Atomizing coil, its manufacturing method, and atomizing equipment

Abstract

This application discloses a method for manufacturing an atomizer core, an atomizer core, and an atomizing device. The manufacturing method includes: providing a substrate, the substrate including a first surface and a second surface facing away from each other, the substrate having a plurality of base units, each base unit having an array of perforations penetrating the first and second surfaces; forming a resistive layer on the entire first surface, the resistive layer having conductive portions corresponding one-to-one with the base units; the atomizing surface facing a structural member and forming a first airflow channel with the structural member, the central axis of the first airflow channel being parallel to the entire atomizing surface so that gas passing through the first airflow channel sweeps parallel across the entire atomizing surface. Thus, by first forming the resistive layer on the entire first surface of the substrate, and then processing the conductive portions of the resistive layer, such that the conductive portions form a first region that at least partially overlaps with the perforation array, compared to first forming a single base unit and then setting the conductive layer on the single base unit, the method is more efficient and can save on the production cost of the atomizer core.

Description

Technical Field

[0001] This application relates to the field of atomizing device technology, and more specifically, to an atomizing core, its manufacturing method, and an atomizing device. Background Technology

[0002] Currently, electronic atomizing devices are becoming increasingly widely used. These devices heat an oil solution using an atomizing core, causing the oil to vaporize and form smoke. In related technologies, the atomizing core includes a substrate and a resistive layer formed on the substrate as a heating film. In mass production, the resistive layer is formed on the substrate using a masking process. This process requires a mask, making it complex and demanding in terms of precision, which is detrimental to reducing the production cost of the atomizing core. Summary of the Invention

[0003] This application provides a method for manufacturing an atomizing core, an atomizing core, and an atomizing device.

[0004] The method for manufacturing the atomizing core according to the embodiments of this application includes:

[0005] A substrate is provided, the substrate including a first surface and a second surface opposite to each other, the substrate having a plurality of base units, each base unit having an array of through holes penetrating the first surface and the second surface;

[0006] A resistive layer is formed on the entire first surface, the resistive layer having conductive portions that correspond one-to-one with the substrate units;

[0007] The conductive portion on the substrate unit is processed to form a first region and a second region insulated from the first region, the first region at least partially overlapping the perforated array.

[0008] In the manufacturing method of this application, a resistive layer is first formed on the entire first surface of the substrate, and then the conductive portion of the resistive layer is processed so that the conductive portion forms a first region that at least partially overlaps with the perforated array. Compared with the method of first forming a single substrate unit and then setting a conductive layer on the single substrate unit, the manufacturing method of this application is more efficient and can save the production cost of the atomizing core.

[0009] In some embodiments, processing the conductive portion on the substrate unit to form a first region and a second region insulated from the first region includes:

[0010] Plan a processing path on the conductive part;

[0011] Material is removed from the conductive portion according to the processing path to form a first insulating groove, the first insulating groove dividing the conductive portion into a first region and a second region, the first insulating groove passing through the perforated array.

[0012] In some embodiments, removing material from the conductive portion along the processing path to form a first insulating groove includes:

[0013] Material of the conductive portion is removed according to the processing path to form a first groove and a second groove, the first groove and the second groove are spaced apart and both pass through the perforation array, the first region is formed between the first groove and the second groove, and the first insulating groove includes the first groove and the second groove.

[0014] In some embodiments, the method further includes: arranging electrodes on the first region.

[0015] In some embodiments, the first region includes a heating region and a grounding region connected to the heating region, the grounding region being located outside the perforated array, and the heating region at least partially overlapping the perforated array;

[0016] Electrodes are arranged on the first region, including:

[0017] The electrodes are arranged in the electrical contact area.

[0018] In some embodiments, the method further includes:

[0019] The material in the second region is removed to form a second insulating groove, which divides the second region into an insulating first sub-region and a second sub-region, the second sub-region corresponding to the end of the first region;

[0020] Arranging electrodes in the first region includes:

[0021] A conductive material is applied to the first sub-region and the first region;

[0022] The conductive material is cured to form the electrode.

[0023] In some embodiments, the method further includes:

[0024] The substrate with the resistive layer is divided according to the position of the substrate unit to form a plurality of chips, each chip including one substrate unit and one conductive portion.

[0025] In some embodiments, forming a resistive layer over the entire first surface includes:

[0026] A resistive layer is formed over the entire first surface.

[0027] An atomizing core, comprising:

[0028] A substrate having an array of perforations extending through the substrate along its thickness direction;

[0029] The conductive portion is sheet-shaped and laid on the substrate, the conductive portion including a first region and a second region insulated from the first region, the first region at least partially overlapping the perforated array.

[0030] In some embodiments, a first insulating groove is formed on the conductive portion, the first insulating groove dividing the conductive portion into a first region and a second region, the first insulating groove passing through the perforated array.

[0031] In some embodiments, the first insulating groove includes a first groove and a second groove, the first groove and the second groove being spaced apart and both passing through the perforated array, and the first region being located between the first groove and the second groove.

[0032] In some embodiments, electrodes are arranged on the first region, and the electrodes are electrically connected to the first region.

[0033] In some embodiments, the first region includes a heating region and a grounding region connected to the heating region, the grounding region being located outside the perforated array, the heating region at least partially overlapping the perforated array, and the electrodes being arranged on the grounding region.

[0034] In some embodiments, the second region is provided with a second insulating groove that divides the second region into an insulating first sub-region and a second sub-region, the first sub-region corresponding to the power receiving region, and the electrode extending from the power receiving region to the first sub-region and covering at least a portion of the second sub-region.

[0035] An atomizing core, wherein the atomizing core is prepared by the method described in any of the above embodiments.

[0036] The atomizing device in the embodiments of this application includes the atomizing core described in any of the above embodiments.

[0037] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0038] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, wherein:

[0039] Figure 1 This is a schematic diagram of the manufacturing method according to the embodiments of this application;

[0040] Figure 2 This is a schematic flowchart of the manufacturing method according to an embodiment of this application;

[0041] Figure 3 This is a cross-sectional schematic diagram of the atomizing core according to an embodiment of this application;

[0042] Figure 4 This is a schematic flowchart of the manufacturing method according to an embodiment of this application;

[0043] Figure 5 This is a schematic diagram of the manufacturing method according to the embodiments of this application;

[0044] Figure 6 This is a schematic diagram of an intermediate product of the atomizing core according to an embodiment of this application;

[0045] Figure 7 This is a schematic diagram of the manufacturing method according to the embodiments of this application;

[0046] Figure 8 This is a schematic flowchart of the manufacturing method according to an embodiment of this application;

[0047] Figure 9 This is a schematic diagram of the manufacturing method according to the embodiments of this application;

[0048] Figure 10 This is a schematic flowchart of the manufacturing method according to an embodiment of this application;

[0049] Figure 11 This is a schematic diagram of the manufacturing method according to the embodiments of this application;

[0050] Figure 12 This is a schematic flowchart of the manufacturing method according to an embodiment of this application;

[0051] Figure 13 This is a three-dimensional schematic diagram of the atomizing device according to an embodiment of this application.

[0052] Key marker descriptions:

[0053] Atomizing core 100, substrate 10, first surface 12, second surface 14, substrate unit 16, perforated array 18, resistive layer 20, conductive part 22, first region 24, second region 26, first insulating groove 28, first groove 30, second groove 32, electrode 34, heating region 36, electrical contact region 38, second insulating groove 40, first sub-region 42, second sub-region 44, chip 46, substrate 48, atomizing device 200. Detailed Implementation

[0054] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0055] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0056] The following disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples and settings are described below. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or settings discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0057] Please see Figures 1-3 This application discloses a method for manufacturing an atomizing core 100, the method comprising the following steps:

[0058] S10, a substrate 10 is provided. The substrate 10 includes a first surface 12 and a second surface 14 facing away from each other. The substrate 10 has a plurality of base units 16. Each base unit 16 is provided with a through-hole array 18 penetrating the first surface 12 and the second surface 14.

[0059] S20, a resistive layer 20 is formed on the entire first surface 12, and the resistive layer 20 has conductive portions 22 that correspond one-to-one with the base unit 16.

[0060] S30, the conductive portion 22 on the substrate unit 16 is processed to form a first region 24 and a second region 26 insulated from the first region 24, the first region 24 at least partially overlapping the perforated array 18.

[0061] In the manufacturing method of this application embodiment, a resistive layer 20 is first formed on the entire first surface 12 of the substrate 10, and then the conductive portion 22 of the resistive layer 20 is processed so that the conductive portion 22 forms a first region 24 that at least partially overlaps with the perforated array 18. The process does not require the use of a mask plate, which can save the production cost of the atomizing core 100.

[0062] Specifically, in related technologies, during the fabrication of the atomizing core, a heating film is deposited on the perforated areas of the substrate using a mask. Other areas of the substrate do not have a heating film. Therefore, the masking process requires precise positioning; otherwise, the heating film may shift, causing defects. Furthermore, the mask needs to be replaced frequently, resulting in considerable costs. Additionally, the contact between the mask and the substrate increases the risk of scratches.

[0063] In the manufacturing method of the atomizing core 100 of this application, a resistive layer 20 is provided on the entire first surface 12 of the substrate 10, thus omitting the process of precise positioning using a mask, simplifying the manufacturing process and improving efficiency.

[0064] Furthermore, a first region 24 and a second region 26 that are mutually insulated are processed on the conductive part 22 of each substrate unit 16, and the first region 24 overlaps at least partially with the perforated array 18, so that when the atomizing core 100 is in use, the first region 24 can heat the oil to atomize the oil, ensuring the normal use of the atomizing core 100.

[0065] Specifically, in step S10, it can be understood that the substrate 10 can be in the form of a flat plate. The substrate 10 as a whole can be a square plate, a circular plate, or other plates of various shapes to meet the requirements. The substrate 10 can be made of dense materials such as sapphire single crystal, other single crystal or polycrystalline materials, and dense ceramics, or it can be made of high-temperature resistant and thermal shock resistant glass such as quartz glass, borosilicate glass, or aluminosilicate glass.

[0066] The substrate 10 can be divided into multiple base units 16 according to the final size of the atomizing core 100, and each base unit 16 can be processed into an atomizing core 100. The multiple base units 16 can be arranged in a rectangular array, which makes it easier to process the perforated array 18 on the base unit 16 and also facilitates the subsequent process of dividing the base unit 16.

[0067] The perforated array 18 can be manufactured using glass perforation techniques such as laser perforation. The perforated array 18 includes multiple perforations, each with a diameter ranging from 1 μm to 100 μm. It is understood that the diameter of the perforations can be specifically designed according to the viscosity of the oil; for example, the higher the viscosity of the oil, the larger the diameter of the perforations can be designed. This application does not limit the specific size of the perforation diameter.

[0068] In this embodiment, the diameter of each of the multiple perforations can be equal or unequal. The multiple perforations can be arranged in a rectangular array, for example, in an 8-row, 10-column configuration.

[0069] In each matrix unit 16, the porosity of the perforations can be from 20% to 70%. Porosity refers to the ratio of the total volume of the perforations to the total volume of the matrix unit 16.

[0070] In step S20, the resistive layer 20 can be formed by coating, screen printing, vapor deposition, sputtering, or direct bonding to the first surface 12. For example, the entire substrate 10 with the perforated array 18 can be placed in a magnetron sputtering machine for coating, and the resistive layer 20 can be formed directly on the entire first surface 12 by sputtering. The resistive layer 20 can form conductive portions 22 that correspond one-to-one with the substrate units 16. In the embodiments of this application, the processing speed of the resistive layer 20 can reach 1000 mm / s, which greatly improves the processing efficiency.

[0071] The resistive layer 20 can be made of conductive and heat-generating materials such as metals or alloys. For example, the material of the resistive layer 20 can be platinum, palladium, palladium-copper alloy, gold-silver-platinum alloy, titanium-zirconium alloy, nickel-chromium alloy, gold-silver alloy, palladium-silver alloy, gold-platinum alloy, etc. The thickness of the resistive layer 20 ranges from 100 nm to 10 μm.

[0072] It should be noted that the resistive layer 20 is continuously distributed, or in some examples, the entire resistive layer 20 is formed on the entire first surface 12. That is to say, in some examples, the resistive layer 20 continuously covers the entire first surface 12.

[0073] In step S30, the first region 24 and the second region 26 can be obtained by removing part of the material from the conductive part 22, for example, by laser engraving, machining, etc. The first region 24 and the second region 26 are insulated, so that when voltage is applied to the first region 24, the second region 26 will not conduct electricity, ensuring the utilization rate of electrical energy. Laser engraving achieves non-contact processing with the substrate, avoiding the risk of scratches compared to the mask process. In addition, the precision of laser engraving is extremely high, with a deviation of less than 10 micrometers, compared to the 100-micrometer tolerance of the mask process, which greatly improves the positional accuracy of the heating film, ensuring that the heating film maintains a suitable distance from the edge of the perforation, neither covering the edge perforation nor being too far away from the edge perforation, improving the efficiency of the atomizing core while avoiding the risk of dry burning.

[0074] Furthermore, the conductive portion 22 is divided into a first region 24 and a second region 26, such that the first region 24, which at least partially overlaps with the perforated array 18, has a suitable size, thereby making the resistance value of the first region 24 suitable, typically in the range of 0.5Ω-10Ω, which is beneficial for the first region 24 to generate heat when a voltage is applied. By controlling the size of the first region 24, the resistance deviation of the first region 24 can be controlled within 0.1Ω.

[0075] This means that the first region 24 at least partially overlaps with the perforated array 18, and the first region 24 and the perforated array 18 have an intersection. The area of ​​the first region 24 can be larger than the area of ​​the perforated array 18, or it can be smaller than or equal to the area of ​​the perforated array 18. The boundary of the first region 24 can be located within the area of ​​the perforated array 18 or outside the area of ​​the perforated array 18; or part of the boundary of the first region 24 can be located within the area of ​​the perforated array 18, and part of the boundary can be located outside the perforated array 18.

[0076] It can be understood that the portion of the first region 24 that overlaps with the perforated array 18 is the effective portion of the first region 24. After a voltage is applied to the first region 24, this effective portion can come into contact with the oil to heat the oil and cause the oil to form smoke.

[0077] The first region 24 and the second region 26 can be regular or irregular in shape. For example, both the first region 24 and the second region 26 can be rectangular, making them easier to manufacture. Furthermore, the second region 26 can help dissipate heat from the atomizer core 100, thus improving its heat dissipation effect.

[0078] In this embodiment of the application, there is one first region 24 and two second regions 26. The two second regions 26 are located on opposite sides of the first region 24, or in other words, the first region 24 is located between the two second regions 26.

[0079] Of course, in other embodiments, the number of first regions 24 and second regions 26 can be other numbers. For example, the number of first regions 24 can be one, and the number of second regions 26 can also be one, with one first region 24 and one second region 26 arranged side by side; or, for example, there can be multiple first regions 24 and multiple second regions 26, with each region insulated from the others, and the first region 24 located between the second regions 26.

[0080] When there are multiple first regions 24, a voltage can be applied to one or more first regions 24.

[0081] Please see Figure 1 and Figure 4 In some embodiments, the conductive portion 22 on the substrate unit 16 is processed to form a first region 24 and a second region 26 insulated from the first region 24 (step S30), including:

[0082] S31, plan the processing path on the conductive part 22;

[0083] S32, the material of the conductive part 22 is removed according to the processing path to form a first insulating groove 28. The first insulating groove 28 divides the conductive part 22 into a first region 24 and a second region 26. The first insulating groove 28 passes through the perforated array 18.

[0084] Thus, the first insulating groove 28 can effectively insulate the first region 24 and the second region 26, preventing the first region 24 and the second region 26 from being electrically connected. In addition, the first insulating groove 28 passes through the perforated array 18, that is, part of the perforated array 18 is located in the second region 26, so that the oil can be fully supplied without dry burning.

[0085] Specifically, in step S31, the processing path can be determined by coordinate positioning or by a vision system.

[0086] In step S32, the first insulating groove 28 can be processed by laser engraving. It is understood that in order to effectively insulate the first region 24 and the second region 26, the first insulating groove 28 penetrates the conductive part 22. The first insulating groove 28 can be a straight groove or a curved groove. The specific shape of the first insulating groove 28 can be determined according to the specific shapes of the first region 24 and the second region 26. This application does not limit the shape of the first insulating groove 28.

[0087] Please see Figure 5 In some embodiments, removing material from the conductive portion 22 along the processing path to form the first insulating groove 28 (step S32) includes:

[0088] Material of conductive part 22 is removed along the processing path to form first groove 30 and second groove 32. First groove 30 and second groove 32 are spaced apart and both pass through perforated array 18. First region 24 is formed between first groove 30 and second groove 32. First insulating groove 28 includes first groove 30 and second groove 32.

[0089] Thus, the edge portion of the perforated array 18 is located within the second region 26, or in other words, a portion of the perforated array 18 is located outside the first region 24. This ensures that the width of the first region 24 is appropriate, guaranteeing that the resistance of the first region 24 can effectively generate heat to heat the oil. Furthermore, the fact that a portion of the perforated array 18 is located outside the first region 24 ensures that all components within the first region 24 are in contact with the oil during the heating process, preventing the first region 24 from drying out and being damaged.

[0090] Specifically, both the first groove 30 and the second groove 32 can be formed by laser engraving. Both the first groove 30 and the second groove 32 can be straight grooves, or grooves of other shapes. For example... Figure 5 In the example, when the first slot 30 and the second slot 32 are straight slots, the first slot 30 and the second slot 32 can be set in parallel.

[0091] like Figure 6 In the example, both the first groove 30 and the second groove 32 can be arc-shaped, and the area between the first groove 30 and the second groove 32 is similar to a part of an ellipse.

[0092] In this embodiment, the first groove 30 and the second groove 32 are symmetrical about the long axis of the perforation array 18. That is to say, in the same width direction of the substrate 10, the distance between the first groove 30 and the center of the perforation array 18 is equal to the distance between the second groove 32 and the center of the perforation array 18.

[0093] As discussed above, in the embodiments of this application, the first insulating groove 28 includes a first groove 30 and a second groove 32, that is, the number of first insulating grooves 28 is two. Of course, in other embodiments, the number of first insulating grooves 28 can be one or more than three, and this application does not limit the specific number of first insulating grooves 28.

[0094] Please see Figure 7 and Figure 8 In some implementations, the method further includes:

[0095] S40, an electrode 34 is arranged on the first region 24. In this way, the electrode 34 facilitates the connection between the first region 24 and an external circuit, so that the external circuit can apply voltage to the first region 24 through the electrode 34.

[0096] Specifically, there are two electrodes 34, which are respectively arranged at the two ends of the first region 24. The electrodes 34 can be made of a metal material with low resistivity, such as gold or silver. This application does not impose a specific limitation. For example, silver can be chosen as the electrode 34 because silver not only has good conductivity but also has a relatively low cost.

[0097] Electrode 34 can be disposed on the first region 24 by means of coating, sputtering, or other methods. It is understood that electrode 34 is electrically connected to the first region 24.

[0098] Please see Figure 7 In some embodiments, the first region 24 includes a heating region 36 and a power receiving region 38 connected to the heating region 36. The power receiving region 38 is located outside the perforated array 18, and the heating region 36 at least partially overlaps with the perforated array 18.

[0099] The steps of arranging electrodes 34 on the first region 24 include:

[0100] Electrode 34 is arranged in the energized area 38.

[0101] Thus, electrode 34 can apply voltage to heating region 36 through electrical contact area 38, thereby enabling heating region 36 to generate heat. Specifically, one end of heating region 36 connected to electrical contact area 38 extends outside the perforated array 18. In this embodiment, there are two electrical contact areas 38, each with an electrode 34 arranged thereon, and the two electrical contact areas 38 are respectively connected to the two ends of heating region 36. The area of ​​heating region 36 is larger than the area of ​​one of the electrical contact areas 38.

[0102] In this embodiment, the shape of the electrical receiving area 38 can be square, which makes the shape of the electrical receiving area 38 simple and easy to identify, thereby facilitating the arrangement of the electrode 34 on the electrical receiving area 38 and improving the manufacturing efficiency of the atomizing core 100.

[0103] Please see Figure 9 and Figure 10 In some embodiments, the manufacturing method further includes:

[0104] Material is removed from the second region 26 to form a second insulating groove 40, which divides the second region 26 into an insulating first sub-region 42 and a second sub-region 44, with the second sub-region 44 corresponding to the end of the first region 24.

[0105] Arranging electrodes 34 on the first region 24 (step S40) includes:

[0106] S41, apply conductive material to the first sub-region 42 and the first region 24;

[0107] S42, Curing conductive material to form electrode 34.

[0108] Thus, the electrode 34 is arranged on both the first sub-region 42 and the first region 24, which facilitates the setting of the electrode 34; at the same time, the second insulating groove 40 can effectively isolate the first sub-region 42 and the second sub-region 44, prevent the electrode 34 from being electrically connected to the second sub-region 44, and ensure the heating performance of the first region 24.

[0109] Specifically, the first sub-region 42 serves as the boundary region of the conductive part 22. The conductive material is coated from the first sub-region 42 through the first region 24. This eliminates the need to specially design the boundary of the electrode 34, improves the coating efficiency of the conductive material, and thus improves the manufacturing efficiency of the atomizing core 100.

[0110] Since electrode 34 is coated on the first region 24 of the first sub-region 42, the width of electrode 34 is greater than the width of the first region 24. Of course, in other embodiments, when electrode 34 is only coated on the first region 24, the width of electrode 34 may be equal to or less than the width of the first region 24.

[0111] In this embodiment, the electrode 34 covers a portion of the perforated array 18, thereby enabling the resistors of the first region 24 corresponding to the perforated array 18 to contact the oil, preventing the resistors from burning out and being damaged, and improving the lifespan of the atomizing core 100.

[0112] It should be noted that the step of forming the second insulating groove 40 can be performed before or after the step of coating the conductive material. For example, the conductive material can be coated on the first region 24 and the second region 26 first, and after the conductive material is cured to form the electrode 34, the second insulating groove 40 can then be formed on the second region 26. It can be understood that the conductive material is coated on the contact area 38 of the first region 24.

[0113] Please see Figure 11 and Figure 12 In some embodiments, the manufacturing method further includes:

[0114] S50, the substrate 10 with resistive layer 20 is divided according to the position of the substrate unit 16 to form a plurality of chips 46, each chip 46 including a substrate unit 16 and a conductive part 22.

[0115] In this way, the substrate 10 is divided to form the smallest unit of the atomizing core 100. Specifically, the substrate 10 with the resistive layer 20 can be processed by laser cutting. Each substrate unit 16 serves as the smallest unit of the atomizing core 100. After cutting the substrate 10, the atomizing core 100 or an intermediate product of the atomizing core 100 can be obtained.

[0116] It should be noted that step S50 can be executed before step S30 and after step S20, or it can be executed after step S30; when step S50 is executed after step S30, step S50 can be executed before step S40 or it can be executed after step S40.

[0117] For example, the substrate 10 with the resistive layer 20 can be divided into multiple chips 46, and then a first insulating trench 28 can be formed on each chip 46. After that, an electrode 34 can be arranged on the first region 24, and finally a second insulating trench 40 can be formed.

[0118] For example, a first insulating groove 28 can be processed on the resistive layer 20 first, then the substrate 10 with the resistive layer 20 can be divided into multiple chips 46, then electrodes 34 can be arranged on the first region 24, and finally the second insulating groove 40 can be formed.

[0119] Please refer to it again. Figure 3 This application also provides an atomizing core 100, which is manufactured using any of the methods described above.

[0120] Please refer to it again. Figure 1 and Figure 3 In one embodiment of this application, the atomizing core 100 includes a substrate 48 and a conductive portion 22. The substrate 48 is provided with a perforated array 18 extending through the substrate 48 along the thickness direction of the substrate 48. The conductive portion 22 is sheet-shaped and laid on the substrate 48. The conductive portion 22 includes a first region 24 and a second region 26 that is insulated from the first region 24. The first region 24 at least partially overlaps with the perforated array 18.

[0121] Thus, the first region 24 can heat the oil passing through the perforated array 18, causing the oil to atomize, while the second region 26 can accelerate the heat dissipation efficiency of other parts of the atomizing core 100, preventing the temperature of other parts of the atomizing core 100 from being too high and causing adverse effects on the components around the atomizing core 100.

[0122] As discussed above, the thickness of the resistive layer 20 ranges from 100 nm to 100 μm. Therefore, the thickness of the conductive portion 22 also ranges from 100 nm to 100 μm.

[0123] In some embodiments, a first insulating groove 28 is formed on the conductive portion 22, the first insulating groove 28 dividing the conductive portion 22 into a first region 24 and a second region 26, and the first insulating groove 28 passes through the perforated array 18.

[0124] Thus, the first insulating groove 28 can effectively insulate the first region 24 and the second region 26, preventing the first region 24 and the second region 26 from being electrically connected. In addition, the first insulating groove 28 passes through the perforated array 18, that is, the perforated array 18 is partially located in the second region 26. This allows the heat generated by the first region 24 after voltage is applied to completely heat the oil, resulting in a high utilization rate of electrical energy.

[0125] Please see Figure 7 In some embodiments, the first insulating groove 28 includes a first groove 30 and a second groove 32, the first groove 30 and the second groove 32 are spaced apart and both pass through the perforated array 18, and the first region 24 is located between the first groove 30 and the second groove 32.

[0126] Thus, the edge portion of the perforated array 18 is located in the second region 26, or in other words, part of the perforated array 18 is located outside the first region 24, which makes the width of the first region 24 appropriate and ensures that the resistance of the first region 24 can effectively generate heat to heat the oil.

[0127] Please see Figure 3 and Figure 7 In some embodiments, an electrode 34 is arranged on the first region 24 and is electrically connected to the first region 24.

[0128] Thus, electrode 34 facilitates the connection between the first region 24 and the external circuit, allowing the external circuit to apply voltage to the first region 24 through electrode 34.

[0129] In some embodiments, the first region 24 includes a heating region 36 and a grounding region 38 connected to the heating region 36. The grounding region 38 is located outside the perforated array 18. The heating region 36 at least partially overlaps with the perforated array 18. Electrodes 34 are arranged on the grounding region 38.

[0130] Thus, electrode 34 can apply voltage to heating region 36 through electrical contact area 38, thereby enabling heating region 36 to generate heat. Specifically, one end of heating region 36 connected to electrical contact area 38 extends outside the perforated array 18. In this embodiment, there are two electrical contact areas 38, each with an electrode 34, and the two electrical contact areas 38 are respectively connected to the two ends of the heating. The area of ​​heating region 36 is larger than the area of ​​one of the electrical contact areas 38.

[0131] Please see Figure 3 and Figure 9 In some embodiments, the second region 26 is provided with a second insulating groove 40, which divides the second region 26 into an insulating first sub-region 42 and a second sub-region 44. The first sub-region 42 corresponds to the grounding region 38, and the electrode 34 extends from the grounding region 38 to the first sub-region 42 and covers at least part of the second sub-region 44.

[0132] Thus, by simultaneously arranging the electrode 34 on the first sub-region 42 and the first region 24, the electrode 34 can be conveniently set up, which is beneficial to improving the production efficiency of the atomizing core 100. At the same time, the second insulating groove 40 can effectively isolate the first sub-region 42 and the second sub-region 44, prevent the electrode 34 from being electrically connected to the second sub-region 44, and ensure the heating performance of the first region 24.

[0133] It should be noted that for other parts of the atomizer core 100 in this embodiment that are not elaborated, please refer to the same or similar parts in the above manufacturing method, and they will not be repeated here. In other words, the explanation of the manufacturing method of the above embodiment applies to the atomizer core 100 of this application.

[0134] Please see Figure 13 The atomizing device 200 of this application embodiment includes the atomizing core 100 of any of the above embodiments. The atomizing device 200 of this application embodiment is a device that forms smoke from oil by heating or other means. It should be noted that the oil used in this application embodiment can be a liquid that forms smoke.

[0135] In the description of the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0136] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with the described embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0137] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A method for manufacturing an atomizing core, characterized in that, include: A substrate is provided, the substrate including a first surface and a second surface opposite to each other, the substrate having a plurality of base units, each base unit having an array of through holes penetrating the first surface and the second surface; A resistive layer is formed on the entire first surface, the resistive layer having conductive portions that correspond one-to-one with the substrate units; The conductive portion on the substrate unit is processed to form a first region and a second region insulated from the first region, the first region at least partially overlapping the perforated array.

2. The method according to claim 1, characterized in that, The process of processing the conductive portion on the substrate unit to form a first region and a second region insulated from the first region includes: Plan a processing path on the conductive part; Material is removed from the conductive portion according to the processing path to form a first insulating groove, the first insulating groove dividing the conductive portion into a first region and a second region, the first insulating groove passing through the perforated array.

3. The method according to claim 2, characterized in that, The process of removing material from the conductive portion along the processing path to form a first insulating groove includes: Material of the conductive portion is removed according to the processing path to form a first groove and a second groove, the first groove and the second groove are spaced apart and both pass through the perforation array, the first region is formed between the first groove and the second groove, and the first insulating groove includes the first groove and the second groove.

4. The method according to claim 1, characterized in that, The method further includes: Electrodes are arranged in the first region.

5. The method according to claim 4, characterized in that, The first region includes a heating region and a power receiving region connected to the heating region, the power receiving region being located outside the perforated array, and the heating region at least partially overlapping the perforated array; Electrodes are arranged on the first region, including: The electrode is arranged in the electrical contact area.

6. The method according to claim 4, characterized in that, The method further includes: The material in the second region is removed to form a second insulating groove, which divides the second region into an insulating first sub-region and a second sub-region, the second sub-region corresponding to the end of the first region; Arranging electrodes in the first region includes: A conductive material is applied to the first sub-region and the first region; The conductive material is cured to form the electrode.

7. The method according to claim 1, characterized in that, The method further includes: The substrate with the resistive layer is divided according to the position of the substrate unit to form a plurality of chips, each chip including one substrate unit and one conductive portion.

8. The method according to claim 1, characterized in that, The formation of a resistive layer across the entire first surface includes: A resistive layer is formed over the entire first surface.

9. An atomizing core, characterized in that, The atomizing core is prepared by the method according to any one of claims 1-8, and the atomizing core comprises: A substrate having an array of perforations extending through the substrate along its thickness direction; The conductive portion is sheet-shaped and laid on the substrate, the conductive portion including a first region and a second region insulated from the first region, the first region at least partially overlapping the perforated array.

10. The atomizing core according to claim 9, characterized in that, A first insulating groove is formed on the conductive part, the first insulating groove dividing the conductive part into a first region and a second region, and the first insulating groove passes through the perforated array.

11. The atomizing core according to claim 10, characterized in that, The first insulating groove includes a first groove and a second groove, the first groove and the second groove are spaced apart and both pass through the perforated array, and the first region is located between the first groove and the second groove.

12. The atomizing core according to claim 9, characterized in that, An electrode is disposed on the first region, and the electrode is electrically connected to the first region.

13. The atomizing core according to claim 12, characterized in that, The first region includes a heating region and an electrical contact region connected to the heating region. The electrical contact region is located outside the perforated array. The heating region at least partially overlaps with the perforated array. The electrodes are arranged on the electrical contact region.

14. The atomizing core according to claim 13, characterized in that, The second region is provided with a second insulating groove, which divides the second region into an insulating first sub-region and a second sub-region. The first sub-region corresponds to the power receiving region, and the electrode extends from the power receiving region to the first sub-region and covers at least part of the first sub-region.

15. An atomizing device, characterized in that, Includes the atomizing core as described in any one of claims 9-14.

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