Cleaning device and cleaning method

Abstract

The application relates to a cleaning device and a cleaning method. The cleaning device comprises a body, and the body is provided with at least one liquid channel. The body is arranged on the side of the first element away from the second element and is in sealing cooperation with the surrounding blocking structure of the first element. The liquid outlet of the liquid channel is arranged on the side of the body facing the first element. The liquid outlet can be in communication with the spacing space through the liquid inlet, so that the cleaning liquid from the liquid outlet can enter the spacing space through the liquid inlet and be discharged from the surrounding of the spacing space. In this way, the cleaning liquid can be directly sent from the liquid inlet to the cleaning position, and the cleaning liquid can efficiently and directly wash away the dirt on the low-pitch and high-precision cleaning position under the action of the flow pressure.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of cleaning devices, in particular to a cleaning device and a cleaning method. BACKGROUND

[0002] With the gradual development of China's local electronic industry, the replacement of consumer electronic products is becoming more and more frequent. Under this consumer market environment, manufacturing industry is booming, but also faces the difficult and inevitable cleaning demand. In the process of industrial electronic manufacturing, electronic components are developing towards precision and density to meet the improvement of product performance. In this process, production processes will inevitably be iterated and updated. New production processes, combined with different precision packaged components, require more precise cleaning methods.

[0003] Electronic components and printed circuit boards are developing towards precision, which brings difficulties to the cleaning process. SOCKET connector used to connect CPU and PCB board is a high-precision component, which includes a connecting plate and a large number of pins densely arranged on the connecting plate. When connecting SOCKET connector and PCB board in SMT process, tin paste is first applied on PCB board, then the pins of SOCKET connector contact the position of tin paste on PCB board, and then the lower end of the pins of SOCKET connector is welded to PCB board through tin paste by heating. After welding, the lower end of the pins of SOCKET connector forms a spherical solder joint and residual flux.

[0004] Because the distance between the connecting plate of SOCKET connector and the PCB board is very small, and the pins of SOCKET connector are very dense, the traditional spray cleaning method is difficult to wash away the residual flux at the lower end of the pins of SOCKET connector by washing with shower. When using the traditional immersion cleaning method, the cleaning liquid is difficult to enter the gap between the low-pitch connecting plate and the PCB board and the gap between the dense pins, so that the residual flux at the lower end of the pins of SOCKET connector is difficult to be effectively cleaned.

[0005] In summary, for the low-pitch and high-precision specific parts of the product, the traditional spray cleaning method and the immersion cleaning method are difficult to achieve effective cleaning effect, so the failure of a component in this specific part of the product often leads to product damage. SUMMARY

[0006] Therefore, it is necessary to provide a cleaning device and a cleaning method for the problem that the traditional spray cleaning method and the immersion cleaning method are difficult to achieve effective cleaning effect for the low-pitch and high-precision specific parts of the product, and the failure of a component in this specific part of the product often leads to product damage.

[0007] A cleaning device for cleaning a to-be-cleaned object, the to-be-cleaned object comprising a first element and a second element arranged in a spaced-apart and opposite manner, the first element being provided with a liquid passage hole, and a spacing space between the first element and the second element being in communication with the liquid passage hole, the first element being provided with a surrounding structure protruding away from the second element;

[0008] The cleaning device comprises a body arranged on a side of the first element away from the second element, the body being capable of sealingly cooperating with the surrounding structure, the body being provided with at least one liquid channel, and a liquid outlet of the liquid channel being arranged on a side of the body facing the first element, the liquid outlet being capable of communicating with the spacing space via the liquid passage hole, so that cleaning liquid flowing out of the liquid outlet can enter the spacing space via the liquid passage hole.

[0009] When the above cleaning device is used to clean the to-be-cleaned object, the body is arranged on a side of the first element away from the second element, cleaning liquid is injected into the liquid channel, and the cleaning liquid flows out of the liquid outlet. Since the body sealingly cooperates with the surrounding structure around the first element, the cleaning liquid can be prevented from flowing away from between the body and the surrounding structure, so that the cleaning liquid flowing out of the liquid outlet can only enter the spacing space via the liquid passage hole and then be discharged from around the spacing space, i.e., the flow path of the cleaning liquid is limited, and the cleaning liquid can effectively flush the interior of the spacing space when flowing along the flow path. In this way, the effect of directly sending the cleaning liquid from the liquid passage hole to the to-be-cleaned part (the spacing space between the first element and the second element) is achieved. Moreover, by continuously injecting the cleaning liquid, flow pressure can be provided for the cleaning liquid, so that the cleaning liquid can flow into the to-be-cleaned part with low spacing and high precision under the action of the flow pressure and be discharged from around the spacing space between the first element and the second element, thereby effectively and directly flushing away dirt in the to-be-cleaned part with low spacing and high precision.

[0010] In an embodiment, the side of the body facing the first element is provided with a plurality of protection structures corresponding to the ends of the pins on the first element away from the second element.

[0011] In the embodiment, when the cleaning device is used, the body is arranged on a side of the first element away from the second element, the protection structures on the body correspond to the pins one by one, and the protection structures abut against the corresponding pins, so that the body can simulate the abutment between the chip and the pins, i.e., simulate the stress state of the pins in actual use, and meanwhile, the abutment between the body and the pins can right the pins, thereby preventing the pins from being skewed under the impact of the cleaning liquid during cleaning.

[0012] In an embodiment, the protection structure is a metal contact. In this embodiment, the protection structure is set as a metal contact, and when the protection structure is in abutment with the pin, the force state of the pin in use can be more truly simulated, so that the pin is not easily damaged. Moreover, the pin is made of metal material, and the metal contact is more matched with the metal pin than the contact made of other materials.

[0013] In an embodiment, the side of the body facing the first element is provided with a protrusion, and the protrusion is used to block the opening on the first element, and the aperture of the opening is larger than the gap between the pins provided on the first element. Thus, the cleaning liquid from the liquid outlet cannot enter the spacing space from the opening, but enters the spacing space from the plurality of mesh holes. Since the plurality of mesh holes are of the same size and arranged uniformly, the cleaning liquid passing through the plurality of mesh holes can enter the spacing space more uniformly, so that a more uniform cleaning effect can be achieved on each position in the spacing space. In this embodiment, the opening cannot be used as a liquid passage hole.

[0014] In an embodiment, the body is provided with a liquid dispersion structure at the liquid outlet, and the liquid dispersion structure is used at the opening on the first element with an inner diameter larger than the mesh hole, and is used to disperse the liquid column from the liquid outlet into a plurality of thinner liquid columns. The liquid column from the liquid outlet is dispersed into a plurality of thinner liquid columns by the liquid dispersion structure. The thinner liquid column is more easily to enter the low-pitch and high-precision position to be cleaned (for example, the gap between the dense pins in the spacing space), so that a better cleaning effect can be achieved.

[0015] In an embodiment, the liquid channel is at least two. When the size of the cleaning object is large, a plurality of (such as two, three, etc.) liquid channels can be provided, and the cleaning liquid can be injected through the plurality of liquid channels at the same time to clean the cleaning object, so as to meet the requirement of cleaning efficiency.

[0016] In an embodiment, the shape of the body is consistent with the shape of the chip used for connection of the chip connector of the cleaning object, so that when the cleaning device is used to clean the cleaning object, the body can be installed to simulate the installation of the chip, the installation is convenient, and the body and the cleaning object are more matched, so that the cleaning object is not easily damaged.

[0017] In an embodiment, the thickness of the body is consistent with the thickness of the chip used for connection of the chip connector of the cleaning object. By making the thickness of the body consistent with the thickness of the chip, the installation of the body can simulate the installation of the chip, and the pressing distance and pressure of the chip mounting seat to the body are substantially equal to the pressing distance and pressure of the chip mounting seat to the chip, so that the damage of the pin caused by the excessive pressing distance and pressure of the pin due to the excessive thickness of the body can be prevented.

[0018] In an embodiment, the body comprises a first part and a second part connected along a thickness direction, the first part is consistent with the thickness of the PCB board of the chip connected with the chip connector of the to-be-cleaned part, and the second part is consistent with the thickness of the heat sink of the chip connected with the chip connector of the to-be-cleaned part. By making the first part consistent with the shape and thickness of the PCB board of the chip and the second part consistent with the shape and thickness of the heat sink of the chip, the body can better simulate the shape and thickness of the chip.

[0019] A cleaning method for equipment failure, comprising the following steps:

[0020] Detecting a failure point of the equipment;

[0021] The liquid outlet of the cleaning device according to any one of the above embodiments is communicated with the interval space through the liquid passage of the to-be-cleaned part at the failure point;

[0022] Injecting cleaning liquid into the liquid passage.

[0023] When the above cleaning method is used to clean the to-be-cleaned part, the body is arranged on the side of the first element away from the second element, cleaning liquid is injected into the liquid passage, and the cleaning liquid flows out of the liquid outlet. Since the body is sealed with the surrounding blocking structure of the first element, the cleaning liquid can be prevented from flowing away from the periphery of the body and the surrounding blocking structure, so that the cleaning liquid can only enter the interval space through the liquid passage and then be discharged from the periphery of the interval space after flowing out of the liquid outlet, that is, the flow path of the cleaning liquid is limited, and the cleaning liquid can effectively flush the interior of the interval space when flowing along the flow path. In this way, the effect of directly sending the cleaning liquid from the liquid passage to the to-be-cleaned part (the interval space between the first element and the second element) is achieved. Moreover, by continuously injecting cleaning liquid, flow pressure can be provided for the cleaning liquid, so that the cleaning liquid can flow into the to-be-cleaned part with low spacing and high precision under the action of the flow pressure and be discharged from the periphery of the interval space between the first element and the second element, thereby effectively and directly flushing away the dirt of the to-be-cleaned part with low spacing and high precision.

[0024] In an embodiment, the step of injecting cleaning liquid into the liquid passage comprises:

[0025] Injecting first cleaning liquid into the liquid passage;

[0026] Injecting second cleaning liquid into the liquid passage, the cleaning power of the second cleaning liquid being stronger than that of the first cleaning liquid.

[0027] When the cleaning liquid is injected, the first cleaning liquid is first injected through the liquid channel to roughly clean the object to be cleaned. Then, the second cleaning liquid with stronger cleaning power is injected through the liquid channel, and the object to be cleaned is cleaned more thoroughly by the second cleaning liquid, so that the object to be cleaned is cleaned thoroughly.

[0028] In an embodiment, the step of injecting the cleaning liquid into the liquid channel includes: after the step of injecting the first cleaning liquid into the liquid channel, and before the step of injecting the second cleaning liquid into the liquid channel, injecting a rinsing liquid into the liquid channel. Thus, the first cleaning liquid in the space between the first element and the second element can be rinsed by the rinsing liquid, and the step is performed after rinsing. Thus, the incompatibility problem caused by the mixing of the second cleaning liquid and the first cleaning liquid can be prevented. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 The structure diagram of the cleaning device of an embodiment.

[0030] Figure 2 The structure diagram of the object to be cleaned of an embodiment.

[0031] Figure 3 The connection relationship diagram of the cleaning device and the object to be cleaned of an embodiment.

[0032] Figure 4 The cleaning principle diagram of the cleaning device to the object to be cleaned of an embodiment.

[0033] BRIEF DESCRIPTION OF DRAWINGS: 100, cleaning device; 110, body; 111, liquid channel; 114, liquid inlet connector; 116, first part; 1161, limiting groove; 117, second part; 1171, boss; 200, object to be cleaned; 210, first element; 211, opening; 212, pin; 2121, soldering point; 213, fence structure; 2131, limiting protrusion; 220, second element; 221, capacitor; 300, chip mounting seat; 301, through hole. DETAILED DESCRIPTION

[0034] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below in combination with the drawings. In the following description, a large number of specific details are set forth in order to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0035] In the description of the application, it should be understood that, if there are these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0036] In addition, if there are these terms "first", "second", these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the application, if the term "multiple" appears, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0037] In this application, unless otherwise explicitly specified and limited, if there are terms such as "mounting", "connecting", "connecting", "fixing" and the like, these terms should be broadly understood. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0038] In this application, unless otherwise explicitly specified and limited, if there are similar descriptions such as "first feature on or under second feature", the meaning can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" of the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" of the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0039] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0040] Please combine Figures 1 to 4 This application provides a cleaning device 100 for cleaning a component 200 to be cleaned. The component 200 includes a first element 210 and a second element 220 spaced apart and opposite to each other. The first element 210 has a liquid passage hole, and the space between the first element 210 and the second element 220 communicates with the liquid passage hole. The first element 210 has a surrounding structure 213 protruding away from the second element 220. The cleaning device 100 includes a body 110, which has at least one liquid channel 111. The body 110 is located on the side of the first element 210 away from the second element 220 and is used to seal against the surrounding structure 213. The outlet of the liquid channel 111 is located on the side of the body 110 facing the first element 210. The outlet communicates with the space through the liquid passage hole, so that cleaning liquid from the outlet can enter the space through the liquid passage hole.

[0041] When the aforementioned cleaning device is used to clean the part 200 to be cleaned, the main body 110 is located on the side of the first element 210 away from the second element 220. Cleaning fluid is injected into the liquid channel 111, and then the cleaning fluid flows out from the outlet. Because the main body 110 and the surrounding enclosure structure 213 of the first element 210 are sealed together, the cleaning fluid is prevented from flowing out between the sides of the main body 110 and the enclosure structure 213. This ensures that after the cleaning fluid flows out from the outlet, it can only enter the spacer through the liquid passage and then exit from the sides of the spacer. This limits the flow path of the cleaning fluid, ensuring that the cleaning fluid can effectively rinse the interior of the spacer when flowing along this path.

[0042] Specifically, the outlet can be oriented towards the through hole, so that the cleaning fluid flowing out of the outlet can flow directly to the through hole on the first element 210. The outlet and the through hole can also be staggered.

[0043] The space between the first element 210 and the second element 220 of the part to be cleaned 200 is a low-pitch, high-precision part of the product. If a traditional spray cleaning method is used, the cleaning liquid can be sprayed onto the exposed parts of the part to be cleaned 200, but it is difficult to clean the space between the first element 210 and the second element 220 of the part to be cleaned 200.

[0044] Compared to traditional spray cleaning methods, the cleaning device described in this application limits the flow path of the cleaning fluid when cleaning the part to be cleaned 200. The cleaning fluid is directly sent into the part to be cleaned (the space between the first element 210 and the second element 220) through the liquid inlet. Under the flow pressure of the cleaning fluid, the cleaning fluid is discharged from the periphery of the space, thereby efficiently and directly rinsing away the dirt from the low-pitch, high-precision part to be cleaned.

[0045] If the traditional immersion cleaning method is used, the part to be cleaned 200 is immersed in the cleaning solution. The space between the first element 210 and the second element 220 is a low-pitch, high-precision part. Due to the surface tension of the cleaning solution, it is difficult for the cleaning solution to flow into the part to be cleaned.

[0046] Compared to traditional spray cleaning methods, the cleaning device described in this application defines the flow path of the cleaning fluid when cleaning the part to be cleaned 200. By continuously introducing the cleaning fluid, a flow pressure can be provided to the cleaning fluid, so that the cleaning fluid can flow into the low-pitch, high-precision part to be cleaned under the action of the flow pressure, and be discharged from the area around the gap between the first element 210 and the second element 220, thereby efficiently and directly rinsing away the dirt from the low-pitch, high-precision part to be cleaned.

[0047] like Figure 1 As shown, in one embodiment, the body 110 is provided with an inlet connector 114 at the inlet of the liquid channel 111 to facilitate connection with the inlet pipe for injection of cleaning fluid.

[0048] In one embodiment, the component to be cleaned 200 can be a connection structure between a chip connector (such as the SOCKET connector mentioned in the background art) and a PCB board: the first element 210 is the connection board of the chip connector, and the second element 220 is the PCB board; a plurality of pins 212 are provided on the connection board, one end of the pin 212 extends to the side of the connection board away from the PCB board, and the other end of the pin 212 extends into the gap space and is soldered to the PCB board.

[0049] The cleaning device described above can send cleaning fluid through the liquid inlet into the space between the connecting plate and the PCB board. Under the flow pressure of the cleaning fluid, the cleaning fluid can wash away the residual flux at the solder joint 2121 where the pin 212 is soldered to the PCB board and discharge it from the periphery of the space.

[0050] For chips in planar grid array (LGA) packages, the connection structure between the chip connector and the PCB board can be used as the part to be cleaned 200, and the cleaning device of this application embodiment can be used for cleaning.

[0051] In other embodiments, the component 200 to be cleaned is not limited to the connection structure between the SOCKET connector and the PCB board, but may also be other chip connectors and PCB board connection structures, or low-pitch, high-precision parts of other products.

[0052] In one embodiment, the body 110 has a plurality of protective structures on the side facing the first element 210, and the protective structures are used to abut against the end of the pin 212 that is away from the second element 220.

[0053] Specifically, in actual use, the chip connector has the chip located on the side of the first element 210 away from the second element 220, and the chip (such as a CPU chip) abuts against the end of the pin 212 away from the second element 220.

[0054] In this embodiment, when the cleaning device 100 is in use, the main body 110 is located on the side of the first element 210 away from the second element 220. The protective structure on the main body 110 corresponds one-to-one with the pin 212. The protective structure abuts against the corresponding pin 212, so that the main body 110 can simulate the chip abutting against the pin 212, that is, simulate the force posture of the pin 212 in actual use. At the same time, the abutting between the main body 110 and the pin 212 plays a role in straightening the pin 212, thereby preventing the pin 212 from tilting under the impact force of the cleaning fluid during cleaning.

[0055] In some embodiments, pin 212 is an elastic pin, and the end of pin 212 opposite to the second element 220 can elastically extend and retract. By abutting the corresponding pin 212 with the protective structure, the extendable end of pin 212 is in a retracted state, which can effectively prevent the extendable end of pin 212 from tilting under the impact force of the cleaning fluid during cleaning.

[0056] In some embodiments, the protective structure is a metal contact. In actual use, when the chip connector contacts the end of pin 212 away from the second element 220, the contact is actually made through the metal contacts on the chip. This embodiment uses a metal contact for the protective structure, which more realistically simulates the stress state of pin 212 during use, thus making pin 212 less prone to damage. Furthermore, since pin 212 is made of metal, the contact between metal contacts and metal pin 212 is a better match than contacts made of other materials.

[0057] In one embodiment, the first element 210 of the chip connector has multiple mesh openings, and multiple pins 212 are correspondingly disposed through the mesh openings (but the pins 212 do not completely block the mesh openings). Therefore, the mesh openings are connected to the space between the first element 210 and the second element 220, and the mesh openings can serve as liquid passages. In this embodiment, at least some of the liquid passages are mesh openings. Cleaning fluid from the outlet can enter the space between the mesh openings.

[0058] like Figure 2 , Figure 4 As shown, in some embodiments, the first element 210 is provided with an opening 211, the inner diameter of which is larger than the gap between adjacent pins 212 on the first element 210. The opening 211 can also serve as a liquid passage. Cleaning fluid from the outlet can enter the spacer through the opening 211.

[0059] like Figure 4 As shown, in some embodiments, a capacitor 221 is provided on the PCB board, and the capacitor 221 is exposed at the opening 211. In this way, when the cleaning fluid enters the space through the opening 211, it can also clean the capacitor 221. Of course, in some products, the capacitor may not be provided at the opening 211.

[0060] In some embodiments, the body 110 has a protrusion on the side facing the first element 210, which blocks the opening 211. This prevents the cleaning fluid from the outlet from entering the spacer through the opening 211, instead allowing it to enter through multiple mesh openings. Since the mesh openings are of similar size and evenly arranged, the cleaning fluid passing through these openings can enter the spacer more evenly, achieving a more uniform cleaning effect at various locations within the spacer. In this embodiment, the opening 211 cannot serve as a liquid passage.

[0061] In some embodiments, the body 110 is provided with a liquid dispersing structure at the liquid outlet. The liquid dispersing structure is used to be disposed at the liquid passage and to disperse the liquid column from the liquid outlet into multiple finer liquid columns.

[0062] Understandably, the cleaning fluid flows into a relatively coarse column when it reaches the outlet. The dispersion structure then disperses the liquid column from the outlet into multiple finer columns. These finer columns can more easily enter the low-pitch, high-precision cleaning locations (such as the gaps between densely packed pins 212 within the space), thus achieving a better cleaning effect.

[0063] Specifically, the liquid dispersion structure protrudes from the side of the body 110 facing the first element 210. The liquid dispersion structure is provided with multiple liquid dispersion holes, which are connected to the liquid outlet, so that the liquid column from the liquid outlet can be dispersed and flow out through the multiple liquid dispersion holes to form multiple finer liquid columns.

[0064] In some embodiments, the liquid dispersion structure is disposed at the opening 211, so that the cleaning liquid entering the space through the opening 211 flows in multiple fine liquid columns, is evenly dispersed and can easily enter the low-pitch, high-precision cleaning position, thereby easily achieving a better cleaning effect.

[0065] Preferably, the periphery of the liquid distribution structure is sealed with the opening 211 to prevent the cleaning fluid from flowing into the space between the liquid distribution structure and the opening 211, so as to ensure that the cleaning fluid entering the space through the opening 211 is in the form of a fine liquid column flowing out from the liquid distribution structure.

[0066] Furthermore, there are multiple liquid outlets, and some of these outlets are equipped with a liquid dispersion structure. That is to say, other outlets are not equipped with a liquid dispersion structure, and these outlets are staggered from the opening 211. The cleaning fluid flowing out from these outlets can flow into the interval space through the mesh.

[0067] In some embodiments, there are at least two liquid channels 111. When the size of the part to be cleaned 200 is large, by setting multiple (e.g., two, three, etc.) liquid channels 111, cleaning fluid can be injected into the part to be cleaned 200 simultaneously through multiple liquid channels 111 to meet the requirements of cleaning efficiency.

[0068] In some embodiments, the shape of the body 110 is consistent with the shape of the chip. Therefore, when the cleaning device is used to clean the part to be cleaned 200, the body 110 can be installed in a manner that simulates the chip installation method, which is convenient for installation and makes the body 110 more compatible with the part to be cleaned 200, and less likely to damage the part to be cleaned 200.

[0069] refer to Figure 3 When in use, the chip is located on the side of the first element 210 opposite to the second element 220, and is mounted via the chip mounting base 300. In this embodiment, by making the shape of the body 110 consistent with the shape of the chip, it is convenient to mount the body 110 via the chip mounting base 300 during cleaning.

[0070] Further, refer to Figure 2 and Figure 4 The first element 210 has a surrounding structure 213 protruding in a direction away from the second element 220. When the chip is used to connect to the PCB board via a chip connector, the chip is seamlessly embedded within the enclosure space of the surrounding structure 213.

[0071] In this embodiment, the body 110 has the same shape as the chip, so that the body 110 can be embedded in the enclosure space of the enclosure structure 213, and the four sides of the body 110 are sealed to the inner circumferential surface of the enclosure structure 213. In this way, the cleaning fluid can be prevented from flowing out from the four sides of the body 110, so that the cleaning fluid can only enter the spacer through the liquid passage after flowing out from the outlet, and then be discharged from the four sides of the spacer. This limits the flow path of the cleaning fluid and ensures that the cleaning fluid can effectively rinse the inside of the spacer when flowing along this flow path.

[0072] refer toFigure 3 The chip mounting base 300 has a through hole 301 in the middle. (Reference) Figure 1 In one embodiment, the body 110 has a boss 1171 extending circumferentially therefrom. When the body 110 is installed, a through hole 301 protrudes from the side of the body 110 away from the pin 212. The side of the boss 1171 away from the pin 212 is abutted by the chip mounting base 300, which is fixed to the PCB board by bolts or other means. Thus, one side of the body 110 is supported by the pin 212, while the side of the boss 1171 away from the pin 212 is subjected to pressure from the chip mounting base 300, thereby achieving the installation and positioning of the body 110.

[0073] In one embodiment, the thickness of the body 110 is the same as the thickness of the chip. In actual use, one side of the chip is supported by the pin 212, and the side of the protrusion on the chip away from the pin 212 is subjected to pressure from the chip mounting base 300, thereby achieving the installation and positioning of the chip.

[0074] In this embodiment, by making the thickness of the body 110 the same as the thickness of the chip, the installation of the chip can be simulated when the body 110 is installed. The pressing distance and pressure of the chip mounting base 300 on the body 110 are approximately equal to its pressing distance and pressure on the chip, thereby preventing the body 110 from being too thick and causing excessive pressing distance and pressure on the pin 212, which would lead to pin damage.

[0075] Please refer to Figure 1 In one embodiment, the body 110 includes a first portion 116 and a second portion 117 connected along the thickness direction. The first portion 116 has the same shape and thickness as the PCB board of the chip, and the second portion 117 has the same shape and thickness as the heat sink of the chip. The first portion 116 and the second portion 117 can be connected by means of bonding or the like.

[0076] Specifically, the chip includes a PCB board and a heat sink connected along the thickness direction. By having the first part 116 consistent with the shape and thickness of the PCB board of the chip, and the second part 117 consistent with the shape and thickness of the heat sink of the chip, the body 110 can better simulate the shape and thickness of the chip.

[0077] When the cleaning device 100 is actually used, the first part 116 is embedded in the enclosure space of the enclosure structure 213.

[0078] like Figure 1 As shown, the boss 1171 is located around the second part 117. The first part 116 protrudes from the second part 117.

[0079] Please combine Figure 1 and Figure 2In one embodiment, a limiting protrusion 2131 is provided on the inner side of the enclosure structure 213, and a limiting groove 1161 is provided on the outer edge of the body 110. When the body 110 is embedded in the enclosure space of the enclosure structure 213, the limiting protrusion 2131 and the limiting groove 1161 cooperate to limit the body 110. Specifically, the limiting groove 1161 is provided on the outer edge of the first part 116.

[0080] One embodiment of this application also provides a cleaning method for equipment malfunctions, comprising the following steps:

[0081] S10: Detection of fault locations in the equipment.

[0082] The equipment is, for example, a server. If a malfunction is detected, the fault location can be checked. It can be determined whether the malfunction is due to the presence of a component 200 that needs cleaning. If so, step S20 is executed.

[0083] The fault locations of the detection equipment can be detected using existing technologies, so this will not be elaborated further.

[0084] In other embodiments, the equipment may not be a server, but may be other products in the prior art.

[0085] S20: Connect the liquid outlet of the cleaning device in any one of the above embodiments to the spacer via the liquid passage of the component to be cleaned at the fault location.

[0086] S30: Inject cleaning fluid into the liquid channel.

[0087] In steps S20 and S30, the cleaning device described in any of the above embodiments is used to clean the component 200 at the fault location.

[0088] When the above-described cleaning method is used to clean the part 200 to be cleaned, the main body 110 is located on the side of the first element 210 away from the second element 220. Cleaning fluid is injected into the liquid channel 111, and the cleaning fluid flows out from the outlet. Since the main body 110 and the surrounding enclosure structure 213 of the first element 210 are sealed together, the cleaning fluid is prevented from flowing out between the periphery of the main body 110 and the enclosure structure 213. This ensures that after the cleaning fluid flows out from the outlet, it can only enter the spacer through the liquid passage hole and then be discharged from the periphery of the spacer. This limits the flow path of the cleaning fluid and ensures that the cleaning fluid can effectively rinse the interior of the spacer when it flows along this flow path. In this way, the cleaning fluid is directly delivered from the fluid inlet into the part to be cleaned (the space between the first element 210 and the second element 220); moreover, by continuously introducing the cleaning fluid, a flow pressure can be provided to the cleaning fluid, so that the cleaning fluid can flow into the low-pitch, high-precision part to be cleaned under the action of the flow pressure, and be discharged from the periphery of the space between the first element 210 and the second element 220, thereby efficiently and directly rinsing away the dirt from the low-pitch, high-precision part to be cleaned.

[0089] In one embodiment, step S30 includes:

[0090] S31: Inject the first cleaning fluid into the liquid channel;

[0091] S32: Inject a second cleaning fluid into the liquid channel. The cleaning power of the second cleaning fluid is stronger than that of the first cleaning fluid.

[0092] Specifically, in this embodiment, the number of liquid channels 111 is at least two, including a first liquid channel and a second liquid channel. When injecting the cleaning fluid, the first cleaning fluid is first injected through the first liquid channel to roughly clean the part 200 to be cleaned. Then, a second cleaning fluid with stronger cleaning power is injected into the second liquid channel for deeper cleaning, thereby ensuring that the part 200 to be cleaned achieves a thorough cleaning effect.

[0093] In one embodiment, the number of liquid channels 111 is at least three, including a third liquid channel. If the first cleaning liquid and the second cleaning liquid are two incompatible cleaning liquids, a rinsing step can be added after step S31 and before step S32: rinsing liquid is injected into the third liquid channel, thereby rinsing the first cleaning liquid in the space between the first element 210 and the second element 220. Step S32 is then performed after rinsing, thus preventing incompatibility problems caused by mixing of the second and first cleaning liquids.

[0094] Moreover, since the second cleaning fluid is injected through the second liquid channel, only the first cleaning fluid in the space between the first element 210 and the second element 220 needs to be rinsed, and the second cleaning fluid can be injected without rinsing the first liquid channel, thus improving cleaning efficiency.

[0095] In other embodiments, the number of liquid channels 111 can also be one. First, a first cleaning solution is injected into the liquid channel 111 for preliminary cleaning, and then a second cleaning solution is injected into the liquid channel 111 for deeper cleaning. Furthermore, after injecting the first cleaning solution, a rinsing solution can be injected into the liquid channel 111 for rinsing, and then the second cleaning solution can be injected. This can also prevent incompatibility problems caused by mixing the second cleaning solution and the first cleaning solution.

[0096] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A cleaning device for cleaning a part to be cleaned, the part to be cleaned comprising a first element and a second element arranged at intervals and opposite to each other, the first element having a liquid passage hole, the space between the first element and the second element communicating with the liquid passage hole, and the first element having a surrounding structure protruding in a direction away from the second element. Its features are, The cleaning device includes a body disposed on the side of the first element away from the second element. The body is capable of sealing with the enclosure structure. The body is provided with at least one liquid channel. The outlet of the liquid channel is located on the side of the body facing the first element. The outlet can communicate with the partition space through the liquid passage hole, so that the cleaning liquid flowing out from the outlet can enter the partition space through the liquid passage hole and flow out from the periphery of the partition space. The shape of the body is consistent with the shape of the chip that the chip connector of the part to be cleaned is used to connect to.

2. The cleaning device according to claim 1, characterized in that, The body has multiple protective structures on the side facing the first element, and the protective structures are used to abut against the end of the pin on the first element that is away from the second element.

3. The cleaning device according to claim 1, characterized in that, The body has a protrusion on the side facing the first element, the protrusion being used to block the opening on the first element, the diameter of the opening being larger than the gap between adjacent pins on the first element. The liquid passage includes a plurality of mesh holes disposed on the first element.

4. The cleaning device according to claim 1, characterized in that, The body is provided with a liquid dispersion structure at the liquid outlet. The liquid dispersion structure is used to be disposed at the opening on the first element and to disperse the liquid column from the liquid outlet into multiple finer liquid columns. The diameter of the opening is larger than the gap between adjacent pins on the first element; the liquid passage includes the opening.

5. The cleaning device according to claim 1, characterized in that, The thickness of the body is the same as the thickness of the chip that the chip connector of the part to be cleaned is used to connect to.

6. The cleaning apparatus according to claim 1, characterized in that, The body includes a first part and a second part connected along the thickness direction. The thickness of the first part is consistent with the thickness of the PCB board of the chip for which the chip connector of the component to be cleaned is used to connect, and the thickness of the second part is consistent with the thickness of the heat sink of the chip for which the chip connector of the component to be cleaned is used to connect.

7. A cleaning method for resolving equipment malfunctions, characterized in that, Includes the following steps: Detect the fault location of the equipment; The liquid outlet of the cleaning device according to any one of claims 1 to 6 is connected to the spacer via the liquid passage of the component to be cleaned at the fault location; Inject cleaning fluid into the liquid channel.

8. The cleaning method according to claim 7, characterized in that, The step of injecting cleaning fluid into the liquid channel includes: Inject the first cleaning solution into the liquid channel; A second cleaning solution is then injected into the liquid channel. The cleaning power of the second cleaning solution is stronger than that of the first cleaning solution.

9. The cleaning method according to claim 8, characterized in that, The step of injecting cleaning fluid into the liquid channel includes: injecting rinsing fluid into the liquid channel after the step of injecting the first cleaning fluid into the liquid channel and before the step of injecting the second cleaning fluid into the liquid channel.

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