Hard coating formula, hard coating and display module

Abstract

Embodiments of the present application provide a hard coating formula, a hard coating and a display module. The hard coating formula comprises polyepisiloxane, an epoxy resin diluent, a photoinitiator, a solvent and an additive. By adding first inorganic hollow microparticles and second inorganic hollow microparticles to the hard coating formula, the hardness of the hard coating can be improved. Due to the large difference in particle size between the first inorganic hollow microparticles and the second inorganic hollow microparticles, the second inorganic hollow microparticles with smaller size can be filled into the voids of the first inorganic hollow microparticles with larger size, which is conducive to eliminating the shrinkage stress and reducing the curling amount of the hard coating. In this way, the problem of serious warping of the hard coating can be solved, and batch production can be realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a hard coating formula, a hard coating and a display module. BACKGROUND

[0002] Glass is widely used as the cover plate of smart phones, tablets and other electronic devices. However, glass has the disadvantages of being thick and heavy and being prone to breakage, making it difficult to achieve lightweight and thin display modules. In addition, glass does not have bending properties and is difficult to apply to foldable display devices. Currently, coating a high-hardness flexible coating on a transparent polymer film has become an excellent choice to replace glass cover plates.

[0003] Currently, organic-inorganic hybrid materials are mostly used to achieve high hardness and flexibility of the coating through a photocuring process. However, the current technical difficulty lies in that the hard coating material shrinks severely after curing, resulting in serious warping of the film layer. Although this phenomenon can be improved through post-curing of moisture, it is difficult to achieve mass production in a roll-to-roll process.

[0004] Therefore, it is necessary to provide a hard coating formula, a hard coating and a display module to improve this defect. SUMMARY

[0005] The embodiments of the present application provide a hard coating formula, a hard coating and a display module, which can improve the hardness of the hard coating, eliminate the shrinkage stress of the hard coating, reduce the curling amount of the hard coating, and solve the problem of serious warping of the hard coating.

[0006] The embodiments of the present application provide a hard coating formula, which comprises polyepisilane, an epoxy resin diluent, a photoinitiator, a solvent and an additive.

[0007] The hard coating formula further comprises first inorganic hollow particles and second inorganic hollow particles. The particle sizes of the first inorganic hollow particles and the second inorganic hollow particles are different. The ratio of the particle size of the first inorganic hollow particles to the particle size of the second inorganic hollow particles is greater than or equal to 5:1 and less than or equal to 20:1.

[0008] According to an embodiment of the present application, the particle size of the first inorganic hollow particles is greater than or equal to 1 micrometer and less than or equal to 10 micrometers, and the particle size of the second inorganic hollow particles is greater than or equal to 200 nanometers and less than or equal to 500 nanometers.

[0009] According to an embodiment of the present application, the material of the first inorganic hollow particles is selected from at least one of silicon oxide, zirconium oxide and calcium oxide, and the material of the second inorganic hollow particles is selected from at least one of silicon oxide, zirconium oxide and calcium oxide.

[0010] According to an embodiment of the present application, the solvent is at least one selected from the group consisting of methyl ethyl ketone, methyl propyl ketone, methyl butyl ketone, methyl isopropyl ketone, acetone, cyclohexanone, 4-methyl-2-pentanone, diethyl ether, propylene glycol methyl ether, methanol, butanol, isopropyl alcohol, isobutyl alcohol, propylene glycol methyl ether acetate, chloroform, dichloromethane, n-hexane, and toluene.

[0011] According to an embodiment of the present application, the poly silyl silsesquioxane is at least one selected from the group consisting of an acrylic poly silyl silsesquioxane, a glycidyl poly silyl silsesquioxane, and an epoxy cyclohexyl poly silyl silsesquioxane.

[0012] According to an embodiment of the present application, the epoxy resin diluent is at least one selected from the group consisting of glycidyl ethers, glycidyl esters, glycidyl amines, and alicyclic epoxy resins.

[0013] According to an embodiment of the present application, the photoinitiator is a cationic photoinitiator selected from the group consisting of diaryliodonium salts, triarylsulfonium salts, and alkylsulfonium salts.

[0014] According to an embodiment of the present application, the solvent is at least one selected from the group consisting of methyl ethyl ketone, methyl propyl ketone, methyl butyl ketone, methyl isopropyl ketone, acetone, cyclohexanone, 4-methyl-2-pentanone, diethyl ether, propylene glycol methyl ether, methanol, butanol, isopropyl alcohol, isobutyl alcohol, propylene glycol methyl ether acetate, chloroform, dichloromethane, n-hexane, and toluene.

[0015] An embodiment of the present application further provides a hard coating layer made of the hard coating formulation as described above.

[0016] An embodiment of the present application further provides a display module, which comprises:

[0017] a display panel;

[0018] an organic transparent substrate disposed on a surface of the display panel;

[0019] The hard coating layer is arranged on the surface of the organic transparent substrate away from the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 A structure diagram of a display module provided by the embodiment of the present application is shown. DETAILED DESCRIPTION

[0021] The following description of the embodiments is provided with reference to the attached drawings, which are used to illustrate specific embodiments in which the application can be practiced. The directional terms mentioned in the present application, such as [up], [down], [front], [back], [left], [right], [inward], [outward], [side] and the like, are only the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present application, not to limit the present application. In the drawings, similar structures are denoted by the same reference numerals.

[0022] The present application will be further described below in conjunction with the drawings and specific embodiments.

[0023] The embodiment of the present application provides a hard coating formula, which can improve the hardness of the hard coating layer, eliminate the shrinkage stress of the hard coating layer, reduce the curling amount of the hard coating layer, and solve the problem of serious warping of the hard coating layer.

[0024] The hard coating formula comprises polysilicic silane, epoxy resin diluent, photoinitiator, solvent, additive, first inorganic hollow microparticles and second inorganic hollow microparticles. The particle sizes of the first inorganic hollow microparticles and the second inorganic hollow microparticles are different, and the ratio of the particle size of the first inorganic hollow microparticles to the particle size of the second inorganic hollow microparticles is greater than or equal to 5:1 and less than or equal to 20:1.

[0025] Compared with the existing hard coating formula, the embodiments of the present application can increase the hardness of the hard coating by adding the first inorganic hollow microparticles and the second inorganic hollow microparticles in the hard coating formula. On this basis, since the particle sizes of the first inorganic hollow microparticles and the second inorganic hollow microparticles are different, the ratio of the particle size of the first inorganic hollow microparticles to the particle size of the second inorganic hollow microparticles is greater than or equal to 5:1 and less than or equal to 20:1, the second inorganic hollow microparticles with smaller size can be filled into the voids of the first inorganic hollow microparticles with larger size, and by using the characteristics that the first inorganic hollow microparticles and the second inorganic hollow microparticles will not shrink, the shrinkage rate of the hard coating can be reduced, which is beneficial to reducing the shrinkage stress of the hard coating film and reducing the curling amount of the hard coating. In this way, the problem of serious warping of the hard coating can be solved.

[0026] In some embodiments, the particle size of the first inorganic hollow microparticles is greater than or equal to 1 micrometer and less than or equal to 10 micrometers, and the particle size of the second inorganic hollow microparticles is greater than or equal to 200 nanometers and less than or equal to 500 nanometers. The first inorganic hollow microparticles are micrometer-level hollow microparticles, and the second inorganic hollow microparticles are nanometer-level hollow microparticles. By limiting the particle sizes of the first inorganic hollow microparticles and the second inorganic hollow microparticles within the above numerical ranges, the first inorganic hollow microparticles and the second inorganic hollow microparticles can be filled with each other, which not only helps to disperse stress and improve the warping problem of the hard coating film after film formation, but also can improve the hardness of the hard coating film after film formation.

[0027] In one of the embodiments, the particle size of the first inorganic hollow microparticles is 1 micrometer, and the particle size of the second inorganic hollow microparticles is 200 nanometers, and the ratio of the particle size of the first inorganic hollow microparticles to the particle size of the second inorganic hollow microparticles is 5:1.

[0028] In one of the embodiments, the particle size of the first inorganic hollow microparticles is 3 micrometers, and the particle size of the second inorganic hollow microparticles is 300 nanometers, and the ratio of the particle size of the first inorganic hollow microparticles to the particle size of the second inorganic hollow microparticles is 10:1.

[0029] In one of the embodiments, the particle size of the first inorganic hollow microparticles is 6 micrometers, and the particle size of the second inorganic hollow microparticles is 400 nanometers, and the ratio of the particle size of the first inorganic hollow microparticles to the particle size of the second inorganic hollow microparticles is 15:1.

[0030] In one of the embodiments, the particle size of the first inorganic hollow microparticles is 10 micrometers, and the particle size of the second inorganic hollow microparticles is 500 nanometers, and the ratio of the particle size of the first inorganic hollow microparticles to the particle size of the second inorganic hollow microparticles is 20:1.

[0031] In practical applications, due to the small particle size of the first and second hollow microparticles and the limited precision of the preparation process, the particle sizes of all microparticles in the first inorganic hollow microparticles are not exactly the same, and the particle sizes of all microparticles in the second inorganic hollow microparticles are not exactly the same. The first inorganic hollow microparticles can contain microparticles of two or more sizes, for example, the first inorganic hollow microparticles can have microparticles with diameters of 2 microns, 3 microns, 4 microns, etc., as long as the particle size is between 1 to 10 microns. The second inorganic hollow microparticles can also contain microparticles of two or more sizes, for example, the second inorganic hollow microparticles can have microparticles with diameters of 200 nanometers, 300 nanometers, 400 nanometers, etc., as long as the particle size is between 200 to 500 nanometers.

[0032] In some embodiments, the material of the first inorganic hollow microparticles is selected from at least one of silicon oxide, zirconium oxide and calcium oxide, and the material of the second inorganic hollow microparticles is selected from at least one of silicon oxide, zirconium oxide and calcium oxide.

[0033] In one of the embodiments, the material of the first inorganic hollow microparticles is zirconium oxide, and the material of the second inorganic hollow microparticles is zirconium oxide.

[0034] In one of the embodiments, the material of the first inorganic hollow microparticles is calcium oxide, and the material of the second inorganic hollow microparticles is calcium oxide.

[0035] Preferably, the material of the first inorganic hollow microparticles is silicon oxide, specifically silicon dioxide. The material of the second inorganic hollow microparticles is silicon oxide, specifically silicon dioxide, i.e., the materials of the first and second inorganic hollow microparticles are the same.

[0036] In other embodiments, the material of the first inorganic hollow microparticles is not limited to silicon oxide as in the above embodiments, but can also be zirconium oxide or calcium oxide, and the first inorganic hollow microparticles can also be a combination of at least two inorganic hollow microparticles of silicon oxide, zirconium oxide and calcium oxide. The material of the second inorganic hollow microparticles is not limited to silicon oxide as in the above embodiments, but can also be zirconium oxide or calcium oxide, or the second inorganic hollow microparticles can also be a combination of at least two inorganic hollow microparticles of silicon oxide, zirconium oxide and calcium oxide. The material of the first inorganic hollow microparticles can be the same as or different from the material of the second inorganic hollow microparticles, which is not limited here.

[0037] In some embodiments, the weight percentage of the solvent in the total weight of the hard coating formulation is 10% to 50%, the solid content of the polysilsesquioxane and the epoxy resin diluent in the hard coating formulation is 50% to 90%, the weight ratio of the polysilsesquioxane to the epoxy resin diluent is 9:1 to 1:9, the weight ratio of the photoinitiator to the solid content of the polysilsesquioxane and the epoxy resin diluent is 1% to 4%, the weight ratio of the total weight of the first and second hollow microparticles to the solid content of the polysilsesquioxane and the epoxy resin diluent is 0.1% to 3%, and the weight ratio of the additive to the solid content of the polysilsesquioxane and the epoxy resin diluent is 0.2% to 1%.

[0038] It should be noted that, by limiting the solid content of the polysilsesquioxane and the epoxy resin diluent in the hard coating formulation to 50% to 90%, the embodiments of the present application not only avoid the situation that the low viscosity of the coating liquid caused by the low solid content leads to easy flow and insufficient hardness of the coating, but also avoid the situation that the high viscosity of the coating liquid caused by the high solid content leads to difficult coating and insufficient uniformity, resulting in easy cracking after solidification.

[0039] In the embodiments of the present application, by limiting the weight ratio of the photoinitiator to the solid content of the polysilsesquioxane and the epoxy resin diluent to 1% to 4%, not only can the situation that the insufficient initial curing, long curing time and low efficiency caused by the reduction of the content of the photoinitiator be avoided, but also the situation that the film layer is still rapidly cured under low ultraviolet light irradiation due to the high content of the photoinitiator, the internal stress of the coating layer is uneven due to the too fast crosslinking rate, and the film layer is warped or wrinkled can be avoided.

[0040] Preferably, the weight ratio of the photoinitiator to the solid content of the polysilsesquioxane and the epoxy resin diluent is 1% to 2%.

[0041] In the embodiments of the present application, by limiting the weight ratio of the total weight of the first and second inorganic hollow microparticles to the solid content of the polysilsesquioxane and the epoxy resin diluent to 0.1% to 3%, on the one hand, the situation that the low particle content leads to the inability to effectively reduce warping and improve hardness can be avoided, and on the other hand, the situation that the high particle content affects the transmittance of the hard coating can be avoided.

[0042] In one of the embodiments, the solid content of the polyepisilicone and the epoxy diluent in the hard coat formulation is 50%, the weight ratio of the polyepisilicone to the epoxy diluent is 9:1, i.e. the solid content of the polyepisilicone in the hard coat formulation is 45% and the solid content of the epoxy diluent in the hard coat formulation is 5%. The weight ratio of the total weight of the first and second inorganic hollow microparticles to the solid content of the polyepisilicone and the epoxy diluent is 0.1%, the weight ratio of the photoinitiator to the solid content of the polyepisilicone and the epoxy diluent is 1%, the total weight percentage of the solvent in the hard coat formulation is 50%, and the weight ratio of the additive to the solid content of the polyepisilicone and the epoxy diluent is 0.2%.

[0043] In one of the embodiments, the solid content of the polyepisilicone and the epoxy diluent in the hard coat formulation is 85%, the weight ratio of the polyepisilicone to the epoxy diluent is 1:9, i.e. the solid content of the polyepisilicone in the hard coat formulation is 8.5% and the solid content of the epoxy diluent in the hard coat formulation is 76.5%. The total weight percentage of the first and second inorganic hollow microparticles to the total weight of the polyepisilicone and the epoxy diluent is 3%, the weight ratio of the photoinitiator to the solid content of the polyepisilicone and the epoxy diluent is 2.35%, the total weight percentage of the solvent in the hard coat formulation is 15%, and the weight ratio of the additive to the solid content of the polyepisilicone and the epoxy diluent is 0.1%.

[0044] In some embodiments, the polyepisilicone is selected from at least one of an acrylic polyepisilicone, a glycidyl polyepisilicone, and an epoxide cyclohexyl polyepisilicone.

[0045] In some embodiments, the epoxy diluent is selected from at least one of a glycidyl ether, a glycidyl ester, a glycidyl amine, and an alicyclic epoxy resin.

[0046] Specifically, the glycidyl ether can be selected from one of bisphenol A diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, bisphenol F monoglycidyl ether, and bisphenol hexafluoroacetone diglycidyl ether.

[0047] The glycidyl ester can be selected from one of phthalic acid diglycidyl ester, hexahydrophthalic acid diglycidyl ester, terephthalic acid diglycidyl ester, isophthalic acid diglycidyl ester, tetrahydrophthalic acid diglycidyl ester, methyltetrahydrophthalic acid diglycidyl ester, end methylene tetrahydrophthalic acid diglycidyl ester, and adipic acid diglycidyl ester.

[0048] The glycidyl amine can be selected from one of diaminodiphenylmethane tetraglycidyl amine (TU13nnrr), diglycidyl-p-aminophenol (TUY.AP), and tetraglycidyl-3-ESL aminomethylcyclohexane.

[0049] The alicyclic epoxy resin can be selected from one of 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexane carboxylate, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate, 2-(3,4-epoxy cyclohexyl) ethyl trimethoxysilane, 2-(3,4-epoxy cyclohexyl) ethyl triethoxysilane, and 2-(3,4-epoxy cyclohexyl) ethyl tripropoxysilane.

[0050] Preferably, the epoxy resin diluent is 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate or 2-(3,4-epoxy cyclohexyl) ethyl trimethoxysilane.

[0051] In some embodiments, the photoinitiator is selected from a cationic photoinitiator. Specifically, the cationic initiator is selected from one of diaryliodonium salts, triarylsulfonium salts, and alkylsulfonium salts.

[0052] Preferably, the photoinitiator is diaryliodonium hexafluoroantimonate salts or triarylsulfonium hexafluoroantimonate salts.

[0053] In some embodiments, the solvent is selected from at least one of methyl ethyl ketone, methyl propyl ketone, methyl butyl ketone, methyl isopropyl ketone, acetone, cyclohexanone, 4-methyl-2-pentanone, diethyl ether, propylene glycol methyl ether, methanol, butanol, isopropyl alcohol, isobutyl alcohol, propylene glycol methyl ether acetate, chloroform, dichloromethane, n-hexane, or toluene, etc.

[0054] In some embodiments, the additive is selected from at least one of a leveling agent, a photosensitizer, a defoaming agent, and a toughening agent.

[0055] According to the hard coating formula provided by the above embodiments of the present application, the embodiments of the present application further provide a hard coating and a display module, which combine Figure 1 as shown, Figure 1 The display module provided by the embodiments of the present application is shown in the structural schematic diagram, which comprises a display panel 1, an organic transparent substrate 2, and a hard coating 3. The organic transparent substrate 2 is arranged on the surface of the display panel 1, and the hard coating 3 is arranged on the surface of the organic transparent substrate 2 away from the display panel 1. The hard coating 3 is made of the hard coating formula provided by any one of the above embodiments.

[0056] The hard coating 3 has first inorganic hollow microparticles 31 and second inorganic hollow microparticles 32. The first inorganic hollow microparticles 31 and the second inorganic hollow microparticles 32 are dispersed in the hard coating 3. The thickness of the hard coating 3 is greater than the particle diameter of the first inorganic hollow microparticles 31 and the second inorganic hollow microparticles 32.

[0057] In some embodiments, the thickness of the hard coating layer 3 is greater than or equal to 10 microns and less than or equal to 60 microns.

[0058] Preferably, the thickness of the hard coating layer 3 is greater than or equal to 20 microns and less than or equal to 45 microns. At this thickness, both the hardness of the hard coating layer 3 can be ensured, and the thickness of the hard coating layer 3 can be prevented from being too large to affect the light transmittance of the display module.

[0059] In one of the embodiments, the thickness of the hard coating layer 3 is 10 microns, the particle size of the first inorganic hollow microparticles is 1 micron, and the particle size of the second inorganic hollow microparticles is 200 nanometers.

[0060] In one of the embodiments, the thickness of the hard coating layer 3 is 30 microns, the particle size of the first inorganic hollow microparticles is 6 microns, and the particle size of the second inorganic hollow microparticles is 400 nanometers.

[0061] In one of the embodiments, the thickness of the hard coating layer 3 is 60 microns, the particle size of the first inorganic hollow microparticles is 10 microns, and the particle size of the second inorganic hollow microparticles is 500 nanometers.

[0062] In some embodiments, the material of the organic transparent substrate 2 is selected from one of polycarbonate, polyimide, polyethylene, polypropylene, polyethylene terephthalate, and polymethyl methacrylate, and triacetate fiber film.

[0063] In some embodiments, the thickness of the organic transparent substrate 2 is greater than or equal to 40 microns and less than or equal to 100 microns. At this thickness, both the flexibility of the organic transparent substrate can be ensured, and the thickness of the organic transparent substrate 2 can be prevented from being too large to affect the light transmittance of the display module.

[0064] Embodiments of the present application also provide a manufacturing method of a display module, which combines the above-mentioned hard coating layer and the above-mentioned organic transparent substrate. Figure 1 As shown in the figure, the manufacturing method of the display module comprises the following steps.

[0065] Step S1: Preparation of the hard coating layer formula, polyepisilicone, epoxy resin diluent, photoinitiator, solvent, first inorganic hollow microparticles, second inorganic hollow microparticles, and additives are added into a brown reagent bottle in proportion, and stirred at a speed of 800 rpm to 2000 rpm for 6 hours at room temperature to mix uniformly.

[0066] Step S2: Clean the surface of the organic transparent substrate 2 with ethanol, and coat the material of the hard coating layer formula on the surface of the organic transparent substrate 2;

[0067] Step S3: Perform pre-baking to remove the solvent, and bake at 80°C for 30 minutes;

[0068] Step S4: UV exposure is performed with an illumination of 30-300 W and a light dose of 1000-10000 mJ to obtain the hard coating layer 3.

[0069] The embodiment of the present application has the following beneficial effects: The embodiment of the present application provides a hard coating formula, a hard coating layer and a display module. The hard coating formula comprises poly-sesquioxane silane, epoxy resin diluent, photoinitiator, solvent and additive. The first inorganic hollow microparticles and the second inorganic hollow microparticles are added in the hard coating formula to improve the hardness of the hard coating layer. Since the particle sizes of the first inorganic hollow microparticles and the second inorganic hollow microparticles are different, the ratio of the particle size of the first inorganic hollow microparticles to the particle size of the second inorganic hollow microparticles is greater than or equal to 5:1 and less than or equal to 20:1. The second inorganic hollow microparticles with smaller size can be filled into the voids of the first inorganic hollow microparticles with larger size. Since the first inorganic hollow microparticles and the second inorganic hollow microparticles do not shrink by themselves, the shrinkage rate of the hard coating layer can be reduced, which is conducive to reducing the shrinkage stress of the hard coating layer and reducing the curling amount of the hard coating layer. In this way, the problem of serious warping of the hard coating layer can be solved, so that mass production can be realized.

[0070] In summary, although the present application discloses the above preferred embodiments, the above preferred embodiments are not used to limit the present application. Those skilled in the art can make various modifications and decorations without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application is based on the scope defined by the claims.

Claims

1. A hard coating composition, characterized in that, Includes polysilsesquioxane, epoxy resin diluent, photoinitiator, solvent and additives; The hard coating composition further includes a first inorganic hollow microparticle and a second inorganic hollow microparticle. The first inorganic hollow microparticle and the second inorganic hollow microparticle have different particle sizes. The ratio of the particle size of the first inorganic hollow microparticle to the particle size of the second inorganic hollow microparticle is greater than 5:1 and less than or equal to 20:

1. The particle size of the second inorganic hollow microparticle is greater than or equal to 200 nanometers and less than or equal to 500 nanometers. The material of the first inorganic hollow microparticle is selected from at least one of silicon oxide, zirconium oxide, and calcium oxide; the material of the second inorganic hollow microparticle is selected from at least one of silicon oxide, zirconium oxide, and calcium oxide. The ratio of the total weight of the first inorganic hollow microparticles and the second inorganic hollow microparticles to the total weight of the polysilsesquioxane and the epoxy resin diluent is 0.001 to 0.03; the sum of the weight percentages of the polysilsesquioxane and the epoxy resin diluent, based on the total weight of the solvent, the polysilsesquioxane, and the epoxy resin diluent, is 50% to 90%.

2. The hard coating composition as claimed in claim 1, characterized in that, The particle size of the first inorganic hollow microparticle is greater than or equal to 1 micrometer and less than or equal to 10 micrometers.

3. The hard coating composition as claimed in claim 1, characterized in that, The solvent comprises 10% to 50% by weight of the total weight of the solvent, the polysilsesquioxane, and the epoxy resin diluent. The weight ratio of the polysilsesquioxane to the epoxy resin diluent is 9:1 to 1:9, the weight ratio of the photoinitiator to the total weight of the polysilsesquioxane and the epoxy resin diluent is 0.01 to 0.04, and the weight ratio of the additive to the total weight of the polysilsesquioxane and the epoxy resin diluent is 0.002 to 0.

01.

4. The hard coating composition according to claim 1, characterized in that, The polysilsesquioxane is selected from at least one of acrylic polysilsesquioxane, glycidyl polysilsesquioxane, and epoxycyclohexyl polysilsesquioxane.

5. The hard coating composition as claimed in claim 1, characterized in that, The epoxy resin diluent is selected from at least one of glycidyl ethers, glycidyl esters, glycidyl amines, and alicyclic epoxy resins.

6. The hard coating composition according to claim 1, characterized in that, The photoinitiator is a cationic photoinitiator, which is selected from one of diaryliodomonium salt, triarylsulfonium salt, and alkylsulfonium salt.

7. The hard coating composition according to claim 1, characterized in that, The solvent is at least one selected from methyl ethyl ketone, methyl propyl ketone, methyl butyl ketone, methyl isopropyl ketone, acetone, cyclohexanone, 4-methyl-2-pentanone, diethyl ether, propylene glycol methyl ether, methanol, butanol, isopropanol, propylene glycol methyl ether acetate, chloroform, dichloromethane, n-hexane, and toluene.

8. A hard coating, characterized in that, The hard coating is made from the hard coating composition according to any one of claims 1 to 7.

9. A display module, characterized in that, The display module includes: Display panel; An organic transparent substrate is disposed on the surface of the display panel; The hard coating as described in claim 8 is disposed on the surface of the organic transparent substrate facing away from the display panel.

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