A high-energy ray detector and a detection method

Abstract

This invention relates to the field of high-energy ray detection, specifically to a high-energy ray detector and detection method. The detector comprises an array of detection units, each unit including a scintillator structure, a photoelectric converter, and a signal readout path. The scintillator structure includes at least one scintillating crystal, at least one dielectric, and at least one Cherenkov scintillator. At least one of the scintillating crystals is coupled to the photoelectric converter, or a combination of at least one scintillating crystal and the Cherenkov scintillator is coupled to the photoelectric converter. All the dielectrics are connected to the signal readout path. The detector of this application can provide heterogeneous detection data to obtain high energy resolution and high temporal resolution data, thereby providing higher image quality in imaging applications.

Description

Technical Field

[0001] This invention relates to the field of high-energy ray detection, and specifically to a high-energy ray detector and detection method. Background Technology

[0002] High-energy ray detectors are often used in applications such as positron emission tomography, single-photon emission tomography, neutron logging in oil wells, high-energy physics, and space physics to detect particles such as gamma rays, neutrons, protons, and alpha particles.

[0003] Scintillators are a crucial component of high-energy ray detectors, responsible for converting high-energy rays into visible light. In high-energy ray detection applications, scintillators are typically used solely as the scintillator to convert high-energy rays into visible light. Taking positron emission tomography (PET) as an example, compared to traditional PET, time-of-flight PET (TOF-PET) additionally captures the time difference between the arrival of two gamma photons generated by positron annihilation at the two detectors, providing a certain temporal resolution. Based on this temporal information, TOF-PET images exhibit superior signal-to-noise ratio and spatial resolution compared to non-TOF-PET images. However, the temporal resolution of commonly used TOF-PET detectors based on scintillators (such as LYSO) is currently limited by the internal physical processes of the scintillator, with a theoretical temporal resolution of approximately 100 ps, ​​but currently only reaching about 200 ps. This restricts the signal-to-noise ratio and spatial resolution of TOF-PET images.

[0004] Therefore, how to provide a new detector structure to improve the image signal-to-noise ratio and spatial resolution in high-energy ray detection is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] This application proposes a high-energy ray detector and detection method to solve at least one of the above-mentioned problems.

[0006] According to one aspect of this application, a high-energy ray detector is provided, the detector comprising an array of detection units, each detection unit comprising a scintillator structure, a photoelectric converter, and a signal readout path; the scintillator structure comprising at least one scintillating crystal, at least one dielectric, and at least one Cherenkov scintillator; wherein at least one of the scintillating crystals is coupled to the photoelectric converter, or a combination of at least one scintillating crystal and the Cherenkov scintillator is coupled to the photoelectric converter; all of the dielectrics are connected to the signal readout path.

[0007] According to some embodiments, the scintillation crystal, the dielectric, and the Cherenkov scintillator are stacked along a predetermined direction, which is parallel or perpendicular to the thickness direction of the scintillation crystal; or, The scintillation crystal, the dielectric, and the Cherenkov scintillator are at least partially stacked in a first direction and at least partially stacked in a second direction perpendicular to the first direction, the first direction being parallel or perpendicular to the thickness direction of the scintillation crystal.

[0008] According to some embodiments, when the number of any one of the scintillating crystal, the dielectric, or the Cherenkov scintillator exceeds one, they are arranged in a manner that is either stacked sequentially of the same type or stacked alternately of different types.

[0009] According to some embodiments, the photoelectric converter is a superconducting nanowire single-photon detector.

[0010] According to some embodiments, an optical coupling agent is disposed between the scintillator structure and the photoelectric converter, and the difference between the refractive index of the optical coupling agent and the refractive index of the scintillator crystal or the Cherenkov scintillator is less than a preset value.

[0011] According to some embodiments, the preset value approaches zero.

[0012] According to some embodiments, the outer surface of the scintillator structure is provided with a reflective layer.

[0013] According to some embodiments, a light-transmitting adhesive is provided between the scintillation crystal and the Cherenkov scintillator, the scintillation crystal and the dielectric, and the Cherenkov scintillator and the dielectric, wherein the thickness of the light-transmitting adhesive is 0.1-0.5 mm.

[0014] According to some embodiments, the detector is used in positron emission tomography, single-photon emission tomography, petroleum neutron logging, high-energy physics or space physics detection.

[0015] According to one aspect of this application, a method for detecting high-energy rays is provided, the method comprising: reading out an electrical signal of the change in dielectric constant caused by the interaction of high-energy rays with a dielectric material using a lumped circuit method, transmission line method, resonance method, streak camera, or free space wave method; reading out Cherenkov light and scintillation light signals generated by the high-energy rays and Cherenkov scintillator and scintillation crystal, respectively, in the form of an electrical signal using a photoelectric converter; converting the electrical signal into a digital signal using an analog-to-digital converter; obtaining the arrival time of the high-energy rays by rise time discrimination or constant ratio time discrimination; and obtaining the energy of the high-energy rays by one or more of numerical integration, fitting integration, peak sampling, or pulse width extraction.

[0016] According to some example embodiments of this application, the detector and detection method proposed in this application combine a scintillation crystal, a dielectric, and a Cherenkov scintillator. During detection, a portion of the incident high-energy rays are deposited in the scintillation crystal, and another portion is deposited in the dielectric or Cherenkov scintillator, or in both. The high-energy rays deposited in the scintillation crystal provide higher energy resolution for imaging, while the high-energy rays deposited in the dielectric and Cherenkov scintillator provide higher temporal resolution. The combination of these two types of rays constitutes heterogeneous detection data, which can provide a certain proportion of high-energy-resolution and high-temporal-resolution data, thereby providing higher image quality in imaging applications. Attached Figure Description

[0017] This application will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein: Figure 1 This diagram illustrates the structure of a high-energy ray detector according to an example embodiment of this application. Figures 2-8 This diagram illustrates a structural schematic of another scintillator structure according to an example embodiment of this application; Figures 9-17 This diagram illustrates a structural schematic of another scintillator structure according to an example embodiment of this application; Figures 18-22 This diagram illustrates a structural schematic of another scintillator structure according to an example embodiment of this application; Figure 23 A flowchart illustrating a method for detecting high-energy rays according to an example embodiment of this application is shown. Detailed Implementation

[0018] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0019] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only. The described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a full understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of these specific details, or other methods, components, materials, devices, or operations may be employed. In these cases, well-known structures, methods, devices, implementations, materials, or operations will not be shown or described in detail.

[0020] The flowcharts shown in the accompanying drawings are merely illustrative and do not necessarily include all content and operations / steps, nor do they necessarily have to be performed in the described order. For example, some operations / steps can be broken down, while others can be combined or partially combined; therefore, the actual execution order may change depending on the specific circumstances.

[0021] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that comprises a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such processes, methods, products, or apparatus. The terms "and / or" or "and / or" include any and all combinations of one or more of the associated listed items.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0023] As described in the background section above, there is an irreconcilable contradiction in the temporal and energy resolution performance of detectors in the prior art for high-energy rays.

[0024] To address the aforementioned problems, specific embodiments according to this application will be described in detail below with reference to the accompanying drawings.

[0025] like Figure 1 As shown, see also Figure 2 The detector provided in this application generally includes an array 01 composed of detection units, each detection unit comprising a scintillator structure 10, a photoelectric converter 20, and a signal readout path. The scintillator structure 10 includes at least one scintillator crystal 11, at least one dielectric material 12, and at least one Cherenkov scintillator 13. At least one scintillator crystal 11 is coupled to the photoelectric converter 20, or a combination of at least one scintillator crystal 11 and the Cherenkov scintillator 13 is coupled to the photoelectric converter 20. All dielectric materials 12 are connected to the signal readout path.

[0026] It should be specifically noted that dielectric 12 refers to a material whose dielectric constant changes significantly under high-energy radiation. Those skilled in the art will understand that a change in dielectric constant greater than 10⁻⁸ is considered significant. The dielectric constant is the ratio of the electric field strength to the electric displacement density in a medium; it is a physical quantity of a medium. Many factors influence the dielectric constant, the most important being temperature. In addition, humidity, frequency, and the molecular structure of the material also affect the dielectric constant. High-energy radiation is a type of high-energy electromagnetic wave that can penetrate matter and interact with it. Irradiation by high-energy radiation may affect the dielectric constant. When high-energy radiation interacts with dielectric 12, it can generate an electrical signal that causes a change in the dielectric constant.

[0027] For example, dielectric 12 is made of at least one of silicon dioxide and barium titanate.

[0028] Cherenkov scintillation is an electromagnetic radiation phenomenon that occurs when charged particles in certain media exceed the speed of light within that medium, producing a predominantly blue electromagnetic radiation. This radiation is caused by charged particles exciting atoms or molecules in the medium as they move through it. When these atoms or molecules return to their ground state, they release energy, forming Cherenkov radiation. The total intensity of Cherenkov radiation is proportional to the velocity of the incident charged particles; more particles result in a stronger total intensity. Unlike fluorescence or stimulated emission, whose electromagnetic spectra have peaks at specific frequencies, Cherenkov radiation has a continuous spectrum. The relative intensity at a given frequency is directly proportional to that frequency; that is, Cherenkov radiation has a stronger intensity at higher frequencies (shorter wavelengths). When high-energy rays enter a Cherenkov scintillator 13, they convert their energy into the kinetic energy of electrons, causing them to exceed the speed of light within the medium and triggering Cherenkov radiation.

[0029] For example, the Cherenkov scintillation 13 is made of at least one of glass and transparent plastic.

[0030] Scintillation crystal 11 is a material that exhibits luminescence properties when excited by ionizing radiation. It is a functional crystal material that can convert the energy of X-rays, gamma rays or other high-energy rays into visible or ultraviolet light. It can be used for radiation detection and safety protection. It is usually processed into crystals in applications and is figuratively described as an "eye" that can see high-energy rays or particles.

[0031] For example, the scintillation crystal is made of at least one of lutetium yttrium silicate (LYSO), yttrium silicate (YSO), lutetium silicate (LSO), bismuth germanate (BGO), and sodium iodide (NaI).

[0032] In this application example, the outer surface of the scintillator structure 10 is provided with a reflective layer. Specifically, an opaque diffuse reflective material, such as BaSO4 powder or a specular reflective film, is coated on the outer surface of the scintillator structure as a reflective layer.

[0033] In some embodiments, the scintillator structure 10 may be connected to a signal readout path, wherein the dielectric 12 is connected to the signal readout path, and the electrical signal of the change in dielectric constant caused by the interaction between high-energy rays and the dielectric is read out via the signal readout path. Specifically, the signal readout path may employ one of the following methods: lumped circuit method, transmission line method, resonant method, streak camera, or free space wave method. For details regarding the specific configuration of the signal readout path, please refer to the prior art, which will not be elaborated here.

[0034] In some embodiments, the scintillator structure 10 is also coupled to the photoelectric converter 20 to convert the scintillating light and Cherenkov light (both visible light) generated by high-energy rays deposited on the scintillator crystal 11 and the Cherenkov scintillator 13 into electrical signals.

[0035] It should be noted that, Figure 2 The scintillator structure 10 is shown to include one scintillator crystal 11, one dielectric 12, and one Cherenkov scintillator 13. As can be seen from the above, the number of any one or more of the scintillator crystal 11, dielectric 12, and Cherenkov scintillator 13 in the scintillator structure 10 exceeds one.

[0036] The high-energy ray detector provided in this application combines a scintillation crystal 11, a dielectric material 12, and a Cherenkov scintillator 13. During detection, a portion of the incident high-energy rays are deposited in the scintillation crystal 11, while the remaining portion is deposited in the dielectric material 12 and the Cherenkov scintillator 13. The high-energy rays deposited in the scintillation crystal 11 provide high energy resolution for imaging, while the high-energy rays deposited in the dielectric material 12 and the Cherenkov scintillator 13 provide high temporal resolution. Together, they constitute heterogeneous detection data, providing a certain proportion of high-energy-resolution and high-temporal-resolution data, thereby offering higher image quality in imaging applications.

[0037] There are various arrangements for the scintillator crystal 11, dielectric 12, and Cherenkov scintillator 13 in the scintillator structure 10. In one embodiment, the scintillator crystal 11, dielectric 12, and Cherenkov scintillator 13 are stacked along a predetermined direction, which is parallel or perpendicular to the thickness direction of the scintillator crystal 11. In one case, the predetermined direction is parallel to the thickness direction of the scintillator crystal 11; in another case, the predetermined direction is perpendicular to the thickness direction of the scintillator crystal 11. In one embodiment, the scintillator crystal 11, dielectric 12, and Cherenkov scintillator 13 are at least partially stacked in a first direction and at least partially stacked in a second direction perpendicular to the first direction. The first direction is parallel or perpendicular to the thickness direction of the scintillator crystal 11. In one case, the first direction is parallel to the thickness direction of the scintillator crystal 11; in another case, the first direction is perpendicular to the thickness direction of the scintillator crystal 11. Furthermore, when the number of any one of the scintillator crystal 11, dielectric 12, or Cherenkov scintillator 13 exceeds one, they are arranged in a manner of sequential stacking of the same type or alternating stacking of different types. Those skilled in the art will understand that: sequential stacking of the same type can be understood as all scintillating crystals 11 stacked together, all dielectrics 12 stacked together, all Cherenkov scintillators 13 stacked together, and then the three types are combined and stacked to form a scintillator structure 10; the method of alternating stacking of different types can be understood as the three types of scintillating crystals 11, dielectrics 12 and Cherenkov scintillators 13 being mixed and stacked to form a scintillator structure 10.

[0038] The different arrangements of the scintillator crystal 11, dielectric 12 and Cherenkov scintillator 13 in the scintillator structure 10 may cause changes in the signal transmission path, but will not have a significant impact on the final acquisition of the signal. All of them can achieve a balance between time resolution and energy resolution performance.

[0039] To enable those skilled in the art to better understand this application, the signal transmission path will be described in detail below using several common scintillator structure arrangements as examples.

[0040] Regarding direction, it can be defined according to preset coordinate axes. In some specific examples, such as... Figure 2 As shown in the figure, referring to the coordinate axes, a preset direction is determined based on the coordinate axes, such as the Z-axis direction (or, the first direction). Specifically, for example, when the outer surface of the scintillator structure 10 is all planar, the direction of the plane where the scintillator structure 10 and the photoelectric converter 20 are coupled can be defined as the X-axis direction, and the Z-axis direction, which is perpendicular to the X-axis direction, can be defined as the preset direction (or, the first direction).

[0041] In a specific example, the scintillator structure 10 includes one scintillator crystal 11, one dielectric 12, and one Cherenkov scintillator 13, with the Cherenkov scintillator 13 located between the scintillator crystal 11 and the dielectric 12. For example, as... Figure 2 As shown, along the first direction, the dielectric 12, Cherenkov scintillator 13, and scintillation crystal 11 are arranged in sequence, with the scintillation crystal 11 coupled to the photoelectric converter 20. The transmission process of the incident high-energy rays is as follows: if deposited in the Cherenkov scintillator 13, the generated visible light (Cherenkov light) first passes through the Cherenkov scintillator 13 and the scintillation crystal 11, and then reaches the photoelectric converter 20; if deposited in the scintillation crystal 11, part of the generated visible light (scintillation light) passes directly to the photoelectric converter 20 through the scintillation crystal 11, and part is reflected and then passes through the scintillation crystal 11 into the photoelectric converter 20; if deposited in the dielectric 12, the generated electrical signal is read out through the signal readout path connected to it.

[0042] In a specific example, such as Figure 3 As shown, the scintillator structure 10 can also be arranged sequentially along the first direction in the order of scintillator crystal 11, Cherenkov scintillator 13, and dielectric 12, wherein the dielectric 12 is coupled to the photoelectric converter 20. The transmission process of the incident high-energy rays is as follows: if deposited in the Cherenkov scintillator 13, the generated visible light (i.e., Cherenkov light) first passes through the Cherenkov scintillator 13 and the dielectric 12, and then reaches the photoelectric converter 20; if deposited in the scintillator crystal 11, part of the generated visible light (i.e., scintillator light) directly passes through the scintillator crystal 11, Cherenkov scintillator 13, and dielectric 12 to the photoelectric converter 20, and part of it is reflected and then passes through the scintillator crystal 11, Cherenkov scintillator 13, and dielectric 12 to enter the photoelectric converter 20; if deposited in the dielectric 12, the generated electrical signal is read out through the signal readout path connected to it.

[0043] In a specific example, the scintillator structure 10 could also be a scintillator crystal 11 located between the Cherenkov scintillator 13 and the dielectric 12. For example, as... Figure 4As shown, the dielectric material 12, scintillation crystal 11, and Cherenkov scintillator 13 are arranged sequentially along the first direction, with the Cherenkov scintillator 13 coupled to the photoelectric converter 20. The transmission process of the incident high-energy rays is as follows: if deposited in the Cherenkov scintillator 13, the generated visible light (Cherenkov light) passes through the Cherenkov scintillator 13 and enters the photoelectric converter 20; if deposited in the scintillation crystal 11, part of the generated visible light (scintillation light) directly passes through the scintillation crystal 11 and Cherenkov scintillator 13 to the photoelectric converter 20, and part is reflected and then passes through the scintillation crystal 11 and Cherenkov scintillator 13 before entering the photoelectric converter 20; if deposited in the dielectric material 12, the generated electrical signal is read out through the signal readout path connected to it.

[0044] In other specific embodiments, at least one of the scintillating crystal 11, dielectric 12, and Cherenkov scintillator 13 is provided in multiples. The number of each type may be the same or not completely the same, and the positional relationship between them is not limited. One type can be located between the other two. Some examples are as follows: Figures 5-6 As shown, but not limited to; three types of staggered stacking can also be used along the first direction, some examples of which are shown below. Figures 7-8 As shown, but not limited to.

[0045] Specifically, see Figure 5 When the scintillation crystal 11” is coupled to the photoelectric converter 20, the transmission process of the incident high-energy rays is as follows: if deposited in the Cherenkov scintillator 13, the generated visible light, i.e., Cherenkov light, passes through Cherenkov scintillator 13, Cherenkov scintillator 13', dielectric 12, and scintillation crystal 11-11”, and then reaches the photoelectric converter 20; if deposited in the Cherenkov scintillator 13', the generated visible light, i.e., Cherenkov light, passes through Cherenkov scintillator 13', dielectric 12, and scintillation crystal 11-11”, and then reaches the photoelectric converter 20; if deposited in the dielectric 12, the generated electrical signal is read out through the signal readout path connected to it; if deposited in the scintillation crystal… In body 11, a portion of the generated visible light, i.e., the scintillation light, directly passes through scintillation crystal 11-11” and is directed to the photoelectric converter, while a portion is reflected and then passes through scintillation crystal 11-11” to enter the photoelectric converter. If the light is deposited in scintillation crystal 11', a portion of the generated visible light, i.e., the scintillation light, directly passes through scintillation crystal 11'-11” and is directed to the photoelectric converter 20, while a portion is reflected and then passes through scintillation crystal 11'-11” to enter the photoelectric converter 20. If the light is deposited in scintillation crystal 11”, a portion of the generated visible light, i.e., the scintillation light, directly passes through scintillation crystal 11” and is directed to the photoelectric converter 20, while a portion is reflected and then passes through scintillation crystal 11” to enter the photoelectric converter 20.

[0046] See Figure 6When dielectric 12' is coupled to photoelectric converter 20, the transmission process of the incident high-energy rays is as follows: if deposited in Cherenkov scintillator 13, the generated visible light, i.e., Cherenkov light, passes through Cherenkov scintillator 13, Cherenkov scintillator 13', scintillator crystal 11-11', dielectric 12-12', and then reaches photoelectric converter 20; if deposited in Cherenkov scintillator 13', the generated visible light, i.e., Cherenkov light, passes through Cherenkov scintillator 13', scintillator crystal 11-11', dielectric 12-12', and then reaches photoelectric converter 20; if deposited in scintillator crystal 11, a portion of the generated visible light... Visible light, i.e., scintillation light, passes directly through scintillation crystals 11-11' and dielectrics 12-12' to the photoelectric converter 20. A portion of the light is reflected and then passes through scintillation crystals 11-11' and dielectrics 12-12' to enter the photoelectric converter 20. If the light is deposited in scintillation crystal 11', a portion of the generated visible light, i.e., scintillation light, passes directly through scintillation crystals 11' and dielectrics 12-12' to the photoelectric converter 20, while a portion is reflected and then passes through scintillation crystals 11' and dielectrics 12-12' to enter the photoelectric converter 20. If the light is deposited in dielectrics 12 or 12', the generated electrical signal is read out through the signal readout path connected to it.

[0047] See Figure 7 When the scintillation crystal 11' is coupled to the photoelectric converter 20, the transmission process of the incident high-energy rays is as follows: If deposited in the Cherenkov scintillator 13, the generated visible light, i.e., Cherenkov light, passes through the Cherenkov scintillator 13, dielectric 12, scintillation crystal 11, Cherenkov scintillator 13', dielectric 12', and scintillation crystal 11', and then reaches the photoelectric converter 20; if deposited in the dielectric 12 or 12', the generated electrical signal is read out through the signal readout path connected to it; if deposited in the scintillation crystal 11, a portion of the generated visible light passes through the scintillation crystal 11, Cherenkov scintillator 13', and dielectric 11', and then reaches the photoelectric converter 20. 12' and scintillation crystal 11' are directed toward the photoelectric converter. A portion of the light is reflected and then passes through scintillation crystal 11, Cherenkov scintillator 13', dielectric 12', and scintillation crystal 11' before entering the photoelectric converter. If the light is deposited in Cherenkov scintillator 13', the generated visible light, i.e., Cherenkov light, passes through Cherenkov scintillator 13', dielectric 12', and scintillation crystal 11' before entering the photoelectric converter 20. If the light is deposited in scintillation crystal 11', a portion of the generated visible light, i.e., scintillation light, passes directly through scintillation crystal 11' before entering the photoelectric converter 20, while a portion is reflected and passes through scintillation crystal 11' before entering the photoelectric converter 20.

[0048] See Figure 8When the scintillation crystal 11' is coupled to the photoelectric converter 20, the transmission process of the incident high-energy rays is as follows: if deposited in dielectric 12, 12', or 12"', the generated electrical signal is read out through the signal readout path connected to it; if deposited in scintillation crystal 11, a portion of the generated visible light passes through scintillation crystal 11, Cherenkov scintillator 13, dielectric 12"', and scintillation crystal 11' and is directed to the photoelectric converter 20, and a portion is reflected and then passes through scintillation crystal 11, Cherenkov scintillator 13, dielectric 12"', and scintillation crystal 11' and enters the photoelectric converter 20; if deposited in Cherenkov scintillator 13, the generated visible light, i.e., Cherenkov light, passes through Cherenkov scintillator 13, dielectric 12"', and scintillation crystal 11' and is directed to the photoelectric converter 20; if deposited in scintillation crystal 11', a portion of the generated visible light, i.e., scintillation light, directly passes through scintillation crystal 11' and is directed to the photoelectric converter 20, and a portion is reflected and then passes through scintillation crystal 11' and enters the photoelectric converter 20.

[0049] As further exemplified, continue to refer to Figure 2 In the example shown, the thicknesses of dielectric 12, Cherenkov scintillator 13, and scintillator crystal 11 are d_1, d_2, and d_3, respectively. Assuming N high-energy rays are deposited in the scintillator structure 10, and the probability of high-energy ray deposition in the three scintillators is proportional to the thickness, then the number of particles deposited in dielectric 12, Cherenkov scintillator 13, and scintillator crystal 11 are respectively: , ,

[0050] The high-energy rays deposited in dielectric 12 and Cherenkov scintillator 13 have high time resolution, and the high-energy rays deposited in scintillator crystal 11 have high energy resolution.

[0051] Furthermore, regarding the scintillation crystal 11, dielectric 12, and Cherenkov scintillator 13, according to preset rules, in some embodiments of this application, the scintillation crystal 11, dielectric 12, and Cherenkov scintillator 13 are stacked in the second direction.

[0052] Regarding the "second direction," in some embodiments, similar to the "first direction," the second direction can be determined based on coordinate axes. In some specific examples, such as... Figure 2 As shown in the figure, referring to the coordinate axes, the second direction is determined based on the coordinate axes, for example, the X-axis direction. Specifically, for example, when the outer surface of the scintillator structure 10 is all planar, the direction of the coupling contact plane between the scintillator structure 10 and the photoelectric converter 20 can be defined as the X-axis direction, and the X-axis direction can be defined as the second direction.

[0053] It should be noted that the scintillator structure 10 can have different alternative implementations regarding the stacking of the scintillator crystal 11, dielectric 12, and Cherenkov scintillator 13 in the second direction.

[0054] In some specific embodiments, the scintillator structure 10 includes one scintillator crystal 11, one dielectric 12, and one Cherenkov scintillator 13, and the positional relationship between them is not limited. One of them can be located between the other two, as shown in the example below. Figures 9-11 As shown.

[0055] In a specific example, the scintillator structure 10 may be a scintillator crystal 11 located between the Cherenkov scintillator 13 and the dielectric 12. For example, as... Figure 9 As shown, the Cherenkov scintillator 13, scintillator crystal 11, and dielectric 12 are arranged sequentially along the second direction, wherein the Cherenkov scintillator 13, scintillator crystal 11, and dielectric 12 are all coupled to the photoelectric converter 20. The transmission process of the incident high-energy rays is as follows: if deposited in the Cherenkov scintillator 13, the generated visible light (i.e., Cherenkov light) reaches the photoelectric converter 20 through the Cherenkov scintillator 13; if deposited in the scintillator crystal 11, part of the generated visible light (i.e., scintillator light) directly hits the photoelectric converter 20, and part is reflected and then passes through the scintillator crystal 11 into the photoelectric converter 20; if deposited in the dielectric 12, the generated electrical signal is read out through the signal readout path connected to it.

[0056] exist Figure 9 In supplementary examples to the example shown, such as Figure 10 As shown, the scintillator structure 10 can also be arranged sequentially along the second direction in the order of dielectric 12, scintillator crystal 11, and Cherenkov scintillator 13, wherein dielectric 12, scintillator crystal 11, and Cherenkov scintillator 13 are all coupled to the photoelectric converter. The transmission process of the incident high-energy rays can be referred to... Figure 9 Examples are provided, but will not be elaborated upon here.

[0057] In a specific example, the scintillator structure 10 could also be a Cherenkov scintillator 13 located between the scintillator crystal 11 and the dielectric 12. For example, as... Figure 11 As shown, the components are arranged sequentially along the second direction in the order of scintillation crystal 11, Cherenkov scintillator 13, and dielectric 12, wherein the scintillation crystal 11, Cherenkov scintillator 13, and dielectric 12 are all coupled to the photoelectric converter 20. The transmission process of the incident high-energy rays can be referred to in the other examples described above, and will not be repeated here.

[0058] In other specific embodiments, at least one of the scintillating crystal 11, dielectric 12, and Cherenkov scintillator 13 is provided in multiple configurations, and their relative positions are not limited. One of them can be located between the other two. Some examples are as follows: Figures 12-14 As shown, but not limited to; three types of alternating stacking can also be used along the second direction, some examples are shown below. Figures 15-17 As shown, but not limited to. Among them, Figures 12-17 The transmission process of high-energy rays incident in the middle can be referred to the other examples mentioned above, and will not be repeated here.

[0059] Furthermore, in some embodiments of this application, the scintillation crystal 11 is at least partially stacked with the dielectric 12 and / or the Cherenkov scintillator 13 in a first direction and at least partially stacked in a second direction different from the first direction. The first and second directions are determined based on preset coordinate axes, as detailed above, and will not be repeated here.

[0060] See Figure 18 When the scintillation crystal 11 is coupled to the photoelectric converter, the transmission process of the incident high-energy rays is as follows: if deposited in the Cherenkov scintillator 13, the generated visible light, i.e., Cherenkov light, passes through the Cherenkov scintillator 13 and the scintillation crystal 11 to reach the photoelectric converter 20; if deposited in the dielectric 12, the generated electrical signal is read out through the signal readout path connected to it; if deposited in the scintillation crystal 11, part of the generated visible light, i.e., the scintillation light, passes directly through the scintillation crystal 11 to the photoelectric converter 20, and part of it is reflected and then passes through the scintillation crystal 11 to enter the photoelectric converter 20.

[0061] See Figure 19When the Cherenkov scintillator 13 is coupled to the photoelectric converter 20, the transmission process of the incident high-energy rays is as follows: if deposited in the Cherenkov scintillator 13, the generated visible light, i.e., Cherenkov light, reaches the photoelectric converter 20 after passing through the Cherenkov scintillator 13; if deposited in the Cherenkov scintillator 13', the generated visible light, i.e., Cherenkov light, reaches the photoelectric converter 20 after passing through the Cherenkov scintillator 13' and 13'; if deposited in the scintillator crystal 11, a portion of the generated visible light, i.e., scintillator light, is directly split into three paths and enters the Cherenkov scintillator 13', dielectric 12, and scintillator crystal 11' respectively, before reaching the Cherenkov scintillator. The light is emitted from the scintillator 13 and then directed towards the photoelectric converter 20. After reflection, a portion of the light is split into three paths, entering the Cherenkov scintillator 13', the dielectric 12, and the scintillator crystal 11' respectively, before reaching the Cherenkov scintillator 13 and then entering the photoelectric converter 20. If the light is deposited in the scintillator crystal 11', a portion of the generated visible light, i.e., the scintillator light, passes directly through the scintillator crystal 11' and the Cherenkov scintillator 13 to the photoelectric converter 20, while another portion is reflected and passes through the scintillator crystal 11' and the Cherenkov scintillator 13 before entering the photoelectric converter 20. If the light is deposited in the dielectric 12, the generated electrical signal is read out through the signal readout path connected to it.

[0062] See Figure 20 When dielectric materials 12-12' are simultaneously coupled to photoelectric converter 20, the transmission process of the incident high-energy rays is as follows: if deposited in dielectric material 12-12", the generated electrical signal is read out through the signal readout path connected to it; if deposited in Cherenkov scintillator 13, the generated visible light, i.e., Cherenkov light, passes through Cherenkov scintillator 13 and dielectric material 12 to reach photoelectric converter 20; if deposited in scintillator crystal 11, part of the generated visible light, i.e., scintillator light, directly passes through scintillator crystal 11 and dielectric material 12 to reach photoelectric converter 20, and part of it is reflected and then passes through scintillator crystal 11 and dielectric material 12 to enter photoelectric converter 20; if deposited in scintillator crystal 11', part of the generated visible light, i.e., scintillator light, directly passes through scintillator crystal 11' and dielectric material 12' to reach photoelectric converter 20, and part of it is reflected and then passes through scintillator crystal 11' and dielectric material 12' to enter photoelectric converter 20.

[0063] See Figure 21When scintillation crystal 11 and Cherenkov scintillator 13” are simultaneously coupled to photoelectric converter 20, the transmission process of the incident high-energy rays is as follows: If deposited in dielectric 12-12”, the generated electrical signal is read out through the signal readout path connected to it; if deposited in Cherenkov scintillator 13, the generated visible light, i.e., Cherenkov light, passes through Cherenkov scintillator 13 and scintillation crystal 11 to reach photoelectric converter 20; if deposited in Cherenkov scintillator 13', the generated visible light, i.e., Cherenkov light, passes through Cherenkov scintillator 13'-13” to reach photoelectric converter 20; if deposited in Cherenkov scintillator 13”, the generated visible light, i.e., Cherenkov light, passes through Cherenkov scintillator 13” to reach photoelectric converter 20; if deposited in scintillation crystal 11, a portion of the generated visible light, i.e., scintillation light, directly passes through scintillation crystal 11 to photoelectric converter 20. 0. A portion of the light is reflected and then enters the photoelectric converter 20 through the scintillation crystal 11. If the light is deposited in the scintillation crystal 11', then a portion of the generated visible light, i.e., the scintillation light, directly passes through the scintillation crystal 11'-11", dielectric 12'-12", and Cherenkov scintillator 13'-13" and enters the photoelectric converter 20. Another portion is reflected and then enters the photoelectric converter 20 through the scintillation crystal 11'-11", dielectric 12'-12", and Cherenkov scintillator 13'-13". If the light is deposited in the scintillation crystal 11", then a portion of the generated visible light, i.e., the scintillation light, directly passes through the scintillation crystal 11", dielectric 12'-12", and Cherenkov scintillator 13'-13" and enters the photoelectric converter 20 through the scintillation crystal 11", dielectric 12'-12", and Cherenkov scintillator 13'-13".

[0064] See Figure 22When the scintillation crystal 11 is coupled to the photoelectric converter 20, the transmission process of the incident high-energy rays is as follows: If deposited in the Cherenkov scintillator 13, the generated visible light, i.e., Cherenkov light, passes through the Cherenkov scintillator 13 and the scintillation crystal 11 to reach the photoelectric converter 20; if deposited in the scintillation crystal 11, part of the generated visible light, i.e., the scintillation light, directly passes through the scintillation crystal 11 to the photoelectric converter 20, and part of it is reflected and then passes through the scintillation crystal 11 to enter the photoelectric converter 20; if deposited in the scintillation crystal 11', part of the generated visible light, i.e., the scintillation light, directly passes through the scintillation crystal 11' to the photoelectric converter 20. The light emitted from 1' and 11 is directed towards the photoelectric converter. A portion of the light is reflected and then passes through scintillation crystals 11' and 11 before entering the photoelectric converter 20. If the light is deposited in scintillation crystal 11", the generated visible light, i.e., the scintillation light, is directly split into two paths, entering scintillation crystal 11' and dielectric 12 respectively, and then reaching scintillation crystal 11. The light then travels towards the photoelectric converter 20. A portion of the light is reflected and then split into two paths, entering scintillation crystal 11' and dielectric 12 respectively, and then reaching scintillation crystal 11 before entering the photoelectric converter 20. If the light is deposited in dielectric 12, the generated electrical signal is read out through the signal readout path connected to it.

[0065] It should be noted that in other examples not shown in this application, the specific structure of the scintillator structure 10 and the transmission process of the incident high-energy rays can refer to the ideas in the above examples.

[0066] In the extended example, a light-transmitting adhesive is provided between the scintillator 11 and the Cherenkov scintillator 13, the scintillator 11 and the dielectric 12, and the Cherenkov scintillator 13 and the dielectric 12. Specifically, the light-transmitting adhesive includes, but is not limited to, at least one of polyurethane, polystyrene, polyacrylate, ethylene-vinyl acetate copolymer, and photocurable resin. The light-transmitting adhesive can fix the scintillator 11, the Cherenkov scintillator 13, and the dielectric 12 together to form the scintillator structure 10. To ensure the light transmittance of the adhesive and not affect light transmission, the thickness of the adhesive is typically 0.1-0.5 mm.

[0067] For example, the shapes of the scintillating crystal 11, dielectric 12, Cherenkov scintillator 13, and scintillator structure 10 can all be cuboids / cubes, or triangular prisms, pentagonal prisms, hexagonal prisms, cylinders, spheres / ellipsoids, irregular bodies, etc.

[0068] In some embodiments, array 01 may consist of detection units with the same structure.

[0069] In some alternative embodiments, array 01 may also consist of detection units with different structures.

[0070] It should be noted that although the structures of the various detection units in the array included in the embodiments of this application may be the same or different, each detection unit includes the scintillator structure 10 provided in the above example, so as to combine the scintillator crystal 11, the dielectric 12, and the Cherenkov scintillator 13. During detection, a portion of the incident high-energy rays are deposited in the scintillator crystal 11, and another portion is deposited in the dielectric 12 or the Cherenkov scintillator 13, or in both the dielectric 12 and the Cherenkov scintillator 13. The high-energy rays deposited in the scintillator crystal 11 can provide higher energy resolution for imaging, while the high-energy rays deposited in the dielectric 12 and the Cherenkov scintillator 13 can provide higher temporal resolution for imaging. The combination of the two constitutes heterogeneous detection data, which can provide a certain proportion of high energy resolution and high temporal resolution data, thereby providing higher image quality in imaging applications.

[0071] The detector provided in this application can be applied to fields such as positron emission tomography, single-photon emission tomography, petroleum neutron logging, high-energy physics or space physics detection.

[0072] Taking positron emission tomography (PET) as an example, the dielectric 12 in the detector is connected to the data processing system in the server via a transmission line, and the scintillation crystal 11 and Cherenkov scintillator 13 are coupled to the photoelectric converter. The detector converts high-energy rays into electrical signals, and the data processing system processes the electrical signals to accurately extract the position, energy, and time information of the original signal in a digital manner. The digitized information is then sent to the back-end server, where the original waveform is restored by fitting, key information is extracted, and conformance processing is performed for image reconstruction.

[0073] In positron emission tomography (PET) scenarios, the scintillation pulses output from the photoelectric converter are ultimately digitized by a multi-voltage threshold sampling method to convert the analog electrical signal into digital samples. The sampled data is then sent to a server for image reconstruction. Before sampling, multiple voltage thresholds need to be preset using a digital-to-analog converter (DAC). By recording the time information of the scintillation pulse signal crossing these voltage thresholds, a series of "time-voltage" pairs are obtained. Then, combined with prior information about the scintillation pulses, the original information of the pulses is restored by fitting.

[0074] Corresponding to the aforementioned detector, this application also provides a method for detecting high-energy rays. For example... Figure 23 As shown, the detection method generally includes the following process: S110: Read out the electrical signal of the change in dielectric constant caused by the interaction of high-energy rays with a dielectric material using one of the following methods: lumped circuit method, transmission line method, resonance method, streak camera method, or free space wave method. S120: The high-energy rays and the Cherenkov light and scintillator light signals generated by the Cherenkov scintillator and scintillator crystal respectively are read out in the form of electrical signals by the photoelectric converter; S130: Converts electrical signals into digital signals via an analog-to-digital converter; S140: The arrival time of high-energy rays is obtained by rise time discrimination (LED) or constant ratio time discrimination (CFD) methods; S150: The energy of high-energy rays is obtained through one or more of the following methods: numerical integration, fitted integration, peak sampling, or pulse width extraction.

[0075] The above detection method allows for the simultaneous reading of dielectric signals, Cherenkov scintillator signals, and visible light signals from scintillating crystals within the same detection unit.

[0076] It should be noted that when the dielectric signal is read out using the transmission line method, the dielectric 12 is connected to the data processing system through the transmission line.

[0077] The arrival time of high-energy rays is obtained through rise time discrimination or constant ratio time discrimination. Specifically, rise time discrimination refers to setting the trigger voltage through a power supply and a digital-to-analog converter, issuing a trigger signal when the signal reaches the trigger voltage through a comparator, and measuring the trigger time, which is the arrival time, through a time-to-digital converter. Constant ratio time discrimination refers to splitting the signal into two, delaying and amplifying one of them, and then using it as a trigger source to trigger the other signal with a comparator, and reading the trigger time through a time-to-digital converter.

[0078] The energy of high-energy rays can be obtained through one or more of the following methods: numerical integration, fitted integration, peak sampling, or pulse width extraction. Specifically, numerical integration refers to digitizing the signal using an analog-to-digital converter and accumulating the voltage at each sampling point; fitted integration refers to fitting the signal to a function model, such as a double exponential model, to obtain an expression, and then integrating it; peak sampling refers to extracting the pulse peak using peak hold and sampling circuits and using it as energy; pulse width extraction refers to extracting the time interval between the signal's upward and downward trigger thresholds using devices such as comparators and time-to-digital converters and using it as energy.

[0079] The lumped-circuit method is a technique that fills a capacitor with lossy material in the low-frequency range and uses the capacitor's parameters and the measured admittance to deduce the dielectric constant. To measure the admittance, a parallel resonant circuit is typically used to measure the Q value (quality factor) and frequency, from which the dielectric constant is derived. Because its maximum frequency is limited by the minimum inductance, the highest frequency using this method is generally 100MHz, and the minimum inductance is typically around 10nHz.

[0080] The transmission line method is a type of network method that places the dielectric material in an appropriate position within the test system as a single-port or two-port network. In the two-port case, the electromagnetic parameters of the microwave are obtained by measuring the S-parameters of the network. Simultaneously, the phase and amplitude of the transmission coefficient or reflection coefficient are measured. By changing the sample length or the measurement frequency, the amplitude response is measured, and a system of simultaneous equations can be used to determine the relative permittivity.

[0081] The free space method can also be considered a transmission line method. Its principle is similar to that of the line transmission method. By measuring the transmission and reflection coefficients, the sample data and frequency are changed to obtain the value of the dielectric constant.

[0082] The detection method provided in this application combines a scintillation crystal, a dielectric material, and a Cherenkov scintillator. During detection, a portion of the incident high-energy rays are deposited in the scintillation crystal, while the remaining portion is deposited in the dielectric material and the Cherenkov scintillator. The high-energy rays deposited in the scintillation crystal provide high energy resolution for imaging, while the high-energy rays deposited in the dielectric material and the Cherenkov scintillator provide high temporal resolution. The combined high-energy and high-temporal resolution data provides a certain proportion of high-energy and high-temporal resolution data, thus offering higher image quality in imaging applications.

[0083] In subsequent image reconstruction, a rough image can be obtained first using high energy resolution data. This prior information can then be used to perform scattering and attenuation correction on high temporal resolution data. High temporal resolution data can be used to refine the image, improve image quality, and enhance imaging signal-to-noise ratio and spatial resolution.

[0084] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0085] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. Furthermore, any changes or modifications made by those skilled in the art based on the ideas of this application, and on the specific implementation methods and application scope of this application, are all within the scope of protection of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A high-energy ray detector, characterized in that, The high-energy ray detector includes an array of detection units, each of which includes a scintillator structure, a photoelectric converter, and a signal readout path. The scintillator structure includes at least one scintillator crystal, at least one dielectric, and at least one Cherenkov scintillator; the scintillator crystal, the dielectric, and the Cherenkov scintillator are stacked along a predetermined direction, which is parallel or perpendicular to the thickness direction of the scintillator crystal; or, the scintillator crystal, the dielectric, and the Cherenkov scintillator are at least partially stacked in a first direction and at least partially stacked in a second direction perpendicular to the first direction, which is parallel or perpendicular to the thickness direction of the scintillator crystal. Wherein, at least one of the scintillation crystals is coupled to the photoelectric converter, or, at least one combination of the scintillation crystal and the Cherenkov scintillator is coupled to the photoelectric converter; All of the dielectrics are connected to the signal readout path.

2. The high-energy ray detector according to claim 1, characterized in that, When the number of any one of the scintillating crystals, dielectrics, or Cherenkov scintillators exceeds one, they are arranged in a manner that either stacks the same type sequentially or stacks different types alternately.

3. The high-energy ray detector according to claim 1, characterized in that, The photoelectric converter is a superconducting nanowire single-photon detector.

4. The high-energy ray detector according to claim 1, characterized in that, An optical coupling agent is provided between the scintillator structure and the photoelectric converter, and the difference between the refractive index of the optical coupling agent and the refractive index of the scintillator crystal or the Cherenkov scintillator is less than a preset value.

5. The high-energy ray detector according to claim 4, characterized in that, The preset value approaches zero.

6. The high-energy ray detector according to claim 1, characterized in that, The outer surface of the scintillator structure is provided with a reflective layer.

7. The high-energy ray detector according to claim 1, characterized in that, A light-transmitting adhesive is provided between the scintillation crystal and the Cherenkov scintillator, between the scintillation crystal and the dielectric, and between the Cherenkov scintillator and the dielectric, wherein the thickness of the light-transmitting adhesive is 0.1-0.5 mm.

8. The high-energy ray detector according to claim 1, characterized in that, The detector is used in positron emission tomography, single-photon emission tomography, petroleum neutron logging, high-energy physics or space physics detection.

9. The detection method of the high-energy ray detector according to any one of claims 1-8, characterized in that, The detection method includes: The electrical signal that reads out the change in dielectric constant caused by the interaction between high-energy rays and dielectric materials is obtained by one of the following methods: lumped circuit method, transmission line method, resonance method, streak camera or free space wave method. The high-energy rays and the Cherenkov light and scintillator light signals generated by the Cherenkov scintillator and scintillator crystal, respectively, are read out in the form of electrical signals by the photoelectric converter. Electrical signals are converted into digital signals using an analog-to-digital converter; The arrival time of high-energy rays can be obtained by rise time discrimination or constant ratio time discrimination; The energy of high-energy rays is obtained by one or more of the following methods: numerical integration, fitted integration, peak sampling, or pulse width extraction.

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