A cooling system, polishing equipment and polishing system for heavy silicon carbide wafer processing

Abstract

The present invention relates to a cooling system, a polishing device and a polishing system for heavy silicon carbide wafer processing, wherein the cooling system comprises a main unit, a liquid storage unit, a first cooling unit, a second cooling unit, a third cooling unit and an electronic control unit. The advantages of the cooling system are that by arranging the first cooling unit on the polishing disc and connecting the first cooling unit with the liquid storage unit, the polishing disc can be cooled, thereby preventing the polishing disc from being overheated during operation and affecting the polishing accuracy; by arranging the second cooling unit on the pipeline connecting the liquid storage unit and the polishing device, the second cooling unit can further cool the polishing liquid in the pipeline; by arranging the third cooling unit on the polishing device, the polishing pad can be cooled by compressed air, thereby ensuring the polishing accuracy of the polishing device operation.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip manufacturing, and in particular to a cooling system, polishing equipment, polishing system and polishing system for heavy silicon carbide wafer processing. Background Art

[0002] In the field of chemical mechanical polishing technology, the wafer is clamped at the lower end of a rotating polishing head, a polishing pad is provided at the upper end of the rotating polishing disk, and polishing liquid is provided between the wafer on the polishing head and the polishing pad. Under the combined action of chemistry and mechanics, the wafer is globally flattened.

[0003] The traditional chemical mechanical polishing processing equipment and methods for silicon carbide wafers are mainly the following: the first process route is to use batch polishing equipment for processing 8-inch and smaller silicon wafers for single-sided polishing; the second process route is to use double-sided polishing equipment to polish both sides of the silicon carbide wafer at the same time; the third process route is to use a CMP device similar to the chip segment to clamp the wafer and use high pressure for processing.

[0004] For the above chemical mechanical polishing, there are the following defects:

[0005] 1. The first type of processing equipment is suitable for polishing silicon wafers. The power and rigid structure of this type of equipment are suitable for the polishing process and conditions of silicon wafers, but cannot effectively meet the long-term and high-intensity polishing process requirements of silicon carbide wafers. Using this type of equipment to polish silicon carbide wafers will lead to problems such as low polishing efficiency, high polishing track repetition leading to deterioration of polishing accuracy, and high polishing processing costs.

[0006] 2. Although the second type of processing equipment can process both sides of the wafer at the same time, and the planetary motion can produce a repeating lower trajectory to effectively achieve processing accuracy, the efficiency of the double-sided polishing process is limited by the strength of the planetary wheel, resulting in the inability to use high pressure and high strength to improve the polishing efficiency in the double-sided polishing process of silicon carbide wafers. At the same time, the double-sided polishing process has problems such as high risk of fragmentation, high maintenance cost, and large equipment investment.

[0007] 3. The third type of processing equipment uses a CMP device with airbag pressurization to complete the single-wafer polishing processing of the wafer. The processing pressure can reach 7PSI, which is far higher than the 3-4PSI pressure commonly used in silicon wafer processing, thereby achieving high-efficiency silicon carbide polishing processing. However, the problem with the application of this equipment and process to silicon carbide wafer polishing is that the equipment investment cost is huge, far higher than traditional single-sided or double-sided polishing equipment. Although the wafer polishing time is short, compared with batch-type polishing equipment, the single-wafer cycle of this equipment for polishing silicon carbide wafers is too long. At the same time, the cost of special accessories or auxiliary materials used in this equipment is also very high, which is not suitable for mass production of silicon carbide substrates.

[0008] At present, there is no effective solution to the problems existing in the relevant technology, such as poor heat dissipation of polishing equipment, low polishing efficiency, high polishing track repetition resulting in deteriorated polishing accuracy, and high polishing processing cost. Summary of the invention

[0009] The purpose of the present invention is to address the deficiencies in the prior art and provide a cooling system, polishing equipment and polishing system for heavy silicon carbide wafer processing, so as to solve the problems existing in the related art such as low polishing efficiency, high polishing track repetition leading to deteriorated polishing accuracy, and high polishing processing cost.

[0010] To achieve the above object, the technical solution adopted by the present invention is:

[0011] In a first aspect, the present invention provides a cooling system for heavy silicon carbide wafer processing, comprising:

[0012] A main unit, wherein the main unit is used to install components;

[0013] A liquid storage unit, which is arranged on the main unit and is used to store polishing liquid and cooling liquid;

[0014] a first cooling unit, which is disposed on a polishing disk of the polishing device and is connected to the liquid storage unit and is used to cool the polishing disk;

[0015] A second cooling unit, the second cooling unit is disposed in a pipeline connecting the liquid storage unit and the polishing device, and is connected to the liquid storage unit, and is used to cool the polishing liquid;

[0016] a third cooling unit, the third cooling unit being disposed in the polishing device and being in communication with the air compressor, and being used for cooling the polishing pad mounted on the polishing plate;

[0017] An electric control unit is arranged in the main unit and is respectively connected to the first cooling unit, the second cooling unit and the third cooling unit, and is used to control the first cooling unit, the second cooling unit and the third cooling unit.

[0018] In some embodiments, the liquid storage unit comprises:

[0019] a first liquid storage element, which is disposed in the main body unit and communicated with the second cooling unit, and is used for storing polishing liquid and supplying polishing liquid to the second cooling unit;

[0020] The second liquid storage element is disposed on the main unit and communicated with the first cooling unit, and is used for storing cooling liquid and supplying cooling liquid to the first cooling unit.

[0021] In some embodiments, the liquid storage unit further comprises:

[0022] The first pump body element is arranged inside the first liquid storage element and is connected to the first cooling unit for pumping the polishing liquid.

[0023] In some embodiments, the liquid storage unit comprises:

[0024] a second pump element, the second pump element being disposed inside the second liquid storage element and being in communication with the second cooling unit and being used for pumping cooling liquid;

[0025] a first communicating pipe element, wherein a first end of the first communicating pipe element is in communication with the second pump body element;

[0026] a first cooling coil element, wherein the first cooling coil element is coiled and arranged on a side wall of the first liquid storage element, and a first end of the first cooling coil element is connected to a second end of the first connecting pipe element;

[0027] a heat exchange element, the heat exchange element being disposed in the main unit and being in communication with the second end of the first cooling coil element;

[0028] a second communicating pipe element, wherein a first end of the second communicating pipe element is in communication with the heat exchange element, and a second end of the second communicating pipe element is in communication with a second liquid storage element;

[0029] A first valve element is provided at the first communicating pipeline element and the second communicating pipeline element, and is used to control the flow of the first communicating pipeline element and the second communicating pipeline element.

[0030] In some embodiments, the first cooling unit comprises:

[0031] A first cooling element, which is disposed at the bottom of the polishing plate and connected to the polishing plate and is used for mounting parts;

[0032] a first cooling line element, wherein a first end of the first cooling line element is in communication with the liquid storage unit and is used for conveying cooling liquid;

[0033] a second cooling coil element, which is disposed on the first cooling element and communicates with the second end of the first cooling pipeline element and is used to cool the polishing disc;

[0034] A second valve element is disposed on the first cooling circuit element and is used to control the flow of the first cooling circuit element.

[0035] In some embodiments, the second cooling unit comprises:

[0036] a second cooling element, the second cooling element being disposed in a pipeline connecting the liquid storage unit and the polishing device and being in communication with the liquid storage unit;

[0037] a third cooling coil element, the third cooling coil element being coiled inside the second cooling element and being in communication with the liquid storage unit for cooling the polishing liquid;

[0038] a second cooling pipeline element, the second cooling pipeline element being connected to the third cooling coil element and the liquid storage unit respectively;

[0039] A third valve element is disposed on the second cooling circuit element and is used to control the flow of the second cooling circuit element.

[0040] In some embodiments, the third cooling unit comprises:

[0041] at least one third cooling element, the third cooling element being disposed in the polishing device and being in communication with the air compressor for storing compressed air;

[0042] A plurality of air nozzle elements, each of which is connected to the third cooling element and is used for blowing gas to the polishing pad;

[0043] A plurality of third cooling pipeline elements, wherein the plurality of third cooling pipeline elements respectively connect the corresponding air nozzle elements with the third cooling elements, and connect the third cooling elements with an air compressor for conveying gas.

[0044] In a second aspect, the present invention further provides a polishing device for heavy silicon carbide wafer processing, connected to the cooling system described in the first aspect, comprising:

[0045] A box unit, wherein the box unit is used to install components;

[0046] A horizontal moving unit, wherein the horizontal moving unit is arranged on the box unit;

[0047] A vertical moving unit, which is arranged on the horizontal moving unit and reciprocates in a horizontal direction under the action of the horizontal moving unit;

[0048] A pressure plate unit is disposed on the vertical moving unit and reciprocates in a vertical direction under the action of the vertical moving unit to apply pressure to the silicon carbide wafer placed on the polishing pad.

[0049] In some of the embodiments, the horizontal moving unit comprises:

[0050] A plurality of slide rail elements, wherein the plurality of slide rail elements are arranged on the box unit;

[0051] A plurality of slider elements, wherein the plurality of slider elements are disposed on the slide rail element and are slidably connected with the slide rail element;

[0052] A supporting element, the supporting element being disposed on the top of the slider element and used for mounting the vertical moving unit and the pressure plate unit;

[0053] A first driving element is disposed on the box unit and connected to the supporting element, and is used for driving the supporting element to reciprocate on the slide rail element.

[0054] In some of the embodiments, the vertical movement unit comprises:

[0055] a telescopic connection element, the telescopic connection element being vertically disposed on the horizontal moving unit and connected to the pressure plate unit;

[0056] A second driving element is disposed on the horizontal moving unit and connected to the telescopic connecting element, and is used for driving the telescopic connecting element to reciprocate and extend.

[0057] In some of the embodiments, the pressure plate unit comprises:

[0058] A pressure plate element, which is disposed at the end of the vertical moving unit and reciprocates in the vertical direction under the action of the vertical moving unit, and is used for installing parts;

[0059] A plurality of pressure applying elements are arranged on the pressure plate element and spaced apart along the circumference of the pressure plate element, and are used to apply pressure to the silicon carbide wafer placed on the polishing pad.

[0060] In a third aspect, a polishing system for heavy silicon carbide wafer processing is provided, comprising:

[0061] The cooling system according to the first aspect;

[0062] A polishing device as described in the second aspect.

[0063] The present invention adopts the above technical solution, and has the following technical effects compared with the prior art:

[0064] The present invention provides a cooling system, polishing equipment and polishing system for heavy silicon carbide wafer processing. A first cooling unit is arranged on the polishing disc and the first cooling unit is connected to a liquid storage unit, so that the polishing disc can be cooled, thereby preventing the polishing disc from being overheated during operation and affecting the polishing accuracy; a second cooling unit is arranged on a pipeline connecting the liquid storage unit and the polishing equipment, so that the second cooling unit can further cool the polishing liquid in the pipeline; a third cooling unit is arranged on the polishing equipment, and the polishing pad is cooled by compressed air, so that the polishing accuracy of the polishing equipment operation can be guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] Figure 1 is a schematic diagram of a cooling system according to an embodiment of the present invention;

[0066] Figure 2 is a schematic diagram of a liquid storage unit according to an embodiment of the present invention;

[0067] Figure 3 is a schematic diagram of a first cooling unit according to an embodiment of the present invention;

[0068] Figure 4 is a schematic diagram of a second cooling unit according to an embodiment of the present invention;

[0069] Figure 5 is a schematic diagram of a third cooling unit according to an embodiment of the present invention (I);

[0070] Figure 6 is a schematic diagram of a third cooling unit according to an embodiment of the present invention (II);

[0071] Figure 7 is a schematic diagram of a third cooling unit according to an embodiment of the present invention (III);

[0072] Figure 8 is a schematic diagram of a polishing device according to an embodiment of the present invention;

[0073] Fig. 9 is a schematic diagram of a horizontal moving unit according to an embodiment of the present invention;

[0074] Fig.10 is a schematic diagram of a vertical moving unit according to an embodiment of the present invention;

[0075] Fig.11 is a schematic diagram of a pressure plate unit according to an embodiment of the present invention;

[0076] Fig.12 is a schematic diagram of a polishing system according to an embodiment of the present invention.

[0077] The reference numerals are: 100, main body unit;

[0078] 200, liquid storage unit; 210, first liquid storage element; 220, second liquid storage element; 230, first pump element; 240, second pump element; 250, first cooling coil element; 260, heat exchange element;

[0079] 300, first cooling unit; 310, first cooling element; 320, second cooling coil element;

[0080] 400, second cooling unit; 410, second cooling element; 411, first liquid inlet; 412, first liquid outlet; 413, second liquid inlet; 414, second liquid outlet;

[0081] 500, third cooling unit; 510, third cooling element; 511, air inlet; 512, air outlet; 513, cooling chamber; 520, air nozzle element;

[0082] 600, electronic control unit;

[0083] 700, cabinet unit;

[0084] 800, horizontal moving unit; 810, slide rail element; 820, slider element; 830, supporting element; 840, first driving element;

[0085] 900, vertical moving unit; 910, telescopic connecting element; 920, second driving element;

[0086] 1000, pressure plate unit; 1010, pressure plate element; 1020, pressure applying element;

[0087] 1100, first cooling equipment;

[0088] 1200. Second cooling equipment. DETAILED DESCRIPTION

[0089] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is described and illustrated below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. Based on the embodiments provided in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0090] Obviously, the drawings described below are only some examples or embodiments of the present application. For ordinary technicians in this field, the present application can also be applied to other similar scenarios based on these drawings without creative work. In addition, it can also be understood that although the efforts made in this development process may be complicated and lengthy, for ordinary technicians in this field related to the content disclosed in this application, some changes in design, manufacturing or production based on the technical content disclosed in this application are just conventional technical means, and should not be understood as insufficient content disclosed in this application.

[0091] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those of ordinary skill in the art that the embodiments described in this application may be combined with other embodiments without conflict.

[0092] Unless otherwise defined, the technical terms or scientific terms involved in this application should be understood by people with ordinary skills in the technical field to which this application belongs. The words "one", "a", "a", "the" and the like involved in this application do not indicate a quantitative limitation, and may represent the singular or plural. The terms "include", "comprise", "have" and any of their variations involved in this application are intended to cover non-exclusive inclusions; for example, a process, method, system, product or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units that are not listed, or may also include other steps or units inherent to these processes, methods, products or devices. The words "connect", "connected", "coupled" and the like involved in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The "multiple" involved in this application refers to two or more. "And / or" describes the association relationship of associated objects, indicating that there may be three relationships, for example, "A and / or B" can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the objects before and after are in an "or" relationship. The terms "first", "second", "third", etc. involved in this application are only used to distinguish similar objects and do not represent a specific ordering of the objects.

[0093] Example 1

[0094] This embodiment relates to a cooling system of the present invention.

[0095] like Figure 1 , Figure 3 , Figure 4 , Figure 5 As shown, a cooling system for heavy silicon carbide wafer processing includes a main unit 100, a liquid storage unit 200, a first cooling unit 300, a second cooling unit 400, a third cooling unit 500 and an electronic control unit 600. Among them, the main unit 100 is used to install parts; the liquid storage unit 200 is arranged on the main unit 100, and is used to store polishing liquid and cooling liquid; the first cooling unit 300 is arranged on the polishing disk of the polishing equipment, and is connected with the liquid storage unit 200, and is used to cool the polishing disk; the second cooling unit 400 is arranged in the pipeline connecting the liquid storage unit 200 and the polishing equipment, and is connected with the liquid storage unit 200, and is used to cool the polishing liquid; the third cooling unit 500 is arranged on the polishing equipment, and is connected with the air compressor, and is used to cool the polishing pad installed on the polishing disk; the electronic control unit 600 is arranged in the main unit 100, and is respectively connected with the first cooling unit 300, the second cooling unit 400 and the third cooling unit 500, and is used to control the first cooling unit 300, the second cooling unit 400 and the third cooling unit 500.

[0096] It should be noted that the electric control unit 600 can provide power to the first cooling unit 300 , the second cooling unit 400 , and the third cooling unit 500 , and control the first cooling unit 300 , the second cooling unit 400 , and the third cooling unit 500 .

[0097] In some of the embodiments, the electric control unit 600 includes but is not limited to an electric control cabinet.

[0098] The main unit 100 includes a main frame of the device and a roller element. The main frame of the device is made of acid- and alkali-resistant materials and can be used to install various components. The roller element is arranged at the bottom of the main frame of the device to realize the movement of the main frame of the device.

[0099] It should be noted that the main frame of the equipment can be set according to the actual equipment assembly requirements, and no excessive restrictions are made here; in addition, the structure of the main frame of the equipment is existing technology and will not be repeated here.

[0100] Specifically, the roller element is installed at the bottom of the main frame of the equipment by welding, riveting or bolting, and the roller element can realize the free movement of the main frame of the equipment.

[0101] In some embodiments, the scroll wheel element includes but is not limited to a direction wheel.

[0102] More specifically, the number of roller elements is 4, and the 4 roller elements are respectively installed at the corners of the bottom of the main frame of the device.

[0103] In some of the embodiments, the number of roller elements may be 6, 8, etc., that is, the number of roller elements may be set according to actual needs, and no further restrictions are made here.

[0104] like Figure 2 As shown, the liquid storage unit 200 includes a first liquid storage element 210 and a second liquid storage element 220. The first liquid storage element 210 is disposed in the main unit 100, communicated with the second cooling unit 400, and is used to store the polishing liquid and supply the polishing liquid to the second cooling unit 400; the second liquid storage element 220 is disposed in the main unit 100, communicated with the first cooling unit 300, and is used to store the cooling liquid and supply the cooling liquid to the first cooling unit 300.

[0105] Specifically, the first liquid storage element 210 is formed on the main frame of the device; the second liquid storage element 220 is formed on the main frame of the device, and the second liquid storage element 220 is arranged in a rectangular box structure.

[0106] In some of the embodiments, the first liquid storage element 210 is provided in a rectangular box structure.

[0107] In some of the embodiments, the first liquid storage element 210 includes but is not limited to a liquid storage tank.

[0108] In some of the embodiments, the second liquid storage element 220 is provided in a rectangular box structure.

[0109] In some of the embodiments, the second liquid storage element 220 includes but is not limited to a liquid storage tank.

[0110] Furthermore, the liquid storage unit 200 further includes a first pump element 230. The first pump element 230 is disposed inside the first liquid storage element 210 and communicated with the first cooling unit 300 for pumping the polishing liquid.

[0111] Specifically, the first pump element 230 is installed inside the first liquid storage element 210 by welding, riveting or bolting, and the liquid outlet of the first pump element 230 is connected to the first cooling unit 300 to achieve pumping of the polishing liquid.

[0112] In some of the embodiments, the first pump element 230 includes, but is not limited to, a liquid pump.

[0113] Furthermore, the liquid storage unit 200 further includes a second pump element 240, a first connecting pipeline element, a first cooling coil element 250, a heat exchange element 260, a second connecting pipeline element and a first valve element. The second pump element 240 is arranged inside the second liquid storage element 220 and communicates with the second cooling unit 400 for pumping coolant; the first end of the first connecting pipeline element is communicated with the second pump element 240; the first cooling coil element 250 is arranged in a coiled manner at the side wall of the first liquid storage element 210, and the first end of the first cooling coil element 250 is communicated with the second end of the first connecting pipeline element; the heat exchange element 260 is arranged in the main unit 100, and the heat exchange element 260 is communicated with the second end of the first cooling coil element 250; the first end of the second connecting pipeline element is communicated with the heat exchange element 260, and the second end of the second connecting pipeline element is communicated with the second liquid storage element 220; the first valve element is arranged in the first connecting pipeline element and the second connecting pipeline element, and is used to control the circulation of the first connecting pipeline element and the second connecting pipeline element.

[0114] Specifically, the second pump element 240 is installed inside the second liquid storage element 220 by welding, riveting or bolting, and the liquid outlet end of the second pump element 240 is connected to the second cooling unit 400 to achieve pumping of the coolant.

[0115] In some of the embodiments, the second pump element 240 includes, but is not limited to, a liquid pump.

[0116] Specifically, the first end of the first communicating pipe element is connected to the liquid outlet end of the second pump body element 240 through a joint and other structures, and the second end of the first communicating pipe element is connected to the first cooling coil element 250 through a joint and other structures. It should be noted that the first end and the second end of the first communicating pipe element are respectively the two ends in the length direction thereof.

[0117] In some of the embodiments, the first connecting pipe element includes but is not limited to a stainless steel pipe.

[0118] Specifically, the first end of the first cooling coil element 250 is connected to the second end of the first connecting pipe element through a joint and other structures, and the second end of the first cooling coil element 250 is connected to the liquid inlet end of the heat exchange element 260 through a joint and other structures. It should be noted that the first end and the second end of the first cooling coil element 250 are respectively two ends in the length direction thereof.

[0119] In some of the embodiments, the first cooling coil element 250 includes, but is not limited to, a stainless steel tube.

[0120] Specifically, the first end of the second connecting pipe element is connected to the liquid outlet end of the heat exchange element 260 through a joint and other structures, and the second end of the second connecting pipe element is connected to the second liquid storage element 220 through a joint and other structures. It should be noted that the first end and the second end of the second connecting pipe element are respectively the two ends in the length direction thereof.

[0121] In some of the embodiments, the second connecting pipeline element includes but is not limited to a stainless steel pipe.

[0122] Specifically, the first valve element includes a first diaphragm valve and a second diaphragm valve, wherein the first diaphragm valve is arranged on the first communicating pipeline element to control the flow of the first communicating pipeline element, and the second diaphragm valve is arranged on the second communicating pipeline element to control the flow of the second communicating pipeline element.

[0123] like Figure 3 As shown, the first cooling unit 300 includes a first cooling element 310, a first cooling circuit element, a second cooling coil element 320 and a second valve element. The first cooling element 310 is arranged at the bottom of the polishing plate and connected to the polishing plate for mounting parts; the first end of the first cooling circuit element is connected to the liquid storage unit 200 for conveying cooling liquid; the second cooling coil element 320 is arranged on the first cooling element 310 and connected to the second end of the first cooling circuit element for cooling the polishing plate; the second valve element is arranged on the first cooling circuit element for controlling the flow of the first cooling circuit element.

[0124] Specifically, the first cooling element 310 is connected to the polishing plate by welding, riveting or bolting, and the first cooling element 310 is arranged in a round seat structure.

[0125] It should be noted that the diameter of the first cooling element 310 is matched with the diameter of the polishing disc. It should be understood that the diameter of the first cooling element 310 is the same as the diameter of the polishing disc.

[0126] In some of the embodiments, the first cooling element 310 includes but is not limited to a polishing disk water cooling seat.

[0127] Specifically, the first cooling circuit element includes a first pipeline. The first end of the first pipeline is connected to the liquid outlet end of the second pump body element 240 through a joint and other structures, and the second end of the first pipeline is connected to the first cooling element 310 for conveying coolant. It should be noted that the first end and the second end of the first pipeline are respectively two ends in the length direction thereof.

[0128] In some of these embodiments, the first cooling circuit element includes, but is not limited to, a stainless steel tube.

[0129] Specifically, the second cooling coil element 320 is disposed in a curved manner along the circumference of the first cooling element 310 , and the second cooling coil element 320 is communicated with the first cooling element 310 .

[0130] In some of these embodiments, the second cooling coil element 320 includes, but is not limited to, a stainless steel tube.

[0131] Specifically, the second valve element includes a third diaphragm valve, wherein the third diaphragm valve is arranged in the first pipeline, and the third diaphragm valve controls the flow of the first pipeline.

[0132] like Figure 4 As shown, the second cooling unit 400 includes a second cooling element 410, a third cooling coil element, a second cooling pipeline element and a third valve element. The second cooling element 410 is arranged in the pipeline connecting the liquid storage unit 200 and the polishing device, and is connected to the first liquid storage element 210 of the liquid storage unit 200; the third cooling coil element is coiled inside the second cooling element 410, and is connected to the second liquid storage element 220 of the liquid storage unit 200, for cooling the polishing liquid; the second cooling pipeline element connects the third cooling coil element with the liquid storage unit 200; the third valve element is arranged in the second cooling pipeline element, and is used to control the circulation of the second cooling pipeline element.

[0133] Specifically, the second cooling element 410 is arranged in a hollow cylindrical structure, and the first end of the second cooling element 410 is connected to the first liquid storage element 210 through a pipeline, and the second end of the second cooling element 410 is connected to the polishing device through a pipeline. It should be noted that the first end and the second end of the second cooling element 410 are respectively the two ends in the length direction thereof.

[0134] In some of the embodiments, the second cooling element 410 includes, but is not limited to, a stainless steel cylinder.

[0135] Further, the second cooling element 410 includes a first liquid inlet 411, a first liquid outlet 412, a second liquid inlet 413 and a second liquid outlet 414. The first liquid inlet 411 is opened at the first end of the second cooling element 410 and communicates with the first liquid storage element 210 through a pipeline; the first liquid outlet 412 is opened at the side wall of the second end of the second cooling element 410 and communicates with the polishing device through a pipeline; the second liquid inlet 413 is opened at the side wall of the first end of the second cooling element 410 and communicates with the second liquid storage element 220 through a second cooling pipeline element; the second liquid outlet 414 is opened at the side wall of the second end of the second cooling element 410 and communicates with the heat exchange element 260 of the liquid storage unit 200 through a second cooling pipeline element.

[0136] More specifically, the first liquid inlet 411 is opened at the center of the first end of the second cooling element 410 and is connected to the first liquid storage element 210 through a pipeline.

[0137] More specifically, the first liquid outlet 412 is opened at the arc-shaped side wall of the second end of the second cooling element 410 and is connected to the polishing equipment through a pipeline.

[0138] More specifically, the second liquid inlet 413 is opened at the arc-shaped side wall of the first end of the second cooling element 410 , and the second liquid inlet 413 and the first liquid outlet 412 are located on the same straight line.

[0139] More specifically, the second liquid outlet 414 is opened at the arc-shaped side wall of the second end of the second cooling element 410 , and the second liquid outlet 414 and the first liquid outlet 412 are symmetrically arranged.

[0140] Specifically, the third cooling coil element is installed inside the second cooling element 410 , and the third cooling coil element is coiled along the axial direction of the second cooling element 410 .

[0141] In addition, the first end of the third cooling coil element is connected to the second liquid storage element 220 through the second cooling pipe element, and the second end of the third cooling coil element is connected to the heat exchange element 260 through the second cooling pipe element; it should be noted that the first end and the second end of the third cooling coil element are respectively the two ends in its length direction.

[0142] In some of these embodiments, the third cooling coil element includes, but is not limited to, a stainless steel tube.

[0143] Specifically, the second cooling circuit element includes a second circuit and a third circuit, wherein the first end of the second circuit is connected to the second pump element 240 , and the second end of the second circuit is connected to the second liquid inlet 413 ; the first end of the third circuit is connected to the second liquid outlet 414 , and the second end of the third circuit is connected to the heat exchange element 260 .

[0144] It should be noted that the first end and the second end of the second pipeline are respectively two ends in the length direction thereof; the first end and the second end of the third pipeline are respectively two ends in the length direction thereof.

[0145] In some of these embodiments, the second cooling circuit element includes, but is not limited to, a stainless steel tube.

[0146] Specifically, the third valve element includes a fourth diaphragm valve and a fifth diaphragm valve, wherein the fourth diaphragm valve is arranged in the second pipeline to control the flow of the second pipeline; the fifth diaphragm valve is arranged in the third pipeline to control the flow of the third pipeline.

[0147] like Figure 5 , Figure 6 and Figure 7 As shown, the third cooling unit 500 includes at least one third cooling element 510, a plurality of air nozzle elements 520 and a plurality of third cooling pipeline elements. The third cooling element 510 is arranged in the polishing device and is connected to the air compressor for storing compressed air; a plurality of air nozzle elements 520 are connected to the third cooling element 510 for blowing air to the polishing pad; a plurality of third cooling pipeline elements respectively connect the corresponding air nozzle elements 520 to the third cooling element 510, and connect the third cooling element 510 to the air compressor for delivering gas.

[0148] Specifically, the third cooling element 510 is provided in a hollow cylindrical structure, and the third cooling element 510 is installed on the polishing device by welding, riveting or bolting, and the third cooling element 510 is connected to the air compressor and the air nozzle element 520 through the third cooling pipeline element.

[0149] In some of the embodiments, the third cooling element 510 includes, but is not limited to, a hollow cylinder.

[0150] It should be noted that the number of the third cooling elements 510 may be two, and the two third cooling elements 510 are arranged at intervals on the polishing device.

[0151] In some of the embodiments, the number of the third cooling elements 510 may be 1, 3, etc., that is, the number of the third cooling elements 510 may be set according to actual needs, and no excessive restrictions are made herein.

[0152] Furthermore, the third cooling element 510 includes an air inlet 511 and an air outlet 512. The air inlet 511 is provided at the side wall of the third cooling element 510 and is connected to the air compressor through the third cooling pipeline element; the air outlet 512 is provided at the bottom of the third cooling element 510 and is connected to the air nozzle element 520 through the third cooling pipeline element.

[0153] More specifically, the air inlet 511 is opened at the arc side wall in the middle of the third cooling element 510, and the air inlet 511 is connected to the air compressor through the third cooling pipeline element.

[0154] More specifically, the air outlet 512 is opened at the bottom of the third cooling element 510 , and the air outlet 512 is communicated with the air nozzle element 520 through the third cooling pipeline element.

[0155] In addition, a cooling chamber 513 is formed inside the third cooling element 510. The cooling chamber 513 is formed inside the third cooling element 510 and is used to cool the air compressed by the air compressor.

[0156] Specifically, the air nozzle element 520 is connected to the third cooling element 510 through the third cooling pipeline element, and the air nozzle element 520 blows compressed air at room temperature toward the polishing pad on the polishing device, thereby cooling the polishing pad.

[0157] In some of the embodiments, the third cooling element 510 includes, but is not limited to, a hollow cylinder.

[0158] It should be noted that the number of the air nozzle elements 520 can be set according to actual needs and no excessive restrictions are made here.

[0159] Specifically, the third cooling circuit element includes a fourth circuit and a fifth circuit, wherein the first end of the fourth circuit is connected to the air compressor, and the second end of the fourth circuit is connected to the air inlet 511 ; the first end of the fifth circuit is connected to the air outlet 512 , and the second end of the fifth circuit is connected to the air nozzle element 520 .

[0160] It should be noted that the first end and the second end of the fourth pipeline are respectively two ends in the length direction thereof; the first end and the second end of the fifth pipeline are respectively two ends in the length direction thereof.

[0161] In some of these embodiments, the third cooling circuit element includes, but is not limited to, a stainless steel tube.

[0162] It should be noted that the number of the fourth pipelines matches the number of the third cooling elements 510 , that is, the number of the fourth pipelines is the same as the number of the third cooling elements 510 .

[0163] It should be noted that the number of the fifth pipelines matches the number of the air nozzle elements 520 , that is, the number of the fifth pipelines is the same as the number of the air nozzle elements 520 .

[0164] The method of using this embodiment is as follows:

[0165] In actual operation, the electronic control unit 600 starts the first pump element 230, and the first pump element 230 pumps the polishing liquid in the first liquid storage element 210 to the polishing equipment through the pipeline;

[0166] The electronic control unit 600 starts the second pump element 240 and opens the first diaphragm valve, and the second pump element 240 pumps the coolant in the second liquid storage element 220 to the first cooling coil element 250 through the first connecting pipeline element, thereby cooling the polishing liquid in the first liquid storage element 210;

[0167] The electronic control unit 600 opens the second diaphragm valve, so that the first cooling coil element 250 is connected to the second connecting pipe element, so that the coolant after heat exchange with the polishing liquid flows to the heat exchange element 260 through the second connecting pipe element, thereby reducing the temperature of the coolant and realizing the recycling of the coolant;

[0168] The electronic control unit 600 opens the third diaphragm valve, so that the coolant can flow to the second cooling coil element 320 through the first pipeline, thereby cooling the polishing plate;

[0169] The electronic control unit 600 opens the fourth diaphragm valve to achieve communication between the second pipeline and the third cooling coil element, thereby enabling the coolant to flow to the third cooling coil element, so that the coolant can exchange heat with the polishing liquid in the third cooling element 510 to achieve cooling of the polishing liquid;

[0170] The electronic control unit 600 opens the fifth diaphragm valve, so that the coolant after heat exchange can flow to the heat exchange element 260 through the third pipeline, thereby realizing the recycling of the coolant;

[0171] The electronic control unit 600 starts the air compressor and the air nozzle element 520. The air compressor can compress the outside air and pump it to the third cooling element 510 through the fourth pipeline. The third cooling element 510 can cool the compressed air and then pump it to the air nozzle element 520 through the fifth pipeline. The air nozzle element 520 blows out air to cool the polishing pad.

[0172] The advantage of this embodiment is that by arranging a first cooling unit on the polishing disc and connecting the first cooling unit to the liquid storage unit, the polishing disc can be cooled, thereby preventing the polishing disc from being overheated during operation and affecting the polishing accuracy; by arranging a second cooling unit on the pipeline connecting the liquid storage unit and the polishing equipment, the second cooling unit can further cool the polishing liquid in the pipeline; by arranging a third cooling unit on the polishing equipment and cooling the polishing pad with compressed air, the polishing accuracy of the polishing equipment operation can be guaranteed.

[0173] Example 2

[0174] This embodiment relates to the polishing apparatus of the present invention.

[0175] like Figure 8 As shown, a polishing device for heavy silicon carbide wafer processing includes a box unit 700, a horizontal moving unit 800, a vertical moving unit 900 and a pressure plate unit 1000. The box unit 700 is used to install parts; the horizontal moving unit 800 is arranged on the box unit 700; the vertical moving unit 900 is arranged on the horizontal moving unit 800, and reciprocates in the horizontal direction under the action of the horizontal moving unit 800; the pressure plate unit 1000 is arranged on the vertical moving unit 900, and reciprocates in the vertical direction under the action of the vertical moving unit 900, and is used to apply pressure to the silicon carbide wafer placed on the polishing pad.

[0176] It should be noted that the cabinet unit 700 is a prior art and will not be described in detail here.

[0177] like Fig. 9 As shown, the horizontal moving unit 800 includes a plurality of slide rail components 810, a plurality of slider components 820, a support component 830 and a first driving component 840. Among them, the plurality of slide rail components 810 are arranged on the box unit 700; the plurality of slider components 820 are arranged on the slide rail component 810 and are slidably connected with the slide rail component 810; the support component 830 is arranged on the top of the slider component 820, and is used to install the vertical moving unit 900 and the pressure plate unit 1000; the first driving component 840 is arranged on the box unit 700, and is connected with the support component 830, and is used to drive the support component 830 to reciprocate on the slide rail component 810.

[0178] Specifically, the slide rail element 810 is fixed to the top of the box unit 700 by welding, riveting or bolting, and the length direction of the slide rail element 810 is arranged along the length direction of the box unit 700.

[0179] In some of these embodiments, the slide rail component 810 includes, but is not limited to, a guide rail.

[0180] More specifically, the number of the rail elements 810 is two, and the two rail elements 810 are arranged at intervals along the width direction of the box unit 700 .

[0181] In some of the embodiments, the number of the slide rail components 810 may be 1, 3, etc., that is, the number of the slide rail components 810 may be set according to actual needs, and no excessive restrictions are imposed herein.

[0182] Specifically, the slider element 820 is slidably connected to the rail element 810 , and the slider element 820 can reciprocate along the length direction of the rail element 810 .

[0183] In some of these embodiments, the slider element 820 includes, but is not limited to, a stainless steel block.

[0184] More specifically, the number of the slider elements 820 disposed on each slide rail element 810 is 6, and the 6 slider elements 820 are disposed at intervals along the length direction of the slide rail element 810 .

[0185] In some of the embodiments, the number of slider elements 820 provided on each slide rail element 810 may also be 4, 8, etc., that is, the number of slider elements 820 may be set according to actual needs, and no excessive restrictions are imposed herein.

[0186] Specifically, the support element 830 is installed on the slider element 820 by welding, riveting or bolting, and the support element 830 is used to install the vertical moving unit 900 and the pressure plate unit 1000 .

[0187] In some of these embodiments, the support element 830 includes, but is not limited to, a stainless steel plate.

[0188] More specifically, the number of the supporting elements 830 is two, and the two supporting elements 830 are respectively connected to the corresponding slider elements 820 .

[0189] In some of the embodiments, the number of the supporting elements 830 may be 1, 3, etc., that is, the number of the supporting elements 830 may be set according to actual needs, and no excessive restrictions are imposed herein.

[0190] Specifically, the first driving element 840 is installed on the top of the box unit 700 by welding, riveting or bolting, and the output end of the first driving element 840 is connected to the supporting element 830 to drive the supporting element 830.

[0191] In some of the embodiments, the first driving element 840 includes but is not limited to a driving motor.

[0192] like Fig.10 As shown, the vertical moving unit 900 includes a telescopic connection element 910 and a second driving element 920. The telescopic connection element 910 is vertically arranged on the horizontal moving unit 800 and connected to the pressure plate unit 1000; the second driving element 920 is arranged on the horizontal moving unit 800 and connected to the telescopic connection element 910, and is used to drive the telescopic connection element 910 to reciprocate and extend.

[0193] Specifically, the telescopic connection element 910 is installed on the support element 830 by welding, riveting or bolting, and the end of the telescopic connection element 910 is connected to the pressure plate unit 1000 .

[0194] In some of the embodiments, the telescopic connection element 910 includes but is not limited to a telescopic rod.

[0195] Specifically, the second driving element 920 is installed on the telescopic connection element 910 by welding, riveting or bolting, and is used to drive the telescopic connection element 910 to telescope.

[0196] In some of the embodiments, the second driving element 920 includes but is not limited to a driving motor.

[0197] like Fig.11As shown, the pressure plate unit 1000 includes a pressure plate element 1010 and a pressure applying element 1020. The pressure plate element is disposed at the end of the vertical moving unit 900, and reciprocates in the vertical direction under the action of the vertical moving unit 900, and is used to install parts; a plurality of pressure applying elements 1020 are disposed on the pressure plate element 1010, and are spaced along the circumference of the pressure plate element 1010, and are used to apply pressure to the silicon carbide wafer placed on the polishing pad.

[0198] Specifically, the pressure disc element 1010 is provided in a disc-shaped structure, and the center position of the pressure disc element 1010 is connected to the end of the telescopic connection element 910 by welding, riveting or bolting.

[0199] In some of the embodiments, the pressure plate element 1010 includes but is not limited to a ceramic carrier plate.

[0200] Specifically, the pressure applying element 1020 is installed on the pressure disc element 1010 by riveting or bolting, and a plurality of pressure applying elements 1020 are arranged around the pressure disc element 1010 to form a circular ring structure.

[0201] In some of these embodiments, the pressure applying element 1020 includes, but is not limited to, a gas nozzle.

[0202] More specifically, four circular ring structures composed of a plurality of pressure applying elements 1020 are disposed on the pressure plate element 1010 , and the four circular ring structures are disposed at intervals along the radial direction of the pressure plate element 1010 .

[0203] In some of the embodiments, the number of circular structures that can be formed by the plurality of pressure applying elements 1020 on the pressure plate element 1010 can also be 3, 5, etc., that is, the number of pressure applying elements 1020 can be set according to actual needs and no excessive restrictions are imposed herein.

[0204] The method of using this embodiment is as follows:

[0205] In actual operation, the first driving element 840 is started, and the first driving element 840 drives the slider element 820 to reciprocate on the slide rail element 810, so that the support element 830 reciprocates on the slide rail element 810, and then the pressure plate element can be adjusted to a preset position on the polishing plate;

[0206] The second driving element 920 is started, and the second driving element 920 drives the telescopic connecting element 910 to operate, so that the pressure plate element abuts against the polishing plate, thereby exerting pressure on the silicon carbide wafer placed on the polishing plate.

[0207] The advantage of this embodiment is that by setting a horizontal moving unit and a vertical moving unit, the pressure plate unit can be moved on the box unit, and the position of the pressure plate unit relative to the polishing plate can be adjusted according to actual processing requirements, thereby improving convenience and functional diversity.

[0208] Example 3

[0209] This embodiment relates to the polishing system of the present invention.

[0210] like Fig.12 As shown, a polishing system for heavy silicon carbide wafer processing includes the cooling system as described in Example 1 and the polishing device as described in Example 2.

[0211] The polishing system also includes a first cooling device and a second cooling device, wherein the first cooling device is connected to the cooling system for cooling the cooling system; the second cooling device is connected to the polishing device for cooling the polishing device.

[0212] In some of these embodiments, the first cooling device and the second cooling device include, but are not limited to, refrigerators.

[0213] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0214] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A cooling system for heavy silicon carbide wafer processing, characterized in that: include: A main unit, wherein the main unit is used to install components; A liquid storage unit, which is arranged on the main unit and is used to store polishing liquid and cooling liquid; a first cooling unit, which is disposed on a polishing disk of the polishing device and is connected to the liquid storage unit and is used to cool the polishing disk; A second cooling unit, the second cooling unit is disposed in a pipeline connecting the liquid storage unit and the polishing device, and is connected to the liquid storage unit, and is used to cool the polishing liquid; a third cooling unit, the third cooling unit being disposed in the polishing device and being in communication with the air compressor, and being used for cooling the polishing pad mounted on the polishing plate; an electric control unit, the electric control unit being arranged in the main unit and connected to the first cooling unit, the second cooling unit and the third cooling unit respectively, and being used to control the first cooling unit, the second cooling unit and the third cooling unit; Wherein, the liquid storage unit comprises: a first liquid storage element, which is disposed in the main body unit and communicated with the second cooling unit, and is used for storing polishing liquid and supplying polishing liquid to the second cooling unit; a second liquid storage element, which is disposed on the main unit and communicated with the first cooling unit, and is used to store cooling liquid and supply cooling liquid to the first cooling unit; a second pump element, the second pump element being disposed inside the second liquid storage element and being in communication with the first cooling unit and being used for pumping cooling liquid; a first communicating pipe element, wherein a first end of the first communicating pipe element is in communication with the second pump body element; a first cooling coil element, wherein the first cooling coil element is coiled and arranged on a side wall of the first liquid storage element, and a first end of the first cooling coil element is connected to a second end of the first connecting pipe element; a heat exchange element, the heat exchange element being disposed in the main unit and being in communication with the second end of the first cooling coil element; a second communicating pipe element, wherein a first end of the second communicating pipe element is in communication with the heat exchange element, and a second end of the second communicating pipe element is in communication with the second liquid storage element; a first valve element, the first valve element being disposed at the first communicating pipeline element and the second communicating pipeline element and being used to control the flow of the first communicating pipeline element and the second communicating pipeline element; Wherein, the first cooling unit comprises: A first cooling element, which is disposed at the bottom of the polishing plate and connected to the polishing plate and is used for mounting parts; a first cooling line element, wherein a first end of the first cooling line element is in communication with the liquid storage unit and is used for conveying cooling liquid; a second cooling coil element, which is disposed on the first cooling element and communicates with the second end of the first cooling pipeline element and is used to cool the polishing disc; a second valve element, the second valve element being disposed on the first cooling circuit element and being used to control the flow of the first cooling circuit element; Wherein, the second cooling unit comprises: a second cooling element, the second cooling element being disposed in a pipeline connecting the liquid storage unit and the polishing device and being in communication with the liquid storage unit; a third cooling coil element, the third cooling coil element being coiled inside the second cooling element and being in communication with the liquid storage unit for cooling the polishing liquid; a second cooling pipeline element, the second cooling pipeline element being connected to the third cooling coil element and the liquid storage unit respectively; a third valve element, the third valve element being disposed on the second cooling circuit element and being used to control the flow of the second cooling circuit element; Wherein, the third cooling unit comprises: at least one third cooling element, the third cooling element being disposed in the polishing device and being in communication with the air compressor for storing compressed air; A plurality of air nozzle elements, each of which is connected to the third cooling element and is used for blowing gas to the polishing pad; A plurality of third cooling pipeline elements, wherein the plurality of third cooling pipeline elements respectively connect the corresponding air nozzle elements with the third cooling elements, and connect the third cooling elements with an air compressor for conveying gas.

2. The cooling system according to claim 1, characterized in that: The liquid storage unit also includes: The first pump body element is arranged inside the first liquid storage element and is connected to the second cooling unit for pumping the polishing liquid.

3. A polishing device for heavy silicon carbide wafer processing, connected to the cooling system according to any one of claims 1 to 2, characterized in that: include: A box unit, wherein the box unit is used to install components; A horizontal moving unit, wherein the horizontal moving unit is arranged on the box unit; A vertical moving unit, which is arranged on the horizontal moving unit and reciprocates in a horizontal direction under the action of the horizontal moving unit; A pressure plate unit is disposed on the vertical moving unit and reciprocates in a vertical direction under the action of the vertical moving unit to apply pressure to the silicon carbide wafer placed on the polishing pad.

4. The polishing device according to claim 3, characterized in that: The horizontal moving unit comprises: A plurality of slide rail elements, wherein the plurality of slide rail elements are arranged on the box unit; A plurality of slider elements, wherein the plurality of slider elements are disposed on the slide rail element and are slidably connected with the slide rail element; A supporting element, the supporting element being disposed on the top of the slider element and used for mounting the vertical moving unit and the pressure plate unit; A first driving element, which is disposed on the box unit and connected to the supporting element, and is used to drive the supporting element to reciprocate on the slide rail element; and / or The vertical moving unit comprises: a telescopic connection element, the telescopic connection element being vertically disposed on the horizontal moving unit and connected to the pressure plate unit; A second driving element is disposed on the horizontal moving unit and connected to the telescopic connecting element, and is used for driving the telescopic connecting element to reciprocate and extend.

5. The polishing device according to claim 3 or 4, characterized in that: The pressure plate unit comprises: A pressure plate element, which is disposed at the end of the vertical moving unit and reciprocates in the vertical direction under the action of the vertical moving unit, and is used for installing parts; A plurality of pressure applying elements are arranged on the pressure plate element and spaced apart along the circumference of the pressure plate element, and are used to apply pressure to the silicon carbide wafer placed on the polishing pad.

6. A polishing system for heavy silicon carbide wafer processing, characterized in that: include: The cooling system according to any one of claims 1 to 2; The polishing device as claimed in any one of claims 3 to 5.

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