Manifold microchannel heat dissipation device and manufacturing method thereof, and heat dissipation method

Abstract

The present disclosure relates to a manifold microchannel heat dissipation device and a manufacturing method thereof, and a method for heat dissipation. The manifold microchannel heat dissipation device includes a substrate, a plurality of fins, a heat dissipation structure and a cover plate. The plurality of fins and the heat dissipation structure are located between the substrate and the cover plate. The plurality of fins are evenly distributed around a central axis perpendicular to the substrate. The heat dissipation structure has an inlet manifold channel, a plurality of diverter manifold channels, a plurality of annular microchannels and a plurality of outlet manifold channels. The inlet manifold channel faces the plurality of fins along the central axis. The plurality of diverter manifold channels are evenly distributed around the central axis, and each diverter manifold channel is connected to the inlet manifold channel. The plurality of annular microchannels are evenly distributed from the inside to the outside around the central axis, and the plurality of annular microchannels are connected to the plurality of diverter manifold channels. The plurality of outlet manifold channels are evenly distributed around the central axis, and the plurality of outlet manifold channels are connected to the plurality of annular microchannels. The uniform distribution of the fluid is achieved, and the uniformity of heat dissipation and the heat dissipation effect are improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of semiconductor power device manufacturing, and in particular to a manifold microchannel heat dissipation device and a manufacturing method thereof, and a method for heat dissipation. Background Art

[0002] At present, the heat dissipation methods of power chips and power modules are mainly air cooling and liquid cooling. For high-power chips and power modules, only liquid cooling can meet the heat dissipation requirements. In the field of industrial technology, liquid cooling mainly adopts the method of bonding water cooling plates or water cooling radiators.

[0003] Due to the high heat dissipation efficiency of microchannels, it has attracted widespread attention in industry and academia. However, while the heat dissipation capacity of microchannels is improved, their pressure drop loss is also increased. Therefore, adding a manifold layer above the microchannel can shorten the fluid flow and reduce the pressure drop. The size of the microchannel is small, and for the convenience of processing, a straight microchannel is usually processed.

[0004] In some cases, such as when the semiconductor chip or heat source is annular in shape, the straight manifold microchannel will include a redundant area relative to the heat source area; then water enters on one side and exits on the other side, resulting in uneven distribution of the fluid. Summary of the invention

[0005] The embodiment of the present disclosure provides a manifold microchannel heat dissipation device, which includes a substrate, a plurality of fins, a heat dissipation structure and a cover plate. The plurality of fins and the heat dissipation structure are located between the substrate and the cover plate. The plurality of fins are evenly distributed around the central axis perpendicular to the substrate. The heat dissipation structure has an inlet manifold channel, a plurality of diverter manifold channels, a plurality of annular microchannels and a plurality of outlet manifold channels. The inlet manifold channel faces the plurality of fins along the central axis. The plurality of diverter manifold channels are evenly distributed around the central axis, each diverter manifold channel is arranged radially along the central axis, and each diverter manifold channel is connected to the inlet manifold channel. The plurality of annular microchannels are evenly distributed from the inside to the outside around the central axis, and the plurality of annular microchannels are connected to the plurality of diverter manifold channels. The plurality of outlet manifold channels are evenly distributed around the central axis, and the plurality of outlet manifold channels are connected to the plurality of annular microchannels. The cover plate has a fluid inlet and a plurality of fluid outlets, the fluid inlet is connected to the inlet manifold channel, and the plurality of fluid outlets are connected to the plurality of outlet manifold channels one by one.

[0006] The manifold microchannel heat dissipation device provided by the embodiment of the present disclosure has multiple fins evenly distributed around the central axis perpendicular to the substrate, the inlet manifold channel and the fluid inlet are directly opposite to the multiple fins along the central axis, and the fluid enters the inlet manifold channel through the fluid inlet and is evenly distributed into the multiple diversion manifold channels through the diversion of the multiple fins, thereby allowing the fluid to evenly enter the multiple annular microchannels and flow. The annular microchannel matches the shape of the annular chip, and the arrangement of the multiple fins and the multiple annular microchannels can achieve uniform distribution of the fluid, improve the uniformity of heat dissipation, and have a better heat dissipation effect.

[0007] In some embodiments, the heat dissipation structure includes a microchannel layer and a manifold layer. The manifold layer is located between the cover plate and the microchannel layer along the central axis. The manifold layer includes an inlet manifold channel, a plurality of flow-dividing manifold channels, and a plurality of water-outlet manifold channels, and the microchannel layer includes a plurality of annular microchannels connected to the substrate; each flow-dividing manifold channel is connected to a plurality of annular microchannels.

[0008] With such an arrangement, the fluid entering from the inlet manifold channel can be evenly distributed along the radial direction of the central axis to enter multiple branch manifold channels, and the fluid in the multiple branch manifold channels can enter multiple annular microchannels along the axial direction of the central axis, thereby achieving uniform distribution of the fluid while shortening the fluid flow and reducing pressure drop.

[0009] In some embodiments, the heat dissipation structure includes a microchannel layer and a manifold layer; the manifold layer is located between the cover plate and the microchannel layer along the central axis. The manifold layer includes an inlet manifold channel and a plurality of outlet manifold channels, the microchannel layer includes a plurality of annular microchannels and a plurality of diverter manifold channels, the plurality of annular microchannels are connected to the substrate, the plurality of diverter manifold channels are connected to the substrate, and each diverter manifold channel is connected to a plurality of annular microchannels.

[0010] With such an arrangement, the fluid entering from the inlet manifold channel can be evenly distributed along the axial direction of the central axis to enter multiple branch manifold channels, and the fluid in the multiple branch manifold channels can enter multiple annular microchannels along the radial direction of the central axis, thereby achieving uniform distribution of the fluid while shortening the fluid flow and reducing pressure drop.

[0011] In some embodiments, the heat dissipation structure includes a microchannel layer and a manifold layer; the manifold layer is located between the cover plate and the microchannel layer along the central axis. The flow diversion manifold channel includes a first flow diversion manifold channel and a second flow diversion manifold channel. The manifold layer includes an inlet manifold channel, a plurality of first flow diversion manifold channels, and a plurality of outlet manifold channels, each of which is connected to a plurality of annular microchannels. The microchannel layer includes a plurality of annular microchannels and a plurality of second flow diversion manifold channels, the microchannel layer is connected to a substrate, a plurality of second flow diversion manifold channels are connected to a substrate, and each second flow diversion manifold channel is connected to a plurality of annular microchannels.

[0012] With such an arrangement, the fluid entering from the inlet manifold channel can be evenly distributed along the radial direction of the central axis to enter multiple first diversion manifold channels, and the fluid in the multiple first diversion manifold channels can enter multiple second diversion manifold channels and multiple annular microchannels along the axial direction of the central axis, thereby achieving uniform distribution of the fluid while shortening the fluid flow and reducing the pressure drop.

[0013] In some embodiments, the plurality of fins are evenly distributed in three layers from the inside to the outside around the central axis; the shape of the fins is a quadrangular prism or a cylindrical shape.

[0014] With this arrangement, the fins can guide the entering positioning fluid while playing a heat dissipation role, adjust the flow direction of the fluid, facilitate the uniform flow of the fluid, and improve the uniformity of heat dissipation. At the same time, the heat exchange area of ​​the central jet area is expanded, and the heat dissipation effect of the radial end area of ​​the microchannel layer is increased.

[0015] In some embodiments, the radial dimension of each annular microchannel along the central axis ranges from 0.02 mm to 1 mm, and the axial dimension of each annular microchannel along the central axis is 3 to 10 times the radial dimension along the central axis. The axial dimension of the inlet manifold channel along the central axis and the axial dimension of the outlet manifold channel along the central axis are 10 to 30 times the axial dimension of the annular microchannel width along the central axis. The dimension of the fin along the central axis is 20% to 60% of the dimension of the inlet manifold channel along the central axis.

[0016] Such a configuration improves the heat dissipation effect of the annular microchannel, increases the uniformity of the chip surface temperature, and reduces the disadvantage of large flow pressure drop in the microchannel.

[0017] In some embodiments, two radial ends of the diversion manifold channel along the central axis are an inlet end and a blocking end, and the inlet end is connected to the inlet manifold channel. The size of the inlet end is 0.5 to 3 times the size of the blocking end.

[0018] Such an arrangement improves the flow speed of the fluid from the inside to the outside in each branch manifold channel, ensures the consistency of the flow rate of the fluid in each microchannel, and improves the uniformity of heat dissipation.

[0019] In some embodiments, the substrate is provided with a plurality of first positioning holes, the plurality of first positioning holes are evenly distributed around the central axis, and the plurality of first positioning holes are located in the edge area of ​​the substrate. The cover plate is provided with a plurality of second positioning holes, the plurality of second positioning holes are evenly distributed around the central axis, and the plurality of second positioning holes are connected to the plurality of first positioning holes one by one.

[0020] Such an arrangement is conducive to improving the installation accuracy of the base plate and the cover plate, so that the fluid inlet, the inlet manifold channel and the fin correspond to each other, and the communication between the fluid inlet and the microchannel is prevented from being blocked.

[0021] The disclosed embodiment provides a method for manufacturing a manifold microchannel heat dissipation device, the method comprising forming a plurality of fins uniformly distributed around a central axis perpendicular to a substrate. A heat dissipation structure is formed, the heat dissipation structure having an inlet manifold channel, a plurality of diverter manifold channels, a plurality of annular microchannels and a plurality of outlet manifold channels; the inlet manifold channel faces a plurality of fins along the central axis; a plurality of diverter manifold channels are uniformly distributed around the central axis, each diverter manifold channel is arranged radially along the central axis, and each diverter manifold channel is connected to the inlet manifold channel; a plurality of annular microchannels are distributed from inside to outside around the central axis, and a plurality of annular microchannels are connected to a plurality of diverter manifold channels; a plurality of outlet manifold channels are distributed around the central axis, and a plurality of outlet manifold channels are connected to a plurality of annular microchannels. A cover plate having a fluid inlet and a plurality of fluid outlets is formed. The cover plate is arranged on the side of the plurality of fins and the heat dissipation structure facing away from the substrate, the fluid inlet is connected to the inlet manifold channel, and a plurality of fluid outlets are connected to a plurality of outlet manifold channels one by one.

[0022] The method for manufacturing a manifold microchannel heat sink provided by the embodiment of the present disclosure is simple to process and improves production efficiency. The manifold microchannel heat sink manufactured by the method can achieve uniform distribution of fluid, improve the uniformity of heat dissipation, and have a better heat dissipation effect.

[0023] The embodiment of the present disclosure provides a method for heat dissipation, using the above-mentioned manifold microchannel heat dissipation device, the method comprising: introducing a heat-conducting medium into a fluid inlet in a jet manner, so that the heat-conducting medium flows into a plurality of branch manifold channels after being evenly distributed through a plurality of fins via the inlet manifold channel, wherein the heat-conducting medium in the plurality of branch manifold channels flows to a plurality of annular microchannels, and the heat-conducting medium in the plurality of annular microchannels flows and converges to a plurality of outlet manifold channels. The heat-conducting medium in the plurality of outlet manifold channels flows out through a plurality of fluid outlets respectively.

[0024] In the method for heat dissipation provided in the embodiment of the present disclosure, the fluid enters the fluid inlet in the form of a jet, flows into multiple annular microchannels via multiple manifold diversion channels, and achieves uniform distribution of the fluid while shortening the fluid flow and reducing pressure drop, thereby improving the uniformity of heat dissipation and achieving better heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of the overall structure of the manifold microchannel heat dissipation device provided in an embodiment of the present disclosure;

[0026] Figure 2 for Figure 1 The cross-section along the AA direction;

[0027] Figure 3 A top view of a first embodiment of a microchannel layer provided in an embodiment of the present disclosure;

[0028] Figure 4 A top view of a second embodiment of a microchannel layer provided in an embodiment of the present disclosure;

[0029] Figure 5 A top view of a third embodiment of a microchannel layer provided in an embodiment of the present disclosure;

[0030] Figure 6 A top view of a fourth embodiment of a microchannel layer provided in an embodiment of the present disclosure;

[0031] Figure 7 A top view of a first embodiment of a manifold layer provided for an embodiment of the present disclosure;

[0032] Figure 8 A top view of a second embodiment of a manifold layer provided for an embodiment of the present disclosure;

[0033] Fig. 9 A top view of a third embodiment of a manifold layer provided in accordance with an embodiment of the present disclosure;

[0034] Fig.10 A distribution diagram of fins provided for an embodiment of the present disclosure;

[0035] Fig.11 A distribution diagram of fins provided for an embodiment of the present disclosure;

[0036] Fig.12 A schematic diagram of the overall structure of a cover plate provided in an embodiment of the present disclosure;

[0037] Fig.13 A flowchart of a method for manufacturing a manifold microchannel heat dissipation device provided in an embodiment of the present disclosure;

[0038] Fig.14 A flowchart of a heat dissipation method provided in an embodiment of the present disclosure.

[0039] Explanation of the reference numerals: 100, manifold microchannel heat dissipation device; 1, substrate; 11, first positioning hole; 2, fin; 3, heat dissipation structure; 30, microchannel layer; 31, manifold layer; 310, inlet manifold channel; 320, diversion manifold channel; 321, first diversion manifold channel; 3211, inlet end; 3212, blocking end; 322, second diversion manifold channel; 330, outlet manifold channel; 340, annular microchannel; 4, cover plate; 41, fluid inlet; 42, fluid outlet; 43, second positioning hole; 5, partition; 51, third positioning hole. DETAILED DESCRIPTION

[0040] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present disclosure more obvious and understandable, the specific implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the embodiments of the present disclosure. However, the embodiments of the present disclosure can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the embodiments of the present disclosure, so the embodiments of the present disclosure are not limited by the specific examples of the embodiments disclosed below.

[0041] In the description of the embodiments of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "perpendicular", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present disclosure.

[0042] In the embodiments of the present disclosure, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0043] In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. Exemplarily, the first positioning hole may also be referred to as the second positioning hole, and the second positioning hole may also be referred to as the first positioning hole. In the description of the embodiments of the present disclosure, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0044] In the embodiments of the present disclosure, unless otherwise clearly specified and limited, the terms "connected", "connected", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a flexible connection, or a rigid connection along at least one direction; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or directly connected with the presence of an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly limited. The terms "installed", "set", "fixed", etc. can be broadly understood as connection. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0045] As used herein, the terms "layer" and "region" refer to a portion of a material that includes an area with a certain thickness. A layer can extend horizontally, vertically and / or along a tapered surface. A layer can be an area of ​​a uniform or non-uniform continuous structure, and its thickness perpendicular to the extension direction may not be greater than the thickness of the continuous structure. A layer can include multiple layers, which can be stacked layers or multiple layers extending discretely. The shapes of various regions and layers in the drawings and their relative sizes and positional relationships are only exemplary, and may actually deviate due to manufacturing tolerances or technical limitations, and the design can be adjusted according to actual needs.

[0046] refer to Figure 1 , Figure 1 The overall structure of the manifold microchannel heat sink 100 in the embodiment of the present disclosure is shown. The present disclosure relates to the technical field of semiconductor power device manufacturing.

[0047] refer to Figure 2 The manifold microchannel heat dissipation device 100 provided in the embodiment of the present disclosure includes a substrate 1, a plurality of fins 2, a heat dissipation structure 3 and a cover plate 4. The plurality of fins 2 and the heat dissipation structure 3 are both located between the substrate 1 and the cover plate 4. Exemplarily, the cover plate 4 and the substrate 1 are both arranged in the horizontal direction, and the cover plate 4 and the substrate 1 are stacked in the vertical direction.

[0048] A plurality of fins 2 are located on the substrate 1, and the plurality of fins 2 are evenly distributed around a central axis perpendicular to the substrate 1. Exemplarily, the vertical direction is perpendicular to the central axis of the substrate 1, and the plurality of fins 2 are fixed to the substrate 1 along the vertical direction and arranged around the central axis of the substrate 1 from inside to outside along the horizontal direction.

[0049] The heat dissipation structure 3 has an inlet manifold channel 310 , a plurality of flow-dividing manifold channels 320 , a plurality of annular microchannels 340 and a plurality of water outlet manifold channels. The inlet manifold channel 310 is located above the plurality of fins 2 and is directly opposite to the plurality of fins 2 .

[0050] A plurality of flow-dividing manifold channels 320 are evenly distributed around the central axis in the horizontal direction, and each flow-dividing manifold channel 320 is connected to the inlet manifold channel 310. In the radial direction of the central axis, each flow-dividing manifold channel 320 extends outward from the connection of the inlet manifold channel 310. Exemplarily, each flow-dividing manifold channel 320 is connected to the inlet manifold channel 310 in the horizontal direction. Exemplarily, each flow-dividing manifold channel 320 is connected to the inlet manifold channel 310 in the vertical direction.

[0051] The plurality of annular microchannels 340 are evenly distributed from inside to outside along the horizontal direction around the central axis, and the plurality of annular microchannels 340 are connected to the plurality of flow dividing manifold channels 320. Exemplarily, the plurality of flow dividing manifold channels 320 are connected to the plurality of annular microchannels 340 along the vertical direction. Exemplarily, the plurality of flow dividing manifold channels 320 are connected to the plurality of annular microchannels 340 along the horizontal direction.

[0052] The plurality of water outlet manifold channels are evenly distributed around the central axis in the horizontal direction, and the plurality of water outlet manifold channels are connected to the plurality of annular microchannels 340 in the vertical direction.

[0053] The cover plate 4 has a fluid inlet 41 and a plurality of fluid outlets 42. The fluid inlet 41 is connected to the inlet manifold channel 310 in the vertical direction, and the plurality of fluid outlets 42 are connected to the plurality of water outlet manifold channels one by one in the vertical direction. Exemplarily, the fluid inlet 41 and the fluid outlet 42 are both arranged in the vertical direction.

[0054] The heat transfer medium used in the manifold microchannel heat sink 100 provided in the embodiment of the present disclosure is a fluid. The heat transfer medium can enter from the fluid inlet 41, pass through the inlet manifold channel 310, and be evenly distributed through the multiple fins 2 before flowing into the multiple branch manifold channels 320. The heat transfer medium in the multiple branch manifold channels 320 flows to the multiple annular microchannels 340. The heat transfer medium in the multiple annular microchannels 340 flows and converges to the multiple water outlet manifold channels and flows out through the multiple fluid outlets 42.

[0055] In the manifold microchannel heat sink 100 provided in the embodiment of the present disclosure, the annular microchannel 340 matches the shape of the annular chip, and no over-processing is required while improving the production efficiency of the microchannel. The arrangement of multiple fins 2 and multiple annular microchannels 340 can achieve uniform distribution of the fluid, improve the uniformity of heat dissipation, better utilize the heat dissipation capacity of the fluid, and have a better heat dissipation effect.

[0056] Exemplarily, the base plate 1 and the cover plate 4 are both square. The fluid inlet 41 is located at the center of the cover plate 4 , and the plurality of fins 2 are connected to the center of the base plate 1 .

[0057] Exemplarily, the radial dimension of the inlet manifold passage 310 is greater than the radial dimension of the fluid inlet 41 .

[0058] Exemplarily, there are eight flow-dividing manifold channels 320, and an angle of 45° is formed between every two flow-dividing manifold channels 320. It is understandable that the number of flow-dividing manifold channels 320 ranges from 4 to 12.

[0059] Exemplarily, the number of the outlet manifold channels 330 is 2, 3 or 4. It is understood that the number of the outlet manifold channels 330 may be a multiple of 4, such as 8 or 12.

[0060] In other embodiments, the fluid outlets 42 may be disposed in the horizontal direction on the peripheral wall of the cover plate 4. It is understood that the number of the fluid outlets 42 matches the number of the outlet manifold channels 330.

[0061] Exemplarily, both the fluid outlet 42 and the fluid inlet 41 may be external pipes for conveying the heat-conducting medium.

[0062] In some embodiments, the heat dissipation structure 3 includes a microchannel layer and a manifold layer 31. The manifold layer 31 is located between the cover plate 4 and the microchannel layer in the vertical direction. The manifold layer 31 includes an inlet manifold channel 310, a plurality of branch manifold channels 320, and a plurality of outlet manifold channels. A plurality of annular microchannels 340 are connected to the substrate 1 and belong to the microchannel layer; each branch manifold channel 320 vertically connects a plurality of annular microchannels 340.

[0063] With such arrangement, the fluid entering from the inlet manifold channel 310 can be evenly distributed in the horizontal direction to enter the multiple branch manifold channels 320, and the fluid in the multiple branch manifold channels 320 can enter the multiple annular microchannels 340 in the vertical direction, thereby achieving uniform distribution of the fluid while shortening the fluid flow and reducing the pressure drop.

[0064] In some embodiments, the heat dissipation structure 3 includes a microchannel layer and a manifold layer 31; the manifold layer 31 is located between the cover plate 4 and the microchannel layer in the vertical direction. The manifold layer 31 includes an inlet manifold channel 310 and a plurality of outlet manifold channels. The microchannel layer includes a plurality of annular microchannels 340 and a plurality of diverter manifold channels 320, the plurality of annular microchannels 340 are connected to the substrate 1, the plurality of diverter manifold channels 320 are connected to the substrate 1, and each diverter manifold channel 320 is connected to the plurality of annular microchannels 340 in the horizontal direction.

[0065] With such arrangement, the fluid entering from the inlet manifold channel 310 can be evenly distributed vertically into the multiple branch manifold channels 320, and the fluid in the multiple branch manifold channels 320 enters the multiple annular microchannels 340 horizontally, thereby achieving even distribution of the fluid while shortening the fluid flow and reducing pressure drop.

[0066] In some embodiments, the heat dissipation structure 3 includes a microchannel layer and a manifold layer 31; the manifold layer 31 is located between the cover plate 4 and the microchannel layer in the vertical direction. The flow-dividing manifold channel 320 includes a first flow-dividing manifold channel 321 and a second flow-dividing manifold channel 322. The manifold layer 31 includes an inlet manifold channel 310, a plurality of first flow-dividing manifold channels 321, and a plurality of outlet manifold channels, each of which is connected to a plurality of annular microchannels 340 in the vertical direction. The microchannel layer includes a plurality of annular microchannels 340 and a plurality of second flow-dividing manifold channels 322, the microchannel layer is connected to the substrate 1, a plurality of second flow-dividing manifold channels 322 are connected to the substrate 1, and each second flow-dividing manifold channel 322 is connected to a plurality of annular microchannels 340 in the horizontal direction.

[0067] With such arrangement, the fluid entering from the inlet manifold channel 310 can be evenly distributed in the horizontal direction to enter the multiple first branch manifold channels 321, and the fluid in the multiple first branch manifold channels 321 can enter the multiple second branch manifold channels 322 and the multiple annular microchannels 340 in the vertical direction, thereby achieving uniform distribution of the fluid while shortening the fluid flow and reducing the pressure drop.

[0068] Exemplarily, the first flow dividing manifold channel 321 and the second flow dividing manifold channel 322 are arranged in alignment along the vertical direction. In other embodiments, the first flow dividing manifold channel 321 and the second flow dividing manifold channel 322 are arranged in an alternating manner along the vertical direction.

[0069] refer to Figures 3 to 6 For example, the shape of the outlet manifold channel 330 may be a fan shape or a petal shape, and the area of ​​the outlet manifold channel 330 may be adjusted according to actual conditions.

[0070] refer to Figures 7 to 9 For example, the radial length of the second flow dividing manifold channel 322 cannot be greater than the outer diameter of the outermost annular microchannel 340. It is understandable that the radial length of the second flow dividing manifold channel 322 can be adjusted according to actual conditions.

[0071] Exemplarily, the number of the second flow dividing manifold channels 322 is less than or equal to the number of the annular microchannels 340 .

[0072] Exemplarily, the solid material of the manifold layer 31 and the microchannel layer is a metal material. Exemplarily, the solid material of the manifold layer 31 and the microchannel layer is copper. Copper has a high thermal conductivity, which is conducive to heat dissipation. It is understood that the solid materials of the cover plate 4, the manifold layer 31, the microchannel layer and the substrate 1 can be organic or non-organic solid materials such as metal and glass.

[0073] Exemplarily, the plurality of annular microchannels may include spoiler columns to enhance the heat exchange effect.

[0074] refer to Fig.10 and Fig.11 In some embodiments, the plurality of fins 2 are evenly distributed in three layers from the inside to the outside around the central axis; the shape of the fins 2 is a quadrangular prism or a cylindrical shape.

[0075] In this way, the fins 2 can guide the entering positioning fluid while playing a heat dissipation role, adjust the flow direction of the fluid, facilitate the uniform flow of the fluid, and improve the uniformity of heat dissipation. At the same time, the heat exchange area of ​​the central jet area is expanded, and the heat dissipation effect of the radial end area of ​​the microchannel layer is increased.

[0076] Exemplarily, the innermost layer has 4 fins 2 evenly distributed, the middle layer has 10 fins 2 evenly distributed, and the outermost layer has 16 fins 2 evenly distributed.

[0077] In some embodiments, the radial dimension of each annular microchannel 340 along the central axis ranges from 0.02 mm to 1 mm, and the axial dimension of each annular microchannel 340 along the central axis is 3 to 10 times the radial dimension along the central axis. The axial dimension of the inlet manifold channel 310 along the central axis and the axial dimension of the outlet manifold channel 330 along the central axis are 10 to 30 times the axial dimension of the width of the annular microchannel 340 along the central axis. The dimension of the fin 2 along the central axis is 20% to 60% of the dimension of the inlet manifold channel 310 along the central axis.

[0078] Such arrangement improves the heat dissipation effect of the annular microchannel 340, increases the uniformity of the chip surface temperature, and reduces the disadvantage of large flow pressure drop in the microchannel.

[0079] Exemplarily, the radial dimension along the central axis is the width, and the axial dimension along the central axis is the height.

[0080] Exemplarily, the width of the annular microchannel 340 is 0.3 mm, and the height of the annular microchannel 340 is 1.5 mm.

[0081] Exemplarily, the interval between adjacent annular microchannels 340 is the wall thickness, which is 0.3 mm.

[0082] Exemplarily, the height of the fin 2 is greater than the height of the annular microchannel 340 , and the height of the fin 2 is less than the height of the inlet manifold channel 310 .

[0083] See again Figures 7 to 9 In some embodiments, the two ends of the diversion manifold channel 320 along the radial direction of the central axis are an inlet end 3211 and a blocking end 3212, and the inlet end 3211 is connected to the inlet manifold channel 310. The size of the inlet end 3211 is 0.5 to 3 times the size of the blocking end 3212.

[0084] Such an arrangement improves the flow speed of the fluid from the inside to the outside in each branch manifold channel 320, ensures the consistency of the flow rate of the fluid in each microchannel, and improves the uniformity of heat dissipation.

[0085] Exemplarily, the size of the inlet end 3211 is 0.8 times the size of the blocking end 3212 .

[0086] refer to Figure 4 and Fig.12 In some embodiments, the substrate 1 is provided with a plurality of first positioning holes 11, the plurality of first positioning holes 11 are evenly distributed around the central axis, and the plurality of first positioning holes 11 are located in the edge area of ​​the substrate 1. The cover plate 4 is provided with a plurality of second positioning holes 43, the plurality of second positioning holes 43 are evenly distributed around the central axis, and the plurality of second positioning holes 43 are connected to the plurality of first positioning holes 11 one by one.

[0087] Such arrangement is conducive to improving the installation accuracy of the substrate 1 and the cover plate 4, so that the fluid inlet 41 and the inlet manifold channel 310 correspond to the fin 2, and prevents the communication between the fluid inlet 41 and the microchannel from being blocked.

[0088] Exemplarily, there are four first positioning holes 11 and four second positioning holes 43 , respectively. The four first positioning holes 11 are evenly distributed at the four corners of the substrate 1 , and the second positioning holes 43 are evenly distributed at the four corners of the cover plate 4 .

[0089] Exemplarily, the manifold layer 31 also includes a partition 5, which is square. The inlet manifold channel 310, the branch manifold channel 320 and the outlet manifold channel 330 are all located on the partition 5. Four third positioning holes 51 are also provided at the four corners of the partition 5. Each third positioning hole 51 is located between a first positioning hole 11 and a second positioning hole 43, and each third positioning hole 51 is opposite to a first positioning hole 11 and a second positioning hole 43.

[0090] Exemplarily, the manifold microchannel heat sink 100 also includes a direct copper-clad ceramic substrate (DBC board), which is located on the lower side of the substrate 1 and connected to the substrate 1. The direct copper-clad ceramic substrate is composed of a copper layer, an aluminum nitride layer and a copper layer in sequence along the vertical direction. The thickness of the copper layer is 0.1 mm, and the thickness of the aluminum nitride layer is 0.635 mm.

[0091] The embodiment of the present disclosure provides a method 1000 for manufacturing a manifold microchannel heat dissipation device, and the method 1000 includes the following steps S101 to S104.

[0092] Step S101 , forming a plurality of fins 2 evenly distributed around a central axis perpendicular to the substrate 1 .

[0093] Step S102, forming a heat dissipation structure 3, the heat dissipation structure 3 has an inlet manifold channel 310, a plurality of branch manifold channels 320, a plurality of annular microchannels 340 and a plurality of water outlet manifold channels; the inlet manifold channel 310 is opposite to the plurality of fins 2 along the central axis; the plurality of branch manifold channels 320 are evenly distributed around the central axis, each branch manifold channel 320 is arranged radially along the central axis, and each branch manifold channel 320 is connected to the inlet manifold channel 310; the plurality of annular microchannels 340 are distributed from the inside to the outside around the central axis, and the plurality of annular microchannels 340 are connected to the plurality of branch manifold channels 320; the plurality of water outlet manifold channels are distributed around the central axis, and the plurality of water outlet manifold channels are connected to the plurality of annular microchannels 340.

[0094] Step S103 , forming a cover plate 4 having a fluid inlet 41 and a plurality of fluid outlets 42 .

[0095] Step S104, a cover plate 4 is arranged on the side of the plurality of fins 2 and the heat dissipation structure 3 facing away from the substrate 1, the fluid inlet 41 is connected to the inlet manifold channel 310, and the plurality of fluid outlets 42 are connected to the plurality of water outlet manifold channels one by one.

[0096] The method 1000 for manufacturing a manifold microchannel heat sink provided in the embodiment of the present disclosure is simple to process and improves production efficiency. The manifold microchannel heat sink 100 manufactured by the method can achieve uniform distribution of fluid, improve the uniformity of heat dissipation, and have a better heat dissipation effect.

[0097] Exemplarily, step S105 is also included to form a DBC board, and the DBC board is connected to the side of the substrate 1 facing away from the cover plate 4. The connection process can be a sintering method such as soldering, silver sintering, copper sintering, TLP, or a bonding method such as glue and solid glue.

[0098] Exemplarily, the method further includes step S106 of connecting the power chip to the side of the DBC board facing away from the substrate 1. The connection process may be a sintering method such as soldering, silver sintering, copper sintering, TLP, or a bonding method such as glue or solid glue.

[0099] For example, the inlet and outlet pipes may be connected to the cover plate 4 by bonding or welding.

[0100] Exemplarily, the inlet manifold channel 310 , the plurality of branch manifold channels 320 , and the plurality of outlet manifold channels 330 are integrally processed.

[0101] Exemplarily, the connection method between the cover plate 4 and the manifold layer 31, and the connection method between the manifold layer 31 and the substrate 1 can adopt sintering methods such as soldering, silver sintering, copper sintering, TLP, or bonding methods such as glue and solid glue.

[0102] Exemplarily, step S104 may be performed first, and then step S101 may be performed.

[0103] The embodiment of the present disclosure provides a method 2000 for heat dissipation, using the manifold microchannel heat dissipation device 100 described above, and the method 2000 includes steps S201 to S202.

[0104] In step S201, a heat-conducting medium is introduced into the fluid inlet 41 in a jet manner, so that the heat-conducting medium is evenly distributed through the multiple fins 2 via the inlet manifold channel 310 and then flows into the multiple branch manifold channels 320, wherein the heat-conducting medium in the multiple branch manifold channels 320 flows to the multiple annular microchannels 340, and the heat-conducting medium in the multiple annular microchannels 340 flows and converges into the multiple outlet manifold channels.

[0105] Step S202 , the heat transfer medium in the plurality of outlet manifold channels 330 flows out through the plurality of fluid outlets 42 respectively.

[0106] In the method 2000 for heat dissipation provided in the embodiment of the present disclosure, the fluid enters the fluid inlet 41 in the form of a jet, flows into the multiple annular microchannels 340 via multiple manifold diversion channels, and achieves uniform distribution of the fluid while shortening the fluid flow and reducing the pressure drop, thereby improving the uniformity of heat dissipation and achieving a better heat dissipation effect.

[0107] Taking a ring-shaped power chip with a diameter of 20mm as an example, its outer area is 30*30mm. The width of the microchannel is set to 0.3mm, and the wall thickness of the microchannel is also 0.3mm. The diameter of the fluid inlet 41 is set to 4.2mm. The inner diameter of the innermost annular microchannel 340 is 5.4mm, and a jet buffer is formed between the outermost multiple fins 2 and the inner diameter of the innermost annular microchannel 340. By numerical simulation, the processing volume of the straight manifold microchannel, the jet channel and the annular microchannel 340 disclosed in the present invention is compared. The specific values ​​are shown in Table 1:

[0108] Table 1

[0109]

[0110] From the numerical comparison in Table 1, it can be seen that, compared with the straight channel, the number of processing channels of the annular microchannel 340 is reduced by 26.4%, and the processing length is reduced by 27.3%, which reduces the processing amount of the microchannel and improves the production efficiency.

[0111] When the heat of the power chip is 500W / cm 2 When the jet flow rate is set to 30 g / s, the ordinary manifold microchannel, the jet radial microchannel and the annular microchannel 340 provided by the present disclosure are used for heat dissipation, and the values ​​of the highest and lowest temperatures on the chip surface are shown in Table 2:

[0112] Table 2

[0113]

[0114] From the numerical comparison in Table 2, it can be seen that compared with the jet radial microchannel solution, after the manifold microchannel heat dissipation device 100 provided by the present disclosure dissipates heat, the maximum temperature of the chip surface is reduced by 28.03%, and the temperature uniformity of the chip surface is improved by 41.09%.

[0115] Compared with the manifold microchannel solution, after the manifold microchannel heat dissipation device 100 provided in the present disclosure dissipates heat, the maximum temperature of the chip surface is reduced by 15.16%, and the temperature uniformity of the chip surface is improved by 58.38%.

[0116] The technical features of the embodiments disclosed above can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0117] In the embodiments disclosed above, unless otherwise clearly specified and limited, the execution order of each step is not limited, for example, it can be executed in parallel, or it can be executed successively in different orders. The sub-steps of each step can also be executed alternately. The above-mentioned various forms of processes can be used, and steps can be reordered, added or deleted, as long as the desired results of the technical solution provided in the embodiment of the present disclosure can be achieved, and this document does not limit it here.

[0118] The embodiments disclosed above only express several implementation methods of the invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of patent protection of the invention. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the invention, and these all belong to the scope of patent protection required by the invention. Therefore, the scope of patent protection of the invention shall be subject to the attached claims.

Claims

1. Manifold microchannel heat dissipation device, characterized in that: It includes a base plate, a plurality of fins, a heat dissipation structure and a cover plate; the plurality of fins and the heat dissipation structure are both located between the base plate and the cover plate; The plurality of fins are evenly distributed around a central axis perpendicular to the base plate; The heat dissipation structure has an inlet manifold channel, a plurality of flow-dividing manifold channels, a plurality of annular microchannels and a plurality of water outlet manifold channels; The inlet manifold channel is directly opposite to the plurality of fins along the central axis; the plurality of flow-dividing manifold channels are evenly distributed around the central axis, each of the flow-dividing manifold channels is arranged along the radial direction of the central axis, and each of the flow-dividing manifold channels is connected to the inlet manifold channel; the plurality of annular microchannels are evenly distributed from inside to outside around the central axis, and the plurality of annular microchannels are connected to the plurality of flow-dividing manifold channels; The plurality of water outlet manifold channels are evenly distributed around the central axis, and the plurality of water outlet manifold channels are connected to the plurality of annular microchannels; The cover plate has a fluid inlet and a plurality of fluid outlets, the fluid inlet is connected to the inlet manifold channel, and the plurality of fluid outlets are connected to the plurality of water outlet manifold channels in a one-to-one correspondence.

2. The manifold microchannel heat dissipation device according to claim 1, characterized in that: The heat dissipation structure comprises a microchannel layer and a manifold layer; the manifold layer is located between the cover plate and the microchannel layer along the central axis; The manifold layer includes the inlet manifold channel, the plurality of flow-dividing manifold channels and the plurality of water-outlet manifold channels, and the microchannel layer includes the plurality of annular microchannels connected to the substrate; each of the flow-dividing manifold channels is connected to the plurality of annular microchannels.

3. The manifold microchannel heat dissipation device according to claim 1, characterized in that: The heat dissipation structure comprises a microchannel layer and a manifold layer; the manifold layer is located between the cover plate and the microchannel layer along the central axis; The manifold layer includes the inlet manifold channel and the multiple outlet manifold channels, the microchannel layer includes the multiple annular microchannels and the multiple diversion manifold channels, the multiple annular microchannels are connected to the substrate, the multiple diversion manifold channels are connected to the substrate, and each of the diversion manifold channels is connected to the multiple annular microchannels.

4. The manifold microchannel heat dissipation device according to claim 1, characterized in that: The heat dissipation structure includes a microchannel layer and a manifold layer; the manifold layer is located between the cover plate and the microchannel layer along the central axis; the flow-dividing manifold channel includes a first flow-dividing manifold channel and a second flow-dividing manifold channel; The manifold layer includes the inlet manifold channel, multiple first diversion manifold channels and multiple outlet manifold channels, each of the first diversion manifold channels is connected to the multiple annular microchannels, the microchannel layer includes the multiple annular microchannels and multiple second diversion manifold channels, the multiple annular microchannels are connected to the substrate, the multiple second diversion manifold channels are connected to the substrate, and each of the second diversion manifold channels is connected to the multiple annular microchannels.

5. The manifold microchannel heat dissipation device according to any one of claims 1 to 4, characterized in that: The plurality of fins are evenly distributed in three layers from the inside to the outside around the central axis; the shape of the fins is a quadrangular prism or a cylindrical shape.

6. The manifold microchannel heat dissipation device according to claim 5, characterized in that: The radial dimension of each of the annular microchannels along the central axis ranges from 0.02 mm to 1 mm, and the axial dimension of each of the annular microchannels along the central axis is 3 to 10 times the radial dimension along the central axis; The axial dimension of the inlet manifold channel along the central axis and the axial dimension of the outlet manifold channel along the central axis are 10 to 30 times the axial dimension of the width of the annular microchannel along the central axis; The dimension of the fin along the central axis is 20% to 60% of the dimension of the inlet manifold channel along the central axis.

7. The manifold microchannel heat dissipation device according to claim 6, characterized in that: The two ends of the flow dividing manifold channel along the radial direction of the central axis are an inlet end and a blocking end, and the inlet end is connected to the inlet manifold channel; The size of the inlet end is 0.5 to 3 times the size of the blocking end.

8. The manifold microchannel heat dissipation device according to claim 7, characterized in that: The substrate is provided with a plurality of first positioning holes, the plurality of first positioning holes are evenly distributed around the central axis, and the plurality of first positioning holes are located in the edge area of ​​the substrate; The cover plate is provided with a plurality of second positioning holes, the plurality of second positioning holes are evenly distributed around the central axis, and the plurality of second positioning holes are connected to the plurality of first positioning holes in a one-to-one correspondence.

9. A method for manufacturing a manifold microchannel heat sink, characterized in that: include: forming a plurality of fins evenly distributed around a central axis perpendicular to the base plate; A heat dissipation structure is formed, wherein the heat dissipation structure has an inlet manifold channel, a plurality of flow-dividing manifold channels, a plurality of annular microchannels and a plurality of water outlet manifold channels; the inlet manifold channel is directly opposite to the plurality of fins along the central axis; the plurality of flow-dividing manifold channels are evenly distributed around the central axis, each of the flow-dividing manifold channels is arranged along the radial direction of the central axis, and each of the flow-dividing manifold channels is connected to the inlet manifold channel; the plurality of annular microchannels are distributed from inside to outside around the central axis, and the plurality of annular microchannels are connected to the plurality of flow-dividing manifold channels; The plurality of water outlet manifold channels are distributed around the central axis, and the plurality of water outlet manifold channels are connected to the plurality of annular microchannels; forming a cover plate having a fluid inlet and a plurality of fluid outlets; as well as The cover plate is arranged on a side of the plurality of fins and the heat dissipation structure facing away from the base plate, the fluid inlet is connected to the inlet manifold channel, and the plurality of fluid outlets are connected to the plurality of water outlet manifold channels one by one.

10. A method for heat dissipation, using the manifold microchannel heat dissipation device according to any one of claims 1 to 8, characterized in that: The method comprises: Introducing a heat-conducting medium into the fluid inlet in a jet manner, so that the heat-conducting medium flows through the inlet manifold channel through a plurality of fins and then flows into the plurality of flow-dividing manifold channels after being evenly distributed, wherein the heat-conducting medium in the plurality of flow-dividing manifold channels flows to the plurality of annular microchannels, and the heat-conducting medium in the plurality of annular microchannels flows and converges into the plurality of water outlet manifold channels; and The heat transfer medium in the plurality of water outlet manifold channels flows out through the plurality of fluid outlets respectively.

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