Solar silicon wafer cleaning and drying integrated processing equipment

Abstract

The present invention provides a solar silicon wafer cleaning and drying integrated processing equipment, including a main tank body, the main tank body is a flat cylindrical structure, the main tank body is provided with a pre-spray tank, a first ultrasonic cleaning tank, a second ultrasonic cleaning tank and a drying tank arranged in a counterclockwise order; an independent central tube is provided at the inner center of the main tank body, a transfer drive assembly is installed inside the central tube, four groups of turnover clamping assemblies distributed in a circular array are vertically installed on the top of the transfer drive assembly, and the bottom of each turnover clamping assembly is matched with a quartz boat body; a silicon wafer loading assembly is installed on the outer side of the pre-spray tank; the silicon wafer loading assembly includes a longitudinal frame, a second driving rod, a transverse frame, a support assembly and a silicon wafer storage assembly. The silicon wafer cleaning efficiency of the present invention is higher, the turnover is simpler, and the loading and unloading automation is higher.

Description

Technical Field

[0001] The invention relates to the technical field of automatic cleaning and processing of solar silicon wafers, and in particular to integrated cleaning and drying processing equipment for solar silicon wafers. Background Art

[0002] Solar silicon wafer is a key component used to manufacture solar cells. It is usually made of high-purity polycrystalline silicon or monocrystalline silicon, and has semiconductor properties: when sunlight shines on the solar silicon wafer, the electrons in the silicon are excited and form an electric current. This process is called the photovoltaic effect. Solar silicon wafers convert solar energy into direct current electricity, which can be used in power systems;

[0003] After the initial manufacturing of solar silicon wafers, they need to be cleaned before the remaining baking operations. The traditional cleaning process has the following problems:

[0004] 1. Before cleaning, the silicon wafers need to be inserted into the fixture one by one manually, which makes the loading operation troublesome;

[0005] After cleaning, the silicon wafer needs to be removed from the fixture and transferred to the quartz boat for the next baking operation. The unloading operation is also very troublesome, requiring a large amount of manpower, and the degree of automation of silicon wafer unloading is not high;

[0006] 2. Most cleaning equipment is rectangular, occupies a large area, and has low silicon wafer turnover efficiency. Summary of the invention

[0007] In view of the deficiencies in the prior art, the present invention provides a solar silicon wafer cleaning and drying integrated processing device, which solves the problems mentioned in the background technology.

[0008] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0009] The solar silicon wafer cleaning and drying integrated processing equipment comprises a main tank body, which is a flat cylindrical structure, and the interior of the main tank body is provided with a pre-spraying tank, a first ultrasonic cleaning tank, a second ultrasonic cleaning tank and a drying tank which are arranged in a counterclockwise order;

[0010] An independent central tube is provided at the center of the main tank, and a transfer drive assembly is installed inside the central tube. Four groups of turnover clamping assemblies distributed in a circular array are vertically installed on the top of the transfer drive assembly. The bottom of each turnover clamping assembly is matched with the quartz boat body; a silicon wafer loading assembly is installed on the outside of the pre-spray tank;

[0011] The silicon wafer loading assembly comprises a longitudinal frame, a second driving rod, a transverse frame, a supporting assembly and a silicon wafer storage assembly; the transverse frame is slidably mounted on the top of the longitudinal frame, the inner wall of the longitudinal frame is provided with a second driving rod for driving the transverse frame to translate longitudinally, the interior of the transverse frame is parallelly mounted with a first screw and a second screw, the bottom thread of the supporting assembly is mounted on the first screw, the top of the supporting assembly is transversely slidably mounted with a silicon wafer storage assembly, the bottom thread of the silicon wafer storage assembly is connected to the second screw, and a pushing assembly is vertically mounted on the discharge end of the supporting assembly;

[0012] The loading process of the silicon wafer loading assembly includes the following steps:

[0013] S1. The silicon wafer storage assembly is placed at the loading end of the support assembly, and the conveyor belt horizontally transports the silicon wafers to the support assembly;

[0014] S2, the second screw rotates to drive the silicon wafer storage assembly to move horizontally from the loading end to the discharging end; when the silicon wafer storage assembly arrives at the discharging end, the silicon wafer storage assembly rotates to drive the silicon wafer to flip from a horizontal state to a vertical state;

[0015] S3, the pushing component inserts the vertical silicon wafer into the quartz boat body in the turnover clamping component;

[0016] S4, the second screw is reversed to drive the silicon wafer storage assembly back to the loading end;

[0017] S5, the silicon wafer storage assembly arrives at the loading end and drives the first screw to rotate, and the first screw drives the pushing assembly to move horizontally to the next discharging position.

[0018] Furthermore, the silicon wafer storage assembly includes a support, a lifting frame and a flipping gear. The support has a surface receiving groove, a second movable block is vertically provided on the bottom surface of the support, a lifting frame is rotatably installed inside the receiving groove, and a flipping gear is provided at the connection between the lifting frame and the support; the second movable block is threadedly mounted on the second screw.

[0019] Furthermore, the support assembly includes a support plate, a bracket is slidably mounted on the surface of the support plate, a side plate is vertically arranged at the surface discharge end of the support plate, a through groove is opened in the middle of the surface of the support plate, the second moving block vertically slides through the through groove, a first moving block is vertically arranged at the bottom discharge end of the support plate, the first moving block is threadedly mounted on the first screw, and a flip rack is arranged at the side discharge end of the support plate;

[0020] In S2, when the silicon wafer storage assembly reaches the discharge end, the flip rack drives the flip gear and the lifting frame to rotate, so as to drive the silicon wafer to flip to a vertical state, so that the silicon wafer is vertically placed between the lifting frame and the side plate.

[0021] Further, the pushing assembly includes a second driving rod, a linkage frame and a push rod, the second driving rod is horizontally arranged on the outer wall of the side plate, the end of the second driving rod is connected to the 7-shaped linkage frame, a notch is opened inside the side plate, a push rod is vertically arranged at the end of the linkage frame, and the push rod is arranged vertically;

[0022] In S3, the second driving rod contracts to drive the push rod to translate, and the push rod pushes the silicon wafer between the side plate and the lifting frame to be inserted into the quartz boat body.

[0023] Furthermore, a one-way gear is provided on the outer wall of the second screw, and the bottom of the one-way gear is meshed and connected to the translation drive assembly; a resistance rod extending horizontally toward the upper material end is vertically provided on the side wall of the second moving block, and the translation drive assembly includes a second connecting rod, a slide rail, a spring rod, a tooth plate and a matching block, the second connecting rod is fixed in the transverse frame, and a slide rail extending longitudinally and horizontally is vertically provided on the end of the second connecting rod, and a tooth plate is slidably installed on the top of the slide rail, and the inner end of one side of the tooth plate is connected to the spring rod, and the end of the spring rod is connected to the second connecting rod, and a matching block is vertically provided on the other side of the tooth plate, and the matching block is located on the inner side of the resistance rod;

[0024] In S5, the abutment rod abuts the matching block to move inward to drive the tooth plate to translate inward, the tooth plate translates to drive the one-way gear to rotate, the one-way gear rotates to drive the second screw to rotate, so that the first moving block and the pushing assembly translate to the next discharge position.

[0025] Furthermore, a spray assembly is installed inside the pre-spray tank, and the spray assembly includes a liquid pump, a liquid pumping pipe, a spraying pipe and a first connecting rod. The liquid pump is placed at the bottom of the pre-spray tank, the outlet end of the liquid pump is connected to the liquid pumping pipe, the outlet end of the liquid pumping pipe is connected to the spraying pipe, the spraying pipe extends to the top of the quartz boat body, and the spraying pipe is fixedly connected to the side plate through the first connecting rod; the spraying pipe sprays cleaning water to clean the silicon wafers inserted in the quartz boat body one by one; the spray assembly and the pushing assembly move synchronously.

[0026] Furthermore, the quartz boat body includes side fixing plates, an assembly seat, an upper positioning bar, a lower positioning bar and a side positioning bar. An upper positioning bar is vertically arranged on the top between the two side fixing plates, a lower positioning bar is vertically arranged on the bottom, and a side positioning bar is vertically arranged on the rear side. The upper positioning bar, the lower positioning bar and the side positioning bar are all provided with slots for inserting silicon wafers; the opening of the quartz boat body faces the pushing assembly; and an assembly seat is provided on the bottom of the outer walls of the two side fixing plates.

[0027] Further, the covering assembly includes a cover plate and a mesh plate, the top inner end of the drying tank is rotatably covered with a cover plate, a second motor driving the cover plate to rotate is installed inside the central tube, the bottom of the drying tank is an open structure, a mesh plate is slidably installed in the middle of the drying tank, a lower cover body is provided at the bottom of the mesh plate, a hot air blower is installed inside the lower cover body, a column is provided at the bottom of the lower cover body, a linkage plate is vertically provided at the bottom end of the column, a third driving rod is vertically provided on the outer end surface of the linkage plate, and the third driving rod is vertically provided at the center of the bottom surface of the main tank body;

[0028] The cover assembly includes the following states:

[0029] In the first state, the first set of turnover clamping components drives the quartz boat body and silicon wafers for secondary cleaning to rotate above the drying tank, and the second set of turnover clamping components drives the quartz boat body and silicon wafers for primary cleaning to rotate above the second ultrasonic cleaning tank;

[0030] In the second state, the second motor drives the cover plate to rotate to the top of the second ultrasonic cleaning tank, and the cover plate is placed under the silicon wafer to be cleaned once;

[0031] In the third state, the first group of turnover clamping components lowers the quartz boat body and places it on the screen. After the lowering is completed, the first group of turnover clamping components is separated from the quartz boat body and lifted up; at the same time, the exhaust plate discharges the drying gas upward to the silicon wafers cleaned once above to purge the residual liquid of the silicon wafers cleaned once;

[0032] In the fourth state, the cover plate rotates to close the drying tank, and the second set of turnover clamping components clamps and lowers the silicon wafer into the second ultrasonic cleaning tank; the hot air blower works to dry the silicon wafer on the mesh plate;

[0033] In the fifth state, after the drying operation is completed, the third driving rod drives the screen plate and the lower cover to descend, so that the dried quartz boat body and silicon wafers are lowered and exposed; the quartz boat turnover assembly extends to insert the empty quartz boat body into the first group of turnover clamping assemblies and take out the dried quartz boat body and silicon wafers at the same time.

[0034] Furthermore, the quartz boat turnover assembly includes a rear frame, a fourth driving rod and a push rod, the inner wall of the rear frame is vertically provided with the fourth driving rod, the output end of the fourth driving rod is provided with a second cross plate, the inner wall of the second cross plate is symmetrically and slidably mounted with a second clamping plate, the second clamping plate is plugged into the assembly seat, the top inner wall of the rear frame is vertically provided with a push rod, the surface of the push rod is horizontally and slidably mounted with a sliding rod, the outer end surface of the sliding rod is provided with a placement plate for placing an empty quartz boat body, and the placement plate is connected to the second cross plate through a linkage rod.

[0035] Furthermore, the transfer drive assembly includes a center plate, a main shaft, a third motor and a bottom plate, the bottom plate is fixedly arranged at the inner bottom end of the center tube, the main shaft is rotatably mounted at the center of the surface of the bottom plate, the main shaft is driven to rotate by the third motor, the top end of the main shaft is provided with a center plate, and the center plate is placed above the center tube;

[0036] The turnover clamping assembly includes a first driving rod, which is vertically arranged on the surface of the center plate. An extension plate is vertically arranged on the top of the first driving rod. The end of the extension plate is connected to the first transverse plate. The bottom of the first transverse plate is symmetrically and slidably installed with a first clamping plate, and the first clamping plate is plugged into the assembly seat.

[0037] The present invention provides a solar silicon wafer cleaning and drying integrated processing device. Compared with the prior art, it has the following beneficial effects:

[0038] 1. The coordinated actions of the silicon wafer storage component and the support component simultaneously achieve the following effects: 1.1. The silicon wafer storage component can automatically receive the silicon wafers transported horizontally, and automatically transport the silicon wafers to the discharge position corresponding to the quartz boat body; 1.2. The silicon wafer storage component can cooperate with the support component to realize the rotation of the horizontal silicon wafer to the vertical silicon wafer, so as to realize the automatic longitudinal insertion of the vertical silicon wafer into the quartz boat body; 1.3. When the silicon wafer storage component is reset to the loading position, it can drive the first screw to rotate, so as to drive the pushing component to move horizontally to the next discharge position, realize the automatic displacement of the pushing component, and prepare for the next automatic plug-in loading.

[0039] 2. Use a quartz boat as a cleaning fixture for silicon wafers. In this way, after cleaning, the quartz boat and the silicon wafer can be directly transferred to the baking furnace to complete the heating treatment of the silicon wafer. The silicon wafer does not need to be transferred in the middle, and the cleaning and baking efficiency of the silicon wafer is higher.

[0040] 3. The central driving assembly and the turnover clamping assembly can drive the quartz boat and silicon wafer to circulate among four stations to realize automatic alternating operation; and the cleaning equipment is circular as a whole, occupying a smaller area. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0042] Figure 1 A schematic diagram of the structure of one side of the solar silicon wafer cleaning and drying integrated processing equipment of the present invention is shown;

[0043] Figure 2 A schematic diagram of the main tank structure of the present invention is shown;

[0044] Figure 3 The schematic diagram of the structure of the silicon wafer loading assembly of the present invention is shown;

[0045] Figure 4 A schematic diagram of the structure of the push component of the present invention is shown;

[0046] Figure 5 A schematic diagram of the structure of the silicon wafer storage assembly of the present invention is shown;

[0047] Figure 6 Shows Figure 3 A schematic diagram of the enlarged structure at point A;

[0048] Figure 7 A schematic diagram of the working structure of the translation drive assembly of the present invention is shown;

[0049] Figure 8 A schematic diagram of the structure of the turnover clamping assembly of the present invention is shown;

[0050] Fig. 9 The main structure diagram of the quartz boat of the present invention is shown;

[0051] Fig.10 A schematic diagram of the structure of the cover assembly of the present invention is shown;

[0052] Fig.11 The schematic diagram of the structure of the quartz boat turnover assembly of the present invention is shown;

[0053] Fig.12 The other side of the structural schematic diagram of the solar silicon wafer cleaning and drying integrated processing equipment of the present invention is shown;

[0054] As shown in the figure: 1. Main tank, 11. Pre-spray tank, 12. First ultrasonic cleaning tank, 13. Second ultrasonic cleaning tank, 14. Drying tank, 2. Turnover clamping assembly, 21. First driving rod, 22. Outer plate, 23. First horizontal plate, 24. First clamping plate, 3. Silicon wafer loading assembly, 31. Vertical frame, 32. Second driving rod, 33. Horizontal frame, 34. Support assembly, 341. Support plate, 3411. Through slot, 342. Side plate, 3421, notch, 343, first moving block, 344, flip rack, 35, silicon wafer storage assembly, 351, bracket, 3511, receiving groove, 352, second moving block, 353, resistance rod, 354, lifting frame, 355, flip gear, 36, first screw rod, 361, one-way gear, 37, second screw rod, 38, push assembly, 381, fifth driving rod, 382, ​​linkage frame, 383, push rod, 4 , cover assembly, 41, cover plate, 42, exhaust plate, 44, mesh plate, 441, lower cover, 45, hot air blower, 46, column, 47, linkage plate, 48, third drive rod, 49, second motor, 5, transfer drive assembly, 51, center plate, 52, spindle, 53, third motor, 54, bottom plate, 6, quartz boat turnover assembly, 61, rear frame, 62, fourth drive rod, 63, second cross plate, 64, second clamping plate, 6 5. Push rod, 66. Slide rod, 67. Placement plate, 68. Linkage rod, 7. Spray assembly, 71. Liquid pump, 72. Liquid pipe, 73. Spray pipe, 74. First connecting rod, 8. Translation drive assembly, 81. Second connecting rod, 82. Slide rail, 83. Spring rod, 84. Tooth plate, 85. Matching block, 9. Quartz boat body, 91. Side fixing plate, 92. Assembly seat, 93. Upper positioning strip, 94. Lower positioning strip, 95. Side positioning strip. DETAILED DESCRIPTION

[0055] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0056] Embodiment 1

[0057] In order to solve the technical problems in the background technology, the following solar silicon wafer cleaning and drying integrated processing equipment is provided:

[0058] Combination Figure 1-Figure 12As shown, the solar silicon wafer cleaning and drying integrated processing equipment provided by the present invention comprises a main tank body 1, which is a flat cylindrical structure, and the main tank body 1 is provided with a pre-spraying tank 11, a first ultrasonic cleaning tank 12, a second ultrasonic cleaning tank 13 and a drying tank 14 arranged in a counterclockwise order;

[0059] An independent central tube is provided at the inner center of the main tank 1, and a transfer drive assembly 5 is installed inside the central tube. Four groups of turnover clamping assemblies 2 distributed in a circular array are vertically installed on the top of the transfer drive assembly 5, and the bottom of each turnover clamping assembly 2 is matched with a quartz boat body 9; a silicon wafer loading assembly 3 is installed on the outer side of the pre-spraying tank 11;

[0060] The silicon wafer loading assembly 3 includes a longitudinal frame 31, a second driving rod 32, a transverse frame 33, a support assembly 34 and a silicon wafer storage assembly 35; the transverse frame 33 is slidably mounted on the top of the longitudinal frame 31, the inner wall of the longitudinal frame 31 is provided with a second driving rod 32 for driving the transverse frame 33 to translate longitudinally, the interior of the transverse frame 33 is parallelly mounted with a first screw 36 and a second screw 37, the bottom of the support assembly 34 is threadedly mounted on the first screw 36, the top of the support assembly 34 is transversely slidably mounted with a silicon wafer storage assembly 35, the bottom of the silicon wafer storage assembly 35 is threadedly connected to the second screw 37, and a pushing assembly 38 is vertically mounted at the discharge end of the support assembly 34;

[0061] The loading process of the silicon wafer loading assembly 3 includes the following steps: S1, the silicon wafer storage assembly is placed on the loading end of the support assembly 34, and the conveyor belt horizontally conveys the silicon wafer to the support assembly 34; S2, the second screw 37 rotates to drive the silicon wafer storage assembly to translate from the loading end to the discharging end; when the silicon wafer storage assembly arrives at the discharging end, the silicon wafer storage assembly rotates to drive the silicon wafer to flip from a horizontal state to a vertical state; S3, the pushing assembly 38 inserts the vertical silicon wafer into the quartz boat body 9 in the turnover clamping assembly 2; S4, the second screw 37 reverses to drive the silicon wafer storage assembly back to the loading end; S5, the silicon wafer storage assembly arrives at the loading end and drives the first screw 36 to rotate, and the first screw 36 drives the pushing assembly 38 to translate to the next discharging position.

[0062] In the above scheme:

[0063] 1. The coordinated actions of the silicon wafer storage component and the support component 34 simultaneously achieve the following effects: 1.1. The silicon wafer storage component can automatically receive the silicon wafers transported horizontally, and automatically transport the silicon wafers to the discharge position corresponding to the quartz boat body 9; 1.2. The silicon wafer storage component can cooperate with the support component 34 to realize the rotation of the horizontal silicon wafer to the vertical silicon wafer, so as to realize the automatic longitudinal insertion of the vertical silicon wafer into the quartz boat body 9; 1.3. When the silicon wafer storage component is reset to the loading position, it can drive the first screw 36 to rotate, so as to drive the pushing component 38 to move horizontally to the next discharge position, realize the automatic displacement of the pushing component 38, and prepare for the next automatic plug-in loading.

[0064] 2. Use a quartz boat as a cleaning fixture for silicon wafers. In this way, after cleaning, the quartz boat and the silicon wafer can be directly transferred to the baking furnace to complete the heating treatment of the silicon wafer. The silicon wafer does not need to be transferred in the middle, and the cleaning and baking efficiency of the silicon wafer is higher.

[0065] 3. The central driving assembly and the turnover clamping assembly 2 can drive the quartz boat and the silicon wafer to circulate among the four stations to realize automatic alternating operation; and the cleaning equipment is circular as a whole, occupying a smaller area.

[0066] In this embodiment, the silicon wafer storage assembly 35 includes a support 351, a lifting frame 354 and a flip gear 355. The surface of the support 351 is provided with a receiving groove 3511, and a second moving block 352 is vertically provided on the bottom surface of the support 351. The lifting frame 354 is rotatably installed inside the receiving groove 3511, and a flip gear 355 is provided at the connection between the lifting frame 354 and the support 351; the second moving block 352 is threadedly mounted on the second screw 37.

[0067] The support assembly 34 includes a support plate 341, a support seat 351 is slidably mounted on the surface of the support plate 341, a side plate 342 is vertically arranged on the surface discharge end of the support plate 341, a through groove 3411 is opened in the middle of the surface of the support plate 341, a second moving block 352 vertically slides through the through groove 3411, a first moving block 343 is vertically arranged on the bottom discharge end of the support plate 341, the first moving block 343 is threadedly mounted on the first screw 36, and a flip rack 344 is arranged on the side discharge end of the support plate 341;

[0068] In S2, when the silicon wafer storage assembly reaches the discharge end, the flip rack 344 drives the flip gear 355 and the lifting frame 354 to rotate, so as to drive the silicon wafer to flip to a vertical state, so that the silicon wafer is vertically placed between the lifting frame 354 and the side plate 342.

[0069] In the above scheme,

[0070] 1. Through the design of the flip gear 355 and the flip rack 344, when the bracket 351 is translated to the discharge position, the lifting frame 354 can be automatically flipped, and the silicon wafer can be automatically adjusted to a vertical state;

[0071] 2. The vertical silicon wafer can be stably placed between the lifting frame 354 and the side plate 342 to prevent the vertical silicon wafer from shifting;

[0072] 3. The design of the through groove 3411 enables the support plate 341 to slide independently to adjust the material discharge position without affecting the silicon wafer storage assembly 35.

[0073] In this embodiment, the pushing assembly 38 includes a fifth driving rod 381, a linkage frame 382 and a push rod 383. The fifth driving rod 381 is horizontally arranged on the outer wall of the side plate 342. The end of the fifth driving rod 381 is connected to the 7-shaped linkage frame 382. A notch 3421 is opened inside the side plate 342. A push rod 383 is vertically arranged at the end of the linkage frame 382. The push rod 383 is arranged vertically.

[0074] In S3 , the fifth driving rod 381 contracts to drive the push rod 383 to translate, and the push rod 383 pushes the silicon wafer between the side plate 342 and the lifting frame 354 to be inserted into the quartz boat body 9 .

[0075] In the above scheme, the fifth driving rod 381 drives the linkage frame 382 to telescopic movement, thereby driving the push rod 383 to translate. The push rod 383 can push out the silicon wafer at the discharge position to realize automatic discharge. The design of the notch 3421 can meet the telescopic movement needs of the linkage frame 382.

[0076] When the push assembly 38 completes one feeding, the push assembly 38 needs to automatically move to the next empty slot of the quartz boat body 9. To solve this problem, the following solution is given:

[0077] In this embodiment, a one-way gear 361 is provided on the outer wall of the second screw rod 37, and the bottom of the one-way gear 361 is meshedly connected to the translation drive assembly 8; a resistance rod 353 extending horizontally toward the upper material end is vertically provided on the side wall of the second moving block 352, and the translation drive assembly 8 includes a second connecting rod 81, a slide rail 82, a spring rod 83, a tooth plate 84 and a matching block 85. The second connecting rod 81 is fixed in the transverse frame 33, and a slide rail 82 extending longitudinally and horizontally is vertically provided at the end of the second connecting rod 81. A tooth plate 84 is slidably installed on the top of the slide rail 82, and a spring rod 83 is connected to the inner end of one side of the tooth plate 84. The end of the spring rod 83 is connected to the second connecting rod 81, and a matching block 85 is vertically provided on the other side of the tooth plate 84. The matching block 85 is located on the inner side of the resistance rod 353;

[0078] In S5, the abutment rod 353 abuts against the matching block 85 to move inward to drive the tooth plate 84 to translate inward, the tooth plate 84 translates to drive the one-way gear 361 to rotate, the one-way gear 361 rotates to drive the second screw 37 to rotate, so that the first moving block 343 and the pushing assembly 38 translate to the next discharge position.

[0079] In the above scheme:

[0080] 1. The one-way gear 361 is designed to rotate only in one direction, and the second screw 37 can only rotate to drive the support plate 341 to move horizontally toward the upper material end;

[0081] 2. When the wafer storage assembly 35 is reset to the loading end, the abutment rod 353 abuts against the matching block 85, so that the toothed plate 84 can drive the one-way gear 361 to rotate, thereby driving the support plate 341 to translate, so that the pushing assembly 38 automatically moves to each discharge position one by one.

[0082] In this embodiment, a spray assembly 7 is installed inside the pre-spray tank 11, and the spray assembly 7 includes a liquid extraction pump 71, a liquid extraction pipe 72, a spray pipe 73 and a first connecting rod 74. The liquid extraction pump 71 is placed at the bottom of the pre-spray tank 11, and the outlet end of the liquid extraction pump 71 is connected to the liquid extraction pipe 72, and the outlet end of the liquid extraction pipe 72 is connected to the spray pipe 73. The spray pipe 73 extends to the top of the quartz boat body 9, and the spray pipe 73 is fixedly connected to the side plate 342 through the first connecting rod 74; the spray pipe 73 sprays cleaning water to clean the silicon wafers inserted in the quartz boat body 9 one by one; the spray assembly 7 and the pushing assembly 38 are displaced synchronously.

[0083] In the above scheme:

[0084] 1. The liquid pump 71 can pump out the cleaning liquid to the spray pipe 73, and the spray pipe 73 can spray the cleaning water to pre-clean each silicon wafer just loaded, thereby improving the cleaning effect of the silicon wafer;

[0085] 2. The spray pipe 73 is fixed to the side plate 342 through the first connecting rod 74, so that the spray assembly 7 and the pushing assembly 38 can move synchronously. The spray pipe 73 can clean the silicon wafer just inserted into each slot.

[0086] In this embodiment, the quartz boat body 9 includes a side fixing plate 91, an assembly seat 92, an upper positioning bar 93, a lower positioning bar 94 and a side positioning bar 95. The upper positioning bar 93 is vertically arranged on the top between the two side fixing plates 91, the lower positioning bar 94 is vertically arranged on the bottom, and the side positioning bar 95 is vertically arranged on the rear side. The upper positioning bar 93, the lower positioning bar 94 and the side positioning bar 95 are all provided with slots for inserting silicon wafers; the opening of the quartz boat body 9 faces the pushing assembly 38; the outer wall bottoms of the two side fixing plates 91 are each provided with an assembly seat 92.

[0087] In this embodiment, the transfer drive assembly 5 includes a center plate 51, a main shaft 52, a third motor 53 and a bottom plate 54. The bottom plate 54 is fixed to the inner bottom end of the center tube. The main shaft 52 is rotatably mounted at the center of the surface of the bottom plate 54. The main shaft 52 is driven to rotate by the third motor 53. The top of the main shaft 52 is provided with a center plate 51, and the center plate 51 is placed above the center tube.

[0088] The turnover clamping assembly 2 includes a first driving rod 21, which is vertically arranged on the surface of the center plate 51. An extension plate 22 is vertically arranged on the top of the first driving rod 21. The end of the extension plate 22 is connected to the first transverse plate 23. The bottom of the first transverse plate 23 is symmetrically and slidably installed with a first clamping plate 24, and the first clamping plate 24 is plugged into the assembly seat 92.

[0089] In the above scheme:

[0090] The third motor 53 drives the main shaft 52 to rotate, thereby driving the center plate 51 and the four rotating clamping assemblies 2 above to rotate; the first clamping plate 24 can open and close to complete the clamping of the quartz boat body 9 for lowering; the first driving rod 21 can drive the first cross plate 23 to move up and down.

[0091] Embodiment 2

[0092] The quartz boat body 9 has the following defects when performing the drying operation: 1. After the quartz boat body 9 is dried, it is necessary to remove the dried quartz boat body 9 and the silicon wafer, and install the empty quartz boat body 9 on the turnover clamping assembly 2. The entire replacement operation is troublesome, and the silicon wafer and the quartz boat body 9 are heavy, making it difficult for workers to take and put them; 2. During drying, it is necessary to ensure sealing, and during loading and unloading, it is necessary to close; To solve the above problems, the following solutions are given:

[0093] Combination Figure 1-Figure 12 As shown, in this embodiment, the covering assembly 4 includes a cover plate 41 and a mesh plate 44, the top inner end of the drying tank 14 is rotatably covered with the cover plate 41, the interior of the central tube is installed with a second motor 49 for driving the cover plate 41 to rotate, the surface of the cover plate 41 is provided with an exhaust plate 42, the bottom of the drying tank 14 is an open structure, the middle part of the interior of the drying tank 14 is slidably installed with a mesh plate 44, the bottom of the mesh plate 44 is provided with a lower cover body 441, the interior of the lower cover body 441 is installed with a hot air blower 45, the bottom of the lower cover body 441 is provided with a column 46, the bottom end of the column 46 is vertically provided with a linkage plate 47, the outer end surface of the linkage plate 47 is vertically provided with a third driving rod 48, and the third driving rod 48 is vertically provided at the center of the bottom surface of the main tank body 1;

[0094] The cover assembly 4 includes the following states:

[0095] In the first state, the first group of turnover clamping components 2 drives the quartz boat body 9 and silicon wafers for secondary cleaning to rotate above the drying tank 14, and the second group of turnover clamping components 2 drives the quartz boat body 9 and silicon wafers for primary cleaning to rotate above the second ultrasonic cleaning tank 13;

[0096] In the second state, the second motor 49 drives the cover plate 41 to rotate to the top of the second ultrasonic cleaning tank 13, and the cover plate 41 is placed under the silicon wafer to be cleaned once;

[0097] In the third state, the first group of turnover clamping components 2 lowers the quartz boat body 9 and places it on the mesh plate 44. After the lowering is completed, the first group of turnover clamping components 2 is separated from the quartz boat body 9 and lifted up; at the same time, the exhaust plate 42 discharges the drying gas upward to the silicon wafers cleaned once above to purge the residual liquid of the silicon wafers cleaned once;

[0098] In the fourth state, the cover plate 41 rotates to close the drying tank 14, and the second group of turnover clamping components 2 clamps and lowers the silicon wafer into the second ultrasonic cleaning tank 13; the hot air blower 45 works to dry the silicon wafer on the mesh plate 44;

[0099] In the fifth state, after the drying operation is completed, the third driving rod 48 drives the mesh plate 44 and the lower cover 441 to descend, so that the dried quartz boat body 9 and silicon wafers are lowered and exposed; the quartz boat turnover assembly 6 extends to insert the empty quartz boat body 9 into the first group of turnover clamping assemblies 2 and take out the dried quartz boat body 9 and silicon wafers at the same time.

[0100] In the above scheme:

[0101] 1. The action of rotating the cover plate 41 to one side can achieve the following effects: 1.1. The drying tank 14 can be opened, so that the turnover clamping assembly 2 can lower the quartz boat onto the screen plate 44; 1.2. The cover plate 41 rotates to the second ultrasonic cleaning tank 13, and the exhaust plate 42 can exhaust gas to flush away the residual liquid on the silicon wafer, thereby preventing the liquid in the first ultrasonic cleaning tank 12 from transferring to the second ultrasonic cleaning tank 13;

[0102] 2. When the cover plate 41 rotates to the drying tank 14, the drying tank 14 can form a sealed structure to ensure the drying effect and prevent heat from dissipating;

[0103] 3. The mesh plate 44 and the lower cover 441 are designed to be vertically movable, so that the bottom discharge can be realized. In this way, there is no need to lower the turnover clamping assembly 2 again to clamp and take out the parts.

[0104] In this embodiment, the quartz boat turnover assembly 6 includes a rear frame 61, a fourth driving rod 62 and a push rod 65. The inner wall of the rear frame 61 is vertically provided with the fourth driving rod 62, and the output end of the fourth driving rod 62 is provided with a second cross plate 63. The inner wall of the second cross plate 63 is symmetrically and slidably installed with a second clamping plate 64. The second clamping plate 64 is plugged into the assembly seat 92. The top inner wall of the rear frame 61 is vertically provided with a push rod 65. The surface of the push rod 65 is horizontally and slidably installed with a slide rod 66. The outer end surface of the slide rod 66 is provided with a placement plate 67 for placing an empty quartz boat body 9. The placement plate 67 is connected to the second cross plate 63 through a linkage rod 68.

[0105] In the above scheme, when the drying is completed, the mesh plate 44 is lowered and opened. At this time, the dried silicon wafer is arranged opposite to the second clamping plate 64, and the placement plate 67 is arranged opposite to the turnover clamping assembly 2. The fourth driving rod 62 drives the placement plate 67 and the second clamping plate 64 to move forward. The second clamping plate 64 is clamped on both sides of the quartz boat body 9, and the first clamping plate 24 clamps the empty quartz boat body 9 on the placement plate 67. Subsequently, the fourth driving rod 62 drives the second cross plate 63 to retreat, so as to realize the unloading of the dried silicon wafer and the automatic loading of the empty quartz boat body 9.

[0106] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0107] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. Solar silicon wafer cleaning and drying integrated processing equipment, characterized by: It includes a main tank body, which is a flat cylindrical structure, and the interior of the main tank body is provided with a pre-spraying tank, a first ultrasonic cleaning tank, a second ultrasonic cleaning tank and a drying tank which are arranged in a counterclockwise order; An independent central tube is provided at the center of the main tank, and a transfer drive assembly is installed inside the central tube. Four groups of turnover clamping assemblies distributed in a circular array are vertically installed on the top of the transfer drive assembly. The bottom of each turnover clamping assembly is matched with the quartz boat body; a silicon wafer loading assembly is installed on the outside of the pre-spray tank; The silicon wafer loading assembly comprises a longitudinal frame, a second driving rod, a transverse frame, a supporting assembly and a silicon wafer storage assembly; the transverse frame is slidably mounted on the top of the longitudinal frame, the inner wall of the longitudinal frame is provided with a second driving rod for driving the transverse frame to translate longitudinally, the interior of the transverse frame is provided with a first screw and a second screw in parallel, the bottom thread of the supporting assembly is installed on the first screw, the top of the supporting assembly is laterally slidably mounted with a silicon wafer storage assembly, the bottom thread of the silicon wafer storage assembly is connected to the second screw, and the discharging end of the supporting assembly is vertically provided with a pushing assembly; The loading process of the silicon wafer loading assembly includes the following steps: S1. The silicon wafer storage assembly is placed at the loading end of the support assembly, and the conveyor belt horizontally transports the silicon wafers to the support assembly; S2, the second screw rotates to drive the silicon wafer storage assembly to move horizontally from the loading end to the discharging end; when the silicon wafer storage assembly arrives at the discharging end, the silicon wafer storage assembly rotates to drive the silicon wafer to flip from a horizontal state to a vertical state; S3, the pushing component inserts the vertical silicon wafer into the quartz boat body in the turnover clamping component; S4, the second screw is reversed to drive the silicon wafer storage assembly back to the loading end; S5, the silicon wafer storage assembly arrives at the loading end and drives the first screw to rotate, and the first screw drives the pushing assembly to move horizontally to the next discharging position.

2. The solar silicon wafer cleaning and drying integrated processing equipment according to claim 1 is characterized in that: The silicon wafer storage assembly includes a support, a lifting frame and a flipping gear. The support has a surface receiving groove, and a second moving block is vertically provided on the bottom surface of the support. The lifting frame is rotatably installed inside the receiving groove, and a flipping gear is provided at the connection between the lifting frame and the support; the second moving block is threadedly mounted on the second screw.

3. The solar silicon wafer cleaning and drying integrated processing equipment according to claim 2 is characterized in that: The support assembly includes a support plate, a bracket is slidably mounted on the surface of the support plate, a side plate is vertically arranged at the surface discharge end of the support plate, a through groove is opened in the middle of the surface of the support plate, a second moving block vertically slides through the through groove, a first moving block is vertically arranged at the bottom discharge end of the support plate, the first moving block is threadedly mounted on the first screw, and a flip rack is arranged at the side discharge end of the support plate; In S2, when the silicon wafer storage assembly reaches the discharge end, the flip rack drives the flip gear and the lifting frame to rotate, so as to drive the silicon wafer to flip to a vertical state, so that the silicon wafer is vertically placed between the lifting frame and the side plate.

4. The solar silicon wafer cleaning and drying integrated processing equipment according to claim 3 is characterized in that: The pushing assembly includes a second driving rod, a linkage frame and a push rod, the second driving rod is horizontally arranged on the outer wall of the side plate, the end of the second driving rod is connected to the 7-shaped linkage frame, a notch is opened inside the side plate, a push rod is vertically arranged at the end of the linkage frame, and the push rod is arranged vertically; In S3, the second driving rod contracts to drive the push rod to translate, and the push rod pushes the silicon wafer between the side plate and the lifting frame to be inserted into the quartz boat body.

5. The solar silicon wafer cleaning and drying integrated processing equipment according to claim 4 is characterized in that: The outer wall of the second screw is provided with a one-way gear, and the bottom of the one-way gear is meshed and connected to the translation drive assembly; the side wall of the second moving block is vertically provided with a resistance rod extending horizontally to the upper material end, and the translation drive assembly includes a second connecting rod, a slide rail, a spring rod, a tooth plate and a matching block. The second connecting rod is fixed in the horizontal frame, and the end of the second connecting rod is vertically provided with a slide rail extending longitudinally and horizontally. The top of the slide rail is slidably installed with a tooth plate, the inner end of one side of the tooth plate is connected to the spring rod, and the end of the spring rod is connected to the second connecting rod. The other side of the tooth plate is vertically provided with a matching block, and the matching block is located on the inner side of the resistance rod; In S5, the abutment rod abuts the matching block to move inward to drive the tooth plate to translate inward, the tooth plate translates to drive the one-way gear to rotate, the one-way gear rotates to drive the second screw to rotate, so that the first moving block and the pushing assembly translate to the next discharge position.

6. The solar silicon wafer cleaning and drying integrated processing equipment according to claim 5, characterized in that: A spray assembly is installed inside the pre-spray tank, and the spray assembly includes a liquid extraction pump, a liquid extraction pipe, a spray pipe and a first connecting rod. The liquid extraction pump is placed at the inner bottom of the pre-spray tank, the outlet end of the liquid extraction pump is connected to the liquid extraction pipe, the outlet end of the liquid extraction pipe is connected to the spray pipe, the spray pipe extends to the top of the quartz boat body, and the spray pipe is fixedly connected to the side plate through the first connecting rod; the spray pipe sprays cleaning water to clean the silicon wafers inserted in the quartz boat body one by one; the spray assembly and the pushing assembly move synchronously.

7. The solar silicon wafer cleaning and drying integrated processing equipment according to claim 6, characterized in that: The quartz boat body includes side fixing plates, an assembly seat, an upper positioning bar, a lower positioning bar and a side positioning bar. An upper positioning bar is vertically arranged on the top between the two side fixing plates, a lower positioning bar is vertically arranged on the bottom, and a side positioning bar is vertically arranged on the rear side. The upper positioning bar, the lower positioning bar and the side positioning bar are all provided with slots for inserting silicon wafers. The opening of the quartz boat body faces the pushing assembly. Assembly seats are arranged on the bottom of the outer walls of the two side fixing plates.

8. The solar silicon wafer cleaning and drying integrated processing equipment according to claim 7, characterized in that: The transfer drive assembly includes a center plate, a main shaft, a third motor and a bottom plate. The bottom plate is fixedly arranged at the inner bottom end of the center tube. The main shaft is rotatably mounted at the center of the surface of the bottom plate. The main shaft is driven to rotate by the third motor. The top of the main shaft is provided with a center plate, and the center plate is placed above the center tube. The turnover clamping assembly includes a first driving rod, which is vertically arranged on the surface of the center plate. An extension plate is vertically arranged on the top of the first driving rod. The end of the extension plate is connected to the first transverse plate. The bottom of the first transverse plate is symmetrically and slidably installed with a first clamping plate, and the first clamping plate is plugged into the assembly seat.

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