A method for processing a composite circuit board

Abstract

The invention discloses a processing method for a composite circuit board, relates to the technical field of composite circuit board processing, and specifically comprises the following steps: step one: cutting an original copper-clad plate into plates that can be produced on a production line to form a PLC substrate; step two: drilling holes in the PLC substrate to form a required circuit pattern; step three: cleaning the drilled PLC substrate and placing it in processing equipment for electroplating; step four: cleaning and drying the electroplated PLC substrate; wherein the processing equipment described in step three comprises a base, a top outer wall of the base is fixedly provided with an electroplating tank body, and a top outer wall of the base is fixedly provided with a liquid receiving tank; when the slow-speed motor of the invention is in operation, it can drive a column to rotate, and cooperate with a plurality of side column rods to drive a plurality of C-shaped frames to turn to the electroplating tank body in sequence, thereby realizing assembly line electroplating operation, and further ensuring the efficiency of the electroplating processing of the circuit board.

Description

Technical Field

[0001] The invention relates to the technical field of composite circuit board processing, and in particular to a composite circuit board processing method. Background Art

[0002] Composite circuit board is a special PCB board (circuit board) which is composed of a variety of materials to achieve specific electrical and physical properties. Composite circuit boards are widely used in various electronic devices and systems, such as computers, mobile phones, televisions, cars, etc. The main characteristics of composite circuit boards are that their materials have good electrical insulation and thermal stability, as well as high mechanical strength and impact resistance. This enables composite circuit boards to work stably under various harsh environmental conditions, ensuring the reliability and safety of electronic equipment. During the production process, composite circuit boards need to be electroplated to enhance the solderability of the circuit board, improve the conductivity of the circuit board, and improve the wear resistance of the circuit board.

[0003] After searching, the Chinese patent document with publication number CN213638413U discloses a circuit board electroplating structure, including: a board frame and a circuit board to be electroplated, the circuit board includes a process edge, the board frame includes a substrate, an opening is formed in the middle of the substrate, both sides of the substrate are provided with a conductive layer, the board frame is fixed to the circuit board by a clip, and the conductive layer of the substrate matches the shape of the process edge of the circuit board and is in conductive contact. This patent can save the board frame, reduce the operation steps, save production costs, save the cost of manufacturing materials, save production costs, and save the cost of board frame manufacturing, while increasing production.

[0004] Based on the above search and the prior art, it is found that the current PCB board electroplating device is generally a plating tank equipped with only one electroplating station, which results in the inability to synchronize the loading and unloading operations with the electroplating operations, thereby lengthening the electroplating operation cycle; on the other hand, after electroplating, a large amount of plating liquid will adhere to the surface of the PCB board, and during the actual operation, it takes a certain amount of time to drain, which further lengthens the electroplating operation cycle, so there are limitations. Summary of the invention

[0005] The object of the present invention is to provide a method for processing a composite circuit board to solve the problems raised in the above background technology.

[0006] The technical solution of the present invention is: a method for processing a composite circuit board, which specifically comprises the following steps:

[0007] Step 1: Cut the original copper clad board into boards that can be made on the production line to form a PLC substrate;

[0008] Step 2: Drill holes on the PLC substrate to form the required circuit pattern;

[0009] Step 3: Clean the drilled PLC substrate and place it in the processing equipment for electroplating;

[0010] Step 4: Clean and dry the electroplated PLC substrate;

[0011] The processing equipment described in step three includes a base, a plating tank body is fixedly installed on the top outer wall of the base, a liquid receiving tank is fixedly installed on the top outer wall of the base, and the liquid receiving tank and the plating tank body are arranged adjacent to each other, a feeding mechanism is arranged above the base, and the feeding mechanism includes a retarding motor fixedly installed on the top outer wall of the base, and the output shaft of the retarding motor is fixedly connected to a column, a plurality of horizontally arranged side column rods are fixedly installed on one end of the outer peripheral wall of the column close to the top, reinforcing ribs are fixedly installed between the two sides of each side column rod and the outer peripheral wall of the column, and a C-shaped frame is fixedly installed on the end of each side column rod, a reciprocating screw is rotatably installed on each C-shaped frame, and a moving unit is installed on the reciprocating screw, a draining assembly is installed on the liquid receiving tank, and a transmission mechanism is commonly arranged on the inner sides of the plurality of reciprocating screws;

[0012] The transmission mechanism includes a support ring frame fixedly mounted on the top outer wall of the base, and the support ring frame is coaxially arranged with the column, a support ring plate is fixedly mounted on the top of the support ring frame, an incomplete toothed ring is fixedly mounted on the top outer wall of the support ring plate, and evenly distributed convex teeth are arranged on the side of the outer peripheral wall of the incomplete toothed ring close to the electroplating tank body;

[0013] A driven gear matched with the incomplete gear ring is fixedly mounted on the bottom end of each reciprocating screw;

[0014] Each of the mobile units comprises a reciprocating sleeve adapted to be mounted on the reciprocating screw, and a slider is fixedly connected to one side of the outer peripheral wall of the reciprocating sleeve, and a limiting sliding groove slidably matched with the slider is provided on one side of each of the C-shaped frames;

[0015] A horizontally arranged side rod is fixedly installed on the side of the outer peripheral wall of the reciprocating shaft sleeve away from the slider, and a pair of guide columns are fixedly installed on the bottom outer wall of each side rod, a material loading net box is arranged below the pair of guide columns, and a horizontal plate is fixedly installed on the top of the material loading net box;

[0016] A pair of connecting tubes are fixedly installed on the top outer wall of the horizontal plate, and the connecting tubes are slidably matched with the guide column. A connecting spring is fixedly installed between the top of the connecting tube and the bottom side of the side rod, and the connecting spring is sleeved on the outer side of the guide column.

[0017] Preferably, a guide oblique block is fixedly installed on the inner bottom of the liquid receiving tank, and the higher end of the guide oblique block is arranged adjacent to the electroplating tank body, and a drain valve pipe is fixedly connected to the lower end of the liquid receiving tank near the guide oblique block;

[0018] The drain assembly comprises two mounting blocks fixedly mounted on the liquid receiving tank, and a shaft is mounted between the two mounting blocks for common rotation, and a cam is fixedly mounted on one end of the outer peripheral wall of the shaft;

[0019] A drive motor is fixedly mounted between one side of one of the mounting blocks and the liquid receiving tank, and an output shaft of the drive motor is fixedly connected to the shaft rod via a coupling;

[0020] When the C-frame rotates to the position of the electroplating tank, the driven gear at the bottom of the reciprocating screw can mesh with the convex teeth of the incomplete gear ring, so that when the C-frame performs circular motion, the reciprocating shaft sleeve can first move vertically downward and then move vertically upward under the limiting action of the slider and the limiting slide groove. This process can make the loading mesh box automatically immersed in the electroplating liquid to complete the electroplating treatment of the PCB substrate; and after the electroplating is completed, the loading mesh box can automatically rise and detach from the electroplating tank, start the drive motor, use the drive motor to drive the shaft to rotate, and use it to drive the cam to rotate, thereby realizing a fixed frequency resistance to the bottom of the loading mesh box, and cooperate with the set connecting spring to ensure the drainage effect of the PCB board.

[0021] Preferably, an end tube is fixedly mounted on the top outer wall of the base, and the end tube is coaxially arranged with the column, and an annular plate is fixedly mounted on one end of the outer peripheral wall of the column close to the opening of the end tube, and the annular plate is rotatably connected to the end tube.

[0022] The present invention provides a processing method for a composite circuit board by improving the present invention, which has the following improvements and advantages compared with the prior art:

[0023] First, when the slow-speed motor of the present invention is running, it can drive the column to rotate, and the multiple side column rods provided can drive multiple C-shaped frames to turn to the electroplating tank in sequence, thereby realizing the assembly line electroplating operation, thereby ensuring the efficiency of the electroplating processing of the circuit board;

[0024] Second, when the C-shaped frame of the present invention rotates to the position of the electroplating tank, the driven gear at the bottom of the reciprocating screw can mesh with the convex teeth of the incomplete gear ring, so that when the C-shaped frame performs a circular motion, the reciprocating shaft sleeve can first move vertically downward and then move vertically upward under the limiting action of the slider and the limiting slide groove. This process can just enable the material loading net box to automatically immerse in the electroplating solution to complete the electroplating treatment of the PCB substrate; and after the electroplating is completed, the material loading net box can automatically rise and detach from the electroplating tank, thereby greatly improving the electroplating processing efficiency of the PCB substrate;

[0025] Thirdly, when the corresponding loading mesh box of the present invention is undergoing electroplating operation, the previous loading mesh box will move to the top of the draining assembly. At this time, the drive motor can be started to drive the shaft to rotate, and the cam is driven to rotate, thereby achieving a fixed frequency resistance to the bottom of the loading mesh box. In combination with the provided connecting spring, the draining effect of the PCB board can be effectively guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 It is a schematic diagram of the process principle of the present invention;

[0028] Figure 2 It is a schematic diagram of the overall first-view stereoscopic structure of the present invention;

[0029] Figure 3 It is a schematic diagram of the overall second viewing angle stereoscopic structure of the present invention;

[0030] Figure 4 It is a schematic diagram of a half-section structure of the present invention;

[0031] Figure 5 For the present invention Figure 4 The enlarged structural diagram at A in the middle;

[0032] Figure 6 It is a schematic diagram of the three-dimensional structure of the guide oblique block of the present invention;

[0033] Figure 7 It is a schematic diagram of the three-dimensional structure of the shaft rod and the cam of the present invention.

[0034] Reference numerals:

[0035] 1. Base; 2. Electroplating tank body; 3. Liquid receiving tank; 301. Drain valve pipe; 4. Diversion bevel block; 5. End tube; 6. Column; 601. Ring plate; 602. Slow-speed motor; 7. Side column rod; 701. Reinforcement rib; 8. C-frame; 801. Limit slide; 9. Reciprocating screw; 901. Reciprocating sleeve; 902. Sliding block; 903. Side rod; 904. Driven gear; 10. Loading net box; 11. Support ring frame; 12. Guide column; 13. Connecting spring; 14. Connecting tube; 15. Cross plate; 16. Support ring plate; 17. Incomplete gear ring; 18. Driving motor; 19. Shaft rod; 20. Cam; 21. Mounting block. DETAILED DESCRIPTION

[0036] The present invention is described in detail below, and the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] The present invention provides a method for processing a composite circuit board by improvement. The technical solution of the present invention is:

[0038] like Figures 1 to 7 As shown, an embodiment of the present invention provides a method for processing a composite circuit board, which specifically includes the following steps:

[0039] Step 1: Cut the original copper clad board into boards that can be made on the production line to form a PLC substrate;

[0040] Step 2: Drill holes on the PLC substrate to form the required circuit pattern;

[0041] Step 3: Clean the drilled PLC substrate and place it in the processing equipment for electroplating;

[0042] Step 4: Clean and dry the electroplated PLC substrate;

[0043] The processing equipment of step three includes a base 1, a plating tank body 2 is fixedly installed on the top outer wall of the base 1, a liquid receiving tank 3 is fixedly installed on the top outer wall of the base 1, and the liquid receiving tank 3 and the plating tank body 2 are arranged adjacent to each other, a feeding mechanism is arranged above the base 1, and the feeding mechanism includes a retarding motor 602 fixedly installed on the top outer wall of the base 1, and the output shaft of the retarding motor 602 is fixedly connected to a column 6, and a plurality of horizontally arranged side column rods 7 are fixedly installed on one end of the outer peripheral wall of the column 6 near the top; in order to ensure the structural firmness of the plurality of side column rods 7, both sides of each side column rod 7 are connected to Reinforcing ribs 701 are fixedly installed between the outer peripheral walls of the columns 6, and a C-frame 8 is fixedly installed at the end of each side column rod 7, a reciprocating screw 9 is rotatably installed on each C-frame 8, and a moving unit is installed on the reciprocating screw 9, a draining component is installed on the liquid receiving tank 3, and a transmission mechanism is commonly provided on the inner side of multiple reciprocating screws 9; the transmission mechanism is used to drive the moving unit to move up and down when the column 6 drives the multiple C-frames 8 to rotate, so that the subsequent PCB substrate is fully in contact with the plating liquid in the plating tank body 2, thereby ensuring the electroplating effect of the PCB substrate.

[0044] As a further solution of the present invention, the transmission mechanism includes a support ring frame 11 fixedly mounted on the top outer wall of the base 1, and the support ring frame 11 is coaxially arranged with the column 6, a support ring plate 16 is fixedly mounted on the top of the support ring frame 11, an incomplete toothed ring 17 is fixedly mounted on the top outer wall of the support ring plate 16, and evenly distributed convex teeth are arranged on the outer peripheral wall of the incomplete toothed ring 17 close to the electroplating tank body 2.

[0045] Furthermore, a driven gear 904 adapted to the incomplete gear ring 17 is fixedly mounted on the bottom end of each reciprocating screw 9 .

[0046] Specifically, when the retarder motor 602 is running, it can drive the column 6 to rotate, and the multiple side column rods 7 provided can drive the multiple C-shaped frames 8 to turn to the electroplating tank 2 in turn, thereby realizing the assembly line electroplating operation, thereby ensuring the efficiency of the circuit board electroplating processing.

[0047] As a further solution of the present invention, each mobile unit includes a reciprocating sleeve 901 adapted to be installed on the reciprocating screw 9, and a slider 902 is fixedly connected to one side of the outer wall of the reciprocating sleeve 901, and a limiting groove 801 that slides with the slider 902 is provided on one side of each C-frame 8.

[0048] Furthermore, a horizontally arranged side rod 903 is fixedly installed on the side of the outer wall of the reciprocating sleeve 901 away from the slider 902, and a pair of guide columns 12 is fixedly installed on the bottom outer wall of each side rod 903, a loading mesh box 10 is arranged below the pair of guide columns 12, and a cross plate 15 is fixedly installed on the top of the loading mesh box 10; wherein, a hanger for clamping the PCB board can be arranged inside the loading mesh box 10, thereby assisting the smooth progress of the electroplating operation.

[0049] Through the above structure, when the C-frame 8 rotates to the position of the electroplating tank body 2, the driven gear 904 at the bottom of the reciprocating screw 9 can mesh with the convex teeth of the incomplete gear ring 17, so that when the C-frame 8 performs a circular motion, the reciprocating shaft sleeve 901 can first move vertically downward and then move vertically upward under the limiting action of the slider 902 and the limiting slide groove 801. This process can better enable the loading mesh box 10 to automatically immerse in the electroplating solution to complete the electroplating treatment of the PCB substrate; and after the electroplating is completed, the loading mesh box 10 can automatically rise and detach from the electroplating tank body 2, thereby greatly improving the electroplating processing efficiency of the PCB substrate.

[0050] Furthermore, a pair of connecting tubes 14 are fixedly installed on the top outer wall of the horizontal plate 15, and the connecting tubes 14 are slidably matched with the guide column 12, and a connecting spring 13 is fixedly installed between the top of the connecting tube 14 and the bottom side of the side rod 903, and the connecting spring 13 is sleeved on the outside of the guide column 12; through the above structure, using the set connecting spring 13, when the loading mesh box 10 is moving, it can produce a shaking effect due to the impact with the plating liquid, thereby further improving the contact degree between the PCB substrate and the plating liquid, so as to achieve the purpose of improving the plating effect.

[0051] Furthermore, a guide bevel 4 is fixedly installed on the inner bottom of the liquid receiving tank 3, and the higher end of the guide bevel 4 is arranged adjacent to the electroplating tank body 2, and the lower end of the liquid receiving tank 3 close to the guide bevel 4 is fixedly connected to a drain valve tube 301; the set liquid receiving tank 3 can effectively receive the excess electroplating liquid carried during the subsequent PCB substrate draining process, and at the same time, the set guide bevel 4 can ensure that the collected electroplating liquid flows centrally to the drain valve tube 301, and when the drain valve tube 301 is opened subsequently, the electroplating liquid can be collected centrally.

[0052] Furthermore, an end tube 5 is fixedly mounted on the top outer wall of the base 1, and the end tube 5 is coaxially arranged with the column 6, an annular plate 601 is fixedly mounted on one end of the outer peripheral wall of the column 6 close to the opening of the end tube 5, and the annular plate 601 is rotatably connected to the end tube 5; through this arrangement, the end tube 5 and the annular plate 601 cooperate with each other, which can provide good support for the column 6, thereby helping to ensure the stability of the device during operation.

[0053] As a further solution of the present invention, the draining assembly includes two mounting blocks 21 fixedly mounted on the liquid receiving trough 3, and a shaft 19 is rotatably mounted between the two mounting blocks 21, a cam 20 is fixedly mounted on one end of the outer peripheral wall of the shaft 19, a driving motor 18 is fixedly mounted between one side of one of the mounting blocks 21 and the liquid receiving trough 3, and the output shaft of the driving motor 18 is fixedly connected to the shaft 19 via a coupling.

[0054] Through the above structure, as shown in the attached manual Figure 3 As shown, when the corresponding loading mesh box 10 is undergoing electroplating operation, the previous loading mesh box 10 will move to the top of the draining component. At this time, the drive motor 18 can be controlled to start, and the drive motor 18 can be used to drive the shaft 19 to rotate, and the cam 20 can be driven to rotate, thereby achieving a fixed frequency resistance to the bottom of the loading mesh box 10. In conjunction with the provided connecting spring 13, the draining effect of the PCB board can be effectively guaranteed.

[0055] The specific working method is as follows: when in use, the PCB substrate to be electroplated is placed in the loading net box 10, and after completion, the slow-speed motor 602 is controlled to start running, driving the column 6 to rotate, and cooperating with the multiple side column rods 7, driving the multiple C-frames 8 to turn to the electroplating tank 2 in turn, thereby realizing the assembly line electroplating operation, thereby ensuring the efficiency of the circuit board electroplating processing; when the C-frame 8 rotates to the position of the electroplating tank 2, the driven gear 904 at the bottom of the reciprocating screw 9 is meshed with the convex teeth of the incomplete gear ring 17, so that when the C-frame 8 performs a circular motion, the reciprocating shaft sleeve 901 is between the slider 902 and the Under the limiting action of the limiting slide 801, the loading net box 10 first moves vertically downward and then moves vertically upward. This process allows the loading net box 10 to automatically immerse in the electroplating solution to complete the electroplating treatment of the PCB substrate; and after the electroplating is completed, the loading net box 10 automatically rises and separates from the electroplating tank body 2, thereby greatly improving the electroplating processing efficiency of the PCB substrate; by using the provided connecting spring 13, when the loading net box 10 is moving, due to the impact with the electroplating solution, a shaking effect is generated, thereby further improving the contact degree between the PCB substrate and the electroplating solution, so as to achieve the purpose of improving the electroplating effect;

[0056] The set liquid receiving tank 3 is used to effectively receive the excess plating liquid carried during the subsequent PCB substrate draining process. At the same time, the set diversion inclined block 4 is used to ensure that the collected plating liquid flows to the drain valve pipe 301. When the drain valve pipe 301 is opened later, the plating liquid can be collected centrally; as shown in the attached manual Figure 3 As shown, when the electroplating operation is in progress, the upper material loading mesh box 10 will move to the top of the draining assembly. At this time, the drive motor 18 can be controlled to start, and the drive motor 18 can be used to drive the shaft 19 to rotate, and the cam 20 can be driven to rotate, thereby achieving a fixed frequency resistance to the bottom of the material loading mesh box 10, and cooperating with the provided connecting spring 13, effectively ensuring the draining effect of the PCB board.

[0057] The above description enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for processing a composite circuit board, It is characterized in that The specific steps include: Step 1: Cut the original copper clad board into boards that can be made on the production line to form a PLC substrate; Step 2: Drill holes on the PLC substrate to form the required circuit pattern; Step 3: Clean the drilled PLC substrate and place it in the processing equipment for electroplating; Step 4: Clean and dry the electroplated PLC substrate; The processing equipment described in step 3 comprises a base (1), a plating tank body (2) is fixedly mounted on the top outer wall of the base (1), a liquid receiving tank (3) is fixedly mounted on the top outer wall of the base (1), and the liquid receiving tank (3) and the plating tank body (2) are arranged adjacent to each other, a feeding mechanism is arranged above the base (1), and the feeding mechanism comprises a retarding motor (602) fixedly mounted on the top outer wall of the base (1), and the output shaft of the retarding motor (602) is fixedly connected to a column (6), and the outer periphery of the column (6) A plurality of horizontally arranged side column rods (7) are fixedly installed at one end of the wall near the top, reinforcing ribs (701) are fixedly installed between the two sides of each side column rod (7) and the outer peripheral wall of the column (6), and a C-shaped frame (8) is fixedly installed at the end of each side column rod (7), a reciprocating screw rod (9) is rotatably installed on each C-shaped frame (8), and a moving unit is installed on the reciprocating screw rod (9), a draining assembly is installed on the liquid receiving tank (3), and a transmission mechanism is commonly arranged on the inner sides of the plurality of reciprocating screw rods (9); The transmission mechanism comprises a support ring frame (11) fixedly mounted on the top outer wall of the base (1), and the support ring frame (11) is coaxially arranged with the column (6), a support ring plate (16) is fixedly mounted on the top of the support ring frame (11), an incomplete toothed ring (17) is fixedly mounted on the top outer wall of the support ring plate (16), and evenly distributed convex teeth are arranged on the side of the outer peripheral wall of the incomplete toothed ring (17) close to the electroplating tank body (2); A driven gear (904) adapted to the incomplete gear ring (17) is fixedly mounted at the bottom end of each reciprocating screw (9); Each of the mobile units comprises a reciprocating sleeve (901) adapted to be mounted on the reciprocating screw (9), and a slider (902) is fixedly connected to one side of the outer peripheral wall of the reciprocating sleeve (901), and a limiting sliding groove (801) slidably matched with the slider (902) is provided on one side of each of the C-shaped frames (8); A horizontally arranged side rod (903) is fixedly mounted on the side of the outer peripheral wall of the reciprocating shaft sleeve (901) away from the slider (902), and a pair of guide columns (12) is fixedly mounted on the bottom outer wall of each side rod (903), a material loading net box (10) is arranged below the pair of guide columns (12), and a horizontal plate (15) is fixedly mounted on the top of the material loading net box (10); A pair of connecting tubes (14) are fixedly mounted on the top outer wall of the horizontal plate (15), and the connecting tubes (14) are slidably matched with the guide column (12). A connecting spring (13) is fixedly mounted between the top of the connecting tube (14) and the bottom side of the side rod (903), and the connecting spring (13) is sleeved on the outer side of the guide column (12); A guide bevel block (4) is fixedly mounted on the inner bottom of the liquid receiving tank (3), and a higher end of the guide bevel block (4) is arranged adjacent to the electroplating tank body (2), and a drain valve pipe (301) is fixedly connected to the lower end of the liquid receiving tank (3) near the guide bevel block (4); The drain assembly comprises two mounting blocks (21) fixedly mounted on the liquid receiving tank (3), and a shaft (19) is mounted between the two mounting blocks (21) for common rotation, and a cam (20) is fixedly mounted on one end of the outer peripheral wall of the shaft (19); A drive motor (18) is fixedly mounted between one side of one of the mounting blocks (21) and the liquid receiving tank (3), and an output shaft of the drive motor (18) is fixedly connected to a shaft rod (19) via a coupling; When the C-shaped frame (8) rotates to the position of the electroplating tank body (2), the driven gear (904) at the bottom of the reciprocating screw (9) can mesh with the convex teeth of the incomplete gear ring (17), so that when the C-shaped frame (8) performs a circular motion, the reciprocating shaft sleeve (901) can first move vertically downward and then move vertically upward under the limiting action of the slider (902) and the limiting slide groove (801). This process can enable the loading net box (10) to automatically immerse in the electroplating solution to complete the electroplating treatment of the PLC substrate; and after the electroplating is completed, the loading net box (10) can automatically rise and detach from the electroplating tank body (2), start the driving motor (18), use the driving motor (18) to drive the shaft (19) to rotate, and use it to drive the cam (20) to rotate, thereby achieving a fixed frequency contact with the bottom of the loading net box (10), and cooperate with the provided connecting spring (13) to ensure the draining effect of the PLC substrate.

2. A method for processing a composite circuit board according to claim 1, Features: An end tube (5) is fixedly mounted on the top outer wall of the base (1), and the end tube (5) is coaxially arranged with the column (6); an annular plate (601) is fixedly mounted on one end of the outer peripheral wall of the column (6) close to the opening of the end tube (5), and the annular plate (601) is rotatably connected to the end tube (5).

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