A valve integrated block for a semiconductor device

Abstract

The application provides a valve integrated block for a semiconductor device, comprising a valve block body and a gas mixing module, and output gas of the valve block body is introduced into the gas mixing module. The gas mixing module comprises a first gas mixing chamber, a second gas mixing chamber, a scattering nozzle and a circumferential inclined pipeline. A main body of the scattering nozzle is arranged in the first gas mixing chamber, and the output gas of the valve block body is introduced into the first gas mixing chamber for mixing through the scattering nozzle. The circumferential inclined pipeline is connected between the first gas mixing chamber and the second gas mixing chamber, and the mixed gas in the first gas mixing chamber enters the second gas mixing chamber for mixing again through the circumferential inclined pipeline.

Description

TECHNICAL FIELD

[0001] The present application relates to semiconductor equipment, in particular to a valve block. BACKGROUND

[0002] The equipment for deposition reaction usually designs an integrated gas mixing valve block according to the kind and quantity of reaction gas, and the gas components cannot be uniform after the mixed gas passes through the integrated block, so it is necessary to find a method to mix the gas uniformly before entering the deposition reaction chamber.

[0003] The prior art integrated gas mixing valve block lacks a specially designed gas mixing structure, and the gas component uniformity is not good, and the gas mixing uniformity is also not good.

[0004] Therefore, there is an urgent need for a valve block with a special structure. SUMMARY

[0005] In order to solve the defects of the prior art integrated gas mixing valve block, the present application provides a special valve block for semiconductor equipment.

[0006] The valve block includes a valve block body and a gas mixing module.

[0007] The output gas of the valve block body enters the gas mixing module.

[0008] The gas mixing module includes a first gas mixing chamber, a second gas mixing chamber, a scattering nozzle and a circumferential inclined pipeline.

[0009] The main body of the scattering nozzle is arranged in the first gas mixing chamber, and the output gas of the valve block body enters the first gas mixing chamber for mixing through the scattering nozzle.

[0010] The circumferential inclined pipeline is connected between the first gas mixing chamber and the second gas mixing chamber, and the mixed gas in the first gas mixing chamber enters the second gas mixing chamber through the circumferential inclined pipeline for further mixing.

[0011] In one embodiment, the valve block further includes a flow resistance adjusting plate connected between the gas mixing module and the valve block body.

[0012] In one embodiment, the flow resistance adjusting plate has a first tapered gas passage, a flow resistance pipe and a second tapered gas passage inside; the flow resistance pipe is connected between the first tapered gas passage and the second tapered gas passage.

[0013] In one embodiment, the bottom surface of the first tapered gas passage is connected to the valve block body, and the top of the first tapered gas passage is in communication with the flow resistance pipe; the top of the second tapered gas passage is connected to the flow resistance pipe, and the bottom surface of the second tapered gas passage is connected to the gas mixing module.

[0014] In one embodiment, the orifice diameter of the flow resistance pipe is adjustable.

[0015] In one embodiment, the plurality of orifices of the scattering nozzle are uniformly distributed on the outer periphery of the scattering nozzle body.

[0016] In one embodiment, the valve block body has a first gas inlet and a second gas inlet, the first gas being introduced into the valve block body from the first gas inlet, and the second gas being introduced into the valve block body from the second gas inlet.

[0017] In one embodiment, the gas mixing module has an output port, and the output gas of the second gas mixing chamber flows out of the output port.

[0018] In one embodiment, the scattering nozzle and the circumferential inclined pipe both adopt the principle of diffusion combined with convection, the orifices of the scattering nozzle facilitate gas diffusion mixing, and the orifices with different orientations can change the direction of gas flow, forcing the gas to circulate in the gas mixing module, and then mixing in the first gas mixing chamber and the second gas mixing chamber, thereby greatly improving the uniformity of the mixed gas.

[0019] In one embodiment, the circumferential inclined pipe is a plurality of inclined pipes arranged around the outer periphery of the cylinder.

[0020] The valve integrated block of the present application increases a dedicated gas mixing module, which adopts a multi-hole multi-flow design, thereby greatly improving the uniformity of the heated gas. In addition, the valve integrated block of the present application is also designed with an adjustable flow resistance gas mixing module, which can effectively improve the uniformity of the mixed gas. BRIEF DESCRIPTION OF DRAWINGS

[0021] The above summary of the application and the following detailed description of the application will be better understood when read in conjunction with the accompanying drawings. It should be noted that the drawings are merely examples of the claimed application. In the drawings, like reference numerals refer to like or similar elements.

[0022] Figure 1 A valve integrated block according to an embodiment of the present application is shown;

[0023] Figure 2 A structure schematic diagram of a gas mixing module according to an embodiment of the present application is shown;

[0024] Figure 3 A valve integrated block according to another embodiment of the present application is shown;

[0025] Figure 4 A structure schematic diagram of a flow resistance adjusting plate according to an embodiment of the present application is shown;

[0026] Figure 5A An internal pipeline schematic diagram of a valve integrated block without a gas mixing module is shown;

[0027] Figure 5B Fig. 2 shows an internal piping diagram of a valve manifold with a gas mixing module according to an embodiment of the present application;

[0028] Figure 6A Fig. 4 shows a piping outlet cross-section O2 mass fraction contour map without a gas mixing module;

[0029] Figure 6B Fig. 6 shows a piping outlet cross-section O2 mass fraction contour map with a gas mixing module according to an embodiment of the present application;

[0030] Figure 7A Fig. 8 shows a piping outlet cross-section TEOS mass fraction contour map without a gas mixing module;

[0031] Figure 7B Fig. 10 shows a piping outlet cross-section TEOS mass fraction contour map with a gas mixing module according to an embodiment of the present application. DETAILED DESCRIPTION

[0032] The specific features and advantages of the present application will be described in detail in the following detailed description, which is sufficient to enable any person skilled in the art to understand the technical content of the present application and to implement it, and according to the description, claims and drawings disclosed in the specification, those skilled in the art can easily understand the related purposes and advantages of the present application. Although the description of the present application will be introduced in combination with the preferred embodiments, it does not mean that the features of the present application are limited to the embodiments. On the contrary, the purpose of introducing the application in combination with the embodiments is to cover other options or modifications that can be extended based on the claims of the present application. In order to provide a deep understanding of the present application, many specific details will be included in the following description. The present application can also be implemented without using these details. In addition, in order to avoid confusion or obscure the focus of the present application, some specific details will be omitted in the description.

[0033] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0034] In addition, the terms "upper", "lower", "left", "right", "horizontal", "vertical", "top", "bottom", "lateral", "medial", "distal", and "proximal" as used herein refer to the orientation of the figure in which the drawings are illustrated. Such relative terms are used for convenience of description only and do not imply or require that the apparatus be manufactured or operated in a particular orientation unless explicitly stated otherwise.

[0035] It is to be understood that the terms "first", "second", "third", and the like, used herein do not imply or require any particular order or sequence but are used for the purpose of nomenclature only. Further, the terms "first", "second", "third", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

[0036] As used in this application and the claims, the terms "comprises", "comprising", "includes", "including" and the like can mean "including but not limited to". As used herein, including the claims "and / or", when used in a list of two or more items, means that any one of the listed items can be present alone, or a combination of any two or more of the listed items can be present. For example, "A and / or B" means: "A alone, B alone, or A and B together". Only those constraints that mathematically or logically follow from the context of the words immediately preceding the constraint are implied.

[0037] Some embodiments use numerical descriptors of ingredients, attributes, quantities. It should be understood that such numerical descriptors used in the description of embodiments can in some examples be modified by the adjectives "about", "approximately", or "generally". Unless otherwise stated, "about", "approximately", or "generally" indicates that the number can vary by ±20%. Accordingly, numerical values used in the specification and claims of this application are approximations which can vary depending upon the desired properties sought to be obtained by the individual embodiment. In some embodiments, numerical values should be considered in the context of the description of the embodiment and, when appropriate, the general level of precision to which the numerical values are carried in the art. Notwithstanding that the numerical scopes of values recited in certain embodiments of the application are approximations, the numerical values set forth in the specific examples are reported as precisely as practicable.

[0038] The application also uses certain terminology to describe embodiments of the application. As used herein, the terms "one embodiment", "an embodiment", or "some embodiments” mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrase "in one embodiment” or "in an embodiment” in various places in the specification are not necessarily all referring to the same embodiment, nor are the various embodiments referred to have to be mutually exclusive. Furthermore, some of the features, structures, or characteristics of one or more embodiments of the application can be combined in an ad hoc manner.

[0039] To solve the defects of the existing integrated gas mixing valve block, the application provides a special valve block for semiconductor equipment.

[0040] The valve block comprises a valve block body and a gas mixing module.

[0041] The output gas of the valve block body enters the gas mixing module.

[0042] The gas mixing module comprises a first gas mixing chamber, a second gas mixing chamber, a scattering nozzle and a circumferential inclined pipe.

[0043] The main body of the scattering nozzle is arranged in the first gas mixing chamber, and the output gas of the valve block body enters the first gas mixing chamber for mixing through the scattering nozzle.

[0044] The circumferential inclined pipe is connected between the first gas mixing chamber and the second gas mixing chamber, and the mixed gas in the first gas mixing chamber enters the second gas mixing chamber for further mixing through the circumferential inclined pipe.

[0045] In one embodiment, the valve block further comprises a flow resistance adjusting plate connected between the gas mixing module and the valve block body.

[0046] In one embodiment, the flow resistance adjusting plate has a first tapered gas passage, a flow resistance pipe and a second tapered gas passage inside; the flow resistance pipe is connected between the first tapered gas passage and the second tapered gas passage.

[0047] In one embodiment, the bottom surface of the first tapered gas passage is connected towards the valve block body, and the top of the first tapered gas passage is in communication with the flow resistance pipe; the top of the second tapered gas passage is connected with the flow resistance pipe, and the bottom surface of the second tapered gas passage is connected towards the gas mixing module.

[0048] In one embodiment, the aperture of the flow resistance pipe is adjustable.

[0049] In one embodiment, the main body of the scattering nozzle is uniformly distributed with multiple pores of different orientations on the outer periphery.

[0050] In one embodiment, the valve block body has a first gas inlet and a second gas inlet, and the first gas enters the valve block body from the first gas inlet, and the second gas enters the valve block body from the second gas inlet.

[0051] In one embodiment, the gas mixing module has an output port, and the output gas of the second gas mixing chamber flows out from the output port.

[0052] In one embodiment, the scattering nozzle and the circumferential inclined pipe both adopt the principle of diffusion combined with convection. The pores of the scattering nozzle facilitate gas diffusion and mixing, and the pores with different orientations can change the direction of gas flow, forcing the gas to circulate in the gas mixing module and then mix in the first gas mixing chamber and the second gas mixing chamber, thereby greatly improving the uniformity of the mixed gas.

[0053] In one embodiment, the circumferential inclined pipe is a plurality of inclined pipes arranged around the outer periphery of the cylinder.

[0054] The valve integrated block of the present application increases a dedicated gas mixing module, which adopts a multi-pore multi-flow design, greatly improving the uniformity of gas heating. The valve integrated block of the present application is also designed with an adjustable flow resistance gas mixing module, which can effectively improve the uniformity of the mixed gas.

[0055] Figure 1 A valve integrated block according to an embodiment of the present application is shown. Specifically, the valve integrated block includes a valve block body and a gas mixing module 103 coupled to the valve block body.

[0056] The valve block body has a first gas inlet 101 and a second gas inlet 102. A first gas is introduced into the valve block body from the first gas inlet 101. A second gas is introduced into the valve block body from the second gas inlet 102.

[0057] In one embodiment, the valve block body can be a conventional integrated gas mixing valve integrated block. However, the output mixed gas is not uniform.

[0058] The gas mixing module 103 is coupled to the valve block body, which can achieve uniform mixing of multiple groups of gas.

[0059] In one embodiment, the gas mixing module 103 is welded or screwed to the valve block body.

[0060] The gas mixing module 103 has a special gas mixing structure for further and fully uniform mixing of the first gas and the second gas, and outputs the mixed gas from an output port 104.

[0061] Figure 2 A structural schematic diagram of a gas mixing module according to an embodiment of the present application is shown. The gas mixing module includes two chambers: a first gas mixing chamber 201 and a second gas mixing chamber 202. The gas mixing module also includes a scattering nozzle 203 and a circumferential inclined pipe 204.

[0062] The scattering nozzle 203 is connected to the output port of the valve block body. The body of the scattering nozzle 203 is arranged in the first gas mixing chamber 201. The gas output by the valve block body enters the first gas mixing chamber 201 through the scattering nozzle 203.

[0063] In one embodiment, the scattering nozzle has holes of different orientations evenly distributed on the circumference of the nozzle body.

[0064] The circumferential inclined pipe 204 is connected between the first gas mixing chamber 201 and the second gas mixing chamber 202.

[0065] In one embodiment, the circumferential inclined pipe 204 is a plurality of inclined pipes arranged around the cylindrical circumference.

[0066] The mixed gas in the first gas mixing chamber 201 passes through the circumferential inclined pipe 204 into the second gas mixing chamber for secondary mixing, which improves the uniformity of the gas.

[0067] The gas heating uniformity can be improved by the multi-channel design of the gas mixing module. Specifically, the scattering nozzle and the circumferential inclined pipe both adopt the principle of combining diffusion and convection. The small holes facilitate gas diffusion and mixing, and the holes of different directions can change the direction of gas flow, forcing the gas to circulate in the gas mixing module, and then mixing in the two-stage chamber, which can fully improve the uniformity of the mixed gas.

[0068] Figure 3 A valve integrated block according to another embodiment of the present application is shown. The valve integrated block includes a valve block body, a gas mixing module 103, and a flow resistance adjusting plate 301.

[0069] The flow resistance adjusting plate 301 is used to stabilize the gas pressure and adjust the flow.

[0070] The flow resistance adjusting plate 301 is located between the gas mixing module and the valve block body.

[0071] In one embodiment, the flow resistance adjusting plate 301 can be added between the gas mixing module and the valve block body in the case of screw connection between the gas mixing module and the valve block body.

[0072] In one embodiment, the flow resistance adjusting plate 301 can be divided into multiple specifications according to the size of the flow resistance pipe diameter to meet different flow resistance requirements, and the flow resistance adjusting plate can provide stable pressure and flow of the gas for the gas mixing module.

[0073] Figure 4 A structural schematic diagram of a flow resistance adjusting plate according to one embodiment of the present application is shown. The flow resistance adjusting plate has a first conical gas passage 402, a flow resistance pipe 401, and a second conical gas passage 403.

[0074] The flow resistance pipe 401 is connected between the first conical gas passage and the second conical gas passage.

[0075] In one embodiment, the aperture of the flow resistance pipe is adjustable.

[0076] The bottom of the first conical gas passage is directed towards the valve block body to receive the gas in. The top of the first conical gas passage is connected with the flow resistance tube.

[0077] The top of the second conical gas passage is connected with the flow resistance tube, and the bottom is directed towards the gas mixing module.

[0078] Figure 5A The internal pipeline schematic diagram of the valve integrated block without the gas mixing module is shown.

[0079] Figure 5B The internal pipeline schematic diagram of the valve integrated block with the gas mixing module according to an embodiment of the present application is shown.

[0080] For the two different structures of the valve integrated block without the gas mixing module and the valve integrated block with the added gas mixing module, the present application carries out simulation analysis to further prove the beneficial technical effects of the valve integrated block with the gas mixing module of the present application.

[0081] Taking O2 (oxygen) and TEOS (ethyl silicate) as examples, simulation analysis is carried out.

[0082] Figure 6A The O2 mass fraction cloud diagram of the pipeline outlet cross section without the gas mixing module is shown. Figure 6B The O2 mass fraction cloud diagram of the pipeline outlet cross section with the gas mixing module according to an embodiment of the present application is shown.

[0083] Figure 7A The TEOS mass fraction cloud diagram of the pipeline outlet cross section without the gas mixing module is shown. Figure 7B The TEOS mass fraction cloud diagram of the pipeline outlet cross section with the gas mixing module according to an embodiment of the present application is shown.

[0084] By comparing Figure 6A and 6B , Figure 7A and 7B , it can be seen that the uniformity of O2 is improved by about 6 times, and the uniformity of TEOS is improved by about 10 times through simulation analysis of the gas mass distribution.

[0085] The terms and expressions used above are only used for description, and the present application should not be limited to these terms and expressions. The use of these terms and expressions does not mean the exclusion of any equivalent features and descriptions (or part thereof), and it should be recognized that various modifications can also be included in the scope of the claims. Other modifications, changes and replacements can also exist. Accordingly, the claims should be considered to cover all these equivalents.

[0086] For the same reasons, it should be noted that the foregoing description of embodiments of the application is sometimes in terms of implementing aspects of one or more applications, and occasionally will describe features that would be useful in some implementations more than others. The skilled artisan will recognize that not all implementations need implement all features or implementations of one or more applications. Thus, the skilled artisan will recognize that, in some contexts, where subclaims are present in the claims below and they do not have the word "means" associated with them, the claims can be understood to be implementing structural circuity claims, as opposed to means-plus-function claims that refer to actions that are performed by a specified apparatus. Conversely, where subclaims refer to specified apparatuses configured to perform specified actions, the claims can be understood to be implementing means-plus-function claims.

[0087] Also, it is noted that, as used herein, "and / or", where used, means "and / or", both terms can be used separately or in combination with one another. Also, it is noted that, as used herein, "or" is used in the inclusive sense, such that "A or B" means "A, B, or both A and B". Also, it is noted that, as used herein, "comprises / comprising" and "has / have / having" can be used interchangeably with "comprising" or "including", such that "A comprises B" is the same as "A includes B" or "A having B".

Claims

1. A valve integrated block for a semiconductor device, characterized by, include: The valve block body and the gas mixing module are provided, and the output gas of the valve block body is introduced into the gas mixing module. The mixing module includes: The first mixing chamber, the second mixing chamber, the scattering nozzle, and the circumferential inclined pipe; The main body of the scattering nozzle is located in the first mixing chamber, and the output gas of the valve block body is introduced into the first mixing chamber through the scattering nozzle for mixing. The circumferential inclined pipe connects the first mixing chamber and the second mixing chamber. The gas mixed in the first mixing chamber enters the second mixing chamber through the circumferential inclined pipe and is mixed again. The scattering nozzle has multiple pores evenly distributed on its outer periphery with different orientations; the circumferential inclined pipe consists of multiple inclined pipes arranged around the outer periphery of a cylinder; both the scattering nozzle and the circumferential inclined pipe adopt the principle of combining diffusion and convection. The pores of the scattering nozzle facilitate gas diffusion and mixing, and the different orientations of the pores can change the gas flow direction, forcing the gas to circulate in the gas mixing module, and then mix in the first and second gas mixing chambers, thus fully improving the uniformity of the gas mixture.

2. The valve integration block for a semiconductor device according to claim 1, wherein The valve assembly also includes: A flow resistance regulating plate is connected between the mixing module and the valve block body.

3. The valve integration block for a semiconductor device according to claim 2, wherein The flow resistance regulating plate has a first conical gas channel, a flow resistance tube, and a second conical gas channel inside; the flow resistance tube is connected between the first conical gas channel and the second conical gas channel.

4. The valve integration bulkhead for a semiconductor device of claim 3, wherein, The bottom surface of the first conical gas channel is connected to the valve block body, and the top surface of the first conical gas channel is connected to the flow resistance pipe; the top surface of the second conical gas channel is connected to the flow resistance pipe, and the bottom surface of the second conical gas channel is connected to the gas mixing module.

5. The valve integration bulkhead for a semiconductor device of claim 3, wherein, The orifice diameter of the flow resistor is adjustable.

6. The valve integration block for a semiconductor device according to claim 1, wherein The valve block body has a first air inlet and a second air inlet. A first gas is introduced into the valve block body through the first air inlet, and a second gas is introduced into the valve block body through the second air inlet.

7. The valve integration block for a semiconductor device according to claim 1, wherein The gas mixing module has an output port from which the output gas from the second gas mixing chamber flows out.

Images