Panel and copper etching solution production equipment for semiconductor

Abstract

The present application relates to etching liquid production technical field, provide a kind of panel and semiconductor copper etching liquid production equipment, including: first raw material tank, for storing N-methyl formamide;Second raw material tank, for storing hydrogen peroxide;Third raw material tank, for storing trisodium phosphate;Fourth raw material tank, for storing ethylenediaminetetraacetic acid;Fifth raw material tank, for storing propionic acid;Sixth raw material tank, for storing additive;Seventh raw material tank, for storing surfactant;Eighth raw material tank, for storing pure water;It also includes material conveying main pipe, material conveying branch pipe, tee pipe, vertical pipe, liquid pump, first electric control valve, second electric control valve and stirring mixing kettle.The present application has the advantages that: pure water is dispersed from material conveying main pipe to material conveying branch pipe, copper etching liquid raw materials enter respective material conveying branch pipe, mixed with pure water to form solution, then under the drive of corresponding liquid pump, it is transported to stirring mixing kettle, and copper etching liquid for panel and semiconductor is efficiently produced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of etching solution production, in particular to a panel and semiconductor copper etching solution production equipment. BACKGROUND

[0002] The copper etching solution is suitable for etching of printed copper, has fast etching speed, the etching speed can reach 4-5 um / min, the waste liquid is simple to recover, and is widely used for printed boards and circuit boards. The copper etching solution can also be used for etching of copper handicrafts. The board surface after etching is flat and bright. The copper etching solution has fast reaction speed, low use temperature, long solution use life, easy post-treatment and small environmental pollution.

[0003] The patent application document with publication number CN116103652A discloses a thick copper etching solution for the fields of semiconductors and touch panels, specifically discloses that in a purification space, pure water, trisodium phosphate, EDTA (ethylenediaminetetraacetic acid), N-methyl formamide, hydrogen peroxide, propionic acid, an additive and a surfactant are sequentially added, stirred uniformly, filtered, and then packaged to obtain a finished product. The additive is an organic acid, and the surfactant is sodium dodecyl benzene sulfonate.

[0004] At room temperature, trisodium phosphate, EDTA (ethylenediaminetetraacetic acid) and the surfactant (sodium dodecyl benzene sulfonate) are in powder shape. As shown in the figure, the traditional powder raw material is added by placing a raw material tank containing powder above the stirring mixing kettle, then opening the bottom valve of the raw material tank, and the powder raw material falls into the stirring mixing kettle through the pipeline due to gravity. After the powder-shaped raw material is used up, the powder raw material needs to be manually moved to the position of the raw material tank above the stirring mixing kettle through stairs or an elevator, and then poured into the raw material tank. Such a material conveying mode occupies a lot of time and has very low production efficiency. Figure 1

[0005] Therefore, how to efficiently produce the copper etching solution for panels and semiconductors is a technical problem to be solved in the field. SUMMARY

[0006] The technical problem to be solved by the present application is to provide a panel and semiconductor copper etching solution production equipment to efficiently produce the copper etching solution for panels and semiconductors.

[0007] The present application is implemented as follows: a panel and semiconductor copper etching solution production equipment, comprising:

[0008] A first raw material tank for storing N-methyl formamide;

[0009] A second raw material tank for storing hydrogen peroxide;

[0010] A third raw material tank for storing trisodium phosphate;​

[0011] A fourth raw material tank for storing ethylenediaminetetraacetic acid;

[0012] A fifth raw material tank for storing propionic acid;

[0013] A sixth raw material tank for storing additives;

[0014] A seventh raw material tank for storing surfactants;

[0015] An eighth raw material tank for storing pure water;

[0016] Further comprising a main feed pipe, a branch feed pipe, a tee pipe, a vertical pipe, a liquid pump, a first electric control valve, a second electric control valve and a stirring mixing kettle;

[0017] The bottom outlet of the eighth raw material tank is connected with the inlet of the main feed pipe, the outlet of the main feed pipe is respectively connected with the inlet of the branch feed pipe, the outlet of the branch feed pipe is connected with the first pipe port of the tee pipe, the second pipe port of the tee pipe is connected with the inlet of the liquid pump, the outlet of the liquid pump is connected with the lower end inlet of the vertical pipe, the upper end outlet of the vertical pipe is connected with the top inlet of the stirring mixing kettle, there are seven of the branch feed pipe, the tee pipe, the liquid pump and the vertical pipe, the bottom outlets of the first raw material tank to the seventh raw material tank are respectively connected with the third pipe ports of the seven tee pipes;

[0018] The bottom outlets of the first raw material tank to the eighth raw material tank are all provided with the first electric control valve, and the inlets of the seven branch feed pipes are all provided with the second electric control valve.

[0019] Further, a water supplement pipe and a water pump are further included, the inlet of the water supplement pipe is connected with the outlet of the main feed pipe, the outlet of the water supplement pipe is connected with the inlet of the water pump, and the outlet of the water pump is connected with the top inlet of the stirring mixing kettle.

[0020] Further, an industrial computer is further included, and the industrial computer is electrically connected with the liquid pump, the water pump, the first electric control valve, the second electric control valve and the stirring mixing kettle.

[0021] Further, a support frame and a weighing sensor are further included, the weighing sensors are all fixedly arranged on the support frame, there are eight of the support frame and the weighing sensors, and the first raw material tank to the eighth raw material tank are respectively arranged at the detection ends of the eight weighing sensors.

[0022] The weighing sensor is electrically connected with the industrial computer, when the weighing sensor detects that the weight of any one of the first raw material tank to the seventh raw material tank decreases to a preset weight threshold, the industrial computer first controls to close the first electric control valve located at the corresponding raw material tank, delays for a preset time, and then controls to close the second electric control valve and the liquid pump located at the corresponding conveying branch pipe.

[0023] Further, when the weighing sensor detects that the weight of the eighth raw material tank decreases to a preset weight threshold, the industrial computer closes all the first electric control valve, the second electric control valve, the liquid pump and the water pump.

[0024] Further, the preset weight threshold is the weight of the empty raw material tank.

[0025] Further, the operation panel is electrically connected with the industrial computer.

[0026] Further, the additive is an organic acid, and the surfactant is sodium dodecyl benzene sulfonate.

[0027] Further, in terms of mass percentage, the N-methyl formamide accounts for 4-10%, the hydrogen peroxide accounts for 4-10%, the trisodium phosphate accounts for trisodium phosphate, the ethylenediaminetetraacetic acid accounts for 0.1-0.5%, the propionic acid accounts for 0.5-3%, the additive accounts for 0.1-0.5%, the surfactant accounts for 0.05-0.2%, and the balance is the pure water.

[0028] Compared with the background art, the advantages of the present application are that the pure water is dispersed from the main conveying pipe to the conveying branch pipe, and the raw materials of the copper etching solution except the pure water enter the respective conveying branch pipes to mix with the pure water to form a solution, and then under the driving of the corresponding liquid pump, the solution is conveyed to the stirring mixing kettle through the vertical pipe, so that the workers do not need to carry the powder raw materials to the upper part of the stirring mixing kettle, but directly add the powder raw materials to the raw material tank at the corresponding position, thereby saving time and efficiently producing the copper etching solution for panels and semiconductors. BRIEF DESCRIPTION OF DRAWINGS

[0029] The present application will be further described below with reference to the accompanying drawings and embodiments.

[0030] Figure 1 It is a schematic view of the positions of the raw material tanks and the stirring mixing kettle in the background art.

[0031] Figure 2 It is a schematic view of the structure of the copper etching solution production equipment for panels and semiconductors in the present application.

[0032] Figure 3 It is a schematic view of the third raw material tank, the eighth raw material tank and the stirring mixing kettle placed on the ground in the present application.

[0033] Figure 4 Figure 1 is a schematic diagram of the connection between the industrial computer and each device in the present application.

[0034] Reference signs: raw material tank 10; first raw material tank 11; second raw material tank 12; third raw material tank 13; fourth raw material tank 14; fifth raw material tank 15; sixth raw material tank 16; seventh raw material tank 17; eighth raw material tank 18; main feed pipe 20; branch feed pipe 21; tee pipe 22; vertical pipe 23; first electric control valve 24; second electric control valve 25; water supplement pipe 26; liquid pump 30; water pump 31; stirring mixing kettle 40; industrial computer 50; operation panel 51; support frame 60; weighing sensor 61. DETAILED DESCRIPTION

[0035] The present application provides a kind of panel and copper etching liquid of semiconductor, overcome the shortcoming that powder raw material of copper etching liquid in the background art needs to be moved to the raw material tank position located above stirring mixing kettle to add raw material, realize the technical effect of no need to transport powder raw material to the upper of stirring mixing kettle, directly add powder raw material in the raw material tank of corresponding position, save time, efficiently produce panel and copper etching liquid of semiconductor.

[0036] The general idea of the technical scheme of the embodiments of the present application is as follows:

[0037] The raw materials of the copper etching liquid for panel and semiconductor are N-methyl formamide, hydrogen peroxide, trisodium phosphate, ethylenediaminetetraacetic acid, propionic acid, additives, surfactants and pure water. The raw material tanks containing these raw materials are located at a low position or placed on the ground, and the staff can directly stand on the ground to add the required raw materials to the raw material tanks. The operations of the corresponding first electric control valve, second electric control valve, liquid pump and water pump are independent of each other. The pure water is dispersed from the main feed pipe to the branch feed pipes, and the raw materials of the copper etching liquid except the pure water enter the respective branch feed pipes to mix with the pure water to form a solution. Then, under the drive of the corresponding liquid pump, the solution is transported to the stirring mixing kettle through the vertical pipe. The raw materials can simultaneously enter the respective branch feed pipes and then flow to the stirring mixing kettle, or the raw materials can enter the respective branch feed pipes in sequence and then flow to the stirring mixing kettle in sequence. The control of the electric control valve and the liquid pump is based on the actual production process.

[0038] In order to better understand the above technical scheme, the above technical scheme will be described in detail below in combination with the drawings of the specification and the specific embodiments.

[0039] Reference Figures 1 to 4 to the preferred embodiments of the present application.

[0040] A panel and semiconductor copper etching liquid production equipment comprises:

[0041] The first raw material tank 11 is used for storing N-methyl formamide;

[0042] The second raw material tank 12 is used for storing hydrogen peroxide;

[0043] The third raw material tank 13 is used for storing trisodium phosphate;

[0044] The fourth raw material tank 14 is used for storing ethylenediaminetetraacetic acid;

[0045] The fifth raw material tank 15 is used for storing propionic acid;

[0046] The sixth raw material tank 16 is used for storing additives;

[0047] The seventh raw material tank 17 is used for storing surfactants;

[0048] The eighth raw material tank 18 is used for storing pure water;

[0049] The eighth raw material tank 18 is used for storing pure water;

[0050] The bottom outlet of the eighth raw material tank 18 is connected with the inlet of the main material conveying pipe 20, the outlet of the main material conveying pipe 20 is connected with the inlet of the branch material conveying pipe 21 respectively, the outlet of the branch material conveying pipe 21 is connected with the first pipe port of the three-way pipe 22, the second pipe port of the three-way pipe 22 is connected with the inlet of the liquid pump 30, the outlet of the liquid pump 30 is connected with the lower end inlet of the vertical pipe 23, the upper end outlet of the vertical pipe 23 is connected with the top inlet of the stirring mixing kettle 40, the branch material conveying pipe 21, the three-way pipe 22, the liquid pump 30 and the vertical pipe 23 are all seven, the bottom outlets of the first raw material tank 11 to the seventh raw material tank 17 are respectively connected with the third pipe ports of the seven three-way pipes 22;

[0051] The bottom outlets of the first raw material tank 11 to the eighth raw material tank 18 are all installed with the first electric control valve 24, and the inlets of the seven branch material conveying pipes 21 are all installed with the second electric control valve 25.

[0052] In this embodiment, pure water is dispersed from the main material conveying pipe 20 to the branch material conveying pipe 21, and the raw materials of the copper etching solution except pure water enter the respective branch material conveying pipes 21 respectively, are mixed with pure water to form a solution, and then are conveyed to the stirring mixing kettle 40 through the vertical pipe 23 under the driving of the corresponding liquid pump 30, so that the staff do not need to carry the powder raw materials to the upper side of the stirring mixing kettle 40, directly add the powder raw materials in the corresponding position of the raw material tank, save time, and efficiently produce the copper etching solution of the panel and the semiconductor.

[0053] The first electrically controlled valve 24 is used to control whether the raw material of the corresponding raw material tank falls and the falling speed, and the second electrically controlled valve 25 is used to control whether pure water flows to the corresponding material conveying branch pipe 21, and the powder raw material and other liquid raw materials are mixed into a solution in the pure water, and the solution is transported upward through the vertical pipe 23 to the top inlet of the stirring mixing kettle 40, and the liquid pump 30 is powered.

[0054] The water supplement pipe 26 and the water pump 31 are further included, the inlet of the water supplement pipe 26 is connected with the outlet of the material conveying main pipe 20, the outlet of the water supplement pipe 26 is connected with the inlet of the water pump 31, and the outlet of the water pump 31 is connected with the top inlet of the stirring mixing kettle 40. The beneficial effect of this technical solution is that the first electrically controlled valve 24 is opened, and the water pump 31 is started, so that water can be supplemented to the stirring mixing kettle 40 alone.

[0055] The industrial computer 50 is further included, and the industrial computer 50 is electrically connected with the liquid pump 30, the water pump 31, the first electrically controlled valve 24, the second electrically controlled valve 25 and the stirring mixing kettle 40. The beneficial effect of this technical solution is that the working states of the liquid pump 30, the water pump 31, the first electrically controlled valve 24, the second electrically controlled valve 25 and the stirring mixing kettle 40 are remotely controlled by the industrial computer 50, and production is orderly carried out.

[0056] The support frame 60 and the weighing sensor 61 are further included, the weighing sensor 61 is fixedly arranged in the support frame 60, and the support frame 60 and the weighing sensor 61 are both eight, and the first raw material tank 11 to the eighth raw material tank 18 are respectively placed at the detection end of the eight weighing sensors 61.

[0057] The weighing sensor 61 is electrically connected with the industrial computer 50, when the weighing sensor 61 detects that the weight of any one of the first raw material tank 11 to the seventh raw material tank 17 decreases to a preset weight threshold, the industrial computer 50 first controls to close the first electrically controlled valve 24 located at the corresponding raw material tank, delays for a preset time, and then controls to close the second electrically controlled valve 25 located at the corresponding conveying branch pipe and the liquid pump 30. The beneficial effect of this technical solution is that the weighing sensor 61 detects the weight change of the raw material tank in real time, and when a certain raw material reaches a preset weight threshold, the feeding of the raw material is automatically stopped, which is high in convenience and avoids overfeeding of the raw material. The preset weight threshold is set according to the weight ratio of the raw material in the copper etching liquid of the application.

[0058] When the weighing sensor 61 detects that the weight of the eighth raw material tank 18 drops to a preset weight threshold, the industrial computer 50 closes all the first electric control valve 24, the second electric control valve 25, the liquid pump 30 and the water pump 31. The preset weight threshold is the weight of the empty raw material tank. The beneficial effect of this technical solution is that when the weight of the eighth raw material tank 18 reaches the preset weight threshold, it indicates that the pure water is insufficient, and the liquid pump 30 is difficult to deliver the powder raw material, so the pure water needs to be supplemented.

[0059] Further comprising an operation panel 51, which is electrically connected with the industrial computer 50. The beneficial effect of this technical solution is that the staff can manually control the production according to the actual situation.

[0060] The additive is an organic acid, and the surfactant is sodium dodecyl benzene sulfonate.

[0061] In terms of mass percentage, the N-methyl formamide accounts for 4-10%, the hydrogen peroxide accounts for 4-10%, the trisodium phosphate accounts for trisodium phosphate, the ethylenediaminetetraacetic acid accounts for 0.1-0.5%, the propionic acid accounts for 0.5-3%, the additive accounts for 0.1-0.5%, the surfactant accounts for 0.05-0.2%, and the balance is the pure water. At room temperature, the trisodium phosphate, EDTA (ethylenediaminetetraacetic acid) and surfactant (sodium dodecyl benzene sulfonate) are in powder form.

[0062] The panel and the copper etching solution for semiconductor production equipment of the application, the raw material tank is located at a low place or on the ground, and the staff directly stands on the ground to add the required raw material to the raw material tank, without the need to carry the raw material to the upper part of the stirring and mixing kettle 40. The powder raw material and other liquid raw materials are first mixed into a solution in the material conveying branch pipe 21 and the pure water, respectively, and then the solution is conveyed to the stirring and mixing kettle 40 by the liquid pump 30. The raw materials can enter the respective material conveying branch pipes 21 at the same time, so as to flow to the stirring and mixing kettle 40 at the same time. Alternatively, the raw materials can enter the respective material conveying branch pipes 21 in sequence, so as to flow to the stirring and mixing kettle 40 in sequence. The electric control valve and the liquid pump 30 are controlled according to the actual production process. The stirring mechanism in the stirring and mixing kettle 40 fully stirs the liquid to obtain the panel and the copper etching solution for semiconductor.

[0063] Although the specific embodiments of the application are described above, those skilled in the art should understand that the specific examples described are only illustrative, and are not intended to limit the scope of the application. Equivalent modifications and variations made by those skilled in the art in accordance with the spirit of the application should be covered within the scope of the claims of the application.

Claims

1. A copper etching solution production equipment for panels and semiconductors, characterized in that, include: The first raw material tank is used to store N-methylformamide; The second raw material tank is used to store hydrogen peroxide; The third raw material tank is used to store trisodium phosphate; The fourth raw material tank is used to store ethylenediaminetetraacetic acid; The fifth raw material tank is used to store propionic acid; The sixth raw material tank is used to store additives; The seventh raw material tank is used to store surfactants; The eighth raw material tank is used to store pure water; It also includes a main conveying pipe, a branch conveying pipe, a tee pipe, a vertical pipe, a liquid pump, a first electrically controlled valve, a second electrically controlled valve, and a mixing kettle; The bottom outlet of the eighth raw material tank is connected to the inlet of the main conveying pipe. The outlet of the main conveying pipe is connected to the inlet of the branch conveying pipe. The outlet of the branch conveying pipe is connected to the first port of the tee pipe. The second port of the tee pipe is connected to the inlet of the liquid pump. The outlet of the liquid pump is connected to the lower inlet of the vertical pipe. The upper outlet of the vertical pipe is connected to the top inlet of the mixing vessel. There are seven branch conveying pipes, seven tee pipes, seven liquid pumps, and seven vertical pipes. The bottom outlets of the first to seventh raw material tanks are connected to the third ports of the seven tee pipes. The first electrically controlled valve is installed at the bottom outlet of each of the first to eighth raw material tanks, and the second electrically controlled valve is installed at the inlet of each of the seven material conveying branch pipes.

2. The copper etching solution production equipment for panels and semiconductors according to claim 1, characterized in that, It also includes a water supply pipe and a water pump. The inlet of the water supply pipe is connected to the outlet of the main conveying pipe, the outlet of the water supply pipe is connected to the inlet of the water pump, and the outlet of the water pump is connected to the top inlet of the mixing vessel.

3. The copper etching solution production equipment for panels and semiconductors according to claim 1, characterized in that, It also includes an industrial computer, which is electrically connected to the liquid pump, water pump, first electrically controlled valve, second electrically controlled valve, and mixing vessel.

4. The copper etching solution production equipment for panels and semiconductors according to claim 3, characterized in that, It also includes a support frame and weighing sensors. The weighing sensors are all fixedly mounted on the support frame. There are eight support frames and eight weighing sensors. The first to eighth raw material tanks are respectively placed at the detection ends of the eight weighing sensors. The weighing sensor is electrically connected to the industrial computer. When the weighing sensor detects that the weight of any one of the raw material tanks from the first to the seventh raw material tank has dropped to a preset weight threshold, the industrial computer first controls the closure of the first electrically controlled valve located in the corresponding raw material tank, and after a preset delay, controls the closure of the second electrically controlled valve located in the corresponding conveying branch pipe and the liquid pump.

5. The copper etching solution production equipment for panels and semiconductors according to claim 4, characterized in that, When the weighing sensor detects that the weight of the eighth raw material tank has dropped to a preset weight threshold, the industrial computer shuts down all the first electrically controlled valves, the second electrically controlled valves, the liquid pump, and the water pump.

6. The copper etching solution production equipment for panels and semiconductors according to claim 4, characterized in that, The preset weight threshold is the weight of an empty raw material tank.

7. The copper etching solution production equipment for panels and semiconductors according to claim 3, characterized in that, It also includes an operation panel, which is electrically connected to the industrial computer.

8. The copper etching solution production equipment for panels and semiconductors according to claim 1, characterized in that, The additive is an organic acid, and the surfactant is sodium dodecylbenzenesulfonate.

9. The copper etching solution production equipment for panels and semiconductors according to claim 1, characterized in that, By mass percentage, the N-methylformamide accounts for 4-10%, the hydrogen peroxide accounts for 4-10%, the trisodium phosphate accounts for 0.1-0.5%, the ethylenediaminetetraacetic acid accounts for 0.5-3%, the additives account for 0.1-0.5%, the surfactant accounts for 0.05-0.2%, and the balance is pure water.

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