Adhesion and pressing mechanism and film tearing and adhesion and pressing equipment

Abstract

The application discloses a pasting and pressing mechanism which is used for pasting a pasting object on an object on a pasting platform, the pasting object comprising a first element, the pasting and pressing mechanism comprising a rack, a main lifting mechanism which drives the rack to perform a lifting action in a vertical direction, a main pressing mechanism which is installed on the rack and has a main pasting head which moves in the vertical direction relative to the rack and corresponds to the first element, a first lifting part which drives the main pasting head to perform a lifting action in the vertical direction relative to the rack, and a control mechanism which detects a first pressure detection signal of the main pasting head pressing and controls the main lifting mechanism to perform an action so that the rack descends a preset stroke to make a main pressing surface of the main pasting head be at a first preset distance from the object on the pasting platform when pasting; the control mechanism controls the first lifting part to drive the main pasting head to descend at a slow speed until the first pressure detection signal reaches a first preset value and then stops so that the first element is attached to the object. The application has the advantages of accurate control and good pasting effect. The application further discloses a film tearing and pasting pressing equipment.

Description

Technical Field

[0001] This invention relates to the field of machinery, and more particularly to a bonding and pressing mechanism and a film-peeling bonding and pressing device. Background Technology

[0002] In mobile phone manufacturing, a photosensitive element needs to be attached to the glass cover. This requires peeling off the thin film from the photosensitive element and then pressing the edge with the film removed onto the corresponding position on the glass cover. However, because the glass cover is relatively brittle, excessive pressure during bonding can crack the screen, while insufficient pressure will result in a weak bond. Current technology controls the pressing head to move downwards by a preset distance to press the photosensitive element onto the glass cover. However, this limited distance makes it difficult to ensure a secure bond without cracking the glass cover, resulting in poor bonding performance and low control precision.

[0003] Therefore, there is an urgent need for a mounting and pressing mechanism that can solve the above problems. Summary of the Invention

[0004] The purpose of this invention is to provide a mounting and pressing mechanism and a film-peeling mounting and pressing device. The mounting and pressing mechanism first controls the main adhesive head to descend through the stroke control, then controls the main adhesive head to descend gradually at a slow speed and controls the descent of the main adhesive head through the pressing force of the main adhesive head, ensuring that the glass cover does not break while the photosensitive element is completely attached to the glass cover screen, resulting in a good pressing effect.

[0005] To achieve the above objectives, the present invention discloses a mounting and pressing mechanism for mounting an object onto a mounting platform. The object includes a first element and a frame; a main lifting mechanism that drives the frame to move vertically up and down; a main pressing mechanism mounted on the frame and having a main adhesive head that moves vertically relative to the frame and corresponds to the first element; a first lifting part that drives the main adhesive head to move vertically up and down relative to the frame; and a control mechanism including one or more processors, one or more memories, and at least one executable instruction stored in the memory. The at least one executable instruction enables the processor to detect a first pressure detection signal of the main adhesive head pressing and to execute the following mounting method during the mounting operation: controlling the main lifting mechanism to move so that the frame descends a preset stroke and then stops, the main pressing surface of the main adhesive head descends with the frame and is at a first preset distance from the object on the mounting platform; controlling the first lifting part to move so that the main adhesive head descends slowly until the first pressure detection signal reaches a first preset value and then stops, so that the first element is attached to the object.

[0006] Preferably, the main pressing mechanism further includes a first support, a main pressing assembly, and a first elastic element. The first support is slidably mounted on the frame in a vertical direction, and the main pressing assembly is slidably mounted on the first support in a vertical direction. The main adhesive head on the main pressing assembly is located on the side of the main pressing assembly away from the first support. The first elastic element is installed between the first support and the main pressing assembly and provides a downward buffering force to the main adhesive head. The first lifting part drives the first support to move relative to the frame. This first elastic element can further improve the pressing effect by "controlling the descent of the main adhesive head through the pressing force of the main adhesive head".

[0007] Specifically, the bonding and pressing mechanism further includes a first pressure sensor, which is installed at one end of the first elastic element and detects the first upward impact force of the main adhesive head. The control mechanism calculates the first pressure detection signal based on the first impact force and the gravity of the main adhesive head.

[0008] Preferably, "controlling the main lifting mechanism to lower the frame by a preset distance and then stop" specifically includes: controlling the main lifting mechanism to lower the main adhesive head at a high speed to a second preset distance above the object; when the second preset distance is reached, lowering the main adhesive head at a low speed to a first preset distance above the object and switching to a slow speed state; in the slow speed state, limiting the descent speed of the main adhesive head to a slow speed; the second preset distance is greater than the first preset distance; the high speed is greater than the low speed; and the low speed is greater than the slow speed.

[0009] Wherein, the high speed is 500 mm / s, the low speed is 20 mm / s, the slow speed is 2 mm / s, the first preset distance is 0.3 mm, and the second preset distance is 5 mm.

[0010] Preferably, the main pressing surface of the main adhesive head is a suction cup surface with vacuum suction holes, so that the mounting pressing mechanism can pick up and release the object to be mounted. The main pressing surface adsorbs the first element during the mounting operation until the first element is attached to the object and then releases the first element.

[0011] Preferably, the mounting material further includes a second element flexibly connected to the first element, the area of ​​the first element being larger than that of the second element. The mounting pressing mechanism further includes: a pressing mechanism mounted on the frame and having a secondary adhesive head that moves vertically relative to the frame and corresponds to the second element; a second lifting part that drives the secondary adhesive head to move vertically relative to the frame; the at least one executable instruction can also cause the processor to detect a second pressure detection signal of the secondary adhesive head pressing; in the mounting method, before "controlling the first lifting part to lower the main adhesive head until the first pressure detection signal reaches a first preset value and stops to attach the first element to the object", the method further includes: controlling the second lifting part to lower the secondary adhesive head slowly until the second pressure detection signal reaches a second preset value and stops to attach the second element to the object; controlling the second lifting part to raise and reset the secondary adhesive head. This solution allows the present invention to be used for the bonding and pressing of multiple components in a component group, bonding and pressing multiple components one by one, and controlling the corresponding adhesive head to rise and reset after bonding and pressing one component, preventing interference with the bonding and pressing of another adhesive head. Furthermore, this invention first pastes the smaller components and then the larger components, reducing the impact of the first-pasted components on the alignment of the later-pasted components.

[0012] Specifically, the pressing mechanism further includes a second bracket, a pressing assembly, and a second elastic element. The second bracket is slidably mounted on the frame in a vertical direction. The pressing assembly is slidably mounted on the second bracket in a vertical direction. The adhesive head of the pressing assembly is located on the side of the pressing assembly away from the second bracket. The second elastic element is installed between the second bracket and the pressing assembly and provides a downward buffering force to the adhesive head. The second lifting part drives the second bracket to move relative to the frame, effectively improving the pressing effect.

[0013] More specifically, the mounting and pressing mechanism further includes a second pressure sensor, which is mounted on one end of the second elastic element and detects the second impact force from the adhesive head, and calculates the second pressure detection signal based on the second impact force and the weight of the adhesive head.

[0014] Specifically, "controlling the main lifting mechanism to lower the frame by a preset distance and then stop" includes: controlling the main lifting mechanism to lower the adhesive head at a high speed to a second preset distance above the object; when the second preset distance is reached, lowering the adhesive head at a low speed to a first preset distance above the object and switching to a slow speed state; in the slow speed state, limiting the descent speed of the adhesive head to a slow speed; the second preset distance is greater than the first preset distance; the high speed is greater than the low speed; and the low speed is greater than the slow speed.

[0015] Specifically, the pressing surface of the adhesive head is a suction cup surface with vacuum suction holes, so that the mounting pressing mechanism can pick up and release the second element. The pressing surface adsorbs the second element during the mounting operation until the second element is attached to the object and then releases the second element.

[0016] Wherein, the high speed is 500 mm / s, the low speed is 20 mm / s, the slow speed is 2 mm / s, the first preset distance is 0.3 mm, and the second preset distance is 5 mm.

[0017] Preferably, the slow speed is greater than or equal to 1 mm / s and less than or equal to 5 mm / s, and the first preset distance is greater than or equal to 0.2 mm and less than or equal to 0.8 mm.

[0018] Preferably, the first element is a flexible component, and the main pressing surface of the main adhesive head is a suction cup surface with vacuum suction holes, so that the mounting pressing mechanism can pick up and release the first element. The main pressing surface is a convex surface that gradually decreases from the center to the periphery, and the height difference between the center of the main pressing surface and the periphery is greater than or equal to a first preset value and less than or equal to a second preset value. During the mounting operation, the main pressing surface adsorbs the first element until it is attached to the object, and then releases the first element, so that the present invention can also be used for material picking and pasting. This solution ensures that the main pressing surface picks up and positions the first element, while also ensuring that there are few air bubbles between the main pressing surface and the first element, and that the adsorption is stable. It also ensures that during the mounting operation, the center of the first element contacts the target object first, which helps to expel gas during mounting and effectively reduces air bubbles between the first element and the object during mounting.

[0019] More preferably, the vacuum suction holes on the main pressing surface are a first vacuum suction hole and a second vacuum suction hole with relatively independent vacuum control. The diameter of the first vacuum suction hole is a first diameter, and the diameter of the second vacuum suction hole is a second diameter and a third diameter. The first diameter is larger than the second diameter, and the second diameter is larger than the third diameter. The main pressing surface has a first corner and a second corner arranged diagonally. The third diameter, the second diameter, and the first diameter extend from the first corner to the second corner. The second corner is a pull-out position. In the first vacuum suction hole and the second vacuum suction hole, the larger the diameter, the greater the vacuum suction force, which effectively prevents the film from breaking after half of the film is torn off.

[0020] This invention also discloses a film-peeling and bonding equipment, including a material picking platform, a film-peeling position, a bonding platform, a film-peeling section, a three-axis conveying mechanism, and a bonding and bonding mechanism. The bonding and bonding mechanism is as described above. The three-axis conveying mechanism drives the bonding and bonding mechanism to move between the material picking platform, the film-peeling position, and the bonding platform. The at least one executable command can also cause the control mechanism to execute a material picking and film-peeling method. The material picking and film-peeling method includes: controlling the bonding and bonding mechanism to move above the material picking platform and grabbing the bonding material; controlling the bonding and bonding mechanism to move to the film-peeling position, controlling the film-peeling section to grab the film of the first element at the pull position of the main bonding surface, and gradually peeling off the film from the pull position; after the film peeling is completed, controlling the bonding and bonding mechanism to carry the bonding material to move above the bonding platform to perform the bonding operation to execute the bonding method.

[0021] Preferably, during the film removal process, the vacuum level of the vacuum suction hole on the main bonding surface is also detected. Based on the position of the film removal, it is determined whether the vacuum environment of the vacuum suction hole in the unremoved part is damaged. If so, it is determined that the film on the first element is broken and the film removal action is stopped. The package is then marked as a defective product and placed in the recycling bin.

[0022] Compared with the prior art, the mounting and pressing mechanism of the present invention first controls the descent of the main adhesive head through stroke control, then controls the main adhesive head to descend slowly and gradually, and controls the descent time of the main adhesive head through the pressing force of the main adhesive head, so as to ensure that the glass cover does not break while the photosensitive element is completely attached to the glass cover screen, resulting in a good pressing effect. Attached Figure Description

[0023] Figure 1 This is a partial perspective view of the film-peeling, pasting, and pressing equipment of the present invention.

[0024] Figure 2 This is a perspective view of the mounting and pressing mechanism of the present invention from one angle.

[0025] Figure 3 This is a perspective view of the mounting and pressing mechanism of the present invention from another angle.

[0026] Figure 4 yes Figure 3 A magnified view of a portion of the image.

[0027] Figure 5 This is a top view of the main pressing component.

[0028] Figure 6 It is along Figure 5 A partial sectional view taken along the EE line.

[0029] Figure 7 This is a side view of the mounting and pressing mechanism of the present invention.

[0030] Figures 8a to 8e This is a flowchart illustrating the mounting and pressing mechanism of the present invention performing mounting operations.

[0031] Figure 9 This is a perspective view of the mounting and pressing mechanism of the present invention performing mounting operations.

[0032] Figure 10 This is a flowchart of the mounting method in Embodiment 1 of the present invention.

[0033] Figure 11 This is a flowchart of the mounting method in Embodiment 2 of the present invention. Detailed Implementation

[0034] To illustrate the technical content, structural features, objectives, and effects of the present invention in detail, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0035] Example 1:

[0036] refer to Figure 1 This invention discloses a film-peeling, bonding, and pressing device 100, including a material picking platform, a film-peeling position, a pressing platform 101, a film-peeling section, a three-axis conveying mechanism 1, a bonding and pressing mechanism 2, and a control mechanism. The control mechanism controls the operation of the three-axis conveying mechanism 1, the film-peeling section, and the bonding and pressing mechanism 2. The three-axis conveying mechanism 1 drives the bonding and pressing mechanism 2 to move between the material picking platform, the film-peeling position, and the pressing platform 101 to complete the material picking, film peeling, and bonding operations, respectively, so that the object to be bonded is adhered and pressed onto an object 203 on the pressing platform 101 (e.g., a film-peeling, film-setting, and pressing device). Figures 8a to 8e ).

[0037] The control mechanism includes one or more processors, one or more memories, and at least one executable instruction stored in the memory, wherein the at least one executable instruction enables the processor to execute a corresponding method.

[0038] The at least one executable instruction enables the processor to execute the material picking and film peeling method and the mounting method.

[0039] refer to Figures 2 to 4 The mounting material includes a first element 201. The mounting and pressing mechanism 2 includes a frame 41, a main lifting mechanism 42, a main pressing mechanism, and a first lifting part 23. The main lifting mechanism 42 drives the frame 41 to move up and down in the vertical direction. The main pressing mechanism is mounted on the frame 41 and has a main adhesive head 21 that moves vertically relative to the frame 41 and corresponds to the first element 201. The first lifting part 23 drives the main adhesive head 21 to move up and down in the vertical direction relative to the frame 41.

[0040] refer to Figure 2 and Figure 3 The main pressing mechanism further includes a first support 22, a main pressing assembly 20, and a first elastic element 24. The first support 22 is slidably mounted on the frame 41 in the vertical direction. The main pressing assembly 20 is slidably mounted on the first support 22 in the vertical direction. The main adhesive head 21 on the main pressing assembly 20 is located on the side of the main pressing assembly 20 away from the first support 22. The first elastic element 24 is installed between the first support 22 and the main pressing assembly 20 and provides a downward buffering force to the main adhesive head 21. The first lifting part 23 drives the first support 22 to move relative to the frame 41.

[0041] refer to Figures 4 to 6 The main pressing surface 211 of the main adhesive head 21 is a suction cup surface with vacuum suction holes, so that the mounting pressing mechanism 2 can pick up and release the first element 201. The main pressing surface 211 adsorbs the first element 201 during the mounting operation until the first element 201 is attached to the object 203 and then releases the first element 201.

[0042] refer to Figure 6 The first element is a flexible component with a certain degree of bending and compressibility. The main pressing surface 211 is a convex surface that gradually decreases from the center to the periphery. The height difference between the center of the main pressing surface 211 and the periphery edge is greater than or equal to a first preset value and less than or equal to a second preset value. During the mounting operation, the main pressing surface 211 adsorbs the first element 201 until the first element 201 is attached to the object 203, after which the first element 201 is released.

[0043] In this embodiment, the first preset value is 0.1 mm, and the second preset value is 0.3 mm. Of course, the first and second preset values ​​can also be other values ​​set according to actual needs. The first preset value is set to ensure a sufficient height difference between the center and periphery of the first adsorption surface 211, ensuring that most of the air is expelled during adsorption positioning or adhesion to the object, and is not limited to 0.1 mm. The second preset value is determined by the flexibility of the first element 201 and the suction force of the main pressing surface 211. It needs to ensure that under the suction force of the main pressing surface 211, the periphery of the first element 201 can deform and adhere to the main pressing surface 211, and this value is not limited to 0.3 mm.

[0044] The main pressing surface 211 is a conical or spherical surface that gradually decreases in size from the center outwards.

[0045] In this embodiment, the first aperture is 3mm, the second aperture is 2mm, and the third aperture is 1mm.

[0046] refer to Figure 5 and Figure 6 The vacuum suction holes on the main pressing surface 211 are a first vacuum suction hole 251 and a second vacuum suction hole 252 with relatively independent vacuum control. The diameter of the first vacuum suction hole 251 is a first diameter, and the diameter of the second vacuum suction hole 252 is a second diameter and a third diameter. The first diameter is larger than the second diameter, and the second diameter is larger than the third diameter. The main pressing surface 211 has a first corner B and a second corner A arranged diagonally. The third diameter, the second diameter, and the first diameter extend from the first corner B to the second corner A. The second corner A is the pull-out position. In the first vacuum suction hole 251 and the second vacuum suction hole 252, the larger the diameter, the greater the vacuum suction force, which effectively prevents the film from breaking after half of the film is torn off.

[0047] The material removal and film-tearing method includes steps S21 to S23.

[0048] S21, control the mounting and pressing mechanism 2 to move above the material picking platform and pick up the mounting material.

[0049] Specifically, step S21 includes: controlling the operation of the three-axis conveyor mechanism 1, which drives the mounting and pressing mechanism 2 to move above the picking platform; controlling the operation of the main lifting mechanism 42 to lower the main pressing surface 211 to a preset distance above the first component 201; controlling the operation of the first lifting part 23 to make the main pressing surface 211 contact the first component 201; controlling the vacuum suction holes on the main pressing surface 211 to start adsorbing the first component 201, so that the first component 201 is gradually adsorbed onto the main pressing surface 211 from the center outwards; and controlling the operation of the main lifting mechanism 42 and / or the first lifting part 23 to make the main pressing surface 211 carry the first component 201 upwards to detach from the picking platform.

[0050] S22, control the three-axis conveying mechanism 1 to move the mounting and pressing mechanism 2 to the film-tearing position and perform film tearing.

[0051] Specifically, step S22 includes: controlling the three-axis conveying mechanism 1 to move the mounting and pressing mechanism 2 to the film-tearing position; controlling the film-tearing part to grab the film of the first element 201 at the pull position of the main pressing surface 211; after grabbing, moving the film-tearing part or controlling the main lifting mechanism 42 and / or the first lifting part 23 to move the main pressing surface 211 carrying the first element 201 to rise, and the film is gradually peeled off from the second corner A to the first corner B of the main pressing surface 211.

[0052] Preferably, when peeling off the film, the vacuum level of the vacuum suction holes (251, 252) of the main pressing surface 211 is also detected. Based on the position of the film peeling, it is determined whether the vacuum environment of the vacuum suction holes in the unpeeled part is damaged. If so, it is determined that the film on the first element 201 is broken and the film peeling action is stopped. The package is marked as a defective product and placed in the recycling bin.

[0053] S23, After the film is peeled off, the three-axis conveyor 1 is controlled to move, so that the mounting and pressing mechanism 2 carries the mounting material to the pressing table 101 to perform the mounting operation and execute the mounting method (e.g., ...). Figure 9 (As shown).

[0054] refer to Figures 7 to 9 as well as Figure 10 The mounting method is used for mounting operations and includes steps S11 to S13.

[0055] S11, detect the first pressure detection signal of the main adhesive head 21 pressing.

[0056] Specifically, the mounting and pressing mechanism 2 also includes a first pressure sensor 26, which is installed at one end of the first elastic member 24 and detects the first upward impact force of the main adhesive head 21. In step S11, the first pressure detection signal is calculated based on the first impact force and the gravity of the main adhesive head 21.

[0057] S12, control the main lifting mechanism 42 to move so that the frame 41 descends a preset stroke and then stops. The main pressing surface 211 of the main adhesive head 21 descends with the frame 41 and is at a first preset distance from the object 203 on the mounting platform. (e.g.) Figure 8a (As shown)

[0058] Specifically, step S12 includes: S121, controlling the main lifting mechanism 42 to descend the main adhesive head 21 at a high speed to a second preset distance above the object 203, and then switching to a low-speed state; S122, driving the main adhesive head 21 to descend at a low speed to a first preset distance above the object 203 and then switching to a slow-speed state. In the slow-speed state, the descent speed of the main adhesive head 21 is limited to a slow speed. The second preset distance is greater than the first preset distance, the high speed is greater than the low speed, and the low speed is greater than the slow speed.

[0059] In this embodiment, the high speed is 500 mm / s, the low speed is 20 mm / s, the slow speed is 2 mm / s, the first preset distance is 0.3 mm, and the second preset distance is 5 mm. Of course, the high speed, low speed, slow speed, first preset distance, and second preset distance are not limited to the above values. Preferably, the slow speed is greater than or equal to 1 mm / s and less than or equal to 5 mm / s, and the first preset distance is preferably greater than or equal to 0.2 mm and less than or equal to 0.8 mm.

[0060] S13, control the first lifting part 23 to move so that the main adhesive head 21 descends slowly until the first pressure detection signal reaches the first preset value and stops. Control the vacuum suction holes (251, 252) of the main pressing surface 211 to release the first element 201 so that the first element 201 is attached to the object 203. The center of the first element 201 contacts the object 203 first, and then the edges gradually contact the object 203, and the attachment is completed under the pressure of the main pressing surface 211. (e.g.) Figure 8d (As shown)

[0061] Preferably, the mounting method further includes step S14, controlling the first lifting part 23 to move so that the main adhesive head 21 rises and resets. Of course, in step S14, the main lifting mechanism 42 can be directly controlled to move so that the entire frame 41 rises and resets. (e.g.) Figure 8e (As shown)

[0062] The main lifting mechanism 42 is a stepper motor, and the second lifting part 33 is a cylinder.

[0063] Example 2:

[0064] In this embodiment, the mounting material is a photosensitive element assembly. The first element 201 is a photosensitive part with a certain degree of flexibility and compressibility, and the second element 202 is a circuit part. The entire photosensitive element assembly is formed on a flexible circuit board, allowing for a flexible connection between the first element 201 and the second element 202. The object 203 is a mobile phone glass cover. The area of ​​the first element 201 is larger than that of the second element 202.

[0065] Unlike Embodiment 1, the mounting and pressing mechanism 2 further includes a pressing mechanism and a second lifting part 33. The pressing mechanism is mounted on the frame 41 and has a sticking head 31 that moves vertically relative to the frame 41 and corresponds to the second element 202. The second lifting part 33 drives the sticking head 31 to move vertically relative to the frame 41.

[0066] The pressing mechanism further includes a second bracket 32, a pressing assembly 30, and a second elastic element 34. The second bracket 32 ​​is slidably mounted on the frame 41 in a vertical direction. The pressing assembly 30 is slidably mounted on the second bracket 32 ​​in a vertical direction. The adhesive head 31 of the pressing assembly 30 is located on the side of the pressing assembly 30 away from the second bracket 32. The second elastic element 34 is installed between the second bracket 32 ​​and the pressing assembly 30 and provides a downward buffering force to the adhesive head 31. The second lifting part 33 drives the second bracket 32 ​​to move relative to the frame 41, effectively improving the pressing effect.

[0067] More specifically, the mounting and pressing mechanism 2 also includes a second pressure sensor, which is mounted on one end of the second elastic member 34 and detects the second impact force from the adhesive head 31, and calculates the second pressure detection signal based on the second impact force and the gravity of the adhesive head 31.

[0068] The pressing surface 311 of the adhesive head 31 is a suction cup surface with a vacuum suction hole 351, so that the mounting pressing mechanism 2 can pick up and release the object to be mounted. The pressing surface 311 adsorbs the second element 202 during the mounting operation until the second element 202 is attached to the object 203 and then releases the second element 202.

[0069] In this embodiment, the material taking and film tearing method includes steps S21a to S23.

[0070] S21a, control the mounting and pressing mechanism 2 to move above the material picking platform and pick up the mounting material.

[0071] Specifically, step S21 includes: controlling the operation of the three-axis conveyor mechanism 1, which drives the mounting and pressing mechanism 2 to move above the material handling platform; controlling the operation of the main lifting mechanism 42 to lower the main pressing surface 211 to a preset distance above the first component 201; controlling the operation of the first lifting part 23 to make the main pressing surface 211 contact the first component 201; and controlling the operation of the second lifting part 33 to make the secondary pressing surface 311 contact the second component 202. The vacuum suction holes on the main pressing surface 211 are controlled to begin adsorbing the first component 201, so that the first component 201 gradually adheres to the main pressing surface 211 from the center outwards; the vacuum suction holes on the secondary pressing surface 311 are controlled to begin adsorbing the second component 202, so that the second component 202 is adsorbed and positioned on the secondary pressing surface 311. Control the main lifting mechanism 42 and / or the first lifting part 23 and the second lifting part 33 to make the main pressing surface 211 carry the first component 201 up to get off the picking table, and carry the second component 202 up from the pressing surface 311 to get off the picking table.

[0072] S22, control the three-axis conveying mechanism 1 to move the mounting and pressing mechanism 2 to the film-tearing position and perform film tearing.

[0073] Specifically, step S22 includes: controlling the three-axis conveying mechanism 1 to move the mounting and pressing mechanism 2 to the film-tearing position; controlling the film-tearing part to grab the film of the first element 201 at the pull position of the main pressing surface 211; after grabbing, moving the film-tearing part or controlling the main lifting mechanism 42 and / or the first lifting part 23 to move the main pressing surface 211 carrying the first element 201 to rise, and the film is gradually peeled off from the second corner A to the first corner B of the main pressing surface 211.

[0074] Preferably, when peeling the film, the vacuum level of the vacuum suction hole of the main pressing surface 211 is also detected. Based on the position of the peeling film, it is determined whether the vacuum environment of the vacuum suction hole (251, 252) of the unpeeled part is damaged. If so, it is determined that the film on the first element 201 is broken and the peeling action is stopped. The attached product is marked as a defective product and placed in the recycling bin.

[0075] S23, After the film is peeled off, the three-axis conveying mechanism 1 is controlled to move so that the mounting and pressing mechanism 2 carries the mounting material to the pressing table 101 to perform the mounting operation and execute the mounting method.

[0076] refer to Figures 7 to 9 as well as Figure 11 The mounting method is used for mounting operations and includes steps S11a to S13a.

[0077] S11a, Detect the first pressure detection signal of the main adhesive head 21 pressing together. S11b, Detect the second pressure detection signal of the auxiliary adhesive head 31 pressing together.

[0078] The mounting and pressing mechanism 2 also includes a first pressure sensor 26 and a second pressure sensor 36. The first pressure sensor 26 is installed at one end of the first elastic member 24 and detects the first upward impact force of the main adhesive head 21. The second pressure sensor 36 is installed at one end of the second elastic member 34 and detects the second impact force of the secondary adhesive head 31. In step S11, the first pressure detection signal is calculated based on the first impact force and the gravity of the main adhesive head 21, and the second pressure detection signal is calculated based on the second impact force and the gravity of the secondary adhesive head 31.

[0079] In this embodiment, the sum of the first impact force and the gravity of the main adhesive head 21 is the first pressure detection signal, and the sum of the second impact force and the gravity of the secondary adhesive head 31 is the second pressure detection signal.

[0080] S12, control the main lifting mechanism 42 to move so that the frame 41 descends a preset stroke and then stops. The main pressing surface 211 of the main adhesive head 21 descends with the frame 41 and is at a first preset distance from the object 203 on the mounting platform. (e.g.) Figure 8a (As shown)

[0081] In the initial state, the main pressing surface 211 of the main adhesive head 21 and the secondary pressing surface 311 of the secondary adhesive head 31 are set at the same height, or the secondary pressing surface 311 is higher than the main pressing surface 211. This ensures that when the main pressing surface 211 descends with the frame 41 and is at a first preset distance from the object 203 on the mounting platform, there is also a preset range of distance between the secondary pressing surface 311 and the object 203. This preset range is preferably greater than or equal to 0.2 mm and less than or equal to 0.8 mm.

[0082] Specifically, step S12 includes: S121, controlling the main lifting mechanism 42 to descend the main adhesive head 21 at a high speed to a second preset distance above the object 203, and then switching to a low-speed state; S122, driving the main adhesive head 21 to descend at a low speed to a first preset distance above the object 203 and then switching to a slow-speed state. In the slow-speed state, the descent speed of the main adhesive head 21 is limited to a slow speed. The second preset distance is greater than the first preset distance, the high speed is greater than the low speed, and the low speed is greater than the slow speed.

[0083] In this embodiment, the high speed is 500 mm / s, the low speed is 20 mm / s, the slow speed is 2 mm / s, the first preset distance is 0.3 mm, and the second preset distance is 5 mm. Of course, the high speed, low speed, slow speed, first preset distance, and second preset distance are not limited to the above values. Preferably, the slow speed is greater than or equal to 1 mm / s and less than or equal to 5 mm / s, and the first preset distance is preferably greater than or equal to 0.2 mm and less than or equal to 0.8 mm.

[0084] S13a, control the second lifting part 33 to move so that the adhesive head 31 descends slowly until the second pressure detection signal reaches the second preset value and stops; control the vacuum suction hole 351 of the pressing surface 311 to move to release the second element 202, so that the second element 202 is attached to the object 203. (e.g.) Figure 8b (As shown)

[0085] S14a, control the second lifting part 33 to move so that the adhesive head 31 rises and resets. (e.g.) Figure 8c (As shown)

[0086] In this embodiment, the adhesive head 31 is raised 1.5mm to reset.

[0087] S15, control the first lifting part 23 to move so that the main adhesive head 21 descends slowly until the first pressure detection signal reaches the first preset value and stops. Control the vacuum suction holes (251, 252) of the main pressing surface 211 to move to release the first element 201 so that the first element 201 is attached to the object 203. The center of the first element 201 contacts the object 203 first, and then the edges gradually contact the object 203, and the attachment is completed under the pressure of the main pressing surface 211. (e.g.) Figure 8d (As shown)

[0088] Preferably, the mounting method further includes step S16, controlling the first lifting part 23 to move so that the main adhesive head 21 rises and resets. Of course, in step S16, the main lifting mechanism 42 can be directly controlled to move so that the entire frame 41 rises and resets. (e.g.) Figure 8e (As shown)

[0089] The main lifting mechanism 42 is a stepper motor, and the first lifting part 23 and the second lifting part 33 are cylinders.

[0090] The above-disclosed embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Therefore, any equivalent variations made in accordance with the claims of the present invention are still within the scope of the present invention.

Claims

1. A mounting press mechanism for mounting a mounting object on an article of a mounting platform, the mounting object including a first element, characterized by: include frame; The main lifting mechanism drives the frame to move up and down in the vertical direction; The main pressing mechanism is mounted on the frame and has a main bonding head that moves vertically relative to the frame and corresponds to the first element; The first lifting unit drives the main adhesive head to move up and down relative to the frame in the vertical direction; The control mechanism includes one or more processors, one or more memories, and at least one executable instruction stored in the memories. The at least one executable instruction enables the processor to detect a first pressure detection signal of the main adhesive head pressing together and to execute the following mounting method during the mounting operation: The main lifting mechanism is controlled to descend the frame by a preset stroke and then stop. The main pressing surface of the main adhesive head descends with the frame and is at a first preset distance from the object on the mounting platform. The first lifting part is controlled to cause the main adhesive head to descend slowly until the first pressure detection signal reaches a first preset value, thereby attaching the first element to the object. The main pressing mechanism further includes a first bracket, a main pressing assembly, and a first elastic element. The first bracket is slidably mounted on the frame in the vertical direction. The main pressing assembly is slidably mounted on the first bracket in the vertical direction. The main adhesive head on the main pressing assembly is located on the side of the main pressing assembly away from the first bracket. The first elastic element is installed between the first bracket and the main pressing assembly and provides a downward buffering force to the main adhesive head. The first lifting part drives the first bracket to move relative to the frame.

2. The pick-and-place bonding mechanism of claim 1, wherein: The mount further includes a second element flexibly connected to the first element, wherein the area of ​​the first element is larger than that of the second element, and the mount pressing mechanism further includes: From the pressing mechanism, mounted on the frame and having a bonding head that moves vertically relative to the frame and corresponds to the second element; The second lifting unit drives the adhesive head to move vertically relative to the frame. The at least one executable instruction may also cause the processor to detect the second pressure detection signal from the bonding head; the mounting method further includes, before "controlling the first lifting part to lower the main bonding head until the first pressure detection signal reaches a first preset value and then stopping to attach the first element to the object": Control the movement of the second lifting part to make the adhesive head descend slowly until the second pressure detection signal reaches the second preset value and then stop, so that the second element is attached to the object; Control the second lifting part to make the adhesive head rise and reset.

3. The pick-and-place bonding mechanism of claim 2, wherein: The pressing mechanism further includes a second bracket, a pressing assembly, and a second elastic element. The second bracket is slidably mounted on the frame in a vertical direction. The pressing assembly is slidably mounted on the second bracket in a vertical direction. The adhesive head of the pressing assembly is located on the side of the pressing assembly away from the second bracket. The second elastic element is installed between the second bracket and the pressing assembly and provides a downward buffering force to the adhesive head. The second lifting part drives the second bracket to move relative to the frame.

4. The mounting and pressing mechanism as described in claim 3, characterized in that: It also includes a first pressure sensor and a second pressure sensor. The first pressure sensor is installed at one end of the first elastic element and detects the first upward impact force of the main adhesive head. The second pressure sensor is installed at one end of the second elastic element and detects the second impact force of the secondary adhesive head. The control mechanism calculates the first pressure detection signal based on the first impact force and the weight of the main adhesive head, and calculates the second pressure detection signal based on the second impact force and the weight of the secondary adhesive head.

5. The mounting and pressing mechanism as described in claim 2, characterized in that: "Controlling the main lifting mechanism to lower the frame by a preset distance and then stop" specifically includes: controlling the main lifting mechanism to lower the main adhesive head and the secondary adhesive head at a high speed to a second preset distance above the object; when the second preset distance is reached, lowering the main adhesive head and the secondary adhesive head at a low speed to a first preset distance above the object and switching to a slow speed state; in the slow speed state, limiting the descent speed of the main adhesive head and the secondary adhesive head to a slow speed; the second preset distance is greater than the first preset distance; the high speed is greater than the low speed; and the low speed is greater than the slow speed.

6. The mounting and pressing mechanism as described in claim 2, characterized in that: The main pressing surface of the main adhesive head and the secondary pressing surface of the secondary adhesive head are suction cup surfaces with vacuum suction holes, so that the mounting pressing mechanism can pick up and release the object to be mounted. During the mounting operation, the main pressing surface adsorbs the first element until the first element is attached to the object and then releases the first element. During the mounting operation, the secondary pressing surface adsorbs the second element until the second element is attached to the object and then releases the second element.

7. The mounting and pressing mechanism as described in claim 1, characterized in that: The slow speed is greater than or equal to 1 mm / s and less than or equal to 5 mm / s, and the first preset distance is greater than or equal to 0.2 mm and less than or equal to 0.8 mm.

8. The mounting and pressing mechanism as described in any one of claims 1-7, characterized in that: The first element is a flexible component, and the main pressing surface of the main adhesive head is a suction cup surface with vacuum suction holes, so that the mounting pressing mechanism can pick up and release the first element. The main pressing surface is a convex surface that gradually decreases from the middle to the periphery, and the height difference between the center of the main pressing surface and the periphery edge is greater than or equal to a first preset value and less than or equal to a second preset value. The main bonding surface adsorbs the first element during the mounting operation until the first element is attached to the object, after which the first element is released.

9. The mounting and pressing mechanism as described in claim 8, characterized in that: The vacuum suction holes on the main pressing surface are a first vacuum suction hole and a second vacuum suction hole with relatively independent vacuum control. The diameter of the first vacuum suction hole is a first diameter, and the diameter of the second vacuum suction hole is a second diameter and a third diameter. The first diameter is larger than the second diameter, and the second diameter is larger than the third diameter. The main pressing surface has a first corner and a second corner arranged diagonally. The third diameter, the second diameter, and the first diameter extend from the first corner to the second corner. The second corner is a pull-out position. In the first vacuum suction hole and the second vacuum suction hole, the larger the diameter, the greater the vacuum suction force.

10. A film-peeling, bonding, and pressing device, characterized in that: The system includes a material picking platform, a film tearing position, a pressing platform, a film tearing section, a three-axis conveying mechanism, and a mounting pressing mechanism. The mounting pressing mechanism is as described in claim 8. The three-axis conveying mechanism drives the mounting pressing mechanism to move between the material picking platform, the film tearing position, and the pressing platform. The at least one executable instruction can also cause the control mechanism to execute a material picking and film tearing method, which includes: The mounting and pressing mechanism is controlled to move above the material picking platform and pick up the mounting material; the mounting and pressing mechanism is controlled to move to the film tearing position, and the film tearing part is controlled to pick up the film of the first element at the pull position of the main pressing surface, and gradually tear off the film from the pull position; after the film is torn off, the mounting and pressing mechanism is controlled to carry the mounting material to move above the pressing platform to perform the mounting operation to execute the mounting method.

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