Solar cell electroplating device and solar cell electroplating method

Abstract

The present application discloses a solar cell electroplating device and a solar cell electroplating method, which relate to the technical field of photovoltaic power generation. A first conductive component and a second conductive component are respectively used to be electrically connected to a grid line feeding point on the surface of a solar cell; a plating power supply control module is respectively electrically connected to the plating power supply, the first conductive component and the second conductive component, and is used to control the first conductive component and the second conductive component to switch between the positive and negative poles of the plating power supply; when the first conductive component is connected to the negative pole of the plating power supply and the second conductive component is connected to the positive pole of the plating power supply, the first conductive component and the anode form a first plating loop, and the first conductive component and the second conductive component form a first stripping loop; when the second conductive component is connected to the negative pole of the plating power supply and the first conductive component is connected to the positive pole of the plating power supply, the second conductive component and the anode form a second plating loop, and the first conductive component and the second conductive component form a second stripping loop.

Description

Technical Field

[0001] The present application belongs to the field of photovoltaic power generation technology, and specifically relates to a solar cell electroplating device and a solar cell electroplating method. Background Art

[0002] At present, electroplating technology is being studied more and more widely as a new method for preparing grid electrodes for solar cells. As a more promising method for preparing grid electrodes, electroplating can not only significantly reduce the cost of solar cell production process, but also the grid electrodes prepared by electroplating technology have a higher aspect ratio and better conductivity than the grid electrodes prepared by traditional screen printing, the internal resistance of the battery is lower, and the shading loss can be reduced, which can effectively improve the photoelectric conversion efficiency of solar cells.

[0003] When preparing the grid electrode of a solar cell by electroplating, the positive electrode of the power supply is electrically connected to the anode plate in the electroplating solution, the negative electrode of the power supply is electrically connected to the conductive cathode, and the conductive cathode contacts the surface of the cell to form an electroplating loop. Therefore, in practical applications, during the process of depositing a metal grid electrode layer on the surface of the cell, metal cations will also be deposited on the conductive cathode, causing the conductive cathode to be plated, reducing the electroplating quality of the grid electrode of the cell and reducing the service life of the conductive cathode.

[0004] In the prior art, the conductive cathode is usually removed from the electroplating device for stripping and cleaning to remove the deposited coating. However, disassembling and replacing the conductive cathode from the electroplating device will cause the electroplating process to be interrupted and suspended, resulting in reduced electroplating efficiency and production capacity. Summary of the invention

[0005] The present application provides a solar cell electroplating device and a solar cell electroplating method to solve the problem in existing electroplating devices that the electroplating process is interrupted and suspended when the conductive cathode is stripped and cleaned, resulting in reduced electroplating efficiency and production capacity.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] In a first aspect, an embodiment of the present application provides a solar cell electroplating device, comprising: an electroplating tank, a first conductive component, a second conductive component, and an electroplating power supply control module;

[0008] An anode is arranged in the electroplating tank;

[0009] The first conductive component and the second conductive component are respectively used to be electrically connected to the grid line feeding points on the surface of the solar cell;

[0010] The electroplating power supply control module is electrically connected to the electroplating power supply, the first conductive component and the second conductive component respectively, and is used to control the first conductive component and the second conductive component to switch between the positive and negative poles of the electroplating power supply;

[0011] When the first conductive component is connected to the negative electrode of the electroplating power source, and the second conductive component is connected to the positive electrode of the electroplating power source, the first conductive component and the anode form a first electroplating loop, and the first conductive component and the second conductive component form a first deplating loop;

[0012] When the second conductive component is connected to the negative pole of the electroplating power supply and the first conductive component is connected to the positive pole of the electroplating power supply, the second conductive component and the anode form a second electroplating circuit, and the first conductive component and the second conductive component form a second deplating circuit.

[0013] An embodiment of the present application also provides a solar cell electroplating device, comprising: an electroplating tank, at least one cathode conductive unit and an anode plate having at least one through hole; the anode plate is attached to the inner wall of the electroplating tank having at least one through hole, and the through hole of the anode plate corresponds to the position of the through hole on the inner wall of the electroplating tank; the cathode conductive unit passes through the through hole of the anode plate and the through hole on the inner wall of the electroplating tank.

[0014] Optionally, the electroplating device includes a first conductive component, a second conductive component, and an electroplating power control module connected to the first conductive component and the second conductive component, the cathode conductive unit has one or more first conductive units and one or more second conductive units, and the first conductive unit is formed on the first conductive component, and the second conductive unit is formed on the second conductive component.

[0015] Optionally, the first conductive component has a first position and a second position;

[0016] When in the first position, the first conductive component is connected to the negative electrode of the electroplating power supply, and the first conductive component is electrically connected to the grid line feeding point on the surface of the solar cell;

[0017] When in the second position, the first conductive component is connected to the positive electrode of the electroplating power source, and the first conductive component is separated from the solar cell;

[0018] The second conductive component has a third position and a fourth position;

[0019] In the third position, the second conductive component is connected to the negative electrode of the electroplating power supply, and the second conductive component is electrically connected to the grid line feeding point on the surface of the solar cell;

[0020] In the fourth position, the second conductive component is connected to the positive electrode of the electroplating power supply, and the second conductive component is separated from the solar cell.

[0021] Optionally, the electroplating power supply control module is electrically connected to the anode, and is used to control the anode to switch between the positive and negative poles of the electroplating power supply.

[0022] Optionally, the solar cell electroplating device further comprises: a stripping cathode;

[0023] The electroplating power supply control module is connected to the stripping cathode and is used to control the on / off circuit between the stripping cathode and the negative electrode of the electroplating power supply;

[0024] When at least one of the first conductive component and the second conductive component is connected to the positive electrode of the electroplating power supply and the deplating cathode is connected to the negative electrode of the electroplating power supply, the deplating cathode and the first conductive component, or, the deplating cathode and the second conductive component, or, the deplating cathode, the first conductive component and the second conductive component form a third deplating circuit.

[0025] Optionally, the stripping cathode is arranged at the bottom of the solar cell installation position;

[0026] The stripping cathode is detachable or position-adjustable.

[0027] Optionally, the first conductive component includes a plurality of first conductive units, the second conductive component includes a plurality of second conductive units, and the first conductive units and the second conductive units are respectively used to be electrically connected to the grid line feeding points on the surface of the solar cell;

[0028] The plurality of first conductive units and the plurality of second conductive units are distributed in an array.

[0029] Optionally, the first conductive unit and the second conductive unit are arranged crosswise.

[0030] Optionally, the array is divided into a first half area and a second half area by an array center line or an array diagonal line, a plurality of first conductive units are located in the first half area, and a plurality of second conductive units are located in the second half area.

[0031] Optionally, the array is divided into an inner circle of the array and an outer circle of the array, a plurality of first conductive units are located in the inner circle of the array, and a plurality of second conductive units are located in the outer circle of the array.

[0032] Optionally, at least a portion of the outer surface of the first conductive unit and / or at least a portion of the outer surface of the second conductive unit is provided with an insulating layer.

[0033] Optionally, the electroplating tank comprises: a plating tank body and a cover plate;

[0034] When the plating tank body and the cover plate are in a first relative position, there is a gap between the plating tank body and the cover plate for loading and unloading the solar cell;

[0035] When the plating tank body and the cover plate are in a second relative position, the plating tank body and the cover plate are buckled together to form the electroplating tank.

[0036] Optionally, a seal is provided between the plating tank body and the cover plate.

[0037] Optionally, the plating tank body is provided with a first positioning portion, and the cover plate is provided with a second positioning portion, and the first positioning portion and the second positioning portion are positioned and matched.

[0038] Optionally, one of the plating tank body and the cover plate is provided with a guide rod, and the other of the plating tank body and the cover plate is provided with a guide hole;

[0039] The guide rod is inserted into the guide hole and is slidably connected to the guide hole.

[0040] Optionally, the cover plate is provided with a plurality of first through holes;

[0041] The first conductive component and the second conductive component extend into the electroplating tank through the first through hole.

[0042] Optionally, the anode is arranged on a side of the cover plate close to the plating tank body;

[0043] The anode is provided with a plurality of second through holes, and the first conductive component and the second conductive component extend into the electroplating tank through the first through holes and the second through holes.

[0044] Optionally, during electroplating, along the thickness direction of the solar cell, the distance between the anode and the solar cell is 1 mm-10 mm.

[0045] Optionally, the solar cell electroplating device further comprises: a first driving mechanism;

[0046] The first driving mechanism is connected to at least one of the plating tank body and the cover plate to drive the plating tank body and the cover plate to switch between the first relative position and the second relative position.

[0047] Optionally, the solar cell electroplating device further comprises: a second driving mechanism;

[0048] The second driving mechanism is connected to the first conductive component to drive the first conductive component to switch between the first position and the second position.

[0049] Optionally, the solar cell electroplating device further comprises: a third driving mechanism;

[0050] The third driving mechanism is connected to the second conductive component to drive the second conductive component to switch between the third position and the fourth position.

[0051] Optionally, the electroplating tank is provided with a liquid inlet and a liquid outlet;

[0052] The minimum cross-sectional area of ​​the liquid inlet is not less than twice the minimum cross-sectional area of ​​the inner cavity of the electroplating tank in a direction perpendicular to the flow of the electroplating solution.

[0053] In a second aspect, the present application also provides a solar cell electroplating method, comprising:

[0054] Controlling the first conductive component to be in a first position, and controlling the second conductive component to be in a fourth position, wherein the first position is a position where the first conductive component is electrically connected to a grid line feeding point on a surface of a solar cell, and the fourth position is a position where the second conductive component is separated from the solar cell;

[0055] Controlling the electroplating power supply control module to be in a first state so that the first conductive component is connected to the negative electrode of the electroplating power supply, and the second conductive component is connected to the positive electrode of the electroplating power supply;

[0056] After a first preset time interval, the first conductive component is controlled to be in a second position, and the second conductive component is controlled to be in a third position, wherein the second position is a position where the first conductive component is separated from the solar cell, and the third position is a position where the second conductive component is electrically connected to a grid line feeding point on the surface of the solar cell;

[0057] The electroplating power supply control module is controlled to be in a second state so that the first conductive component is connected to the positive electrode of the electroplating power supply, and the second conductive component is connected to the negative electrode of the electroplating power supply.

[0058] Optionally, the solar cell electroplating method further comprises:

[0059] At a second preset time before the end of electroplating, the path between the electroplating power supply and the anode is disconnected.

[0060] Optionally, the solar cell electroplating method further comprises:

[0061] After the electroplating is completed, the electroplating power supply control module is controlled to be in a third state so that at least one of the first conductive component and the second conductive component is connected to the positive pole of the electroplating power supply, and the stripping cathode is connected to the negative pole of the electroplating power supply.

[0062] Optionally, the solar cell electroplating method further comprises:

[0063] After the electroplating is completed, the electroplating power supply control module is controlled to be in the fourth state so that at least one of the first conductive component and the second conductive component is connected to the positive electrode of the electroplating power supply, and the anode is connected to the negative electrode of the electroplating power supply.

[0064] Optionally, controlling the electroplating power supply control module to be in a first state includes:

[0065] Controlling the electroplating power supply control module to pass a gradually increasing electroplating current to the first conductive component until a first current threshold is reached;

[0066] The controlling the electroplating power supply control module to be in the second state comprises:

[0067] The electroplating power control module is controlled to pass a gradually increasing electroplating current to the second conductive component until a second current threshold is reached.

[0068] Optionally, controlling the electroplating power supply control module to be in a first state includes:

[0069] Controlling the electroplating power supply control module to pass a gradually increasing stripping current to the second conductive component until a third current threshold is reached;

[0070] The controlling the electroplating power supply control module to be in the second state comprises:

[0071] The electroplating power supply control module is controlled to pass a gradually increasing stripping current to the first conductive component until a fourth current threshold is reached.

[0072] Optionally, before controlling the first conductive component to be in the first position and controlling the second conductive component to be in the fourth position, the solar cell electroplating method further includes:

[0073] Controlling the first conductive component to be in the first position, and controlling the second conductive component to be in the third position;

[0074] The electroplating power supply control module is controlled to be in a fifth state so that the first conductive component and the second conductive component are both connected to the negative pole of the electroplating power supply.

[0075] In the embodiment of the present application, the electroplating power supply control module can control one of the first conductive component and the second conductive component to be connected to the positive electrode of the electroplating power supply, and the other to be connected to the negative electrode of the electroplating power supply. When the first conductive component is connected to the negative electrode of the electroplating power supply and the second conductive component is connected to the positive electrode of the electroplating power supply, the first conductive component and the anode form a first electroplating circuit, and the first conductive component and the second conductive component form a first stripping circuit; when the second conductive component is connected to the negative electrode of the electroplating power supply and the first conductive component is connected to the positive electrode of the electroplating power supply, the second conductive component and the anode form a second electroplating circuit, and the first conductive component and the second conductive component form a second stripping circuit. While ensuring the normal electroplating of the solar cell, the first conductive component and the second conductive component can also be stripped alternately, and the metal deposited on the first conductive component and the second conductive component is corroded and consumed by the principle of electrochemical reaction, without the need to disassemble and clean the first conductive component and the second conductive component, which helps to improve the continuity of the electroplating process and ensure production efficiency and capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0076] Figure 1 It is a structural schematic diagram of a solar cell electroplating device according to an embodiment of the present application;

[0077] Figure 2 This is an embodiment of the present application Figure 1 Schematic diagram of the structure along the a direction;

[0078] Figure 3 This is an embodiment of the present application Figure 1 Schematic diagram of the structure along the b direction;

[0079] Figure 4 This is an embodiment of the present application Figure 1 Schematic diagram of the structure along the c direction;

[0080] Figure 5 It is a schematic diagram of the upper structure of a solar cell electroplating device according to an embodiment of the present application;

[0081] Figure 6 This is an embodiment of the present application Figure 5 Schematic diagram of the structure along the d direction;

[0082] Figure 7 This is an embodiment of the present application Figure 5 Schematic diagram of the structure along the e direction;

[0083] Figure 8 This is an embodiment of the present application Figure 5 Schematic diagram of the structure along the f direction;

[0084] Fig. 9 It is a schematic diagram of the lower structure of a solar cell electroplating device according to an embodiment of the present application;

[0085] Fig.10 This is an embodiment of the present application Fig. 9 Schematic diagram of the structure along the g direction;

[0086] Fig.11 This is an embodiment of the present application Fig. 9 Schematic diagram of the structure along the h direction;

[0087] Fig.12 This is an embodiment of the present application Fig. 9 Schematic diagram of the structure along the i direction;

[0088] Fig.13 This is a schematic diagram of an anode structure described in an embodiment of the present application;

[0089] Fig.14 This is a schematic diagram of the structure of a solar cell according to an embodiment of the present application;

[0090] Fig.15 It is a flow chart of a solar cell electroplating method described in an embodiment of the present application.

[0091] Description of reference numerals:

[0092] 10-plating tank; 101-plating tank body; 102-cover plate; 103-seal; 104-first positioning portion; 105-guide rod; 106-guide hole; 107-liquid inlet; 108-liquid outlet; 20-first conductive component; 201-first conductive unit; 30-second conductive component; 301-second conductive unit; 40-plating power supply control module; 50-anode; 501-second through hole; 60-solar cell; 601-grid line feeding point; 70-stripping cathode; 80-first drive mechanism; 90-second drive mechanism; 100-third drive mechanism. DETAILED DESCRIPTION

[0093] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0094] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here. In addition, the "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally represents that the objects associated with each other are in an "or" relationship.

[0095] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0096] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0097] The solar cell electroplating device provided in the embodiment of the present application is described in detail below through specific embodiments and application scenarios in conjunction with the accompanying drawings.

[0098] Figures 1 to 4 A schematic structural diagram of a solar cell electroplating device according to an embodiment of the present application is shown.

[0099] In the embodiment of the present application, the solar cell electroplating device may specifically include: an electroplating tank 10, a first conductive component 20, a second conductive component 30 and an electroplating power supply control module 40; an anode 50 is provided in the electroplating tank 10; the first conductive component 20 and the second conductive component 30 are respectively used to contact with the solar cell 60 The grid line feeding point 601 on the surface is electrically connected; the electroplating power supply control module 40 is electrically connected to the electroplating power supply, the first conductive component 20 and the second conductive component 30 respectively, and is used to control the first conductive component 20 and the second conductive component 30 to switch between the positive and negative poles of the electroplating power supply; when the first conductive component 20 is connected to the negative pole of the electroplating power supply and the second conductive component 30 is connected to the positive pole of the electroplating power supply, the first conductive component 20 and the anode 50 form a first electroplating circuit, and the first conductive component 20 and the second conductive component 30 form a first deplating circuit; when the second conductive component 30 is connected to the negative pole of the electroplating power supply and the first conductive component 20 is connected to the positive pole of the electroplating power supply, the second conductive component 30 and the anode 50 form a second electroplating circuit, and the first conductive component 20 and the second conductive component 30 form a second deplating circuit.

[0100] Specifically, if Figures 1 to 4 As shown, the electroplating tank 10 is used to provide a place for electroplating. The electroplating tank 10 has an inner cavity. The electroplating tank 10 can be closed or semi-closed. The inner cavity of the electroplating tank 10 is filled with a plating solution, and the plating solution includes a water-soluble metal salt and a buffer. During the electroplating process, one or more of copper powder, nickel powder, copper oxide powder, copper salt, tin salt or nickel salt can be added to the electroplating solution to maintain the concentration of the plating solution stable and ensure the continuity of the electroplating process.

[0101] When the electroplating process or the stripping process is performed, the anode 50 is located in the inner cavity of the electroplating tank 10, and at least part of the anode 50 is in the electroplating solution; similarly, the conductive parts of the first conductive component 20 and the second conductive component 30 are also located in the electroplating solution. The electroplating power supply has a positive electrode and a negative electrode. The anode 50 can be directly electrically connected to the positive electrode of the electroplating power supply. The anode 50 can be connected in series to the positive electrode of the electroplating power supply through a flexible wire, or can be connected in series to the positive electrode of the electroplating power supply through a rigid conductive member. The anode 50 can also be connected to the electroplating power supply through the electroplating power supply control module 40. The anode 50 can be a soluble anode that can precipitate metal cations during the electroplating process to supplement the metal cations in the electroplating solution; the anode 50 can also be an insoluble anode that only supplements the metal cations through the circulation of the electroplating solution. During the electroplating process, the anode 50 will not be dissolved and lost, and there is no need to frequently replace the anode 50, thereby improving the electroplating efficiency. The number of anodes 50 can be set according to the actual needs of electroplating.

[0102] At least part of the first conductive component 20 and the second conductive component 30 is made of conductive material, and is respectively used to be electrically connected to the grid line feeding point 601 on the surface of the solar cell 60. The first conductive component 20 and the second conductive component 30 are connected to the electroplating power supply through the electroplating power supply control module 40. The electroplating power supply control module 40 can control the first conductive component 20 and the second conductive component 30 to switch between the positive and negative poles of the electroplating power supply. For example, the electroplating power supply control module 40 can control the first conductive component 20 and the second conductive component 30 to be connected to the positive pole of the electroplating power supply, and can also control the first conductive component 20 and the second conductive component 30 to be connected to the negative pole of the electroplating power supply, and can also control one of the first conductive component 20 and the second conductive component 30 to be connected to the positive pole of the electroplating power supply, and the other to be connected to the negative pole of the electroplating power supply.

[0103] When the first conductive component 20 is connected to the negative electrode of the electroplating power source, and the second conductive component 30 is connected to the positive electrode of the electroplating power source, the first conductive component 20 and the anode 50 form a first electroplating loop. In the first electroplating loop, under the action of the electroplating power source, the metal cations in the electroplating solution are attracted by the first conductive component 20 and deposited on the surface of the solar cell 60 in contact with the first conductive component 20 to form a grid electrode. The first conductive component 20 and the second conductive component 30 form a first stripping loop. At this time, the second conductive component 30 can be regarded as a soluble anode 50. The metal coating on the second conductive component 30 will be corroded and consumed, and metal cations will be precipitated, thereby realizing the stripping of the second conductive component 30. In addition, the metal cations precipitated by the second conductive component 30 can also be utilized by the first electroplating loop and re-plated on the surface of the solar cell 60 to form a grid electrode, thereby improving the electroplating efficiency.

[0104] Under the control of the electroplating power supply control module 40, the electrical properties of the first conductive component 20 and the second conductive component 30 can be interchanged. When the second conductive component 30 is connected to the negative electrode of the electroplating power supply and the first conductive component 20 is connected to the positive electrode of the electroplating power supply, the second conductive component 30 and the anode 50 form a second electroplating loop. In the second electroplating loop, under the action of the electroplating power supply, the metal cations in the electroplating solution are attracted by the second conductive component 30 and deposited on the surface of the solar cell 60 in contact with the second conductive component 30 to form a grid electrode. The first conductive component 20 and the second conductive component 30 form a second stripping loop. At this time, the first conductive component 20 can be regarded as a soluble anode 50. The metal coating on the first conductive component 20 will be corroded and consumed, and metal cations will be precipitated, thereby realizing the stripping of the first conductive component 20. In addition, the metal cations precipitated by the first conductive component 20 can also be used by the second electroplating loop and re-plated on the surface of the solar cell 60 to form a grid electrode, thereby improving the electroplating efficiency.

[0105] The number of electroplating power supplies can be one, two or more. The anode 50, the first conductive component 20 and the second conductive component 30 can be powered by the same power supply or by different power supplies. Two of the anode 50, the first conductive component 20 and the second conductive component 30 can also be powered by the same power supply and the other one can be powered by another power supply. As long as a plating circuit or a deplating circuit can be formed between the anode 50, the first conductive component 20 and the second conductive component 30, the embodiment of the present application is not limited to this.

[0106] The first conductive component 20 and the second conductive component 30 can be distributed on the same side of the solar cell 60 to achieve single-sided electroplating of the solar cell 60; the first conductive component 20 and the second conductive component 30 can also be located on both sides of the solar cell 60 at the same time, for example, the first surface and the second surface of the solar cell 60 are both provided with the first conductive component 20 and the second conductive component 30, so that the solar cell 60 can achieve double-sided electroplating, wherein the first surface and the second surface are two opposite surfaces of the solar cell 60.

[0107] In the embodiment of the present application, the first conductive component 20 and the second conductive component 30 are controlled by the electroplating power supply control module 40, and while ensuring the normal electroplating of the solar cell 60, the first conductive component 20 and the second conductive component 30 can also be alternately stripped, and the metal deposited on the first conductive component 20 and the second conductive component 30 is corroded and consumed by the principle of electrochemical reaction, without the need to disassemble and clean the first conductive component 20 and the second conductive component 30, which helps to improve the continuity of the electroplating process and ensure production efficiency and capacity. In addition, when the first conductive component 20 or the second conductive component 30 is stripped, the metal cations precipitated from the first conductive component 20 or the second conductive component 30 can also be used by the electroplating circuit, and re-plated on the surface of the solar cell 60 to form a grid electrode, further improving the electroplating efficiency.

[0108] An embodiment of the present application also provides a solar cell electroplating device, comprising: an electroplating tank 10, at least one cathode conductive unit and an anode plate having at least one through hole; the anode plate is attached to the inner wall of the electroplating tank 10 having at least one through hole, and the positions of the through holes of the anode plate and the through holes on the inner wall of the electroplating tank 10 correspond to each other; the cathode conductive unit passes through the through holes of the anode plate and the through holes on the inner wall of the electroplating tank 10.

[0109] Specifically, during the electroplating process, the negative electrode of the electroplating power supply is connected to the cathode conductive unit, and the anode plate is connected to the positive electrode of the electroplating power supply. The cathode conductive unit only needs to pass through the through hole of the anode plate and the through hole on the inner wall of the electroplating tank 10, and the conductive part of the cathode conductive unit is extended into the electroplating tank 10, so as to realize the conduction of the electroplating circuit between the anode plate and the cathode conductive unit. Compared with the solution in which the cathode needs to be immersed in the electroplating tank 10 in the traditional electroplating device, the space inside the electroplating tank 10 is saved, so that the inner cavity volume of the electroplating tank 10 can be as small as possible. When the electroplating tank 10 circulates the electroplating solution through the inlet and outlet, the volume of the electroplating solution passing through the unit time remains unchanged. Since the inner cavity volume of the electroplating tank 10 is small, when the electroplating solution flows into the inner cavity of the electroplating tank 10 from the inlet, the flow rate of the electroplating solution will be greatly accelerated, thereby accelerating the flow rate on the surface of the solar cell 60, which can increase the current density on the surface of the solar cell 60, thereby improving the electroplating rate.

[0110] Optionally, the electroplating device includes a first conductive component 20, a second conductive component 30, and an electroplating power control module 40 connected to the first conductive component 20 and the second conductive component 30, the cathode conductive unit has one or more first conductive units 201 and one or more second conductive units 301, and the first conductive unit 201 is formed on the first conductive component 20, and the second conductive unit 301 is formed on the second conductive component 30.

[0111] Specifically, the first conductive component 20 and the second conductive component 30 are connected to the electroplating power supply through the electroplating power supply control module 40. The electroplating power supply control module 40 can control the first conductive component 20 and the second conductive component 30 to switch between the positive and negative poles of the electroplating power supply. For example, the electroplating power supply control module 40 can control the first conductive component 20 and the second conductive component 30 to be connected to the positive pole of the electroplating power supply, and can also control the first conductive component 20 and the second conductive component 30 to be connected to the negative pole of the electroplating power supply. It can also control one of the first conductive component 20 and the second conductive component 30 to be connected to the positive pole of the electroplating power supply, and the other to be connected to the negative pole of the electroplating power supply.

[0112] At least one first conductive unit 201 is disposed on the first conductive component 20, and at least one second conductive unit 301 is disposed on the second conductive component 30. The specific number of the first conductive unit 201 and the second conductive unit 301 can be selected according to the number of grid line feeding points 601 on the surface of the solar cell 60.

[0113] Optionally, refer to Figures 1 to 4As shown, the first conductive component 20 has a first position and a second position; in the first position, the first conductive component 20 is connected to the negative electrode of the electroplating power supply, and the first conductive component 20 is electrically connected to the grid line feeding point 601 on the surface of the solar cell 60; in the second position, the first conductive component 20 is connected to the positive electrode of the electroplating power supply, and the first conductive component 20 is separated from the solar cell 60; the second conductive component 30 has a third position and a fourth position; in the third position, the second conductive component 30 is connected to the negative electrode of the electroplating power supply, and the second conductive component 30 is electrically connected to the grid line feeding point 601 on the surface of the solar cell 60; in the fourth position, the second conductive component 30 is connected to the positive electrode of the electroplating power supply, and the second conductive component 30 is separated from the solar cell 60.

[0114] Specifically, if Figures 1 to 4 As shown, in the embodiment of the present application, the control logic of the electroplating power supply control module 40 can be matched with the positions of the first conductive component 20 and the second conductive component 30. The first conductive component 20 has a first position and a second position, and the second conductive component 30 has a third position and a fourth position. The switching of the first conductive component 20 between the first position and the second position, and the switching of the second conductive component 30 between the third position and the fourth position can be controlled by a driving mechanism or manually, which is not limited in the embodiment of the present application.

[0115] When the first conductive component 20 is in the first position, correspondingly, the second conductive component 30 is in the fourth position, the electroplating power supply control module 40 controls the first conductive component 20 to be connected to the negative electrode of the electroplating power supply, and the electroplating power supply control module 40 controls the second conductive component 30 to be connected to the positive electrode of the electroplating power supply. At this time, the first conductive component 20 is electrically connected to the grid line feeding point 601 on the surface of the solar cell 60, and forms a first electroplating loop with the anode 50; the second conductive component 30 is separated from the solar cell 60, and forms a first stripping loop with the first conductive component 20.

[0116] When the first conductive component 20 is in the second position, correspondingly, the second conductive component 30 is in the third position, the electroplating power supply control module 40 controls the first conductive component 20 to be connected to the positive electrode of the electroplating power supply, and the electroplating power supply control module 40 controls the second conductive component 30 to be connected to the negative electrode of the electroplating power supply. At this time, the first conductive component 20 is separated from the solar cell 60, and forms a second stripping circuit with the second conductive component 30; the second conductive component 30 is electrically connected to the grid line feeding point 601 on the surface of the solar cell 60, and forms a second electroplating circuit with the anode 50.

[0117] By matching the control logic of the electroplating power supply control module 40 with the positions of the first conductive component 20 and the second conductive component 30, when the first conductive component 20 or the second conductive component 30 needs to participate in electroplating, the first conductive component 20 or the second conductive component 30 can be moved to a position electrically connected to the grid line feeding point 601 on the surface of the solar cell 60; when the first conductive component 20 or the second conductive component 30 needs to be stripped, the first conductive component 20 or the second conductive component 30 can be moved to a position separated from the solar cell 60. While ensuring the normal progress of the electroplating process, the shielding of the grid line electrode on the surface of the solar cell 60 by the first conductive component 20 or the second conductive component 30 during stripping can also be reduced, the circulation rate of the electroplating solution can be accelerated, and the consistency of the electroplating grid line electrode can be improved.

[0118] Optionally, the electroplating power supply control module 40 is electrically connected to the anode 50 to control the anode 50 to switch between the positive and negative poles of the electroplating power supply.

[0119] Specifically, during the electroplating process, the electroplating power supply control module 40 can control the anode 50 to be conductive with the positive electrode of the electroplating power supply, and the anode 50, the first conductive component 20 and the second conductive component 30 can form an electroplating loop.

[0120] After the electroplating process of the solar cell 60 is completed, part of the plating layer may remain on the first conductive component 20 and the second conductive component 30 due to incomplete stripping of the previous alternating process, which may affect the subsequent electroplating of the solar cell 60. Therefore, when the stripping of the first conductive component 20 and the second conductive component 30 is incomplete, the electroplating power supply control module 40 can control the anode 50 to be connected to the negative electrode of the electroplating power supply, and at least one of the first conductive component 20 and the second conductive component 30 to be connected to the positive electrode of the electroplating power supply, and the anode 50 is used to strip the first conductive component 20 and / or the second conductive component 30, without adding a component involved in the stripping, thereby simplifying the device and reducing the production cost.

[0121] Optionally, refer to Figures 9 and 10 As shown, the solar cell electroplating device also includes: a stripping cathode 70; a plating power supply control module 40 is connected to the stripping cathode 70, and is used to control the on / off circuit between the stripping cathode 70 and the negative electrode of the plating power supply; when at least one of the first conductive component 20 and the second conductive component 30 is connected to the positive electrode of the plating power supply, and the stripping cathode 70 is connected to the negative electrode of the plating power supply, the stripping cathode 70 and the first conductive component 20, or, the stripping cathode 70 and the second conductive component 30, or, the stripping cathode 70, the first conductive component 20 and the second conductive component 30 form a third stripping loop.

[0122] Specifically, if Figures 9 and 10As shown, after the electroplating process of the solar cell 60 is completed, part of the plating layer may remain on the first conductive component 20 and the second conductive component 30 due to incomplete previous alternating stripping, which may affect the subsequent electroplating of the solar cell 60. Therefore, when the stripping of the first conductive component 20 and the second conductive component 30 is incomplete, the third stripping circuit can be used to strip the first conductive component 20 and / or the second conductive component 30 again.

[0123] In the third deplating circuit, the deplating cathode 70 can be made of metal materials such as copper and iron, preferably the same material as the electroplating material. The deplating cathode 70 is connected to the negative electrode of the electroplating power supply, and at least one of the first conductive component 20 and the second conductive component 30 is connected to the positive electrode of the electroplating power supply, thereby forming a complete deplating circuit. The third deplating circuit can include the following three sub-circuits: a deplating sub-circuit composed of the deplating cathode 70 and the first conductive component 20, a deplating sub-circuit composed of the deplating cathode 70 and the second conductive component 30, and a deplating sub-circuit composed of the deplating cathode 70, the first conductive component 20 and the second conductive component 30.

[0124] By setting up a third deplating circuit, when the previous alternating deplating is incomplete, the third deplating circuit can be used and a larger current can be applied to quickly deplating the first conductive component 20 and / or the second conductive component 30, thereby improving the deplating efficiency and avoiding affecting the subsequent electroplating of the solar cell 60.

[0125] Optionally, refer to Figures 9 and 10 As shown, the stripping cathode 70 is disposed at the bottom of the solar cell 60 installation position; the stripping cathode 70 is detachable or position-adjustable.

[0126] Specifically, if Figures 9 and 10 As shown, the stripping cathode 70 is arranged at the bottom of the mounting position of the solar cell 60, without occupying too much space in the inner cavity of the electroplating tank 10. The stripping cathode 70 is detachable. When the stripping cathode 70 is plated with more coatings, the stripping cathode 70 can be disassembled and replaced. The stripping cathode 70 is position-adjustable. During the stripping process, the distance between the stripping cathode 70 and the solar cell 60 can be adjusted according to the thickness of the coating on the stripping cathode 70 to avoid interference with the solar cell 60. In addition, for the stripping area of ​​the stripping cathode 70 exposed in the electroplating solution, it is preferably slightly smaller than the area of ​​the solar cell 60 according to the convenience of structural design, but it can also be optimized and adjusted according to the structure of the solar cell fixing base. If the structure allows, it is preferred to use a stripping cathode with a larger coverage area to perform the stripping of the conductive units on the first conductive component 20 and the second conductive component 30. However, even when a stripping cathode 70 with a small exposed area is used, the stripping of the conductive units on the first conductive component 20 and the second conductive component 30 can be completed (such as Figure 9-10 shown).

[0127] Optionally, refer to Figures 5 to 8 , Fig.14 As shown, the first conductive component 20 includes a plurality of first conductive units 201, and the second conductive component 30 includes a plurality of second conductive units 301. The first conductive units 201 and the second conductive units 301 are respectively used to electrically connect to the grid line feeding points 601 on the surface of the solar cell 60; the plurality of first conductive units 201 and the plurality of second conductive units 301 are distributed in an array.

[0128] Specifically, if Figures 5 to 8 , Fig.14 As shown, in an embodiment of the present application, the solar cell 60 can be a heterojunction cell (Hetero-junction with Intrinsic Thin-layer, HJT) with an intrinsic amorphous layer, or a TOPCon (Tunnel Oxide Passivating Contacts) cell, etc. The surface of the solar cell 60 has a grid line pattern and a grid line feeding point 601, and the multiple first conductive units 201 of the first conductive component 20 and the multiple second conductive units 301 of the second conductive component 30 are respectively used to be electrically connected to the grid line feeding point 601. The distribution mode of the grid line feeding point 601 of the solar cell 60 matches the arrangement mode of the first conductive unit 201 and the second conductive unit 301. The non-grid line area of ​​the solar cell 60 is covered with an insulating layer (or referred to as a plating mask). During the electroplating process, the area covered with the insulating layer is not in direct contact with the plating solution, and the plating solution only contacts the grid line area to be plated.

[0129] Multiple first conductive units 201 can be arranged together on the same base, which is made of conductive material and electrically connected to the electroplating power supply control module 40. The electroplating power supply control module 40 energizes the base to transfer current to the multiple first conductive units 201. The first conductive unit 201 can be a spring probe, a conductive fiber bundle, or other structures.

[0130] The plurality of second conductive units 301 may be disposed on the same base, which is made of conductive material and electrically connected to the electroplating power supply control module 40. The electroplating power supply control module 40 energizes the base to transfer current to the plurality of second conductive units 301. The second conductive unit 301 may also be a spring probe, a conductive fiber bundle, or the like.

[0131] The plurality of first conductive units 201 and the plurality of second conductive units 301 are distributed in an array, forming a plurality of conductive contact points on the surface of the solar cell 60 , thereby improving the efficiency and quality of electroplating.

[0132] Optionally, the first conductive units 201 and the second conductive units 301 are arranged crosswise.

[0133] Specifically, the first conductive unit 201 and the second conductive unit 301 are cross-arranged, and the specific arrangement method can be that the array includes multiple rows or columns of conductive units, and the first conductive units 201 and the second conductive units 301 are cross-arranged in adjacent rows and / or columns. The cross-arranged first conductive units 201 and the second conductive units 301 can be evenly distributed on the surface of the solar cell 60, and the current and metal cations are evenly distributed during the electroplating or stripping process, which can improve the consistency of the electroplated grid line electrode.

[0134] Optionally, the array is divided into a first half area and a second half area by an array center line or an array diagonal line, the plurality of first conductive units 201 are located in the first half area, and the plurality of second conductive units 301 are located in the second half area.

[0135] Specifically, the first conductive unit 201 and the second conductive unit 301 can also be arranged in a half-area manner, and the conductive unit array is divided into a first half area and a second half area by a center line or an array diagonal line, multiple first conductive units 201 are located in the first half area, and multiple second conductive units 301 are located in the second half area.

[0136] The above arrangement has a simple structure, and is convenient for controlling the first conductive unit 201 and the second conductive unit 301 separately. When the first conductive unit 201 and the second conductive unit 301 move separately, they are not likely to interfere with each other.

[0137] Optionally, the array is divided into an inner circle of the array and an outer circle of the array, the plurality of first conductive units 201 are located in the inner circle of the array, and the plurality of second conductive units 301 are located in the outer circle of the array.

[0138] Specifically, the first conductive units 201 and the second conductive units 301 may also be arranged in an array inner circle and an array outer circle. The array outer circle surrounds the array inner circle to form a complete conductive unit array, multiple first conductive units 201 are located in the array inner circle, and multiple second conductive units 301 are located in the array outer circle.

[0139] The above arrangement has a simple structure, and is convenient for controlling the first conductive unit 201 and the second conductive unit 301 separately. When the first conductive unit 201 and the second conductive unit 301 move separately, they are not likely to interfere with each other.

[0140] Optionally, at least a portion of the outer surface of the first conductive unit 201 and / or at least a portion of the outer surface of the second conductive unit 301 is provided with an insulating layer.

[0141] Specifically, during the electroplating process, the first conductive unit 201 and the second conductive unit 301 will inevitably contact the electroplating solution. To prevent the first conductive unit 201 and the second conductive unit 301 from corrosion and plating, an insulating layer is provided on at least part of the outer surface of the first conductive unit 201 and / or at least part of the outer surface of the second conductive unit 301. The insulating layer at least partially covers the first conductive unit 201 and the second conductive unit 301, and only the positions of the first conductive unit 201 and the second conductive unit 301 for conductive contact with the solar cell 60 are exposed to ensure the stability of the electrical connection between the first conductive unit 201 and the second conductive unit 301 and the solar cell 60. By providing the insulating layer, the first conductive unit 201 and the second conductive unit 301 can be prevented from corrosion and plating, the workload of subsequent stripping can be reduced, the cost can be saved, and the durability of the device can be improved.

[0142] The insulating layer may be made of materials such as Teflon and silicone, or may be formed on the outer surfaces of the first conductive unit 201 and the second conductive unit 301 by spraying insulating paint.

[0143] Optionally, refer to Figures 1 to 4 As shown, the electroplating tank 10 includes: a plating tank body 101 and a cover plate 102; when the plating tank body 101 and the cover plate 102 are in a first relative position, there is a gap between the plating tank body 101 and the cover plate 102 for loading and unloading the solar cell 60; when the plating tank body 101 and the cover plate 102 are in a second relative position, the plating tank body 101 and the cover plate 102 are buckled to form the electroplating tank 10.

[0144] Specifically, if Figures 1 to 4 As shown, the electroplating tank 10 adopts a split structure, including a plating tank body 101 and a cover plate 102, and the plating tank body 101 and the cover plate 102 are buckled to form a complete electroplating tank 10, which can ensure the airtightness during the electroplating process. The plating tank body 101 and the cover plate 102 have a first relative position and a second relative position. When the plating tank body 101 and the cover plate 102 are in the first relative position, there is a gap between the plating tank body 101 and the cover plate 102 for loading and unloading the solar cell 60, which is convenient for loading and unloading the solar cell 60. When the plating tank body 101 and the cover plate 102 are in the second relative position, the plating tank body 101 and the cover plate 102 buckle together to form the electroplating tank 10. By switching the plating tank body 101 and the cover plate 102 between the first relative position and the second relative position, it is possible to realize the rapid switching of the loading and unloading scene of the solar cell 60 and the electroplating scene, thereby improving the production efficiency.

[0145] Optionally, refer to Figures 9 to 12 As shown, a seal 103 is provided between the plating tank body 101 and the cover plate 102 .

[0146] Specifically, if Figures 9 to 12 As shown, in order to ensure the airtightness of the inner cavity of the electroplating tank 10 after the plating tank body 101 and the cover plate 102 are buckled together, a seal 103 is provided between the plating tank body 101 and the cover plate 102. The seal 103 can be provided on the plating tank body 101 or the cover plate 102 alone, or on both the plating tank body 101 and the cover plate 102. The material of the seal 103 can be a flexible material such as rubber, silicone, etc.

[0147] Optionally, refer to Figures 9 to 12 As shown, the plating tank body 101 is provided with a first positioning portion 104, and the cover plate 102 is provided with a second positioning portion, and the first positioning portion 104 and the second positioning portion are positioned and matched.

[0148] Specifically, if Figures 9 to 12 As shown, in order to ensure the alignment accuracy when the plating tank body 101 and the cover plate 102 are buckled, a first positioning portion 104 is provided on the plating tank body 101, and a second positioning portion is provided on the cover plate 102. The first positioning portion 104 can be a positioning slot, and correspondingly, the second positioning portion can be a positioning shaft; similarly, the first positioning portion 104 can be a positioning shaft, and correspondingly, the second positioning portion can be a positioning slot. The first positioning portion 104 and the second positioning portion can be provided at the edges of the plating tank body 101 and the cover plate 102 to avoid encroaching on the inner cavity space of the electroplating tank 10.

[0149] Optionally, refer to Figures 1 to 4 As shown, one of the plating tank body 101 and the cover plate 102 is provided with a guide rod 105, and the other of the plating tank body 101 and the cover plate 102 is provided with a guide hole 106;

[0150] Specifically, if Figures 1 to 4 As shown, a guide rod 105 can be provided on the plating tank body 101, and a guide hole 106 can be provided on the cover plate 102. The number of the guide rods 105 and the guide hole 106 is the same, and the number of the guide rods 105 and the guide hole 106 can be selected according to the size of the electroplating tank 10. For example, a square electroplating tank 10 is adopted, and four groups of guide rods 105 and guide holes 106 can be provided at the four corners of the electroplating tank 10. Of course, the guide holes 106 can also be provided on the plating tank body 101, and the guide rods 105 can be provided on the cover plate 102. The guide rod 105 is penetrated through the guide hole 106 and is slidably connected with the guide hole 106. When the plating tank body 101 and the cover plate 102 move relative to each other, the cooperation of the guide rod 105 and the guide hole 106 can realize the limiting of the plating tank body 101 and the cover plate 102, and improve the alignment accuracy of the plating tank body 101 and the cover plate 102.

[0151] Optionally, the cover plate 102 is provided with a plurality of first through holes; the first conductive component 20 and the second conductive component 30 extend into the electroplating tank 10 through the first through holes.

[0152] Specifically, the first conductive component 20 and the second conductive component 30 may be directly disposed inside the electroplating tank 10 , or may be partially disposed inside the electroplating tank 10 , with the remaining portion being located outside the electroplating tank 10 .

[0153] In the embodiment of the present application, the first conductive component 20 and the second conductive component 30 are controlled by an external driving mechanism, and a plurality of first through holes are provided on the cover plate 102, through which the first conductive component 20 and the second conductive component 30 extend into the electroplating tank 10. The number of the first through holes matches the number of conductive elements on the first conductive component 20 and the second conductive component 30.

[0154] By providing the first through hole on the cover plate 102 to allow the first conductive component 20 and the second conductive component 30 to pass through, the manufacturing difficulty and cost are lower than the solution of directly providing the first conductive component 20 and the second conductive component 30 inside the electroplating tank 10. To prevent leakage of the electroplating solution, the aperture of the first through hole can be matched with the outer diameter of the conductive element to reduce the gap between the first through hole and the conductive element.

[0155] Optionally, refer to Fig.13 As shown, the anode 50 is disposed on one side of the cover plate 102 close to the plating tank body 101 ; the anode 50 is provided with a plurality of second through holes 501 , and the first conductive component 20 and the second conductive component 30 extend into the plating tank 10 through the first through holes and the second through holes 501 .

[0156] Specifically, if Fig.13 As shown, the anode 50 may be a soluble anode 50 or an insoluble anode 50. In the embodiment of the present application, the anode 50 is an insoluble anode 50, and the anode 50 is arranged on the side of the cover plate 102 close to the plating tank body 101, and a plurality of second through holes 501 are arranged on the anode 50. The number of the second through holes 501 matches the number of conductive elements on the first conductive component 20 and the second conductive component 30. The first conductive component 20 and the second conductive component 30 extend into the interior of the electroplating tank 10 through the first through hole and the second through hole 501. During the electroplating process, the conductive element on the first conductive component 20 or the second conductive component 30 is partially inserted into the second through hole 501, and the current distribution between the anode 50 and the conductive element is more uniform, thereby improving the consistency of the electroplated grid line electrode.

[0157] Optionally, during electroplating, along the thickness direction of the solar cell 60 , the distance between the anode 50 and the solar cell 60 is 1 mm-10 mm.

[0158] Specifically, the anode 50 is disposed below the cover plate 102. After the cover plate 102 is buckled with the plating tank body, the solar cell 60 is in the inner cavity formed by the cover plate 102 and the plating tank body. Along the thickness direction of the solar cell 60, the distance between the anode 50 and the solar cell 60 is 1 mm-10 mm. The smaller the distance, the shorter the distance of cationic electroplating movement, which can increase the current density, thereby greatly improving the electroplating rate.

[0159] Optionally, refer to Figures 1 to 4 As shown, the solar cell electroplating device also includes: a first driving mechanism 80; the first driving mechanism 80 is connected to at least one of the plating tank body 101 and the cover plate 102 to drive the plating tank body 101 and the cover plate 102 to switch between the first relative position and the second relative position.

[0160] Specifically, if Figures 1 to 4 As shown, the switching mode of the plating tank body 101 and the cover plate 102 between the first relative position and the second relative position can be manual switching, or the movement of the plating tank body 101 or the cover plate 102 can be controlled by the first driving mechanism 80. The first driving mechanism 80 can be a combination of a motor and a lead screw, or a combination of a cylinder and a connecting rod. When the first driving mechanism 80 is set, the first driving mechanism 80 can be connected to at least one of the plating tank body 101 and the cover plate 102 to drive the plating tank body 101 and the cover plate 102 to switch between the first relative position and the second relative position. By setting the first driving mechanism 80, the degree of automation of the solar cell electroplating device can be improved, thereby improving production efficiency.

[0161] Optionally, refer to Figures 1 to 8 As shown, the solar cell electroplating device further includes: a second driving mechanism 90; the second driving mechanism 90 is connected to the first conductive component 20 to drive the first conductive component 20 to switch between the first position and the second position.

[0162] Specifically, if Figures 1 to 8 As shown, the first conductive component 20 can be switched between the first position and the second position manually, or the movement of the first conductive component 20 can be controlled by the second driving mechanism 90. The second driving mechanism 90 can be a combination of a motor and a lead screw, or a combination of a cylinder and a connecting rod. By providing the second driving mechanism 90, the degree of automation of the solar cell electroplating device can be improved, thereby improving production efficiency.

[0163] Optionally, refer to Figures 1 to 8 As shown, the solar cell electroplating device further includes: a third driving mechanism 100; the third driving mechanism 100 is connected to the second conductive component 30 to drive the second conductive component 30 to switch between the third position and the fourth position.

[0164] Specifically, if Figures 1 to 8 As shown, the second conductive component 30 can be switched between the third position and the fourth position by manual switching, or by controlling the movement of the second conductive component 30 through the third driving mechanism 100. The third driving mechanism 100 can be a combination of a motor and a lead screw, or a combination of a cylinder and a connecting rod. By providing the third driving mechanism 100, the degree of automation of the solar cell electroplating device can be improved, thereby improving production efficiency.

[0165] Optionally, refer to Figure 1 , Figure 2 , Fig. 9 , Fig.11 As shown, the electroplating tank 10 is provided with a liquid inlet 107 and a liquid outlet 108; the minimum cross-sectional area of ​​the liquid inlet 107 is not less than twice the minimum cross-sectional area of ​​the inner cavity of the electroplating tank 10 in the direction perpendicular to the flow of the electroplating solution.

[0166] Specifically, if Figure 1 , Figure 2 , Fig. 9 , Fig.11 As shown, the plating solution in the inner cavity of the electroplating tank 10 is circulated through the liquid inlet 107 and the liquid outlet 108, and the plating solution is passed into the inner cavity of the electroplating tank 10 via the liquid inlet 107. Due to the different volumes of the liquid inlet 107 and the inner cavity of the electroplating tank 10, the flow rate of the plating solution will be affected. The minimum cross-sectional area of ​​the liquid inlet 107 is not less than twice the minimum cross-sectional area of ​​the inner cavity of the electroplating tank 10 in the vertical direction of the plating solution flow. In the case where the volume of the plating solution is constant per unit time, due to the small volume of the inner cavity of the electroplating tank 10, when the plating solution flows into the inner cavity of the electroplating tank 10 from the liquid inlet 107, the flow rate of the plating solution will be greatly accelerated, and the current density in the inner cavity of the electroplating tank 10 can be increased, thereby improving the rate of electroplating. In addition, the flow rate of the plating solution is accelerated, and the dendrites and bubble holes on the surface of the solar cell 60 may be washed away, and it is not easy to form the degradation of the electroplating layer, which is conducive to improving the quality of the electroplated grid line electrode.

[0167] In summary, the solar cell electroplating device described in the embodiment of the present application has at least the following advantages:

[0168] In the embodiment of the present application, the electroplating power supply control module 40 can control one of the first conductive component 20 and the second conductive component 30 to be connected to the positive electrode of the electroplating power supply, and the other to be connected to the negative electrode of the electroplating power supply. When the first conductive component 20 is connected to the negative electrode of the electroplating power supply, and the second conductive component 30 is connected to the positive electrode of the electroplating power supply, the first conductive component 20 and the anode 50 form a first electroplating circuit, and the first conductive component 20 and the second conductive component 30 form a first stripping circuit; when the second conductive component 30 is connected to the negative electrode of the electroplating power supply, and the first conductive component 20 is connected to the positive electrode of the electroplating power supply, the second conductive component 30 and the anode 50 form a second electroplating circuit, and the first conductive component 20 and the second conductive component 30 form a second stripping circuit. While ensuring the normal electroplating of the solar cell 60, the first conductive component 20 and the second conductive component 30 can be stripped alternately, and the metal deposited on the first conductive component 20 and the second conductive component 30 can be corroded and consumed by the principle of electrochemical reaction, without the need to disassemble and clean the first conductive component 20 and the second conductive component 30, which helps to improve the continuity of the electroplating process and ensure production efficiency and capacity. In addition, when the first conductive component 20 or the second conductive component 30 is stripped, the metal cations precipitated from the first conductive component 20 or the second conductive component 30 can also be used by the electroplating circuit and re-plated on the surface of the solar cell 60 to form a grid electrode, further improving the electroplating efficiency.

[0169] Reference Fig.15 , shows a flow chart of the solar cell electroplating method described in an embodiment of the present application.

[0170] In an embodiment of the present application, a solar cell electroplating method includes:

[0171] Step 101, controlling the first conductive component to be in a first position, and controlling the second conductive component to be in a fourth position, wherein the first position is a position where the first conductive component is electrically connected to a grid line feeding point on a surface of a solar cell, and the fourth position is a position where the second conductive component is separated from the solar cell.

[0172] Before electroplating, the solar cell is placed in the electroplating tank, and the first conductive component is controlled to be in the first position so that the first conductive component contacts the grid line feeding point on the surface of the solar cell. The second conductive component does not participate in the electroplating process, and the second conductive component can be separated from the solar cell.

[0173] Step 102, controlling the electroplating power supply control module to be in a first state, so that the first conductive component is connected to the negative electrode of the electroplating power supply, and the second conductive component is connected to the positive electrode of the electroplating power supply.

[0174] When the electroplating power supply control module is in the first state, the first conductive component is connected to the negative electrode of the electroplating power supply, the second conductive component is connected to the positive electrode of the electroplating power supply, and the anode is connected to the positive electrode of the electroplating power supply. The first conductive component and the anode form a first electroplating loop. In the first electroplating loop, under the action of the electroplating power supply, the metal cations in the electroplating solution are attracted by the first conductive component and deposited on the surface of the solar cell in contact with the first conductive component to form a grid electrode.

[0175] The first conductive component and the second conductive component form a first stripping circuit. At this time, the second conductive component can be regarded as a soluble anode. The metal coating plated on the second conductive component will be corroded and consumed to precipitate metal cations, thereby achieving stripping of the second conductive component. In addition, the metal cations precipitated from the second conductive component can also be utilized by the first electroplating circuit and re-plated on the surface of the solar cell to form a grid electrode, thereby improving the electroplating efficiency.

[0176] Step 103: After a first preset time interval, control the first conductive component to be in a second position, and control the second conductive component to be in a third position, wherein the second position is a position where the first conductive component is separated from the solar cell, and the third position is a position where the second conductive component is electrically connected to a grid line feeding point on the surface of the solar cell.

[0177] After the first preset time is implemented in step 102, the first preset time can be a time period of 1min, 3min, 5min, 10min, 30min, 60min, etc., which can be selected according to the actual electroplating situation of the gate electrode. Since the first conductive component participates in the electroplating process, there will be plating on the surface, which affects the subsequent electroplating process. The electroplating power supply can be disconnected first, and then the first conductive component is controlled to be in the second position so that the first conductive component is separated from the solar cell; the second conductive component is controlled to be in the third position so that the second conductive component is in contact with the gate feed point on the surface of the solar cell.

[0178] Step 104, controlling the electroplating power supply control module to be in a second state, so that the first conductive component is connected to the positive electrode of the electroplating power supply, and the second conductive component is connected to the negative electrode of the electroplating power supply.

[0179] When the electroplating power control module is in the second state, the first conductive component is connected to the positive electrode of the electroplating power supply, the second conductive component is connected to the negative electrode of the electroplating power supply, and the anode is connected to the positive electrode of the electroplating power supply. The second conductive component and the anode form a second electroplating loop. In the second electroplating loop, under the action of the electroplating power supply, the metal cations in the electroplating solution are attracted by the second conductive component and deposited on the surface of the solar cell in contact with the second conductive component to form a grid electrode.

[0180] The first conductive component and the second conductive component form a second stripping circuit. At this time, the first conductive component can be regarded as a soluble anode. The metal coating plated on the first conductive component will be corroded and consumed to precipitate metal cations, thereby achieving stripping of the first conductive component. In addition, the metal cations precipitated from the first conductive component can also be utilized by the second electroplating circuit and re-plated on the surface of the solar cell to form a grid electrode, thereby improving the electroplating efficiency.

[0181] In an embodiment of the present application, the solar cell electroplating method further includes:

[0182] Step 105: at a second preset time before the end of electroplating, disconnect the path between the electroplating power supply and the anode.

[0183] The second preset time can be a time period of 1min, 2min, 5min, 10min, 15min, 30min, etc. During this time period, the gate electrode on the surface of the solar cell has been basically plated, the path between the electroplating power supply and the anode can be disconnected, and only the first conductive component or the second conductive component is used as the anode. A larger current can be used for stripping, which can improve the stripping efficiency and stripping integrity.

[0184] In an embodiment of the present application, the solar cell electroplating method further includes:

[0185] Step 106A, after the electroplating is completed, control the electroplating power supply control module to be in a third state so that at least one of the first conductive component and the second conductive component is connected to the positive electrode of the electroplating power supply, and the stripping cathode is connected to the negative electrode of the electroplating power supply.

[0186] After the electroplating process of the solar cell is completed, part of the plating layer may remain on the first conductive component and the second conductive component due to incomplete stripping of the previous alternating process, which may affect the subsequent electroplating of the solar cell. Therefore, when the stripping of the first conductive component and the second conductive component is incomplete, the electroplating power supply control module can be controlled to be in the third state, so that the anode is connected to the negative electrode of the electroplating power supply, and at least one of the first conductive component and the second conductive component is connected to the positive electrode of the electroplating power supply, and the anode is used to strip the first conductive component and / or the second conductive component, without adding new components involved in the stripping, simplifying the device and reducing the production cost.

[0187] In an embodiment of the present application, the solar cell electroplating method further includes:

[0188] Step 106B, after the electroplating is completed, control the electroplating power supply control module to be in the fourth state, so that at least one of the first conductive component and the second conductive component is connected to the positive electrode of the electroplating power supply, and the anode is connected to the negative electrode of the electroplating power supply.

[0189] After the electroplating process of the solar cell is completed, part of the plating layer may remain on the first conductive component and the second conductive component due to incomplete alternating stripping in the previous sequence, which may affect the subsequent electroplating of the solar cell. Therefore, when the stripping of the first conductive component and the second conductive component is incomplete, the electroplating power supply control module can be controlled to be in the fourth state, so that at least one of the first conductive component and the second conductive component is connected to the positive electrode of the electroplating power supply, and the stripping cathode is connected to the negative electrode of the electroplating power supply, and the first conductive component and / or the second conductive component are stripped again using the third stripping circuit.

[0190] In the third deplating circuit, the deplating cathode can be made of metal such as copper and iron, the deplating cathode is connected to the negative electrode of the electroplating power supply, and at least one of the first conductive component and the second conductive component is connected to the positive electrode of the electroplating power supply, thereby forming a complete deplating circuit. The third deplating circuit may include the following three sub-circuits: a deplating sub-circuit composed of the deplating cathode and the first conductive component, a deplating sub-circuit composed of the deplating cathode and the second conductive component, and a deplating sub-circuit composed of the deplating cathode, the first conductive component and the second conductive component.

[0191] By setting up a third deplating circuit, when the previous alternating deplating is incomplete, the third deplating circuit can be used and a larger current can be applied to quickly deplat the first conductive component and / or the second conductive component, thereby improving the deplating efficiency and avoiding affecting the subsequent electroplating of the solar cell.

[0192] In the embodiment of the present application, step 102, controlling the electroplating power supply control module to be in the first state, includes:

[0193] S11. Control the electroplating power control module to pass a gradually increasing electroplating current to the first conductive component until a first current threshold is reached.

[0194] When the electroplating power supply control module is in the first state, the first conductive component is electrically connected to the grid line feed point on the surface of the solar cell sheet. Since the grid line electrode is thinner during initial electroplating, if a larger current is passed, the potential at the grid line feed point is lower, and the potential in the surrounding area is higher. After this potential difference occurs, the thinner grid line electrode near the first conductive component is stripped. The electroplating power supply control module can be used to first pass a smaller electroplating current into the first conductive component, and after the thickness of the grid line electrode is stable, the electroplating current is gradually increased until the first current threshold is reached, and the first current threshold is the current value during stable electroplating. By passing the electroplating current that is gradually increased into the first conductive component, the stripping problem of the grid line electrode can be reduced, which is conducive to improving the quality of the grid line electrode.

[0195] In the embodiment of the present application, step 104, controlling the electroplating power supply control module to be in the second state, includes:

[0196] S21. Control the electroplating power control module to pass a gradually increasing electroplating current to the second conductive component until a second current threshold is reached.

[0197] When the electroplating power supply control module is in the second state, the second conductive component is electrically connected to the grid line feed point on the surface of the solar cell sheet. Since the grid line electrode is thinner during initial electroplating, if a larger current is passed, the potential at the grid line feed point is lower, and the potential in the surrounding area is higher. After this potential difference occurs, the thinner grid line electrode near the second conductive component is stripped. The electroplating power supply control module can be used to first pass a smaller electroplating current into the second conductive component, and after the thickness of the grid line electrode is stable, the electroplating current is gradually increased until the second current threshold is reached, and the second current threshold is the current value during stable electroplating. By passing the electroplating current that is gradually increased into the second conductive component, the stripping problem of the grid line electrode can be reduced, which is conducive to improving the quality of the grid line electrode.

[0198] The first current threshold and the second current threshold may be the same or different, and may be adjusted according to the node of the electroplating process and the actual plating condition of the gate line electrode.

[0199] In the embodiment of the present application, step 102, controlling the electroplating power supply control module to be in the first state, includes:

[0200] S31, controlling the electroplating power control module to pass a gradually increasing stripping current to the second conductive component until a third current threshold is reached.

[0201] When the power control module is in the first state, a gradually increasing electroplating current is introduced into the first conductive component, and the increase in the electroplating current will also cause the plating situation of the first conductive component or the second conductive component to intensify. Therefore, the electroplating power control module can be controlled to introduce a gradually increasing stripping current into the second conductive component until a third current threshold is reached, and the third current threshold matches the stripping rate. By introducing a gradually increasing stripping current into the second conductive component, the stripping speed of the second conductive component is accelerated, avoiding the problem of delayed stripping, which leads to accumulation of the coating on the second conductive component.

[0202] In the embodiment of the present application, step 104, controlling the electroplating power supply control module to be in the second state, includes:

[0203] S41, controlling the electroplating power control module to pass a gradually increasing stripping current to the first conductive component until a fourth current threshold is reached.

[0204] When the power control module is in the second state, a gradually increasing electroplating current is introduced into the second conductive component, and the increase in the electroplating current will also cause the plating situation of the first conductive component or the second conductive component to intensify. Therefore, the electroplating power control module can be controlled to introduce a gradually increasing stripping current into the first conductive component until a fourth current threshold is reached, and the fourth current threshold matches the stripping rate. By introducing a gradually increasing stripping current into the first conductive component, the stripping speed of the first conductive component is accelerated, avoiding the problem of delayed stripping, which leads to accumulation of the coating on the first conductive component.

[0205] In the embodiment of the present application, before step 101, controlling the first conductive component to be in the first position and controlling the second conductive component to be in the fourth position, the solar cell electroplating method further includes:

[0206] Step S101, controlling the first conductive component to be in the first position, and controlling the second conductive component to be in the third position.

[0207] In order to avoid the phenomenon of stripping due to thin gate electrode, before the first conductive component and the second conductive component are alternately electroplated and stripped, the first conductive component can be controlled to be in the first position and the second conductive component can be controlled to be in the third position, so that the first conductive component and the second conductive component are both in contact with the gate feeding point on the surface of the solar cell. The first conductive component and the second conductive component electroplate the solar cell at the same time, and after a stable gate electrode is formed, the alternating electroplating and stripping process is performed.

[0208] Step S102, controlling the electroplating power supply control module to be in the fifth state, so that the first conductive component and the second conductive component are both connected to the negative electrode of the electroplating power supply.

[0209] When the electroplating power supply control module is in the fifth state, the first conductive component and the second conductive component are both connected to the negative electrode of the electroplating power supply, the anode is connected to the positive electrode of the electroplating power supply, the first conductive component, the second conductive component and the anode form an electroplating loop, and the first conductive component and the second conductive component electroplate the solar cell at the same time. The electroplating power supply control module can pass a gradually increasing electroplating current to the first conductive component and the second conductive component, and then pass a constant current after forming a stable grid line electrode.

[0210] After forming a stable gate line electrode, performing an alternating electroplating and stripping process can reduce the stripping problem of the gate line electrode and is beneficial to improving the quality of the gate line electrode.

[0211] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A solar cell electroplating device, It is characterized in that include: An electroplating tank, a first conductive component, a second conductive component, and an electroplating power supply control module; An anode is arranged in the electroplating tank; The first conductive component and the second conductive component are respectively used to be electrically connected to the grid line feeding points on the surface of the solar cell; The electroplating power supply control module is electrically connected to the electroplating power supply, the first conductive component and the second conductive component respectively, and is used to control the first conductive component and the second conductive component to switch between the positive and negative poles of the electroplating power supply; When the first conductive component is connected to the negative electrode of the electroplating power source, and the second conductive component is connected to the positive electrode of the electroplating power source, the first conductive component and the anode form a first electroplating loop, and the first conductive component and the second conductive component form a first deplating loop; When the second conductive component is connected to the negative electrode of the electroplating power source, and the first conductive component is connected to the positive electrode of the electroplating power source, the second conductive component and the anode form a second electroplating loop, and the first conductive component and the second conductive component form a second deplating loop; The first conductive component has a first position and a second position; When in the first position, the first conductive component is connected to the negative electrode of the electroplating power supply, and the first conductive component is electrically connected to the grid line feeding point on the surface of the solar cell; When in the second position, the first conductive component is connected to the positive electrode of the electroplating power source, and the first conductive component is separated from the solar cell; The second conductive component has a third position and a fourth position; In the third position, the second conductive component is connected to the negative electrode of the electroplating power supply, and the second conductive component is electrically connected to the grid line feeding point on the surface of the solar cell; In the fourth position, the second conductive component is connected to the positive electrode of the electroplating power supply, and the second conductive component is separated from the solar cell.

2. A solar cell electroplating device, It is characterized in that include: An electroplating tank, at least one cathode conductive unit and an anode plate having at least one through hole; the anode plate is attached to the inner wall of the electroplating tank having at least one through hole, and the through hole of the anode plate and the through hole on the inner wall of the electroplating tank correspond to each other; the cathode conductive unit passes through the through hole of the anode plate and the through hole on the inner wall of the electroplating tank; The electroplating device comprises a first conductive component, a second conductive component, and an electroplating power supply control module connected to the first conductive component and the second conductive component, the cathode conductive unit has more than one first conductive unit and more than one second conductive unit, and the first conductive unit is formed on the first conductive component, and the second conductive unit is formed on the second conductive component; The first conductive component has a first position and a second position; When in the first position, the first conductive component is connected to the negative electrode of the electroplating power supply, and the first conductive component is electrically connected to the grid line feeding point on the surface of the solar cell; When in the second position, the first conductive component is connected to the positive electrode of the electroplating power source, and the first conductive component is separated from the solar cell; The second conductive component has a third position and a fourth position; In the third position, the second conductive component is connected to the negative electrode of the electroplating power supply, and the second conductive component is electrically connected to the grid line feeding point on the surface of the solar cell; In the fourth position, the second conductive component is connected to the positive electrode of the electroplating power supply, and the second conductive component is separated from the solar cell.

3. The solar cell electroplating device according to claim 1 or 2, It is characterized in that The electroplating power supply control module is electrically connected to the anode and is used to control the anode to switch between the positive and negative poles of the electroplating power supply.

4. The solar cell electroplating device according to claim 1 or 2, It is characterized in that The solar cell electroplating device further comprises: a stripping cathode; The electroplating power supply control module is connected to the stripping cathode and is used to control the on / off circuit between the stripping cathode and the negative electrode of the electroplating power supply; When at least one of the first conductive component and the second conductive component is connected to the positive electrode of the electroplating power supply and the deplating cathode is connected to the negative electrode of the electroplating power supply, the deplating cathode and the first conductive component, or, the deplating cathode and the second conductive component, or, the deplating cathode, the first conductive component and the second conductive component form a third deplating circuit.

5. The solar cell electroplating device according to claim 4, It is characterized in that The stripping cathode is arranged at the bottom of the solar cell installation position; The stripping cathode is detachable or position-adjustable.

6. The solar cell electroplating device according to claim 1 or 2, It is characterized in that The first conductive component includes a plurality of first conductive units, the second conductive component includes a plurality of second conductive units, and the first conductive units and the second conductive units are respectively used to be electrically connected to the grid line feeding points on the surface of the solar cell; The plurality of first conductive units and the plurality of second conductive units are distributed in an array.

7. The solar cell electroplating device according to claim 6, It is characterized in that The first conductive units and the second conductive units are arranged crosswise.

8. The solar cell electroplating device according to claim 6, It is characterized in that The array is divided into a first half area and a second half area by an array center line or an array diagonal line, a plurality of first conductive units are located in the first half area, and a plurality of second conductive units are located in the second half area.

9. The solar cell electroplating device according to claim 6, It is characterized in that The array is divided into an inner circle and an outer circle. A plurality of first conductive units are located in the inner circle, and a plurality of second conductive units are located in the outer circle.

10. The solar cell electroplating device according to claim 6, It is characterized in that At least a portion of the outer surface of the first conductive unit and / or at least a portion of the outer surface of the second conductive unit is provided with an isolation insulating layer.

11. The solar cell electroplating device according to claim 1 or 2, It is characterized in that The electroplating tank comprises: a plating tank body and a cover plate; When the plating tank body and the cover plate are in a first relative position, there is a gap between the plating tank body and the cover plate for loading and unloading the solar cell; When the plating tank body and the cover plate are in a second relative position, the plating tank body and the cover plate are buckled together to form the electroplating tank.

12. The solar cell electroplating device according to claim 11, It is characterized in that A sealing member is provided between the plating tank body and the cover plate.

13. The solar cell electroplating device according to claim 11, It is characterized in that The plating tank body is provided with a first positioning portion, and the cover plate is provided with a second positioning portion, and the first positioning portion and the second positioning portion are positioned and matched.

14. The solar cell electroplating device according to claim 11, It is characterized in that One of the plating tank body and the cover plate is provided with a guide rod, and the other of the plating tank body and the cover plate is provided with a guide hole; The guide rod is inserted into the guide hole and is slidably connected to the guide hole.

15. The solar cell electroplating device according to claim 11, It is characterized in that The cover plate is provided with a plurality of first through holes; The first conductive component and the second conductive component extend into the electroplating tank through the first through hole.

16. The solar cell electroplating device according to claim 15, It is characterized in that The anode is arranged on one side of the cover plate close to the plating tank body; The anode is provided with a plurality of second through holes, and the first conductive component and the second conductive component extend into the electroplating tank through the first through holes and the second through holes.

17. The solar cell electroplating device according to claim 16, It is characterized in that During electroplating, along the thickness direction of the solar cell, the distance between the anode and the solar cell is 1 mm-10 mm.

18. The solar cell electroplating device according to claim 11, It is characterized in that The solar cell electroplating device further comprises: a first driving mechanism; The first driving mechanism is connected to at least one of the plating tank body and the cover plate to drive the plating tank body and the cover plate to switch between the first relative position and the second relative position.

19. The solar cell electroplating device according to claim 1, It is characterized in that The solar cell electroplating device further comprises: a second driving mechanism; The second driving mechanism is connected to the first conductive component to drive the first conductive component to switch between the first position and the second position.

20. The solar cell electroplating device according to claim 1, It is characterized in that The solar cell electroplating device further comprises: a third driving mechanism; The third driving mechanism is connected to the second conductive component to drive the second conductive component to switch between the third position and the fourth position.

21. The solar cell electroplating device according to claim 1 or 2, It is characterized in that The electroplating tank is provided with a liquid inlet and a liquid outlet; The minimum cross-sectional area of ​​the liquid inlet is not less than twice the minimum cross-sectional area of ​​the inner cavity of the electroplating tank in a direction perpendicular to the flow of the electroplating solution.

22. A method for electroplating a solar cell. It is characterized in that include: Controlling the first conductive component to be in a first position, and controlling the second conductive component to be in a fourth position, wherein the first position is a position where the first conductive component is electrically connected to a grid line feeding point on a surface of a solar cell, and the fourth position is a position where the second conductive component is separated from the solar cell; Controlling the electroplating power supply control module to be in a first state so that the first conductive component is connected to the negative electrode of the electroplating power supply, and the second conductive component is connected to the positive electrode of the electroplating power supply; After a first preset time interval, the first conductive component is controlled to be in a second position, and the second conductive component is controlled to be in a third position, wherein the second position is a position where the first conductive component is separated from the solar cell, and the third position is a position where the second conductive component is electrically connected to a grid line feeding point on the surface of the solar cell; The electroplating power supply control module is controlled to be in a second state so that the first conductive component is connected to the positive electrode of the electroplating power supply, and the second conductive component is connected to the negative electrode of the electroplating power supply.

23. The solar cell electroplating method according to claim 22, It is characterized in that The solar cell electroplating method further comprises: At a second preset time before the end of electroplating, the path between the electroplating power supply and the anode is disconnected.

24. The solar cell electroplating method according to claim 22, It is characterized in that The solar cell electroplating method further comprises: After the electroplating is completed, the electroplating power supply control module is controlled to be in a third state so that at least one of the first conductive component and the second conductive component is connected to the positive pole of the electroplating power supply, and the stripping cathode is connected to the negative pole of the electroplating power supply.

25. The solar cell electroplating method according to claim 22, It is characterized in that The solar cell electroplating method further comprises: After the electroplating is completed, the electroplating power supply control module is controlled to be in the fourth state so that at least one of the first conductive component and the second conductive component is connected to the positive electrode of the electroplating power supply, and the anode is connected to the negative electrode of the electroplating power supply.

26. The solar cell electroplating method according to claim 22, It is characterized in that The controlling electroplating power supply control module is in a first state, comprising: Controlling the electroplating power supply control module to pass a gradually increasing electroplating current to the first conductive component until a first current threshold is reached; The controlling the electroplating power supply control module to be in the second state comprises: The electroplating power control module is controlled to pass a gradually increasing electroplating current to the second conductive component until a second current threshold is reached.

27. The solar cell electroplating method according to claim 22, It is characterized in that The controlling electroplating power supply control module is in a first state, comprising: Controlling the electroplating power supply control module to pass a gradually increasing stripping current to the second conductive component until a third current threshold is reached; The controlling the electroplating power supply control module to be in the second state comprises: The electroplating power supply control module is controlled to pass a gradually increasing stripping current to the first conductive component until a fourth current threshold is reached.

28. The solar cell electroplating method according to claim 22, It is characterized in that Before controlling the first conductive component to be in the first position and controlling the second conductive component to be in the fourth position, the solar cell electroplating method further includes: Controlling the first conductive component to be in the first position, and controlling the second conductive component to be in the third position; The electroplating power supply control module is controlled to be in a fifth state so that the first conductive component and the second conductive component are both connected to the negative pole of the electroplating power supply.

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