Display panel and display device

Abstract

The application discloses a display panel and a display device. The display panel comprises a support layer and a rigid bearing layer on the side of the support layer away from a pixel layer. The rigid bearing layer comprises a first part attached to the support layer and a second part. The side of the second part close to the support layer is attached to a circuit board, so that the display panel is in a flat state. The display panel provided by the application can use the rigid bearing layer to attach the support layer and the circuit board, so as to fix the support layer and the circuit board, thereby avoiding the damage of the display panel caused by the position deviation of internal circuit elements when the display panel is in a flat state, and reducing the probability of damage of the display panel.

Description

Technical Field

[0001] This invention belongs to the field of display panel technology, and specifically relates to a display panel and a display device. Background Technology

[0002] With the evolution of the form of flexible screens (Organic Light-Emitting Diode, or OLED for short), the form in which flexible OLED supply materials (such as flexible OLED display panels) are shipped has evolved from the initial bent shipment state to the flat shipment state.

[0003] However, when flexible OLED display panels are shipped flat, the internal circuit components may shift due to factors such as vibration, collision, or compression, which can easily lead to damage to the circuit components.

[0004] Therefore, the high damage rate of flexible OLED display panels in the flattened shipping state in the existing technology has become an urgent problem to be solved. Summary of the Invention

[0005] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a display panel and display device that can use a rigid bearing layer to bond the support layer and the circuit board to fix the support layer and the circuit board, thereby avoiding damage to the display panel due to the positional displacement of internal circuit components when the display panel is flattened for shipment, and reducing the probability of damage to the display panel.

[0006] According to a first aspect of this application, a display panel is provided, including a support layer and a rigid carrier layer on the side of the support layer away from the pixel layer; the rigid carrier layer includes a first portion and a second portion attached to the support layer, and a circuit board is attached to the side of the second portion near the support layer to make the display panel flat.

[0007] In addition, the display panel of this application may also have the following additional technical features:

[0008] Preferably, the second part includes a first bonding area and a second bonding area on the side near the support layer; the first bonding area is bonded to the non-touch circuit board, and the second bonding area is bonded to the touch circuit board.

[0009] Preferably, the first bonding area is close to the first part, and the second bonding area is far away from the first part.

[0010] Preferably, the circuit board is a non-touch circuit board, and the display panel also includes a touch circuit board, wherein the length of the touch circuit board along the target direction is less than the length of the second part along the target direction, and the target direction is the direction from the first part to the second part.

[0011] Preferably, after the non-touch circuit board is attached to the second part, the distance between the non-touch circuit board and the edge of the second part along the length direction of the display panel is not less than 1% of the length of the rigid support layer.

[0012] Preferably, after the non-touch circuit board and the touch circuit board are attached to the second part, the distance between the non-touch circuit board and the edge of the second part along the length direction of the display panel is greater than 1% of the length of the rigid support layer.

[0013] Preferably, the second part also includes a humidity indicator layer on the side near the support layer.

[0014] Preferably, the rigid support layer further includes limiting holes, which are located in the non-adhesive area of ​​the rigid support layer; wherein, the non-adhesive area is the area on the rigid support layer other than the adhesive support layer and the circuit board.

[0015] Preferably, the second part has an adhesive layer on the side near the support layer, which is used to adhere the circuit board.

[0016] According to a second aspect of this application, a display device is provided, which includes the display panel of the first aspect.

[0017] The display panel and display device provided in this application embodiment, by providing a rigid bearing layer on the side of the support layer away from the pixel layer, can, on the one hand, use the rigid bearing layer to bond the support layer to achieve support for the support layer and the pixel layer and other film layers; on the other hand, can use the rigid bearing layer to bond the circuit board to achieve fixation of the circuit board, thereby avoiding damage to the display panel due to the positional displacement of internal circuit components when the display panel is flattened for shipment, and thus reducing the probability of damage to the display panel.

[0018] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0020] Figure 1 This is an implementation environment architecture diagram of a display panel 10 according to an embodiment of this application;

[0021] Figure 2 A schematic diagram of the structure of the display panel 20 provided in an embodiment of this application from one viewpoint;

[0022] Figure 3This is a schematic diagram of a pixel layer 202 provided in an embodiment of this application;

[0023] Figure 4 This is another schematic diagram of the pixel layer 202 provided in an embodiment of this application;

[0024] Figure 5 Another structural schematic diagram of the display panel 20 provided in the embodiment of this application, from one viewpoint;

[0025] Figure 6 A schematic diagram of the structure of the display panel 20 provided in an embodiment of this application from another perspective;

[0026] Figure 7 A schematic diagram of the adhesive layer provided in the embodiments of this application;

[0027] In the above image:

[0028] 101 – Support layer; 102 – Pixel layer; 103 – Cover layer; 104 – Non-touch circuit board; 105 – Touch circuit board; 106 – Connector for non-touch circuit board 104; 201 – Support layer; 202 – Pixel layer; 203 – Rigid carrier layer; 204 – First part of rigid carrier layer; 205 – Second part of rigid carrier layer; 206 – Circuit board; 207 – Crystal-coated film layer; 208 – Cover layer; 2081 – Cover layer ink area; 301 – Touch layer; 302 – Polarizing film layer; 303 – OLED display layer; 304 – OLED back film layer; 305 – Optical adhesive layer 1; 306 – Optical adhesive layer 2; 501 – Non-touch circuit board; 502 – Touch circuit board; 503 – First bonding area; 504 – Second bonding area; 601 – Humidity indicator layer; 602 – Limiting hole. Detailed Implementation

[0029] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0030] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present application will now be described in detail with reference to the accompanying drawings and embodiments. Furthermore, the term "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The terms "first" and "second," etc., in the specification and claims of the embodiments of this application are used to distinguish different objects, not to describe a specific order of objects.

[0031] First, the terminology used in this application will be explained as follows:

[0032] (1) Organic Light-Emitting Diode (OLED): Also known as organic electroluminescent display technology, it is a display technology that uses organic materials to convert electrical energy into light energy;

[0033] (2) Printed Circuit Board (PCB): A rigid or semi-rigid printed circuit board, usually made of glass fiber and epoxy resin, used to connect electronic components;

[0034] (3) Flexible Printed Circuit (FPC): A type of flexible printed circuit board, usually composed of a flexible insulating substrate and conductive copper foil, which is specifically installed in electronic components that need to be bent or have a bent shape;

[0035] (4) Touch flexible printed circuit board (abbreviated as touch FPC): It is a flexible printed circuit board with touch function, usually composed of metal lines and circuit elements, and is specifically used to transmit touch signals and control circuits;

[0036] (5) Electrostatic discharge (ESD): This refers to the discharge of static charge between two objects when there is an imbalance in the static charge between them. Specifically, electrostatic discharge in electronic components and electronic devices may cause damage, performance degradation, or even failure of the components.

[0037] (6) Integrated Circuit (IC): A tiny electronic device that integrates a large number of electronic components (such as transistors, resistors, capacitors, etc.) onto a small silicon chip;

[0038] (7) Chip on Film (COF): It can directly connect chips to flexible substrates.

[0039] Figure 1 This is an implementation environment architecture diagram of a display panel 10 provided in an embodiment of this application. For example... Figure 1 As shown, the display panel 10 may include a support layer 101, a pixel layer 102, a cover layer 103, a non-touch circuit board 104, and a touch circuit board 105. The cover layer 103, the pixel layer 102, and the support layer 101 are stacked.

[0040] For example, the support layer 101 can be used to support the entire display panel 10 to maintain the stability of the pixel layer 102 and the cover layer 103; for example, the support layer can be made of high-strength, corrosion-resistant metal materials such as stainless steel, aluminum alloy or titanium alloy.

[0041] For example, the pixel layer 102 can be used to realize a light-emitting display; specifically, the pixel layer 102 may include a back film layer for controlling the brightness and color of each pixel inside the display panel 10, a display layer for making the display panel 10 produce a light-emitting effect, and a polarizing layer for controlling the propagation direction of light inside the display panel 10.

[0042] For example, the cover plate layer 103 can be used to protect the pixel layer 102; one end of the non-touch circuit board 104 can be bonded to the pixel layer 102 through a flip-chip film; one end of the touch circuit board 105 can be directly bonded to the pixel layer 102.

[0043] For example, such as Figure 1 As shown in (a), when the display panel 10 is in a flattened shipping state, the non-touch circuit board 104 and the touch circuit board 105 are suspended at the ends away from the pixel layer 102. Optionally, as... Figure 1 As shown in (b), when the display panel 10 is in the folded shipping state, a double-sided adhesive layer can be provided on the side of the support layer 101 away from the pixel layer 102, so that the other end of the non-touch circuit board 104 away from the pixel layer 102 is attached to the side of the support layer 101 away from the pixel layer 102, and the other end of the touch circuit board 105 is attached to the connector 106 of the non-touch circuit board 104.

[0044] It should be noted that when the display panel 10 is shipped in a folded state, a shielding layer can be covered on the side of the non-touch circuit board 104 and the touch circuit board 105 away from the support layer 101 to improve the ESD protection capability between the components. The shielding layer can be composed of a combination of insulating Mylar and conductive cloth.

[0045] Currently, with the evolution of flexible OLED technology, the form in which flexible OLED supply materials (e.g., flexible OLED display panels) are shipped has changed from the initial bent state to the flattened state. However, as mentioned above... Figure 1 As shown, when flexible OLED display panels are shipped flat, their internal module layers and circuit boards are bonded in a non-bending, fixed manner. Therefore, the internal module layers are easily damaged by vibration, impact, or pressure, and the circuit boards are prone to displacement. Both of these situations can easily lead to damage to circuit components. Therefore, the high damage rate of flexible OLED display panels in the flat-pack shipping state in the prior art is a problem that urgently needs to be solved.

[0046] Based on this, this application proposes a display panel that can use a rigid bearing layer to bond the support layer and the circuit board, thereby fixing the support layer and the circuit board. This avoids damage to the display panel due to the positional displacement of internal circuit components when the display panel is flattened for shipment, and reduces the probability of damage to the display panel.

[0047] Figure 2 This is a schematic diagram of the structure of the display panel 20 provided in an embodiment of this application from one viewpoint, such as... Figure 2 As shown, the display panel 20 includes a support layer 201 and a rigid support layer 203 on the side of the support layer 201 away from the pixel layer 202; the rigid support layer 203 includes a first portion 204 and a second portion 205 that are attached to the support layer 201, and a circuit board 206 is attached to the side of the second portion 205 near the support layer 201 so that the display panel 20 is in a flattened state.

[0048] In this embodiment, the display panel 20 can be fixed by the rigid bearing layer 203 and the support layer 201 being in contact, so as to prevent the display panel 20 from bending, folding or scratching due to vibration, collision or squeezing during transportation.

[0049] In one possible implementation, the display panel 20 may include a support layer 201, a pixel layer 202, and a rigid support layer 203. The pixel layer 202, the support layer 201, and the rigid support layer 203 are stacked together.

[0050] For example, the rigid support layer 203 can be bonded to the side of the support layer 201 away from the pixel layer 202. The bonding area between the rigid support layer 203 and the support layer 201 is equal to the area of ​​the support layer 201.

[0051] Specifically, the rigid load-bearing layer 203 and the support layer 201 can be bonded together by an adhesive layer. It should be noted that the area of ​​the adhesive layer can be less than or equal to the bonding area between the rigid load-bearing layer 203 and the support layer 201, and no specific limitation is made here.

[0052] For example, the support layer 201 and the pixel layer 202 can be stacked using a specific adhesive; for instance, a support layer adhesive can be added between the support layer 201 and the pixel layer 202.

[0053] In one possible implementation, the rigid load-bearing layer 203 may be composed of a first part 204 and a second part 205. The first part 204 may be the area where the rigid load-bearing layer 203 and the support layer 201 are attached; the second part 205 may be the area other than the area where the rigid load-bearing layer 203 and the support layer 201 are attached.

[0054] For example, the second portion 205 of the rigid support layer 203, near the support layer 201, may have an adhesive material to achieve adhesion to the circuit board 206. The adhesive material may constitute an adhesive layer.

[0055] Specifically, a circuit board connector may be provided on one side of the circuit board 206, and the second part 205 may be mated with the side of the circuit board 206 without the circuit board connector. The circuit board connector can be used to connect the circuit board 206 to other electronic components.

[0056] In one possible implementation, when the first part 204 and the second part 205 of the rigid support layer 203 are respectively attached to the support layer 201 and the circuit board 206, the display panel 20 can be in a flattened shipping state.

[0057] For example, the rigid support layer 203 can be bonded to the support layer 201 and the circuit board 206 respectively using an adhesive material. Based on this bonding method, when the rigid support layer 203 detaches from the support layer 201 and the circuit board 206, the state of the display panel 20 can be switched from a flattened shipping state to an assemblable state.

[0058] In one possible implementation, circuit board 206 may include a touch circuit board and a non-touch circuit board. The non-touch circuit board may include a printed circuit board (PCB) and a flexible printed circuit board (FPC); the touch circuit board may be a touch-enabled flexible printed circuit board (FPC).

[0059] For example, such as Figure 2 As shown, one end of the circuit board 206 can be bonded to the pixel layer 202 through the flip-chip thin film layer 207, wherein the integrated circuit IC can be bonded to the flip-chip thin film layer 207.

[0060] It should be noted that the integrated circuit IC can be bonded to the side of the flip-chip thin film layer 207 close to the rigid carrier layer 203, or it can be bonded to the side of the flip-chip thin film layer 207 away from the rigid carrier layer 203. No specific restrictions are made here.

[0061] One possible implementation is, such as Figure 2 As shown, the display panel 20 may further include a cover layer 208. The cover layer 208 may have a cover layer ink area 2081. Specifically, the cover layer ink area 2081 can be used to protect circuit components and reduce reflection and light leakage of the display panel 20.

[0062] For example, the cover layer 208 may be disposed on the side of the pixel layer 202 away from the support layer 201 and stacked with the pixel layer 202 to protect the pixel layer 202.

[0063] It should be noted that the display panel 20 in this embodiment can be an external touch display panel (Out-cell Touch Display Module, or Out-cell MDL) or an internal touch display panel (On-cell Touch Display Module, or On-cell MDL).

[0064] For example, the display panel 20 can be determined to be either an Out-cell MDL or an On-cell MDL based on whether an external touch FPC exists inside the display panel 20.

[0065] Specifically, Figure 3 This is a schematic diagram of a pixel layer 202 provided in an embodiment of this application. When the display panel 20 is an Out-cell MDL, the display panel 20 may include an external touch FPC. Figure 3 As shown, the pixel layer 202 may include a touch layer 301, a polarizer layer 302, an OLED display layer 303, and an OLED back film layer 304 stacked together. The touch layer 301 can be bonded to the cover plate layer 208 via an optical adhesive layer 305, and to the polarizer layer 302 via an optical adhesive layer 306.

[0066] When the display panel 20 is an On-cell MDL... Figure 4 This is another schematic diagram of the pixel layer 202 provided in the embodiments of this application, as shown below. Figure 4 As shown, the pixel layer 202 may include a polarizer layer 302, an OLED display layer 303, and an OLED back film layer 304 stacked together. The polarizer layer 302 can be bonded to the cover plate layer 208 via an optical adhesive layer 306.

[0067] It should be noted that one end of the flip-chip film layer 207 can be bonded to both the OLED display layer 303 and the OLED back film layer 304; one end of the touch FPC can be bonded to both the touch layer 301 and the optical adhesive layer 306. Furthermore, the integrated circuit IC can also be bonded to the OLED display layer 303 using anisotropic conductive film (ASF).

[0068] The display panel 20 provided in this application embodiment can have a rigid support layer 203 provided on the side of the support layer 201 away from the pixel layer 202. On the one hand, the rigid support layer 203 can be used to bond the support layer 201 to support the film layers such as the support layer 201 and the pixel layer 202. On the other hand, the rigid support layer 203 can be used to bond the circuit board 206 to fix the circuit board 206, thereby avoiding damage to the display panel 20 due to the positional displacement of internal circuit components when the display panel 20 is flattened for shipment, and thus reducing the probability of damage to the display panel 20.

[0069] In another embodiment of this application, a specific implementation method for the rigid support layer 203 to achieve the bonding function is also described. For example, the second part 205 near the support layer 201 includes a first bonding area and a second bonding area; the first bonding area is bonded to the non-touch circuit board, and the second bonding area is bonded to the touch circuit board.

[0070] In this embodiment, different types of circuit boards can be fixed using the first bonding area and the second bonding area respectively, thereby avoiding the occurrence of poor electrode contact or disconnection due to positional shift during the transportation of the circuit board to the display panel 20.

[0071] In one possible implementation, the second part 205 of the rigid bearing layer 203 can be divided into a first bonding area and a second bonding area on the side near the support layer 201; wherein the area of ​​the first bonding area and the second bonding area is not limited.

[0072] For example, the first bonding area can be used to bond with the circuit board 206 of the display panel 20; wherein the circuit board 206 is a non-touch circuit board, such as an FPC or a PCB. Specifically, the first bonding area can be fully bonded to the non-component area of ​​the non-touch circuit board near the rigid support layer 203. For example, the bonding state between the first bonding area and the non-touch circuit board can be achieved by using an adhesive material.

[0073] For example, the second bonding area can be used to bond with the touch circuit board of the display panel 20; wherein, the touch circuit board can be a touch FPC. Specifically, the second bonding area can be bonded to one end of the touch circuit board where the pixel layer 202 is bonded. For example, the bonding state between the second bonding area and the touch circuit board can be achieved by using an adhesive material.

[0074] For example, an adhesive material can be applied to the side of the second part 205 of the rigid bearing layer 203 near the support layer 201. In this case, the bonding area between the second part 205 and the non-touch circuit board is the first bonding area, and the bonding area between the second part 205 and the touch circuit board is the second bonding area.

[0075] Optionally, adhesive materials can be applied to the bonding portions of the second part 205 and the non-touch circuit board, and to the bonding portions of the second part 205 and the touch circuit board, respectively, to form a first bonding area and a second bonding area.

[0076] It should be noted that the rigid bearing layer 203 can be bonded to the support layer 201, the touch circuit board or the non-touch circuit board using the same or different types of adhesive materials, and no specific restrictions are made here.

[0077] In another embodiment of this application, the specific distribution of the first and second bonding regions is also described. For example, the first bonding region is close to the first portion, and the second bonding region is far from the first portion.

[0078] In one possible implementation, when the display panel 20 includes a touch circuit board, the second bonding area that is bonded to the touch circuit board can be located outside the first bonding area that is bonded to the non-touch circuit board.

[0079] For example, Figure 5 This is another structural schematic diagram of the display panel 20 provided in the embodiments of this application from one viewpoint, such as... Figure 5 As shown, the display panel 20 may include a non-touch circuit board 501 and a touch circuit board 502. The bonding portion between the non-touch circuit board 501 and the rigid support layer 203 is a first bonding area 503, and the bonding portion between the touch circuit board 502 and the rigid support layer 203 is a second bonding area 504. The areas of the first bonding area 503 and the second bonding area 504 may be the areas of the adhesive layer between the non-touch circuit board 501 and the touch circuit board 502 and the rigid support layer 203, respectively.

[0080] It should be noted that when the non-touch circuit board 501 and the touch circuit board 502 are respectively bonded with the rigid carrier layer 203, the flip-chip thin film layer 207 bonded to the non-touch circuit board 501 remains unchanged.

[0081] In another embodiment of this application, a bonding method for the rigid support layer 203 is also described. For example, the circuit board 206 is a non-touch circuit board 501, and the display panel 20 also includes a touch circuit board 502, wherein the length of the touch circuit board 502 along the target direction is less than the length of the second part 205 along the target direction, and the target direction is the direction from the first part 204 to the second part 205.

[0082] In this embodiment, when the extension length of the touch circuit board 502 is less than the bonding length between the rigid support layer 203 and the non-touch circuit board 501, the rigid support layer 203 is only bonded to the non-touch circuit board 501.

[0083] For example, when the non-touch circuit board 501 (e.g., PCB or FPC) is attached to the rigid support layer 203 and the extension length of the touch circuit board 502 (e.g., touch FPC) away from the pixel layer 202 does not exceed the length of the second portion 205 of the rigid support layer 203 in the target direction, the end of the touch circuit board 502 away from the pixel layer 202 is suspended. The target direction is the direction from the first portion 204 to the second portion 205.

[0084] Optionally, when the non-touch circuit board 501 is bonded to the rigid support layer 203 and the extension length of the end of the touch circuit board 502 away from the pixel layer 202 exceeds the length of the second portion 205 of the rigid support layer 203 in the target direction, the end of the touch circuit board 502 away from the pixel layer 202 is in a bonded state with the rigid support layer 203. Specifically, the touch circuit board 502 and the rigid support layer 203 can be bonded together using an adhesive material.

[0085] In another embodiment of this application, one implementation method for bonding the rigid support layer 203 is also described. For example, after the non-touch circuit board 501 is bonded to the second portion 205, the distance between the non-touch circuit board 501 and the edge of the second portion 205 along the length direction of the display panel 20 is not less than 1% of the length of the rigid support layer 204.

[0086] In this embodiment, the rigid support layer 203 can be designed in a way that ensures its fixation when the second part 205 of the rigid support layer 203 is attached to the non-touch circuit board 501.

[0087] For example, Figure 6 This is a structural schematic diagram of the display panel 20 provided in the embodiments of this application from another perspective, such as... Figure 6 As shown, when the non-touch circuit board 501 is attached to the second part 205, the distance between the non-touch circuit board 501 and the edge of the second part 205 along the length direction of the display panel 20 is d6.1, where d6.1 is not less than 1% of the length of the rigid support layer 204.

[0088] Secondly, such as Figure 6 As shown, when the support layer 201 is attached to the rigid support layer 203, the distance between the edges of the support layer 201 and the rigid support layer 203 along the width direction of the display panel 20 is d6.2, where d6.2 is not less than 2% of the width of the rigid support layer 204.

[0089] In another embodiment of this application, another implementation method for achieving the bonding of the rigid support layer 203 is also described. For example, after the non-touch circuit board 501 and the touch circuit board 502 are bonded to the second portion 205, the distance between the edges of the non-touch circuit board 501 and the second portion 205 along the length direction of the display panel 20 is greater than 1% of the length of the rigid support layer 203.

[0090] In this embodiment, the rigid support layer 203 can be further designed to ensure its fixing function when it is attached to the non-touch circuit board 501 and the touch circuit board 502 respectively.

[0091] In one possible implementation, when the display panel 20 is an external touch display panel and the extension length of the end of the touch circuit board 502 of the display panel 20 away from the pixel layer 202 exceeds the length of the second part 205 of the rigid support layer 203 in the target direction, the end of the touch circuit board 502 away from the pixel layer 202 is in a bonded state with the rigid support layer 203.

[0092] For example, such as Figure 6 As shown, when the non-touch circuit board 501 and the touch circuit board 502 are respectively attached to the second part 205, the distance between the edges of the non-touch circuit board 501 and the second part 205 along the length direction of the display panel 20 is d6.3, where d6.3 is greater than 1% of the length of the rigid support layer 204.

[0093] It should be noted that when the non-touch circuit board 501 and the touch circuit board 502 are respectively attached to the second part 205, the design length of the rigid support layer 203 is obviously greater than the design length of the rigid support layer 203 when the non-touch circuit board 501 and the second part 205 are attached. Therefore, the above-mentioned d6.3 must be greater than the above-mentioned d6.1.

[0094] In another embodiment of this application, other distributions of the rigid support layer 203 are also described. Exemplarily, the second portion 205 near the support layer 201 also includes a humidity indicator layer.

[0095] In this embodiment, the humidity inside the display panel 20 can be detected using a humidity indicator layer, so that the humidity inside the display panel 20 can be directly determined based on the color change of the humidity indicator layer, thereby achieving quality control of the display panel 20.

[0096] In one possible implementation, a humidity indicator layer may be provided on the side of the second portion 205 of the rigid bearing layer 203 near the support layer 201.

[0097] For example, the humidity indicator layer can be a humidity indicator test strip used to measure and monitor the relative humidity level in an environment or enclosed space.

[0098] For example, the humidity indicator layer can be disposed on the rigid support layer 203 in an area close to the components of the non-touch circuit board 501. For instance, as... Figure 6 As shown, the humidity indicator layer 601 can be positioned opposite to the non-touch circuit board 501.

[0099] It should be noted that, as Figure 6 As shown, the edge distance of the rigid support layer 203 where the humidity indicator layer 601 is located is d6.4. In order to avoid the humidity indicator layer 601 from interfering with other components inside the display panel 20, the length of d6.4 needs to be greater than d6.2.

[0100] In another embodiment of this application, other distributions of the rigid support layer 203 are also described. Exemplarily, the rigid support layer 203 further includes limiting holes, which are disposed in the non-adhesive area of ​​the rigid support layer 203; wherein, the non-adhesive area is the area on the rigid support layer 203 other than the adhesive support layer 201 and the circuit board.

[0101] In this embodiment, the installation efficiency of the display panel 20 can be improved by setting limiting holes on the rigid bearing layer 203.

[0102] In one possible implementation, a limiting hole can be provided in the non-adhesive area of ​​the rigid support layer 203. Specifically, the non-adhesive area of ​​the rigid support layer 203 refers to the area on the rigid support layer 203 excluding the adhesive support layer 201, the non-touch circuit board 501, and the touch circuit board 502. Optionally, a limiting groove can be provided in the non-adhesive area of ​​the rigid support layer 203.

[0103] For example, such as Figure 6 As shown, a limiting hole 602 can be provided in the edge area of ​​the rigid bearing layer 203.

[0104] It should be noted that the opening area of ​​the limiting hole 602 is not less than 1*πmm2, the distance between its center position and the edge of the rigid bearing layer 203 is not less than 1.5mm, and the distance between the limiting hole 602 and the edge of the rigid bearing layer 203 is not less than 3mm.

[0105] In another embodiment of this application, other distributions of the rigid support layer 203 are also described. For example, an adhesive layer is provided on the side of the second portion 205 near the support layer 201, the adhesive layer being used to adhere the circuit board 206.

[0106] In this embodiment, the rigid bearing layer 203, the support layer 201, and the circuit board 206 can be bonded together with adhesive layers. Based on this bonding method, the rigid bearing layer 203 can be easily detached from the bonded state.

[0107] In one possible implementation, when the rigid support layer 203 is bonded to the support layer 201, the non-touch circuit board 501, and the touch circuit board 502, a first adhesive layer can be provided in the bonding area between the rigid support layer 203 and the support layer 201, a second adhesive layer can be provided in the bonding area between the rigid support layer 203 and the non-touch circuit board 501, and a third adhesive layer can be provided in the bonding area between the rigid support layer 203 and the touch circuit board 502. The adhesive layers can be made of adhesive substances such as glue, double-sided tape, or resin; no specific limitations are placed on the adhesive substances used in the first, second, and third adhesive layers.

[0108] Optionally, when the rigid bearing layer 203 is bonded to the support layer 201 and the non-touch circuit board 501 respectively, a first adhesive layer can be provided in the bonding area between the rigid bearing layer 203 and the support layer 201, and a second adhesive layer can be provided in the bonding area between the rigid bearing layer 203 and the non-touch circuit board 501.

[0109] For example, Figure 7 This is a schematic diagram of the adhesive layer provided in the embodiments of this application. When the first adhesive layer is as follows... Figure 7 As shown, the inward dimension of the first adhesive layer relative to the support layer 201 is not less than 0.25 mm, i.e., a1 = b1 = c1 = d1 ≥ 0.25 mm; when the second adhesive layer is as shown... Figure 7 As shown, the inward dimension of the second adhesive layer relative to the non-touch circuit board 501 is not less than 0.5mm, i.e., a1=b1=c1=d1≥0.5mm; when the third adhesive layer is as shown... Figure 7 As shown, the inward dimension of the third adhesive layer relative to the touch circuit board 502 is not less than 0.5mm, that is, a1=b1=c1=d1≥0.5mm.

[0110] In another embodiment of this application, a display device 30 is also described. Exemplarily, the display device 30 includes the display panel 20 of the above embodiments.

[0111] In one possible implementation, the display device 30 can be used to output image information. For example, the display device 30 can display text images by controlling semiconductor light-emitting diodes; for instance, the display device 30 can be an OLED display.

[0112] The display device 30 provided in this application embodiment can provide a rigid support layer 203 on the side of the support layer 201 away from the pixel layer 202. On the one hand, the rigid support layer 203 can be used to bond the support layer 201 to support the film layers such as the support layer 201 and the pixel layer 202. On the other hand, the rigid support layer 203 can be used to bond the circuit board 206 to fix the circuit board 206, thereby avoiding damage to the display panel 20 due to the positional displacement of internal circuit components when the display panel 20 is flattened for shipment, and thus reducing the probability of damage to the display panel 20.

[0113] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of disclosure in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the foregoing disclosed concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A display panel, characterized in that, The display panel includes a support layer and a rigid support layer on the side of the support layer away from the pixel layer; the rigid support layer includes a first portion and a second portion that are attached to the support layer, and a circuit board is attached to the side of the second portion that is close to the support layer, so that the display panel is in a flattened state. The second part includes a first bonding area and a second bonding area on the side near the support layer; the first bonding area is bonded to the non-touch circuit board, and the second bonding area is bonded to the touch circuit board.

2. The display panel according to claim 1, characterized in that, The first bonding area is close to the first part, and the second bonding area is far away from the first part.

3. The display panel according to claim 1, characterized in that, The circuit board is a non-touch circuit board, and the display panel also includes a touch circuit board. The length of the touch circuit board along the target direction is less than the length of the second part along the target direction. The target direction is the direction from the first part to the second part.

4. The display panel according to claim 3, characterized in that, After the non-touch circuit board is attached to the second part, the distance between the non-touch circuit board and the edge of the second part along the length direction of the display panel is not less than 1% of the length of the rigid support layer.

5. The display panel according to claim 2, characterized in that, After the non-touch circuit board and the touch circuit board are attached to the second part, the distance between the non-touch circuit board and the edge of the second part along the length direction of the display panel is greater than 1% of the length of the rigid support layer.

6. The display panel according to claim 1, characterized in that, The second part also includes a humidity indicator layer on the side near the support layer.

7. The display panel according to claim 1, characterized in that, The rigid support layer further includes a limiting hole, which is disposed in the non-adhesive area of ​​the rigid support layer; wherein, the non-adhesive area is the area on the rigid support layer other than the area adhering to the support layer and the circuit board.

8. The display panel according to claim 1, characterized in that, The second part has an adhesive layer on the side near the support layer, which is used to adhere the circuit board.

9. A display device, characterized in that, Includes the display panel as described in any one of claims 1-8.

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