Semiconductor automatic film peeling machine

Abstract

This invention discloses an automatic semiconductor film peeling machine. The main platform is sequentially equipped with a feeding unit, a film peeling unit, a vision inspection unit, and a discharging unit. The main platform also includes a first conveying platform, a second conveying platform, a first moving clamp, and a second moving clamp. A frame mounted on the main platform is equipped with a feeding hopper door and a discharging hopper door. This invention eliminates the need for machine downtime during the feeding and discharging processes, improving production efficiency. It can preheat the semiconductor panel, reducing the adhesion between the semiconductor substrate and the protective film adhesive, facilitating film peeling, and minimizing incomplete peeling and residue. The vision inspection unit, in conjunction with a third robotic arm, sorts qualified and unqualified semiconductor substrates, reducing labor costs. The film-lifting knife, the first clamping part, and the second clamping part work together to increase the film's contact area and simultaneously form an angle between the external force direction and the contact surface of the semiconductor substrate, improving peeling efficiency and yield.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing equipment technology, and more particularly to an automatic semiconductor film peeling machine. Background Technology

[0002] Semiconductors are materials based on conductors and insulators that operate at room temperature. They are frequently used in technological fields such as aerospace, automotive, artificial intelligence, and communication systems. Common semiconductor materials include silicon, germanium, and gallium arsenide, with silicon being one of the most influential. However, semiconductors are also among the most delicate materials. In the daily semiconductor manufacturing process, to prevent the semiconductor panel from coming into contact with foreign objects, and to avoid damage to the semiconductor panel during wire bonding, lead securing, sealing, and panel scratches, a thin film with different process requirements is usually coated on the semiconductor material. After completing the above processing, the protective film needs to be removed.

[0003] Traditional film-peeling machines suffer from low automation, excessive reliance on manual labor, cumbersome manual sorting operations, high labor costs, and the need to stop and wait during loading and unloading, which greatly reduces production efficiency. Furthermore, abnormal situations such as incomplete film removal and residue during the film-peeling process can lead to a low product qualification rate. Summary of the Invention

[0004] Purpose of the invention: The purpose of this invention is to address the shortcomings of the prior art and provide an automatic semiconductor film peeling machine.

[0005] Technical solution: The present invention is a semiconductor automatic film peeling machine, including a main platform, on which a feeding unit, a film peeling unit, a vision inspection unit and a unloading unit are arranged in sequence. The main platform is also provided with a first conveying platform, a second conveying platform, a first moving clamp and a second moving clamp. A frame is installed on the main platform, and a feeding bin door and a discharging bin door are provided on the frame.

[0006] The feeding unit includes a first conveying track, a second conveying track, a first robotic arm, a second robotic arm, a transfer platform, and a magazine. The magazine contains four semiconductor panels for preparing to peel off the film. The semiconductor panels include a semiconductor substrate and a protective film.

[0007] The first moving fixture transports the semiconductor panel on the second conveying platform, and the second moving fixture transports the semiconductor panel on the first conveying platform. The first and second moving fixtures preheat the semiconductor panel during the transport process.

[0008] The film-tearing unit includes a third conveying track, a fourth conveying track, a first film-tearing mechanism, a second film-tearing mechanism, and a waste film section. The first film-tearing mechanism includes a film-lifting knife, a first clamping part, and a second clamping part.

[0009] The unloading unit includes a fifth conveyor track, a third robotic arm, a third conveying platform, a first swing table, a second swing table, a lifting platform, a finished product box, a finished product box output platform, and an empty box input platform;

[0010] The vision inspection unit is equipped with a moving track to alternately scan the semiconductor substrate on the first moving fixture and the second moving fixture to detect any abnormal residues on the semiconductor substrate after the film is removed.

[0011] A further improvement of the present invention is that the transfer platform positions and corrects the semiconductor panel so that the semiconductor panel is parallel to the first moving fixture and the second moving fixture, while the transfer platform preheats the semiconductor panel.

[0012] A further improvement of the present invention is that the second robotic arm moves on the second conveying track to pick up the semiconductor panel from the magazine and place it on the transfer platform; the first robotic arm moves on the first conveying track to pick up the semiconductor panel from the transfer platform and alternately place it on the first moving fixture and the second moving fixture, and the first robotic arm preheats the semiconductor panel during the transfer process.

[0013] A further improvement of the present invention is that the first film-tearing mechanism tears the film off the semiconductor panel on the second moving fixture, the second film-tearing mechanism tears the film off the semiconductor panel on the first moving fixture, the first film-tearing mechanism transports the waste film to the waste film section via the third conveying track, and the second film-tearing mechanism transports the waste film to the waste film section via the fourth conveying track.

[0014] A further improvement of the present invention is that the first film-tearing mechanism and the second film-tearing mechanism are completely identical film-tearing mechanisms. The film-lifting knife pre-separates the protective film on the semiconductor panel, the first clamping part clamps the edge corner of the protective film being lifted, the semiconductor panel moves to the right, and the second clamping part clamps the vertical surface of the lifted protective film, so that the force of film tearing is uniform.

[0015] A further improvement of the present invention is that the third robot arm transports the semiconductor substrate on the first moving fixture and the second moving fixture to the first and second swing tables via the fifth conveying track. The first swing table transports the semiconductor substrate to the finished product box via the third conveying platform. The empty box input platform is used to prepare empty finished product boxes and transport them to the lifting platform. The lifting platform transports the fully loaded finished product boxes to the finished product box output platform.

[0016] A further improvement of the present invention is that the third robotic arm, based on the scanning results of the semiconductor substrate by the vision detection unit, places qualified semiconductor substrates on the first stage and unqualified semiconductor substrates on the second stage.

[0017] A further improvement of the present invention is that the loading and unloading processes of the loading and unloading hopper doors and the unloading hopper doors do not interfere with the operation of the equipment. When changing the magazine, the loading hopper door and the empty magazine are unlocked simultaneously. After the magazine is filled, the loading hopper door and the magazine are locked simultaneously. When changing the finished product box, the unloading hopper door, the finished product box output platform, and the empty box input platform are unlocked simultaneously. The empty box input platform is pulled out and an empty finished product box is placed in. The finished product box output platform is pulled out and a full finished product box is taken out to reserve space. After the replacement is completed, the unloading hopper door, the finished product box output platform, and the empty box input platform are locked.

[0018] A further improvement of the present invention is that the empty material box input platform and the finished material box output platform are driven by a motor, with the empty material box input platform conveying from the outside to the inside and the finished material box output platform conveying from the inside to the outside.

[0019] Compared with the prior art, the semiconductor automatic film peeling machine provided by the present invention achieves at least the following beneficial effects:

[0020] The invention features a second robotic arm that works in conjunction with four magazines to load materials while the machine is running. During the unloading process, finished product boxes are kept on the lifting platform to support the machine's operation. Empty finished product boxes are placed into the empty box input platform, and fully loaded finished product boxes are removed from the output platform, leaving space for the unloading. The loading and unloading processes do not require machine downtime, improving production efficiency. The first and second moving clamps and the transfer platform preheat the semiconductor panel, reducing the adhesion between the semiconductor substrate and the protective film adhesive, facilitating film removal, and reducing incomplete removal and residue. The vision inspection unit works in conjunction with the third robotic arm to sort qualified and unqualified semiconductor substrates, reducing labor costs. The film-lifting knife, the first clamping part, and the second clamping part work together to increase the force-bearing area of ​​the film and simultaneously form an angle between the direction of external force and the force-bearing surface of the semiconductor substrate, improving film removal efficiency and yield. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention. The drawings do not constitute any limitation on the invention, and those skilled in the art can obtain other drawings based on the following drawings without any inventive effort.

[0022] Figure 1 This is a top view of the structure of the present invention;

[0023] Figure 2 This is a front structural diagram of the present invention;

[0024] Figure 3 This is a diagram of the external frame of the present invention;

[0025] Figure 4 This is a schematic diagram of the film-tearing mechanism of the present invention;

[0026] Figure 5 This is a perspective view of the present invention;

[0027] Figure 6 This is a schematic diagram of the film-tearing state of the present invention;

[0028] Figure 7 This is a structural distribution diagram of the present invention.

[0029] The components include: 1. Main platform; 2. Loading unit; 3. Film-tearing unit; 4. Unloading unit; 5. Vision inspection unit; 6. First conveyor platform; 7. Second conveyor platform; 8. First moving fixture; 9. Second moving fixture; 10. Semiconductor panel; 11. Frame; 12. Loading bin door; 13. Discharge bin door; 21. First conveyor track; 22. Second conveyor track; 23. First robotic arm; 24. Second robotic arm; 25. Transfer platform; 26. Magazine; 31. Third conveyor track. 32. Fourth conveying track; 33. First film tearing mechanism; 34. Second film tearing mechanism; 35. Waste film section; 41. Fifth conveying track; 42. Third robotic arm; 43. Third conveying platform; 44. First swing table; 45. Second swing table; 46. Lifting platform; 47. Finished product box; 48. Finished product box output platform; 49. Empty box input platform; 101. Semiconductor substrate; 102. Protective film; 331. Film lifting knife; 332. First clamping part; 333. Second clamping part. Detailed Implementation

[0030] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0031] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0032] Techniques, methods, and apparatus known to those skilled in the art may not be discussed in detail; however, where appropriate, such techniques, methods, and apparatus should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0033] See the attached instruction manual. Figure 1-7The system includes a main platform 1, on which a feeding unit 2, a film-tearing unit 3, a vision inspection unit 5, and a unloading unit 4 are sequentially arranged. The main platform 1 is also equipped with a first conveying platform 6, a second conveying platform 7, a first moving clamp 8, and a second moving clamp 9. A frame 11 is installed on the main platform 1, and a feeding hopper door 12 and a discharging hopper door 13 are arranged on the frame 11.

[0034] The feeding unit 2 includes a first conveying track 21, a second conveying track 22, a first robotic arm 23, a second robotic arm 24, a transfer platform 25, and a magazine 26. There are four magazines 26, which store semiconductor panels 10 for preparing to peel off the film. The semiconductor panel 10 includes a semiconductor substrate 101 and a protective film 102.

[0035] The first moving clamp 8 transports the semiconductor panel 10 on the second conveying platform 7, and the second moving clamp 9 transports the semiconductor panel 10 on the first conveying platform 6. The first moving clamp 8 and the second moving clamp 9 preheat the semiconductor panel 10 during the transport process.

[0036] The film-tearing unit 3 includes a third conveying track 31, a fourth conveying track 32, a first film-tearing mechanism 33, a second film-tearing mechanism 34, and a waste film section 35. The first film-tearing mechanism 33 includes a film-lifting knife 331, a first clamping part 332, and a second clamping part 333.

[0037] The unloading unit 4 includes a fifth conveying track 41, a third robotic arm 42, a third conveying platform 43, a first swing table 44, a second swing table 45, a lifting platform 46, a finished product box 47, a finished product box output platform 48, and an empty box input platform 49.

[0038] The visual inspection unit 5 is equipped with a moving track to alternately scan the semiconductor substrate 101 on the first moving fixture 8 and the second moving fixture 9 to detect any abnormal residues on the semiconductor substrate 101 after the film is removed.

[0039] The transfer platform 25 positions and corrects the semiconductor panel 10, making it parallel to the first moving clamp 8 and the second moving clamp 9. Simultaneously, the transfer platform 25 preheats the semiconductor panel 10. The second robotic arm 24 moves on the second transport track 22, picking up the semiconductor panel 10 from the magazine 26 and placing it on the transfer platform 25. The first robotic arm 23 moves on the first transport track 21, picking up the semiconductor panel 10 from the transfer platform 25 and alternately placing it on the first moving clamp 8 and the second moving clamp 9. The first robotic arm 23 preheats the semiconductor panel 10 during the transfer process. The first film-tearing mechanism 33 peels off the semiconductor panel 10 from the second moving clamp 9. The semiconductor panel 10 is peeled off, and the second peeling mechanism 34 peels off the film on the semiconductor panel 10 on the first moving clamp 8. The first peeling mechanism 33 transports the waste film to the waste film section 35 through the third conveying track 31, and the second peeling mechanism 34 transports the waste film to the waste film section 35 through the fourth conveying track 32. The first peeling mechanism 33 and the second peeling mechanism 34 are identical peeling mechanisms. The film lifting knife 331 pre-separates the protective film 102 on the semiconductor panel 10. The first clamping part 332 clamps the edge of the protective film 102, the semiconductor panel 10 moves to the right, and the second clamping part 333 clamps the vertical surface of the lifted protective film 102, so that the force of the film peeling is uniform.

[0040] The third robotic arm 42 transports the semiconductor substrates 101 from the first moving fixture 8 and the second moving fixture 9 to the first swing table 44 and the second swing table 45 via the fifth conveying track 41. The first swing table 44 transports the semiconductor substrates 101 to the finished product box 47 via the third conveying platform 43. The empty box input platform 49 is used to prepare empty finished product boxes 47 and transports them to the lifting platform 46. The lifting platform 46 transports the full-loaded finished product boxes 47 to the finished product box output platform 48. The third robotic arm 42 scans the semiconductor substrates 101 using the vision inspection unit 5, placing qualified semiconductor substrates 101 on the first swing table 44 and unqualified semiconductor substrates 101 on the second swing table 45. The loading and unloading process of the loading hopper door 12 and the unloading hopper door 13 is related to the equipment operation status. Without interfering with each other, when changing magazine 26, the loading chamber door 12 and the empty magazine 26 are unlocked simultaneously. After magazine 26 is refilled, the loading chamber door 12 and magazine 26 are locked simultaneously. When changing finished product box 47, the discharging chamber door 13, finished product box output platform 48, and empty box input platform 49 are unlocked simultaneously. The empty box input platform 49 is pulled out and an empty finished product box is placed in. The finished product box output platform 48 is pulled out and a full finished product box is removed to reserve space. After the replacement is completed, the discharging chamber door 13, finished product box output platform 48, and empty box input platform 49 are locked. The empty box input platform 49 and finished product box output platform 48 are driven by motors. The empty box input platform 49 is conveyed from the outside to the inside, and the finished product box output platform 48 is conveyed from the inside to the outside.

[0041] The working principle and operation steps of this invention are as follows:

[0042] S1: Loading: Semiconductor panels 10 are sequentially loaded into four magazines 26. The second robotic arm 24 sequentially transfers semiconductor panels 10 from the four magazines 26 to the transfer platform 25. When the second robotic arm 24 starts transferring semiconductor panels 10 from the fourth magazine, the equipment issues a warning prompt and simultaneously unlocks the loading chamber door 12 and the empty magazine, and fills the empty magazine. After the second robotic arm 24 finishes transferring the fourth magazine, it immediately starts transferring from the first magazine that has been filled. At this time, the fourth magazine is unlocked and filled again. After filling is completed, the loading chamber door 12 and the magazines 26 are locked.

[0043] S2: Positioning and heating. The transfer platform 25 positions and corrects the semiconductor panel 10 so that the semiconductor panel 10 is parallel to the first moving clamp 8 and the second moving clamp 9. At the same time, the transfer platform 25 preheats the semiconductor panel 10. The first robot arm 23 moves on the first conveying track 21, grabs the semiconductor panel 10 from the transfer platform 25 and alternately places it on the first moving clamp 8 and the second moving clamp 9. The first robot arm 23 preheats the semiconductor panel 10 during the transfer process. The first moving clamp 8 conveys the semiconductor panel 10 on the second conveying platform 7, and the second moving clamp 9 conveys the semiconductor panel 10 on the first conveying platform 6. The first moving clamp 8 and the second moving clamp 9 preheat the semiconductor panel 10 during the conveying process.

[0044] S3: Film peeling, the film peeling knife 331 is used to pre-separate the protective film 102 on the semiconductor panel 10, the first clamping part 332 clamps the edge of the protective film 102, the semiconductor panel 10 moves to the right, the second clamping part 333 clamps the vertical surface of the lifted protective film 102, so that the force of film peeling is uniform, the first film peeling mechanism 33 peels the semiconductor panel on the second moving clamp 9, the second film peeling mechanism 34 peels the semiconductor panel on the first moving clamp 8, and conveys the waste film to the waste film part 35;

[0045] S4: Inspection. The visual inspection unit 5 has a moving track inside, which alternately scans the semiconductor substrate 101 on the first moving fixture 8 and the second moving fixture 9 to detect the residue or abnormality of the semiconductor substrate 101 after the film is removed, and distinguishes between qualified and unqualified products after film removal.

[0046] S5: Sorting and boxing. The third robot 42 transports the semiconductor substrate 101 on the first moving fixture 8 and the second moving fixture 9 to the first table 44 and the second table 45 via the fifth conveying track 41. The semiconductor substrate on the first table 44 is a qualified product, and the semiconductor substrate on the second table 45 is a defective product. The first table 44 transports the semiconductor substrate 101 to the finished product box 47 via the third conveying platform 43. The empty box input platform 49 is used to prepare empty finished product boxes and transport them to the lifting platform 46. The lifting platform 46 transports the full-load finished product boxes to the finished product box output platform 48.

[0047] S6: Discharge material. At the same time, unlock the discharge hopper door 13, finished product box output platform 48 and empty material box input platform 49. Pull out the empty material box input platform 49 and put in an empty finished product box. Pull out the finished product box output platform 48 and take out the full finished product box to reserve space. After the replacement is completed, the discharge hopper door 13, finished product box output platform 48 and empty material box input platform 49 enter the locked state.

[0048] In summary, the semiconductor automatic film peeling machine of the present invention can be loaded while the machine is running. During the unloading process, finished product boxes are kept on the lifting platform to cooperate with the machine's operation. Empty finished product boxes are placed into the empty box input platform, and the finished product box output platform removes the full-load finished product boxes to reserve space. The loading and unloading process does not require machine downtime, improving production efficiency. The first moving clamp, the second moving clamp, and the transfer platform preheat the semiconductor panel, reducing the adhesion between the semiconductor substrate and the protective film adhesive, making film peeling easier and reducing incomplete peeling and residue. The vision inspection unit works in conjunction with the third robotic arm to sort qualified and unqualified semiconductor substrates, reducing labor costs. The film peeling knife, the first clamping part, and the second clamping part work together to increase the force-bearing area of ​​the film, while forming an angle between the direction of external force and the force-bearing surface of the semiconductor substrate, improving peeling efficiency and pass rate.

[0049] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. An automatic semiconductor film peeling machine, characterized in that: Includes a main platform (1), on which a feeding unit (2), a film-tearing unit (3), a vision inspection unit (5) and a unloading unit (4) are arranged in sequence. The main platform (1) is also provided with a first conveying platform (6), a second conveying platform (7), a first moving fixture (8) and a second moving fixture (9). A frame (11) is installed on the main platform (1), and a feeding hopper door (12) and a discharging hopper door (13) are provided on the frame (11). The feeding unit (2) includes a first conveying track (21), a second conveying track (22), a first robotic arm (23), a second robotic arm (24), a transfer platform (25), and a magazine (26). The magazine (26) has four magazines and stores semiconductor panels (10) for preparing to peel off the film. The semiconductor panel (10) includes a semiconductor substrate (101) and a protective film (102). The first moving fixture (8) transports the semiconductor panel (10) on the second conveying platform (7), and the second moving fixture (9) transports the semiconductor panel (10) on the first conveying platform (6). The first moving fixture (8) and the second moving fixture (9) preheat the semiconductor panel (10) during the transport process. The film-tearing unit (3) includes a third conveying track (31), a fourth conveying track (32), a first film-tearing mechanism (33), a second film-tearing mechanism (34), and a waste film section (35). The first film-tearing mechanism (33) includes a film-lifting knife (331), a first clamping part (332), and a second clamping part (333). The unloading unit (4) includes a fifth conveying track (41), a third robotic arm (42), a third conveying platform (43), a first swing table (44), a second swing table (45), a lifting platform (46), a finished product box (47), a finished product box output platform (48), and an empty box input platform (49). The visual inspection unit (5) is equipped with a moving track to alternately scan the semiconductor substrate (101) on the first moving fixture (8) and the second moving fixture (9) to detect any abnormal residues on the semiconductor substrate (101) after the film is removed. The transfer platform (25) positions and corrects the semiconductor panel (10) so that the semiconductor panel (10) is parallel to the first moving clamp (8) and the second moving clamp (9), while the transfer platform (25) preheats the semiconductor panel (10); The second robotic arm (24) moves on the second transport track (22) to pick up the semiconductor panel (10) from the magazine (26) and place it on the transfer platform (25); the first robotic arm (23) moves on the first transport track (21) to pick up the semiconductor panel (10) from the transfer platform (25) and alternately place it on the first moving fixture (8) and the second moving fixture (9). The first robotic arm (23) preheats the semiconductor panel (10) during the transfer process.

2. The semiconductor automatic film peeling machine according to claim 1, characterized in that: The first film-tearing mechanism (33) tears the film off the semiconductor panel (10) on the second moving fixture (9), and the second film-tearing mechanism (34) tears the film off the semiconductor panel (10) on the first moving fixture (8). The first film-tearing mechanism (33) transports the waste film to the waste film section (35) via the third conveying track (31), and the second film-tearing mechanism (34) transports the waste film to the waste film section (35) via the fourth conveying track (32).

3. The semiconductor automatic film peeling machine according to claim 1, characterized in that: The first film-tearing mechanism (33) and the second film-tearing mechanism (34) are completely identical film-tearing mechanisms. The film-lifting knife (331) pre-separates the protective film (102) on the semiconductor panel (10). The first clamping part (332) clamps the edge of the protective film (102) and moves the semiconductor panel (10) to the right. The second clamping part (333) clamps the vertical surface of the lifted protective film (102) so that the force of film tearing is uniform.

4. The semiconductor automatic film peeling machine according to claim 1, characterized in that: The third robotic arm (42) transports the semiconductor substrate (101) on the first moving fixture (8) and the second moving fixture (9) to the first swing table (44) and the second swing table (45) via the fifth conveying track (41). The first swing table (44) transports the semiconductor substrate (101) to the finished product box (47) via the third conveying platform (43). The empty box input platform (49) is used to prepare empty finished product boxes (47) and transport them to the lifting platform (46). The lifting platform (46) transports the fully loaded finished product boxes (47) to the finished product box output platform (48).

5. The semiconductor automatic film peeling machine according to claim 4, characterized in that: The third robotic arm (42) uses the scanning results of the semiconductor substrate (101) by the vision detection unit (5) to place qualified semiconductor substrates (101) on the first stage (44) and unqualified semiconductor substrates (101) on the second stage (45).

6. The semiconductor automatic film peeling machine according to claim 1, characterized in that: The loading and unloading processes of the loading hopper door (12) and the unloading hopper door (13) do not interfere with the operation of the equipment. When changing the magazine (26), the loading hopper door (12) and the empty magazine are unlocked at the same time. After the magazine (26) is filled, the loading hopper door (12) and the magazine (26) are locked at the same time. When changing the finished product box (47), the unloading hopper door (13), the finished product box output platform (48) and the empty box input platform (49) are unlocked at the same time. The empty box input platform (49) is pulled out and an empty finished product box is put in. The finished product box output platform (48) is pulled out and a full finished product box is taken out to reserve space. After the replacement is completed, the unloading hopper door (13), the finished product box output platform (48) and the empty box input platform (49) are locked.

7. The semiconductor automatic film peeling machine according to claim 1, characterized in that: The empty material box input platform (49) and the finished material box output platform (48) are driven by a motor. The empty material box input platform (49) conveys material from the outside to the inside, and the finished material box output platform (48) conveys material from the inside to the outside.

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