A control method for an eight-cavity precision stamping die system for a sub-beam gasket.

Abstract

This invention discloses a control method for an eight-cavity precision stamping die system for sub-beam gaskets. The system includes an upper die assembly for transmitting blank holder force during product strip processing, and a lower die assembly below the upper die assembly for transmitting counter-pressure during product strip processing. A cavity for inputting the product strip to be processed is provided between the upper and lower die assemblies. The upper die assembly includes a punch assembly for transmitting blank holder force to the product strip, and the lower die assembly includes a punch assembly for transmitting counter-pressure to the product strip. The upper die assembly also includes a waste discharge assembly for discharging waste generated during product strip processing. This invention overcomes the problem of low production quality in gasket-type products produced by traditional die processing equipment in the prior art. This invention has the advantage of producing high-quality gaskets.

Description

Technical Field

[0001] This invention relates to the field of mold processing equipment, and more specifically, to a control method for an eight-cavity precision stamping mold system for a sub-beam gasket. Background Technology

[0002] Currently, a mold gasket and mold clamping structure are disclosed on the Chinese patent website (publication number CN208214095U). The mold gasket has a fixing groove and several first fixing holes. The fixing groove is offset from the center of the mold gasket, and the first fixing holes are distributed on opposite sides of the mold gasket. The mold has several fixing parts, each fixing part having at least two mating grooves and several second fixing holes. The first fixing holes correspond to the second fixing holes, and one mating groove coincides with the fixing groove. When it is necessary to switch the bed, if the T-slot positions of the two bed beds that can be clamped are relatively close, when the mold gasket is flipped and fitted with the fixing part, the fixing groove coincides with another mating groove, avoiding the problem of the clamping distance being too close and affecting safety. This improves the safety performance of mold clamping and facilitates the use by workers.

[0003] Sub-beam gaskets are components used in solar thermal power generation systems. Figure 1 Its characteristics are: huge usage, with a single project requiring approximately 15 million gaskets; thin material, the gaskets are made of stainless steel with thicknesses of 0.3mm, 0.4mm, 0.5mm, 1.0mm, and 2.0mm; high requirements for flatness and burrs, as the gaskets require automated feeding during installation, the flatness requirement is 0.05mm Max, and the products must be free of burrs.

[0004] Due to the aforementioned characteristics of the sub-beam gaskets, the following issues need to be addressed in the mold design: The large quantity of gaskets makes full inspection impossible; the mold must ensure stable product quality during production. The mold needs to be multi-cavity and capable of high-speed processing to meet customer capacity requirements. The dimensions of each cavity must be consistent, and the position of the rivet holes relative to the outer shape must remain consistent. Each cavity must ensure its own flatness meets the 0.05mm Max requirement and maintain a consistent flatness trend with products from other cavities. Burrs must be controlled during mass production, avoiding localized burrs, edge burrs, or burrs around holes. The product surface must be free of oil, water, or other liquids to prevent adhesion between products. Because of multi-cavity production, waste material from holes can easily mix into the finished product; this must be avoided. The product surface must be free of obvious dents and deformation.

[0005] Based on the above requirements, although the mold gasket and mold clamping structure in the aforementioned patent have the advantages of high safety and ease of use for workers, it is still very difficult to meet the above requirements. Special auxiliary production systems need to be added to the equipment and mold, such as video detection, external pressure detection system, and feeding leveling system.

[0006] Furthermore, using standard testing methods for quality control results in a high product scrap rate, reaching 10% to 12%, and the possibility of customer complaints. To improve this situation, it's necessary to increase sampling frequency and add more quality specialists to ensure products meet quality requirements. This approach could reduce the scrap rate to around 5% to 8%, preventing serious customer complaints. However, adding more specialists would result in costs exceeding revenue. Summary of the Invention

[0007] In order to overcome the problem of low production quality of traditional mold processing equipment in the production of gasket products, this invention provides a control method for a single-mold eight-cavity precision stamping mold system for sub-beam gaskets, which has the advantage of high production efficiency.

[0008] The control method of the present invention is as follows:

[0009] 1) Before starting work, first assemble the upper die assembly and the lower die assembly of the fine blanking die. After assembling the upper die assembly and the lower die assembly, a mold cavity is formed. Then, install the upper die assembly and the lower die assembly onto the processing position in the fine blanking machine.

[0010] 2) During operation, the product strip is first uncoiled and leveled. During uncoiling and leveling, the product strip is first loaded onto the input wheel shaft of the leveling machine and then introduced into the leveling machine for leveling.

[0011] 3) After being leveled by the leveling machine, the product strip is fed into the mold cavity composed of the upper mold assembly and the lower mold assembly;

[0012] 4) After the product strip reaches the mold cavity, the upper hydraulic cylinder of the fine blanking machine located above the upper mold assembly starts to work. The piston rod of the upper hydraulic cylinder extends downward and abuts against the upper mold assembly, driving the upper mold assembly to close close to the lower mold assembly until the concave plate of the lower mold assembly is in contact with the lower surface of the product strip and the unloading plate of the upper mold assembly is in contact with the upper surface of the product strip. At this time, the upper mold assembly and the lower mold assembly reach the pressure point respectively. At this time, the first infrared sensor J6 located at the left end of the upper mold assembly calculates the distance h1 between the first infrared sensor J6 and the upper surface of the product strip. At the same time, the second infrared sensor J7 located at the left end of the lower mold assembly calculates the distance h2 between the second infrared sensor J7 and the lower surface of the product strip.

[0013] 5) When h1 equals h2, this is the optimal pressure point for the product strip, and the upper hydraulic cylinder of the fine blanking machine begins to apply pressure to the upper die assembly;

[0014] 6) When h1 is less than h2, the optimal pressure point for the product strip has not been reached. The upper hydraulic cylinder of the fine blanking machine needs to continue pressing down on the upper die assembly until h1 equals h2. When h1 is greater than h2, the overpressure point for the product strip has been reached. The piston rod of the upper hydraulic cylinder of the fine blanking machine located above the upper die assembly needs to retract, while the piston rod of the lower hydraulic cylinder of the fine blanking machine located below the lower die assembly extends to drive the lower die assembly to move upward until h1 equals h2.

[0015] 7) After reaching the optimal pressure point, the piston rod of the hydraulic cylinder located above the upper mold assembly begins to exert a pressing force on the upper mold assembly, and the piston rod of the hydraulic cylinder located below the lower mold assembly begins to exert a counter-pressure on the lower mold assembly.

[0016] 8) The blank holder force and the counter-pressure force are applied simultaneously. When the blank holder force is greater than the counter-pressure force, the die float decreases to 0. The punch installed on the die platen punches into the product strip and performs stamping on the product strip. The generated waste is discharged from the waste discharge through hole in the die. When the die float is 0, the punching force is greater than the blank holder force. The distance that pushes the stripper plate upward is the thickness of the product strip + 0.2mm. Under the pressure of the fine blanking machine, the punch carries the product strip into the punch assembly and cuts the product strip into the shape of the sub-beam gasket. After that, the blank holder force and the counter-pressure force begin to be released until they are 0.

[0017] 9) Then, the upper mold assembly and the lower mold assembly are gradually separated. When the distance between the lower mold assembly and the upper mold assembly is 3 times the thickness of the product strip, the hydraulic press located above the upper mold assembly works again and acts on the stripper plate to push the product strip away from the die. When the distance between the lower mold assembly and the upper mold assembly is 5 times the thickness of the strip, the hydraulic press located below the lower mold assembly works again and acts on the ejector to push the product out of the die plate.

[0018] 10) After the product is ejected from the die, delay for about 1-2 seconds, and use a blower to blow out the waste material. Then the upper die assembly and the lower die assembly continue to separate. After the distance between the upper die assembly and the lower die assembly reaches 40mm, the unprocessed product strip can be fed in, and the stamping is completed.

[0019] Preferably, the fine punching machine is equipped with an electrical control cabinet for controlling the inlet pump SJYG of the upper hydraulic cylinder, the outlet pump SCYG of the upper hydraulic cylinder, the inlet pump XJYB of the lower hydraulic cylinder, the outlet pump XCYB of the lower hydraulic cylinder, the first infrared sensor J6, and the second infrared sensor J7. The electrical control cabinet is equipped with a power supply circuit for providing electrical energy, and the electrical control cabinet located to the right of the power supply circuit is equipped with a control circuit for use in conjunction with the power supply circuit.

[0020] Preferably, the power supply circuit includes a power module M1, a switch K1, and a diode D1. Pin 1 of the power module M1 is electrically connected to the positive terminal of the diode D1, and the negative terminal of the diode D1 is electrically connected to one end of the switch K1. The other end of the switch K1 outputs +VCC, and pin 2 of the power module M1 is grounded. The control circuit includes a control chip U1, a crystal oscillator Y1, an infrared sensor J6, an infrared sensor J7, an inlet pump SJYB, an outlet pump SCQB, an inlet pump XJYB, an outlet pump XCQB, transistors Q1, Q2, Q3, and Q4, relays J2, J3, J4, and J5, resistors R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, and R11, switches K2, K3, and K4, capacitors C1 and C2, and a... The output end of the inlet pump SJYB is connected to the input end of the hydraulic cylinder of the fine-brushing machine via a pipe, and the input end of the outlet pump CQB is connected to the output end of the hydraulic cylinder of the fine-brushing machine via a pipe. Switches K1, K2, K3, and K4 are sequentially embedded on the front face of the electrical control cabinet from top to bottom. The control chip U1 is connected to the crystal oscillator Y1, infrared sensor J6 (number one), infrared sensor J7 (number two), inlet pump SJYB, and outlet pump CQB. Pump SCQB, inlet pump XJYB, outlet pump XCQB, transistors Q1, Q2, Q3, and Q4, relays J2, J3, J4, and J5, resistors R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, and R11, switches K2, K3, and K4, and capacitors C1, C2, and C3 are electrically connected.

[0021] Preferably, one end of the crystal oscillator Y1 is electrically connected to one end of capacitor C1 and pin 19 of control chip U1, and the other end of the crystal oscillator Y1 is electrically connected to one end of capacitor C2 and pin 18 of control chip U1. The other end of capacitor C1 is electrically connected to the other end of capacitor C2, and the other end of capacitor C1 is grounded. One end of resistor R1 is electrically connected to one end of switch K2, one end of capacitor C3, and pin 9 of control chip U1, and the other end of resistor R1 is grounded. The other end of switch K2 is electrically connected to the other end of capacitor C3, and the other end of switch K2 is connected to +VCC. Pin 31 of control chip U1 is connected to +VCC. Pin 1 of control chip U1 is electrically connected to one end of resistor R2, and the other end of resistor R2 is electrically connected to one end of switch K3, the other end of switch K3 is grounded. Pin 2 of control chip U1 is electrically connected to one end of resistor R3, and the other end of resistor R3 is electrically connected to one end of switch K4, the other end of switch K4 is grounded. Pin 4 of control chip U1 is electrically connected to pin 2 of infrared sensor J6, pin 5 of control chip U1 is electrically connected to pin 3 of infrared sensor J6, pin 1 of infrared sensor J6 is connected to +VCC, pin 4 of infrared sensor J6 is grounded, and pin 7 of control chip U1 is connected to infrared sensor J7. Pin 2 of the control chip U1 is electrically connected to pin 3 of the second infrared sensor J7. Pin 1 of the second infrared sensor J7 is connected to +VCC, and pin 4 of the second infrared sensor J7 is grounded. Pin 39 of the control chip U1 is electrically connected to one end of resistor R4. The other end of resistor R4 is electrically connected to the base of transistor Q1. The emitter of transistor Q1 is connected to +VCC. The collector of transistor Q1 is electrically connected to one end of resistor R5 and pin 5 of relay J2. The other end of resistor R5 is electrically connected to pin 6 of relay J2. Pins 1 and 2 of relay J2 are grounded. Pin 3 of relay J2... The relay J2 is connected to +VCC. Pin 4 is electrically connected to the positive terminal of the inlet pump SJYB, and the negative terminal of the inlet pump SJYB is grounded. Pin 38 of the control chip U1 is electrically connected to one end of resistor R6, and the other end of resistor R6 is electrically connected to the base of transistor Q2. The emitter of transistor Q2 is connected to +VCC. The collector of transistor Q2 is electrically connected to one end of resistor R7 and pin 5 of relay J3. The other end of resistor R7 is electrically connected to pin 6 of relay J3. Pins 1 and 2 of relay J3 are grounded. Pin 3 of relay J3 is connected to +VCC. Pin 4 of relay J3 is electrically connected to the positive terminal of the outlet pump SCYB.The negative terminal of the discharge pump SCYB is grounded. Pin 21 of the control chip U1 is electrically connected to one end of resistor R8. The other end of resistor R8 is electrically connected to the base of transistor Q3. The emitter of transistor Q3 is connected to +VCC. The collector of transistor Q3 is electrically connected to one end of resistor R9 and pin 5 of relay J4. The other end of resistor R9 is electrically connected to pin 6 of relay J4. Pins 1 and 2 of relay J4 are grounded. Pin 3 of relay J4 is connected to +VCC. Pin 4 of relay J4 is electrically connected to the positive terminal of the inlet pump XJYB. The negative terminal of the control chip U1 is grounded. Pin 20 of the control chip U1 is electrically connected to one end of resistor R10. The other end of resistor R10 is electrically connected to the base of transistor Q4. The emitter of transistor Q4 is connected to +VCC. The collector of transistor Q4 is electrically connected to one end of resistor R11 and pin 5 of relay J5. The other end of resistor R11 is electrically connected to pin 6 of relay J5. Pins 1 and 2 of relay J5 are grounded. Pin 3 of relay J5 is connected to +VCC. Pin 4 of relay J5 is electrically connected to the positive terminal of the discharge pump XCYB. The negative terminal of discharge pump XCYB is grounded.

[0022] Preferably, the upper mold assembly includes an upper template, with an upper template pad at the lower end of the upper template for supporting the upper template. Below the upper template pad is a stripper plate for unloading the processed product strip. Below the stripper plate is a stripper plate pad for supporting the stripper plate. There is a movable gap between the upper template pad and the stripper plate. The lower mold assembly includes a lower template, with a concave template above the lower template. Between the concave template and the lower template is a concave template pad for cooperating with the concave template. There is a floating gap between the lower end of the concave template and the concave template pad.

[0023] Preferably, the punch assembly includes a front punch assembly, and a rear punch assembly is provided on the rear side of the front punch assembly. The front punch assembly and the rear punch assembly are staggered. The front punch assembly and the rear punch assembly have the same structure and are both composed of four evenly distributed punches. The center of each punch has a through hole for discharging waste material longitudinally through the punch.

[0024] Preferably, the waste discharge component includes eight upper mold waste discharge slots formed at the upper end of the upper template, which cooperate with the in-mold waste discharge through holes to discharge waste generated during the processing of the product strip. The upper mold waste discharge slots are located directly above the in-mold waste discharge through holes and communicate with the in-mold waste discharge through holes.

[0025] Preferably, the punch assembly includes four dies embedded in the die plate. Each die is fitted with two punches that cooperate with the two punches directly above it. The upper end of each punch is fitted with a material ejector for ejecting the processed product strip. The upper end of the punch is embedded in the die plate, and the lower end of the punch is embedded in the die plate backing plate. The upper surface of the punch is parallel to the upper surface of the die, and the lower surface of the punch abuts against the upper surface of the lower die plate.

[0026] Preferably, the upper end of the punch is embedded in the upper template, the upper end of the punch abuts against the lower end of the upper die waste discharge groove, the neck of the punch is embedded in the upper die pad, the waist of the punch is embedded in the stripper plate pad, the lower end of the punch is embedded in the stripper plate, and the lower end face of the punch is parallel to the lower end face of the stripper plate.

[0027] Preferably, the upper template has bushing through holes that extend longitudinally through the upper template and the upper template pad at both its left and right ends. A guide bushing is embedded in the bushing through hole, and a guide post is inserted into the guide bushing. A ball bearing guide sleeve is fitted on the waist of the guide post and abuts against the inner wall of the bushing. The unloading plate pad has ball bearing through holes that extend longitudinally through the unloading plate pad and are used to embed the lower end of the ball bearing guide sleeve at both its left and right ends. The unloading plate has through holes that extend longitudinally through the unloading plate and are used to insert the guide post at both its left and right ends. A guide sleeve that extends longitudinally through the concave template and is used to insert the guide post is opened on the concave template directly below the guide post through hole. The upper template pad has upper hydraulic insert grooves that extend longitudinally through the upper template pad and the unloading plate pad at both its left and right ends. The concave template has lower hydraulic insert grooves that extend longitudinally through the concave template and the concave template pad at both its left and right ends.

[0028] The power module M1 can be of model HLK-20M12; the control chip U1 can be of model STC89C52. Before normal operation, the user can burn the required program into the control chip U1 using a programmer. Switch K2 can be used to reset the control chip U1. The inlet pump SJYB of the upper hydraulic cylinder of the fine-pressing machine is connected to the liquid output terminal of the external liquid storage device through a pipe; the outlet pump SCYB of the upper hydraulic cylinder of the fine-pressing machine is connected to the liquid input terminal of the external liquid storage device through a pipe; the inlet pump XJYB of the lower hydraulic cylinder of the fine-pressing machine is connected to the liquid output terminal of the external liquid storage device through a pipe; and the outlet pump XCYB of the lower hydraulic cylinder of the fine-pressing machine is connected to the liquid input terminal of the external liquid storage device through a pipe.

[0029] The leveling machine can be a 13-roll precision leveling machine, and the fine stamping machine can be a fine stamping hydraulic press.

[0030] After the product strip falls into the mold cavity, press switch K3. Infrared sensors J6 and J7 will start working and begin collecting h1 and h2 data in real time. Control chip U1 will compare and calculate based on the collected h1 and h2 data, and then control the upper and lower hydraulic cylinders accordingly. If a malfunction occurs during the process, switch K4 can be pressed to pause. After the malfunction is resolved, switch K3 can be pressed again to continue processing the product strip.

[0031] The upper template, upper template pad, unloading plate, unloading plate pad, concave template pad, and lower template of this invention are all made of Cr12MoV material with a hardness of 55-58HRC. The template height is within the range of +0.02, and the flatness and parallelism of the upper and lower surfaces of each template are within the range of 0.02Max.

[0032] The concave template and stripper plate of the present invention are precision plates and positioning reference plates of fine blanking dies. They are made of ASSAB88 material with a hardness of 59-60HRC.

[0033] The punch described is model ASP23 and is made of powder high-speed mold steel.

[0034] The aforementioned die is of model ASP23 and is made of powder high-speed mold steel.

[0035] The fine stamping machine can use SKH51 punches, which are made of high-speed die steel.

[0036] Mold guiding system installation instructions: The guide pillar and the stripper plate are interference fit with a clearance of 0.005~-0.015. Dry ice can be used for cold installation during storage; the clearance between the guide pillar and the guide sleeve is 0.0025~0.005.

[0037] Assembly Instructions for Core Mold Components: The clearance between the die and the die plate must be controlled within 0.005 mm on each side during installation. The clearance between the ejector pin and the die should be between 0.005 and 0.01 mm on each side. The clearance between the die and the stripper plate should be controlled within 0.005 mm on each side. The clearance between the punch and the ejector pin should be controlled within 0.01 mm on each side.

[0038] This invention has the following advantages: punching and blanking are completed in one step, resulting in high product precision with no cumulative error; the composite blanking under the action of three forces results in small deformation and higher flatness consistency; the cross-sectional quality is high and the burrs are small; the punching waste is discharged from the mold and separated from the product, reducing waste sorting and quality problems such as product surface damage and deformation caused by waste residue on the working surface of the mold; and the quality consistency is good. Attached Figure Description

[0039] Appendix Figure 1This is a schematic diagram of the process of the present invention.

[0040] Appendix Figure 2 This is the circuit schematic diagram of the present invention.

[0041] Appendix Figure 3 This is a schematic diagram of the punching punch of the present invention.

[0042] Appendix Figure 4 This is a schematic diagram of the guide post of the present invention.

[0043] Upper template 1, upper template pad 2, stripper plate 3, stripper plate pad 4, concave template 5, concave template pad 6, lower template 7, guide post 8, guide bushing 9, ball bearing guide bushing 10, upper hydraulic insert mold groove 11, lower hydraulic insert mold groove 12, guide bushing 13, concave mold 14, punching punch 15, in-mold waste discharge through hole 16, ejector part 17. Detailed Implementation

[0044] The technical solution of the present invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings.

[0045] Example: According to the appendix Figure 1 Appendix Figure 2 Appendix Figure 3 and attached Figure 4 To further illustrate this example, a control method for an eight-cavity precision stamping die system for a sub-beam gasket is described, wherein the control method is as follows:

[0046] 1) Before starting work, first assemble the upper die assembly and the lower die assembly of the fine blanking die. After assembling the upper die assembly and the lower die assembly, a mold cavity is formed. Then, install the upper die assembly and the lower die assembly onto the processing position in the fine blanking machine.

[0047] 2) During operation, the product strip is first uncoiled and leveled. During uncoiling and leveling, the product strip is first loaded onto the input wheel shaft of the leveling machine and then introduced into the leveling machine for leveling.

[0048] 3) After being leveled by the leveling machine, the product strip is fed into the mold cavity composed of the upper mold assembly and the lower mold assembly;

[0049] 4) After the product strip reaches the mold cavity, the upper hydraulic cylinder of the fine blanking machine located above the upper mold assembly starts to work. The piston rod of the upper hydraulic cylinder extends downward and abuts against the upper mold assembly, driving the upper mold assembly to close close to the lower mold assembly until the concave plate of the lower mold assembly is in contact with the lower surface of the product strip and the unloading plate of the upper mold assembly is in contact with the upper surface of the product strip. At this time, the upper mold assembly and the lower mold assembly reach the pressure point respectively. At this time, the first infrared sensor J6 located at the left end of the upper mold assembly calculates the distance h1 between the first infrared sensor J6 and the upper surface of the product strip. At the same time, the second infrared sensor J7 located at the left end of the lower mold assembly calculates the distance h2 between the second infrared sensor J7 and the lower surface of the product strip.

[0050] 5) When h1 equals h2, this is the optimal pressure point for the product strip, and the upper hydraulic cylinder of the fine blanking machine begins to apply pressure to the upper die assembly;

[0051] 6) When h1 is less than h2, the optimal pressure point for the product strip has not been reached. The upper hydraulic cylinder of the fine blanking machine needs to continue pressing down on the upper die assembly until h1 equals h2. When h1 is greater than h2, the overpressure point for the product strip has been reached. The piston rod of the upper hydraulic cylinder of the fine blanking machine located above the upper die assembly needs to retract, while the piston rod of the lower hydraulic cylinder of the fine blanking machine located below the lower die assembly extends to drive the lower die assembly to move upward until h1 equals h2.

[0052] 7) After reaching the optimal pressure point, the piston rod of the hydraulic cylinder located above the upper mold assembly begins to exert a pressing force on the upper mold assembly, and the piston rod of the hydraulic cylinder located below the lower mold assembly begins to exert a counter-pressure on the lower mold assembly.

[0053] 8) The blank holder force and the counter-pressure force are applied simultaneously. When the blank holder force is greater than the counter-pressure force, the die float decreases to 0. The punch installed on the die platen punches into the product strip and performs stamping on the product strip. The generated waste is discharged from the waste discharge through hole in the die. When the die float is 0, the punching force is greater than the blank holder force. The distance that pushes the stripper plate upward is the thickness of the product strip + 0.2mm. Under the pressure of the fine blanking machine, the punch carries the product strip into the punch assembly and cuts the product strip into the shape of the sub-beam gasket. After that, the blank holder force and the counter-pressure force begin to be released until they are 0.

[0054] 9) Then, the upper mold assembly and the lower mold assembly are gradually separated. When the distance between the lower mold assembly and the upper mold assembly is 3 times the thickness of the product strip, the hydraulic press located above the upper mold assembly works again and acts on the unloading plate to push the product strip away from the die. When the distance between the lower mold assembly and the upper mold assembly is 5 times the thickness of the strip, the hydraulic press located below the lower mold assembly works again and acts on the ejector to push the product out of the die plate.

[0055] 10) After the product is ejected from the die, delay for about 1-2 seconds, and use a blower to blow out the waste material. Then the upper die assembly and the lower die assembly continue to separate. After the distance between the upper die assembly and the lower die assembly reaches 40mm, the unprocessed product strip can be fed in, and the stamping is completed.

[0056] Next to the fine punching machine is an electrical control cabinet for controlling the inlet pump SJYG of the upper hydraulic cylinder, the outlet pump SCYG of the upper hydraulic cylinder, the inlet pump XJYB of the lower hydraulic cylinder, the outlet pump XCYB of the lower hydraulic cylinder, infrared sensor J6 (number one), and infrared sensor J7 (number two). The electrical control cabinet contains a power supply circuit for providing electrical energy, and a control circuit for use in conjunction with the power supply circuit is located in the electrical control cabinet to the right of the power supply circuit.

[0057] The power supply circuit includes a power module M1, a switch K1, and a diode D1. Pin 1 of the power module M1 is electrically connected to the positive terminal of the diode D1, and the negative terminal of the diode D1 is electrically connected to one end of the switch K1. The other end of the switch K1 outputs +VCC, and pin 2 of the power module M1 is grounded. The control circuit includes a control chip U1, a crystal oscillator Y1, an infrared sensor J6, an infrared sensor J7, an inlet pump SJYB, an outlet pump SCQB, an inlet pump XJYB, an outlet pump XCQB, transistors Q1, Q2, Q3, and Q4, relays J2, J3, J4, and J5, resistors R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, and R11, switches K2, K3, and K4, and capacitors C1, C2, and C3. The output end of the inlet pump SJYB is connected to the input end of the hydraulic cylinder of the fine blanking machine via a pipe. The input end of the outlet pump CQB is connected to the output end of the hydraulic cylinder of the fine blanking machine via a pipe. Switches K1, K2, K3, and K4 are sequentially embedded on the front face of the electrical control cabinet from top to bottom. The control chip U1 is connected to the crystal oscillator Y1, infrared sensor J6, infrared sensor J7, inlet pump SJYB, and outlet pump SJYB. CQB, inlet pump XJYB, outlet pump XCQB, transistor Q1, transistor Q2, transistor Q3, transistor Q4, relay J2, relay J3, relay J4, relay J5, resistor R1, resistor R2, resistor R3, resistor R4, resistor R5, resistor R6, resistor R7, resistor R8, resistor R9, resistor R10, resistor R11, switch K2, switch K3, switch K4, capacitor C1, capacitor C2, and capacitor C3 are electrically connected.

[0058] One end of the crystal oscillator Y1 is electrically connected to one end of capacitor C1 and pin 19 of control chip U1. The other end of the crystal oscillator Y1 is electrically connected to one end of capacitor C2 and pin 18 of control chip U1. The other end of capacitor C1 is electrically connected to the other end of capacitor C2, and the other end of capacitor C1 is grounded. One end of the resistor R1 is electrically connected to one end of switch K2, one end of capacitor C3, and pin 9 of control chip U1, and the other end of resistor R1 is grounded. The other end of switch K2 is electrically connected to the other end of capacitor C3, and the other end of switch K2 is connected to +VCC. Pin 31 of control chip U1 is connected to +VCC. Pin 1 of control chip U1 is connected to the resistor... One end of resistor R2 is electrically connected, and the other end of resistor R2 is electrically connected to one end of switch K3, which is grounded. Pin 2 of control chip U1 is electrically connected to one end of resistor R3, and the other end of resistor R3 is electrically connected to one end of switch K4, which is grounded. Pin 4 of control chip U1 is electrically connected to pin 2 of infrared sensor J6, and pin 5 of control chip U1 is electrically connected to pin 3 of infrared sensor J6. Pin 1 of infrared sensor J6 is connected to +VCC, and pin 4 of infrared sensor J6 is grounded. Pin 7 of control chip U1 is electrically connected to pin 2 of infrared sensor J7. The control chip U1's pin 8 is electrically connected to the third pin of the second infrared sensor J7. The second infrared sensor J7's pin 1 is connected to +VCC, and its fourth pin is grounded. The control chip U1's pin 39 is electrically connected to one end of resistor R4. The other end of resistor R4 is electrically connected to the base of transistor Q1. The emitter of transistor Q1 is connected to +VCC. The collector of transistor Q1 is electrically connected to one end of resistor R5 and the fifth pin of relay J2. The other end of resistor R5 is electrically connected to the sixth pin of relay J2. The relay J2's pins 1 and 2 are grounded, and its third pin is connected to +VCC. Pin 4 of the circuit breaker is electrically connected to the positive terminal of the inlet pump SJYB, and the negative terminal of the inlet pump SJYB is grounded. Pin 38 of the control chip U1 is electrically connected to one end of resistor R6, and the other end of resistor R6 is electrically connected to the base of transistor Q2. The emitter of transistor Q2 is connected to +VCC. The collector of transistor Q2 is electrically connected to one end of resistor R7 and pin 5 of relay J3. The other end of resistor R7 is electrically connected to pin 6 of relay J3. Pins 1 and 2 of relay J3 are grounded, and pin 3 of relay J3 is connected to +VCC. Pin 4 of relay J3 is electrically connected to the positive terminal of the outlet pump SCYB, and the negative terminal of the outlet pump SCYB is grounded.Pin 21 of the control chip U1 is electrically connected to one end of resistor R8. The other end of resistor R8 is electrically connected to the base of transistor Q3. The emitter of transistor Q3 is connected to +VCC. The collector of transistor Q3 is electrically connected to one end of resistor R9 and pin 5 of relay J4. The other end of resistor R9 is electrically connected to pin 6 of relay J4. Pins 1 and 2 of relay J4 are grounded. Pin 3 of relay J4 is connected to +VCC. Pin 4 of relay J4 is electrically connected to the positive terminal of inlet pump XJYB. The negative terminal of inlet pump XJYB is grounded. Pin 20 of the control chip U1 is electrically connected to one end of resistor R10. The other end of resistor R10 is electrically connected to the base of transistor Q4. The emitter of transistor Q4 is connected to +VCC. The collector of transistor Q4 is electrically connected to one end of resistor R11 and pin 5 of relay J5. The other end of resistor R11 is electrically connected to pin 6 of relay J5. Pins 1 and 2 of relay J5 are grounded. Pin 3 of relay J5 is connected to +VCC. Pin 4 of relay J5 is electrically connected to the positive terminal of the discharge pump XCYB. The negative terminal of discharge pump XCYB is grounded.

[0059] The upper mold assembly includes an upper mold plate 1. The lower end of the upper mold plate 1 is provided with an upper mold plate pad 2 for supporting the upper mold plate 1. Below the upper mold plate pad 2 is a stripper plate 3 for unloading the processed product strip. The lower end of the stripper plate 3 is provided with a stripper plate pad 4 for supporting the stripper plate 3. There is an movable gap between the upper mold plate pad 2 and the stripper plate 3. The lower mold assembly includes a lower mold plate 7. The lower mold plate 7 is provided with a concave mold plate 5. There is a concave mold plate pad 6 between the concave mold plate 5 and the lower mold plate 7 for use with the concave mold plate 5. There is a floating gap between the lower end of the concave mold plate 5 and the concave mold plate pad 6.

[0060] The punch assembly includes a front punch assembly, and a rear punch assembly is provided on the rear side of the front punch assembly. The front punch assembly and the rear punch assembly are staggered. The front punch assembly and the rear punch assembly have the same structure and are both composed of four evenly distributed punches. The center of each punch has a longitudinal through hole 16 for discharging waste material.

[0061] The waste discharge assembly includes eight upper mold waste discharge slots located on the upper end of the upper template 1, which cooperate with the in-mold waste discharge through holes 16 to discharge waste generated during the processing of the product strip. The upper mold waste discharge slots are located directly above the in-mold waste discharge through holes 16 and are connected to the in-mold waste discharge through holes 16.

[0062] The punch assembly includes four dies 14 mounted on the die plate 5. Each die 14 is fitted with two punches 15 that cooperate with the two punches directly above it. The upper end of each punch 15 is fitted with a material ejector 17 for ejecting the processed product strip. The upper end of each punch 15 is mounted on the die plate 5, and the lower end of each punch 15 is mounted on the die plate pad 6. The upper end face of each punch 15 is parallel to the upper end face of the die 14, and the lower end face of each punch 15 abuts against the upper end face of the lower die plate 7.

[0063] The upper end of the punch is embedded in the upper template 1, the upper end of the punch abuts against the lower end of the upper die waste discharge groove, the neck of the punch is embedded in the upper die pad, the waist of the punch is embedded in the stripper plate pad 4, the lower end of the punch is embedded in the stripper plate 3, and the lower end face of the punch is parallel to the lower end face of the stripper plate 3.

[0064] The upper template 1 has bushing through holes that extend longitudinally through the upper template 1 and the upper template pad 2 at its left and right ends. A guide bushing 9 is embedded in the bushing through hole. A guide post 8 is inserted into the guide bushing 9. A ball bearing guide sleeve 10 that abuts against the inner wall of the bushing is fitted on the waist of the guide post 8. The unloading plate pad 4 has ball bearing through holes that extend longitudinally through the unloading plate pad 4 and are used to embed the lower end of the ball bearing guide sleeve 10 at its left and right ends. The unloading plate 3 has through holes that extend longitudinally through the unloading plate 3 and are used to insert the guide post 8 at its left and right ends. A guide sleeve 13 that extends longitudinally through the concave template 5 and is used to insert the guide post 8 is located directly below the through hole of the guide post 8. The upper template pad 2 has upper hydraulic insert grooves 11 that extend longitudinally through the upper template pad 2 and the unloading plate pad 4 at its left and right ends. The concave template 5 has lower hydraulic insert grooves 12 that extend longitudinally through the concave template 5 and the concave template pad 6 at its left and right ends.

[0065] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. Any changes or modifications made by those skilled in the art within the scope of the present invention are covered by the patent scope of the present invention.

Claims

1. A control method for a single-die eight-cavity fine blanking die system for a sub-beam gasket, the single-die eight-cavity fine blanking die system comprising an upper die assembly, a lower die assembly, and a scrap discharge assembly, characterized in that: The upper mold assembly includes an upper template (1), an upper template pad (2) for supporting the upper template (1) is provided at the lower end of the upper template (1), an unloading plate (3) for unloading the processed product strip is provided below the upper template pad (2), an unloading plate pad (4) for supporting the unloading plate (3) is provided at the lower end of the unloading plate (3), and there is a movable gap between the upper template pad (2) and the unloading plate (3). The lower mold assembly includes a lower template (7), a concave template (5) is provided above the lower template (7), a concave template pad (6) for cooperating with the concave template (5) is provided between the concave template (5) and the lower template (7), and there is a floating gap between the lower end of the concave template (5) and the concave template pad (6). A punch assembly is provided on the unloading plate (3), and four concave dies (14) are embedded on the concave template (5). Each concave die (14) is respectively embedded with two punches (15) for cooperating with the two punches directly above it. The control method is as follows: Before starting work, first assemble the upper die assembly and the lower die assembly of the fine blanking die. After assembling the upper die assembly and the lower die assembly, a mold cavity is formed. Then, install the upper die assembly and the lower die assembly onto the processing position in the fine blanking machine. During operation, the product strip is first uncoiled and leveled. After uncoiling and leveling, the product strip is first loaded onto the input wheel shaft of the leveling machine and then introduced into the leveling machine for leveling. After being leveled by the leveling machine, the product strip is fed into the mold cavity composed of the upper mold assembly and the lower mold assembly; After the product strip reaches the mold cavity, the upper hydraulic cylinder of the fine blanking machine located above the upper mold assembly starts to work. The piston rod of the upper hydraulic cylinder extends downward and abuts against the upper mold assembly, driving the upper mold assembly to close close to the lower mold assembly until the concave plate of the lower mold assembly is in contact with the lower surface of the product strip and the unloading plate of the upper mold assembly is in contact with the upper surface of the product strip. At this time, the upper mold assembly and the lower mold assembly reach the pressure point respectively. At this time, the first infrared sensor J6 located at the left end of the upper mold assembly calculates the distance h1 between the first infrared sensor J6 and the upper surface of the product strip. At the same time, the second infrared sensor J7 located at the left end of the lower mold assembly calculates the distance h2 between the second infrared sensor J7 and the lower surface of the product strip. When h1 equals h2, this is the optimal pressure point for the product strip, and the upper hydraulic cylinder of the fine punching machine begins to apply pressure to the upper die assembly; When h1 is less than h2, the optimal pressure point for the product strip has not been reached. The upper hydraulic cylinder of the fine blanking machine needs to continue pressing down on the upper die assembly until h1 equals h2. When h1 is greater than h2, the overpressure point for the product strip has been reached. The piston rod of the upper hydraulic cylinder of the fine blanking machine located above the upper die assembly needs to retract, while the piston rod of the lower hydraulic cylinder of the fine blanking machine located below the lower die assembly extends to drive the lower die assembly to move upward until h1 equals h2. After reaching the optimal pressure point, the piston rod of the hydraulic cylinder located above the upper mold assembly begins to exert a pressing force on the upper mold assembly, while the piston rod of the hydraulic cylinder located below the lower mold assembly begins to exert a counter-pressure on the lower mold assembly. The blank holder force and the counter-pressure force are applied simultaneously. When the blank holder force is greater than the counter-pressure force, the die float decreases to 0. The punch installed on the die platen punches into the product strip and performs stamping on the product strip. The generated waste is discharged from the waste discharge through hole in the die. When the die float is 0, the punching force is greater than the blank holder force. The distance that pushes the stripper plate upward is the thickness of the product strip + 0.2mm. Under the pressure of the fine blanking machine, the punch carries the product strip into the punch assembly and cuts the product strip into the shape of the sub-beam gasket. After that, the blank holder force and the counter-pressure force begin to be released until they are 0. Then, the upper mold assembly and the lower mold assembly are gradually separated. When the distance between the lower mold assembly and the upper mold assembly is 3 times the thickness of the product strip, the hydraulic press located above the upper mold assembly works again and acts on the unloading plate to push the product strip away from the die. When the distance between the lower mold assembly and the upper mold assembly is 5 times the thickness of the strip, the hydraulic press located below the lower mold assembly works again and acts on the ejector to push the product out of the die plate. After the product is ejected from the die, there is a delay of about 1-2 seconds. A blower can be used to blow out the waste material. Then the upper die assembly and the lower die assembly continue to separate. After the distance between the upper die assembly and the lower die assembly reaches 40mm, the unprocessed product strip can be fed in, and the stamping is completed.

2. The control method for an eight-cavity precision stamping die system for a sub-beam gasket according to claim 1, characterized in that: Next to the fine punching machine is an electrical control cabinet for controlling the inlet pump SJYG of the upper hydraulic cylinder, the outlet pump SCYG of the upper hydraulic cylinder, the inlet pump XJYB of the lower hydraulic cylinder, the outlet pump XCYB of the lower hydraulic cylinder, infrared sensor J6 (number one), and infrared sensor J7 (number two). The electrical control cabinet contains a power supply circuit for providing electrical energy, and a control circuit for use in conjunction with the power supply circuit is located in the electrical control cabinet to the right of the power supply circuit.

3. The control method for an eight-cavity precision stamping die system for a sub-beam gasket according to claim 2, characterized in that: The power supply circuit includes a power module M1, a switch K1, and a diode D1. Pin 1 of the power module M1 is electrically connected to the positive terminal of the diode D1, and the negative terminal of the diode D1 is electrically connected to one end of the switch K1. The other end of the switch K1 outputs +VCC, and pin 2 of the power module M1 is grounded. The control circuit includes a control chip U1, a crystal oscillator Y1, an infrared sensor J6, an infrared sensor J7, an inlet pump SJYB, an outlet pump SCQB, an inlet pump XJYB, an outlet pump XCQB, transistors Q1, Q2, Q3, and Q4, relays J2, J3, J4, and J5, resistors R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, and R11, switches K2, K3, and K4, and capacitors C1, C2, and C3. The output end of the inlet pump SJYB is connected to the input end of the hydraulic cylinder of the fine blanking machine via a pipe. The input end of the outlet pump CQB is connected to the output end of the hydraulic cylinder of the fine blanking machine via a pipe. Switches K1, K2, K3, and K4 are sequentially embedded on the front face of the electrical control cabinet from top to bottom. The control chip U1 is connected to the crystal oscillator Y1, infrared sensor J6, infrared sensor J7, inlet pump SJYB, and outlet pump SJYB. CQB, inlet pump XJYB, outlet pump XCQB, transistor Q1, transistor Q2, transistor Q3, transistor Q4, relay J2, relay J3, relay J4, relay J5, resistor R1, resistor R2, resistor R3, resistor R4, resistor R5, resistor R6, resistor R7, resistor R8, resistor R9, resistor R10, resistor R11, switch K2, switch K3, switch K4, capacitor C1, capacitor C2, and capacitor C3 are electrically connected.

4. The control method for an eight-cavity precision stamping die system for a sub-beam gasket according to claim 3, characterized in that: One end of the crystal oscillator Y1 is electrically connected to one end of capacitor C1 and pin 19 of control chip U1. The other end of the crystal oscillator Y1 is electrically connected to one end of capacitor C2 and pin 18 of control chip U1. The other end of capacitor C1 is electrically connected to the other end of capacitor C2, and the other end of capacitor C1 is grounded. One end of the resistor R1 is electrically connected to one end of switch K2, one end of capacitor C3, and pin 9 of control chip U1, and the other end of resistor R1 is grounded. The other end of switch K2 is electrically connected to the other end of capacitor C3, and the other end of switch K2 is connected to +VCC. Pin 31 of control chip U1 is connected to +VCC. Pin 1 of control chip U1 is connected to the resistor... One end of resistor R2 is electrically connected, and the other end of resistor R2 is electrically connected to one end of switch K3, which is grounded. Pin 2 of control chip U1 is electrically connected to one end of resistor R3, and the other end of resistor R3 is electrically connected to one end of switch K4, which is grounded. Pin 4 of control chip U1 is electrically connected to pin 2 of infrared sensor J6, and pin 5 of control chip U1 is electrically connected to pin 3 of infrared sensor J6. Pin 1 of infrared sensor J6 is connected to +VCC, and pin 4 of infrared sensor J6 is grounded. Pin 7 of control chip U1 is electrically connected to pin 2 of infrared sensor J7. The control chip U1's pin 8 is electrically connected to the third pin of the second infrared sensor J7. The second infrared sensor J7's pin 1 is connected to +VCC, and its fourth pin is grounded. The control chip U1's pin 39 is electrically connected to one end of resistor R4. The other end of resistor R4 is electrically connected to the base of transistor Q1. The emitter of transistor Q1 is connected to +VCC. The collector of transistor Q1 is electrically connected to one end of resistor R5 and the fifth pin of relay J2. The other end of resistor R5 is electrically connected to the sixth pin of relay J2. The relay J2's pins 1 and 2 are grounded, and its third pin is connected to +VCC. Pin 4 of the circuit breaker is electrically connected to the positive terminal of the inlet pump SJYB, and the negative terminal of the inlet pump SJYB is grounded. Pin 38 of the control chip U1 is electrically connected to one end of resistor R6, and the other end of resistor R6 is electrically connected to the base of transistor Q2. The emitter of transistor Q2 is connected to +VCC. The collector of transistor Q2 is electrically connected to one end of resistor R7 and pin 5 of relay J3. The other end of resistor R7 is electrically connected to pin 6 of relay J3. Pins 1 and 2 of relay J3 are grounded, and pin 3 of relay J3 is connected to +VCC. Pin 4 of relay J3 is electrically connected to the positive terminal of the outlet pump SCYB, and the negative terminal of the outlet pump SCYB is grounded.Pin 21 of the control chip U1 is electrically connected to one end of resistor R8. The other end of resistor R8 is electrically connected to the base of transistor Q3. The emitter of transistor Q3 is connected to +VCC. The collector of transistor Q3 is electrically connected to one end of resistor R9 and pin 5 of relay J4. The other end of resistor R9 is electrically connected to pin 6 of relay J4. Pins 1 and 2 of relay J4 are grounded. Pin 3 of relay J4 is connected to +VCC. Pin 4 of relay J4 is electrically connected to the positive terminal of inlet pump XJYB. The negative terminal of inlet pump XJYB is grounded. Pin 20 of the control chip U1 is electrically connected to one end of resistor R10. The other end of resistor R10 is electrically connected to the base of transistor Q4. The emitter of transistor Q4 is connected to +VCC. The collector of transistor Q4 is electrically connected to one end of resistor R11 and pin 5 of relay J5. The other end of resistor R11 is electrically connected to pin 6 of relay J5. Pins 1 and 2 of relay J5 are grounded. Pin 3 of relay J5 is connected to +VCC. Pin 4 of relay J5 is electrically connected to the positive terminal of the discharge pump XCYB. The negative terminal of discharge pump XCYB is grounded.

5. The control method for an eight-cavity precision stamping die system for a sub-beam gasket according to claim 1, characterized in that: The punch assembly includes a front punch assembly, and a rear punch assembly is provided on the rear side of the front punch assembly. The front punch assembly and the rear punch assembly are staggered. The front punch assembly and the rear punch assembly have the same structure and are both composed of four evenly distributed punches. The center of each punch has a longitudinal through hole (16) for discharging waste material.

6. The control method for an eight-cavity precision stamping die system for a sub-beam gasket according to claim 5, characterized in that: The waste discharge assembly includes eight upper mold waste discharge slots opened at the upper end of the upper template (1) and used in conjunction with the in-mold waste discharge through holes (16) to discharge the waste generated during the processing of the product strip. The upper mold waste discharge slots are located directly above the in-mold waste discharge through holes (16) and are connected to the in-mold waste discharge through holes (16).

7. The control method for an eight-cavity precision stamping die system for a sub-beam gasket according to claim 1, characterized in that: The upper end of the punch (15) is fitted with a material ejector (17) for ejecting the processed product strip. The upper end of the punch (15) is embedded in the die plate (5), and the lower end of the punch (15) is embedded in the die plate pad (6). The upper end face of the punch (15) is parallel to the upper end face of the die (14), and the lower end face of the punch (15) abuts against the upper end face of the lower die plate (7).

8. The control method for an eight-cavity precision stamping die system for a sub-beam gasket according to claim 5, characterized in that: The upper end of the punch is embedded in the upper template (1), the upper end of the punch abuts against the lower end of the upper die waste discharge groove, the neck of the punch is embedded in the upper die pad, the waist of the punch is embedded in the stripper plate pad (4), the lower end of the punch is embedded in the stripper plate (3), and the lower end face of the punch is parallel to the lower end face of the stripper plate (3).

9. The control method for an eight-cavity precision stamping die system for a sub-beam gasket according to claim 7, characterized in that: The upper template (1) has bushing through holes that extend longitudinally through the upper template (1) and the upper template pad (2) at both ends. A guide bushing (9) is embedded in the bushing through hole. A guide post (8) is inserted into the guide bushing (9). A ball bearing guide sleeve (10) that abuts against the inner wall of the bushing is fitted on the waist of the guide post (8). The unloading plate pad (4) has ball bearing through holes that extend longitudinally through the unloading plate pad (4) and are used to embed the lower end of the ball bearing guide sleeve (10) at both ends. The unloading plate (3) has longitudinal bushing through holes that extend longitudinally through the unloading plate pad (4) and are used to embed the lower end of the ball bearing guide sleeve (10) at both ends. A guide sleeve (13) is provided on the concave template (5) located directly below the through hole of the guide post (8) and is provided to penetrate the concave template (5) and is provided to insert the guide post (8). The upper template pad (2) is provided with upper hydraulic insert grooves (11) that penetrate the upper template pad (2) and the unloading plate pad (4) respectively. The concave template (5) is provided with lower hydraulic insert grooves (12) that penetrate the concave template (5) and the concave template pad (6) respectively.

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