Backlight module and display module

Abstract

The application provides a backlight module and a display module. The backlight module comprises a first flexible circuit board, a plurality of light emitting components, a second flexible circuit board and electronic components. The first flexible circuit board comprises at least two first conductive layers arranged in a stack. Two adjacent first conductive layers are arranged separately. The light emitting components are arranged on the first flexible circuit board and electrically connected with the first conductive layers. The second flexible circuit board is fixed to one side of the first flexible circuit board. The second flexible circuit board comprises a second conductive layer electrically connected with the first conductive layers. The number of the first conductive layers is greater than that of the second conductive layers. The electronic components are arranged on the second flexible circuit board and electrically connected with the second conductive layers. The application can reduce the manufacturing cost of the backlight module while integrating more light emitting components.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a backlight module and a display module. BACKGROUND

[0002] In order to achieve better display effect, more light emitting components composed of control chips and LED lamp beads are usually arranged in the backlight module of the display device. In order to integrate more light emitting components in the backlight module, the traditional method is to increase the number of conductive layers of the flexible circuit board in the backlight module, so that the light emitting components have enough wiring space. However, the increase of the number of conductive layers will result in high manufacturing cost of the backlight module.

[0003] Therefore, it is necessary to provide a new technical scheme to solve the above technical problems. SUMMARY

[0004] The purpose of the present application is to provide a backlight module and a display module, so as to reduce the manufacturing cost of the backlight module under the premise of integrating more light emitting components in the backlight module.

[0005] To solve the above problems, the technical scheme of the present application is as follows:

[0006] In a first aspect, the present application provides a backlight module, which comprises:

[0007] A first flexible circuit board comprising at least two first conductive layers located at different layers;

[0008] A plurality of light emitting components arranged on the first flexible circuit board and electrically connected with the first conductive layers;

[0009] A second flexible circuit board fixed on one side of the first flexible circuit board, the second flexible circuit board comprising a second conductive layer, the second conductive layer being electrically connected with the first conductive layer, and the number of the first conductive layers being greater than the number of the second conductive layers;

[0010] An electronic component arranged on the second flexible circuit board, the electronic component being electrically connected with the second conductive layer.

[0011] Optionally, in some embodiments of the present application, a first step is provided on a side of the first flexible circuit board facing away from the light-emitting component, the first step is located on a side of the first flexible circuit board close to the second flexible circuit board, a portion of the bottom surface of the first conductive layer is exposed to the step surface of the first step, and a second step is provided on a side of the second flexible circuit board facing the electronic component, the second step is located on a side of the second flexible circuit board close to the first flexible circuit board, a portion of the top surface of the second conductive layer is exposed to the step surface of the second step, at least a portion of the step surface of the first step is superimposed on at least a portion of the step surface of the second step, and the portion of the first conductive layer exposed to the step surface of the first step is electrically connected to the portion of the second conductive layer exposed to the step surface of the second step.

[0012] Optionally, in some embodiments of the present application, the first flexible circuit board further includes a first substrate, at least one layer of the first conductive layer is located below the first substrate, a portion of the bottom surface of the first conductive layer located below the first substrate is exposed to the step surface of the first step, and the second flexible circuit board further includes a second substrate, and the second conductive layer is located above the second substrate.

[0013] Optionally, in some embodiments of the present application, a first step is provided on a side of the first flexible circuit board facing the light-emitting component, the first step is located on a side of the first flexible circuit board close to the second flexible circuit board, a portion of the top surface of the first conductive layer is exposed to the step surface of the first step, and a second step is provided on a side of the second flexible circuit board facing away from the electronic component, the second step is located on a side of the second flexible circuit board close to the first flexible circuit board, a portion of the bottom surface of the second conductive layer is exposed to the step surface of the second step, the step surface of the second step is located on the step surface of the first step, and the first conductive layer exposed to the step surface of the first step is electrically connected to the second conductive layer exposed to the step surface of the second step.

[0014] Optionally, in some embodiments of the present application, the first flexible circuit board further includes a first substrate, at least one layer of the first conductive layer is located above the first substrate, and a portion of the top surface of the first conductive layer located above the first substrate is exposed to the step surface of the first step, and the second flexible circuit board further includes a second substrate, and the second conductive layer is located above or below the second substrate.

[0015] Optionally, in some embodiments of the present application, a first binding portion is provided on the first conductive layer exposed to the step surface of the first step, the first binding portion is provided with a plurality of first conductive parts, the first conductive parts are located on the step surface of the first step, a second binding portion is provided on the second conductive layer exposed to the step surface of the second step, the second binding portion is provided with a plurality of second conductive parts, the second conductive parts are located on the step surface of the second step, and the first conductive parts are connected to the second conductive parts via conductive glue.

[0016] Optionally, in some embodiments of the present application, the first flexible circuit board is provided with a first bending portion, the area where the first bending portion is located is located between the area where the light-emitting component is located and the area where the first step is located, and the first bending portion is located on the same side of any two of the light-emitting components.

[0017] Optionally, in some embodiments of the present application, the second flexible circuit board is provided with a second bending portion, and the area where the second bending portion is located is located between the area where the electronic component is located and the area where the second step is located.

[0018] Optionally, in some embodiments of the present application, an electrical connector is provided on the first flexible circuit board, the electrical connector is electrically connected to the first conductive layer, one end of the second flexible circuit board is inserted into the electrical connector, and the second conductive layer is electrically connected to the first conductive layer through the electrical connector.

[0019] In a second aspect, the present application proposes a display module, comprising:

[0020] The backlight module as described in any of the above embodiments; and

[0021] The display panel is arranged above the light-emitting component of the backlight module. The display panel includes an array substrate, an opposite substrate, and a liquid crystal layer located between the array substrate and the opposite substrate.

[0022] The backlight module of the present application is formed by splicing two flexible circuit boards, so that the first flexible circuit board and the second flexible circuit board can be manufactured separately. The present application enables the first flexible circuit board electrically connected to multiple light-emitting components to have multiple first conductive layers, so that the first flexible circuit board can provide routing space for partitioned circuits of a larger number of light-emitting components. By electrically connecting the first conductive layer of the first flexible circuit board and the second conductive layer of the second flexible circuit board, the electronic components on the second flexible circuit board can control the electrical signals of the light-emitting components on the first flexible circuit board, and reduces the manufacturing cost of the vias and the conductive layer of the second flexible circuit board, thereby reducing the manufacturing cost of the backlight module while integrating more light-emitting components. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a schematic diagram of a backlight module of the prior art;

[0024] Figure 2 is a top view of the backlight module shown in Figure 1

[0025] Figure 3 is a schematic diagram of the backlight module provided by Embodiment One of the present application in a first case;

[0026] Figure 4 is a cross-sectional view of the backlight module shown in Figure 3

[0027] Figure 5 is a schematic diagram of the first flexible circuit board and the second flexible circuit board of the backlight module shown in Figure 3

[0028] Figure 6 is a schematic diagram of the first flexible circuit board and the second flexible circuit board of the backlight module shown in Figure 3

[0029] Figure 7 is a schematic diagram of the backlight module provided by Embodiment One of the present application in a second case;

[0030] Figure 8 is a schematic diagram of the backlight module provided by Embodiment Two of the present application;

[0031] Figure 9 is a schematic diagram of the backlight module provided by Embodiment Three of the present application;

[0032] Figure 10 is a schematic diagram of the display module provided by the present application.

[0033] Reference signs:

[0034] 10, backlight module; 100, first flexible circuit board; 110, first conductive layer; 120, first substrate; 130, first upper encapsulation layer; 140, first lower encapsulation layer; 151, first adhesive layer; 152, first cover film layer; 1001, first step; 160, first binding portion; 161, first conductive member; 170, first bending portion;

[0035] 200, light-emitting assembly; 210, light-emitting lamp bead; 220, control chip;

[0036] ​​​​300, second flexible circuit board; 310, second conductive layer; 320, second substrate; 330, second upper encapsulation layer; 340, second lower encapsulation layer; 351, second adhesive layer; 352, second cover film layer; 3001, second step; 360, second binding portion; 361, second conductive member; 370, second bending portion;

[0037] 400. Electronic components;

[0038] 501, light emitting area; 502, bending area; 503, circuit board connection area; 504, component binding area;

[0039] 600, electrical connector;

[0040] 20. Display panel; 700. Array substrate; 800. Counter substrate; 900. Liquid crystal layer. DETAILED DESCRIPTION

[0041] The meanings of the terms used in this specification and claims correspond to those commonly understood by persons of ordinary skill in the art to which this application belongs. The terms used in this specification and claims are intended solely to facilitate the description and understanding of this application and are not intended to limit this application to the narrow interpretations of the specific terms used in the specification and claims.

[0042] In addition, the terms "first", "second" and similar words do not indicate any order, quantity or importance, but are only used to distinguish different technical features. The term "plurality" and similar words mean two or more, unless otherwise expressly limited.

[0043] The various embodiments provided in this application are similar, and features of different embodiments may be combined with each other.

[0044] See Figures 3 to 8 The present application provides a backlight module, which includes a first flexible circuit board 100, a plurality of light-emitting components 200, a second flexible circuit board 300 and electronic components 400.

[0045] The first flexible circuit board 100 includes at least two stacked first conductive layers 110 , and two adjacent first conductive layers 110 are separated to provide more wiring space, so that the backlight module can integrate more light-emitting components.

[0046] The light emitting component 200 is disposed on the first flexible circuit board 100 and electrically connected to the first conductive layer 110. The second flexible circuit board 300 is fixed to one side of the first flexible circuit board 100. The second flexible circuit board 300 includes a second conductive layer 310, which is electrically connected to the first conductive layer 110.

[0047] The electronic component 400 is disposed on the second flexible circuit board 300 , and the electronic component 400 is electrically connected to the second conductive layer 310 .

[0048] The backlight module of the present application is formed by splicing two flexible circuit boards, so that the first flexible circuit board 100 and the second flexible circuit board 300 can be manufactured separately. By providing the first flexible circuit board 100, which is electrically connected to multiple light-emitting components 200, with multiple first conductive layers 110, the first flexible circuit board 100 can provide routing space for the partitioned circuits of a large number of light-emitting components 200. By electrically connecting the first conductive layer 110 of the first flexible circuit board 100 with the second conductive layer 310 of the second flexible circuit board 300, the electronic components 400 on the second flexible circuit board 300 can control the electrical signals of the light-emitting components 200 on the first flexible circuit board 100. In addition, the manufacturing cost of the vias and conductive layers of the second flexible circuit board 300 is reduced, thereby reducing the manufacturing cost of the backlight module while integrating more light-emitting components.

[0049] In this application, the light-emitting assembly 200 includes a light-emitting lamp 210 and a control chip 220, wherein the light-emitting lamp 210 and the control chip 220 are both electrically connected to the first conductive layer 110. The light-emitting area 501 of the backlight module is divided into multiple partitions, and the light-emitting lamp 210 and the control chip 220 in each partition are electrically connected to the same first conductive layer 110. At least two light-emitting assemblies 200 are electrically connected to two first conductive layers 110, respectively.

[0050] The multi-layer first conductive layer 110 provides sufficient space for the routing of multiple light-emitting components 200, which is beneficial to increasing the number of partitions of the light-emitting area 501, can adapt to more complex circuits of light-emitting lamp beads 210, and a larger number of driver chips, which is beneficial to improving the display effect of the display device.

[0051] In this embodiment, the electronic component 400 includes a resistor and / or a capacitor.

[0052] In this embodiment, the thickness of the first flexible circuit board 100 is greater than that of the second flexible circuit board 300. Specifically, the number of first conductive layers 110 of the first flexible circuit board 100 is greater than the number of second conductive layers 310 of the second flexible circuit board 300, thereby reducing the manufacturing cost of the vias and conductive layers of the second flexible circuit board 300.

[0053] like Figures 3 to 6 As shown, in the first embodiment of the present application, the number of the first conductive layer 110 of the first flexible circuit board 100 is two, and the number of the second conductive layer 310 of the second flexible circuit board 300 is one.

[0054] Alternatively, the first conductive layer 110 of the first flexible circuit board 100 is two or more layers in number, and the second conductive layer 310 of the second flexible circuit board 300 is one layer in number.

[0055] In the embodiment, the electronic components 400 on the second flexible circuit board 300 are electrically connected to the same second conductive layer 310, and the at least two light-emitting assemblies 200 on the first flexible circuit board 100 are electrically connected to different layers of the first conductive layer 110, so that the light-emitting assemblies 200 have more wiring space.

[0056] In the embodiment, the first flexible circuit board 100 is provided with a first step 1001 on the side away from the light-emitting device, the first step 1001 is located on the side of the first flexible circuit board 100 close to the second flexible circuit board 300, a part of the bottom surface of the first conductive layer 110 is exposed to the step surface of the first step 1001, the second flexible circuit board 300 is provided with a second step 3001 on the side facing the electronic components 400, the second step 3001 is located on the side of the second flexible circuit board 300 close to the first flexible circuit board 100, a part of the top surface of the second conductive layer 310 is exposed to the step surface of the second step 3001, at least a part of the step surface of the first step 1001 is stacked on at least a part of the step surface of the second step 3001, and the part of the first conductive layer 110 exposed to the step surface of the first step 1001 is electrically connected to the part of the second conductive layer 310 exposed to the step surface of the second step 3001.

[0057] In the embodiment, the first step 1001 is arranged on the side of the first flexible circuit board 100 away from the light-emitting device to expose a part of the bottom surface of the first conductive layer 110, the second step 3001 is arranged on the side of the second flexible circuit board 300 away from the light-emitting device to expose a part of the bottom surface of the second conductive layer 310, the first step 1001 is butted against the second step 3001 to electrically connect the first conductive layer 110 and the second conductive layer 310, and the electrical connection of the first conductive layer 110 and the second conductive layer 310 does not need to be additionally provided with other devices, thereby reducing the manufacturing cost of splicing the first flexible circuit board 100 and the second flexible circuit board 300.

[0058] In the embodiment, the first conductive layer 110 is located above the second conductive layer 310.

[0059] In the embodiment, the first flexible circuit board 100 further includes a first substrate 120, and the at least one first conductive layer 110 is located below the first substrate 120, and a part of the bottom surface of the first conductive layer 110 located below the first substrate 120 is exposed to the step surface of the first step 1001.

[0060] Specifically, when the first flexible circuit board 100 has two layers of first conductive layers 110, one layer of the first conductive layer 110 is located above the first substrate 120, and the other layer of the first conductive layer 110 is located below the first substrate 120. When the first step 1001 is arranged on the side of the first flexible circuit board 100 facing away from the light-emitting component 200, that is, when the first step 1001 is arranged on the back side of the first flexible circuit board 100, a portion of the bottom surface of the first conductive layer 110 located below the first substrate 120 is exposed to the step surface of the first step 1001, that is, only the portion of the first flexible circuit board 100 located below the first substrate 120 is removed, and the first substrate 120 is retained, ensuring that the first substrate 120 can maintain a supporting effect on the film layer of the first flexible circuit board 100.

[0061] In this embodiment, the second flexible circuit board 300 further includes a second substrate 320 , and the second conductive layer 310 is located above the second substrate 320 .

[0062] In this embodiment, a first binding portion 160 is provided on the first conductive layer 110 exposed on the step surface of the first step 1001, and the first binding portion 160 is provided with multiple first conductive parts 161, and the first conductive parts 161 are located on the step surface of the first step 1001. A second binding portion 360 is provided on the second conductive layer 310 exposed on the step surface of the second step 3001, and the second binding portion 360 is provided with multiple second conductive parts 361, and the second conductive parts 361 are located on the step surface of the second step 3001. The first conductive parts 161 are connected to the second conductive parts 361 through conductive glue.

[0063] In this embodiment, the bottom surface of the second flexible circuit board 300 is located at a lower plane than the bottom surface of the first flexible circuit board 100 , and the top surface of the second flexible circuit board 300 is located at a lower plane than the top surface of the first flexible circuit board 100 .

[0064] In this embodiment, the first conductive member 161 of the first conductive layer 110 and the second conductive member 361 of the second conductive layer 310 are bound to fix the second flexible circuit board 300 on the first flexible circuit board 100 so that the second conductive layer 310 is electrically connected to one of the first conductive layers 110 .

[0065] In this embodiment, a portion of the first flexible circuit board 100 overlaps a portion of the second flexible circuit board 300 .

[0066] In this embodiment, a portion of the first conductive layer 110 overlaps a portion of the second conductive layer 310 .

[0067] In this embodiment, in a top view, the length of the overlapping portion of the first conductive layer 110 and the second conductive layer 310, in the direction from the first flexible circuit board 100 toward the second flexible circuit board 300, is greater than or equal to 500 μm. Within this range, the electrical contact between the first conductive layer 110 and the second conductive layer 310 is reliable, improving the stability of electrical signal transmission in the backlight module.

[0068] In this embodiment, the distance between the center lines of two adjacent first conductive members 161 is 0.12 mm, and the distance between the center lines of two adjacent second conductive members 361 is 0.12 mm.

[0069] like Figure 3 As shown, in this embodiment, the first flexible circuit board 100 is provided with a first bending portion 170, and the area where the first bending portion 170 is located is located between the area where the light-emitting component 200 is located and the area where the first step 1001 is located, and the first bending portion 170 is located on the same side of any two light-emitting components 200.

[0070] Specifically, the first bending portion 170 is located on a side of any two light-emitting components 200 close to the first step 1001 .

[0071] In this embodiment, the area where the first bent portion 170 is located is located between the area where the light-emitting component 200 is located and the area where the first step 1001 is located. The first bent portion 170 is provided in an area other than the connection position between the first flexible circuit board 100 and the second flexible circuit board 300. This reduces the stress on the connection between the first flexible circuit board 100 and the second flexible circuit board 300 when the backlight module is in a bent state, thereby preventing the first flexible circuit board 100 and the second flexible circuit board 300 from being broken due to the stress.

[0072] Furthermore, the area where the first bending portion 170 is located is located between the area where the light-emitting component 200 is located and the area where the first step 1001 is located, so that after the first bending portion 170 is bent, the first step 1001 and the second step 3001 are both located on the back side of the backlight module, thereby ensuring that the first conductive layer 110 and the second conductive layer 310 have a larger binding area while the display device has a narrower frame.

[0073] Or, as Figure 7 As shown, the second flexible circuit board 300 is provided with a second bending portion 370 , and the area where the second bending portion 370 is located is located between the area where the electronic component 400 is located and the area where the second step 3001 is located.

[0074] In this embodiment, the first flexible circuit board 100 further includes a first substrate 120, a first upper encapsulation layer 130, and a second lower encapsulation layer 340. At least two first conductive layers 110 are respectively located on opposite sides of the first substrate 120 and between the first upper encapsulation layer 130 and the first lower encapsulation layer 140. The first upper encapsulation layer 130 and the first lower encapsulation layer 140 are respectively in contact with the two first conductive layers 110.

[0075] The second flexible circuit board 300 also includes a second substrate 320, a second upper packaging layer 330 and a second lower packaging layer 340. The second conductive layer 310 is located on the surface of the second substrate 320 close to the electronic components 400 and contacts the second substrate 320. The second upper packaging layer 330 contacts the surface of the second conductive layer 310 away from the second substrate 320, and the second lower packaging layer 340 contacts the surface of the second substrate 320 away from the second conductive layer 310.

[0076] Specifically, the first flexible circuit board 100 includes a first upper packaging layer 130 and a second lower packaging layer 340, and the two first conductive layers 110 are respectively in contact with the opposite sides of the first substrate 120, wherein the first upper packaging layer 130 is arranged on the first conductive layer 110 located on the side of the first substrate 120 close to the light-emitting device, and the first lower packaging layer 140 is arranged below the first conductive layer 110 located on the side of the first substrate 120 away from the light-emitting device.

[0077] In this embodiment, the first upper encapsulation layer 130 and the first lower encapsulation layer 140 include a first adhesive layer 151 and a first cover film layer 152 . The first cover film layer 152 is connected to the first conductive layer 110 through the first adhesive layer 151 .

[0078] In this embodiment, the second conductive layer 310 contacts the second substrate 320 and is laminated to the second upper packaging layer 330 . The side of the second substrate 320 facing away from the second conductive layer 310 is laminated to the second lower packaging layer 340 .

[0079] The second upper encapsulation layer 330 and the second lower encapsulation layer 340 each include a second adhesive layer 351 and a second cover film layer 352 .

[0080] like Figure 7 As shown, in the second embodiment of the present application, the second embodiment is similar to the first embodiment, and the second embodiment and the first embodiment can be combined. The difference between the second embodiment and the first embodiment is:

[0081] In the embodiment, the first flexible circuit board 100 is provided with a first step 1001 on the side facing the light emitting device, the first step 1001 is located on the side of the first flexible circuit board 100 close to the second flexible circuit board 300, a part of the top surface of the first conductive layer 110 constitutes the step surface of the first step 1001, the second flexible circuit board 300 is provided with a second step 3001 on the side away from the electronic component 400, the second step 3001 is located on the side of the second flexible circuit board 300 close to the first flexible circuit board 100, a part of the bottom surface of the second conductive layer 310 constitutes the step surface of the second step 3001, the step surface of the second step 3001 is located on the step surface of the first step 1001, and the first conductive layer 110 constituting the step surface of the first step 1001 is electrically connected with the second conductive layer 310 constituting the step surface of the second step 3001.

[0082] In the embodiment, the second conductive layer 310 is located above the first conductive layer 110.

[0083] In the embodiment, the first flexible circuit board 100 further comprises a first substrate 120, and at least one first conductive layer 110 is located above the first substrate 120, a part of the top surface of the first conductive layer 110 located above the first substrate 120 constitutes the step surface of the first step 1001.

[0084] Specifically, in the case that the first flexible circuit board 100 has two first conductive layers 110, one first conductive layer 110 is located above the first substrate 120, and the other first conductive layer 110 is located below the first substrate 120, wherein, in the case that the first step 1001 is arranged on the side of the first flexible circuit board 100 close to the light emitting assembly 200, i.e. in the case that the first step 1001 is arranged on the top surface of the first flexible circuit board 100, a part of the top surface of the first conductive layer 110 located above the first substrate 120 constitutes the step surface of the first step 1001, i.e. only the part of the first flexible circuit board 100 located above the first substrate 120 is removed, and the first substrate 120 is retained, so as to ensure that the first substrate 120 can support the film layer of the first flexible circuit board 100.

[0085] In the embodiment, the second conductive layer 310 is located above or below the second substrate 320.

[0086] In the embodiment, the plane where the top surface of the first flexible circuit board 100 is located is lower than the plane where the top surface of the second flexible circuit board 300 is located, and the plane where the bottom surface of the first flexible circuit board 100 is located is lower than the plane where the bottom surface of the second flexible circuit board 300 is located.

[0087] Alternatively, the first flexible circuit board 100 is not provided with the first step 1001, and the second flexible circuit board 300 is not provided with a step. The side surface of the first flexible circuit board 100 contacts the side surface of the second flexible circuit board 300, and the side surface of the first conductive layer 110 is connected to the side surface of the second conductive layer 310 to achieve splicing of the first flexible circuit board 100 and the second flexible circuit board 300.

[0088] Specifically, the first flexible circuit board 100 and the second flexible circuit board 300 are connected by adhesive.

[0089] like Figure 8 As shown, in the third embodiment of the present application, the third embodiment is similar to the first embodiment, and the third embodiment can be combined with at least one of the first embodiment and the second embodiment. The difference between the third embodiment and the first embodiment is that:

[0090] An electrical connector 600 is provided on the first flexible circuit board 100 , which is electrically connected to the first conductive layer 110 . One end of the second flexible circuit board 300 is plugged into the electrical connector 600 , and the second conductive layer 310 is electrically connected to the first conductive layer 110 through the electrical connector 600 .

[0091] In this embodiment, by providing the electrical connector 600 on the first flexible circuit board 100 , the first flexible circuit board 100 can be electrically connected to the second flexible circuit board 300 through the electrical connector 600 .

[0092] like Figure 10 As shown, based on the backlight module provided in the above embodiment, the present application further provides a display module, which includes:

[0093] The backlight module 10 and the display panel 20 provided in any of the above embodiments.

[0094] The display panel 20 is disposed above the light emitting component 200 of the backlight module 10 . The display panel 20 includes an array substrate 700 , an opposing substrate 800 , and a liquid crystal layer 900 located between the array substrate 700 and the opposing substrate 800 . The backlight module 10 provides a backlight source for the display panel 20 .

[0095] The above describes in detail the specific embodiments of the present application. The above embodiments disclosed in this application are merely preferred embodiments of the present application. Those skilled in the art will appreciate that many variations and improvements can be made without departing from the spirit of the present application. These variations and improvements fall within the scope of protection defined by the claims of this application.

Claims

1. A backlight module, characterized in that: include: A first flexible circuit board includes a first substrate and at least two first conductive layers located in different layers, at least one first conductive layer is located above the first substrate, and at least one first conductive layer is located below the first substrate; a plurality of light-emitting components, wherein the light-emitting components are disposed on the first flexible circuit board and electrically connected to the first conductive layer; a second flexible circuit board fixed to one side of the first flexible circuit board, the second flexible circuit board comprising a second substrate and a second conductive layer, the second conductive layer being located above the second substrate and electrically connected to the first conductive layer, and the number of the first conductive layers being greater than the number of the second conductive layers; electronic components, disposed on the second flexible circuit board, the electronic components being electrically connected to the second conductive layer; In which, a first step is provided on a side of the first flexible circuit board close to the second flexible circuit board, a portion of the bottom surface of the first conductive layer located below the first substrate is exposed to the step surface of the first step, a second step is provided on a side of the second flexible circuit board close to the first flexible circuit board, a portion of the top surface of the second conductive layer is exposed to the step surface of the second step, the first step of the first flexible circuit board overlaps the second step of the second flexible circuit board, the exposed first conductive layer and the exposed second conductive layer are electrically connected, and the exposed second conductive layer and the light-emitting component are respectively connected to the first conductive layers located on different layers.

2. The backlight module according to claim 1, wherein: The first step is provided on a side of the first flexible circuit board facing away from the light-emitting component, and the second step is provided on a side of the second flexible circuit board facing the electronic component. At least a portion of the step surface of the first step is overlapped on at least a portion of the step surface of the second step, and the portion of the first conductive layer exposed to the step surface of the first step is electrically connected to the portion of the second conductive layer exposed to the step surface of the second step.

3. The backlight module according to claim 2, wherein: A first binding portion is provided on the first conductive layer exposed on the step surface of the first step, and the first binding portion is provided with multiple first conductive parts, and the first conductive parts are located on the step surface of the first step. A second binding portion is provided on the second conductive layer exposed on the step surface of the second step, and the second binding portion is provided with multiple second conductive parts, and the second conductive parts are located on the step surface of the second step. The first conductive part is connected to the second conductive part through conductive glue.

4. The backlight module according to claim 2, wherein: The first flexible circuit board is provided with a first bending portion, the area where the first bending portion is located is located between the area where the light-emitting components are located and the area where the first step is located, and the first bending portion is located on the same side of any two light-emitting components.

5. The backlight module according to claim 2, wherein: The second flexible circuit board is provided with a second bending portion, and the area where the second bending portion is located is located between the area where the electronic component is located and the area where the second step is located.

6. The backlight module according to claim 1, wherein: An electrical connector is provided on the first flexible circuit board, and the electrical connector is electrically connected to the first conductive layer. One end of the second flexible circuit board is plugged into the electrical connector, and the second conductive layer is electrically connected to the first conductive layer through the electrical connector.

7. A display module, characterized in that: include: The backlight module according to any one of claims 1 to 6; as well as The display panel is arranged above the light-emitting component of the backlight module. The display panel includes an array substrate, an opposite substrate, and a liquid crystal layer located between the array substrate and the opposite substrate.

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