed and combined, and finally cold rolling is performed to a preset thickness, at this time, the three plates are completely compounded into one, and the overall structure is very stable. DETAILED DESCRIPTION

[0024] In order to make the technical problems to be solved by the present application, the technical solutions and the beneficial technical effects clearer and more apparent, the present application will be further described in detail below in combination with multiple exemplary embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the protection scope of the present application.

[0025] A preparation process of inconel alloy-copper composite plate, comprising the following steps:

[0026] s1, take an inconel alloy plate and two copper plates, and clean the surfaces of the inconel alloy plate and the copper plates; the thicknesses of the two copper plates are equal, and the total thickness of the two copper plates to the thickness of the inconel alloy plate is in a ratio of 0.75-1.5; the surface cleaning steps of the inconel alloy plate and the copper plates are as follows: s1-1, alkali washing is performed on the surface of the plate to remove oil stains, and then ultrasonic deionized water cleaning is performed after alkali washing; s1-2, acid pickling is performed on the surface of the plate to remove the oxide film, and then ultrasonic deionized water cleaning is performed again after acid pickling; s1-3, the plate is dried in a nitrogen-filled oven;

[0027] s2, the inconel alloy plate is heated to 250-300℃, then the inconel alloy plate is immersed in liquid copper, kept for 3-5min, and then taken out and cooled to 500-650℃, and the liquid copper on both sides of the inconel alloy plate is cooled to form a copper film;

[0028] s3, the two copper plates and the inconel alloy plate are stacked together and positioned by a clamp to form a group of initial composite plate materials, wherein the inconel alloy plate is located between the two copper plates, and the total thickness of the initial composite plate materials is 6-10mm;

[0029] s4, graphite separators are added to both sides of the initial composite plate materials, and a load perpendicular to the plate direction is added to the outermost side, and the load is 0.5-1kN / m, then the whole is placed in a heating furnace for heating in a hydrogen atmosphere, the heating temperature is 700-850℃, and the heating time is 20-40min.

[0030] s5, after taking out, cooling to 500-650℃, then hot rolling, the hot rolling pass deformation is 30-80%, after hot rolling, composite blank is made, the thickness of the composite blank is 25-30% of the initial composite blank;

[0031] s6, stress relief annealing is carried out on the composite blank, the annealing temperature is 300-500℃, the annealing time is 40-60min;

[0032] s7, after annealing, natural cooling to room temperature, cold rolling is carried out, the cold rolling pass deformation is 10%-20%, the invar alloy-copper composite plate of the preset thickness is made by cold rolling.

[0033] Example 1: s1, take an invar alloy plate, two copper plates, clean the surface of the invar alloy plate and the copper plates respectively; the thickness of the two copper plates is 2mm, and the thickness of the invar alloy plate is 5mm; the surface of the invar alloy plate and the copper plates is cleaned as follows: s1-1, alkali washing is carried out on the surface of the plate to remove oil stains, after alkali washing, ultrasonic deionized water is used for cleaning; s1-2, pickling is carried out on the surface of the plate to remove oxide film, after pickling, ultrasonic deionized water is used for cleaning again; s1-3, the plate is dried in a nitrogen-filled oven;

[0034] s2, after heating the invar alloy plate to 250℃, the invar alloy plate is immersed in liquid copper for 5min, then taken out and cooled to 650℃, the liquid copper on both sides of the invar alloy plate is cooled to form a copper film;

[0035] s3, the two copper plates and the invar alloy plate are stacked together and positioned by a clamp to form a set of initial composite blank, wherein the invar alloy plate is located between the two copper plates, and the total thickness of the initial composite blank is 9mm;

[0036] s4, graphite separators are added to both sides of the initial composite blank, and a load perpendicular to the plate direction is added to the outermost side, the load is 0.5kN / m, then the whole is placed in a heating furnace for heating in a hydrogen atmosphere, the heating temperature is 800℃, and the heating time is 30min;

[0037] s5, after taking out, cooling to 650℃, then hot rolling, the hot rolling pass deformation is 60%, after hot rolling, composite blank is made, the thickness of the composite blank is 30% of the initial composite blank;

[0038] s6, stress relief annealing is carried out on the composite blank, the annealing temperature is 500℃, the annealing time is 60min;

[0039] s7, after annealing, natural cooling to room temperature, cold rolling is carried out, the cold rolling pass deformation is 15%, the invar alloy-copper composite plate of the preset thickness is made by cold rolling.

[0040] Example 2: s1, take a piece of copper alloy plate, two pieces of copper plate, clean the surface of the copper alloy plate and the copper plate respectively; the thickness of the two copper plates is 3mm, the thickness of the copper alloy plate is 4mm, and the surface of the copper alloy plate and the copper plate is cleaned as follows: s1-1, the surface of the plate is cleaned with alkali to remove oil stains, and the plate is cleaned with ultrasonic deionized water after alkali cleaning; s1-2, the surface of the plate is pickled to remove the oxide film, and the plate is cleaned with ultrasonic deionized water again after pickling; s1-3, dry the plate in a nitrogen-filled oven;

[0041] s2, heat the copper alloy plate to 280℃, then immerse the copper alloy plate in liquid copper, keep for 4min, then take out and cool to 550℃, and the two sides of the copper alloy plate are cooled to form a copper film;

[0042] s3, stack the two copper plates and the copper alloy plate together and position them with clamps to form an initial composite plate, wherein the copper alloy plate is located between the two copper plates, and the total thickness of the initial composite plate is 10mm;

[0043] s4, add graphite separators to both sides of the initial composite plate, and add a load perpendicular to the plate direction on the outermost side, the load is 0.8kN / m, then place the whole in a heating furnace and heat it in a hydrogen atmosphere, the heating temperature is 750℃, and the heating time is 40min;

[0044] s5, take out and cool to 550℃, then hot roll, the hot rolling pass deformation is 75%, and the composite blank is made after hot rolling, the thickness of the composite blank is 28% of the initial composite plate;

[0045] s6, stress relief annealing is performed on the composite blank, the annealing temperature is 400℃, and the annealing time is 40min;

[0046] s7, after annealing, naturally cool to room temperature, cold roll, the cold rolling pass deformation is 18%, and the copper alloy-copper composite plate of the preset thickness is made by cold rolling.

[0047] In this application, a copper film is first prepared on the surface layer of the copper alloy plate, there is a stable interfacial diffusion layer between the copper film and the copper alloy plate, then the copper plate-copper alloy plate is heated and pressed in a heating furnace, the plates have a certain bonding strength; then hot rolling is performed, so that the grains at the bonding surface of the plates are further fused and combined, and finally the cold rolling is performed to the preset thickness, at this time the three plates are completely combined into one, and the overall structure is very stable.

[0048] In the description of the present application, it should be understood that the directional or positional relationships indicated by up, down, left, right, inner end, outer end, one end, the other end and the like are merely for the convenience of describing the technical solutions of the present application, and do not indicate or imply that the device or element referred to must have a particular direction, be constructed and operated in a particular orientation, and cannot be understood as a limitation of the present application.

[0049] Although specific embodiments of the application are described in detail herein, they are offered by way of illustration and not by way of limitation. Various substitutions, alterations and modifications can be conceived and made without departing from the spirit and scope of the application.

Claims

1. A process for producing a composite plate of inconel-copper, characterized by, The method comprises the following steps: s1, taking a piece of inconel alloy plate and two pieces of copper plate, cleaning the surfaces of the inconel alloy plate and the copper plate respectively; s2, heating the inconel alloy plate to 250-300 DEG C, then immersing the inconel alloy plate into liquid copper, keeping for 3-5 min, then taking out and cooling to 500-650 DEG C, the liquid copper on both sides of the inconel alloy plate is cooled to form copper film; s3, stacking the two pieces of copper plate and the inconel alloy plate together and positioning by a clamp to form an initial composite plate material, wherein the inconel alloy plate is located between the two pieces of copper plate; s4, adding graphite separators on both sides of the initial composite plate material, and adding load in the direction perpendicular to the plate, then putting the whole into a heating furnace for heating, the heating temperature is 700-850 DEG C, and the heating time is 20-40 min; s5, taking out and cooling to 500-650 DEG C, then hot rolling, and forming a composite blank after hot rolling, the thickness of the composite blank is 25-30% of the initial composite plate material; s6, stress relieving annealing the composite blank, the annealing temperature is 300-500 DEG C, and the annealing time is 40-60 min; s7, naturally cooling to room temperature after annealing, cold rolling, and forming an inconel-copper composite plate with a preset thickness.

2. The process for preparing an invar-copper composite plate according to claim 1, characterized in that, In step s1, the thicknesses of the two pieces of copper plate are equal, and the ratio of the total thickness of the two pieces of copper plate to the thickness of the inconel alloy plate is 0.75-1.5; in step s3, the total thickness of the initial composite plate material is 6-10 mm.

3. The process for preparing an invar-copper composite plate according to claim 1, characterized in that, In step s1, the cleaning steps of the surfaces of the inconel alloy plate and the copper plate are as follows: s1-1, alkali washing the plate surface to remove oil stains, then cleaning the plate surface with ultrasonic deionized water after alkali washing; s1-2, pickling the plate surface to remove oxide film, then cleaning the plate surface with ultrasonic deionized water again after pickling; s1-3, drying the plate in a nitrogen-filled oven.

4. The process for preparing an invar-copper composite plate according to claim 1, characterized in that, In step s4, the heating furnace is heated in a hydrogen atmosphere.

5. The process for preparing an invar-copper composite plate according to claim 1, characterized in that, In step s5, the deformation amount of the hot rolling pass is 30-80%.

6. The process for preparing an invar-copper composite plate according to claim 1 or 5, characterized in that, In step s7, the deformation amount of the cold rolling pass is 10%-20%.