Power conversion unit

Abstract

A power conversion unit has a frame, a plurality of fans, a heat sink, and a plurality of semiconductor elements. The fans generate a flow of air inside the frame. The heat sink forms an air flow path on an upstream side of the flow of air inside the frame. The plurality of semiconductor elements are arranged on an element arrangement surface of the heat sink in a direction intersecting a flow direction of the air at the heat sink.

Description

Technical Field

[0001] Embodiments of the present invention relate to power conversion units. Background Technology

[0002] Previously, there were power conversion devices with heat sinks that housed switching elements that served as heat sources.

[0003] However, in a heat sink with multiple switching elements, the cooling air pressure loss may increase due to the longer ventilation path of the cooling air, and the temperature gradient along the ventilation path may increase, thereby reducing the cooling efficiency.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2003-45632

[0007] Patent Document 2: International Publication No. 2011 / 001568 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] The problem to be solved by the present invention is to provide a power conversion unit that can improve cooling efficiency.

[0010] Methods for solving problems

[0011] The power conversion unit of this embodiment includes a housing, fluid machinery, a heat dissipation component, and multiple elements. The fluid machinery generates refrigerant flow inside the housing. The heat dissipation component forms a refrigerant flow path upstream of the refrigerant flow path inside the housing. The multiple elements are arranged on the element arrangement surface of the heat dissipation component in a direction intersecting the refrigerant flow direction at the heat dissipation component. Attached Figure Description

[0012] Figure 1 This is a perspective view showing the structure of the power conversion unit in the implementation method.

[0013] Figure 2 This is a perspective view showing the structure of the component units and drive unit of the power conversion unit in the embodiment.

[0014] Figure 3 This is a perspective view showing the structure of the capacitor unit of the power conversion unit in the embodiment.

[0015] Figure 4 This is a cross-sectional view showing the flow of cooling air at the power conversion unit in the embodiment.

[0016] Figure 5 It means Figure 4 An enlarged cross-sectional view of the cooling airflow at the component unit and capacitor unit shown. Detailed Implementation

[0017] Hereinafter, the power conversion unit of the embodiment will be described with reference to the accompanying drawings.

[0018] Figure 1 This is a perspective view showing the structure of the power conversion unit 10 according to the embodiment.

[0019] In the following, the directions of the X, Y, and Z axes, which are orthogonal to each other in three-dimensional space, are parallel to the axes themselves. For example, as shown... Figure 1 As shown, the X-axis is parallel to the left-right direction of the power conversion unit 10. The Y-axis is parallel to the front-back direction of the power conversion unit 10. The Z-axis is parallel to the up-down direction of the power conversion unit 10.

[0020] The power conversion unit 10 in the embodiment is, for example, a panel found in electrical equipment. The panel is a distribution panel, sub-distribution panel, and control panel that constitutes a power supply device and a motor drive device. The power conversion unit 10 includes various circuit components such as semiconductor elements, conductors, fuses, capacitors, transformers, switches, circuit breakers, and measuring devices.

[0021] like Figure 1 As shown, the power conversion unit 10 includes, for example, an operation unit 10a and a power control unit 10b. The operation unit 10a receives, for example, input operations from the operator related to the operation of the power control unit 10b. The operation unit 10a outputs a signal instructing the operation of the power control unit 10b based on the operator's input operations. The operation unit 10a includes, for example, input devices such as operation buttons and displays such as liquid crystal displays.

[0022] The power control unit 10b has, for example, a housing 11, multiple fans (an example of fluid machinery) 13, and multiple power control units 15.

[0023] The upper part 11a of the frame 11 in the Z-axis direction supports multiple fans 13. An exhaust port 11A is formed in the upper part 11a (see description below). Figure 4 For example, it faces and communicates with each fan 13 along the Z-axis direction. Multiple air inlets 11B formed on the front part 11b of the frame 11 in the Y-axis direction are opposite to the appropriate power control unit 15, for example, along the Y-axis direction. Each air inlet 11B is, for example, a rectangular opening.

[0024] The frame 11 supports multiple power control units 15 configured inside.

[0025] Multiple fans 13, for example, two fans 13. Each fan 13 draws in air from outside the frame 11 through its air inlet 11B at the front 11b of the frame 11. Each fan 13 exhausts air from inside the frame 11 to the outside through its exhaust port 11A at the top 11a of the frame 11. Each fan 13 cools multiple power control units 15 via cooling air F, which is formed by air flowing inside the frame 11.

[0026] The plurality of power control units 15, for example, are 12 power control units 15. The plurality of power control units 15 are arranged in 6 levels in the Z-axis direction and in 2 columns in the X-axis direction, and are disposed inside the housing 11. The power control units 15, except for the top two columns, are arranged, for example, opposite to the air inlets 11B of the housing 11 along the Y-axis direction.

[0027] Each power control unit 15 includes, for example, a component unit 21, a drive unit 23, and a capacitor unit 25.

[0028] Figure 2 This is a perspective view showing the structure of the component unit 21 and drive unit 23 of the power conversion unit 10 according to the embodiment.

[0029] like Figure 2 As shown, the component unit 21 and the drive unit 23 are configured, for example, to be stacked along the Z-axis direction.

[0030] The component unit 21 includes a first unit frame 31, a plurality of semiconductor elements (first elements) 33, and a heat sink (an example of a heat dissipation component) 35. The first unit frame 31 internally supports the plurality of semiconductor elements (elements, an example of first elements) 33 and the heat sink 35. A front opening 31A and a rear opening 31B, for example, facing and communicating with the heat sink 35 along the Y-axis direction, are formed on the front portion 31a and rear portion 31b of the first unit frame 31 (see below). Figure 5 ).

[0031] Multiple semiconductor elements 33 include, for example, multiple switching elements and rectifier elements that are connected in a bridging circuit. The switching elements are transistors such as IGBTs (Insulated Gate Bipolar Transistors) or MOSFETs (Metal Oxide Semiconductor Field Effect Transistors). The rectifier elements are diodes connected in parallel with each transistor.

[0032] Multiple semiconductor elements 33 are disposed on the element placement surface 35A of the heat sink 35. The element placement surface 35A of the heat sink 35 is, for example, the upper end surface of the upper part 35a of the heat sink 35 in the Z-axis direction. The multiple semiconductor elements 33 are, for example, arranged in a row along the X-axis direction on the element placement surface 35A.

[0033] The heat sink 35 has a rectangular parallelepiped shape, for example. The length of the heat sink 35 along the Y-axis is, for example, formed to be longer than the Y-axis length of each semiconductor element 33 disposed on the element mounting surface 35A by a predetermined length. This predetermined length is, for example, the length required to fix each semiconductor element 33 to the element mounting surface 35A.

[0034] The heat sink 35 has multiple fin components 35b. Each fin component 35b is, for example, a plate-shaped component parallel to the YZ plane. The multiple fin components 35b extend downward from the upper part 35a toward the Z-axis and contact the partition member 37a of the drive unit 23, which will be described later. The multiple fin components 35b are arranged at predetermined intervals along the X-axis.

[0035] Multiple fin components 35b of the heat sink 35 are formed in the airflow path 35c inside the frame 11. The airflow direction at the heat sink 35 is set by the multiple fin components 35b to be parallel to the YZ plane.

[0036] The drive unit 23 has a second unit frame 37 and a substrate 39. The second unit frame 37 is supported on the substrate 39 disposed inside. The second unit frame 37 has a partition member 37a. The partition member 37a separates the interior of the second unit frame 37 on which the substrate 39 is disposed from the air flow path 35c formed by the heat sink 35.

[0037] The partition member 37a is, for example, a plate-shaped component parallel to the XY plane. The partition member 37a prevents air (cooling air F) flowing through the flow path 35c at the radiator 35 from flowing into the interior of the second unit frame 37.

[0038] The substrate 39 may be, for example, a drive substrate that drives and controls switching elements among a plurality of semiconductor elements 33.

[0039] Figure 3 This is a perspective view showing the structure of the capacitor unit 25 of the power conversion unit 10 in the embodiment.

[0040] Capacitor unit 25 is configured, for example, to be adjacent to element unit 21 and drive unit 23 along the Y-axis in a state separate from element unit 21 and drive unit 23.

[0041] like Figure 3As shown, capacitor unit 25 has a third unit frame (an example of a support member) 41 and a plurality of capacitors (capacitors: elements, an example of second elements) 43. The third unit frame 41 supports the plurality of capacitors 43 arranged inside.

[0042] The third unit frame 41, for example, has a left side 41a and a right side 41b in the X-axis direction, an upper part 41c and a lower part 41d in the Z-axis direction, and a support member 41e between the upper part 41c and the lower part 41d.

[0043] The left side portion 41a and the right side portion 41b are each plate-shaped, for example, parallel to the YZ plane. Multiple side openings (an example of through holes) 45a are formed on the left side portion 41a and the right side portion 41b for allowing air (cooling air F) to pass through. Each side opening 45a is, for example, a circular through opening.

[0044] The upper part 41c, the lower part 41d, and the supporting member 41e are each plate-shaped, for example, parallel to the XY plane. The upper part 41c has multiple insertion holes 45b for inserting multiple capacitors 43 and multiple upper openings (an example of through holes) 45c for air (cooling air F) to pass through (see below). Figure 5 Each upper opening 45c is, for example, a circular opening that extends through the entire surface.

[0045] Multiple lower openings (an example of through holes) 45d are formed in the lower part 41d to allow air (cooling air F) to pass through. Each lower opening 45d is, for example, a through opening with a rounded rectangular shape.

[0046] The support member 41e, through which multiple capacitors 43 are disposed, has multiple support openings 45e for air (cooling air F) to pass through (see below). Figure 5 (An example of a through hole). The opening 45e of each support is, for example, a circular through opening.

[0047] Between the upper part 41c and the support member 41e, which are arranged at predetermined intervals along the Z-axis, a pair of opposing openings 45f are formed along the Y-axis to allow air (cooling air F) to pass through. Each opening 45f is, for example, a rectangular opening.

[0048] Between the lower part 41d and the support member 41e, which are arranged at predetermined intervals along the Z-axis, an opening 45g is formed in the front part 41f in the Y-axis direction for air (cooling air F) to pass through. The opening 45g is, for example, a trapezoidal opening.

[0049] Multiple openings 45h are formed in the rear part 41g in the Y-axis direction between the lower part 41d and the support member 41e, through which air (cooling air F) passes. The multiple openings 45h are, for example, circular through openings.

[0050] Each capacitor 43 may include, for example, a capacitor that smooths out voltage fluctuations caused by switching operations that accompany the on and off of switching elements in the plurality of semiconductor elements 33.

[0051] Figure 4 This is a cross-sectional view showing the flow of cooling air F at the power conversion unit 10 in the embodiment. Figure 5 It means Figure 4 An enlarged cross-sectional view of the flow of cooling air F at component unit 21 and capacitor unit 25 shown.

[0052] like Figure 4 and Figure 5 As shown, driven by multiple fans 13, air from outside the frame 11 is drawn into the frame 11 through multiple air inlets 11B. The air passing through the frame 11 is then exhausted to the outside of the frame 11 through exhaust ports 11A and each fan 13. The air passing through the frame 11 acts as cooling air F in the flow path from each air inlet 11B to each exhaust port 11A, thereby cooling the multiple power control units 15.

[0053] First, the cooling air F drawn into the interior of the frame 11 from each air inlet 11B flows along the Y-axis toward the component unit 21 and drive unit 23 of each power control unit 15.

[0054] Cooling air F reaching each power control unit 15 flows from the front opening 31A of the first unit frame 31 of the component unit 21 toward the heat sink 35. The cooling air F passing through the flow path 35c formed by the heat sink 35 cools the multiple semiconductor components 33 disposed on the heat sink 35.

[0055] Cooling air F, passing through the radiator 35 and the rear opening 31B of the first unit frame 31, flows inside the third unit frame 41 of the capacitor unit 25. The cooling air F flowing between the upper part 41c and the support member 41e inside the third unit frame 41 cools each capacitor 43 by flowing between the multiple capacitors 43.

[0056] The cooling air F passing through the interior of the third unit frame 41 flows toward each exhaust port 11A and each fan 13, and is discharged to the outside of the frame 11.

[0057] In capacitor cell 25, in addition to a pair of openings 45f, opening 45g, and multiple openings 45h in the Y-axis direction, cooling air F also passes through multiple side openings 45a, multiple upper openings 45c, multiple lower openings 45d, and multiple support openings 45e in each of the X-axis and Z-axis directions. The multiple capacitor cells 25 arranged in the Z-axis direction function as a so-called wind tunnel for the cooling air F passing through them along the X-axis, Y-axis, and Z-axis directions.

[0058] Thus, the power conversion unit 10 has a plurality of semiconductor elements 33 arranged in a row along a direction orthogonal to the flow direction of the cooling air F. Therefore, the cooling efficiency of the heat sink 35 can be improved. For example, compared with the case where the plurality of semiconductor elements 33 are arranged in multiple rows along the flow direction of the cooling air F, each semiconductor element 33 can be cooled more actively, and the length of the heat sink 35 in the flow direction of the cooling air F can be reduced.

[0059] For example, it can prevent the upstream semiconductor element 33 from affecting the downstream semiconductor element 33 thermally and from causing temperature non-uniformity between the upstream and downstream semiconductor elements 33, such as when multiple semiconductor elements 33 are arranged along the flow direction of the cooling air F.

[0060] By suppressing the increase in the flow path of the cooling air F at the heat sink 35, the increase in the temperature gradient of the heat sink 35 can be suppressed, and the increase in the pressure loss of the cooling air F can also be suppressed. By reducing the pressure loss of the cooling air F, the air velocity of the cooling air F can be increased, thereby improving the cooling efficiency of the multiple semiconductor elements 33 and the multiple capacitors 43. By reducing the length of the heat sink 35 in the flow direction of the cooling air F and reducing the pressure loss of the cooling air F, the cooling efficiency of other motor equipment located downstream of the cooling air F can be improved.

[0061] The power conversion unit 10 described above has a heat sink 35 disposed upstream of the cooling airflow F. Therefore, multiple semiconductor elements 33 disposed on the heat sink 35 can be actively cooled. For example, compared to the case where the semiconductor elements 33 that generate relatively large amounts of heat are disposed downstream of other circuit elements in the cooling airflow F, multiple semiconductor elements 33 can be cooled more efficiently.

[0062] The aforementioned power conversion unit 10 has a third unit frame 41 with multiple side openings 45a, multiple upper openings 45c, multiple lower openings 45d, and multiple support openings 45e. Therefore, it is possible to facilitate the passage of cooling air F through the interior of the third unit frame 41. By utilizing the multiple third unit frames 41 as wind tunnels, it is possible to suppress the increase in pressure loss inside the frame 11.

[0063] This design prevents the need for additional cooling airflow F within the frame 11, thus preventing the frame 11 from becoming too large. By reducing pressure loss within the frame 11, the cooling capacity of the cooling airflow F within the frame 11 can be increased, thereby increasing the internal capacity of the frame 11. Increasing the cooling capacity of the cooling airflow F also suppresses the increase in power consumption of each fan 13, allowing for the miniaturization of each fan 13.

[0064] The power conversion unit 10 described above has a partition member 37a that separates the interior of the second unit frame 37 from the air flow path 35c formed by the heat sink 35. Therefore, it is possible to suppress the heat dissipation of the heat sink 35 from having a thermal impact on the interior of the second unit frame 37.

[0065] By separating the component unit 21 and the drive unit 23 from the capacitor unit 25, maintenance ease can be improved.

[0066] The following is an explanation of the variations.

[0067] In the above embodiments, the component unit 21, the driving unit 23, and the capacitor unit 25 can be separated from each other, or they can be integrated into one unit through appropriate combination.

[0068] According to at least one embodiment described above, the cooling efficiency of the heat sink 35 can be improved by having a plurality of semiconductor elements 33 arranged in a row along a direction orthogonal to the flow direction of the cooling air F.

[0069] Several embodiments of the present invention have been described, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other ways, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the scope of the invention as described in the claims and its equivalents.

[0070] Label Explanation

[0071] 10… Power conversion unit, 11… Frame, 13… Fan (fluid machinery), 15… Power control unit, 21… Component unit, 23… Drive unit, 25… Capacitor unit, 31… First unit frame, 33… Semiconductor component (component, first component), 35… Heat sink (heat dissipation component), 35A… Component mounting surface, 35c… Flow path, 37… Second unit frame, 37a… Separator, 39… Substrate, 41… Third unit frame (support component), 43… Capacitor (capacitor, component, second component), 45a… Side opening (through hole), 45c… Top opening (through hole), 45d… Bottom opening (through hole), 45e… Support opening (through hole).

Claims

1. A power conversion unit, comprising: Frame; Fluid machinery that generates the flow of refrigerant inside the frame; A heat dissipation component forms a refrigerant flow path upstream of the refrigerant flow path inside the frame; Multiple first elements are arranged on the element configuration surface of the heat dissipation component in a direction intersecting with the flow direction of the refrigerant at the heat dissipation component; A plurality of second elements are disposed in the flow path at a position downstream of the plurality of first elements; as well as The frame supports the plurality of second elements in a manner that allows the refrigerant to circulate between adjacent second elements. The frame has: The upper part of the plate has insertion holes for inserting the plurality of second elements respectively; as well as A plate-shaped support member supports the plurality of second elements. Multiple upper openings are formed between the upper insertion holes to allow the refrigerant to pass through. Multiple support openings are formed at a location that avoids the second element of the support member, allowing the refrigerant to pass through.

2. The power conversion unit according to claim 1, further comprising: Separating components, forming regions separated from the flow path; and A substrate is disposed in the region and controls the driving of the plurality of first elements.

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