Nanoimprint mechanism, apparatus and method

Abstract

The application relates to the technical field of semiconductors, and provides a nano-imprinting mechanism, equipment and method, wherein the nano-imprinting mechanism comprises a wafer supporting table used for supporting a substrate; a fixing device arranged above the wafer supporting table; the fixing device comprises a working cavity, the working cavity is provided with a template mounting piece and a soft film fixing piece below the template mounting piece; when the working cavity applies air pressure to a soft film fixed on the soft film fixing piece, the surface of the soft film is formed with deformation of different target regions; the working cavity is further provided with a heating device used for heating the surface of the soft film of different target regions. The structure of the heating device used for heating the surface of the soft film is designed to offset or weaken the influence degree of the different degrees of deformation of the soft film between different target regions on the pattern period change, so that the uniformity of the imprinting process is improved, and the imprinting quality is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and provides a nano-imprint mechanism, device and method. BACKGROUND

[0002] The nano-imprint technology is an important processing method in the fields of microelectronics and materials, and mainly completes pattern transfer through contact type imprint. At present, a soft film is generally used as an imprint template, and a certain air pressure is needed to open the soft film in the process to ensure that the soft film can be completely attached to the substrate in the imprint process, thereby improving pattern consistency. However, in the process of opening the soft film, the deformation amount of the soft film in the central region is greatly different from that of the soft film in the edge region, and the pattern is obviously deformed, which causes the pattern period to gradually decrease from the central region to the edge region in the actual imprint process of the soft film, thereby causing pattern difference. SUMMARY

[0003] To solve at least one of the deficiencies in the prior art, the present application provides a nano-imprint mechanism, which comprises a wafer supporting table for supporting a substrate.

[0004] A fixing device is arranged above the wafer supporting table. The fixing device comprises a working cavity, a template mounting member arranged in the working cavity, and a soft film fixing member arranged below the template mounting member. When the working cavity applies air pressure to the soft film fixed on the soft film fixing member, the surface of the soft film is formed with deformation of different target regions.

[0005] A heating device is further arranged in the working cavity, and the heating device is used to heat the surface of the soft film in different target regions.

[0006] In an embodiment, the heating device heats the soft film according to a heating temperature to control the deformation uniformity of the soft film between different target regions. The heating temperature is generated based on the deformation amount of the different target regions formed on the surface of the soft film, and the deformation amount is represented as the vertical displacement amount of the same position on the surface of the soft film under the state of no air pressure and air pressure.

[0007] In an embodiment, in a certain target region, the formula for conversion between the heating temperature and the deformation amount is ΔL=αL0ΔT; wherein ΔL represents the deformation amount of the target region of the soft film after heating, α represents the thermal expansion coefficient of the soft film, L0 represents the initial deformation amount of the target region of the soft film under the state of air pressure, and ΔT represents the heating temperature of the target region of the soft film when heated.

[0008] In an embodiment, the heating device comprises a plurality of heating members arranged above different target regions of the soft film, and the heating temperatures of the plurality of heating members are independently controlled.

[0009] In an embodiment, the heating device comprises a plurality of annular heating elements which are concentrically and evenly distributed from the center of the working cavity to the edge; the heating temperature of the plurality of annular heating elements is independently controlled.

[0010] In an embodiment, the heating element or annular heating element is one or more of an electric heating wire, an infrared heating tube, and a PTC ceramic heater.

[0011] In an embodiment, the device further comprises a control assembly and a sensing assembly, the sensing assembly is used to detect the deformation of different target areas on the soft film, the deformation is represented as the vertical displacement of the same position on the surface of the soft film under the state of no air pressure and the state of air pressure; the control assembly is electrically connected with the sensing assembly and the heating device, so as to convert the deformation of the soft film of a certain target area into the heating temperature and transmit the heating temperature to the heating device of the target area.

[0012] In an embodiment, the formula of converting the deformation of the soft film of a certain target area into the heating temperature is:

[0013] ΔT = ΔL / αL0;

[0014] wherein, ΔT represents the heating temperature of the target area of the soft film when heated, ΔL represents the deformation of the target area of the soft film after heated, α represents the thermal expansion coefficient of the soft film, and L0 represents the initial deformation of the target area of the soft film under the state of air pressure.

[0015] In an embodiment, the device further comprises a lifting device, the lifting device is connected with the fixing device, and is used to drive the working cavity to press downward to the substrate supporting table, so as to press the soft film and the substrate.

[0016] The application further provides a nano-imprint device adopting the nano-imprint mechanism.

[0017] In an embodiment, the device further comprises an ultraviolet light source, the ultraviolet light source is used to expose and cure the photoresist layer on the substrate.

[0018] The application further provides a nano-imprint method, which comprises adopting the nano-imprint mechanism or the nano-imprint device, and further comprises the following steps:

[0019] providing a substrate, the substrate is placed on the substrate supporting table;

[0020] covering a photoresist layer on the surface of the substrate;

[0021] mounting a convex mold plate with an imprint pattern on the mold plate mounting part of the working cavity; fixing a soft film on the soft film fixing part of the working cavity; the working cavity applies air pressure to the soft film to form the deformation of different target areas on the side surface of the substrate.

[0022] The heating device heats the different target regions of the soft film surface according to the heating temperature.

[0023] The convex template presses the soft film on the photoresist layer by pressing the pattern.

[0024] Based on the above, compared with the prior art, the nano-imprinting mechanism provided by the application offsets or weakens the influence of the different degrees of deformation of the soft film between different target regions on the pattern period change by setting the soft film in the working cavity of the fixing device, combining the application of air pressure and the heating of the soft film, improves the uniformity of the imprinting process, and makes the pattern of the patterned substrate clearer and the resolution higher.

[0025] Other features and advantages of the present application will be described in the following description and, in part, will become apparent to those skilled in the art from the description, or recognized by practicing the application as described, in combination with the drawings. The aims and other advantages of the present application can be realized and obtained by the structures specifically pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor; in the following description, the positional relationship described in the drawings is the direction of the components drawn in the drawings as the reference, unless otherwise specified.

[0027] Figure 1 The cross-sectional structure diagram of the nano-imprinting mechanism provided by an embodiment of the present application;

[0028] Figure 2 The cross-sectional structure diagram of the use process of the nano-imprinting mechanism provided by an embodiment of the present application;

[0029] Figure 3 The structure schematic diagram of the soft film before being applied with air pressure, after being applied with air pressure and after being heated;

[0030] Figures 4 to 6 The structure schematic diagram of the multiple embodiments of the heating device.

[0031] Reference signs:

[0032] 100 wafer holding table 200 fixing device 300 soft film

[0033] 400 template 500 lifting device 600 ultraviolet light source

[0034] 110 substrate 120 photoresist layer 210 working cavity

[0035] 211 soft film fixing part 212 template mounting part 213 heating device

[0036] 213a annular heating part 213b heating part DETAILED DESCRIPTION

[0037] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application; and the technical features designed in different implementation manners of the present application described below can be combined with each other as long as there is no conflict. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0038] In the description of the present application, it should be noted that all the terms (including technical terms and scientific terms) used in the present application have the same meanings as those generally understood by a person of ordinary skill in the art to which the present application belongs, and should not be understood as a limitation on the present application; it should be further understood that the terms used in the present application should be understood as having the same meanings as the meanings of these terms in the context of the present specification and the related art, and should not be understood in an idealized or overly formal sense, unless defined explicitly in the present application.

[0039] The present application provides a nano-imprinting mechanism, at least comprising a wafer supporting table 100, a fixing device 200, the wafer supporting table 100 is used for supporting a substrate 110; the fixing device 200 is arranged above the wafer supporting table 100; the fixing device 200 comprises a working cavity 210, the working cavity 210 is provided with a template mounting part 212 and a soft film fixing part 211 below the template mounting part 212; when the working cavity 210 applies air pressure to a soft film 300 fixed on the soft film fixing part 211, the surface of the soft film 300 is deformed to form different target areas; the working cavity 210 is further provided with a heating device 213, and the heating device 213 is used for heating the surface of the soft film 300 of different target areas.

[0040] In specific implementation, Figure 1 , 2As shown, the soft film 300 is fixed on the soft film fixing member 211 in the working cavity 210, and is arranged opposite to the substrate 110 placed on the substrate supporting table 100. Preferably, the cross-sectional shape of the working cavity 210 can be circular, square, triangular, trapezoidal, or other irregular shapes according to actual needs. A template mounting member 212 is arranged above the soft film fixing member 211 in the working cavity 210 to mount a template 400 with an embossed pattern, which is a concave-convex nanostructure and can pattern the soft film 300 before nanoimprint. Preferably, the soft film fixing member 211 and the template mounting member 212 can be one or more of clamping structures, buckle structures, and vacuum adsorption structures. A heating device 213 is arranged in the working cavity 210 and indirectly contacts the soft film 300. When the working cavity 210 applies air pressure to the soft film 300 fixed on the soft film fixing member 211, the surface of the soft film 300 forms deformation of different target regions, and the heating device 213 heats the surface of the soft film 300 in different target regions to affect the deformation of the surface of the soft film 300 in different target regions, thereby improving the precision of nanoimprint.

[0041] Preferably, the heating device 213 heats the soft film 300 according to the heating temperature to control the deformation uniformity of the soft film 300 between different target regions, so that the nanoimprint process is more accurate and controllable, which helps to improve the efficiency and quality of nano manufacturing. The heating temperature is generated based on the deformation amount of different target regions formed on the surface of the soft film 300, which is represented as the vertical displacement amount of the same position on the surface of the soft film 300 under the state of no air pressure and the state of air pressure. In a certain target region, the formula for converting the heating temperature and the deformation amount is: ΔL = αL0ΔT; where ΔL represents the deformation amount of the target region of the soft film 300 after heating, α represents the thermal expansion coefficient of the soft film 300, L0 represents the initial deformation amount of the target region of the soft film 300 under the state of air pressure, and ΔT represents the heating temperature of the target region of the soft film 300 when heated. That is, different target regions obtain corresponding heating temperatures according to the initial deformation amount and the required deformation amount of the target region after heating.

[0042] As an example, as shown in Figure 3 The dashed line part represents the state of the soft film 300 without air pressure, the solid line part represents the state of the soft film 300 with air pressure and without heating, and the dash-dot line part represents the state of the soft film 300 with air pressure and heating. If the soft film 300 at the target region A position is to be uniformly deformed to the result shown in the dash-dot line part after heating, the heating temperature can be obtained by obtaining the size values of ΔL and L0 and then according to the above calculation method, and the target region A position is heated. The size annotations of ΔL and L0 of the target region A position can be referred to Figure 3 as shown.

[0043] When the soft film 300 is applied with the air pressure state, different deformation amounts can be formed according to the fixing mode thereof. In the embodiment, the deformation amounts of different positions are changed by heating, so that the deformation amounts of the positions are relatively consistent. For this purpose, the ΔL of a target region can be determined based on the difference between the maximum deformation amount of the soft film 300 under the air pressure state and the initial deformation amount of the soft film 300 under the air pressure state before heating, for example, ΔL = L max -L0, where L max is the maximum deformation amount of the soft film 300 under the air pressure state before heating, and L0 represents the initial deformation amount of the target region of the soft film 300 under the air pressure state before heating. Of course, considering the mutual heating effect between a plurality of adjacent target regions of the soft film 300, the value of ΔL can be ΔL < L max -L0. Further, the heating device 213 heats the soft film 300 according to the deformation amount ΔL of different target regions of the soft film 300, which helps to realize the uniformity of the deformation of the soft film 300 between different target regions.

[0044] It should be noted that the conversion formula of the heating temperature and the deformation amount is not limited to the above formula, and a person skilled in the art can also reasonably simulate and design to obtain a relevant experience formula according to the actual embossing mechanism and the embossing mode, which falls within the protection scope of the present application.

[0045] Preferably, the heating device 213 includes a plurality of heating pieces 213b located above different target regions of the soft film 300, and the heating temperatures of the plurality of heating pieces 213b are independently controlled.

[0046] In another optional embodiment, the heating device 213 includes a plurality of annular heating pieces 213a which are sequentially and concentrically nested and spaced apart from each other from the center to the edge of the working cavity 210, and the heating temperatures of the plurality of annular heating pieces 213a are independently controlled.

[0047] In specific implementation, as shown in Figure 4 , Figure 5 When the soft film 300 is fixed around, the deformation of the soft film 300 after being applied with the air pressure presents a state of gradually decreasing from the center to the periphery, at this time, the heating device 213 can be designed as a plurality of annular heating pieces 213a which are sequentially and concentrically nested and spaced apart from each other from the center to the edge. More specifically, the shape of the annular heating piece 213a can be reasonably designed according to the shape of the soft film 300. For example, when the soft film 300 is circular, the annular heating piece 213a is circular as shown in Figure 4 , and when the soft film 300 is square, the annular heating piece 213a is square as shown in Figure 5The soft film 300 is shown as a square ring. Further, when the soft film 300 is only partially fixed, the heating device 213 can design the heating element 213b to cover the same heating element 213b for the target region with a consistent deformation variable, and different heating elements 213b for the target region with a large difference in deformation variable in order to control the temperature. Figure 6 When the soft film 300 is only fixed on the left and right sides, the deformation of the soft film 300 after the air pressure is applied shows a state of gradually decreasing from the center line to the left and right sides, so the heating element 213b can be designed as a strip. In addition, due to the different deformation differences of different target regions, the spacing between each heating element 213b or ring-shaped heating element 213a can be the same or different. For example, the spacing between multiple heating elements 213b or ring-shaped heating elements 213a can gradually increase from the position with the maximum deformation variable to the fixed position of the soft film 300, in order to more accurately control the temperature and the deformation variable after heating.

[0048] Therefore, the design of the shape, size, and spacing of the heating element 213b or ring-shaped heating element 213a in the heating device 213 can be reasonably changed and designed according to the different deformation states formed by the actual soft film shape, size, and fixed manner, all of which fall within the scope of the present application.

[0049] The heating device 213 uses independent control of the heating element 213b or ring-shaped heating element 213a, which can independently control the heating temperature for different target regions of the soft film 300, and enhance the adjustability and flexibility during nanoimprint. Preferably, the heating element 213b or ring-shaped heating element 213a is one or more of an electric heating wire, an infrared heating tube, and a PTC ceramic heater. Of course, the heating element 213b or ring-shaped heating element 213a can also be other conventional heating components in the art that can achieve independent temperature regulation, all of which fall within the scope of the present application.

[0050] Preferably, the nanoimprint mechanism further comprises a control component and a sensing component (not shown in the figure), the sensing component is used to detect the deformation variable of different target regions of the soft film 300, the deformation variable is represented as the vertical displacement of the same position on the surface of the soft film 300 under the condition of no air pressure and air pressure; the control component is electrically connected with the sensing component and the heating device 213, in order to convert the deformation variable of a certain target region of the soft film 300 into a heating temperature and transmit it to the heating device 213. The formula for converting the deformation variable of a certain target region of the soft film 300 into a heating temperature is ΔT = ΔL / αL0; ΔT represents the heating temperature of the target region of the soft film 300 when heated, ΔL is the deformation variable of the target region of the soft film 300 after heating, α represents the thermal expansion coefficient of the soft film 300, and L0 represents the initial deformation variable of the target region of the soft film 300 under the condition of air pressure.

[0051] Wherein, the inductive component can be a position detection sensor, such as a photoelectric sensor, a laser displacement sensor, etc., and the control component can be designed according to actual requirements by selecting appropriate chips and programs, which will not be described herein.

[0052] In a specific implementation, according to the pressure and temperature required by the imprinting process, the deformation amount ΔL of the soft film 300 before being stretched out before imprinting is actually measured. By the deformation amount ΔL and the thermal expansion coefficient α of the material of the soft film 300, the corresponding temperature change value ΔT required for adjusting the pattern period is converted. The control component converts the deformation amount ΔL of the soft film 300 in different target areas into a heating temperature and transmits it to the heating device 213, so as to realize real-time monitoring and feedback of the heating process. This closed-loop feedback system allows timely adjustment of the heating temperature to better respond to the actual deformation of the surface of the soft film 300. The resulting precise control helps to improve the consistency and precision of nanoimprinting and ensures that the requirements of specific target areas are better met during the preparation process.

[0053] Preferably, the nanoimprinting mechanism further comprises a lifting device 500 connected with the fixing device 200, for driving the working cavity 210 to press down to the substrate table 100 so that the soft film 300 is imprinted with the substrate 110.

[0054] In a specific implementation, the lifting device 500 is used to control the working cavity 210 to press down to the substrate table 100, so as to accurately imprint the soft film 300 with the substrate 110. Preferably, the lifting device 500 can be a lead screw nut lifting device, a pneumatic cylinder lifting device, a motor-driven lifting device, a sliding rail lifting device, or other devices capable of controlling the vertical movement of the working cavity 210, without being limited to the embodiments. The lifting device 500 can realize precise control of the imprinting process, ensuring that the contact and pressure between the soft film 300 and the substrate 110 meet the requirements. This helps to improve the consistency and repeatability of imprinting, making the process more controllable and efficient.

[0055] The present application also provides a nanoimprinting device using the nanoimprinting mechanism as described above.

[0056] Preferably, it further comprises an ultraviolet light source 600 for exposing and curing the photoresist layer 120 on the substrate 110.

[0057] In a specific implementation, preferably, at least one of the soft film 300 or the substrate 110 is a material that is transparent to ultraviolet light, and the ultraviolet exposure promotes the cross-linking reaction and curing of the photoresist layer 120 in the imprinting area of the substrate 110.

[0058] The present application also provides a nanoimprinting method using the nanoimprinting mechanism as described above, or using the nanoimprinting device as described above, further comprising the following steps:

[0059] S10, providing a substrate 110, which is placed on the substrate support 100;

[0060] S20, covering the surface of the substrate 110 with a photoresist layer 120;

[0061] S30, installing a template 400 with an imprinting pattern on the template mounting part 212 of the working cavity 210, and fixing a soft film 300 on the soft film fixing part 211 of the working cavity 210; the working cavity 210 applies air pressure to the soft film 300 to make the soft film 300 deform to the side surface of the substrate 110 with different target areas;

[0062] S40, generating corresponding heating temperatures based on the deformation amount of the different target areas on the surface of the soft film 300, and heating the different target areas on the surface of the soft film 300 according to the heating temperatures by the heating device 213;

[0063] S50, imprinting the soft film 300 on the photoresist layer 120 by the template 400 through the imprinting pattern.

[0064] In the implementation, step S20 and step S30 can be performed synchronously, or step S20 can be performed first and then step S30, or step S30 can be performed first and then step S20.

[0065] In the present application, the soft film 300 with high elastic modulus is used as the template material. Preferably, the soft film 300 can be a PET soft film, a PDMS soft film, a PVC film or other elastic materials with good flexibility, and the PDMS soft film is preferred as the imprinting template material in the embodiment. Before the substrate 110 with the photoresist layer 120 is pressed against the soft film 300, the working cavity 210 applies air pressure to the soft film 300, and the soft film 300 deforms to the side surface of the substrate 110 with different target areas under the pressure. The deformation amount of the soft film 300 in different target areas is converted into heating temperatures by the formula ΔT=ΔL / αL0, and the heating temperatures are transmitted to the heating device 213 to heat the soft film 300, so as to offset or weaken the influence of the deformation amount of the soft film 300 on the pattern period change, and improve the uniformity of the imprinting process. Then, the lifting device 500 drives the working cavity 210 to press down to the substrate support 100, and when the substrate 110 with the photoresist layer 120 is pressed against the soft film 300 with uniform deformation, the soft film 300 is pressed and attached to the surface of the substrate 110 at each position, so that the pattern on the soft film 300 is transferred to the surface of the substrate 110, and the patterned substrate 110 is formed.

[0066] In one embodiment, in step S50, the soft film 300 is imprinted against the substrate 110 while the exposure process is performed to cure the photoresist layer 120.

[0067] In another alternative embodiment, the thickness of the photoresist layer 120 on the surface of the substrate 110 is slightly greater than the thickness of the concave-convex structure on the template 400 with the imprint pattern, and the photoresist layer 120 and the soft film 300 are attached to not only completely fill the concave structure on the template 400, but also form a residual imprint glue layer between the convex structure and the substrate 110, so as to isolate the template 400 from the substrate 110.

[0068] In summary, compared with the prior art, the nano-imprint mechanism, device and method provided by the application have the following advantages:

[0069] I. The heating device is arranged in the working cavity, and the heating member or the annular heating member is independently realized to control the temperature, so as to improve the deformation uniformity of the soft film between different target regions;

[0070] II. The deformation amount of the soft film in different target regions is detected by the induction assembly, and the deformation amount is converted into the heating temperature by the control assembly, which is helpful to more accurately control the formation of the nano structure;

[0071] III. The lifting device is introduced to control the downward pressing of the working cavity to the supporting table 100, so that the soft film is imprinted with the substrate, and the efficiency and controllability of the nano-imprint are further improved.

[0072] In addition, those skilled in the art should understand that although there are many problems in the prior art, each embodiment or technical solution of the application can only be improved in one or several aspects, and it is not necessary to solve all the technical problems listed in the prior art or background art at the same time. Those skilled in the art should understand that the content not mentioned in a claim should not be regarded as a limitation to the claim.

[0073] Although terms such as supporting table, substrate, fixing device, working cavity, template mounting member, soft film fixing member, soft film, heating device, etc. are used more frequently in this paper, the possibility of using other terms is not excluded. The use of these terms is only for the convenience of describing and explaining the essence of the application; any additional limitation is contrary to the spirit of the application; the terms "first", "second", etc. (if any) in the specification and claims of the embodiment of the application and the above-mentioned drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence.

[0074] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions recorded in the above embodiments can be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A nanoimprint apparatus characterized by comprising: The application relates to a nano-imprint mechanism, which comprises a substrate supporting table for supporting a substrate; a fixing device arranged above the substrate supporting table; the fixing device comprises a working cavity, a template mounting piece arranged in the working cavity, and a soft film fixing piece arranged below the template mounting piece; when the working cavity applies air pressure to a soft film fixed on the soft film fixing piece, the surface of the soft film is deformed to form different target areas; the working cavity is further provided with a heating device for heating the surface of the soft film in different target areas; the heating device heats the soft film according to a heating temperature to control the deformation uniformity of the soft film between different target areas; the heating temperature is generated based on the deformation amount of the different target areas formed on the surface of the soft film, and the deformation amount is represented as the vertical displacement amount of the same position on the surface of the soft film in the state of no air pressure and air pressure; in a certain target area, the conversion formula of the heating temperature and the deformation amount is: Delta L = alpha L0 Delta T; wherein Delta L is the deformation amount of the target area of the soft film after heating, alpha represents the thermal expansion coefficient of the soft film, L0 represents the initial deformation amount of the target area of the soft film in the state of air pressure, and Delta T represents the heating temperature of the target area of the soft film when the soft film is heated; the heating device comprises a plurality of heating pieces arranged above different target areas of the soft film, and the heating temperatures of the plurality of heating pieces are independently controlled; the heating device comprises a plurality of annular heating pieces which are concentrically and sequentially nested and spaced apart from each other from the center to the edge of the working cavity; the heating temperatures of the plurality of annular heating pieces are independently controlled; the heating piece or the annular heating piece is one or more of an electric heating wire, an infrared heating pipe and a PTC ceramic heater; the application further comprises a control assembly and a sensing assembly; the sensing assembly is used for detecting the deformation amount of different target areas on the soft film, and the deformation amount is represented as the vertical displacement amount of the same position on the surface of the soft film in the state of no air pressure and air pressure; the control assembly is electrically connected with the sensing assembly and the heating device respectively, so as to convert the deformation amount of the soft film in a certain target area into the heating temperature and transmit the heating temperature to the heating device of the target area; the formula for converting the deformation amount of the soft film in a certain target area into the heating temperature is: Delta T = Delta L / alpha L0; wherein Delta T represents the heating temperature of the target area of the soft film when the soft film is heated, Delta L is the deformation amount of the target area of the soft film after heating, alpha represents the thermal expansion coefficient of the soft film, and L0 represents the initial deformation amount of the target area of the soft film in the state of air pressure; the application further comprises a lifting device connected with the fixing device, which is used for driving the working cavity to press down to the substrate supporting table so that the soft film is pressed against the substrate; the nano-imprint mechanism is used; the application further comprises an ultraviolet light source for exposing and curing a photoresist layer arranged on the substrate; the nano-imprint mechanism is used; or, the nano-imprint equipment is used, and the application further comprises the following steps: providing a substrate which is placed on the substrate supporting table; covering a photoresist layer on the surface of the substrate; ​ ​ ​ ​ 2. The nanoimprint apparatus according to claim 1, characterized by: ​ 3. The nanoimprint apparatus according to claim 1, wherein: ​ 4. The nanoimprint apparatus according to claim 1, wherein: ​ 5. The nanoimprint apparatus according to claim 3 or 4, characterized by: ​ 6. The nanoimprint apparatus according to claim 1, wherein: ​ 7. The nanoimprint apparatus according to claim 6, wherein: ​ ​ ​ 8. The nanoimprint apparatus according to claim 1, wherein: ​ 9. A nanoimprint apparatus characterized by comprising: ​ 10. The nanoimprint apparatus according to claim 9, characterized by: ​ 11. A nanoimprint method characterized by, ​ ​ ​ The convex template with the embossing pattern is installed on the template mounting part of the working cavity; the soft film is fixed on the soft film fixing part of the working cavity; the working cavity applies air pressure to the soft film to make the soft film deform to the side surface of the substrate to form different target areas; The heating temperature corresponding to the deformation amount of the different target areas formed on the surface of the soft film is generated, and the heating device heats the different target areas on the surface of the soft film according to the heating temperature; The convex template embosses the soft film on the photoresist layer through the embossing pattern.

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