A base platform LED plane support

Abstract

The application belongs to a base pedestal LED plane support. The base pedestal LED plane support comprises a base body, a pedestal arranged below the base body, and a glue injection packaging hole communicated with the top surface of the pedestal arranged on the base body. The top surface of the pedestal is formed into a circuit arrangement area by the bottom of the glue injection packaging hole. The small-size glue injection packaging hole can reduce the contact area of the packaging glue with the base hardware and PPA, improve the moisture sensitivity level of the product, reduce the abnormal proportion of the poor consistency of the glue surface caused by the overflow of the surface glue to the edge of the cup opening, improve the consistency of the glue surface, reduce the glue consumption by 60%, and thus reduce the product cost. The wall thickness of the base is increased, the proportion of the uneven base of the hardware solder pad is reduced, the wire bonding quality and the porcelain nozzle life are improved.

Description

[Technical Field]

[0001] This invention relates to the field of lighting bracket technology, and more particularly to a base-mounted LED planar bracket. [Background Technology]

[0002] Traditional planar LED brackets typically have a base that accounts for over 80% of the total product's dimensions on one side. This design results in an excessively large contact area between the metal sheets, PPA material, and encapsulating adhesive on the bracket base, leading to a relatively high amount of adhesive used. The significant difference in the expansion coefficients between the metal sheets and the encapsulating adhesive results in poor moisture sensitivity. Furthermore, after prolonged exposure to air, the structure is more prone to delamination between the adhesive and the bracket. External moisture penetrates the base through a shorter path to the metal sheets and chips, and the electrolysis caused by moisture under energized conditions leads to metal migration, thus reducing the lifespan of the LED chips. [Summary of the Invention]

[0003] To address the aforementioned issues, this invention proposes a base-mounted LED planar support, which reduces the contact area between the encapsulation adhesive and the base metal sheet and PPA, thereby improving the product's moisture sensitivity rating.

[0004] This invention is achieved by the following technical solution:

[0005] A base-mounted LED planar support includes a base body, a support frame is provided below the base body, and a glue injection and encapsulation hole is provided on the base body and communicates with the top surface of the support frame; the top surface of the support frame is surrounded by the bottom of the glue injection and encapsulation hole to form a circuit arrangement area.

[0006] As described above, a base is used to form an LED planar support, wherein the upper part of the base body is provided with stepped holes to prevent glue overflow.

[0007] As described above, the base is used to form an LED planar support, and the stepped hole and the glue injection and encapsulation hole are respectively provided with a first inclined hole wall and a second inclined hole wall to prevent glue overflow.

[0008] As described above, in a base forming an LED planar support, a first plane is connected between the upper end of the first inclined hole wall and the periphery of the base body; a second plane is connected between the upper end of the second inclined hole wall and the lower end of the first inclined hole wall.

[0009] As described above, in a base-type LED planar support, the first inclined hole wall surrounds the stepped hole, and the second inclined hole wall surrounds the encapsulation hole.

[0010] As described above, in a base assembly LED planar support, the first plane surrounds the stepped hole; the second plane surrounds the injection encapsulation hole.

[0011] As described above, in a base-type LED planar support, the thickness of the upper part of the base body is less than the thickness of the lower part.

[0012] As described above, a base-type LED planar support is provided with a discontinuous strip dividing the circuit arrangement area into a first circuit arrangement area, a second circuit arrangement area, a third circuit arrangement area, and a fourth circuit arrangement area.

[0013] As described above, a base is used to form an LED planar support, wherein electronic components for connecting circuits are arranged on the circuit layout area; and chips for connecting circuits are provided on the circuit layout area.

[0014] As described above, a base is used to form an LED planar support, wherein the base body is fixedly connected to the platform.

[0015] Compared with the prior art, the present invention has the following advantages:

[0016] This invention proposes a base-mounted LED planar support. The base size is reduced from over 80% of one side's dimensions to less than 60%, decreasing the contact area between the encapsulating adhesive and the base metal sheet and PPA, thus improving the product's moisture sensitivity rating. Increasing the base wall thickness extends the moisture intrusion path, further enhancing product reliability. Furthermore, the increased base wall thickness reduces the unevenness of the metal solder pads, improving wire bonding quality and nozzle lifespan. The base employs a double-step design, with a thinner upper wall, reducing the proportion of adhesive overflow to the cup edge that leads to poor adhesive surface consistency, thus improving overall adhesive surface uniformity. [Attached Image Description]

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0018] Figure 1 This is a top view of the structure of the present invention;

[0019] Figure 2 This is a cross-sectional structural diagram of the present invention;

[0020] Figure 3 This is a cross-sectional structural diagram of the present invention, which includes electronic components.

Detailed Implementation Methods

[0021] To make the technical problems solved, the technical solutions, and the beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0022] Specific embodiments, such as Figures 1 to 3 The diagram shows a base-mounted LED planar support, comprising a base body 1, a support frame 3 for supporting the base body 1, and a glue injection and encapsulation hole 2 communicating with the top surface of the support frame 3; the top surface of the support frame 3 is surrounded by the glue injection and encapsulation hole 2 to form a circuit arrangement area 10.

[0023] Furthermore, as a preferred embodiment of this solution and not a limitation thereof, the upper part of the base body 1 is provided with a stepped hole 4 to prevent glue overflow.

[0024] In this implementation case, the size of the encapsulation hole was reduced from more than 80% of the single-sided size to less than 60% of the single-sided size. This reduces the contact area between the encapsulation adhesive and the base metal sheet and PPA, improving the product's moisture sensitivity level. The stepped hole also reduces the abnormal proportion of adhesive overflow to the edge of the cup, which leads to poor adhesive surface consistency, thus improving adhesive surface consistency.

[0025] Furthermore, as a preferred embodiment of this solution and not a limitation thereof, the stepped hole 4 and the glue injection and encapsulation hole 2 are respectively provided with a first inclined hole wall 41 and a second inclined hole wall 42 to prevent glue overflow.

[0026] In this implementation case, tilting the hole wall reduces the abnormal proportion of adhesive overflow to the edge of the cup, which leads to poor adhesive surface consistency, and improves adhesive surface consistency.

[0027] Furthermore, as a preferred embodiment of this solution and not a limitation thereof, a first plane 51 is connected between the upper end of the first inclined hole wall 41 and the periphery of the base body 1; a second plane 52 is connected between the upper end of the second inclined hole wall 42 and the lower end of the first inclined hole wall 41.

[0028] In this implementation case, the inclined hole wall and the connecting plane reduce the abnormal proportion of surface glue overflow to the edge of the cup, which leads to poor glue surface consistency, and improve glue surface consistency.

[0029] Furthermore, as a preferred embodiment of this solution and not a limitation thereof, the first inclined hole wall 41 surrounds the stepped hole 4, and the second inclined hole wall 42 surrounds the injection encapsulation hole 2.

[0030] In this implementation case, the inclined hole wall is surrounded to comprehensively improve the consistency of the adhesive surface.

[0031] Furthermore, as a preferred embodiment of this solution and not a limitation thereof, the first plane 51 surrounds the stepped hole 4; the second plane 52 surrounds the injection encapsulation hole 2.

[0032] In this implementation case, the planar surround setting comprehensively improves the consistency of the adhesive surface.

[0033] Furthermore, as a preferred embodiment of this solution and not a limitation, the thickness of the upper part of the base body 1 is less than the thickness of the lower part.

[0034] In this implementation case, the thickness of the lower part of the base body is increased to extend the moisture intrusion path and improve the humidity sensitivity level.

[0035] Furthermore, as a preferred embodiment of this solution and not a limitation, the circuit arrangement area 10 is provided with a discontinuity band 11 dividing the circuit arrangement area 10, and the circuit arrangement area 10 is divided into a first circuit arrangement area 101, a second circuit arrangement area 102, a third circuit arrangement area 103, and a fourth circuit arrangement area 104.

[0036] In this implementation case, the circuit layout area is reasonably divided into discontinuous zones.

[0037] Furthermore, as a preferred embodiment of this solution and not a limitation, the circuit layout area 10 is provided with electronic components 12 for connecting circuits; the circuit layout area 10 is provided with chips 7 for connecting circuits.

[0038] In this implementation, electronic components and chips are used to connect the circuit.

[0039] Furthermore, as a preferred embodiment of this solution and not a limitation, the base body 1 is fixedly connected to the platform 3.

[0040] In this implementation case, the base body is fixedly connected to the platform, improving the overall integrity of the device.

[0041] The working principle of this implementation case is as follows:

[0042] This invention provides a base for forming an LED planar support. Electronic components are welded onto the platform surface where the glue injection and encapsulation holes communicate with the platform. When the manufacturer injects glue into the glue injection and encapsulation holes, when the glue injection and encapsulation holes are filled with glue and overflows, a second plane can prevent the overflowing glue from flowing out. When the glue continues to flow out of the second plane, a first inclined hole wall can prevent the glue from overflowing. When the glue overflows from the first inclined hole wall, the first plane can continue to prevent the glue from flowing out.

[0043] The above description is one embodiment provided in conjunction with specific content, and does not imply that the specific implementation of the present invention is limited to these descriptions. Furthermore, due to differences in industry naming conventions, the invention is not limited to the above names or English names. Any methods or structures similar to or identical to those of the present invention, or any technical deductions or substitutions made based on the concept of the present invention, should be considered within the scope of protection of the present invention.

Claims

1. A base-mounted LED planar support, characterized in that: The system includes a base body (1), and a support frame (3) is provided below the base body (1). The base body (1) is provided with a glue injection and encapsulation hole (2) that communicates with the top surface of the support frame (3). The top surface of the support frame (3) is surrounded by the bottom of the glue injection and encapsulation hole (2) to form a circuit arrangement area (10). The upper part of the base body (1) is provided with a stepped hole (4) to prevent glue from overflowing. The stepped hole (4) is provided with a first inclined hole wall (41) to prevent glue overflow, and the glue injection and sealing hole (2) is provided with a second inclined hole wall (42) to prevent glue overflow. A first plane (51) is connected between the upper end of the first inclined hole wall (41) and the outer wall of the base body (1); a second plane (52) is connected between the upper end of the second inclined hole wall (42) and the lower end of the first inclined hole wall (41). The first inclined hole wall (41) surrounds the stepped hole (4) for one circumference, and the second inclined hole wall (42) surrounds the injection encapsulation hole (2) for one circumference; The first plane (51) surrounds the stepped hole (4) for one circumference; the second plane (52) surrounds the injection encapsulation hole (2) for one circumference; The thickness of the upper part of the base body (1) is less than the thickness of the lower part.

2. The base-mounted LED planar support according to claim 1, characterized in that: The circuit arrangement area (10) is provided with a discontinuous band (11) that divides the circuit arrangement area (10). The circuit arrangement area (10) is divided into a first circuit arrangement area (101), a second circuit arrangement area (102), a third circuit arrangement area (103), and a fourth circuit arrangement area (104).

3. The base-mounted LED planar support according to claim 2, characterized in that: The circuit layout area (10) is provided with electronic components (12) for connecting circuits; the circuit layout area (10) is provided with chips (7) for connecting circuits.

4. The base-mounted LED planar support according to claim 1, characterized in that: The base body (1) is fixedly connected to the platform (3).

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