A bending machine convenient for Z-bending flat wire with holes

Abstract

The present invention discloses a bending machine that is convenient for Z-bending flat wire with holes, which relates to the field of flat wire processing, including a feeding device seat, one side of the feeding device seat is connected to a bending processing table, and the side wall of the bending processing table is installed with a copper bar vertical bending elbow mechanism and a copper bar Z-bending mechanism, a flat wire is placed inside the feeding device seat, a stamping platform is installed inside the feeding device seat, and a turret is installed on the top of the stamping platform, and the turret includes a supporting plate and a turntable. The present invention is provided with a turret, a stamping die, a movable support plate and a cleaning mechanism, so that when processing the flat wire, the grinding motor drives the movable support plate to rotate, thereby grinding and cleaning the edge burrs of the flat wire punching holes, and after cleaning, the waste chips will be discharged through the guide groove in the movable support plate, and then the waste chips will be recovered by the cleaning mechanism, thereby avoiding unnecessary wear of the flat wire by the waste chips and improving the cleaning effect.

Description

Technical Field

[0001] The invention relates to the field of flat wire processing, in particular to a bending machine which is convenient for Z-bending a flat wire with a hole. Background Art

[0002] Flat wire, also known as flat wire, flattened wire, flat-angle wire or ultra-narrow strip, refers to a special-shaped metal wire with a cross-section that is approximately a rounded rectangle. Due to its ribbon-like shape, it is sometimes also called an ultra-narrow flat strip. Compared with common round wire, flat wire has unique advantages in heat dissipation, welding contact area, fatigue resistance, and hardness control. During the processing of flat wire, holes will be opened on the surface of the flat wire according to its use, and then the flat wire will be bent at multiple angles according to actual conditions to facilitate its use.

[0003] However, in the prior art, holes of different diameters are punched on the flat wire according to processing needs. For this purpose, multiple sets of punching structures are installed during punching. Different punching structures are driven by motors to move above the flat wire according to needs, and punching heads of different diameters are moved above the flat wire for punching. This causes the punching mechanism to be too large, resulting in a bloated use process (reciprocating movement is required to drive the punching structure to move reciprocatingly above the flat wire). In addition, during the punching process, a suitable receiving seat needs to be selected according to different punching heads for support to ensure that the blanking port of the receiving seat is consistent with the punching head, thereby reducing the deformation of the punching edge of the flat wire. However, the punching process also causes protruding burrs on the punching edge. After the prior art supports the receiving seat, it is difficult to process the burrs, resulting in the need for further processing, which increases the processing steps and difficulty (especially after the flat wire is bent into multiple groups of shapes, it is even more difficult to process the burrs). Summary of the Invention

[0004] Based on this, the purpose of the present invention is to provide a bending machine that is convenient for Z-bending of flat wire with holes, so as to solve the technical problem.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a bending machine that is convenient for Z-bending flat wire with holes, comprising a feeding device seat, one side of the feeding device seat is connected to a bending processing table, and the side wall of the bending processing table is installed with a copper bar vertical bending head mechanism and a copper bar Z-bending mechanism, a flat wire is placed inside the feeding device seat, a stamping platform is installed inside the feeding device seat, a turret is installed on the top of the stamping platform, the turret includes a carrying plate and a turntable, a servo motor is arranged above the turntable, the turntable is divided into upper and lower layers, the upper layer of the turntable is installed with multiple groups of stamping dies, and the lower layer of the turntable is installed with multiple groups of movable pressing tools that match the stamping dies. The movable support plate, the flat wire passes through the stamping die and the movable support plate, the bottom end of the stamping die is provided with a stamping head, and the inside of the movable support plate is provided with a hole matching the stamping head, the outside of the stamping die is provided with a connecting spring, the stamping die is movably connected to the turntable through the connecting spring, the inside of the supporting plate is provided with a grinding motor, the grinding motor is connected to the movable support plate by transmission, the stamping platform is located above the turret and is provided with a punching boost cylinder, the output end of the punching boost cylinder is engaged with the stamping die for transmission, the stamping platform is located at one end of the turret and is provided with a cleaning mechanism, one side of the cleaning mechanism is provided with multiple groups of suction pipes, and the suction pipes are aligned with the movable support plate.

[0006] By adopting the above technical solution, different stamping dies can be driven by the turntable to move to the bottom of the punching booster cylinder, so that the flat wire can be punched with holes of different specifications. After punching, the punched holes of the flat wire can be polished by the rotating movable support plate to reduce the burrs of the punching, and the negative pressure generated by the cleaning mechanism after punching can collect the cleaned waste chips.

[0007] The present invention is further configured such that a control panel is installed on the outside of the stamping platform, and a cutting mechanism is installed on the side of the stamping platform close to the copper bar Z-bending mechanism, and the flat wire passes through the cutting mechanism. The cutting mechanism includes a cutting cylinder, a cutting head, and a limit frame, and the flat wire is located between the cutting head and the limit frame.

[0008] By adopting the above technical solution, the processed flat wire can be cut by the cutting mechanism, which facilitates the processing of the flat wire.

[0009] The present invention is further configured such that the turret is fixed above the stamping platform, a buffer plate is installed on the top of the supporting plate on one side of the turntable, a mounting bracket is provided at the bottom end of the buffer plate, the grinding motor is installed inside the mounting bracket, and the buffer plate and the turntable are located below the flat wire to support the flat wire.

[0010] By adopting the above technical solution, the impact force on the turntable during the punching process can be reduced, thereby reducing the deformation of the turntable and improving the punching efficiency.

[0011] The present invention is further configured such that the specifications of the punch heads within each set of the punching dies are different, and the specifications of the internal cavity of the movable support plate matched with each set of the punching dies match the specifications of the nearest punch head. The punch heads punch holes in the flat wire, and the waste generated is discharged through the internal cavity of the movable support plate.

[0012] By adopting the above technical solution, it is convenient to perform punching processing of different specifications on flat wires.

[0013] The present invention is further configured such that a fixing bracket is installed on the outer side of the punching and boosting cylinder, the servo motor is fixed to the bottom end of the fixing bracket, the output end of the servo motor is fixedly connected to the turntable, and the servo motor drives the turntable to rotate.

[0014] By adopting the above technical solution, the servo motor can be easily fixed and limited.

[0015] The present invention is further configured such that a groove is provided at the output end of the punching booster cylinder, and an electromagnet is installed above the groove at the output end of the punching booster cylinder. A limiting groove is provided at the top of each group of the stamping dies, and a magnetic ring is movably connected inside the limiting groove. When the stamping die moves to the bottom of the output end of the punching booster cylinder, the magnetic attraction generated by the electromagnet moves the magnetic ring into the groove, and the lower half of the magnetic ring is also located inside the limiting groove. Multiple groups of ball bearings are also provided around the magnetic ring at the top of the stamping die.

[0016] By adopting the above technical solution, the punching booster cylinder can be conveniently connected to the stamping die, thereby avoiding the deviation of the stamping die during the stamping process.

[0017] The present invention is further configured such that the stamping die is provided with a protruding ring on the outer side below the upper layer of the turntable, the top end of the protruding ring is connected to a connecting spring, and the stamping die is movably connected to the turntable via the connecting spring.

[0018] By adopting the above technical solution, the stamping die can be easily moved up and down and return to its original position after stamping is completed.

[0019] The present invention is further configured such that a driven tooth is provided on the outer side of the movable support plate, a driving tooth is connected to the output end of the grinding motor, the movable support plate is transmission-connected to the grinding motor through the driven tooth, a support ring is provided on the top of the movable support plate, the movable support plate is engaged with the lower limit of the turntable through the support ring, the inner wall of the movable support plate is provided with multiple groups of lead-out grooves, and the top of the lead-out groove extends to the middle position of the top of the support ring and is connected to the cavity, and the bottom end of the lead-out groove extends to the outer wall of the movable support plate and is aligned with the suction pipe.

[0020] By adopting the above technical solution, the movable support plate can be easily rotated, so that the flat wire after punching can be polished. During the polishing process, the waste chips generated by polishing can be discharged through the discharge groove. As the movable support plate rotates, the waste chips can be discharged more conveniently through centrifugal force, thereby improving the discharge effect.

[0021] The present invention is further configured such that a support gasket is provided at the top of the stamping platform, and the support gasket extends to the interior of the turret and fits into the bottom of the turntable. Extension plates are provided at both ends of the support gasket. When the turntable rotates, the extension plates are retracted into the interior of the support gasket. When punching is performed, the extension plates are expanded and arranged around the movable support plate.

[0022] By adopting the above technical solution, the impact force when punching the turntable can be reduced, the stability of the turntable can be improved, and the waste chips generated during the grinding process can be collected by the extension plate.

[0023] The present invention is further configured such that a fan and a filter element are installed inside the cleaning mechanism, a handle extending to the outside of the cleaning mechanism is provided at the top of the filter element, and the filter element is located between the fan and the intake pipe, and the end of the intake pipe is an inclined surface, so that when the movable support plate rotates, the intake pipe does not hinder the rotation of the movable support plate.

[0024] By adopting the above technical solution, waste chips can be easily recycled, and during the recycling process, the waste chips can be collected by the filter element for easy recycling.

[0025] In summary, the present invention mainly has the following beneficial effects:

[0026] 1. The present invention effectively reduces the number of punching booster cylinders by setting a turret, a punching die and multiple groups of movable support plates, and can punch holes of different diameters for flat wires. The punching head can be replaced by a turntable structure, which is convenient for subsequent maintenance and replacement of the punching head. Before punching, the punching die can be conveniently connected to the punching booster hole, which improves the stability of the punching. During the punching process, the movable support plate can effectively support and limit the edge position of the flat wire punching hole, thereby effectively reducing the deformation of the flat wire punching edge during the punching process and improving the punching effect.

[0027] 2. The present invention is equipped with a turret, a stamping die, a movable support plate and a cleaning mechanism. When processing the flat wire, the grinding motor drives the movable support plate to rotate, thereby grinding and cleaning the burrs on the edge of the flat wire punching hole. After cleaning, the waste chips will be discharged through the guide groove in the movable support plate, and then the waste chips will be recovered by the cleaning mechanism, thereby avoiding unnecessary wear of the flat wire by the waste chips and improving the cleaning effect.

[0028] 3. The present invention can limit the turntable by the support ring during the punching process, thereby reducing the deformation of the turntable during the punching process, and seal the movable support plate during grinding by the support ring, thereby effectively reducing the splashing of waste chips during the grinding process and improving the effect of waste chip recovery. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of the present invention;

[0030] Figure 2 This is a schematic diagram of the installation position of the turntable punching mechanism of the present invention;

[0031] Figure 3 This is a schematic diagram of the installation of the rotary punching mechanism and the flat wire of the present invention;

[0032] Figure 4 It is a schematic structural diagram of the rotary disc punching mechanism of the present invention;

[0033] Figure 5 This is a schematic diagram of the exploded structure of the rotary disc punching mechanism of the present invention;

[0034] Figure 6 Schematic diagram of the cross-sectional structure of the punching and boosting cylinder of the present invention;

[0035] Figure 7 Schematic diagram of the cross-sectional structure of the turntable punching of the present invention;

[0036] Figure 8 For the present invention Figure 7 A schematic diagram of the partially enlarged structure at center A;

[0037] Figure 9 This is a schematic structural diagram of the buffer pad of the present invention;

[0038] Figure 10 It is a schematic diagram of the cleaning mechanism and movable support plate structure of the present invention;

[0039] Figure 11 It is a schematic diagram of the cross-sectional structure of the movable support plate of the present invention.

[0040] In the figure: 1. Feeding device base; 2. Bending table; 201. Control panel; 202. Punching platform; 203. Cutting mechanism; 3. Copper bar vertical bending mechanism; 4. Copper bar Z-bending mechanism; 5. Turret; 501. Carrying plate; 502. Turntable; 503. Servo motor; 504. Buffer plate; 505. Mounting bracket; 506. Grinding motor; 5061. Driving gear; 507. Support ring; 5 08. Extension plate; 6. Punching booster cylinder; 601. Fixing bracket; 602. Electromagnet; 7. Stamping die; 701. Punching head; 702. Magnetic ring; 703. Limiting groove; 704. Protruding ring; 705. Connecting spring; 706. Ball; 8. Movable support plate; 801. Driven gear; 802. Lead-out groove; 803. Support ring; 9. Cleaning mechanism; 901. Filter element; 902. Intake pipe; 10. Flat wire. DETAILED DESCRIPTION

[0041] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be understood as limiting the present invention.

[0042] The following describes an embodiment of the present invention based on its overall structure.

[0043] A bending machine that is convenient for Z-bending flat wire with holes, such as Figures 1 to 10As shown, it includes a feeding device seat 1, one side of the feeding device seat 1 is connected to a bending processing table 2, and the side wall of the bending processing table 2 is installed with a copper bar vertical bending bending head mechanism 3 and a copper bar Z-bending mechanism 4, a flat wire 10 is placed inside the feeding device seat 1, which can drive the flat wire 10 to move inside the bending machine, a stamping platform 202 is installed inside the feeding device seat 1, a turret 5 is installed on the top of the stamping platform 202, the stamping platform 202 is located above the turret 5 and a punching booster cylinder 6 is installed, the turret 5 includes a carrying plate 501 and a turntable 502, the turntable 502 A servo motor 503 is provided on the top, and a fixing frame 601 is installed on the outside of the punching boost cylinder 6. The servo motor 503 is fixed to the bottom end of the fixing frame 601. The output end of the servo motor 503 is fixedly connected to the turntable 502. The servo motor 503 drives the turntable 502 to rotate. The turntable 502 is divided into an upper and a lower layers. The upper layer of the turntable 502 is equipped with multiple groups of stamping dies 7. The output end of the punching boost cylinder 6 is engaged with the stamping die 7 for transmission. The lower layer of the turntable 502 is equipped with multiple groups of movable support plates 8 that match the stamping die 7. The flat wire 10 passes through the stamping die 7 and the movable support plates 8. Between the movable support plates 8, a punching head 701 is provided at the bottom end of the punching die 7, and a hole matching the punching head 701 is provided inside the movable support plate 8. A groove is provided at the output end of the punching booster cylinder 6. An electromagnet 602 is installed above the output end of the punching booster cylinder 6. A limiting groove 703 is provided at the top of each set of punching dies 7, and a magnetic ring 702 is movably connected inside the limiting groove 703. When the punching die 7 moves to the bottom of the output end of the punching booster cylinder 6, the magnetic attraction generated by the electromagnet 602 attracts the magnetic ring 702 to move into the groove, and the magnetic ring 7 The lower half of 02 is also located inside the limiting groove 703, thereby limiting the horizontal position of the stamping die 7. A plurality of sets of balls 706 are provided around the top of the stamping die 7 surrounding the magnetic ring 702. The stamping die 7 is located on the outer side below the upper layer of the turntable 502 and is provided with a protruding ring 704. The top of the protruding ring 704 is connected to a connecting spring 705. The stamping die 7 is movably connected to the turntable 502 through the connecting spring 705. At this time, the punching booster cylinder 6 is started, and its output end moves downward to extrude the stamping die 7 downward, so that the punching head 701 punches the flat wire 10.

[0044] A grinding motor 506 is installed inside the carrier plate 501, and a driven gear 801 is provided on the outer side of the movable support plate 8. The output end of the grinding motor 506 is connected to the driving gear 5061. The movable support plate 8 is transmission-connected to the grinding motor 506 through the driven gear 801. A support ring 803 is provided on the top of the movable support plate 8. The movable support plate 8 is engaged with the lower limit of the turntable 502 through the support ring 803. The inner wall of the movable support plate 8 is provided with multiple groups of lead-out grooves 802, and the top of the lead-out groove 802 extends to the middle position of the top of the support ring 803 and is connected to the cavity. The bottom end of the lead-out groove 802 extends to the outer wall of the movable support plate 8. A support pad ring 507 is provided on the top of the stamping platform 202, and the support pad ring 507 extends to the inside of the turret 5 and fits with the bottom end of the turntable 502. Extension plates 508 are provided at both ends of the support pad ring 507. When the turntable 502 rotates, it extends The plate 508 is received inside the support pad ring 507. When punching is in progress, the extension plate 508 is unfolded and arranged around the movable support plate 8. The stamping platform 202 is located at one end of the turret 5 and a cleaning mechanism 9 is installed. One side of the cleaning mechanism 9 is provided with multiple groups of suction pipes 902, and the suction pipes 902 are aligned with the movable support plate 8. The waste material punched down passes through the hole of the movable support plate 8 and falls to the bottom of the stamping platform 202. The rotating movable support plate 8 grinds and cleans the burrs protruding from the punching holes at the bottom end of the flat wire 10 through the top grinding block, and discharges the waste generated by grinding through the guide groove 802. The cleaning mechanism 9 is started, and the fan in the cleaning mechanism 9 generates negative pressure through the suction pipe 902 to the surrounding of the movable support plate 8, and absorbs and collects the waste discharged from the guide groove 802, and filters and collects the waste through the filter element 901, thereby reducing pollution to the processing environment and improving the processing effect.

[0045] See also Figure 1 and Figure 2 A control panel 201 is installed on the outside of the stamping platform 202, and a cutting mechanism 203 is installed on the side of the stamping platform 202 close to the copper busbar Z-bending mechanism 4. The flat wire 10 passes through the cutting mechanism 203. The cutting mechanism 203 includes a cutting cylinder, a cutting head, and a limit frame. The flat wire 10 is located between the cutting head and the limit frame, which can facilitate the bending of the flat wire 10 after punching, and after bending, the flat wire 10 is cut off by the cutting mechanism 203.

[0046] See also Figure 7 and Figure 8 The turret 5 is fixed above the stamping platform 202, and the top of the carrying plate 501 is located on one side of the turntable 502 and is equipped with a buffer plate 504. The bottom end of the buffer plate 504 is provided with a mounting bracket 505, and the grinding motor 506 is installed inside the mounting bracket 505. The buffer plate 504 and the turntable 502 are located below the flat wire 10 to support the flat wire 10. During the punching process of the flat wire 10, the buffer plate 504 can provide auxiliary support to the flat wire 10 to reduce the impact on the turntable 502.

[0047] See also Figure 5 and Figure 7 The specifications of the punch heads 701 within each set of punching dies 7 are different, and the specifications of the internal cavity of the movable support plate 8 corresponding to each set of punching dies 7 match those of the nearest punch head 701. When the punch heads 701 punch holes in the flat wire 10, the waste material is discharged through the internal cavity of the movable support plate 8, making it easy to punch holes of different specifications in the flat wire 10 and expanding the processing range.

[0048] See also Figure 7 and Figure 10 A fan and a filter element 901 are installed inside the cleaning mechanism 9. A handle extending to the outside of the cleaning mechanism 9 is provided at the top of the filter element 901, and the filter element 901 is located between the fan and the intake pipe 902. The end of the intake pipe 902 is an inclined surface. When the movable support plate 8 rotates, the intake pipe 902 does not hinder the rotation of the movable support plate 8, and can conveniently collect the waste chips after grinding, and collect the waste chips through the filter element 901.

[0049] When processing the flat wire 10, first straighten the flat wire 10 through the feeding device seat 1, and the transport roller conveys the flat wire 10 to the turret 5. At this time, according to the size of the punching hole required, a suitable punching head 701 is selected, and the servo motor 503 is powered on. The servo motor 503 drives the turntable 502 to rotate, and drives the stamping die 7 on the turntable 502 and the matching movable support plate 8 to rotate synchronously until the suitable punching head 701 moves to the top of the flat wire 10. The electromagnet 602 is started to generate a magnetic force that attracts the magnetic ring 702. Under the action of the magnetic force, the magnetic ring 702 is located in the limit groove 703 and the punching hole. The hole boosting cylinder 6 is slotted at the bottom end, thereby limiting the horizontal position of the stamping die 7 to prevent the stamping die 7 from shifting during the stamping process. At the same time, the movable support plate 8 also rotates to the vicinity of the grinding motor 506, and engages with the active tooth 5061 of the grinding motor 506 through the outer driven tooth 801, and opens the extension plate 508 to block the bottom of the movable support plate 8 (the extension plate 508 can be driven by a motor, a cylinder, etc.), and then starts the grinding motor 506, and drives the movable support plate 8 to rotate below the flat wire 10 through the active tooth 5061. Then, the flat wire 10 needs to be punched, and the motor is started at this time. The output end of the dynamic punching booster cylinder 6 moves downward to extrude the punching die 7 downward, so that the punching head 701 punches the flat wire 10. During the punching process, the support ring 507 is used to limit the turntable 502 to reduce the deformation of the turntable 502, and the buffer plate 504 is used to partially support the flat wire 10 to reduce the impact force directly acting on the turntable 502, thereby improving the service life of the turntable 502. The punched waste passes through the hole of the movable support plate 8 and falls to the bottom of the punching platform 202. The rotating movable support plate 8 passes through the top grinding block (not shown in the figure, the specific shape needs to be determined according to the punching The situation is determined, generally a frosting sheet is used to grind and clean the burrs protruding from the punching holes at the bottom end of the flat wire 10, and the waste chips generated by grinding are discharged through the guide groove 802. The cleaning mechanism 9 is started, and the fan in the cleaning mechanism 9 generates negative pressure and reaches the surrounding area of the movable support plate 8 through the suction pipe 902, and absorbs and collects the waste chips discharged from the guide groove 802 (at this time, the support pad ring 507 and the extension plate 508 surround the lower outer side of the movable support plate 8, thereby isolating and limiting the external airflow and waste chips to prevent the waste chips from splashing). The waste chips are filtered and collected by the filter element 901, thereby reducing pollution to the processing environment and improving the processing effect;

[0050] After the punching is completed, if the size of the subsequent punching needs to be adjusted, the electromagnet 602 is reversely started, so that the electromagnet 602 generates a magnetic force that repels the magnetic ring 702, pressing the magnetic ring 702 into the limiting groove 703, releasing the connection between the punching die 7 and the punching booster cylinder 6, and then starting the servo motor 603 to drive the turntable 502 to rotate, moving the punching die 7 of other specifications to the bottom of the punching booster cylinder 6, thereby facilitating the punching of different specifications of the flat wire 10;

[0051] After the punching process is completed, the punching booster cylinder 6 is started to move the punching head 701 out of the punching hole in the flat wire 10, and the feeding device seat 1 is started to drive the flat wire 10 to move. The flat wire 10 moves to the bending position after passing through the cutting knife group. According to the bending requirements, the flat wire 10 is bent and deformed by the copper bar vertical bending bending head mechanism 3 and the copper bar Z-bending mechanism 4 (while bending, the flat wire 10 is punched by the punching structure, thereby improving the processing efficiency). After bending, the cylinder of the cutting mechanism 203 is started to drive the cutting knife group to cut the flat wire 10, completing the processing of the flat wire 10.

[0052] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in an appropriate manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiment without creative contribution as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A bending machine for Z-bending a flat wire with a hole, comprising a feeding device seat (1), one side of the feeding device seat (1) is connected to a bending processing table (2), and a copper bar vertical bending bending head mechanism (3) and a copper bar Z-bending mechanism (4) are installed on the side wall of the bending processing table (2), a flat wire (10) is placed inside the feeding device seat (1), and is characterized in that: A punching platform (202) is installed inside the feeding device seat (1), and a turret (5) is installed on the top of the punching platform (202). The turret (5) includes a supporting plate (501) and a turntable (502). A servo motor (503) is provided above the turntable (502). The turntable (502) is divided into two layers, the upper layer of the turntable (502) is provided with multiple groups of punching dies (7), and the lower layer of the turntable (502) is provided with multiple groups of movable support plates (8) matching the punching dies (7). The flat wire (10) passes between the punching dies (7) and the movable support plates (8). A punching head (701) is provided at the bottom end of the punching die (7), and a movable support plate (8) is provided inside to match the punching head (701). Matching hollows, the outer side of the punching die (7) is installed with a connecting spring (705), the punching die (7) is movably connected to the turntable (502) through the connecting spring (705), the interior of the carrier plate (501) is installed with a grinding motor (506), the grinding motor (506) is transmission-connected to the movable support plate (8), the punching platform (202) is located above the turret (5) and is installed with a punching boost cylinder (6), the output end of the punching boost cylinder (6) is engaged with the punching die (7) for transmission, the punching platform (202) is located at one end of the turret (5) and is installed with a cleaning mechanism (9), a plurality of suction pipes (902) are provided on one side of the cleaning mechanism (9), and the suction pipes (902) are aligned with the movable support plate (8); The output end of the punching boosting cylinder (6) is provided with a groove, and the output end of the punching boosting cylinder (6) is located above the groove and an electromagnet (602) is installed. The top of each group of the punching dies (7) is provided with a limiting groove (703), and the inside of the limiting groove (703) is movably connected with a magnetic ring (702). When the punching die (7) moves to the bottom of the output end of the punching boosting cylinder (6), the magnetism generated by the electromagnet (602) attracts the magnetic ring (702) to move into the groove, and the lower half of the magnetic ring (702) is also located inside the limiting groove (703). The top of the punching die (7) is also provided with multiple groups of balls (706) surrounding the magnetic ring (702); The outer side of the movable support plate (8) is provided with a driven tooth (801), the output end of the grinding motor (506) is connected with a driving tooth (5061), the movable support plate (8) is connected to the grinding motor (506) through the driven tooth (801), the top of the movable support plate (8) is provided with a support ring (803), the movable support plate (8) is engaged with the lower limit of the turntable (502) through the support ring (803), the inner wall of the movable support plate (8) is provided with multiple groups of guide grooves (802), and the top of the guide groove (802) extends to the middle position of the top of the support ring (803) and is connected to the cavity, and the bottom end of the guide groove (802) extends to the outer wall of the movable support plate (8) and is aligned with the suction pipe (902); A support ring (507) is provided at the top of the punching platform (202), and the support ring (507) extends to the inside of the turret (5) and fits with the bottom of the turntable (502). Extension plates (508) are provided at both ends of the support ring (507). When the turntable (502) rotates, the extension plates (508) are received in the support ring (507). When punching is being performed, the extension plates (508) are unfolded and arranged around the movable support plate (8); A fan and a filter element (901) are installed inside the cleaning mechanism (9), and a handle extending to the outside of the cleaning mechanism (9) is provided at the top of the filter element (901). The filter element (901) is located between the fan and the suction pipe (902). The end of the suction pipe (902) is an inclined surface. When the movable support plate (8) rotates, the suction pipe (902) does not hinder the rotation of the movable support plate (8).

2. A bending machine for Z-shaped bending of a flat wire with a hole according to claim 1, characterized in that: A control panel (201) is installed on the outside of the punching platform (202), and a cutting mechanism (203) is installed on the side of the punching platform (202) close to the copper bar Z-bending mechanism (4). The flat wire (10) passes through the cutting mechanism (203). The cutting mechanism (203) comprises a cutting cylinder, a cutting head, and a limiting frame. The flat wire (10) is located between the cutting head and the limiting frame.

3. A bending machine for Z-shaped bending of a flat wire with a hole according to claim 1, characterized in that: The turret (5) is fixed above the punching platform (202); the top end of the carrier plate (501) is located on one side of the turntable (502) and is provided with a buffer plate (504); the bottom end of the buffer plate (504) is provided with a mounting bracket (505); the grinding motor (506) is installed inside the mounting bracket (505); the buffer plate (504) and the turntable (502) are located below the flat wire (10) to support the flat wire (10).

4. A bending machine for Z-shaped bending of a flat wire with a hole according to claim 1, characterized in that: The specifications of the punching heads (701) inside each set of the punching dies (7) are different, and the specifications of the internal cavities of the movable support plates (8) matched with each set of the punching dies (7) are matched with the specifications of the nearest punching heads (701). The punching heads (701) punch the flat wires (10), and the waste generated is discharged through the internal cavities of the movable support plates (8).

5. The bending machine for Z-shaped bending of perforated flat wire according to claim 1, characterized in that: A fixing frame (601) is installed on the outer side of the punching and boosting cylinder (6), the servo motor (503) is fixed to the bottom end of the fixing frame (601), the output end of the servo motor (503) is fixedly connected to the turntable (502), and the servo motor (503) drives the turntable (502) to rotate.

6. The bending machine for Z-shaped bending of perforated flat wire according to claim 1, characterized in that: The punching die (7) is located below the upper layer of the turntable (502) and is provided with a protruding ring (704) on the outer side. The top end of the protruding ring (704) is connected to a connecting spring (705). The punching die (7) is movably connected to the turntable (502) via the connecting spring (705).

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