Adaptive machining method and equipment for the surface faces of cylindrical parts
By combining laser detection components and probes, the tool movement path is measured and controlled, solving the problem of difficulty in controlling the depth of holes on the outer surface of cylindrical parts, and achieving precise hole machining results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BEIJING HANGXING MACHINERY MFG CO LTD
- Filing Date
- 2023-12-20
- Publication Date
- 2026-05-19
AI Technical Summary
Cylindrical parts are prone to deformation during processing, resulting in local unevenness on the outer circumference surface. The radial hole depth is difficult to control, affecting the hole processing quality and requiring a large amount of adjustment work.
By combining laser detection components and probes, the relative positional relationship between the machining tool and the precision zero point is measured, and the tool movement path is planned and controlled to achieve precise hole machining.
It enables precise machining of the outer surface of cylindrical parts, solves the problem of part deformation affecting hole depth, and improves machining reliability and accuracy.
Smart Images
Figure CN117696945B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of CNC machining technology, and in particular to an adaptive machining method and machining equipment for the outer surface of cylindrical parts. Background Technology
[0002] like Figure 1 The cylindrical thin-walled part shown is prone to deformation during processing. After deformation, the outer circumferential surface of the cylindrical thin-walled part has local unevenness. During the processing of the radial hole on the outer circumferential surface, the deformation of the part affects the hole processing depth, making it difficult to control the hole depth and ensure the hole processing quality. In order to meet the hole processing requirements, the amount of adjustment work during processing is large. Summary of the Invention
[0003] The technical problem solved by this invention is to overcome the shortcomings of the prior art and provide an adaptive machining method and machining equipment for the external surface of cylindrical parts, thereby solving the problem that the drilling depth of existing cylindrical parts is not easily adjusted due to the deformation of the parts.
[0004] The technical solution of this invention is: an adaptive machining method for holes on the outer surface of cylindrical parts, realizing the machining of holes on the outer surface of cylindrical parts; including,
[0005] The intersection of the axis of the hole to be machined and the actual outer surface of the cylindrical part is used as the precision zero point for the depth machining of the hole, thus completing the machining of the hole.
[0006] In the aforementioned adaptive machining method for the external surface of cylindrical parts, during the hole machining step,
[0007] The relative positional relationship between the machining tool and the precision zero point is obtained by measurement, and the actual movement path required for the machining tool to move to the precision zero point is planned.
[0008] Based on the actual movement path, control the machining tool to move to the precision zero point and complete the machining of the hole to be machined.
[0009] In the aforementioned adaptive machining method for the outer surface of cylindrical parts, the step of measuring and obtaining the relative positional relationship between the machining tool and the precision zero point...
[0010] A laser detection assembly and a probe are used, with the laser detection assembly positioned between the probe and the cylindrical part.
[0011] During measurement, the laser detection assembly and probe move synchronously and approach the cylindrical part;
[0012] The position where the laser emitted by the laser detection component is blocked by the cylindrical part is set as the coarse zero point, and the position where the probe contacts the cylindrical part is set as the fine zero point;
[0013] Control the moving speed of the laser detection component and probe, ensuring that the moving speed to the coarse zero point is greater than the moving speed from the coarse zero point to the fine zero point.
[0014] The machining equipment for realizing the adaptive machining method of the surface face of the cylindrical part described above includes a base, a turntable, a turntable position adjustment unit, a measurement and machining unit, and a measurement and machining position adjustment unit.
[0015] The base has a horizontal support part and a vertical support part, the horizontal support part extends horizontally, and the vertical support part is set vertically;
[0016] The turntable position adjustment unit is installed on the horizontal support, and the horizontal position of the turntable is adjusted using the turntable position adjustment unit.
[0017] The measurement and processing position adjustment unit is set on the vertical support. The measurement and processing unit includes a probe and a laser detection component, with the laser detection component located below the probe. The vertical position of the measurement and processing unit is adjusted using the measurement and processing position adjustment unit.
[0018] In the aforementioned processing equipment, the turntable position adjustment unit includes an X-axis servo moving device and a Y-axis servo moving device;
[0019] The guide rail of the Y-axis servo moving device is fixedly installed on the horizontal support; the guide rail of the X-axis servo moving device is installed on the slider of the Y-axis servo moving device; the extension direction of the guide rail of the Y-axis servo moving device is perpendicular to the extension direction of the guide rail of the X-axis servo moving device.
[0020] The turntable is fixed on the slider of the X-axis servo moving device.
[0021] In the aforementioned processing equipment, the measurement and processing position adjustment unit includes a Z-axis servo moving device, the guide rail of which is fixedly installed on the vertical support and is vertically arranged; the measurement and processing unit is installed on the slider of the Z-axis servo moving device.
[0022] In the aforementioned processing equipment, the measuring and processing unit further includes an indexable power head, a processing tool, and a connecting frame;
[0023] The indexable power head is rotatably mounted on the slider of the Z-axis servo moving device;
[0024] Both the probe and the machining tool are fixedly mounted on the indexable power head;
[0025] The laser detection component is fixedly mounted on the slider of the Z-axis servo moving device via a connecting bracket.
[0026] In the aforementioned processing equipment, the probe and the processing tool are located on opposite sides of the indexable power head, and the probe and the processing tool are coaxial.
[0027] In the aforementioned processing equipment, the laser detection component includes a laser emitter and a laser receiver, which are located on opposite sides of the probe, respectively.
[0028] In the above-mentioned adaptive machining method for the outer surface of cylindrical parts, the probe is a contact measuring device, and the distance between the center point of the probe end and the laser beam is 5cm.
[0029] The advantages of this invention compared to the prior art are:
[0030] It solves the machining problem of the surface pore system of cylindrical parts, especially the machining of easily deformable thin-walled cylindrical parts, with high machining accuracy and high reliability;
[0031] The processing equipment has a simple structure and is easy to implement, and can process the surface hole system of cylindrical parts;
[0032] By combining laser non-contact measurement with machine tool contact probe measurement, it is not limited by the size and shape of the part and can achieve good measurement accuracy. Attached Figure Description
[0033] Figure 1 This is a structural schematic diagram of a cylindrical part;
[0034] Figure 2 This is a schematic diagram of the processing device. Detailed Implementation
[0035] An adaptive machining method for the surface faces of cylindrical parts has been developed, achieving the following: Figure 1 The cylindrical part 12 shown is subjected to adaptive machining of its external surface hole system; the outer wall of the cylindrical part 12 has radial holes, which can be one or more; the radial holes are blind holes or through holes with or without countersunk holes or counterbored holes.
[0036] The adaptive processing method includes,
[0037] The intersection of the axis of the hole to be machined and the actual outer surface of the cylindrical part 12 is used as the zero point for the depth machining of the hole, and the machining of the hole is completed.
[0038] In the hole machining process, the relative positional relationship between the machining tool and the precision zero point is measured, and the actual movement path required for the machining tool to move to the precision zero point is planned.
[0039] Based on the actual movement path, control the machining tool to move to the precision zero point and complete the machining of the hole to be machined.
[0040] In the step of measuring the relative positional relationship between the machining tool and the precision zero point, a laser detection assembly and a probe are used, with the laser detection assembly located between the probe and the cylindrical part 12.
[0041] During measurement, the laser detection component and the probe move synchronously and approach the cylindrical part 12.
[0042] The position where the laser emitted by the laser detection component is blocked by the cylindrical part 12 is set as the coarse zero point, and the position where the probe contacts the cylindrical part 12 is set as the fine zero point.
[0043] Control the moving speed of the laser detection component and probe, ensuring that the moving speed to the coarse zero point is greater than the moving speed from the coarse zero point to the fine zero point.
[0044] In the above-mentioned adaptive machining method for the outer surface of cylindrical parts, the machining tool is controlled with the precision zero point as the reference to accurately control the depth of hole machining. This can solve the problem in the prior art that the hole machining depth is difficult to control due to the deformation of the cylindrical part 12 affecting the hole machining depth.
[0045] Processing equipment that implements the above adaptive processing method, such as Figure 2 As shown, the processing equipment includes a base, a turntable 11, a turntable position adjustment unit, a measurement and processing unit, and a measurement and processing position adjustment unit.
[0046] The base includes a horizontal support portion 13 and a vertical support portion 1. The horizontal support portion 13 extends horizontally and is used to install and fix the turntable position adjustment unit. The vertical support portion 1 is vertically positioned and is used to install and fix the measurement and processing position adjustment unit. The horizontal support portion 13 and the vertical support portion 1 can be assembled and fixed as a whole, or they can be fixed separately on the installation platform, depending on the actual installation needs.
[0047] The turntable position adjustment unit includes an X-axis servo moving device 2 and a Y-axis servo moving device 3. The X-axis servo moving device 2 and Y-axis servo moving device 3 can be commercially available servo moving devices, including guide rails, sliders, and drive devices that drive the sliders to move along the guide rails. Specifically, the guide rail of the Y-axis servo moving device 3 is fixedly mounted on the horizontal support 13; the guide rail of the X-axis servo moving device 2 is fixedly mounted on the slider of the Y-axis servo moving device 3. The drive devices of the X-axis servo moving device 2 and Y-axis servo moving device 3 are assembled and fixed as needed. For example, if a motor is selected as the drive device for the X-axis servo moving device 2, the motor is fixed to the slider of the Y-axis servo moving device 3, and the slider of the X-axis servo moving device 2 is driven by a lead screw and sliding sleeve structure.
[0048] The rotary table 11 is fixed on the slider of the X-axis servo moving device 2. The extension direction of the guide rail of the Y-axis servo moving device 3 is perpendicular to the extension direction of the guide rail of the X-axis servo moving device 2. Therefore, by controlling the movements of the X-axis servo moving device 2 and the Y-axis servo moving device 3 respectively, the position of the rotary table 11 can be adjusted in the horizontal direction. The workpiece 12 to be processed can be directly or indirectly fixed on the rotary table 11. The X-axis servo moving device 2 and the Y-axis servo moving device 3 are used to control the X and Y positions of the workpiece 12 respectively. The rotary table 11 drives the workpiece 12 to rotate, thereby adjusting the processing position of the workpiece 12.
[0049] The measurement and machining position adjustment unit includes a Z-axis servo moving device 4. The Z-axis servo moving device 4 can also be a commercially available servo moving device, which includes a guide rail, a slider, and a drive device to move the slider along the guide rail. The guide rail of the Z-axis servo moving device 4 is fixedly mounted on the vertical support 1 and is vertically positioned. The measurement and machining unit is mounted on the slider of the Z-axis servo moving device 4. The drive device of the Z-axis servo moving device 4 can also be selected according to the installation requirements of the equipment, as long as it meets the driving requirements of the slider.
[0050] The measurement and processing unit includes a probe 7, a laser detection component, an indexable power head 5, a processing tool 6, and a connecting frame 8.
[0051] The indexable power head 5 is rotatably mounted on the slider of the Z-axis servo moving device 4. The slider is also equipped with power equipment such as a motor to drive the indexable power head 5 to rotate.
[0052] Both the probe 7 and the machining tool 6 are fixedly mounted on the indexable power head 5. The indexable power head 5 is equipped with a motor and other power equipment to drive the machining tool 6 to rotate, so that the machining tool 6 can drill holes and perform machining on the outer side of the cylindrical part 12.
[0053] The relative positions of the probe 7 and the machining tool 6 are fixed. Ideally, the probe 7 and the machining tool 6 are located on opposite sides of the indexable power head 5, and the probe 7 and the machining tool 6 are coaxial. The indexable power head 5 can switch between two postures by rotating 180°, that is, the probe 7 is directly below or the machining tool 6 is directly below.
[0054] The laser detection assembly is located on the underside of the probe 7 and includes a laser emitter 9 and a laser receiver 10. The laser emitter 9 and the laser receiver 10 are mounted on the slider of the Z-axis servo moving device 4 via a connecting bracket 8. The laser emitter 9 and the laser receiver 10 are located on opposite sides of the probe 7, and the distance between the laser emitter 9 and the laser receiver 10 must be greater than the outer diameter of the cylindrical part 12 to avoid interference with the cylindrical part 12 during movement.
[0055] The laser emitter 9, laser receiver 10, and probe 7 are positioned relatively fixed and move or stop together. The laser emitter 9 emits a horizontal laser beam that intersects the axis of the probe 7 perpendicularly. A fixed distance, specifically 5 cm, is set between the center point of the probe 7's end and the laser beam. During detection, the laser detection assembly first detects the cylindrical part 12, and then the probe 7 contacts the outer surface of the cylindrical part 12. The probe 7 is a contact measuring device, such as a machine tool contact probe.
[0056] It also includes a control device 13, which has display, input, and output functions. The control device 13 can control the X-axis servo moving device 2, Y-axis servo moving device 3, Z-axis servo moving device 4, turntable 11, and indexable power head 5, as well as receive signals from the probe 7 and laser receiver 10. The control device 13's control of the X-axis servo moving device 2, Y-axis servo moving device 3, Z-axis servo moving device 4, turntable 11, and indexable power head 5, as well as its reception of signals from the probe 7 and laser receiver 10, are all existing technologies, and the inventor has not made any improvements.
[0057] This processing equipment can process the concentric hole system on the outer surface of cylindrical parts 12. During the processing, it can achieve automatic zero-point alignment and automatic correction of the height position of the hole center point caused by part deformation.
[0058] The method for adaptive machining of cylindrical parts with their outer surfaces facing the center hole system using the aforementioned machining equipment includes the following steps:
[0059] Step 1: The cylindrical part 12 is clamped directly or by tooling on the turntable 11. During subsequent processing, the cylindrical part 12 is adjusted by the turntable 11 so that different positions on the outer circumferential surface of the cylindrical part 12 are aligned with the probe 7 or the machining tool 6.
[0060] Step 2: Position the probe 7 directly below the indexable power head 5.
[0061] If, as needed, the probe 7 is initially positioned directly above the indexable power head 5, the indexable power head 5 is controlled to rotate, causing the probe 7 to rotate directly below the indexable power head 5.
[0062] Step 3: Adjust the position of the turntable 11 and control the turntable 11 to rotate so that the center of the hole to be machined on the cylindrical part 12 is directly below the center of the probe 7.
[0063] When adjusting the position of the turntable 11, the position of the turntable 11 is adjusted by moving the X-axis servo moving device 2 and the Y-axis servo moving device 3.
[0064] Step 4: The Z-axis servo moving device 4 moves toward the cylindrical part 12 and gets closer to the cylindrical part 12.
[0065] Step 5: The laser emitter 9 emits a horizontal laser beam, which is received by the laser receiver 10. When the Z-axis servo moving device 4 moves to a certain position, the laser beam emitted by the laser emitter 9 is blocked by the probe 7, and the laser receiver 10 cannot receive the laser. This position is set as the coarse zero point of the Z-axis.
[0066] Step 6: The probe 7 executes the measurement program with reference to the coarse zero point position, measures the precise Z-axis value of the center point of the current hole to be machined on the cylindrical part 12, determines the position of the center point, and uses the center point as the fine zero point.
[0067] Step 7: The Z-axis servo moving device 4 retracts to a safe height.
[0068] Step 8: The indexable power head 5 rotates so that the machining tool 6 is located directly below the indexable power head 5, and the machining tool 6 starts to rotate.
[0069] Step 9: The Z-axis servo moving device 4 moves closer and begins drilling, controlling the depth of the hole with a precise zero point.
[0070] Step 10: Drilling ends, Z-axis servo moving device 4 returns to position.
[0071] By repeating the above steps, the machining of multiple radial holes on the cylindrical part 12 can be completed in sequence.
[0072] The contents not described in detail in this specification are common knowledge to those skilled in the art.
Claims
1. An adaptive machining method for holes on the outer surface of a cylindrical part, realizing the machining of holes on the outer surface of a cylindrical part (12); characterized in that: include, The intersection of the axis of the hole to be machined and the actual outer surface of the cylindrical part (12) is taken as the zero point for the depth machining of the hole, and the machining of the hole is completed. In the process of hole machining, The relative positional relationship between the machining tool and the precision zero point is obtained by measurement, and the actual movement path required for the machining tool to move to the precision zero point is planned. Based on the actual movement path, control the machining tool to move to the precision zero point and complete the machining of the hole to be machined; In the step of measuring the relative positional relationship between the machining tool and the precision zero point, The laser detection assembly and the probe are used, with the laser detection assembly located between the probe and the cylindrical part (12); During measurement, the laser detection assembly and the probe move synchronously and approach the cylindrical part (12). The position where the laser emitted by the laser detection component is blocked by the cylindrical part (12) is set as the coarse zero point, and the position where the probe contacts the cylindrical part (12) is set as the fine zero point; Control the moving speed of the laser detection component and probe, ensuring that the moving speed to the coarse zero point is greater than the moving speed from the coarse zero point to the fine zero point.
2. A processing apparatus for implementing the adaptive machining method for the external surface faces of cylindrical parts as described in claim 1, characterized in that: Includes a base, a turntable (11), a turntable position adjustment unit, a measurement and processing unit, and a measurement and processing position adjustment unit; The base has a horizontal support part (13) and a vertical support part (1), the horizontal support part (13) extends horizontally, and the vertical support part (1) is set vertically; The turntable position adjustment unit is set on the horizontal support (13), and the position of the turntable (11) in the horizontal direction is adjusted by the turntable position adjustment unit; The measurement and processing position adjustment unit is set on the vertical support (1). The measurement and processing unit includes a probe (7) and a laser detection component. The laser detection component is located below the probe (7). The position of the measurement and processing unit in the vertical direction is adjusted by the measurement and processing position adjustment unit.
3. The processing equipment according to claim 2, characterized in that: The turntable position adjustment unit includes an X-axis servo moving device (2) and a Y-axis servo moving device (3). The guide rail of the Y-axis servo moving device (3) is fixedly installed on the horizontal support (13); the guide rail of the X-axis servo moving device (2) is installed on the slider of the Y-axis servo moving device (3); the extension direction of the guide rail of the Y-axis servo moving device (3) is perpendicular to the extension direction of the guide rail of the X-axis servo moving device (2). The turntable (11) is fixed on the slider of the X-axis servo moving device (2).
4. The processing equipment according to claim 2, characterized in that: The measurement and processing position adjustment unit includes a Z-axis servo moving device (4), the guide rail of the Z-axis servo moving device (4) is fixedly installed on the vertical support part (1) and is set vertically; the measurement and processing unit is installed on the slider of the Z-axis servo moving device (4).
5. The processing equipment according to claim 2, characterized in that: The measurement and processing unit also includes a indexable power head (5), a processing tool (6), and a connecting frame (8). The indexable power head (5) is rotatably mounted on the slider of the Z-axis servo moving device (4); The probe (7) and the machining tool (6) are both fixedly mounted on the indexable power head (5); the laser detection assembly is fixedly mounted on the slider of the Z-axis servo moving device (4) via the connecting bracket (8).
6. The processing equipment according to claim 5, characterized in that: The probe (7) and the machining tool (6) are located on opposite sides of the indexable power head (5), and the probe (7) and the machining tool (6) are coaxial.
7. The processing equipment according to claim 5, characterized in that: The laser detection assembly includes a laser emitter (9) and a laser receiver (10), which are located on opposite sides of the probe (7).
8. The processing equipment according to claim 7, characterized in that: The probe (7) is a contact measuring device, and the distance between the center point of the end of the probe (7) and the laser beam is 5cm.