Thin film transfer apparatus and method

Abstract

The present application relates to a kind of film transfer device and method, device includes: including container, limiting cover, bracket and transfer tool, the limiting cover is fixed on the container, the limiting cover defines a two-end opening limiting cavity;The bracket includes the supporting plate, supporting plate is equipped with multiple through holes and multiple support columns, multiple support columns are detachably fixed with the transfer tool for adsorbing film.The film transfer device and method of the present application, based on chemical corrosion method, without complex mechanical equipment can complete the large size transfer of film, transfer efficiency is high, can realize the batch preparation of device;By limiting cover limiting and supporting plate buffering, avoid the film movement and collision caused by water flow, reduce the film breakage probability, guarantee the performance of transfer film.

Description

Technical Field

[0001] This invention relates to the field of thin-film device manufacturing, and more specifically to a thin-film transfer apparatus and method. Background Technology

[0002] Two-dimensional materials, such as graphene, two-dimensional transition metal sulfides, and MXenes, possess nanoscale layered structures, excellent semiconductor properties, and large specific surface areas, demonstrating enormous potential in the research and application of novel sensor devices. For example, the applications of graphene devices in biology, optics, and gas chromatography have attracted widespread attention both domestically and internationally, continuously spurring new and important research findings.

[0003] In the research of devices using two-dimensional materials, the device fabrication process is a crucial step, directly affecting not only the feasibility of various device studies (such as the realization of novel device structure designs) but also significantly influencing device performance. Currently, the mainstream fabrication processes in this type of device research often involve multiple steps: taking the commonly used exfoliation-transfer method as an example, it first requires exfoliating the two-dimensional material, then transferring the two-dimensional material, and finally fabricating the device's metal electrodes. The stripping and transfer of two-dimensional materials typically employs a wet transfer process. This process involves: spin-coating PMMA (polymethyl methacrylate) onto the surface of a film to which the substrate is attached; then immersing the film in a container of etching solution to allow the solution to etch the substrate; once the substrate is completely removed, contacting the PMMA with a clean, polished silicon wafer (or other polished substrate) to gently pull the PMMA-coated film into deionized water to remove any remaining etching solution; then contacting the PMMA with the silicon wafer again to gently pull the PMMA / film from the deionized water and transfer it to the surface of the target substrate, ensuring contact between the film and the target substrate; then slowly removing the silicon wafer; and finally baking the PMMA / film / target substrate to ensure tight adhesion; then removing the PMMA with acetone, followed by removing the acetone with deionized water to complete the transfer.

[0004] However, in existing transfer processes, PMMA needs to be spin-coated onto the thin film first, and the film is transferred through PMMA. Then, the PMMA is removed after the transfer is completed. The process is complicated and the transfer efficiency is low, making it impossible to mass-produce devices. Summary of the Invention

[0005] The purpose of this invention is to provide a thin film transfer device and method to improve the transfer efficiency of thin films, thereby enabling the mass production of devices.

[0006] To achieve the above objectives, the present invention provides a film transfer device, comprising a container, a limiting cover, a bracket, and a transfer fixture. The limiting cover is fixed to the container and defines a limiting cavity with openings at both ends. The bracket includes a tray, which has multiple through holes and multiple support columns. A transfer fixture for adsorbing the film is detachably fixed on the multiple support columns.

[0007] Furthermore, the container has a receiving groove, and the tray is located within the receiving groove.

[0008] Furthermore, the container is provided with a liquid inlet / outlet device, which is connected to the receiving tank.

[0009] Furthermore, a limit cover bracket is fixed on the container, and the limit cover is fixed on the limit cover bracket.

[0010] Furthermore, the bracket also includes a baffle plate, and a buffer space is formed between the baffle plate and the bracket, with multiple support columns located within the buffer space.

[0011] Furthermore, each support column is provided with a slot for fixing the transfer tooling.

[0012] Furthermore, the slot is at a preset angle to the horizontal plane, so that the transfer fixture is fixed at a preset angle to the horizontal plane after being fixed on multiple support columns.

[0013] Furthermore, the bracket also includes a sliding arm and a handle, the sliding arm being slidably connected to both sides of the container, and the two ends of the handle being connected to the sliding arm.

[0014] Another aspect of the present invention provides a thin film transfer method, comprising:

[0015] A thin film transfer apparatus as described above is provided, and an etching solution is injected into the container of the thin film transfer apparatus;

[0016] The film to be transferred, with the substrate attached, is floated in the etching solution in the limiting cavity, so that the etching solution corrodes the substrate.

[0017] After the substrate is completely etched, the transfer fixture is fixed to each support column of the tray, and the tray is slid to the first position so that the transfer fixture is located below the film to be transferred.

[0018] The corrosive liquid in the container is drained so that the film to be transferred is gradually adsorbed onto the surface of the transfer fixture as the liquid level drops.

[0019] The cleaning operation is repeated multiple times. Each cleaning operation includes: injecting cleaning fluid into the receiving tank so that the film to be transferred floats on the surface of the cleaning fluid; after a preset time, draining the cleaning fluid from the receiving tank so that the film to be transferred is adsorbed onto the surface of the transfer fixture.

[0020] Inject cleaning fluid into the receiving tank so that the film to be transferred floats on the surface of the cleaning fluid; then slide the tray to the second position so that the tray is away from the cover.

[0021] The target substrate is fixed on each support column of the tray, and then the tray is slid to the first position;

[0022] The cleaning solution in the container is drained so that the film to be transferred adheres to the surface of the target substrate as the liquid level drops, thus completing the transfer of the film to be transferred.

[0023] The thin film transfer apparatus and method of the present invention are based on chemical etching, which can complete the large-size transfer of thin films without complex mechanical equipment, with high transfer efficiency and the ability to mass-produce devices. Through multiple support pillars on the tray, the thin film can be transferred on target substrates of different sizes, which is highly versatile. The thin film transfer apparatus of the present invention is simple to operate, requires less manual operation, and has high production efficiency. Attached Figure Description

[0024] Figure 1 This is a structural block diagram of a thin film transfer apparatus according to an embodiment of the present invention;

[0025] Figure 2 This is a perspective view of a thin film transfer apparatus according to a specific embodiment of the present invention;

[0026] Figure 3 for Figure 2 Top view;

[0027] Figure 4 This is a schematic diagram of the structure of the limiting cover of the thin film transfer device according to an embodiment of the present invention;

[0028] Figure 5 This is a schematic diagram of the structure of the limiting cover bracket and container according to an embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram of the bracket according to an embodiment of the present invention;

[0030] Figure 7 This is a structural schematic diagram of the bracket according to an embodiment of the present invention from another perspective;

[0031] Figure 8 This is a schematic diagram of the transfer tooling according to an embodiment of the present invention;

[0032] Figure 9This is a flowchart of a thin film transfer method according to another embodiment of the present invention. Detailed Implementation

[0033] The preferred embodiments of the present invention are given below with reference to the accompanying drawings and described in detail.

[0034] like Figure 1 As shown, an embodiment of the present invention provides a film transfer device, including a container 100, a limiting cover, and a bracket. The limiting cover includes a cover body 210 fixed on the container 100, and the cover body 210 defines a limiting cavity 220 with openings at both ends. The bracket includes a support plate 310, and the support plate 310 is provided with a plurality of through holes 311 penetrating the support plate 310 and a plurality of support columns 312. Transfer fixtures for adsorbing films are detachably fixed on the plurality of support columns 312.

[0035] like Figure 2 and Figure 3 As shown, in one specific embodiment, the thin film transfer device includes a container 100 with a receiving tank 110, which holds an etching solution for reacting with and etching the substrate of the thin film, thereby removing the substrate. A limiting cover is fixed to the container 100, the limiting cover including a cover body 210, which defines a limiting cavity 220 open at both ends. The cover body 210 is at least partially located in the receiving tank 110, such that the upper opening of the limiting cavity 220 is below the liquid level in the receiving tank 110, and the lower opening is above the liquid level. A bracket, including a support plate 310, is also slidably connected to the container 100. The tray 310 is located in the receiving groove 110 and can slide relative to the container 110 between a first position and a second position. The tray 310 is provided with a plurality of through holes 311 penetrating the tray 310 and a plurality of support columns 312. A transfer fixture 400 is detachably fixed on the plurality of support columns 312. The transfer fixture 400 is used to adsorb the film (not shown in the figure). When the tray 310 is in the first position, the tray 310 is located below the limiting cavity 220, and the transfer fixture 400 covers the lower opening of the limiting cavity 220 (that is, the projection of the lower opening falls completely on the transfer fixture 400). The second position is the position when the tray 310 is away from the cover 210.

[0036] In some embodiments, the container 100 may also be provided with an inlet / outlet device 500, which communicates with the receiving tank 110 for introducing solution into the receiving tank 110 and discharging solution from the receiving tank 110. The inlet / outlet device 500 may include a three-way valve 510, an inlet pipe 520, and an outlet pipe 530, wherein the three-way valve 510 is connected to the outlet of the container 100, the inlet pipe 520, and the outlet pipe 530, respectively, for controlling the communication between the inlet pipe 520 and the outlet pipe 530 and the outlet of the container 100. When the inlet pipe 520 is connected to the outlet of the container 100, liquid can be introduced; when the outlet pipe 530 is connected to the outlet of the container 100, liquid can be discharged. In an exemplary embodiment, the outlet of the container 100 is located at the bottom of the container 100.

[0037] When using a film transfer device to transfer a film, an etchant (e.g., ferric chloride solution) can first be introduced into the receiving tank 110. The etchant should cover a portion of the cover 210, so that the two openings of the limiting cavity 220 are located above and below the liquid level, respectively. Then, the film to be transferred floats in the etchant within the limiting cavity 220, thereby confining the film's position within the limiting cavity 220. The etchant can remove the substrate from the bottom of the film. After the substrate is removed, the support plate 310 can be slid below the limiting cavity 220, and then the etchant can be drained. As the etchant is gradually drained, the liquid level in the receiving tank 110 will gradually decrease, and the film will be adsorbed onto the transfer fixture 400. After the etchant is drained, a cleaning solution can be introduced into the receiving tank 110. The cleaning solution is used to remove residual etching solution from the film. After cleaning, the cleaning solution is drained. As the liquid level gradually decreases, the film will be adsorbed onto the transfer fixture 400. Then, new cleaning solution is injected. As the cleaning solution is gradually injected, it will pass through the through-hole 311 and the support plate 310. When the liquid level exceeds the film, the film will leave the transfer fixture 400 and float on the liquid surface. Then, the support plate 310 is slid away from the cover 210, and the transfer fixture 400 on the support pillar 312 is removed. The target substrate is then fixed on the multiple support pillars 312. The support plate 310 is then slid below the limiting cavity 220, and the cleaning solution is drained again, allowing the film to gradually descend and adhere to the target substrate, thus completing the film transfer. Since the liquid passes through the through-hole 311 and the support plate 310 during injection and discharge, the liquid can be diverted, reducing the fluctuations caused by sudden increases and decreases in liquid level, thereby reducing the interference of liquid rise and fall on the film.

[0038] In some embodiments, container 100 may be various industrially common trough-shaped containers, and the inner liner material of the container includes, but is not limited to, various plastics, ceramics, or glass. In an exemplary embodiment, container 100 is a rectangular trough-shaped container, and the inner liner material of container 100 is glass.

[0039] In some embodiments, a limiting cover bracket 600 may be fixed to the container 100, and the cover body 210 may be detachably fixed to the limiting cover bracket 600, thereby allowing the limiting cover of different sizes to be replaced as needed to accommodate films of different sizes. Specifically, the size of the limiting cavity 220 of the limiting cover needs to be larger than the size of the film, so that the film can be limited within the limiting cavity 220. The shape of the cover body 210 can be any suitable shape, and the material of the cover body 210 includes, but is not limited to, various plastics, ceramics, or glass.

[0040] like Figure 4 As shown, in an exemplary embodiment, the cover 210 can be a hollow cube surrounded by four side plates, and the space surrounded by the four side plates is the limiting cavity 220. The cover 210 can be provided with two outwardly extending fixing arms 230, which are used to cooperate with the limiting cover bracket 600 to install the limiting cover on the limiting cover bracket 600.

[0041] like Figure 5 As shown, in some embodiments, the limiting cover bracket 600 can be U-shaped. The limiting cover bracket 600 is fixed to one side of the container 100 and includes two mounting arms 610 extending toward the other side of the container 100. Each mounting arm 610 is provided with a groove 611 that cooperates with the fixing arm 230. The two fixing arms 230 are respectively located in the grooves 611 on the two mounting arms 610 to achieve fixation. The cover body 210 is located between the two mounting arms 610. In this way, the limiting cover can be fixed on the limiting cover bracket 600, and the cover body 210 is at least partially located in the receiving groove 110.

[0042] In some embodiments, the size of the cover 210 can be set as needed. On cover 210 of different sizes, the same two fixing arms 230 are provided, so that cover 210 of different sizes can be installed on the limiting cover bracket 600 through the two fixing arms 230 to limit the film of different sizes.

[0043] like Figure 6 and Figure 7 As shown, a vertically extending baffle plate 320 is provided around the periphery of the tray 310, forming a buffer space between the baffle plate 320 and the tray 310. Multiple support columns 312 are located within this buffer space. During the transfer process, the membrane is also located within this buffer space. The baffle plate 320 prevents a large amount of liquid from entering or exiting the buffer space from around the tray 310; that is, liquid can only enter and exit the buffer space through the multiple through holes 311 on the tray 310. This buffers fluid fluctuations and reduces interference from liquid flow to the membrane during entry and exit. During the transfer process, the membrane is confined within the limiting cavity 220 and simultaneously located within the buffer space, thus preventing membrane movement and collisions caused by water flow, reducing the probability of membrane breakage, and ensuring the performance of the transferred membrane.

[0044] In some embodiments, the baffle plate 320 may be provided with two sliding arms 330, which are slidably connected to the two sides of the container 100, thereby allowing the bracket to slide relative to the container 100. For example, one of the sliding arms 330 and the container 100 may be provided with a slider, and the other with a slide rail, the slider cooperating with the slide rail, thereby allowing the sliding arm 330 to slide relative to the container 100. In an exemplary embodiment, a groove 331 is formed on the sliding arm 330, and the side wall of the container 100 cooperates with the groove 331, that is, the side wall of the container 100 can be accommodated in the groove 331, thereby allowing the sliding arm 330 to slide on the side wall of the container 100.

[0045] In some embodiments, the tray may also include a handle 340, the two ends of which are fixedly connected to two sliding arms 330, thereby allowing the tray to slide on the container and to place the tray on or remove the tray from the container 100.

[0046] In some embodiments, a notch 321 may be provided on the side of the baffle plate 320 near the cover 210 to avoid the cover 210 and prevent the baffle plate 320 from interfering with the cover 210 when the bracket moves to the first position.

[0047] In some embodiments, the materials of the bracket (including the tray 310, the baffle 320, the support column 312, the sliding arm 330, and the handle 340, etc.) include, but are not limited to, various plastics, ceramics, or glass.

[0048] like Figure 6 As shown, in an exemplary embodiment, the multiple support pillars 312 can be divided into three groups: A, B, and C. Each group includes three support pillars 312. Each group of support pillars 312 can fix a transfer fixture 400 of a certain size. For example, the left side of the transfer fixture 400 is fixed to the left support pillar 312 of one group, the right side of the transfer fixture 400 is fixed to the right support pillar 312 of the same group, and the front side of the transfer fixture 400 is fixed to the front support pillar 312 of the same group, thereby achieving the fixation of the transfer fixture 400. The three groups of support pillars 312 can achieve the fixation of three sizes of transfer fixtures 400. In an exemplary embodiment, the above three groups of support pillars 312 are respectively suitable for the transfer of 3-inch, 4-inch, and 6-inch wafers.

[0049] In some embodiments, each support post 312 is provided with a slot (not shown in the figure), such as Figure 8As shown, the transfer fixture 400 is a roughly circular, thin-walled structure with a small thickness, so it can be directly inserted into the slot for fixation. For example, the left side of the transfer fixture 400 is inserted into the slot of the left support column 312, and the right side of the transfer fixture 400 is inserted into the slot of the right support column 312, thereby achieving fixation on the left and right sides. The front side of the transfer fixture 400 is inserted into the slot of the front support column 312, thereby defining the position of the front side.

[0050] The transfer fixture 400 needs to be larger than the size of the film to adsorb the entire film. For example, if the size of the film is a 3-inch wafer, then the diameter of the transfer fixture 400 can be 4 inches. In an exemplary embodiment, the transfer fixture 400 can be the transfer fixture in the patent application with application number 202310421966.1.

[0051] In some embodiments, the slot on the support column 312 is at a certain angle to the horizontal plane (it can be any angle between 0 and 180°, for example, 12°), so that after the transfer fixture 400 is fixed on the support column 312, it is at a certain angle to the horizontal plane, that is, one side is higher and the other side is lower. Since the function of the front support column 312 is to limit the position of the transfer fixture 400, the tilt angle and direction of its slot must be the same as the tilt angle and direction of the front side of the transfer fixture 400. In this way, during the transfer process, when the liquid level in the receiving tank 110 gradually decreases, the film will first contact the higher side of the transfer fixture 400, and then the contact area will gradually increase until it is completely attached to the transfer fixture 400 (i.e., completely adsorbed onto the transfer fixture 400). This ensures that the film is flatly attached to the surface of the transfer fixture 400 and avoids slippage. In addition, the tilted transfer fixture 400 can also guide the liquid below the film, thereby improving the adhesion effect between the film and the transfer fixture 400.

[0052] In some embodiments, a limiting device (not shown in the figure) may be provided on the container 100 to limit the first position of the bracket. When the bracket moves to the first position, it will be blocked by the limiting device and will not be able to move forward, thereby keeping the bracket in the first position. In this way, during the film transfer process, when it is necessary to slide the bracket to the first position, the bracket can simply be slid along the container 100 until it is limited, without the need for any other positioning operations, which is very convenient.

[0053] The thin film transfer device of this invention is based on a chemical etching method, which can complete the large-size transfer of thin films without complex mechanical equipment, with high transfer efficiency and the ability to mass-produce devices. Through multiple support pillars 312 on the tray 310, the thin film can be transferred on target substrates of different sizes, which is highly versatile. The thin film transfer device of this invention is simple to operate, requires less manual operation, and has high production efficiency.

[0054] like Figure 9 As shown, another embodiment of the present invention provides a thin film transfer method, including the following steps:

[0055] S1000: A thin film transfer apparatus according to the above embodiment is provided, and an etching liquid is injected into the receiving tank 110 of the container 100 of the thin film transfer apparatus, such that the liquid level of the etching liquid exceeds the lower end opening of the limiting cavity 220.

[0056] The size, shape, and materials of the thin film transfer device can be selected as needed. The etching solution reacts with the substrate of the thin film to be transferred to achieve the etching of the substrate; for example, the etching solution can be a ferric chloride solution.

[0057] In some embodiments, the volume of the corrosive liquid can be 2 / 3 to 3 / 4 of the volume of the containing tank 110, preferably 2 / 3.

[0058] S2000: The film to be transferred with the substrate attached is floated in the etching solution in the limiting cavity 220, so that the etching solution corrodes the substrate.

[0059] The film to be transferred includes, but is not limited to, two-dimensional material films such as graphene, carbon nanotube films, molybdenum disulfide, tungsten disulfide, molybdenum diselenide, or tungsten diselenide. The size of the film to be transferred is smaller than the size of the limiting cavity 220, thereby allowing the film to be confined within the limiting cavity 220. For example, the area of ​​the film to be transferred can be 64 square centimeters, and the area of ​​the lower opening of the limiting cavity 220 can be 67.24 square centimeters. The substrate material includes, but is not limited to, nickel, copper, silicon oxide, quartz, glass, plastic, silicon, PET, etc.; for example, the substrate can be made of copper.

[0060] S3000: After the substrate is completely corroded, the transfer tool 400 is fixed on each support column 312 of the tray 310, and the bracket is slid to the first position so that the tray 310 slides to the bottom of the limiting cavity 220, and the transfer tool 400 covers the lower opening of the limiting cavity 220.

[0061] During the process of sliding the bracket to the first position, it can be slid slowly to reduce the interference of liquid fluctuations on the film to be transferred.

[0062] S4000: Drain the corrosive liquid in the receiving tank 110 so that the film to be transferred gradually adsorbs onto the surface of the transfer fixture 400 as the liquid level drops.

[0063] Because the material of the film to be transferred is hydrophobic, the film will float on the liquid surface. As the corrosive liquid is gradually discharged from the receiving tank 110, the liquid level will gradually drop, and the film to be transferred will also drop along with it. When the liquid level drops to the transfer fixture 400, the film to be transferred will adhere to the transfer fixture 400 and then remain stationary. For example, when the transfer fixture 400 is tilted, the gradually descending film to be transferred will first contact the higher side of the transfer fixture 400 until the liquid level drops below the transfer fixture 400, at which point the film to be transferred will be completely adhered to the transfer fixture 400. After the corrosive liquid is drained, residual corrosive liquid will remain between the film to be transferred and the transfer fixture 400.

[0064] S5000: Repeat the cleaning operation multiple times, wherein each cleaning operation includes: injecting cleaning fluid into the receiving tank 110, the liquid level of the cleaning fluid exceeding the lower opening of the limiting cavity 220, so that the film to be transferred floats on the liquid level of the cleaning fluid; after a preset time, draining the cleaning fluid in the receiving tank 110, so that the film to be transferred is adsorbed on the surface of the transfer fixture 400.

[0065] To remove residual corrosion fluid between the film to be transferred and the transfer fixture 400, multiple cleaning operations are required. In some embodiments, the number of cleaning operations is at least three. For example, it can be five times.

[0066] During each cleaning operation, after the cleaning fluid is injected into the receiving tank 110, the liquid level will gradually rise and exceed the transfer fixture 400, causing the film to be transferred to leave the transfer fixture 400 and float again on the surface of the cleaning fluid. For example, when the transfer fixture 400 is tilted, the lower side of the film to be transferred will float on the liquid surface first, and then the other part will gradually detach from the transfer fixture 400 until the liquid level completely exceeds the transfer fixture 400, so that the film to be transferred is completely floating on the liquid surface. In this way, the residual corrosive liquid will diffuse into the cleaning fluid, thereby cleaning the corrosive liquid. After a preset time, the cleaning fluid is drained, and the film to be transferred will be re-adsorbed onto the transfer fixture 400.

[0067] S6000: Inject cleaning fluid into the receiving tank 110 so that the liquid level of the cleaning fluid exceeds the lower opening of the limiting cavity 220, so that the film to be transferred floats on the liquid level of the cleaning fluid; then slide the bracket to the second position so that the tray 310 is away from the cover 210.

[0068] As the bracket is slid away from the cover 210, it can be slid slowly to reduce the interference of liquid waves on the film to be transferred.

[0069] S7000: Fix the target substrate on the multiple support pillars 312 of the tray 310, and then slide the tray to the first position so that the tray 310 slides below the limiting cavity 220 and the target substrate covers the lower opening of the limiting cavity 220.

[0070] The target substrate is larger than the film to be transferred. When sliding the support, it can be slid slowly to reduce interference from liquid fluctuations on the film to be transferred.

[0071] S8000: Drain the cleaning fluid in the receiving tank 110 so that the film to be transferred adheres to the surface of the target substrate as the liquid level drops, thus completing the transfer of the film to be transferred.

[0072] Since the film to be transferred is always confined in the limiting cavity 220 during the transfer process, its position remains almost unchanged.

[0073] The thin film transfer method of this invention, using the thin film transfer device described above, can easily and conveniently achieve large-size transfer of the thin film to be transferred, with high transfer efficiency, thereby realizing the mass production of devices.

[0074] Unless otherwise specified or stated, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, an integral connection, an electrical connection, or a signal connection; "connection" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0075] Furthermore, it should be understood that the directional terms such as "upper," "lower," "inner," and "outer" used in the exemplary embodiments of this disclosure are for convenience only, for example, to describe the objects according to the angles shown in the accompanying drawings, and should not be construed as limiting the exemplary embodiments of this disclosure. It should also be understood that, in the context of a reference to an element or feature being "upper," "lower," "inner," or "outer," it can be directly connected to the other element(s) "upper," "lower," "inner," or "outer," or indirectly connected to the other element(s) "upper," "lower," "inner," or "outer" through an intermediate element.

[0076] The terms “a,” “one,” “the,” and “the” are used to indicate the existence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion meaning and that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first” and “second” are used only as markers and are not a limitation on the number of objects.

[0077] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of the invention. Various variations can be made to the above embodiments of the present invention. That is, all simple and equivalent changes and modifications made based on the claims and description of this invention fall within the protection scope of the claims of this patent. All aspects not described in detail in this invention are conventional technical content.

Claims

1. A thin film transfer device, characterized in that, The device includes a container, a limiting cover, a bracket, and a transfer fixture. The limiting cover is fixed to the container and defines a limiting cavity with openings at both ends. The bracket includes a tray with multiple through holes and multiple support columns. A transfer fixture for adsorbing a film is detachably fixed on the multiple support columns.

2. The thin film transfer apparatus according to claim 1, characterized in that, The container has a receiving slot, and the tray is located within the receiving slot.

3. The thin film transfer apparatus according to claim 2, characterized in that, The container is equipped with a liquid inlet / outlet device, which is connected to the receiving tank.

4. The thin film transfer apparatus according to claim 1, characterized in that, A limit cover bracket is fixed to the container, and the limit cover is fixed to the limit cover bracket.

5. The thin film transfer apparatus according to claim 1, characterized in that, The bracket also includes a baffle plate, and a buffer space is formed between the baffle plate and the bracket, with multiple support columns located within the buffer space.

6. The thin film transfer apparatus according to claim 1, characterized in that, Each support column is provided with a slot for fixing the transfer tool.

7. The thin film transfer apparatus according to claim 6, characterized in that, The slot is at a preset angle to the horizontal plane so that the transfer fixture is fixed at a preset angle to the horizontal plane after being fixed on multiple support columns.

8. The thin film transfer apparatus according to claim 1, characterized in that, The bracket also includes sliding arms and handles. The sliding arms are slidably connected to both sides of the container, and the two ends of the handle are connected to the sliding arms.

9. A thin film transfer method, characterized in that, include: A thin film transfer apparatus as described in any one of claims 1-8 is provided, and an etching solution is injected into the container of the thin film transfer apparatus; The film to be transferred, with the substrate attached, is floated in the etching solution in the limiting cavity, so that the etching solution corrodes the substrate. After the substrate is completely etched, the transfer fixture is fixed to each support column of the tray, and the tray is slid to the first position so that the transfer fixture is located below the film to be transferred. The corrosive liquid in the container tank is drained so that the film to be transferred gradually adheres to the surface of the transfer fixture as the liquid level drops. The cleaning operation is repeated multiple times. Each cleaning operation includes: injecting cleaning fluid into the receiving tank so that the film to be transferred floats on the surface of the cleaning fluid; after a preset time, draining the cleaning fluid from the receiving tank so that the film to be transferred is adsorbed onto the surface of the transfer fixture. Inject cleaning fluid into the receiving tank so that the film to be transferred floats on the surface of the cleaning fluid; then slide the tray to the second position so that the tray is away from the cover. The target substrate is fixed on each support column of the tray, and then the tray is slid to the first position; The cleaning solution in the container is drained so that the film to be transferred adheres to the surface of the target substrate as the liquid level drops, thus completing the transfer of the film to be transferred.

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