IGBT module side frame and its manufacturing process

Abstract

The present application provides a preparation process for an IGBT module side frame, including stamping a copper bar to form a first busbar part and a second busbar part; the first busbar part and the second busbar part are arranged in parallel and spaced on an insulating protection plate to form a busbar unit; the busbar unit, a plurality of nut sleeves and a plurality of connecting terminals are fed to an injection mold for injection molding; an IGBT module side frame is obtained; the present application also provides an IGBT module side frame. The present application first forms an insulating protection plate between the first busbar part and the second busbar part arranged at intervals before injection molding the side frame, so that the interval between the first busbar part and the second busbar part is constant and a spacing structure is formed, thereby improving the stability of the busbar unit, reducing the difficulty of injection molding of the side frame in the later stage of injection molding, and improving production efficiency.

Description

Technical Field

[0001] The present invention relates to the field of IGBT technology, and in particular to an IGBT module side frame and a preparation process thereof. Background Art

[0002] IGBT (Insulated Gate Bipolar Transistor), as a power semiconductor device, is widely used in rail transit, smart grid, industrial energy conservation, electric vehicles and new energy equipment. It has the characteristics of energy saving, easy installation, easy maintenance and stable heat dissipation.

[0003] IGBT modules usually include power modules and IGBT side frames, wherein the IGBT side frames play the role of bearing, connecting and protecting the power modules. The power modules need to be installed in the external functional area through the IGBT side frames, and the IGBT side frames are provided with connection terminals, and the power modules are electrically connected to the functional areas through the connection terminals. For example, the optimized structure of the positive and negative busbars of a power module disclosed in the publication number CN115513163A, the positive busbar and the negative busbar in the side frame are arranged at intervals, which achieves the effect of reducing the surge voltage caused by stray inductance and avoiding the breakdown of the power module. However, due to the large current on the positive busbar and the negative busbar, when the positive busbar or the negative busbar is accidentally deformed by external force, the interval between them will be reduced. At this time, both the positive busbar and the negative busbar have large currents flowing through them, and the reduction in the interval between the positive busbar and the negative busbar will cause arcing, which will cause the positive busbar or the negative busbar to be broken down by the large current and cause short circuit or fire, and the stability is poor. At the same time, when the positive busbar and the negative busbar are directly placed into the injection mold to form the IGBT side frame, due to the high pressure during injection molding, the positive busbar and the negative busbar are often squeezed and deformed by the injection liquid. The constant interval between the positive and negative busbars cannot be guaranteed, defective products cannot pass the insulation withstand voltage test, and the product defective rate is high, making production extremely difficult. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present application provides an IGBT module side frame and a preparation process thereof.

[0005] The present application discloses a preparation process of an IGBT module side frame, comprising: stamping a copper bar to form a first busbar component and a second busbar component; arranging the first busbar component and the second busbar component in parallel and at intervals on an insulating protection plate to form a busbar unit; loading the busbar unit, a plurality of nut sleeves and a plurality of connecting terminals into an injection mold for injection molding; and obtaining the IGBT module side frame.

[0006] Preferably, the first busbar component and the second busbar component are arranged in parallel and spaced apart on the insulating protection board, and the formation of the busbar unit includes the following sub-steps: making the insulating protection board using PPS insulating resin; installing the first busbar component on one side of the insulating protection board, and installing the second busbar component on the other side of the insulating protection board to form a busbar unit.

[0007] Preferably, when punching the copper busbar to form the first busbar component and the second busbar component, a first injection molding positioning hole is punched out on the first busbar component, and a second injection molding positioning hole is punched out on the second busbar component; when using PPS insulating resin to make an insulating protection plate, a third injection molding positioning hole is opened on the insulating protection plate; when assembling to form a busbar unit, the first injection molding positioning hole, the second injection molding positioning hole and the third injection molding positioning hole are opposite to each other and interconnected.

[0008] Preferably, the first busbar component and the second busbar component are arranged in parallel and spaced apart on the insulating protection plate, and forming a busbar unit includes the following sub-steps: loading the first busbar component and the second busbar component into a preliminary injection mold, and keeping the first busbar component and the second busbar component in a spaced apart state; injection molding the first busbar component and the second busbar component, and forming an insulating protection plate between the first busbar component and the second busbar component, thereby forming a busbar unit.

[0009] Preferably, after the step of obtaining the IGBT module side frame, the following steps are also included: placing the IGBT module side frame in a CCD visual inspection device; and the CCD visual inspection device inspects multiple nut sleeves in the IGBT module side frame respectively.

[0010] Preferably, after the step of obtaining the IGBT module side frame, the method further includes the following steps: using a terminal pin flattening device to flatten the terminal pins on the IGBT module side frame and arrange them in parallel.

[0011] Preferably, the terminal pin flattening device includes a magnetic detection mechanism, a terminal flattening mechanism and a side frame bearing mechanism. The side frame bearing mechanism has a side frame bearing position, and the IGBT module side frame is carried on the side frame bearing position. The detection end of the magnetic detection mechanism is arranged at the bottom of the side frame bearing mechanism to detect whether a nut sleeve is installed in the side frame of the IGBT module. The terminal flattening mechanism is arranged in the side frame bearing mechanism, and the flattening ends of the terminal flattening mechanism are respectively opposite to the terminal pins of the IGBT module side frame. When the terminal pins on the side frame of the IGBT module are flattened by the terminal pin flattening device, it is simultaneously detected whether the side frame of the IGBT module is equipped with a nut sleeve.

[0012] Preferably, the terminal pin flattening device also includes an insulation withstand voltage testing mechanism, the detection end of the insulation withstand voltage testing mechanism is electrically connected to the IGBT module side frame in the side frame bearing mechanism, so as to detect the insulation withstand voltage characteristics of the IGBT module side frame; after the terminal pins on the IGBT module side frame are flattened by the terminal pin flattening device, the insulation withstand voltage test is performed on the IGBT module side frame in the side frame bearing position.

[0013] Preferably, loading the busbar unit, multiple nut sleeves and multiple connecting terminals into the injection mold for injection molding comprises the following steps: loading multiple nut sleeves and multiple connecting terminals into the injection mold; loading the busbar unit into the injection mold and locating it above the nut sleeves; and performing injection molding.

[0014] The present application also provides an IGBT module side frame, which is prepared using the preparation process of the IGBT module side frame.

[0015] The beneficial effect of the present application is that before injection molding to form the side frame, an insulating protection plate is first formed between the first busbar component and the second busbar component that are spaced apart, so that the interval between the first busbar component and the second busbar component is constant and a spacing structure is formed, thereby improving the stability of the busbar unit and reducing the difficulty of injection molding to form the side frame in the later stage.

[0016] Among them, the method of assembling the first busbar component and the second busbar component on the insulating protection plate to form an assembled busbar unit can reduce the difficulty of production, facilitate installation, have high flexibility, and improve production efficiency. The method of integrally forming the first busbar component and the second busbar component on the insulating protection plate to form an integrated busbar unit can further improve the stability of the overall structure of the busbar unit, so that it is not easy to deform when squeezed by external force. At the same time, the terminal foot flattening process, the process of detecting whether the nut sleeve is missing, and the insulation withstand voltage process are integrated into one process, shortening the production time, simplifying the production process steps, and improving production efficiency. There is no need to purchase multiple production equipment, thereby reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0018] Figure 1 It is a structural schematic diagram of the terminal foot flattening device in the first embodiment;

[0019] Figure 2 It is a structural schematic diagram of the supporting base in the first embodiment;

[0020] Figure 3 It is a structural schematic diagram of the pressure plate in the first embodiment;

[0021] Figure 4 It is a structural schematic diagram of the magnetic detection mechanism in Example 1;

[0022] Figure 5 This is a flow chart of the process for preparing the IGBT module side frame in Example 2;

[0023] Figure 6 It is a structural schematic diagram of the busbar unit in the second embodiment;

[0024] Figure 7 It is a structural schematic diagram of the first busbar component in the second embodiment;

[0025] Figure 8 is a schematic structural diagram of the second busbar component in the second embodiment;

[0026] Fig. 9 This is a schematic diagram of the structure of the insulation protection plate in Example 2;

[0027] Fig.10 This is a flow chart of the process for preparing the IGBT module side frame in Example 3;

[0028] Fig.11 This is a schematic diagram of the structure of the insulation protection plate in Example 3;

[0029] Fig.12 This is a flow chart of a process for preparing an IGBT module side frame in Embodiment 4;

[0030] Fig.13 This is a schematic diagram of the structure of the IGBT module side frame in Example 6.

[0031] Reference numerals:

[0032] 1. First busbar component; 11. First main body; 111. Positioning hole; 12. First busbar; 121. First row; 1211. Mounting hole; 122. Second row; 13. First terminal; 2. Second busbar component; 21. Second main body; 22. Second busbar; 221. Third row; 222. Fourth row; 23. Second terminal; 3. Insulation protection plate; 31. Positioning column; 4. Terminal foot flattening device; 41. Magnetic detection mechanism; 411. Magnetic sensing part; 412. Magnet; 42. Terminal foot flattening mechanism; 421. Flattening drive member; 422. Flattening plate; 423. Flattening block; 43. Side frame bearing mechanism; 431. Bearing base; 4311. Buffer block; 4312. Bearing block; 432. Bearing frame; 100. Side frame main body; 101. Connecting terminal. DETAILED DESCRIPTION

[0033] The following will disclose multiple embodiments of the present application with drawings. For the purpose of clear description, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present application. In other words, in some embodiments of the present application, these practical details are not necessary. In addition, in order to simplify the drawings, some conventional structures and components will be depicted in a simple schematic manner in the drawings.

[0034] It should be noted that all directional indications such as up, down, left, right, front, back... in the embodiments of the present application are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indication will also change accordingly.

[0035] In addition, in the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present application. They are only used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present application.

[0036] In order to further understand the application content, features and effects of the present application, the following embodiments are cited and described in detail with reference to the accompanying drawings.

[0037] Embodiment 1:

[0038] Reference Figure 1-4 , Figure 1 is a schematic diagram of the structure of the terminal foot flattening device in the first embodiment, Figure 2 is a schematic diagram of the structure of the supporting base in the first embodiment, Figure 3 is a schematic diagram of the structure of the pressure plate in the first embodiment, Figure 4 This is a structural diagram of the magnetic detection mechanism in the first embodiment. The terminal pin flattening device 4 in this embodiment includes a magnetic detection mechanism 41, a terminal flattening mechanism 42 and a side frame bearing mechanism 43. The side frame bearing mechanism 43 has a side frame bearing position, and the IGBT module side frame is carried on the side frame bearing position. The detection end of the magnetic detection mechanism 41 is arranged at the bottom of the side frame bearing mechanism 43 to detect whether a nut sleeve is installed in the IGBT module side frame. The terminal flattening mechanism 42 is arranged in the side frame bearing mechanism 43, and the flattening end of the terminal flattening mechanism 42 is respectively opposite to the terminal pins of the IGBT module side frame. When the terminal pin flattening device 4 flattens the terminal pins on the IGBT module side frame, it is synchronously detected whether a nut sleeve is installed in the IGBT module side frame.

[0039] The terminal pin flattening device 4 in this embodiment is placed on the inspection workbench for use, specifically for flattening the terminal pins of the IGBT module side frame after injection molding and detecting whether the side frame is equipped with a nut sleeve. Before the IGBT module side frame is formed by injection molding, multiple nut sleeves need to be manually or mechanically loaded onto the injection mold, and after the IGBT module side frame is injection molded, the nut sleeve is assembled inside the IGBT module side frame to provide an installation position for the IGBT module side frame, so that the IGBT module side frame can be installed on the external functional area through the nut sleeve. If the nut sleeve is missed, the corresponding position cannot be installed on the functional area, resulting in defective IGBT module side frame. Therefore, after injection molding, the IGBT module side frame generally needs to be detected by human eyes or CCD visual detection equipment to detect whether the side frame is equipped with a nut sleeve. Human eye detection not only has low detection efficiency but also often misses detection. CCD visual detection equipment is expensive. The magnetic detection mechanism 41 can detect whether the side frame is equipped with a nut sleeve, thereby improving detection efficiency and reducing equipment costs. At the same time, the terminal pins on the side frame can be flattened by the terminal flattening mechanism 42 to ensure that the terminal pins are all arranged in parallel, so that when the circuit board is welded to the terminal pins later, the circuit board and the terminal pins can be closely attached to each other, thereby improving the welding quality. The terminal pin flattening device 4 in this embodiment is equivalent to integrating the nut sleeve detection process and the terminal pin flattening process into one device, which can not only complete the nut sleeve detection and terminal pin flattening at one station, but also does not need to transfer the IGBT module side frame, thereby improving the detection efficiency and saving the cost of purchasing additional CCD visual detection equipment.

[0040] Re-reference Figure 1-4Preferably, the side frame bearing mechanism 43 includes a bearing base 431 and a bearing frame 432. The bearing base 431 is arranged on the detection workbench, and the bearing frame 432 is arranged on the bearing base 431. A bearing block 4312 is arranged on the bearing base 431. The bearing block 4312 has a detection bearing position, which is also the side frame bearing position. The detection bearing position is adapted to the side frame of the IGBT module. The terminal flattening mechanism 42 includes a flattening drive component 421, a flattening plate 422 and a plurality of flattening blocks 423. The flattening drive component 421 is arranged on the supporting frame 432. The driving end of the flattening drive component 421 is connected to the flattening plate 422. A plurality of flattening blocks 443 are arranged on the end of the flattening plate 422 facing the supporting base 431. The plurality of flattening blocks 443 respectively correspond to a plurality of terminal pins on the side frame of the IGBT module. The supporting base 431 is also provided with a plurality of buffer blocks 4311. When the side frame of the IGBT module is placed in the detection supporting position, the plurality of buffer blocks 4311 are respectively arranged at the bottom of the plurality of terminal pins of the side frame of the IGBT module, and respectively support the plurality of terminal pins. The flattening drive 421 drives the flattening plate 422 to descend, driving the flattening block 443 to descend synchronously until it contacts the terminal pin, pressing the terminal pin between the flattening block 443 and the buffer block 4311, and further driving the flattening plate 422 to descend through the flattening drive 421, so that multiple terminal pins are flattened on the same straight line, ensuring that the terminal pins are all arranged in parallel, so that when the circuit board is welded to the terminal pins later, the circuit board and the terminal pins can be closely attached to each other, thereby improving the welding quality. Furthermore, when the terminal pins are flattened, the side frame of the IGBT module is pressed firmly on the detection bearing position, so that the side frame of the IGBT module is close to the magnetic detection mechanism 41 at the bottom, thereby improving the accuracy of the detection of the magnetic detection mechanism 41. Specifically, the flattening plate 422, the flattening block 423 and the buffer block 4311 are all made of insulating materials.

[0041] Re-reference Figure 1-4Preferably, the magnetic detection mechanism 41 includes a magnetic detection body and a plurality of magnetic detection parts, each of which includes a magnetic sensing part 411 and a magnet 412. The plurality of magnetic sensing parts 411 are electrically connected to the magnetic detection body, respectively. The plurality of magnets 412 are respectively arranged at the plurality of magnetic sensing parts 411, and the magnetic sensing part 411 is arranged at the bottom of the detection bearing position. The magnet 412 is located between the magnetic sensing part 411 and the nut sleeve, and is directly opposite to the nut sleeve in the side frame of the IGBT module. Since the first busbar 1 and the second busbar 2 are both made of copper material, which has weak magnetism, and the nut sleeve is made of iron or steel, when the side frame of the IGBT module is placed in the detection bearing position, the magnet 412 and the nut sleeve in the side frame of the IGBT module are magnetically adsorbed, so that the magnet 412 rises close to the nut sleeve, that is, the magnet 412 is separated from the magnetic sensing part 411. At this time, the magnetic sensing part 411 can feedback the signal that the corresponding position in the side frame of the IGBT module has a nut sleeve. In specific applications, the bearing block 2312 is provided with a plurality of limiting holes. The magnetic sensing part 411 is arranged at the bottom of the supporting block 2312, and the cross-section of the magnet 412 is T-shaped. When the magnet 412 is magnetically attracted to the nut in the nut sleeve, the magnet 412 is blocked by the limiting hole of the supporting block 2312 to prevent the magnet 412 from being directly adsorbed on the side frame of the IGBT module. It can be understood that when the IGBT module side frame is removed after the detection, the magnetic attraction of the nut sleeve is lost, and the magnet 412 falls back on the magnetic sensing part 411. In this embodiment, the magnetic sensing part 411 can be a sensor or other components, which is not limited here. By setting up the magnetic detection mechanism 41, the IGBT module side frame is placed in the detection bearing position. When the terminal flattening mechanism 42 flattens the terminal feet of the IGBT module side frame, the magnetic detection mechanism 41 simultaneously detects whether the nut sleeve inside the IGBT module side frame is missing, and the two processes are compressed into one workstation, eliminating the need for workers to transfer products multiple times, thereby improving production efficiency. At the same time, the magnetic detection mechanism 41 uses the magnet 412 and the magnetic sensing part 411 to cooperate to realize magnetic suction detection, and the assembly cost is relatively low. Compared with the traditional detection method using CCD visual inspection equipment, it not only reduces the equipment purchase cost, but also improves the detection efficiency.

[0042] Preferably, the terminal foot flattening device 4 also includes an insulation withstand voltage test mechanism, and the detection end of the insulation withstand voltage test mechanism is electrically connected to the IGBT module side frame in the side frame bearing mechanism 43 to detect the insulation withstand voltage characteristics of the IGBT module side frame. After the terminal foot flattening device 4 flattens the terminal foot on the IGBT module side frame, the insulation withstand voltage test is performed on the IGBT module side frame in the side frame bearing position. In specific applications, the insulation withstand voltage test mechanism includes a test device body and at least two test pieces, the test piece is a test probe, the test device body is located on one side of the bearing frame 432, one end of one of the test pieces is connected to the test device body, and the other end is arranged on the bearing base 431 and electrically connected to the IGBT module side frame on the detection bearing position, one end of the other test piece is connected to the test device body, and the other end is arranged on the flat plate 422 and is respectively opposite to the first busbar 1 and the second busbar 2, the IGBT module side frame is placed in the detection bearing position, the magnetic detection mechanism 41 detects whether the nut sleeve inside the IGBT module side frame is missing, and the flattening drive member 421 drives the pressing plate 422 to drive the flattening block 423 to descend to flatten the terminal pins, and simultaneously drives another test piece to contact the first busbar piece 1 and the second busbar piece 2. The test equipment body performs an insulation withstand voltage test on the IGBT module side frame through the test piece. At the same time, the IGBT module side frame is pressed firmly on the detection bearing position during the test. The insulation withstand voltage test mechanism does not shake when performing the insulation withstand voltage test on the IGBT module side frame, ensuring the safety and stability of the test. In this way, the insulation withstand voltage test can also be performed on the IGBT module side frame at this workstation, further shortening the detection process, improving detection efficiency, and reducing labor transportation costs.

[0043] Embodiment 2:

[0044] Reference Figure 5-9 , Figure 5 is a flow chart of the preparation process of the IGBT module side frame in Example 2, Figure 6 is a schematic diagram of the structure of the busbar unit in the second embodiment, Figure 7 is a schematic diagram of the structure of the first busbar in the second embodiment, Figure 8 is a schematic diagram of the structure of the second busbar in the second embodiment, Fig. 9 Schematic diagram of the structure of the insulating protection plate in the second embodiment. The preparation process of the IGBT module side frame in this embodiment includes:

[0045] S1: stamping the copper bar into a first busbar component 1 and a second busbar component 2. The first busbar component 1 includes a first body 11, a plurality of first busbars 12 and a plurality of first terminals 13, wherein the plurality of first busbars 12 are sequentially arranged at one end of the first body 11, and the plurality of first terminals 13 are spaced apart at the other end of the first body 11. The second busbar component 2 includes a second body 21, a plurality of second busbars 22 and a plurality of second terminals 23, wherein the plurality of second busbars 22 are sequentially arranged at one end of the second body 21, and the plurality of second terminals 23 are spaced apart at the other end of the second body 21. In this embodiment, the first body 11 and the second body 21 are in the shape of long strips, a plurality of first busbars 12 are arranged at one end of the first body 11 at intervals along the length direction of the first body 11, a plurality of first terminals 13 are arranged at the other end of the first body 11 at intervals along the length direction of the first body 11, a plurality of second busbars 22 are arranged at one end of the second body 21 at intervals along the length direction of the second body 21, and a plurality of second terminals 23 are arranged at the other end of the second body 21 at intervals along the length direction of the second body 21. In this embodiment, the number of the first busbars 12 and the second busbars 22 are both three, the number of the first terminals 13 and the second terminals 23 are both six, and the number of the connecting terminals 101 is three. It can be understood that the IGBT module The side frame of the block can be divided into three areas, each area includes a first busbar 12, a second busbar 22, two first terminals 13, two second terminals 23 and a connecting terminal 101, wherein the two second terminals 23 are arranged adjacent to each other, and the two first terminals 13 are respectively located on both sides of the two second terminals 23, that is, the second terminal 23 is located between the two first terminals 13, and the first terminal 13 and the second terminal 23 are respectively opposite to the connecting terminal 101, so that after the side frame is formed by injection molding, the functional module can be welded on the first terminal 13, the second terminal 23 and the connecting terminal 101, ensuring that the functional module can be stably welded to the first terminal 13, the second terminal 23 and the connecting terminal 101, thereby improving the stability of the product.

[0046] Specifically, the copper bars are put into the stamping forming equipment for stamping to obtain the first busbar component 1 and the second busbar component 2. It should be particularly noted that in this embodiment, the first busbar component 1 and the second busbar component 2 are physically separate components. The first busbar 12 includes a first row 121 and a second row 122. One end of the second row 122 is connected to the first body 11, and the other end of the second row 122 extends upward in a direction away from the first body 11. The first row 121 is connected to the other end of the second row 122. The second busbar 22 includes a third row 221 and a fourth row 222. One end of the fourth row 222 is connected to the second body 21, and the other end of the fourth row 222 extends upward in a direction away from the second body 21. The third row 221 is connected to the other end of the fourth row 222. The first row 121 and the third row 221 are located in the same plane. In specific applications, mounting holes 1211 are provided on the first row 121 and the third row 221. Through the setting of the mounting holes 1211, the nut sleeves can be set below the first row 121 and the third row 221 and directly opposite to the mounting holes 1211, which is equivalent to establishing mounting sites on the first row 121 and the third row 221. The busbar terminals can be connected to the external functional area through the mounting sites, and the connection method can be bolted fixed connection. Since the first row 121 and the third row 221 are located in the same plane, but not in the same plane with the first body 11 and the second body 21, that is, the first row 121 and the third row 221 are both located obliquely above the first body 11 and the second body 21, there is a gap between the first body 11 and the second body 21 and the functional area after installation to avoid direct contact with the functional area. At the same time, after the side frame is formed by injection molding in the later stage, the gap position is a reserved nut position. In addition, the first row 121 and the third row 221 are located in the same plane to ensure that they can form a flat installation surface, which is convenient for the busbar terminals to be installed flatly on the functional area and improve the stability of the installation. Of course, in other embodiments, if the external functional area is not a flat surface, the position of the first row 121 and the third row 221 can also be adjusted accordingly for adaptation.

[0047] S2: The first busbar 1 and the second busbar 2 are arranged in parallel and spaced apart on the insulating protection plate 3 to form a busbar unit. In specific applications, the insulating protection plate 3 is arranged between the first body 11 and the second body 21. The spacing between the first body 11 and the second body 21 is controlled to be as small as possible under the premise of ensuring its insulation performance, so as to minimize the loop area through which the current flows, thereby reducing the surge voltage caused by stray inductance and improving the electrical performance and stability of the product.

[0048] Preferably, S2 arranges the first busbar component 1 and the second busbar component 2 in parallel and at intervals on the insulating protection plate 3 to form a busbar unit, which includes the following sub-steps:

[0049] S21a: The insulating protection plate 3 is made using PPS insulating resin. The PPS insulating resin dried at 140°C to 150°C for 4 hours is heated and melted, and the melted liquid is injected into the insulating protection plate molding mold for injection molding to obtain the insulating protection plate 3. The insulating protection plate 3 in this embodiment is physically a separate component, and the first body 11 and the second body 21 can be installed on both sides of the insulating protection plate 3 respectively. Specifically, a plurality of positioning columns 31 are provided on both sides of the insulating protection plate 3, and positioning holes 111 are provided at the positions of the first body 11 and the second body 21 corresponding to the positioning columns 31. Through the arrangement of the positioning columns 31 and the positioning holes 111, when the first body 11 and the second body 21 are installed on the insulating protection plate 3, the positioning holes 111 are sleeved outside the positioning columns 31, and the positions of the first body 11 and the second body 21 are positioned and fixed, so that the relative positions of the first body 11 and the second body 21 are fixed and do not shake, thereby improving the stability of the busbar installation.

[0050] S22a: Install the first busbar component 1 on one side of the insulation protection plate 3, and install the second busbar component 2 on the other side of the insulation protection plate 3 to form a busbar unit. In specific applications, both sides of the insulation protection plate 3 can be provided with corresponding grooves corresponding to the size and shape of the first body 11 and the second body 21. The first body 11 is embedded in the groove and the positioning column 31 is inserted into the positioning hole 111 to achieve the installation of the first body 11 on one side of the insulation protection plate 3. The position can be further positioned and fixed by setting the groove, and the second body 21 is the same. It can be understood that the insulating protection plate 3 in this embodiment is only arranged between the first main body 11 and the second main body 21, the first busbar 12, the second busbar 22, the first terminal 13 and the second terminal 23 all extend in the direction away from the insulating protection plate 3, and the first main body 11 and the second main body 21 installed on the insulating protection plate 3 are arranged at intervals, and the distance between them is the thickness of the insulating protection plate 3. The busbar unit structure assembled in this way is stable, and the distance between the first main body 11 and the second main body 21 is constant, which is the thickness of the insulating protection plate 3. At the same time, the insulating protection plate 3 supports and insulates the first main body 11 and the second main body 21. After the first busbar component 1 and the second busbar component 2 are installed on the insulating protection plate 3, they can be directly placed in the side frame injection mold for injection molding to form a side frame. During the injection molding process, the insulating protection plate 3 ensures that the first main body 11 and the second main body The gap between the first and second bodies 11 and 21 is constant and is protected from deformation, which greatly reduces the difficulty of injection molding of the side frame, improves the yield rate of the product, and improves the production quality and efficiency. At the same time, in the later power-on process, the insulating protection plate 3 supports the first body 11 and the second body 21 to prevent them from being deformed by force, thereby avoiding arcing caused by the deformation of the first and second bodies 11 and 21, thereby avoiding the busbar from being punctured or short-circuited, and improving the stability and safety of the product. In addition, the form of the assembled busbar formed in this way is more flexible and simple and convenient to install. The size of the gap between the first body 11 and the second body 21 can be changed by injection molding the insulating protection plate 3 of different thicknesses. This makes it easy to produce busbar units with different gaps according to actual production needs, reducing the difficulty of product manufacturing and improving production efficiency.

[0051] Preferably, when the copper bar is punched to form the first busbar component 1 and the second busbar component 2, a first injection molding positioning hole is punched out on the first busbar component 1, and a second injection molding positioning hole is punched out on the second busbar component 2. When the insulating protection plate 3 is made using PPS insulating resin, a third injection molding positioning hole is opened on the insulating protection plate 3. When assembled to form a busbar unit, the first injection molding positioning hole, the second injection molding positioning hole and the third injection molding positioning hole are opposite and interconnected, the first injection molding positioning hole is opened in the first body 11, and the second injection molding positioning hole is opened in the second body 21. The provision of the first injection molding positioning hole, the second injection molding positioning hole and the third injection molding positioning hole is essentially equivalent to opening a through injection molding positioning hole on the busbar unit. The busbar unit can be fixedly placed on the side frame molding mold through the injection molding positioning hole, thereby improving the speed and accuracy of feeding. At the same time, since the injection molding positioning hole can be plugged into the positioning column on the side frame molding mold, the busbar unit semi-finished product will not shake during the process of injection molding to form the side frame, thereby ensuring the accuracy of the position of the busbar unit semi-finished product in the side frame after molding and improving product quality.

[0052] S3: Load the busbar unit, multiple nut sleeves and multiple connection terminals 101 into the injection mold for injection molding. In specific applications, the nut sleeve is an M5 nut, which is covered with an insulating protective sleeve. The insulating protective sleeve separates the nut from the busbar unit to avoid direct contact between the nut and the busbar unit, thereby improving the stability of the product.

[0053] Preferably, S3 loading the busbar unit, the plurality of nut sleeves and the plurality of connection terminals 101 into the injection mold for injection molding comprises the following steps:

[0054] S31: Load multiple nut sleeves and multiple connecting terminals 101 into the injection mold. In specific applications, the connecting terminal 101 includes a third main body and a mounting row and multiple terminal feet respectively arranged at both ends of the third main body. The mounting row is provided with a mounting hole. When the nut sleeve is loaded, it is located below the mounting row and directly opposite to the mounting hole. After the side frame is formed by injection molding, the nut sleeve can be completely accommodated inside the side frame, thereby improving the flatness and space utilization of the side frame. In this embodiment, the number of connecting terminals 101 is three, and each connecting terminal 101 includes a third main body, a mounting row and three terminal feet, and a nut sleeve is provided at the bottom of each mounting row. Of course, in other embodiments, the terminal feet can be set to different numbers according to actual needs. It can be understood that the external bolt can be screwed into the threaded hole in the nut sleeve after passing through the mounting hole to achieve screw installation.

[0055] S32: Load the busbar unit to the injection mold and place it above the nut sleeve. In specific applications, a nut sleeve is provided at the bottom of each first busbar 12 and each second busbar 22, and the nut sleeve is directly opposite to the mounting holes 1211 on the first busbar 12 and the second busbar 22. It should be particularly noted that the connection terminal 101 and the busbar unit are respectively located at opposite ends of the injection mold when they are loaded, and the terminal pins of the connection terminal 101 are arranged opposite to the terminal pins of the busbar unit.

[0056] S33: Injection molding is performed. After the loading is completed, the upper mold and the lower mold are attached to each other and PPS insulating resin is injected into the side frame injection mold for injection molding.

[0057] S4: Obtaining the IGBT module side frame. Taking out the molded IGBT module side frame from the side frame injection mold.

[0058] S5: Flatten the first terminal 13, the second terminal 23 and the terminal pins of the connecting terminal 101 on the side frame of the IGBT module and arrange them in parallel by using the terminal pin flattening device 4. In specific applications, since the terminal pins of the first terminal 13, the second terminal 23 and the connecting terminal 101 on the side frame of the IGBT module are used for welding with the IGBT module circuit board, flattening the terminal pins of the first terminal 13, the second terminal 23 and the connecting terminal 101 so that they are in the same plane facilitates the subsequent stable welding of the circuit board, thereby improving the welding stability and quality.

[0059] S6: Perform insulation withstand voltage test on the IGBT module side frame through insulation withstand voltage test equipment. Since the IGBT module side frame is often under high voltage in specific applications, the insulation withstand voltage test can detect whether the IGBT module side frame can maintain insulation for a long time under high voltage, ensure subsequent safe and reliable operation, prevent leakage, short circuit and other faults, and improve product stability and safety.

[0060] S7: Place the IGBT module side frame in the CCD visual inspection device, and the CCD visual inspection device inspects the multiple nut sleeves in the IGBT module side frame respectively. Since the nut sleeves in this embodiment are located at the bottom of the first busbar 12, the second busbar 22 and the mounting row, the nut sleeves are assembled inside the side frame after the side frame is formed by injection molding, and in this embodiment, one IGBT module side frame is equipped with nine nut sleeves. Any lack of a nut sleeve will make the IGBT module side frame unable to be stably installed in the functional area, thus becoming a defective product. Not only is the detection efficiency low through human eye detection, but missed detection often occurs. The IGBT module side frame is placed in the CCD visual inspection device, and the CCD visual inspection device can visually observe whether the IGBT module side frame is equipped with a nut sleeve through the mounting hole, avoiding the situation where nuts are missed during the loading process, thereby ensuring the quality of the product.

[0061] Embodiment three:

[0062] Reference Figure 10-11 , Fig.10 is a flow chart of the preparation process of the IGBT module side frame in Example 3, Fig.11 Schematic diagram of the structure of the insulating protection plate in the third embodiment. The difference between the preparation process of the IGBT module side frame in this embodiment and that in the second embodiment lies in step S2. Step S2 in this embodiment includes the following sub-steps:

[0063] S21b: Load the first busbar component 1 and the second busbar component 2 into the preliminary injection mold, and keep the first busbar component 1 and the second busbar component 2 in a spaced state.

[0064] S22b: injection molding the first busbar component 1 and the second busbar component 2, and forming an insulating protection plate 3 between the first busbar component 1 and the second busbar component 2, so as to form a busbar unit. The insulating protection plate 3 is formed between the first body 11 and the second body 21. It can be understood that the first busbar component 1 and the second busbar component 2 in this embodiment actually need to go through two injection molding processes. The first injection molding process only places the first busbar component 1 and the second busbar component 2 in the preliminary injection mold, and forms a busbar unit through preliminary injection molding. The insulating protection plate 3 in this embodiment is also made of PPS insulating resin. Since the amount of glue used for injection molding at this time is small, it is only necessary to form the insulating protection plate 3 between the first body 11 and the second body 21. The pressure on the first body 11 and the second body 21 is small, and the copper busbar structure is not prone to compression deformation or spacing changes. In addition, since the insulating protection plate 3 is only formed between the first body 11 and the second body 21 during the first injection molding, the first busbar 12 and the second busbar 22 are both exposed. Therefore, the first body 11 and the second body 21 can also be fixed in position by the mold. The injection molding ensures that the gap between the first body 11 and the second body 21 is constant, reducing the difficulty of injection molding. In this way, after only the first injection molding, the first busbar component 1, the second busbar component 2 and the insulating protection plate 3 are an integrally molded structure. Compared with the assembled busbar unit formed in the second embodiment, the busbar unit structure in this embodiment is more stable, that is, the first busbar component 1 and the second busbar component 2 are more stably arranged on the insulating protection plate 3. When encountering external force impact, the busbar unit of this embodiment can withstand greater pressure and keep the first busbar component 1 and the second busbar component 2 from deformation.

[0065] Embodiment 4:

[0066] Reference Fig.12 , Fig.12This is a flow chart of the preparation process of the IGBT module side frame in the fourth embodiment. The difference between the preparation process of the IGBT module side frame in this embodiment and that in the second embodiment lies in steps S5, S6 and S7. The preparation process of the IGBT module side frame in this embodiment further includes the following steps after step S4:

[0067] S5a: Place the IGBT module side frame in the terminal foot flattening device 4 in the first embodiment. In specific applications, when the terminal foot flattening device 4 flattens the terminal foot on the IGBT module side frame, it is simultaneously detected whether the nut sleeve is assembled in the IGBT module side frame, which is equivalent to integrating the S5 and S7 steps in the second embodiment together, not only can the nut sleeve detection and terminal foot flattening be completed at one station, but there is no need to transfer the IGBT module side frame, which improves the detection efficiency and saves the cost of purchasing additional CCD visual inspection equipment. It can be understood that, in this embodiment, when the terminal pins of the IGBT module side frame are flattened on the terminal pin flattening device 4, the magnetic detection mechanism 41 has synchronously completed the detection of the nut sleeve. Compared with the second embodiment, it not only saves the time of transferring the IGBT module side frame to the CCD visual detection device, but also saves the detection time of the CCD visual detection device. More importantly, although the detection by the CCD visual detection device can improve the detection accuracy to a certain extent compared with the human eye detection, there is still a certain missed detection rate. The magnetic detection mechanism 41 has higher accuracy than the CCD visual detection device in detecting the nut sleeve in the side frame of the IGBT module through magnetic detection.

[0068] S6a: Perform insulation withstand voltage test on the IGBT module side frame using insulation withstand voltage test equipment.

[0069] Embodiment five:

[0070] The difference between the preparation process of the IGBT module side frame in this embodiment and the fourth embodiment is that the present embodiment combines S5a and S6a in the fourth embodiment into one station, specifically, the terminal foot flattening device 4 in the first embodiment is applied. The preparation process of the IGBT module side frame in this embodiment further includes the following steps after step S4:

[0071] S5b: After the step of flattening the terminal pins on the side frame of the IGBT module by the terminal pin flattening device 4, the insulation withstand voltage test is performed on the side frame of the IGBT module in the side frame bearing position. In specific applications, after the terminal flattening mechanism 42 flattens the terminal pins and the magnetic detection mechanism 41 completes the detection of whether the nut sleeve is missing in the side frame of the IGBT module, the side frame of the IGBT module is pressed firmly on the detection bearing position, and the insulation withstand voltage test mechanism performs an insulation withstand voltage test on the side frame of the IGBT module. The side frame of the IGBT module is pressed firmly between the bearing base 431 and the flat plate 422 without shaking, ensuring the safety and stability of the test. It can be understood that in this embodiment, the terminal pin flattening process, the process of detecting whether the nut sleeve is missing, and the insulation withstand voltage process are integrated into one device for operation, that is, the three processes are combined into one process, so that the production personnel do not need to switch different detection equipment many times, simplifying the production process steps, shortening the production time, and improving the production efficiency. At the same time, there is no need to purchase multiple production equipment, reducing the production cost.

[0072] Embodiment six:

[0073] Reference Fig.13 , Fig.13 The schematic diagram of the structure of the IGBT module side frame in the sixth embodiment is obtained by the preparation process of the IGBT module side frame in the fourth or fifth embodiment. The IGBT side frame in the present embodiment comprises a first busbar component 1, a second busbar component 2, a side frame body 100 and a plurality of connection terminals 101. The first busbar component 1 and the second busbar component 2 are arranged at one end of the side frame body 100, and a plurality of connection terminals 101 are arranged side by side at the other end of the side frame body 100. The first terminal 13 and the second terminal 23 extend in the direction of the connection terminal 101 respectively, and the terminal pins of the connection terminal 101 extend in the direction of the first busbar component 1 and the second busbar component 2. The first terminal 13, the second terminal 23 and the terminal pins of the connection terminal 101 cooperate with each other in the side frame body 100 to form a functional module bearing position, which is used for welding the IGBT module.

[0074] In summary, before the injection molding of the side frame, an insulating protection plate is first formed between the first busbar component and the second busbar component that are spaced apart, so that the interval between the first busbar component and the second busbar component is constant and forms a spacing structure, thereby improving the stability of the busbar unit and reducing the difficulty of injection molding of the side frame in the later stage. Among them, the method of assembling the first busbar component and the second busbar component on the insulating protection plate to form an assembled busbar unit can reduce the difficulty of production, facilitate installation, have high flexibility, and improve production efficiency. The method of integrally molding the first busbar component and the second busbar component on the insulating protection plate to form an integrated busbar unit can further improve the stability of the overall structure of the busbar unit, so that it is not easy to deform when squeezed by external force. At the same time, the terminal foot flattening process, the process of detecting whether the nut sleeve is missing, and the insulation withstand voltage process are integrated into one process, which shortens the production time, simplifies the production process steps, improves production efficiency, and does not require the purchase of multiple production equipment, thereby reducing production costs.

[0075] The above is only the implementation mode of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A process for preparing an IGBT module side frame, characterized in that: include: Punching the copper bar into a first busbar component (1) and a second busbar component (2); The first busbar component (1) and the second busbar component (2) are arranged in parallel and at intervals on the insulating protection plate (3) to form a busbar unit; Loading the busbar unit, a plurality of nut sleeves and a plurality of connection terminals (101) into an injection mold for injection molding; Obtain the IGBT module side frame; The terminal pins on the side frame of the IGBT module are flattened and arranged in parallel by a terminal pin flattening device (4), and at the same time, whether the nut sleeve is installed in the side frame of the IGBT module is synchronously detected; The terminal foot flattening device (4) comprises a magnetic detection mechanism (41), a terminal flattening mechanism (42) and a side frame bearing mechanism (43); the side frame bearing mechanism (43) has a side frame bearing position, and the IGBT module side frame is carried on the side frame bearing position; the detection end of the magnetic detection mechanism (41) is arranged at the bottom of the side frame bearing mechanism (43) to detect whether the nut sleeve is installed in the IGBT module side frame; the terminal flattening mechanism (42) is arranged on the side frame bearing mechanism (43); and the flattening ends of the terminal flattening mechanism (42) are respectively opposite to the terminal feet of the IGBT module side frame.

2. The process for preparing the IGBT module side frame according to claim 1, characterized in that: The first busbar component (1) and the second busbar component (2) are arranged in parallel and spaced apart on an insulating protection plate (3) to form a busbar unit, comprising the following sub-steps: An insulating protection plate (3) is prepared using PPS insulating resin; The first busbar component (1) is mounted on one side of the insulating protection plate (3), and the second busbar component (2) is mounted on the other side of the insulating protection plate (3) to form a busbar unit.

3. The process for preparing the IGBT module side frame according to claim 2, characterized in that: When punching the copper bar to form the first busbar component (1) and the second busbar component (2), a first injection molding positioning hole is punched out on the first busbar component (1), and a second injection molding positioning hole is punched out on the second busbar component (2); when using PPS insulating resin to make the insulating protection plate (3), a third injection molding positioning hole is opened on the insulating protection plate (3); when assembling to form the busbar unit, the first injection molding positioning hole, the second injection molding positioning hole and the third injection molding positioning hole are opposite to each other and are interconnected.

4. The process for preparing the IGBT module side frame according to claim 1, characterized in that: The first busbar component (1) and the second busbar component (2) are arranged in parallel and spaced apart on an insulating protection plate (3) to form a busbar unit, comprising the following sub-steps: Loading the first busbar component (1) and the second busbar component (2) into a preliminary injection mold, and keeping the first busbar component (1) and the second busbar component (2) in a spaced state; The first busbar component (1) and the second busbar component (2) are injection molded, and an insulating protection plate (3) is formed between the first busbar component (1) and the second busbar component (2), thereby forming a busbar unit.

5. The process for preparing the IGBT module side frame according to claim 1, characterized in that: The terminal foot flattening device (4) further comprises an insulation withstand voltage testing mechanism, wherein a detection end of the insulation withstand voltage testing mechanism is electrically connected to the IGBT module side frame in the side frame bearing mechanism (43) to detect the insulation withstand voltage characteristics of the IGBT module side frame; After the terminal pins on the IGBT module side frame are flattened by a terminal pin flattening device (4), an insulation withstand voltage test is performed on the IGBT module side frame in the side frame bearing position.

6. The process for preparing the IGBT module side frame according to claim 1, characterized in that: Loading the busbar unit, a plurality of nut sleeves and a plurality of connection terminals (101) into an injection mold for injection molding comprises the following steps: Loading a plurality of the nut sleeves and a plurality of the connecting terminals (101) into an injection mold; Loading the busbar unit into the injection mold and locating it above the nut sleeve; Perform injection molding.

7. An IGBT module side frame, characterized in that: The IGBT module side frame is prepared using the preparation process of the IGBT module side frame as described in any one of claims 1 to 6.

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