A copper material heat conducting device

Abstract

The application relates to a copper material heat conduction device and belongs to the technical field of heat conduction devices. The device comprises a four-mirror grid structure, a circular arc supporting plate, two side plates, a handle, two heat conduction main plates, fixing clamping grooves and connecting copper plates. The circular arc supporting plate is in a horizontally placed disc-shaped structure. The two heat conduction main plates are vertically and symmetrically arranged on the upper surface of the circular arc supporting plate. The two heat conduction main plates are connected through the connecting copper plates. The opposite inner side walls of the two heat conduction main plates are both provided with the fixing clamping grooves. The four-mirror grid structure is installed between the two heat conduction main plates through cooperation with the fixing clamping grooves. The handle is installed at the top of the four-mirror grid structure. The two side plates are symmetrically installed at the outer side walls of the two heat conduction main plates. The application realizes effective transmission of the heat in the silo coating agent to the outside of the silo through the heat conduction device.

Description

Technical Field

[0001] This invention belongs to the technical field of heat conduction devices, and relates to a heat conduction device made of copper. Background Technology

[0002] During the use of a certain coating agent, if the external temperature is too high, the temperature inside the silo will rise. When this temperature exceeds the initial reaction temperature of the material, a chemical reaction will occur between the material components, releasing heat. If the material has a low thermal conductivity, the heat conduction path is uneven, or the heat cannot be dissipated in time, the reaction rate will be further accelerated. Currently, there is no corresponding solution. Summary of the Invention

[0003] The technical problem solved by this invention is to overcome the shortcomings of the prior art and propose a copper material heat conduction device to effectively transfer the heat inside the silo coating agent to the outside of the silo through the heat conduction device.

[0004] The solution of the present invention is:

[0005] A copper heat-conducting device includes a four-grid structure, an arc-shaped support plate, two side plates, a handle, two heat-conducting main plates, a fixing slot, and a connecting copper plate.

[0006] The arc support plate is a horizontally placed conical ring structure; two heat-conducting main plates are vertically and symmetrically arranged in the arc support plate; the two heat-conducting main plates are connected by connecting copper plates; the inner sidewalls of the two heat-conducting main plates are provided with fixing slots; the four-grid structure is installed between the two heat-conducting main plates by cooperating with the fixing slots; the handle is installed on the top of the four-grid structure; and two side plates are symmetrically installed on the outer sidewalls of the two heat-conducting main plates.

[0007] In the aforementioned copper heat-conducting device, the connecting copper plate is a rectangular plate structure; the connecting copper plate is located on the top side of the two heat-conducting main plates, and the connecting copper plate is perpendicular to the two heat-conducting main plates.

[0008] In the aforementioned copper heat-conducting device, the bottom ends of the two heat-conducting main plates and the two side plates are all beveled structures, and the angle of the bevel corresponds to the taper of the arc support plate, thereby enabling the arc support plate to clamp the two heat-conducting main plates and the two side plates from the bottom.

[0009] In the aforementioned copper heat-conducting device, the fixing slot is vertically arranged, with a groove along the vertical direction and a sealed bottom; this allows the four-grid structure to be inserted into the slot from the top and vertically limited by the bottom of the fixing slot.

[0010] In the aforementioned copper heat-conducting device, the four-grid structure is a cross-shaped vertical plate structure; the vertical plate perpendicular to the heat-conducting main board in the four-grid structure is installed by cooperating with the fixing slot.

[0011] In the aforementioned copper material heat conduction device, the handle is characterized in that: the handle is an arc-shaped structure; the handle is installed on the top of the vertical plate perpendicular to the heat conduction main board in the four-grid structure.

[0012] In the aforementioned copper heat-conducting device, the side plates are vertically arranged and respectively installed vertically in the middle of the outer side wall of the corresponding heat-conducting main plate, thereby achieving a proportional extension of the heat-conducting main plate.

[0013] In the aforementioned copper heat-conducting device, the four-grid structure, the arc support plate, the two side plates, the handle, the two heat-conducting main plates, the fixing slot, and the connecting copper plate are all made of copper, achieving high heat conduction efficiency.

[0014] In the aforementioned copper heat-conducting device, the working process of the heat-conducting device is as follows:

[0015] The heat-conducting device is placed in the hopper containing the coating agent. The high temperature of the coating agent in the middle is transferred to the outer coating agent through the arc support plate, the four-grid structure, two heat-conducting main plates, connecting copper plates and two side plates.

[0016] In the aforementioned copper heat-conducting device, after heat conduction is completed, the four-grid structure is removed from the fixing slots of the two heat-conducting main boards by using the handle.

[0017] The advantages of this invention compared to the prior art are:

[0018] (1) The present invention proposes a copper heat conduction device, which is assembled and welded from multiple copper plates. The manufacturing method is simple, the heat transfer efficiency is high, and it is not easy to rust during long-term use and the structure is stable.

[0019] (2) The two heat-conducting main plates of the present invention are vertically and symmetrically arranged in the arc support plate; the two heat-conducting main plates are connected by connecting copper plates; the four-grid structure is installed between the two heat-conducting main plates by cooperating with the fixing slot; the two side plates are symmetrically installed on the outer side walls of the two heat-conducting main plates to achieve a proportionally extended heat-conducting configuration and achieve high-efficiency heat conduction.

[0020] (3) After the invention is used, the four-grid structure can be removed from the fixing slots of the two heat-conducting motherboards by the handle, so that it can be recycled and is more energy-saving and environmentally friendly. Attached Figure Description

[0021] Figure 1 This is a front view of the overall structure of the heat conduction device of the present invention;

[0022] Figure 2 This is a top view of the overall structure of the heat conduction device of the present invention;

[0023] Figure 3 This is a schematic diagram of the handle installation of the present invention. Detailed Implementation

[0024] The present invention will be further described below with reference to the embodiments.

[0025] This invention provides a copper material heat conduction device. When the external temperature causes the temperature inside the silo to rise, the addition of a heat conduction device inside the silo can promptly conduct heat and prevent safety accidents.

[0026] Copper heat-conducting devices, such as Figure 1 , 2 As shown, it specifically includes a four-grid structure 1, an arc-shaped support plate 2, two side plates 3, a handle 4, two heat-conducting main plates 5, fixing slots 6, and connecting copper plates 7. The arc-shaped support plate 2 is a horizontally placed conical ring structure; the two heat-conducting main plates 5 are vertically and symmetrically arranged within the arc-shaped support plate 2; the two heat-conducting main plates 5 are connected by the connecting copper plates 7; fixing slots 6 are provided on the opposing inner sidewalls of the two heat-conducting main plates 5; the four-grid structure 1 is installed between the two heat-conducting main plates 5 by cooperating with the fixing slots 6; the handle 4 is installed on the top of the four-grid structure 1; and the two side plates 3 are symmetrically installed on the outer sidewalls of the two heat-conducting main plates 5.

[0027] A heat-conducting device is placed in the coating agent hopper. The heat-conducting device uses copper plates to divide the coating agent containing area. The contact between the coating agent and the heat-conducting copper plate in the containing area is used to conduct the internal heat of the coating agent to the outside. At the same time, a four-grid structure is added to the inner side of the middle parallel copper plate. When the coating agent enters the middle hopper, it will be quickly dispersed in the four sub-areas. While the internal heat is conducted to the outer edge in time, the lateral viscosity of the coating agent is reduced, the supporting force disperses the force of the coating agent accumulation, and the interaction force is reduced, thereby avoiding the formation of arching and bridging.

[0028] The connecting copper plate 7 is a rectangular plate structure; the connecting copper plate 7 is located on the top side of the two heat-conducting main plates 5, and the connecting copper plate 7 is perpendicular to the two heat-conducting main plates 5. The bottom ends of the two heat-conducting main plates 5 and the two side plates 3 are all beveled structures, and the angle of the bevel corresponds to the taper of the arc support plate 2, so that the arc support plate 2 clamps the two heat-conducting main plates 5 and the two side plates 3 from the bottom.

[0029] The fixed slot 6 is set vertically, with a groove along the vertical direction and the bottom sealed; so that the four-grid structure 1 can be inserted into the slot from the top and is vertically limited by the bottom of the fixed slot 6.

[0030] The four-grid structure 1 is a cross-shaped vertical plate structure; the vertical plate in the four-grid structure 1, perpendicular to the heat-conducting main plate 5, cooperates with the fixing slot 6 for installation. The handle 4 is installed on the top of the vertical plate in the four-grid structure 1, perpendicular to the heat-conducting main plate 5, as shown below. Figure 3 As shown.

[0031] The side plate 3 is vertically arranged, and the side plate 3 is respectively vertically installed in the middle of the outer side wall of the corresponding heat-conducting main plate 5, so as to achieve proportional extension of the heat-conducting main plate 5.

[0032] The four-grid structure (1, arc support plate; 2, two side plates; 3, handle; 4, two heat-conducting main plates; 5, fixing slot; 6, and connecting copper plate) is made of copper, achieving high heat conduction efficiency.

[0033] The working process of the heat conduction device is as follows:

[0034] The heat-conducting device is placed in the hopper containing the coating agent. The high temperature of the central coating agent is channeled to the outer coating agent via the arc-shaped support plate 2, the four-grid structure 1, two heat-conducting main plates 5, the connecting copper plate 7, and two side plates 3. After heat conduction is complete, the four-grid structure 1 is removed from the fixing slots 6 of the two heat-conducting main plates 5 using the handle 4.

[0035] The main body of the heat-conducting device of the present invention is mainly composed of two heat-conducting main plates and two heat-conducting side plates. A detachable four-grid structure is provided at the center of the main body of the heat-conducting device. The detachable four-grid structure inside the heat-conducting device is fixed by slots located on two parallel copper plates. The outside of the heat-conducting device is supported by a ring of arc copper plates parallel to the inner wall of the hopper. There is a gap in the arc copper plate outside the heat-conducting device, and above the gap is a connecting copper plate perpendicular to the two parallel copper plates of the main body.

[0036] The slots for the fixed and detachable four-grid structure are located in the middle of the heat-conducting motherboard, and the two slots are at the same height. A handle is designed above the four-grid structure, which is perpendicular to the heat-conducting motherboard, for installing and removing the four-grid structure.

[0037] Example

[0038] The novel pure copper material heat conduction device includes two heat conduction main plates and two side plates. The outside is supported by a ring of arc copper plates parallel to the inner wall of the hopper. The two heat conduction main plates and two side plates form a coating agent containing area with the inner wall of the hopper. At the same time, a detachable four-grid structure is located in the middle of the two parallel heat conduction main plates to disperse the coating agent in the hopper into four sub-areas. This ensures that the internal heat is transferred to the outer edge in a timely manner while avoiding arching and bridging.

[0039] Working principle: When an external heat source provides heat to the coating agent, causing the temperature of the coating agent material inside the silo to rise, the heat will be transferred from the high-temperature area inside to the low-temperature area outside through the heat conduction device. In this process, the molecules at the point closest to the highest material temperature will be excited by the material temperature, the distance between the molecules will decrease, and the vibration frequency of the molecules will increase, thus enabling the heat to be transferred quickly.

[0040] Instructions for use: For first-time use, first use compressed air to blow away any dust adhering to the surface, then place it into the hopper. When placing it, ensure that the side with the opening passes through the platinum resistance temperature sensor. Cover with the top filter screen, pour the coating agent onto the filter screen, and use a special tool to slowly pass it through the filter screen into the hopper. After use, remove the top filter screen, pull the four-compartment handle in the middle to remove it, and remove any remaining coating agent to prevent it from deteriorating if left in the hopper for an extended period.

[0041] The present invention proposes a copper heat conduction device, which is assembled and welded from multiple copper plates. The manufacturing method is simple, the heat transfer efficiency is high, and it is not easy to rust during long-term use and the structure is stable.

[0042] In this invention, two heat-conducting main plates are vertically and symmetrically arranged in an arc-shaped support plate; the two heat-conducting main plates are connected by a connecting copper plate; the four-grid structure is installed between the two heat-conducting main plates by cooperating with the fixing slot; two side plates are symmetrically installed on the outer side walls of the two heat-conducting main plates to achieve a proportionally extended heat-conducting configuration and achieve high-efficiency heat conduction.

[0043] After use, the four-grid structure can be removed from the fixing slots of the two heat-conducting motherboards by using the handle, making it recyclable and more energy-efficient and environmentally friendly.

[0044] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solutions of the present invention by utilizing the methods and techniques disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the protection scope of the technical solutions of the present invention.

Claims

1. A heat conducting device of a copper material, characterized by: It includes a four-grid structure (1), an arc support plate (2), two side plates (3), a handle (4), two heat-conducting main plates (5), a fixing slot (6), and a connecting copper plate (7); Among them, the arc support plate (2) is a horizontally placed conical ring structure; two heat-conducting main plates (5) are vertically and symmetrically arranged in the arc support plate (2); the two heat-conducting main plates (5) are connected by connecting copper plates (7); the inner sidewalls of the two heat-conducting main plates (5) are provided with fixing slots (6); the four-grid structure (1) is installed between the two heat-conducting main plates (5) by cooperating with the fixing slots (6); the handle (4) is installed on the top of the four-grid structure (1); and two side plates (3) are symmetrically installed on the outer sidewalls of the two heat-conducting main plates (5).

2. A copper material heat conducting device as claimed in claim 1, characterized in that: The connecting copper plate (7) is a rectangular plate structure; the connecting copper plate (7) is located on the top side of the two heat-conducting main plates (5), and the connecting copper plate (7) is perpendicular to the two heat-conducting main plates (5).

3. A copper material heat conducting device as claimed in claim 1, characterized in that: The bottom ends of the two heat-conducting main plates (5) and the two side plates (3) are all inclined structures, and the angle of the inclined edge corresponds to the taper of the arc support plate (2), so that the arc support plate (2) clamps the two heat-conducting main plates (5) and the two side plates (3) from the bottom.

4. The copper material heat conducting device according to claim 1, wherein: The fixed slot (6) is set vertically, and the fixed slot (6) is slotted in the vertical direction and sealed at the bottom; so that the four-grid structure (1) is inserted into the slot from the top and is vertically limited by the bottom of the fixed slot (6).

5. A copper material heat conducting device as claimed in claim 4, characterized in that: The four-grid structure (1) is a cross-shaped vertical plate structure; the vertical plate in the four-grid structure (1) that is perpendicular to the heat-conducting main plate (5) cooperates with the fixing slot (6) to achieve installation.

6. A copper material heat conducting device as claimed in claim 5, characterized in that: The handle (4) has an arc-shaped structure; the handle (4) is installed on the top of the vertical plate that is perpendicular to the heat-conducting main plate (5) in the four-grid structure (1).

7. A copper material heat conducting device as claimed in claim 5, characterized in that: The side plate (3) is vertically arranged and is respectively installed vertically in the middle of the outer side wall of the corresponding heat-conducting main plate (5), so as to achieve proportional extension of the heat-conducting main plate (5).

8. A copper material heat conducting device as claimed in claim 1, characterized in that: The four-grid structure (1), the arc support plate (2), the two side plates (3), the handle (4), the two heat-conducting main plates (5), the fixing slot (6) and the connecting copper plate (7) are all made of copper, achieving high heat conduction efficiency.

9. A copper material heat conducting device as claimed in claim 1, characterized in that: The working process of the heat conduction device is as follows: The heat-conducting device is placed in the silo containing the coating agent. The high temperature of the coating agent in the middle is diverted to the outer coating agent through the arc support plate (2), the four-grid structure (1), two heat-conducting main plates (5), the connecting copper plate (7) and two side plates (3).

10. A copper material heat conducting device as claimed in claim 9, characterized in that: After the heat conduction is completed, remove the four-grid structure (1) from the fixing slots (6) of the two heat conduction main boards (5) by using the handle (4).

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