Vacuum-assisted high-precision coating method and coating system

Abstract

This invention discloses a vacuum-assisted high-precision coating method and system. The coating method includes preparing a high-vacuum coating environment, distributing several substrate samples to be coated in the coating environment, and performing at least one deposition. Each deposition includes at least one cycle: A) fully dispersing the mist-like particles Pi formed by the adhesive Gi to be coated in the current cycle in the coating environment, and depositing the Ti mist-like particles Pi onto the substrate sample within a time period to form a deposition structure with a deposition thickness Di, where i is the sequence of cycles, and the distribution of the mist-like particles Pi satisfies the following condition: the size of the mist-like particles is 15-20 nm; B) evacuating the vacuum to repair the coating environment and eliminate residual mist-like particles Pi. This invention optimizes the adhesive deposition coating technology in nanoimprinting, achieving controllable adhesive layer thickness and effectively overcoming problems such as uneven coating and bubbles caused by factors such as mechanical equipment in coating technology.

Description

Technical Field

[0001] This invention relates to micro-nano fabrication technology, and in particular to a vacuum-assisted high-precision coating method and coating system. Background Technology

[0002] In the field of micro-nano fabrication, whether it's photoresist coating in micro-nano lithography or imprinting in nanoimprinting, there are high requirements for the uniformity of the resist layer thickness, the smoothness of the resist layer surface, and the removal of air bubbles and impurities within the resist layer. This is especially true when dealing with small-sized structures with high aspect ratios and the processing requirements of thick resist layers, where the requirements for resist thickness uniformity, resist layer surface smoothness, and the removal of air bubbles within the resist layer are even more stringent and their impact is more pronounced.

[0003] Commonly used coating processes include spin coating, spray coating, and dip coating. Spin coating often encounters problems such as inconsistent adhesive thickness between the center and edges, radial streaks on the surface, and air bubbles within the adhesive layer. Similarly, spray coating and dip coating may also encounter problems such as uneven adhesive surface and air bubbles within the adhesive layer.

[0004] The information disclosed in this background section is intended only to enhance the understanding of the overall background of the invention and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide a vacuum-assisted high-precision adhesive coating method and coating system. By optimizing the adhesive deposition coating technology in nanoimprinting, the thickness of the adhesive layer is controllable, effectively overcoming problems such as uneven coating and bubbles caused by factors such as mechanical equipment in the coating technology. Thus, the invention develops a uniform adhesive layer structure achieved by depositing nanoscale atomized particles in a vacuum environment.

[0006] To achieve the above objectives, embodiments of the present invention provide a high-precision coating method, including preparing a high-vacuum coating environment, wherein several substrate samples to be coated are distributed in the coating environment and at least one deposition is performed; one deposition includes at least one cycle as follows: A, fully dispersing the mist particles Pi formed by the adhesive Gi to be coated in the current cycle in the coating environment, and depositing the mist particles Pi onto the substrate sample within a time period Ti to form a deposition structure with a deposition thickness Di, where i is the sequence of cycles, and the distribution of the mist particles Pi satisfies the following: the size of the mist particles is 15-20 nm; B, evacuating the vacuum to repair the coating environment and eliminate the residual mist particles Pi in the coating environment.

[0007] In one or more embodiments of the present invention, the high vacuum of the adhesive coating environment is: the vacuum degree is not higher than 100 mTorr.

[0008] In one or more embodiments of the present invention, the distribution conditions of the fog particles Pi in two adjacent cycles during deposition are different, which is reflected in at least one of the following aspects: fog particle size and fog particle electrical properties.

[0009] In one or more embodiments of the present invention, the adhesive Gi to be coated in two adjacent cycles of deposition is different, in at least one of the following aspects: the dispersion of the mist particles Pi, the bulk of the mist particles Pi, and the viscosity of the adhesive to be coated.

[0010] It is important to note that, under normal circumstances, the control parameters for two adjacent cycles should be consistent. This is because the operating conditions for each deposition process can be preset according to the actual product processing requirements before processing, thereby achieving precise control over the product deposition process and deposition quality. Of course, if an error occurs in a certain process during multiple deposition cycles, or if the work plan needs to be adjusted, and the deposition target of a certain cycle needs to be adjusted, personalized steps can also be achieved by appropriately adjusting the parameters.

[0011] In one or more embodiments of the present invention, the mist particles Pi are obtained by ultrasonic atomization of the adhesive Gi to be coated, wherein the parameters of ultrasonic atomization are: frequency 2.2MHz-2.8MHz.

[0012] In one or more embodiments of the present invention, the adhesive Gi to be coated satisfies the following condition: the viscosity of the adhesive solution is less than 20 cps.

[0013] In one or more embodiments of the present invention, a coating system for implementing the vacuum-assisted high-precision coating method as described above includes a working chamber that provides a coating environment and an atomizing device for providing mist particles into the working chamber, wherein a stage for carrying a substrate sample is provided in the working chamber.

[0014] In one or more embodiments of the present invention, the working chamber is connected to a vacuum generator.

[0015] In one or more embodiments of the present invention, a filtration and adhesive collection device is also connected between the working chamber and the vacuum generator. Adding a filtration and adhesive collection device between the working chamber and the vacuum generator (such as a vacuum pump) prevents excessive adhesive from damaging the vacuum pump during the vacuuming process.

[0016] Compared with the prior art, the vacuum-assisted high-precision coating method and coating system according to the embodiments of the present invention effectively overcomes the problems of uneven coating and bubbles caused by factors such as mechanical equipment in coating technology, thereby achieving the goal of developing a uniform adhesive layer structure by utilizing the deposition of nano-level atomized particles in a vacuum environment. Attached Figure Description

[0017] Figure 1This is a structural schematic diagram according to an embodiment of the present invention. Detailed Implementation

[0018] The specific embodiments of the present invention will be described in detail below, but it should be understood that the scope of protection of the present invention is not limited to the specific embodiments.

[0019] Unless otherwise expressly stated, throughout the specification and claims, the term "comprising" or its variations such as "including" or "comprises" shall be understood to include the stated elements or components without excluding other elements or other components.

[0020] like Figure 1 As shown, including but not limited to the embodiments described below, the following mechanism can be used in its implementation: a support stage 2 is provided in the working chamber 1, and the sample 3 to be deposited is placed in the appropriate position on the support stage 2 according to the deposition requirements (which can be shaped according to the process). The vacuum pump 4 evacuates the entire cavity to a suitable vacuum level. After the preparation work is completed, the ultrasonic atomizer 5 atomizes the photoresist adjusted to the appropriate viscosity and distributes it evenly in the form of droplets throughout the chamber. The droplets are deposited on the surface of the sample 3. After the current deposition is completed, the vacuum is broken and subsequent work can be carried out (such as preparing for the next deposition or transferring the sample).

[0021] First set of embodiments

[0022] Example 11

[0023] In this embodiment, AZ4620 photoresist was selected, and propylene glycol methyl ether acetate (PGMEA) was used as the diluent. The photoresist and diluent were mixed at a ratio of 1:2, and the viscosity was measured to be 5.2 cps. The sample was placed and a vacuum was drawn. When the vacuum reached 100 mTorr, atomization coating began. The spraying rate was 20 μL / s (ultrasonic frequency 2.2 MHz, atomized particle size 20 nm), the spraying time was 3 s, the deposition time was 5 s, and the vacuum was drawn for 10 s. The spraying, deposition, and vacuuming process was repeated three times. After the vacuum was broken, the sample was taken out and baked on a hot plate at 95°C for 3 min. A uniform photoresist layer with a thickness of about 850 nm was obtained, and the surface was flat, uniform, and free of bubbles. Ellipsometry was used to check that the thickness uniformity was over 99.7%.

[0024] Example 12

[0025] The only difference between this embodiment and Embodiment 11 is that the photoresist and diluent are mixed in a ratio of 1:1.5, and the viscosity is measured to be 10.7 cps.

[0026] The deposition process yields a uniform photoresist layer with a thickness of approximately 900 nm, and the surface is smooth, uniform, and free of bubbles.

[0027] Example 13

[0028] The only difference between this embodiment and Embodiment 11 is that the photoresist and diluent are mixed in a ratio of 1:1.2, and the viscosity is measured to be 18 cps.

[0029] The deposition process yields a uniform photoresist layer with a thickness of approximately 850 nm, and the surface is smooth, uniform, and free of bubbles.

[0030] Example 14

[0031] The only difference between this embodiment and Embodiment 11 is that the photoresist and diluent are mixed in a ratio of 1:3, and the viscosity is measured to be 3 cps, with a spraying rate of 10 μL / s.

[0032] The deposition process yields a uniform photoresist layer with a thickness of approximately 350 nm, and the surface is smooth, uniform, and free of bubbles.

[0033] Example 15

[0034] The only difference between this embodiment and embodiment 11 is that atomization of the adhesive begins when the vacuum level reaches 50 mTorr.

[0035] The deposition process yields a uniform photoresist layer with a thickness of approximately 850 nm, and the surface is smooth, uniform, and free of bubbles.

[0036] Example 16

[0037] The only difference between this embodiment and embodiment 11 is that atomization of the adhesive begins when the vacuum level reaches 20 mTorr.

[0038] The deposition process yields a uniform photoresist layer with a thickness of approximately 850 nm, and the surface is smooth, uniform, and free of bubbles.

[0039] Example 17

[0040] The only difference between this embodiment and Embodiment 11 is that the ultrasonic frequency is 2.5MHz and the size of the mist particles is 17nm.

[0041] The deposition process yields a uniform photoresist layer with a thickness of approximately 850 nm, and the surface is smooth, uniform, and free of bubbles.

[0042] Example 18

[0043] The only difference between this embodiment and Embodiment 11 is that the ultrasonic frequency is 2.8MHz and the size of the mist particles is 15nm.

[0044] The deposition process yields a uniform photoresist layer with a thickness of approximately 850 nm, and the surface is smooth, uniform, and free of bubbles.

[0045] Second set of embodiments

[0046] Example 21

[0047] In this embodiment, dipentaerythritol penta / hexaacrylate was used as the polymer matrix, 1-hydroxycyclohexylphenyl ketone was used as the photoinitiator, the matrix:photoinitiator ratio was 9:1, 4-methyl-2-pentanone (MIBK) was selected as the solvent, and the solid content of the final mixed solution was 8.7 wt%, and its viscosity was measured to be 7.5 cps. The sample was placed and a vacuum was drawn. When the vacuum reached 100 mTorr, atomization coating was started. The spraying rate was 13 μL / s (ultrasonic frequency 2.2 MHz, atomized particle size 18 nm), the spraying time was 3 s, the deposition time was 5 s, and the vacuum was drawn for 10 s. The spraying, deposition and vacuuming process was repeated three times. After the vacuum was broken, the sample was taken out and placed on a hot plate at 95°C for 3 min to obtain a uniform UV imprinted adhesive layer with a thickness of about 400 nm.

[0048] Example 22

[0049] The only difference between this embodiment and embodiment 21 is that atomization of the adhesive begins when the vacuum level reaches 50 mTorr.

[0050] The deposition process yields a uniform photoresist layer with a thickness of approximately 400 nm, and the surface is smooth, uniform, and free of bubbles.

[0051] Example 23

[0052] The only difference between this embodiment and embodiment 21 is that atomization of the adhesive begins when the vacuum level reaches 20 mTorr.

[0053] The deposition process yields a uniform photoresist layer with a thickness of approximately 400 nm, and the surface is smooth, uniform, and free of bubbles.

[0054] Example 24

[0055] The only difference between this embodiment and embodiment 21 is that the ultrasonic frequency is 2.5MHz and the size of the mist particles is 17nm.

[0056] The deposition process yields a uniform photoresist layer with a thickness of approximately 400 nm, and the surface is smooth, uniform, and free of bubbles.

[0057] Example 25

[0058] The only difference between this embodiment and embodiment 21 is that the ultrasonic frequency is 2.8MHz and the size of the mist particles is 15nm.

[0059] The deposition process yields a uniform photoresist layer with a thickness of approximately 400 nm, and the surface is smooth, uniform, and free of bubbles.

[0060] Example 26

[0061] In this embodiment, dipentaerythritol penta / hexaacrylate was used as the polymer matrix, and 1-hydroxycyclohexylphenyl ketone was used as the photoinitiator. The matrix:photoinitiator ratio was 9:1. 4-methyl-2-pentanone (MIBK) was selected as the solvent. The final mixed solution had a solid content of 8.7 wt% and a measured viscosity of 7.5 cps. The sample was placed and a vacuum was drawn. When the vacuum reached 100 mTorr, atomization coating was started. The spraying rate was 13 μL / s (ultrasonic frequency 2.2 MHz, atomized particle size 18 nm), the spraying time was 3 s, the deposition time was 5 s, and the vacuum was drawn for 10 s. After repeating the spraying, deposition, and vacuuming process twice, the parameters were adjusted to a spraying rate of 13 μL / s (ultrasonic frequency 2.8 MHz, atomized particle size 16 nm), a spraying time of 2 s, a deposition time of 5 s, the vacuum was broken, the sample was taken out, and the sample was placed on a hot plate at 95°C for 3 min to obtain a uniform UV imprinted adhesive layer with a thickness of about 390 nm.

[0062] The foregoing description of specific exemplary embodiments of the invention is for illustrative and explanatory purposes. These descriptions are not intended to limit the invention to the precise forms disclosed, and it will be apparent that many changes and variations can be made in accordance with the foregoing teachings. The exemplary embodiments were chosen and described in order to explain the specific principles of the invention and its practical application, thereby enabling those skilled in the art to implement and utilize various different exemplary embodiments of the invention, as well as various different choices and variations. The scope of the invention is intended to be defined by the claims and their equivalents.

Claims

1. A vacuum-assisted high-precision glue coating method, comprising preparing a high-vacuum glue coating environment, a plurality of substrate samples to be coated are distributed in the glue coating environment, and at least one deposition is performed in the glue coating environment, wherein the high-vacuum of the glue coating environment is: a vacuum degree of no more than 100 mTorr; one of the depositions comprises at least one cycle as follows: A, sufficiently dispersing mist particles Pi formed by a glue Gi to be coated corresponding to the current cycle in the glue coating environment, and depositing the mist particles Pi to the substrate samples within a time period Ti to form a deposited structure with a deposition thickness Di, i is the sequence of the cycle, and the distribution of the mist particles Pi satisfies: the mist particle size is 15-20 nm, and the glue Gi to be coated satisfies: a viscosity of no more than 20 cps; B, vacuumizing to repair the glue coating environment and eliminate residual mist particles Pi in the glue coating environment.

2. The vacuum assisted high precision glue applying method according to claim 1, wherein, The distribution conditions of the mist particles Pi of two adjacent cycles in the deposition are different, and are embodied in at least one of the following aspects: the mist particle size and the electrical property of the mist particles.

3. The vacuum assisted high precision glue applying method of claim 1, wherein, The glues Gi to be coated of two adjacent cycles in the deposition are different, and are embodied in at least one of the following aspects: the dispersion liquid of the mist particles Pi, the main body of the mist particles Pi, and the viscosity of the glue to be coated.

4. The vacuum assisted high precision glue applying method of claim 1, wherein, The mist particles Pi are obtained by ultrasonic atomization of the glue Gi to be coated, wherein the parameters of the ultrasonic atomization are: 2.2 MHz-2.8 MHz.

5. A coating system for implementing the vacuum-assisted high-precision glue coating method according to any one of claims 1-4, comprising a work cabin for providing a glue coating environment, and an atomization device for providing mist particles into the work cabin, and a carrier table for carrying the substrate samples is arranged in the work cabin.

6. The coating system of claim 5, wherein, The work cabin is connected with a vacuum generator.

7. The coating system of claim 6, wherein, The work cabin and the vacuum generator are further communicated with a filtering and glue liquid collecting device.

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