A component gap detection and adjustment system for rapid heat treatment equipment

Abstract

This invention discloses a part gap detection and adjustment system for a rapid thermal processing equipment, comprising: a magnetic levitation drive unit, a magnetic levitation rotor, a sensing unit, and a control unit. The wafer to be processed is placed on the magnetic levitation rotor, which is suspended within the process cavity based on the magnetic field generated by the magnetic levitation drive unit. The sensing unit includes several first sensors for measuring the distance between the magnetic levitation rotor and the sidewall of the process cavity, and several second sensors for measuring the distance between the magnetic levitation rotor and the bottom plate of the process cavity. The sensing unit and the process cavity are separately configured. The control unit controls the magnetic levitation drive unit based on the measurement results from the sensing unit to adjust the position of the magnetic levitation rotor. This part gap detection and adjustment system solves the problem of measurement deviation caused by sensor positional deviation due to cavity vibration by separating the sensing unit from the process cavity.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor rapid thermal processing equipment, and particularly relates to a component gap detection and adjustment system for rapid thermal processing equipment. Background Technology

[0002] Rapid thermal processing (RTP) reduces the thermal budget by rapidly heating up the wafer to shorten the time it spends in the thermal field. RTP technology was initially developed for annealing after ion implantation, but due to its very fast heating and cooling rates, shorter process time, and smaller cavity volume, it has been widely used in advanced semiconductor manufacturing processes and has become the mainstream technology for deep submicron semiconductor wafer thermal processing. Its advantages are even more obvious when used in ultra-shallow junction advanced devices and large-size wafer processes. Key applications of RTP technology include rapid annealing, oxidation processes, ultra-shallow junction (USJ) formation, and silicide reaction.

[0003] To improve the uniformity and consistency of temperature and atmosphere during the wafer reaction process, the wafer needs to be kept rotating. However, existing wafer stages are prone to disturbances and vertical vibrations during rotation, which can lead to inaccurate wafer positioning and negatively impact the uniformity and consistency of the process across the wafer.

[0004] In particular, during maintenance of the equipment chamber in semiconductor RTP processes, after replacing the magnetic levitation rotor components, horizontal adjustment is performed. If a magnetic field operates within the chamber, the magnetic levitation rotor components will float in the air. Horizontal / vertical adjustment is then performed, using sensors to detect the interval between chamber changes and component replacements.

[0005] After the adjustment process is completed, wafers frequently break during normal equipment operation. This is because the screws securing the sensors loosen due to minor vibrations in the equipment, causing errors in horizontal / vertical alignment and ranging. This results in vibrations during the rotation of the magnetic levitation rotor, ultimately leading to wafer breakage. Therefore, a technology is urgently needed to mitigate the distortion of sensor measurements caused by minor vibrations within the chamber. Summary of the Invention

[0006] The purpose of this invention is to overcome the defects of the prior art and provide a part gap detection and adjustment system for rapid heat treatment equipment. This part gap detection and adjustment system solves the problem of vibration caused by the vibration of the cavity causing the position deviation of the sensor connected to it to cause measurement deviation and thus causing vibration during the rotation of the magnetic levitation rotor by separating the sensing unit from the process cavity.

[0007] The objective of this invention is achieved through the following technical solution:

[0008] A component gap detection and adjustment system for a rapid thermal processing equipment, the component gap detection and adjustment system comprising: a magnetic levitation drive unit, a magnetic levitation rotor, a sensing unit and a control unit, wherein the wafer to be processed is placed on the magnetic levitation rotor;

[0009] The magnetic levitation drive unit is embedded in the bottom plate of the process cavity, and the magnetic levitation rotor is suspended in the process cavity based on the magnetic field generated by the magnetic levitation drive unit.

[0010] The sensing unit includes several first sensors for measuring the distance between the magnetic levitation rotor and the side wall of the process cavity, and several second sensors for measuring the distance between the magnetic levitation rotor and the bottom plate of the process cavity; and the sensing unit and the process cavity are separately configured.

[0011] The control unit controls the magnetic levitation drive unit based on the measurement results of the sensing unit to complete the position adjustment of the magnetic levitation rotor.

[0012] According to a preferred embodiment, each first sensor is disposed in a reserved hole on the side wall of the process chamber; each second sensor is disposed in a reserved hole on the bottom plate of the process chamber.

[0013] According to a preferred embodiment, each of the first and second sensors is separate from the wall of the process cavity and is not connected, and is fixed to the external support via a connector.

[0014] According to a preferred embodiment, each of the first and second sensors is an ultrasonic ranging sensor.

[0015] According to a preferred embodiment, the control unit includes a main control box, which contains an adjustment circuit board. The adjustment circuit board has a control knob, and the user adjusts the horizontal and vertical positions of the magnetic levitation rotor based on the control knob.

[0016] According to a preferred embodiment, the sensing unit transmits measurement data to the control unit via an optical fiber.

[0017] The aforementioned main solution of the present invention and its various further alternative solutions can be freely combined to form multiple solutions, all of which are solutions that can be adopted and are claimed by the present invention. Those skilled in the art, after understanding the solution of the present invention, will realize, based on existing technology and common knowledge, that there are many combinations, all of which are technical solutions to be protected by the present invention; therefore, no exhaustive list is provided here.

[0018] The beneficial effects of the present invention: The part gap detection and adjustment system of the present invention solves the problem of measurement result deviation caused by the position deviation of the sensor connected to it due to the vibration of the cavity, which leads to the vibration of the magnetic levitation rotor during rotation by separating the sensing unit from the process cavity. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the component gap detection and adjustment system for rapid heat treatment equipment according to the present invention;

[0020] Among them, 201-process cavity, 202-magnetic levitation drive unit, 202a-magnetic field, 203-magnetic levitation rotor, 204-wafer, 205-first sensor, 206-second sensor. Detailed Implementation

[0021] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. It should be noted that, in order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments.

[0022] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship of the product in use, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. In addition, the terms "horizontal," "vertical," and "suspended," etc., do not indicate that the component is required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0023] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0024] Example 1:

[0025] refer to Figure 1 As shown, the present invention discloses a component gap detection and adjustment system for a rapid heat treatment equipment. The component gap detection and adjustment system includes: a magnetic levitation drive unit, a magnetic levitation rotor, a sensing unit, and a control unit, with the wafer to be processed placed on the magnetic levitation rotor.

[0026] The magnetic levitation drive unit is embedded in the bottom plate of the process cavity, and the magnetic levitation rotor is suspended within the process cavity based on the magnetic field generated by the magnetic levitation drive unit. Specifically, the magnetic levitation drive unit generates magnetic force in the magnetic induction coil by controlling the current, thereby driving the magnetic levitation rotor to complete position adjustment.

[0027] Preferably, the sensing unit includes several first sensors for measuring the distance between the magnetic levitation rotor and the sidewall of the process cavity, and several second sensors for measuring the distance between the magnetic levitation rotor and the bottom plate of the process cavity. Each of the first and second sensors can be an ultrasonic ranging sensor.

[0028] Furthermore, the sensing unit and the process cavity are separately configured. That is, the sensing unit and the process cavity are not in contact or connected. The sensing unit transmits measurement data to the control unit via optical fiber.

[0029] Furthermore, each of the first sensors is disposed in a reserved hole on the side wall of the process chamber; each of the second sensors is disposed in a reserved hole on the bottom plate of the process chamber.

[0030] For example, each of the first and second sensors is separate from the wall of the process cavity and not connected, and is fixed to the external support body via a connector.

[0031] Preferably, the control unit controls the magnetic levitation drive unit based on the measurement results of the sensing unit to complete the position adjustment of the magnetic levitation rotor.

[0032] Furthermore, the control unit includes a main control box, which contains an adjustment circuit board. The adjustment circuit board has a control knob, which the user uses to adjust the horizontal and vertical positions of the magnetic levitation rotor.

[0033] The part gap detection and adjustment system of the present invention solves the problem of measurement deviation caused by the positional deviation of the sensor connected to it due to cavity vibration, which leads to the vibration of the magnetic levitation rotor during rotation by separating the sensing unit from the process cavity.

[0034] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A part gap detection adjustment system for a rapid thermal processing apparatus, characterized by, The component gap detection and adjustment system includes: a magnetic levitation drive unit (202), a magnetic levitation rotor (203), a sensing unit and a control unit, with the wafer to be processed (204) placed on the magnetic levitation rotor (203); The magnetic levitation drive unit (202) is embedded in the cavity bottom plate of the process cavity (201), and the magnetic levitation rotor (203) is suspended in the process cavity (201) based on the magnetic field (202a) generated by the magnetic levitation drive unit (202). The sensing unit includes several first sensors (205) for measuring the distance between the magnetic levitation rotor (203) and the side wall of the process cavity (201), and several second sensors (206) for measuring the distance between the magnetic levitation rotor (203) and the bottom plate of the process cavity (201); and the sensing unit and the process cavity (201) are separately configured. The control unit controls the magnetic levitation drive unit (202) based on the measurement results of the sensing unit to complete the position adjustment of the magnetic levitation rotor (203).

2. The part gap detection and adjustment system as described in claim 1, characterized in that, Each first sensor (205) is disposed in a reserved hole on the side wall of the process chamber (201); each second sensor (206) is disposed in a reserved hole on the bottom plate of the process chamber (201).

3. The part gap detection and adjustment system as described in claim 2, characterized in that, Each of the first sensors (205) and the second sensors (206) is separate from the wall of the process cavity (201) and is not connected, and is fixed to the external support body by a connector.

4. The part gap detection and adjustment system as described in claim 3, characterized in that, Each of the first sensor (205) and the second sensor (206) is an ultrasonic ranging sensor.

5. The part gap detection and adjustment system as described in claim 1, characterized in that, The control unit includes a main control box, which contains an adjustment circuit board. The adjustment circuit board has a control knob, and the user can adjust the horizontal and vertical positions of the magnetic levitation rotor (203) based on the control knob.

6. The part gap detection and adjustment system as described in claim 5, characterized in that, The sensing unit transmits measurement data to the control unit via optical fiber.

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