Self-cleaning coating, self-cleaning structure, manufacturing method, glass curtain wall and monitoring device

By setting an electrodeformable structure with a conductive layer and an array of adhesive columns on the substrate surface, and using an alternating electric field to make the nano-adhesive columns vibrate, the problem of decreased function of existing self-cleaning coatings is solved, and the active cleaning effect of monitoring equipment is achieved.

CN117800615BActive Publication Date: 2026-03-03ZHEJIANG DAHUA TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-12-20
Publication Date
2026-03-03

AI Technical Summary

Technical Problem

Existing hydrophobic and hydrophilic self-cleaning coatings lose their self-cleaning function during long-term outdoor use, failing to achieve effective active cleaning and affecting the imaging quality of monitoring equipment.

Method used

A conductive layer is formed on the substrate surface, and an array of adhesive pillars is formed on it. Electrodeformable structures are set on the nano-adhesive pillars of the adhesive pillar array. By introducing alternating current into the conductive layer, the electrodeformable structures are repeatedly stretched or contracted under the alternating electric field, causing the adhesive pillar array to vibrate, thereby achieving mechanical active dust removal.

Benefits of technology

It enables the self-cleaning coating to effectively and actively clean itself during long-term outdoor use, thereby improving the imaging quality of monitoring equipment.

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Abstract

The application discloses a self-cleaning coating, a self-cleaning structure, a manufacturing method, a glass curtain wall and a monitoring device, and relates to the technical field of self-cleaning coatings.The self-cleaning coating comprises a conductive layer and a glue column array layer arranged on at least one side surface of the conductive layer, wherein the glue column array layer comprises a plurality of nanometer glue columns, one end of each nanometer glue column is connected with the conductive layer, and at least one electro-deformation structural member is arranged on the side surface of each nanometer glue column, and the at least one electro-deformation structural member of each nanometer glue column is arranged at intervals from the conductive layer.The self-cleaning coating disclosed by the application ensures the conductivity of the surface of the substrate by arranging the conductive layer on the surface of the substrate, and at least one electro-deformation structural member is arranged on each nanometer glue column of the glue column array layer arranged on the surface of the conductive layer, and the at least one electro-deformation structural member is arranged at intervals from the conductive layer, so that the electro-deformation structural member is deformed under the action of an alternating electric field, and the glue column array layer is vibrated, thereby realizing mechanical active dust removal.
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Description

Technical Field

[0001] This application relates to the field of window coating technology, and in particular to a self-cleaning coating, a self-cleaning structure, a manufacturing method, a glass curtain wall, and a monitoring device. Background Technology

[0002] Outdoor devices, such as surveillance equipment used in open-air venues, often accumulate dirt and dust on their viewing surfaces, affecting image quality. To address this issue, some researchers have developed hydrophobic and hydrophilic self-cleaning coatings for inactive decontamination. However, both hydrophilic and hydrophobic films will experience a decline in self-cleaning function during long-term outdoor use, rendering active cleaning impossible. Summary of the Invention

[0003] This application discloses a self-cleaning coating, a self-cleaning structure, a manufacturing method, a glass curtain wall, and a monitoring device, to provide a coating capable of active cleaning.

[0004] To achieve the above objectives, this application provides the following technical solution:

[0005] In a first aspect, this application provides a self-cleaning coating, comprising:

[0006] Conductive layer;

[0007] A glue pillar array layer is disposed on at least one surface of the conductive layer, the glue pillar array layer comprising a plurality of nano glue pillars, one end of each nano glue pillar being connected to the conductive layer;

[0008] Each of the nanopillars has at least one electrodeformable structure on its side, and the at least one electrodeformable structure of each nanopillar is spaced apart from the conductive layer.

[0009] The self-cleaning coating of this application achieves its self-cleaning function by setting a conductive layer on the substrate surface to ensure the conductivity of the substrate surface, and setting an array of adhesive pillars on the surface of the conductive layer. Each nanopillar of the adhesive pillar array layer has at least one electrodeformable structure, and the at least one electrodeformable structure is spaced apart from the conductive layer. Specifically, when dust removal is required, alternating current is introduced into the conductive layer. Under the action of the applied alternating electric field, the electrodeformable structure on the adhesive pillar array layer repeatedly elongates or contracts, thereby causing the adhesive pillar array layer to vibrate and achieving mechanical active dust removal.

[0010] In some embodiments, the distance between the electrodeformable structure of each nanopillar, which is spaced apart from the conductive layer, and the conductive layer is greater than or equal to half the height of the nanopillar.

[0011] In some embodiments, each of the nanopillars has two electrodeformable structures on its side. The two electrodeformable structures of any nanopillar are staggered along the height direction of the nanopillar. One of the electrodeformable structures is spaced apart from the conductive layer, and the other electrodeformable structure is connected to the conductive layer.

[0012] In some embodiments, within the orthographic projection plane of the conductive layer, two of the electrodeformable structural members of any one of the nanopillars are arranged along a first direction.

[0013] In some embodiments, the orthographic projection of the nanopillar on the conductive layer is a rectangle or a regular polygon, and two electrodeformable structural members of each nanopillar are respectively disposed on two opposite sides of the nanopillar.

[0014] In some embodiments, the nanopillar is a silica nanopillar.

[0015] In some embodiments, the height of each nanopillar perpendicular to the first direction is 20-40 nm. In some embodiments, the material of the electrodeformable structure includes at least one of nano-lead zirconate titanate or nano-barium titanate.

[0016] In some embodiments, the thickness of the conductive layer is 10-15 nm; the material of the conductive layer includes gold or platinum.

[0017] In a second aspect, this application provides a self-cleaning structure, including a self-cleaning coating and a substrate as described in the first aspect, wherein the self-cleaning coating is disposed on at least one side surface of the substrate.

[0018] In some embodiments, the substrate is a glass substrate.

[0019] Thirdly, this application provides a method for manufacturing a self-cleaning coating, comprising:

[0020] A substrate covered with a conductive layer is provided, and a columnar adhesive array layer is formed on the surface of the conductive layer;

[0021] Electrodeformable structures are formed on the side of each nanopillar in the adhesive pillar array layer, and the self-cleaning coating is formed on the substrate surface.

[0022] In some embodiments, a glue pillar array layer is formed on the surface of the conductive layer, including:

[0023] A mask structure with a hole array is formed on the surface of the conductive layer. The substrate with the mask structure is placed in a silica fume solution for electrophoresis treatment. A silica nanopillar array is formed on the surface of the conductive layer corresponding to the hole array of the mask structure. The mask structure is removed to obtain the pillar array layer.

[0024] In some embodiments, a mask structure having an array of holes is provided on the surface of the conductive layer, including:

[0025] A metal layer is formed on the surface of the conductive layer opposite to the substrate;

[0026] The side of the metal layer facing away from the substrate is subjected to surface oxidation treatment to form a metal oxide layer on the surface of the metal layer;

[0027] Photoresist is coated on the surface of the metal oxide layer, and the hole array is obtained by sequential exposure and development treatment and wet etching treatment.

[0028] Remove the remaining photoresist to form the mask structure.

[0029] In some embodiments, the thickness of the metal layer is 1.2-1.5 μm, and the material of the metal layer includes aluminum or zinc.

[0030] In some embodiments, the thickness of the metal oxide layer is 0.8-1.0 μm.

[0031] In some embodiments, the diameter of each hole in the hole array is d = 0.8-1.2 μm, and the spacing between any adjacent holes is D = 0.8-1.2 μm.

[0032] In some embodiments, an electrodeformable structure is formed on the side of each nanopillar of the adhesive pillar array layer, including:

[0033] The silica nanopillar array layer is placed in a modified electrodeformable material dispersion for surface adsorption treatment, forming an electrodeformable structure layer on the surface of the silica nanopillar array. The electrodeformable structure layer is etched to form an electrodeformable structure, and the conductive layer outside the corresponding area of ​​the silica nanopillar is etched away to obtain a self-cleaning coating.

[0034] Fourthly, this application provides a glass curtain wall including the self-cleaning structure described in the second aspect.

[0035] Fifthly, this application provides a monitoring device including the self-cleaning structure as described in the second aspect. Attached Figure Description

[0036] Figure 1This is a schematic diagram of the structure of a self-cleaning coating provided in an embodiment of this application;

[0037] Figure 2 This is a schematic diagram of another self-cleaning coating provided in an embodiment of this application;

[0038] Figure 3 This is a schematic diagram of another self-cleaning coating provided in an embodiment of this application;

[0039] Figure 4 This is a process flow diagram for a method of manufacturing a self-cleaning coating provided in an embodiment of this application.

[0040] Icons: 1. Substrate; 2. Conductive layer; 3. Adhesive pillar array layer; 31. Nanoparticle adhesive pillar; 4. Electrodeformable structure; 5. Metal layer; 6. Metal oxide layer; 7. Photoresist; 8. Hole array; 9. Mask structure. Detailed Implementation

[0041] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application. In the description of the embodiments of this application, unless otherwise stated, " / " means "or", for example, A / B can mean A or B; "and / or" in the text is merely a description of the relationship between related objects, indicating that there can be three relationships, for example, A and / or B can represent: A alone, A and B at the same time, and B alone. In addition, in the description of the embodiments of this application, "multiple" means two or more.

[0042] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature, and in the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0043] In a first aspect, embodiments of this application provide a self-cleaning coating, which can be disposed on one side surface of a substrate. The self-cleaning coating includes a conductive layer, a columnar adhesive array layer, and an electrodeformable structural component.

[0044] Figure 1 This is a schematic diagram of a self-cleaning coating provided in an embodiment of this application. Figure 1As shown, a column array layer 3 is disposed on at least one side surface of the conductive layer 2. The column array layer 3 includes a plurality of nanocolumns 31, one end of each nanocolumn 31 being connected to the conductive layer 2. Each nanocolumn 31 has at least one electrodeformable structure 4 on its side, and the at least one electrodeformable structure 4 of each nanocolumn 31 is spaced apart from the conductive layer 2. The conductive layer 2 is made of gold or platinum, and its thickness is 10-15 nm, such as 10 nm, 11 nm, 12 nm, 13 nm, 14 nm, 15 nm, etc. The nanocolumns 31 are silica nanocolumns. The electrodeformable structure 4 is made of at least one of nano-lead zirconate titanate or nano-barium titanate.

[0045] As an example, refer to Figure 1 Each nanopillar 31 is provided with an electrodeformable structure 4, and each electrodeformable structure 4 is spaced apart from the conductive layer 2. The height of each nanopillar 31 along the thickness direction of the conductive layer 2 is 20-40 nm, such as 20 nm, 25 nm, 30 nm, 35 nm, 40 nm, etc. When an alternating current is applied to the conductive layer 2, the electrons and holes inside each electrodeformable structure 4 will move and become polarized under the action of the applied alternating electric field, thereby causing the electrodeformable structure 4 to elongate or contract and deform, which in turn causes the nanopillar 31 to vibrate, thus realizing mechanical active dust removal.

[0046] Continue to refer to Figure 1 The distance between the electrodeformable structural member 4, which is spaced apart from the conductive layer 2, and the conductive layer 2 is greater than or equal to half the height of the nano-adhesive column 31. The purpose of this arrangement is that when the electrodeformable structural member 4 deforms, each nano-adhesive column 31 can achieve a larger amplitude vibration, thereby improving the dust removal effect.

[0047] Figure 2 This is a schematic diagram of another self-cleaning coating provided in an embodiment of this application. Figure 3 As shown, two electrodeformable structural members 4 of any nanopillar 31 are staggered along the height direction of the nanopillar 31 and are located on both sides of the horizontal centerline of the nanopillar 31. One electrodeformable structural member 4 is spaced apart from the conductive layer 2, and the other electrodeformable structural member 4 is connected to the conductive layer 2. Figure 3As shown in the diagram, under the influence of an external electric field, the electrodeformable structural members 4 on the upper left and lower right sides of each nano-adhesive column 31 will undergo elongation or contraction deformation. For example, under the influence of an external electric field, if both the upper left and lower right electrodeformable structural members 4 elongate, the nano-adhesive column 31 will rotate to the left during the deformation of the electrodeformable structural members 4. When the direction of the electric field changes, both the upper left and lower right electrodeformable structural members 4 contract, and the nano-adhesive column 31 will rotate to the right during the deformation of the electrodeformable structural members 4. This process repeats itself; under the influence of an external alternating electric field, the electrodeformable structural members 4 undergo repeated elongation or contraction deformation, thereby causing the nano-adhesive column 31 to vibrate, achieving mechanical active dust removal. When the electrodeformable structure 4 on the lower right side deforms, it will exert a force on the lower part of the nano-adhesive column 31, increasing the vibration amplitude and improving the dust removal effect.

[0048] Figure 3 This is a schematic diagram of another self-cleaning coating provided in an embodiment of this application. Figure 2 As shown, each nanopillar 31 has two electrodeformable structural members 4 on its side. In the orthographic projection plane of the conductive layer 2, the two electrodeformable structural members 4 of any nanopillar 31 are arranged in the same direction, such as along the first direction ( Figure 2 It is positioned in a direction parallel to conductive layer 2. For example... Figure 2 In the orientation shown, under the action of an external electric field, the electrodeformable structural component 4 on the left and the electrodeformable structural component 4 on the right of each nano-adhesive column 31 will undergo elongation or contraction deformation. Under this condition, the vibration amplitude of each nano-adhesive column 31 can be further increased, thereby improving the dust removal effect.

[0049] The nanopillars 31 have a rectangular or regular polygonal orthographic projection onto the conductive layer, and two electrodeformable structural members 4 are respectively disposed on two opposite sides of each nanopillar 31. (Refer to...) Figure 2-3 As a preferred option, the nano-adhesive column 31 has a quadrangular prism structure. Under the action of an external electric field, the deformation of the electrodeformable structural component 4 causes the vibration of each nano-adhesive column 31, thereby achieving dust removal.

[0050] It should be noted that, Figure 1-3 This is merely one embodiment of the design of the nano-adhesive column 31. In other words, if a better dust removal effect can be achieved, the nano-adhesive column 31 can also be designed as a column of other shapes, such as a hexagonal prism, an octagonal prism, etc.

[0051] Secondly, embodiments of this application also provide a self-cleaning structure, including a self-cleaning coating and a substrate as described in the first aspect. The substrate is a glass substrate. Since the self-cleaning structure includes all the technical features of the self-cleaning coating, it also includes all the beneficial effects of the self-cleaning coating, which will not be elaborated further here.

[0052] Thirdly, embodiments of this application also provide a method for manufacturing a self-cleaning coating, referring to... Figure 4 Specifically, it includes the following steps:

[0053] (1) A metal layer 5 is formed on the side of the conductive layer 2 that is away from the substrate 1;

[0054] (2) Surface oxidation treatment is performed on the side of the metal layer 5 that is away from the substrate 1 to form a metal oxide layer 6 on the surface of the metal layer 5.

[0055] (3) Photoresist 7 is coated on the surface of the metal oxide layer, and after exposure and development and wet etching, a hole array 8 is obtained.

[0056] (4) Remove the remaining photoresist 7 and form a mask structure 9 with a hole array 8 on the surface of the conductive layer.

[0057] (5) The substrate 1 with the mask structure 9 is placed in the silica gel solution for electrophoresis treatment, and a silica nanopillar array is formed on the surface of the conductive layer 2 corresponding to the hole array 8 of the mask structure 9. The mask structure 9 is removed to obtain the pillar array layer 3.

[0058] (6) The gel pillar array layer 3 is placed in the modified electrodeformable material dispersion for surface adsorption treatment, and an electrodeformable structure layer is formed on the surface of the silica nano gel pillar array. The electrodeformable structure layer is etched to form an electrodeformable structure 4, and the conductive layer 2 outside the corresponding area of ​​the silica nano gel pillar is etched away to form a self-cleaning coating on the surface of the substrate 1.

[0059] It should be noted that before creating the self-cleaning coating, the substrate 1 needs to be ultrasonically cleaned and naturally dried, and pre-treated. Pre-treatment includes any one of ozone treatment, plasma cleaning, or ultraviolet grafting.

[0060] In some embodiments, the metal layer 5 is made of either pure aluminum or pure zinc, and has a thickness of 1.2-1.5 μm, such as 1.2 μm, 1.25 μm, 1.3 μm, 1.35 μm, 1.4 μm, 1.45 μm, 1.5 μm, etc. The metal oxide layer 6 has a thickness of 0.8-1.0 μm, such as 0.8 μm, 0.85 μm, 0.9 μm, 0.95 μm, 1.0 μm, etc. The diameter of each hole in the hole array 8 is d = 0.8-1.2 μm, such as 0.8 μm, 0.85 μm, 0.9 μm, 0.95 μm, 1.0 μm, 1.05 μm, 1.1 μm, 1.15 μm, 1.2 μm, etc. The spacing between any two adjacent holes is D = 0.8-1.2 μm, such as 0.8 μm, 0.85 μm, 0.9 μm, 0.95 μm, 1.0 μm, 1.05 μm, 1.1 μm, 1.15 μm, 1.2 μm, etc.

[0061] This application obtains a self-cleaning coating through the above-described manufacturing method. The coating adopts a pure inorganic material system and does not require external stimulation. Only by applying alternating current to the conductive layer 2, the internal electrons and holes of the electrodeformable structure 4 will move and become polarized under the action of the external electric field, thereby causing the electrodeformable structure 4 to elongate and contract, which in turn causes the nano-colloidal column 31 to vibrate, thus achieving mechanical active dust removal.

[0062] In one specific embodiment, the method for preparing the self-cleaning coating includes the following steps:

[0063] (1) Ultrasonic cleaning of glass substrate, followed by natural drying, followed by plasma cleaning for 10 min;

[0064] (2) Place the glass substrate into the chamber and prepare a platinum layer by magnetron sputtering with a thickness of 10 nm.

[0065] (3) A layer of aluminum metal was prepared on the surface of the platinum layer by magnetron sputtering, with a thickness controlled to be 1.2 μm;

[0066] (4) The aluminum metal layer is subjected to surface anodizing treatment in sulfuric acid solution with a sulfuric acid concentration of 160 g / L, a voltage of 18 V, and a time of 4 min to form an aluminum oxide layer on the surface of the aluminum metal layer with a thickness of 0.8 μm.

[0067] (5) Photoresist is coated on the surface of the aluminum oxide layer, and after exposure and development treatment and wet etching treatment, a hole array is obtained. The etching solution is hydrochloric acid, the hole diameter is d = 1 μm, and the spacing is D = 1 μm.

[0068] (6) Remove the remaining photoresist and form a mask structure with an array of holes (composed of aluminum oxide and metallic aluminum) on the surface of the platinum layer.

[0069] (7) The glass substrate with the mask structure is placed in the silica gel solution for electrophoresis treatment. A silica nanopillar array is formed on the surface of the platinum layer corresponding to the hole array of the mask structure. The mask structure is removed by chemical etching (the solution is hydrochloric acid) to obtain the pillar array layer. The voltage of the electrophoresis process is controlled at 1V, the pH value is controlled at 2, and the time is controlled at 20min.

[0070] (8) The gel pillar array layer is placed in the modified electrodeformable material dispersion for surface adsorption treatment to form an electrodeformable structure layer on the surface of the silica nano gel pillar array.

[0071] (9) The electrodeformable structure layer is laser-etched to form an electrodeformable structure, and the platinum layer outside the corresponding area of ​​the silicon dioxide nanopillar is removed by laser etching. The laser spot size is 400nm, and the etching time of the electrodeformable structure layer is 1min. After introducing AC current into the substrate, a mechanical swing self-cleaning coating is formed.

[0072] According to national standard testing methods, the self-cleaning coating did not corrode or peel off after 800 hours of use, and its salt spray resistance was good. After 336 hours of rapid temperature change, its self-cleaning performance remained good. After being placed outdoors for 30 days, the transmittance changed by less than 1%, which means that the dustproof effect was good.

[0073] It should be further noted that the solution used in the wet etching process is hydrochloric acid. The platinum layer does not react with the hydrochloric acid, thus ensuring the conductivity of the glass surface. Simultaneously, it can serve as a negative electrode substrate to construct a positively charged silica nanopillar array. By adding anionic surfactants to disperse and modify the electrodeformable material, it is electrostatically adsorbed onto the surface of the silica nanopillar array. The anionic surfactants include any one of sodium dodecylbenzenesulfonate or sodium dodecylcarboxylate. Furthermore, the platinum layer does not adsorb the electrodeformable material, ensuring that the bottom of the silica nanopillar array will not move under an alternating electric field, thereby improving the reliability of the coating.

[0074] Fourthly, embodiments of this application also provide a glass curtain wall, including the self-cleaning structure as described in the second aspect. Since the glass curtain wall includes the self-cleaning structure, and the self-cleaning structure includes all the technical features of the self-cleaning coating, the glass curtain wall also includes all the beneficial effects of the self-cleaning coating, which will not be elaborated further here.

[0075] Fifthly, embodiments of this application also provide a monitoring device, including the self-cleaning structure as described in the second aspect. Since the monitoring device includes the self-cleaning structure, and the self-cleaning structure includes all the technical features of the self-cleaning coating, the monitoring device also includes all the beneficial effects of the self-cleaning coating, which will not be elaborated further here.

[0076] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A self-cleaning coating, characterized in that, include: Conductive layer; A glue pillar array layer is disposed on at least one surface of the conductive layer, the glue pillar array layer comprising a plurality of nano glue pillars, one end of each nano glue pillar being connected to the conductive layer; Each of the nanopillars has at least one electrodeformable structure on its side, and the at least one electrodeformable structure of each nanopillar is spaced apart from the conductive layer.

2. The self-cleaning coating according to claim 1, characterized in that, The electrodeformable structural element of each nanopillar, spaced apart from the conductive layer, is at a distance greater than or equal to half the height of the nanopillar.

3. The self-cleaning coating according to claim 1, characterized in that, Each of the nanopillars has two electrodeformable structures on its side. The two electrodeformable structures of any nanopillar are staggered along the height direction of the nanopillar. One of the electrodeformable structures is spaced apart from the conductive layer, and the other electrodeformable structure is connected to the conductive layer.

4. The self-cleaning coating according to claim 3, characterized in that, Within the orthographic projection plane of the conductive layer, two electrodeformable structural members of any one of the nanopillars are arranged along a first direction.

5. The self-cleaning coating according to claim 4, characterized in that, The orthographic projection of the nanopillar onto the conductive layer is a rectangle or a regular polygon, and two electrodeformable structural components of each nanopillar are respectively disposed on two opposite sides of the nanopillar.

6. The self-cleaning coating according to any one of claims 1-5, characterized in that, The nanopillars are silica nanopillars.

7. The self-cleaning coating according to any one of claims 1-5, characterized in that, The height of each nanopillar perpendicular to the first direction is 20-40 nm.

8. The self-cleaning coating according to any one of claims 1-5, characterized in that, The material of the electrodeformable structure includes at least one of nano-lead zirconate titanate or nano-barium titanate.

9. The self-cleaning coating according to any one of claims 1-4, characterized in that, The thickness of the conductive layer is 10-15 nm; the material of the conductive layer includes gold or platinum.

10. A self-cleaning structure, characterized in that, Includes a self-cleaning coating and a substrate as described in any one of claims 1-9, wherein the self-cleaning coating is disposed on at least one side surface of the substrate.

11. The self-cleaning structure according to claim 10, characterized in that, The substrate is a glass substrate.

12. A method for manufacturing a self-cleaning coating, characterized in that, include: A substrate covered with a conductive layer is provided, and a columnar adhesive array layer is formed on the surface of the conductive layer; Electrodeformable structures are formed on the side of each nanopillar in the adhesive pillar array layer, and the self-cleaning coating is formed on the substrate surface.

13. The manufacturing method according to claim 12, characterized in that, A columnar adhesive array layer is formed on the surface of the conductive layer, comprising: A mask structure with a hole array is formed on the surface of the conductive layer. The substrate with the mask structure is placed in a silica fume solution for electrophoresis treatment. A silica nanopillar array is formed on the surface of the conductive layer corresponding to the hole array of the mask structure. The mask structure is removed to obtain the pillar array layer.

14. The manufacturing method according to claim 13, characterized in that, A mask structure with an array of holes is formed on the surface of the conductive layer, including: A metal layer is formed on the surface of the conductive layer opposite to the substrate; The side of the metal layer facing away from the substrate is subjected to surface oxidation treatment to form a metal oxide layer on the surface of the metal layer; Photoresist is coated on the surface of the metal oxide layer, and the hole array is obtained by sequential exposure and development treatment and wet etching treatment. Remove the remaining photoresist to form the mask structure.

15. The manufacturing method according to claim 14, characterized in that, The thickness of the metal layer is 1.2-1.5 μm, and the material of the metal layer includes either aluminum or zinc.

16. The manufacturing method according to claim 14, characterized in that, The thickness of the metal oxide layer is 0.8-1.0 μm.

17. The manufacturing method according to claim 14, characterized in that, The diameter of each hole in the hole array is d = 0.8-1.2 μm, and the spacing between any two adjacent holes is D = 0.8-1.2 μm.

18. The manufacturing method according to any one of claims 12-17, characterized in that, Electrodeformable structures are formed on the side surfaces of each nanopillar in the adhesive pillar array layer, including: The silica nanopillar array layer is placed in a modified electrodeformable material dispersion for surface adsorption treatment, forming an electrodeformable structure layer on the surface of the silica nanopillar array. The electrodeformable structure layer is etched to form an electrodeformable structure, and the conductive layer outside the corresponding area of ​​the silica nanopillar is etched away to obtain a self-cleaning coating.

19. A glass curtain wall, characterized in that, Includes the self-cleaning structure as described in any one of claims 10-11.

20. A monitoring device, characterized in that, Includes the self-cleaning structure as described in any one of claims 10-11.

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