Interference signal testing method and electronic equipment

Abstract

The embodiment of the present application is applicable to the field of electrostatic testing, and provides a testing method and electronic device for interference signals, which are applied to an electrostatic discharge (ESD) testing system. The ESD testing system includes an electrostatic generator, an electronic device to be tested, and a signal detection device. The method includes: obtaining a first voltage signal, a second voltage signal, and a third voltage signal, and then obtaining a first interference signal between a first detection point and a second detection point based on the first voltage signal, the second voltage signal, and the third voltage signal. In the embodiment of the present application, the interference signal brought by the probe, the differential amplifier module, and the sampling circuit inside the signal detection device in the signal detection device can be corrected by accessing the first voltage signal and the second voltage signal with different directions, and the interference signal introduced in the circuit loop between the first detection point and the second detection point can be corrected by the insulating device, thereby improving the accuracy of the first interference signal.

Description

Technical Field

[0001] The present application relates to the field of electrostatic testing, and more particularly, to a method and electronic equipment for testing interference signals. Background Art

[0002] With the development of mobile terminals, more and more floating electronic devices are appearing in people's lives. Among them, floating electronic devices refer to electronic devices that are not connected to the ground. For example, common floating electronic devices include mobile phones and smart wearable devices.

[0003] Electrostatic discharge (ESD) is a common source of damage to electronic devices. Typically, electronic devices must undergo electrostatic discharge (ESD) testing before they can be used by consumers. Because floating-grounded electronic devices are not connected to the ground, ESD testing cannot accurately detect interference signals caused by static electricity, making it difficult to analyze electronic component failures that occur during ESD testing.

[0004] Based on this, how to test interference signals during ESD testing has become an urgent problem to be solved. Summary of the Invention

[0005] The present application provides a method for testing interference signals, which can test interference signals during ESD testing.

[0006] In a first aspect, a method for testing interference signals is provided, which is applied to an electrostatic discharge (ESD) test system. The ESD test system includes an electrostatic generator, an electronic device to be tested, and a signal detection device. The electronic device to be tested includes a first detection point and a second detection point. The signal detection device includes a first probe and a second probe. The electrostatic generator is connected to the first detection point, and the signal detection device is connected to the electronic device to be tested. The electrostatic generator is used to output an electrostatic signal, and the signal detection device is used to detect a signal between the first detection point and the second detection point through the first probe and the second probe. The method includes:

[0007] Acquire a first voltage signal, where the first voltage signal is a signal between a first detection point and a second detection point in a first connection state, where the first connection state refers to a connection state where the first probe is connected to the first detection point and the second probe is connected to the second detection point;

[0008] Acquire a second voltage signal, where the second voltage signal is a signal between the first detection point and the second detection point in a second connection state, where the second connection state refers to a connection state where the first probe is connected to the second detection point and the second probe is connected to the first detection point;

[0009] Acquire a third voltage signal, where the third voltage signal is a signal between the first detection point and the second detection point in a third connection state, where the third connection state refers to a connection state where the first detection point and the second detection point are connected via an insulating device;

[0010] A first interference signal is obtained according to the first voltage signal, the second voltage signal and the third voltage signal; the first interference signal refers to an interference signal generated by the electrostatic signal between the first detection point and the second detection point.

[0011] The interference signal testing method provided in the embodiment of the present application is applied to an electrostatic discharge (ESD) testing system, wherein the ESD testing system includes an electrostatic generator, an electronic device to be tested, and a signal detection device, wherein the electronic device to be tested includes a first detection point and a second detection point, and the signal detection device includes a first probe and a second probe; the electrostatic generator is connected to the first detection point, and the signal detection device is connected to the electronic device to be tested, the electrostatic generator is used to output an electrostatic signal, and the signal detection device is used to detect the signal between the first detection point and the second detection point through the first probe and the second probe. The method includes: obtaining a first voltage signal, a second voltage signal, and a third voltage signal, wherein the first voltage signal refers to the first voltage signal at the first probe. When the first detection point is connected and the second probe is connected to the second detection point, the signal between the first detection point and the second detection point is obtained. The second voltage signal refers to the signal between the first detection point and the second detection point when the first probe is connected to the second detection point and the second probe is connected to the first detection point. The third voltage signal refers to the signal between the first detection point and the second detection point when the first detection point and the second detection point are connected through an insulating device; then the first interference signal between the first detection point and the second detection point is obtained according to the first voltage signal, the second voltage signal and the third voltage signal; the first interference signal refers to the interference signal generated by the electrostatic signal between the first detection point and the second detection point. In an embodiment of the present application, the first voltage signal and the second voltage signal with different access directions can be used to correct the interference signal brought by the probe, the differential amplifier module and the sampling circuit inside the signal detection device in the signal detection device, and the interference signal introduced in the circuit loop between the first detection point and the second detection point is corrected through the insulating device, so that the signal obtained after correction can more accurately indicate the signal between the first detection point and the second detection point of the electrostatic signal, that is, to improve the accuracy of the first interference signal.

[0012] In one embodiment of the present application, obtaining the first interference signal according to the first voltage signal, the second voltage signal, and the third voltage signal includes:

[0013] Correcting the second interference signal according to the first voltage signal and the second voltage signal to obtain a fourth voltage signal, where the second interference signal refers to an interference signal generated by the signal detection device on the test link;

[0014] A first interference signal is obtained according to the third voltage signal and the fourth voltage signal.

[0015] In one embodiment of the present application, the signal detection device further includes a differential amplification module, a first probe, and a second probe. The second interference signal includes a differential mode interference signal introduced by the signal detection device through a test link between the first probe and the second probe, and a common mode interference signal generated by the differential amplification module. The second interference signal is corrected according to the first voltage signal and the second voltage signal to obtain a fourth voltage signal, including:

[0016] A fourth voltage signal is obtained by subtracting the first voltage signal from the second voltage signal. The fourth voltage signal is expressed by a first formula, which includes:

[0017] V1=△V1-△V2=(V AB +V loop +V ub_needle )*a Ringing (f);

[0018] V1 represents the fourth voltage signal, △V1 represents the first voltage signal, △V2 represents the second voltage signal, V AB Represents the electrostatic interference signal, V loop V represents the interference signal generated by the circuit loop between the first probe and the second probe by the electrostatic signal. ub_needle represents the differential mode interference signal between the first probe and the second probe, a Ringing (f) refers to the preset correction factor;

[0019] The first voltage is expressed by the second formula, and the second voltage signal is expressed by the third formula;

[0020] The second formula includes:

[0021] △V1=(V AB +V loop +V ub_needle +V ub_probe +V comm )*a Ringing (f);

[0022] The third formula includes:

[0023] △V2=[(-V AB )+(-V loop )+(-V ub_needle )+V ub_probe +V comm ]*a Ringing (f);

[0024] V ub_probeIndicates the differential mode interference signal introduced by the signal detection device through the test link between the first probe and the second probe, V comm Indicates the common-mode interference signal generated by the differential amplifier module.

[0025] In an embodiment of the present application, in the process of obtaining the first interference signal, the second interference signal can be first corrected according to the first voltage signal and the second voltage signal to obtain a fourth voltage signal, wherein the second interference signal includes a differential-mode interference signal introduced by the signal detection device through the test link between the first probe and the second probe, and a common-mode interference signal generated by the differential amplifier module. In this way, the first interference signal finally obtained is obtained after correcting the differential-mode interference signal introduced by the signal detection device through the test link between the first probe and the second probe, and the signal obtained after correction can more accurately indicate the signal of the electrostatic signal between the first detection point and the second detection point, that is, the accuracy of the first interference signal is improved.

[0026] In one embodiment of the present application, obtaining the first interference signal according to the third voltage signal and the fourth voltage signal includes:

[0027] The interference signal generated by the circuit loop between the first probe and the second probe and the differential mode interference signal between the first probe and the second probe are corrected according to the third voltage signal and the fourth voltage signal to obtain a first interference signal.

[0028] In one embodiment of the present application, the correction of the interference signal generated by the circuit loop between the first probe and the second probe and the differential mode interference signal between the first probe and the second probe according to the third voltage signal and the fourth voltage signal to obtain the first interference signal includes:

[0029] Correcting an interference signal generated by a circuit loop between the first probe and the second probe and a differential mode interference signal between the first probe and the second probe based on a difference between the third voltage signal and the fourth voltage signal pair to obtain a first interference signal;

[0030] The third voltage signal is expressed by a fourth formula, which includes:

[0031] V2=(V loop +V ub_needle )*a Ringing (f);

[0032] V2 represents a third voltage signal.

[0033] The interference signal testing method provided in the embodiments of the present application is applied to an electrostatic discharge (ESD) testing system, wherein the ESD testing system includes an electrostatic generator, an electronic device to be tested, and a signal detection device, wherein the electronic device to be tested includes a first detection point and a second detection point, and the signal detection device includes a first probe and a second probe; the electrostatic generator is connected to the first detection point for outputting an electrostatic signal, and the signal detection device is connected to the electronic device to be tested for detecting a signal between the first detection point and the second detection point through the first probe and the second probe, including: obtaining a first voltage signal, a second voltage signal, and a third voltage signal, wherein the first voltage signal refers to a signal between the first detection point and the second detection point when the first probe is connected to the first detection point and the second probe is connected to the second detection point, and the second voltage signal refers to a signal between the first detection point and the second detection point when the first probe is connected to the first detection point and the second probe is connected to the second detection point The second detection point is connected, and the second probe is connected to the first detection point. The signal between the first detection point and the second detection point is the third voltage signal. The signal between the first detection point and the second detection point is the third voltage signal. The second interference signal is then corrected according to the first voltage signal and the second voltage signal to obtain a fourth voltage signal, wherein the second interference signal includes a differential mode interference signal introduced by the signal detection device through the test link between the first probe and the second probe, and a common mode interference signal generated by the differential amplifier module. Based on the difference between the third voltage signal and the fourth voltage signal pair, the interference signal generated by the circuit loop between the first probe and the second probe by the electrostatic signal and the differential mode interference signal between the first probe and the second probe are corrected to obtain the first interference signal. In this way, the obtained first interference signal is obtained by correcting the interference signal brought by the probe, the differential amplifier module and the sampling circuit inside the signal detection device in the signal detection device through the first voltage signal and the second voltage signal with different access directions, and correcting the interference signal introduced in the circuit loop between the first detection point and the second detection point through the insulation device, thereby improving the accuracy of the obtained first interference signal.

[0034] In one embodiment of the present application, when acquiring the first voltage signal, the first probe is connected to the first probe through the inner core of the coaxial line, and the second probe is connected to the second probe through the outer shell of the coaxial line.

[0035] In the embodiments of the present application, when acquiring a first voltage signal, the first probe is connected to the first probe via the inner core of the coaxial line, and the second probe is connected to the second probe via the outer shell of the coaxial line. Due to the high isolation between the outer shell and the inner core of the coaxial line, the acquisition of the first voltage signal is prevented from being affected by other interference signals, thereby improving the accuracy of the first voltage signal.

[0036] In one embodiment of the present application, when acquiring the second voltage signal, the first probe is connected to the second probe through the outer shell of the coaxial line, and the second probe is connected to the first probe through the inner core of the coaxial line.

[0037] In the embodiments of the present application, when acquiring the second voltage signal, the first probe is connected to the second probe via the outer shell of the coaxial line, and the second probe is connected to the first probe via the inner core of the coaxial line. Due to the high isolation between the outer shell and the inner core of the coaxial line, the acquisition of the second voltage signal is prevented from being affected by other interference signals, thereby improving the accuracy of the second voltage signal.

[0038] In one embodiment of the present application, the electronic device to be tested is arranged on an insulating pad, the insulating pad is arranged on a metal plate, and the metal plate is grounded.

[0039] In one embodiment of the present application, the signal detection device includes an oscilloscope.

[0040] In a second aspect, a device for testing interference signals is provided, comprising a unit for performing any of the methods described in the first aspect. The device may be a server, a terminal device, or a chip within the terminal device. The device may include an input unit and a processing unit.

[0041] When the device is a terminal device, the processing unit may be a processor, and the input unit may be a communication interface; the terminal device may also include a memory for storing computer program code, and when the processor executes the computer program code stored in the memory, the terminal device executes any one of the methods in the first aspect.

[0042] When the device is a chip in a terminal device, the processing unit may be a processing unit inside the chip, and the input unit may be an output interface, a pin or a circuit, etc.; the chip may also include a memory, which may be a memory inside the chip (for example, a register, a cache, etc.) or a memory located outside the chip (for example, a read-only memory, a random access memory, etc.); the memory is used to store computer program code, and when the processor executes the computer program code stored in the memory, the chip executes any one of the methods in the first aspect.

[0043] In one possible implementation, a memory is used to store computer program code; a processor executes the computer program code stored in the memory, and when the computer program code stored in the memory is executed, the processor is used to perform the following: obtaining a first voltage signal, where the first voltage signal is a signal between a first detection point and a second detection point in a first connection state, where the first connection state refers to a connection state in which the first probe is connected to the first detection point and the second probe is connected to the second detection point; obtaining a second voltage signal, where the second voltage signal is a signal between the first detection point and the second detection point in a second connection state, where the second connection state refers to a connection state in which the first probe is connected to the second detection point and the second probe is connected to the first detection point; obtaining a third voltage signal, where the third voltage signal is a signal between the first detection point and the second detection point in the third connection state, where the third connection state refers to a connection state in which the first detection point and the second detection point are connected via an insulating device; and obtaining a first interference signal based on the first voltage signal, the second voltage signal, and the third voltage signal; the first interference signal refers to an interference signal generated by an electrostatic signal between the first detection point and the second detection point.

[0044] In a third aspect, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores a computer program code. When the computer program code is executed by a test device for an interference signal, the test device for an interference signal executes any one of the test methods for an interference signal in the first aspect or the second aspect.

[0045] In a fourth aspect, a computer program product is provided, comprising: a computer program code, wherein when the computer program code is executed by a test device for an interference signal, the test device for an interference signal executes any one of the device methods in the first aspect or the second aspect.

[0046] The interference signal testing method provided in the embodiment of the present application is applied to an electrostatic discharge (ESD) testing system, wherein the ESD testing system includes an electrostatic generator, an electronic device to be tested, and a signal detection device, wherein the electronic device to be tested includes a first detection point and a second detection point, and the signal detection device includes a first probe and a second probe; the electrostatic generator is connected to the first detection point, and the signal detection device is connected to the electronic device to be tested, the electrostatic generator is used to output an electrostatic signal, and the signal detection device is used to detect the signal between the first detection point and the second detection point through the first probe and the second probe. The method includes: obtaining a first voltage signal, a second voltage signal, and a third voltage signal, wherein the first voltage signal refers to the first voltage signal at the first probe. When the first detection point is connected and the second probe is connected to the second detection point, the signal between the first detection point and the second detection point is obtained. The second voltage signal refers to the signal between the first detection point and the second detection point when the first probe is connected to the second detection point and the second probe is connected to the first detection point. The third voltage signal refers to the signal between the first detection point and the second detection point when the first detection point and the second detection point are connected through an insulating device; then the first interference signal between the first detection point and the second detection point is obtained according to the first voltage signal, the second voltage signal and the third voltage signal; the first interference signal refers to the interference signal generated by the electrostatic signal between the first detection point and the second detection point. In an embodiment of the present application, the first voltage signal and the second voltage signal with different access directions can be used to correct the interference signal brought by the probe, the differential amplifier module and the sampling circuit inside the signal detection device in the signal detection device, and the interference signal introduced in the circuit loop between the first detection point and the second detection point is corrected through the insulating device, so that the signal obtained after correction can more accurately indicate the signal between the first detection point and the second detection point of the electrostatic signal, that is, to improve the accuracy of the first interference signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 It is a schematic diagram of the environment for electrostatic discharge testing;

[0048] Figure 2 This is a schematic diagram of an application scenario provided by an embodiment of the present application;

[0049] Figure 3 This is a flow chart of a method for testing interference signals provided in an embodiment of the present application;

[0050] Figure 4 is a schematic diagram of a connection state in an electrostatic discharge test provided in an embodiment of the present application;

[0051] Figure 5 is a circuit diagram of an electrostatic discharge test provided in an embodiment of the present application;

[0052] Figure 6 is a schematic diagram of another connection state in an electrostatic discharge test provided in an embodiment of the present application;

[0053] Figure 7 is a schematic diagram of another connection state in an electrostatic discharge test provided in an embodiment of the present application;

[0054] Figure 8 1 is a flow chart of another interference signal testing method provided in an embodiment of the present application;

[0055] Figure 9 This is a schematic diagram of a test device for interference signals provided by the present application;

[0056] Figure 10 This is a schematic diagram of an electronic device for testing interference signals provided by the present application. DETAILED DESCRIPTION

[0057] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings in the embodiments of the present application. In the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in this article is merely a description of the association relationship of associated objects, indicating that three relationships can exist, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of the present application, "multiple" means two or more than two.

[0058] In the following, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the technical features indicated. Therefore, a feature specified as "first," "second," or "third" may explicitly or implicitly include one or more of the features.

[0059] To facilitate understanding, some of the examples given are provided for reference to the description of concepts related to the embodiments of the present application.

[0060] 1. Electrostatic discharge test

[0061] Static electricity is a natural phenomenon that can be generated by contact, friction, and induction between electrical devices. It accumulates over long periods of time, exhibits high voltage, low charge, low current, and a short duration. Static electricity can cause serious harm in various fields, with triboelectric charging and human static electricity being two of the most serious hazards in the electronics industry, often causing unstable operation and even damage to electronic products. Therefore, electronic products are generally required to pass electrostatic discharge testing before they can be used by consumers.

[0062] Electrostatic discharge testing usually refers to placing the electronic device under test in an electrostatic discharge test environment for testing. Figure 1 The electrostatic test environment is described using the scenario shown in (a) of FIG. The electrostatic test environment includes an insulating pad 10 and a grounded metal plate 20 , wherein the metal plate 20 may be a tabletop of a metal table, and the metal plate 20 may be connected to the ground through the legs of the metal table.

[0063] It should be understood that the ground mentioned in the electrostatic discharge test refers to the reference ground, that is, the earth. Usually, for the sake of electrical safety, a large conductive device (such as a metal pole) will be buried underground at a preset distance (for example, 5 kilometers), and a cable will be led out from the conductive device as a grounding wire, that is, the grounding wire in the plug-in interface used by users for plug-in electronic products. The static electricity generated during the use of electronic products can be introduced into the earth through the grounding wire to avoid damage to electronic products caused by static electricity. The metal plate 20 is connected to the ground through the legs of the metal table, which may mean that the metal plate 20 is connected to the earth through the legs of the metal table and the grounding wire to achieve the function of introducing static electricity into the earth.

[0064] During the electrostatic discharge test, the electronic device under test 30 is placed on the insulating pad 10, which is placed on the metal plate 20. The electrostatic generator 40 is connected to the electronic device under test 30, the first detection point 301 on the electronic device under test 30 is connected to the first probe 501 of the signal detection device 50, and the second detection point 302 on the electronic device under test 30 is connected to the second probe 502 of the signal detection device 50.

[0065] The following describes the signal flow in the electrostatic discharge test.

[0066] For example, Figure 1 As shown in (b) of FIG, an electrostatic generator 40 generates an electrostatic signal that is input into the electronic device under test. This electrostatic signal is transmitted along the first detection point 301 of the electronic device under test 30 to the second detection point 302. During this transmission process, the electrostatic signal passes through the insulating pad 10 and couples to the metal plate 20. The electrostatic signal coupled to the metal plate 20 is then transmitted to the ground. The signal detection device 50 detects the signal between the first detection point 301 and the second detection point 302 through the circuit loop formed by the first probe 501, the first detection point 301, the second detection point 502, and the second probe 502.

[0067] It should be understood that the first detection point 301 and the second detection point 302 can be any two points on the electronic device 30 to be tested.

[0068] 2. Floating electronic equipment

[0069] Some electronic devices are connected to a grounding wire during use, which conducts static electricity generated during use to the ground. However, with the development of mobile devices, some electronic devices, such as mobile phones, smart wearable devices, and tablets, are not connected to a grounding wire during use. Because these electronic devices are often carried around by users, they cannot be connected to a grounding wire and cannot conduct static electricity generated during use to the ground. These electronic devices are called floating-ground electronic devices.

[0070] At present, floating electronic devices are increasingly appearing in people's lives. Since floating electronic products are not connected to the ground, the static electricity generated during use cannot be conducted to the ground, which brings safety risks to floating electronic products. Before leaving the factory, floating electronic products usually need to pass the electrostatic discharge test, and will only be released to users if the electrostatic discharge test passes. Among them, the environment used for the electrostatic discharge test of floating electronic products can be as follows: Figure 1 As shown in (a) in the figure. During the ESD test, the electrostatic generator outputs an electrostatic signal to the floating electronic product. The signal detection device captures the signal waveform on the electronic product to determine whether there is an abnormal signal. However, the probe, differential amplifier module, and sampling circuit inside the signal detection device also generate some interference signals, which are indistinguishable from the interference signals generated by the electrostatic signal on the floating electronic product. Therefore, if a fault occurs during the ESD test, it is impossible to accurately determine whether it is caused by the electrostatic signal.

[0071] In view of this, an embodiment of the present application provides a method for testing interference signals, which is applied to an electrostatic discharge (ESD) test system. The ESD test system includes an electrostatic generator, an electronic device to be tested, and a signal detection device. The electronic device to be tested includes a first detection point and a second detection point. The signal detection device includes a first probe and a second probe. The electrostatic generator is connected to the first detection point, and the signal detection device is connected to the electronic device to be tested. The electrostatic generator is used to output an electrostatic signal, and the signal detection device is used to detect the signal between the first detection point and the second detection point through the first probe and the second probe. The method includes: obtaining a first voltage signal, a second voltage signal, and a third voltage signal, wherein the first voltage signal refers to the first voltage signal. When a probe is connected to a first detection point and a second probe is connected to a second detection point, the signal between the first detection point and the second detection point, the second voltage signal refers to the signal between the first detection point and the second detection point when the first probe is connected to the second detection point and the second probe is connected to the first detection point, and the third voltage signal refers to the signal between the first detection point and the second detection point when the first detection point and the second detection point are connected through an insulating device; then, a first interference signal between the first detection point and the second detection point is obtained according to the first voltage signal, the second voltage signal and the third voltage signal; the first interference signal refers to the interference signal generated by the electrostatic signal between the first detection point and the second detection point. In an embodiment of the present application, the interference signal brought by the probe, the differential amplifier module and the sampling circuit inside the signal detection device in the signal detection device can be corrected by accessing the first voltage signal and the second voltage signal with different directions, and the interference signal introduced in the circuit loop between the first detection point and the second detection point is corrected by the insulating device, so that the signal obtained after correction can more accurately indicate the signal between the first detection point and the second detection point of the electrostatic signal, that is, the accuracy of the first interference signal is improved.

[0072] The interference signal testing method provided in the embodiment of the present application can be used to perform electrostatic discharge testing on terminal equipment. The terminal equipment can also be referred to as a terminal, user equipment (UE), mobile station (MS), mobile terminal (MT), etc. The terminal equipment can be a mobile phone, a smart TV, a wearable device, a tablet computer (Pad), a computer with wireless transceiver function, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control (industrial control), a wireless terminal in self-driving (self-driving), a wireless terminal in remote medical surgery (remote medical surgery), a wireless terminal in smart grid (smart grid), a wireless terminal in transportation safety (transportation safety), a wireless terminal in smart city (smart city), a wireless terminal in smart home (smart home), etc. The embodiments of the present application do not limit the specific technology and specific device form adopted by the terminal equipment.

[0073] The application scenarios provided by the embodiments of the present application are described below with reference to the accompanying drawings.

[0074] The interference signal testing method provided in the embodiment of the present application can be applied to Figure 2 In the environment shown in (a), there are an insulating pad 10, a grounded metal plate 20, an electronic device under test 30, an electrostatic generator 40, and a signal detection device 50. The insulating pad 10 is arranged above the grounded metal plate 20, and the electronic device under test 30 is arranged above the insulating pad 10. The electronic device under test 30 is connected to the electrostatic generator 30 and the signal detection device 50 respectively. The electrostatic generator 40 outputs an electrostatic signal to the electronic device under test 30, and the signal detection device 50 detects the signal on the electronic device under test 30.

[0075] It should be understood that the connection status between the electronic device to be tested 30 and the signal detection device 50 may include multiple connection states.

[0076] For example, a connection state between the electronic device under test 30 and the signal detection device 50 may refer to that the first probe 501 on the signal detection device 50 is connected to the first detection point 301 on the electronic device under test 30, and the second probe 502 on the signal detection device 50 is connected to the second detection point 302 on the electronic device under test 30.

[0077] The signal detection device 50 may output prompt information indicating the connection status between the electronic device under test 30 and the signal detection device 50. For example, the prompt information may indicate that the first probe 501 on the signal detection device 50 is connected to the first detection point 301 on the electronic device under test 30, and that the second probe 502 on the signal detection device 50 is connected to the second detection point 302 on the electronic device under test 30.

[0078] The interference signal testing method provided in the embodiment of the present application can be applied to Figure 2 In the environment shown in (b), there are an insulating pad 10, a grounded metal plate 20, an electronic device to be tested 30, an electrostatic generator 40, a signal detection device 50 and a computer device 60. The insulating pad 10 is arranged above the grounded metal plate 20, and the electronic device to be tested 30 is arranged above the insulating pad 10. The electronic device to be tested 30 is connected to the electrostatic generator 30 and the signal detection device 50 respectively. The signal detection device 50 is connected to the computer device 60. The electrostatic generator 40 outputs an electrostatic signal to the electronic device to be tested, and the signal detection device 50 detects the signal on the electronic device to be tested 30, and sends the test data obtained from the test to the computer device 60.

[0079] The computer device 60 may output prompt information indicating the connection status between the electronic device under test 30 and the signal detection device 50. For example, the prompt information may indicate that the first probe 501 on the signal detection device 50 is connected to the first detection point 301 on the electronic device under test 30, and that the second probe 502 on the signal detection device 50 is connected to the second detection point 302 on the electronic device under test 30.

[0080] It should be understood that the above is an example of an application scenario and does not limit the application scenario of this application.

[0081] The following combination Figures 3 to 8 The interference signal testing method provided in the embodiment of the present application is described in detail.

[0082] Figure 3 A flow chart of a method for testing interference signals provided in an embodiment of the present application is provided. The method is applied to Figure 2 (a) or Figure 2In the application environment shown in (b), the application environment refers to an ESD test system, which includes an electronic device to be tested 30, an electrostatic generator 40 and a signal detection device 50. The electronic device to be tested 30 includes a first detection point 301 and a second detection point 302. The signal detection device 50 includes a first probe 501 and a second probe 502. The electrostatic generator 40 is connected to the first detection point 301, and the signal detection device 50 is connected to the electronic device to be tested 30. The electrostatic generator 40 is used to output an electrostatic signal, and the signal detection device 50 is used to detect the signal between the first detection point 301 and the second detection point 302 through the first probe 501 and the second probe 502. Figure 3 As shown, the method includes:

[0083] S101. Acquire a first voltage signal, where the first voltage signal is a signal between a first detection point and a second detection point in a first connection state. The first connection state refers to a connection state in which a first probe is connected to the first detection point and a second probe is connected to the second detection point.

[0084] The first voltage signal is a signal between the first detection point 301 and the second detection point 302 in the first connection state. The first connection state can be as follows Figure 4 As shown in (a), it refers to the connection state in which the first probe 501 is connected to the first detection point 301 and the second probe 502 is connected to the second detection point 302.

[0085] Optionally, the signal detection device 50 may be an oscilloscope.

[0086] The probe of the oscilloscope may be a high-voltage differential probe.

[0087] Optionally, the signal detection device 50 further includes a first probe 503 and a second probe 504. The first connection state may refer to a connection state in which the first probe 501 is connected to the first detection point 301 via the first probe 503 and the second probe 502 is connected to the second detection point 302 via the second probe 504.

[0088] Among them, such as Figure 4 As shown in (b), the first probe 501 is connected to the first detection point 301 through the first probe 503, which may mean that the first probe 501 is connected to the inner core 701 of the coaxial line 70, then connected to the first probe 503 through the inner core 701 of the coaxial line 70, and then connected to the first detection point 301 through the first probe 503. The second probe 502 is connected to the second detection point 302 through the second probe 504, which may mean that the second probe 502 is connected to the outer shell 702 of the coaxial line 70, then connected to the second probe 504 through the outer shell 702 of the coaxial line 70, and then connected to the second detection point 302 through the second probe 504.

[0089] In the embodiments of the present application, when acquiring a first voltage signal, the first probe is connected to the first probe via the inner core of the coaxial line, and the second probe is connected to the second probe via the outer shell of the coaxial line. Due to the high isolation between the outer shell and the inner core of the coaxial line, the acquisition of the first voltage signal is prevented from being affected by other interference signals, thereby improving the accuracy of the first voltage signal.

[0090] The electrostatic generator 40 outputs an electrostatic signal to the electronic device to be tested 30, and the signal detection device 50 collects the signal between the first detection point 301 and the second detection point 302 through the first probe 501 and the second probe 502 to obtain a first voltage signal. It should be understood that the signal detection device 50 generally includes a probe, a probe, a differential amplifier module and an internal sampling module. When testing the electrostatic signal, these modules usually introduce differential mode interference signals and common mode interference signals. Therefore, in the first connection state, the signal detection device 50 collects the signal (first voltage signal) between the first detection point 301 and the second detection point 302 through the first probe 501 and the second probe 502. In addition to the signal between the first detection point 301 and the second detection point 302 of the input electrostatic signal, it also includes the differential mode interference signals and common mode interference signals introduced by the above-mentioned probe, probe, differential amplifier module and internal sampling module.

[0091] For example, Figure 5 As shown, between the first detection point 301 and the second detection point 302, the voltage signal caused by the electrostatic signal generated by the electrostatic generator 40 is V AB , that is, the first interference signal; between the first probe 503 and the second probe 504, the voltage signal caused by the electrostatic signal generated by the electrostatic generator 40 is V loop Between the first probe 503 and the second probe 504, the voltage signal caused by the differential mode signal of the signal detection device 50 is V ub_needle ; The test link between the first probe 501 and the second probe 502, the voltage signal caused by the differential mode signal of the signal detection device 50 is V ub_probe , before the differential amplifier, the voltage signal caused by the common mode signal of the signal detection device 50 is V comm .

[0092] Optionally, the first voltage signal can be expressed by formula (1) (equivalent to the second formula).

[0093] △V1=(V AB + V loop + V ub_needle + V ub_probe + V comm ) * a Ringing (f) Formula (1);

[0094] Among them, △V1 represents the first voltage signal, V AB Represents the first interference signal, V loop represents the interference signal generated by the circuit loop between the first probe 503 and the second probe 504 by the electrostatic signal, V ub_needle represents the differential mode interference signal between the first probe 503 and the second probe 504, V ub_probe V represents the differential mode interference signal introduced by the signal detection device 50 through the test link between the first probe 501 and the second probe 502. comm Indicates the common-mode interference signal generated by the differential amplifier module, a Ringing (f) refers to the preset correction factor.

[0095] The first interference signal may refer to an interference signal generated by an electrostatic signal between the first detection point 301 and the second detection point 302. The preset correction coefficient may refer to a coefficient obtained by simulating the interference signal introduced by the internal sampling module and used to correct the interference signal introduced by the internal sampling module.

[0096] S102: Acquire a second voltage signal, where the second voltage signal is a signal between the first detection point and the second detection point in a second connection state. The second connection state refers to a connection state in which the first probe is connected to the second detection point and the second probe is connected to the first detection point.

[0097] The second voltage signal is a signal between the first detection point 301 and the second detection point 302 in the second connection state. The second connection state can be as follows Figure 6 As shown in (a), it refers to the connection state in which the first probe 501 is connected to the second detection point 302, and the second probe 502 is connected to the first detection point 301.

[0098] Optionally, the second connection state may refer to a connection state in which the first probe 501 is connected to the first detection point 301 through the second probe 504 , and the second probe 502 is connected to the second detection point 302 through the first probe 503 .

[0099] Among them, such as Figure 6As shown in (b), the first probe 501 is connected to the first detection point 301 through the second probe 504, which may mean that the first probe 501 is connected to the inner core 701 of the coaxial line 70, then connected to the second probe 504 through the inner core 701 of the coaxial line 70, and then connected to the first detection point 301 through the second probe 504. The second probe 502 is connected to the second detection point 302 through the first probe 503, which may mean that the second probe 502 is connected to the outer shell 702 of the coaxial line 70, then connected to the first probe 503 through the outer shell 702 of the coaxial line 70, and then connected to the second detection point 302 through the first probe 503.

[0100] In the embodiments of the present application, when acquiring the second voltage signal, the first probe is connected to the second probe via the outer shell of the coaxial line, and the second probe is connected to the first probe via the inner core of the coaxial line. Due to the high isolation between the outer shell and the inner core of the coaxial line, the acquisition of the second voltage signal is prevented from being affected by other interference signals, thereby improving the accuracy of the second voltage signal.

[0101] Similar to the description in S101 above, in the second connection state, the electrostatic generator 40 collects the signal (first voltage signal) between the first detection point 301 and the second detection point 302 through the first probe 501 and the second probe 502. In addition to the input electrostatic signal between the first detection point 301 and the second detection point 302, it also includes the differential mode interference signal and common mode interference signal introduced by the above-mentioned probe, differential amplifier module and internal sampling module.

[0102] Optionally, the second voltage signal can be expressed by formula (2) (third formula).

[0103] △V2=[(-V AB )+ (-V loop ) + (-V ub_needle ) + V ub_probe + V comm ] * a Ringing (f) Formula (2);

[0104] Among them, △V2 represents the second voltage signal, V AB Represents the first interference signal, V loop represents the interference signal generated by the circuit loop between the first probe 503 and the second probe 504 by the electrostatic signal, V ub_needle represents the differential mode interference signal between the first probe 503 and the second probe 504, V ub_probe V represents the differential mode interference signal introduced by the signal detection device through the test link between the first probe 501 and the second probe 502. comm Indicates the common-mode interference signal generated by the differential amplifier module, aRinging (f) refers to the preset correction factor.

[0105] It should be understood that the first voltage signal is the signal between the first detection point 301 and the second detection point 302 in the first connection state, and the second voltage signal is the signal between the first detection point 301 and the second detection point 302 in the second connection state. Compared with the first connection state and the second connection state, the signal between the first probe 503 and the second probe 504 is reversed, while other signals in the loop are in the same direction. In other words, compared with the second voltage signal, the first interference signal, the interference signal generated by the electrostatic signal in the circuit loop between the first probe 503 and the second probe 504, and the differential-mode interference signal between the first probe 503 and the second probe 504 are in opposite directions, while the differential-mode interference signal introduced through the test link between the first probe 501 and the second probe 502 and the common-mode interference signal generated by the differential amplifier module are in the same direction.

[0106] S103: Acquire a third voltage signal, where the third voltage signal is a signal between the first detection point and the second detection point in a third connection state. The third connection state refers to a connection state in which the first detection point and the second detection point are connected via an insulating device.

[0107] The third voltage signal is a signal between the first detection point 301 and the second detection point 302 in the third connection state. The third connection state refers to a connection state in which the insulation device 303 is provided between the first detection point 301 and the second detection point 302.

[0108] The insulating device 303 may be an insulating pad made of insulating material.

[0109] It should be understood that in the third connection state, the first probe 501 can be connected to the first detection point 301, and the second probe 502 can be connected to the second detection point 302; or the first probe 501 can be connected to the second detection point 302, and the second probe 502 can be connected to the first detection point 301; this embodiment of the present application does not limit this.

[0110] For example, the third connection state can be as follows: Figure 7As shown in (a), the first probe 501 is connected to the first detection point 301 via the first probe 503, which may mean that the first probe 501 is connected to the inner core 701 of the coaxial line 70, then connected to the first probe 503 via the inner core 701 of the coaxial line 70, and then connected to the first detection point 301 via the first probe 503. The second probe 502 is connected to the second detection point 302 via the second probe 504, which may mean that the second probe 502 is connected to the outer shell 702 of the coaxial line 70, then connected to the second probe 504 via the outer shell 702 of the coaxial line 70, and then connected to the second detection point 302 via the second probe 504. At the same time, the first detection point 301 and the second detection point 302 are connected via the insulating device 303.

[0111] For example, the third connection state can be as follows: Figure 7 As shown in (b), the first probe 501 is connected to the first detection point 301 through the second probe 504. This may mean that the first probe 501 is connected to the inner core 701 of the coaxial line 70, then connected to the second probe 504 through the inner core 701 of the coaxial line 70, and then connected to the first detection point 301 through the second probe 504. The second probe 502 is connected to the second detection point 302 through the first probe 503. This may mean that the second probe 502 is connected to the outer shell 702 of the coaxial line 70, then connected to the first probe 503 through the outer shell 702 of the coaxial line 70, and then connected to the second detection point 302 through the first probe 503. At the same time, the first detection point 301 and the second detection point 302 are connected by the insulating device 303.

[0112] It should be understood that because the insulating device 302 is provided between the first detection point 301 and the second detection point 302, when the signal detection device 50 detects the third voltage signal between the first detection point 301 and the second detection point 302, it does not introduce the differential mode interference signal introduced by the signal detection device through the test link between the first probe 501 and the second probe 502, nor the common mode interference signal generated by the differential amplifier module. The third voltage signal can be expressed by formula (3) (equivalent to the fourth formula).

[0113] V2 = (V loop + V ub_needle ) * a Ringing (f) Formula (3);

[0114] Wherein, V2 represents the third voltage signal, V loop represents the interference signal generated by the circuit loop between the first probe 503 and the second probe 504 by the electrostatic signal, V ub_needle represents the differential mode interference signal between the first probe 503 and the second probe 504, a Ringing (f) refers to the preset correction factor.

[0115] S104 : Correct the second interference signal according to the first voltage signal and the second voltage signal to obtain a fourth voltage signal.

[0116] Among them, the second interference signal refers to the interference signal generated by the signal detection device 50 on the test link.

[0117] Exemplarily, the second interference signal includes a differential mode interference signal introduced by the signal detection device 50 through the test link between the first probe 501 and the second probe 502 , and a common mode interference signal generated by the differential amplification module.

[0118] In one possible case, a difference is calculated between the first voltage signal and the second voltage signal to obtain a fourth voltage signal.

[0119] Optionally, the fourth voltage signal can be expressed by formula (4) (first formula). The fourth formula includes:

[0120] V1 = △V1 - △V2 = (V AB + V loop + V ub_needle ) * a Ringing (f) Formula (4);

[0121] Wherein, V1 represents the fourth voltage signal, ΔV1 represents the first voltage signal, ΔV2 represents the second voltage signal, V AB Represents the first interference signal, V loop represents the interference signal generated by the circuit loop between the first probe 503 and the second probe 504 by the electrostatic signal, V ub_needle represents the differential mode interference signal between the first probe 503 and the second probe 504, a Ringing (f) refers to the preset correction factor.

[0122] In an embodiment of the present application, in the process of obtaining the first interference signal, the second interference signal can be first corrected according to the first voltage signal and the second voltage signal to obtain a fourth voltage signal, wherein the second interference signal includes a differential-mode interference signal introduced by the signal detection device through the test link between the first probe and the second probe, and a common-mode interference signal generated by the differential amplifier module. In this way, the first interference signal finally obtained is obtained after correcting the differential-mode interference signal introduced by the signal detection device through the test link between the first probe and the second probe, and the signal obtained after correction can more accurately indicate the signal of the electrostatic signal between the first detection point and the second detection point, that is, the accuracy of the first interference signal is improved.

[0123] S105 . Obtain a first interference signal according to the third voltage signal and the fourth voltage signal.

[0124] Among them, obtaining the first interference signal according to the third voltage signal and the fourth voltage signal may refer to correcting the interference signal generated by the circuit loop of the electrostatic signal between the first probe and the second probe and the differential mode interference signal between the first probe and the second probe based on the difference between the third voltage signal and the fourth voltage signal to obtain the first interference signal.

[0125] It should be understood that the third voltage signal can be expressed by formula (3), and the fourth voltage signal can be expressed by formula (4). The difference between the third voltage signal and the fourth voltage signal can be expressed as shown in formula (5):

[0126] V2-V1=(V AB + V loop + V ub_needle ) * a Ringing (f) -(V loop + V ub_needle ) * a Ringing (f) = V AB * a Ringing (f) Formula (5);

[0127] Wherein, V1 represents the fourth voltage signal, V2 represents the third voltage signal, V AB Represents the first interference signal, V loop represents the interference signal generated by the circuit loop between the first probe 503 and the second probe 504 by the electrostatic signal, V ub_needle represents the differential mode interference signal between the first probe 503 and the second probe 504, a Ringing (f) refers to the preset correction factor.

[0128] It should be understood that due to a Ringing (f) refers to the coefficient obtained by simulating the interference signal introduced by the internal sampling module and used to correct the interference signal introduced by the internal sampling module. Therefore, by looking up the preset correction coefficient a Ringing (f) After that, the difference value V is obtained by performing a subtraction on the third voltage signal and the fourth voltage signal. AB *a Ringing (f) Divide the difference between the third voltage signal and the fourth voltage signal by the preset correction coefficient a. Ringing (f) Obtain the first interference signal V AB .

[0129] The interference signal testing method provided in the embodiments of the present application is applied to an electrostatic discharge (ESD) testing system, wherein the ESD testing system includes an electrostatic generator, an electronic device to be tested, and a signal detection device, wherein the electronic device to be tested includes a first detection point and a second detection point, and the signal detection device includes a first probe and a second probe; the electrostatic generator is connected to the first detection point for outputting an electrostatic signal, and the signal detection device is connected to the electronic device to be tested for detecting a signal between the first detection point and the second detection point through the first probe and the second probe, including: obtaining a first voltage signal, a second voltage signal, and a third voltage signal, wherein the first voltage signal refers to a signal between the first detection point and the second detection point when the first probe is connected to the first detection point and the second probe is connected to the second detection point, and the second voltage signal refers to a signal between the first detection point and the second detection point when the first probe is connected to the first detection point and the second probe is connected to the second detection point The second detection point is connected, and the second probe is connected to the first detection point. The signal between the first detection point and the second detection point is the third voltage signal. The signal between the first detection point and the second detection point is the third voltage signal. The second interference signal is then corrected according to the first voltage signal and the second voltage signal to obtain a fourth voltage signal, wherein the second interference signal includes a differential mode interference signal introduced by the signal detection device through the test link between the first probe and the second probe, and a common mode interference signal generated by the differential amplifier module. Based on the difference between the third voltage signal and the fourth voltage signal pair, the interference signal generated by the circuit loop between the first probe and the second probe by the electrostatic signal and the differential mode interference signal between the first probe and the second probe are corrected to obtain the first interference signal. In this way, the obtained first interference signal is obtained by correcting the interference signal brought by the probe, the differential amplifier module and the sampling circuit inside the signal detection device in the signal detection device through the first voltage signal and the second voltage signal with different access directions, and correcting the interference signal introduced in the circuit loop between the first detection point and the second detection point through the insulation device, thereby improving the accuracy of the obtained first interference signal.

[0130] Figure 8 A flow chart of a method for testing interference signals provided in an embodiment of the present application is shown as follows: Figure 8 As shown, the method includes:

[0131] S201. Acquire a first voltage signal, where the first voltage signal is a signal between a first detection point and a second detection point in a first connection state. The first connection state refers to a connection state in which a first probe is connected to the first detection point and a second probe is connected to the second detection point.

[0132] S202: Acquire a second voltage signal, where the second voltage signal is a signal between the first detection point and the second detection point in a second connection state. The second connection state refers to a connection state in which the first probe is connected to the second detection point and the second probe is connected to the first detection point.

[0133] S203: Acquire a third voltage signal, where the third voltage signal is a signal between the first detection point and the second detection point in a third connection state. The third connection state refers to a connection state in which the first detection point and the second detection point are connected via an insulating device.

[0134] S204 , obtaining a first interference signal according to the first voltage signal, the second voltage signal, and the third voltage signal; the first interference signal refers to an interference signal generated by the electrostatic signal between the first detection point and the second detection point.

[0135] The interference signal testing method provided in the embodiment of the present application is applied to an electrostatic discharge (ESD) testing system, wherein the ESD testing system includes an electrostatic generator, an electronic device to be tested, and a signal detection device, wherein the electronic device to be tested includes a first detection point and a second detection point, and the signal detection device includes a first probe and a second probe; the electrostatic generator is connected to the first detection point, and the signal detection device is connected to the electronic device to be tested, the electrostatic generator is used to output an electrostatic signal, and the signal detection device is used to detect the signal between the first detection point and the second detection point through the first probe and the second probe. The method includes: obtaining a first voltage signal, a second voltage signal, and a third voltage signal, wherein the first voltage signal refers to the first voltage signal at the first probe. When the first detection point is connected and the second probe is connected to the second detection point, the signal between the first detection point and the second detection point is obtained. The second voltage signal refers to the signal between the first detection point and the second detection point when the first probe is connected to the second detection point and the second probe is connected to the first detection point. The third voltage signal refers to the signal between the first detection point and the second detection point when the first detection point and the second detection point are connected through an insulating device; then the first interference signal between the first detection point and the second detection point is obtained according to the first voltage signal, the second voltage signal and the third voltage signal; the first interference signal refers to the interference signal generated by the electrostatic signal between the first detection point and the second detection point. In an embodiment of the present application, the first voltage signal and the second voltage signal with different access directions can be used to correct the interference signal brought by the probe, the differential amplifier module and the sampling circuit inside the signal detection device in the signal detection device, and the interference signal introduced in the circuit loop between the first detection point and the second detection point is corrected through the insulating device, so that the signal obtained after correction can more accurately indicate the signal between the first detection point and the second detection point of the electrostatic signal, that is, to improve the accuracy of the first interference signal.

[0136] It should be understood that, although the various steps in the flow chart in the above-described embodiment are shown in sequence according to the indication of the arrows, these steps are not necessarily performed in sequence according to the order indicated by the arrows. Unless clearly stated herein, the execution of these steps does not have strict order restrictions, and these steps can be performed in other orders. Moreover, at least a portion of the steps in the flow chart may include a plurality of sub-steps or a plurality of stages, and these sub-steps or stages are not necessarily performed at the same time, but can be performed at different times, and the execution order of these sub-steps or stages is not necessarily performed in sequence, but can be performed in turn or alternately with at least a portion of other steps or sub-steps or stages of other steps.

[0137] It is understandable that in order to implement the above functions, the electronic device includes hardware and / or software modules corresponding to the execution of each function. In combination with the algorithm steps of each example described in the embodiments disclosed herein, the present application can be implemented in the form of hardware or a combination of hardware and computer software. Whether a function is executed in the form of hardware or computer software driving hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application in combination with the embodiments, but such implementation should not be considered to be beyond the scope of this application.

[0138] The embodiment of the present application can divide the functional modules of the electronic device according to the above method example. For example, each functional module can be divided according to each function, or two or more functions can be integrated into one module. It should be noted that the division of modules in the embodiment of the present application is schematic and is only a logical function division. There may be other division methods in actual implementation. It should be noted that the names of the modules in the embodiment of the present application are schematic and are not limited to the names of the modules in actual implementation.

[0139] Figure 9 A schematic structural diagram of a device for testing interference signals provided in an embodiment of the present application.

[0140] It should be understood that the interference signal testing device 600 can perform Figures 3 to 8The test method for interference signals shown in the figure; the test device 600 for interference signals is applied to an electrostatic discharge (ESD) test system, the ESD test system includes an electrostatic generator, an electronic device to be tested, and a signal detection device, the electronic device to be tested includes a first detection point and a second detection point, the signal detection device includes a first probe and a second probe, the electrostatic generator is connected to the first detection point, the signal detection device is connected to the electronic device to be tested, the electrostatic generator is used to output an electrostatic signal, and the signal detection device is used to detect the signal between the first detection point and the second detection point through the first probe and the second probe. The test device 600 for interference signals includes: an acquisition unit 610 and a processing unit 620.

[0141] The acquisition unit 610 is configured to acquire a first voltage signal, where the first voltage signal is a signal between a first detection point and a second detection point in a first connection state. The first connection state refers to a connection state in which the first probe is connected to the first detection point and the second probe is connected to the second detection point.

[0142] The acquisition unit 610 is configured to acquire a second voltage signal, where the second voltage signal is a signal between the first detection point and the second detection point in a second connection state, where the second connection state refers to a connection state where the first probe is connected to the second detection point and the second probe is connected to the first detection point.

[0143] The acquisition unit 610 is configured to acquire a third voltage signal, where the third voltage signal is a signal between the first detection point and the second detection point in a third connection state, where the third connection state refers to a connection state where the first detection point and the second detection point are connected via an insulating device.

[0144] The processing unit 620 is configured to obtain a first interference signal according to the first voltage signal, the second voltage signal, and the third voltage signal; the first interference signal refers to an interference signal generated by an electrostatic signal between the first detection point and the second detection point.

[0145] In one embodiment, the processing unit 620 is specifically used to correct the second interference signal according to the first voltage signal and the second voltage signal to obtain a fourth voltage signal, where the second interference signal refers to the interference signal generated by the signal detection device on the test link; and obtain the first interference signal according to the third voltage signal and the fourth voltage signal.

[0146] In one embodiment, the signal detection device further includes a differential amplifier module, a first probe and a second probe, the second interference signal includes a differential mode interference signal introduced by the signal detection device through the test link between the first probe and the second probe, and a common mode interference signal generated by the differential amplifier module, and the processing unit 620 is specifically used to perform a difference between the first voltage signal and the second voltage signal to obtain a fourth voltage signal, and the fourth voltage signal is represented by the first formula, and the first formula includes: V1 = △V1-△V2 = (V AB+V loop +V ub_needle )*a Ringing (f); V1 represents the fourth voltage signal, △V1 represents the first voltage signal, △V2 represents the second voltage signal, V AB Represents the electrostatic interference signal, V loop V represents the interference signal generated by the circuit loop between the first probe and the second probe by the electrostatic signal. ub_needle represents the differential mode interference signal between the first probe and the second probe, a Ringing (f) refers to a preset correction coefficient; wherein the first voltage is represented by the second formula, and the second voltage signal is represented by the third formula; the second formula includes: △V1=(V AB +V loop +V ub_needle +V ub_probe +V comm )*a Ringing (f); The third formula includes: △V2=[(-V AB )+(-V loop )+(-V ub_needle )+V ub_probe +V comm ]*a Ringing (f); V ub_probe Indicates the differential mode interference signal introduced by the signal detection device through the test link between the first probe and the second probe, V comm Indicates the common-mode interference signal generated by the differential amplifier module.

[0147] In one embodiment, the processing unit 620 is specifically used to correct the interference signal generated by the circuit loop of the electrostatic signal between the first probe and the second probe, and the differential mode interference signal between the first probe and the second probe according to the third voltage signal and the fourth voltage signal to obtain the first interference signal.

[0148] In one embodiment, the processing unit 620 is specifically configured to correct the interference signal generated by the circuit loop between the first probe and the second probe and the differential mode interference signal between the first probe and the second probe of the electrostatic signal based on the difference between the third voltage signal and the fourth voltage signal to obtain a first interference signal; wherein the third voltage signal is represented by a fourth formula, and the fourth formula includes: V2=(V loop +V ub_needle )*a Ringing (f); V2 represents the third voltage signal.

[0149] In one embodiment, when acquiring the first voltage signal, the first probe is connected to the first probe pin through the inner core of the coaxial line, and the second probe is connected to the second probe pin through the outer shell of the coaxial line.

[0150] In one embodiment, when acquiring the second voltage signal, the first probe is connected to the second probe through the outer shell of the coaxial line, and the second probe is connected to the first probe through the inner core of the coaxial line.

[0151] In one embodiment, the electronic device to be tested is placed on an insulating pad, which is placed on a metal plate, and the metal plate is grounded.

[0152] In one embodiment, the signal detection device comprises an oscilloscope.

[0153] The interference signal testing device provided in this embodiment is used to execute the interference signal testing method of the above embodiment. The technical principles and technical effects are similar and will not be described in detail here.

[0154] It should be noted that the interference signal testing device 600 is implemented in the form of a functional unit. The term "unit" here can be implemented in the form of software and / or hardware, and is not specifically limited to this.

[0155] For example, a "unit" may be a software program, a hardware circuit, or a combination of the two that implements the aforementioned functionality. The hardware circuit may include an application specific integrated circuit (ASIC), an electronic circuit, a processor (e.g., a shared processor, a dedicated processor, or a group processor) and memory for executing one or more software or firmware programs, combined logic circuits, and / or other suitable components that support the described functionality.

[0156] Therefore, the units of each example described in the embodiments of this application can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0157] Figure 10 A schematic structural diagram of an electronic device provided in this application is shown. Figure 10 The dotted line in the figure indicates that the unit or module is optional. The electronic device 700 can be used to implement the interference signal testing method described in the above method embodiment.

[0158] The electronic device 700 includes one or more processors 701, which can support the electronic device 700 to implement the interference signal testing method in the method embodiment. The processor 701 can be a general-purpose processor or a special-purpose processor. For example, the processor 701 can be a central processing unit (CPU), a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other programmable logic devices, such as discrete gates, transistor logic devices, or discrete hardware components.

[0159] The processor 701 can be used to control the electronic device 700, execute software programs, and process data of the software programs. The electronic device 700 can also include a communication unit 705 to implement signal input (reception) and output (transmission).

[0160] For example, the electronic device 700 may be a chip, the communication unit 705 may be an input and / or output circuit of the chip, or the communication unit 705 may be a communication interface of the chip, and the chip may be a component of a terminal device or other electronic device.

[0161] For another example, the electronic device 700 may be a terminal device, and the communication unit 705 may be a transceiver of the terminal device, or the communication unit 705 may be a transceiver circuit of the terminal device.

[0162] The electronic device 700 may include one or more memories 702 on which a program 704 is stored. The program 704 can be executed by the processor 701 to generate instructions 703, so that the processor 701 executes the impedance matching method described in the above method embodiment according to the instructions 703.

[0163] Optionally, data may be stored in the memory 702. Optionally, the processor 701 may read data stored in the memory 702. The data may be stored at the same storage address as the program 704, or may be stored at a different storage address than the program 704.

[0164] The processor 701 and the memory 702 may be provided separately or integrated together; for example, they may be integrated on a system on chip (SOC) of a terminal device.

[0165] Exemplarily, the memory 702 can be used to store a related program 704 of the interference signal testing method provided in an embodiment of the present application, and the processor 701 can be used to call the related program 704 of the interference signal testing method stored in the memory 702 when performing an interference signal test, and execute the interference signal testing method of the embodiment of the present application; including: obtaining a first voltage signal, where the first voltage signal is a signal between the first detection point and the second detection point in a first connection state, and the first connection state refers to a connection state in which the first probe is connected to the first detection point and the second probe is connected to the second detection point; obtaining a second voltage signal, where the second voltage signal is a signal between the first detection point and the second detection point in a second connection state, and the second connection state refers to a connection state in which the first probe is connected to the second detection point and the second probe is connected to the first detection point; obtaining a third voltage signal, where the third voltage signal is a signal between the first detection point and the second detection point in a third connection state, and the third connection state refers to a connection state in which the first detection point and the second detection point are connected through an insulating device; obtaining a first interference signal according to the first voltage signal, the second voltage signal, and the third voltage signal; the first interference signal refers to an interference signal generated by the electrostatic signal between the first detection point and the second detection point.

[0166] The present application also provides a computer program product, which, when executed by the processor 701, implements the interference signal testing method described in any method embodiment of the present application.

[0167] The computer program product may be stored in the memory 702 , for example, a program 704 , which is converted into an executable target file that can be executed by the processor 701 after undergoing preprocessing, compilation, assembly, and linking.

[0168] This application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a computer, implements the interference signal testing method described in any method embodiment of this application. The computer program can be a high-level language program or an executable object program.

[0169] The computer-readable storage medium is, for example, memory 702. Memory 702 may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memory. The non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), which is used as an external cache. By way of example and not limitation, many forms of RAM are available, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), and direct rambus RAM (DR RAM).

[0170] In this application, "at least one" means one or more, and "plurality" means two or more. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can mean: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or plural.

[0171] It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0172] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0173] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0174] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative; for example, the division of the units is merely a logical function division, and there may be other division methods in actual implementation; for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection of some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0175] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0176] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0177] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A method for testing interference signals, characterized in that: Applied to an electrostatic discharge (ESD) test system, the ESD test system includes an electrostatic generator, an electronic device to be tested, and a signal detection device, the electronic device to be tested includes a first detection point and a second detection point, the signal detection device includes a first probe, a second probe, and a differential amplifier module, the electrostatic generator is connected to the first detection point, the signal detection device is connected to the electronic device to be tested, the electrostatic generator is used to output an electrostatic signal, and the signal detection device is used to detect a signal between the first detection point and the second detection point through the first probe and the second probe. The method includes: Acquire a first voltage signal, where the first voltage signal is a signal between the first detection point and the second detection point in a first connection state, where the first connection state refers to a connection state in which the first probe is connected to the first detection point and the second probe is connected to the second detection point; Acquire a second voltage signal, where the second voltage signal is a signal between the first detection point and the second detection point in a second connection state, where the second connection state refers to a connection state in which the first probe is connected to the second detection point and the second probe is connected to the first detection point; Acquire a third voltage signal, where the third voltage signal is a signal between the first detection point and the second detection point in a third connection state, where the third connection state refers to a connection state in which the first detection point and the second detection point are connected via an insulating device; A fourth voltage signal is obtained by subtracting the first voltage signal from the second voltage signal. The fourth voltage signal is expressed by a first formula, which includes: V1=△V1-△V2=(V AB +V loop +V ub_needle )*a Ringing (f); The V1 represents the fourth voltage signal, the ΔV1 represents the first voltage signal, the ΔV2 represents the second voltage signal, and the V AB Represents the electrostatic interference signal, the V loop represents the interference signal generated by the circuit loop between the first probe and the second probe by the electrostatic signal, and the V ub_needle represents the differential mode interference signal between the first probe and the second probe, the a Ringing (f) refers to the preset correction factor; The first voltage is expressed by a second formula, and the second voltage signal is expressed by a third formula; The second formula includes: △V1=(V AB +V loop +V ub_needle +V ub_probe +V comm )*a Ringing (f); The third formula includes: △V2=[(-V AB )+(-V loop )+(-V ub_needle )+V ub_probe +V comm ]*a Ringing (f); The V ub_probe represents the differential mode interference signal introduced by the signal detection device through the test link between the first probe and the second probe, the V comm represents the common-mode interference signal generated by the differential amplifier module; Correcting an interference signal generated by the electrostatic signal in a circuit loop between the first probe and the second probe and a differential mode interference signal between the first probe and the second probe based on a difference between the third voltage signal and the fourth voltage signal to obtain a first interference signal; The third voltage signal is expressed by a fourth formula, which includes: V2=(V loop +V ub_needle )*in Ringing (favorite); The V2 represents the third voltage signal.

2. The method according to claim 1, characterized in that When acquiring the first voltage signal, the first probe is connected to the first probe through the inner core of the coaxial line, and the second probe is connected to the second probe through the outer shell of the coaxial line.

3. The method according to claim 1, characterized in that When acquiring the second voltage signal, the first probe is connected to the second probe through the outer shell of the coaxial line, and the second probe is connected to the first probe through the inner core of the coaxial line.

4. The method according to any one of claims 1 to 3, characterized in that The electronic device to be tested is arranged on an insulating pad, the insulating pad is arranged on a metal plate, and the metal plate is grounded.

5. The method according to any one of claims 1 to 3, characterized in that The signal detection device includes an oscilloscope.

6. A chip, characterized in that: The method comprises a processor, wherein when the processor executes instructions, the processor performs the method according to any one of claims 1 to 5.

7. An electronic device, characterized in that: The electronic device includes a processor, which is coupled to a memory and reads instructions in the memory, and enables the electronic device to execute the method according to any one of claims 1 to 5 according to the instructions.

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