Crimping device and testing system

Abstract

The present invention relates to a crimping device and a testing system. The crimping device includes a bearing seat, a pressing assembly, an input assembly, and an output assembly. The bearing seat is used to support a power semiconductor. The pressing assembly can be raised and lowered relative to the bearing seat and includes a main control board and a probe board electrically connected to the main control board. The probe board can be crimped to the signal terminals of the power semiconductor. The input assembly can be raised and lowered relative to the bearing seat and includes a capacitor and an input copper busbar electrically connected to the capacitor. The input copper busbar can be crimped to the positive and negative terminals of the power semiconductor. The output assembly can be raised and lowered relative to the bearing seat and includes an output copper busbar electrically connected to the load. The output copper busbar can be crimped to the three-phase terminals of the power semiconductor. The input assembly and the output assembly are electrically connected to the power semiconductor using the copper busbars for automatic crimping. The power semiconductor is not easily damaged, thereby ensuring the accuracy of the test results and improving the test efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of power semiconductor testing, in particular to a crimping device and a testing system. Background Art

[0002] During the production process, power semiconductors such as IGBT modules require quality and performance testing. Prior to testing, the power terminals of the test equipment's main circuit must be electrically connected to the input and output terminals of the power semiconductor using cable lock screws.

[0003] However, this connection method can easily damage the power semiconductors, and the wiring process is cumbersome and time-consuming, thus affecting the test results and test efficiency. Summary of the Invention

[0004] Based on this, it is necessary to provide a crimping device and a testing system to address the above problems. The crimping device can prevent power semiconductors from being damaged and can improve testing efficiency.

[0005] The present invention first provides a crimping device, comprising: a supporting seat for supporting a power semiconductor; a pressing assembly that can be raised and lowered relative to the supporting seat and includes a main control board and a probe board electrically connected to the main control board, wherein the probe board can be crimped to the signal terminal of the power semiconductor; an input assembly that can be raised and lowered relative to the supporting seat and includes a capacitor and an input copper busbar electrically connected to the capacitor, wherein the input copper busbar can be crimped to the positive and negative terminals of the power semiconductor; and an output assembly that can be raised and lowered relative to the supporting seat and includes an output copper busbar electrically connected to the load, wherein the output copper busbar can be crimped to the three-phase terminals of the power semiconductor.

[0006] In the above-mentioned crimping device, the power semiconductor is first placed on the support seat, and then the input component, output component and downward pressure component are driven to descend relative to the support seat so that the input copper busbar is crimped to the positive and negative terminals of the power semiconductor, the output copper busbar is crimped to the three-phase terminals of the power semiconductor, and the probe plate is crimped to the signal terminal of the power semiconductor. After the capacitor is energized, the stored electrical energy is applied to the power semiconductor through the input copper busbar and the positive and negative terminals of the power semiconductor. The power semiconductor withstands large current and high voltage when operating with an inductive load. The main control board controls the switching frequency and output current and other parameters of the power semiconductor through the probe plate and the signal terminal. After the power semiconductor converts uncontrollable electrical energy into controllable electrical energy, it is output to the load through the three-phase terminals and the output copper busbar. The input component and output component can be electrically connected to the power semiconductor by automatically crimping the copper busbar. The copper busbar can pass large current and withstand high voltage, and does not require the user to manually connect it using cable lock screws. The positive and negative terminals and three-phase terminals of the power semiconductor are not easily damaged, thereby ensuring the accuracy of the test results, simplifying the operating steps, and improving test efficiency.

[0007] In one embodiment, the pressing assembly further includes a driving plate and a gate plate which are arranged on a side of the probe board away from the supporting base and are electrically connected to the probe board.

[0008] This arrangement makes it easy for users to disassemble or replace the driver board and gate plate, and prevents users from touching the probes of the probe plate, thereby avoiding hand injuries to users and damage to the probes, driver board or gate plate.

[0009] In one embodiment, the crimping device further includes a first driving member for driving the input component to rise and fall relative to the supporting seat; and / or, the crimping device further includes a second driving member for driving the output component and the pressing component to rise and fall relative to the supporting seat.

[0010] In this arrangement, the input component is driven solely by the first driving member, so that the input component can be set close to the power semiconductor, simplifying the overall structure of the crimping device; the output component and the down-pressing component are driven together by the second driving member, which can reduce the number of parts, avoid increasing the overall volume of the crimping device, and also save energy.

[0011] In one embodiment, the crimping device further includes a waterway plate disposed on the supporting seat, and the waterway plate is used to support the power semiconductor and cool the power semiconductor.

[0012] With this arrangement, the cooling liquid flowing in the water channel plate dissipates heat and cools the power semiconductor, so that the temperature of the power semiconductor can be maintained within a normal operating temperature range.

[0013] In one embodiment, the pressing assembly further includes a pressing rod, and the pressing rod is capable of pressing the power semiconductor tightly against the supporting seat.

[0014] With such an arrangement, the pressure rod can ensure the stability of the power semiconductor during the test process, and prevent the power semiconductor from deviating relative to the supporting base and affecting the test results.

[0015] In one embodiment, there are multiple pressure rods, which are arranged in a one-to-one correspondence with the threaded holes of the power semiconductor, and the diameter of the pressure rod is larger than the inner diameter of the threaded hole.

[0016] With this arrangement, the pressure rod can simulate a fastener to fix the power semiconductor to the support seat during the test, and can reduce the contact area between the pressure rod and the power semiconductor, ensuring that the pressure rod will not leave an indentation on the surface of the power semiconductor, avoiding damage to the power semiconductor.

[0017] In one embodiment, the pressure applied by the pressing component to the power semiconductor is greater than the water pressure in the waterway plate.

[0018] This arrangement allows the power semiconductor to fit tightly against the edge of the waterway plate, ensuring the sealing between the power semiconductor and the waterway plate and preventing coolant leakage.

[0019] In one embodiment, the input copper busbar includes a first connecting section, a first soft copper busbar and a first crimping section connected in sequence, the first connecting section is electrically connected to the capacitor, and the first crimping section can be crimped to the positive and negative terminals of the power semiconductor; the output copper busbar includes a second connecting section, a second soft copper busbar and a second crimping section connected in sequence, the second connecting section is electrically connected to the load, and the second crimping section can be crimped to the three-phase terminals of the power semiconductor.

[0020] With this arrangement, the first and second soft copper bars can act as buffers, ensuring that the power semiconductor is not damaged by impact, and also allowing the first and second crimping sections to fully fit with the positive and negative terminals and three-phase terminals of the power semiconductor.

[0021] In one embodiment, the first soft copper busbar includes a first bending section, and the angle α between the extension lines of the two ends of the first bending section is greater than or equal to 135°; and / or the second soft copper busbar includes a second bending section, and the angle β between the extension lines of the two ends of the second bending section is greater than or equal to 90°.

[0022] With such an arrangement, the first soft copper busbar and the second soft copper busbar can better compensate for the movement accuracy error of the first driving member and the second driving member in the crimped state, so that the contact between the first crimping section and the second crimping section and the positive and negative terminals and the three-phase terminals of the power semiconductor is more stable; and the first soft copper busbar and the second soft copper busbar can be restored to the uncrimped state in time.

[0023] The present invention also provides a testing system, comprising the crimping device described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 A schematic diagram of the three-dimensional structure of a crimping device according to an embodiment of the present invention;

[0026] Figure 2 The present invention provides Figure 1 A schematic structural diagram of the crimping device from a side view;

[0027] Figure 3 The present invention provides Figure 2 Enlarged view of point A in the middle;

[0028] Figure 4 The present invention provides Figure 2 Schematic diagram of the structure of the input copper busbar from a top-down perspective;

[0029] Figure 5 The present invention provides Figure 4 Schematic diagram of the structure of the input copper busbar from a side view;

[0030] Figure 6 The present invention provides Figure 2 Schematic diagram of the structure of the middle output copper busbar from a side view;

[0031] Figure 7 The present invention provides Figure 2 Schematic diagram of the structure of a medium-power semiconductor from a top-down perspective.

[0032] Figure numerals: 1. supporting base; 2. pressing assembly; 21. main control board; 22. probe board; 23. driving board; 24. gate plate; 25. pressure rod; 3. input assembly; 31. capacitor; 32. input copper busbar; 321. first connecting section; 322. first soft copper busbar; 3221. first bending section; 323. first crimping section; 4. output assembly; 41. output copper busbar; 411. second connecting section; 412. second soft copper busbar; 4121. second bending section; 413. second crimping section; 42. cable; 5. waterway board; 6. first driving part; 7. second driving part; 8. power semiconductor; 81. signal terminal; 82. positive terminal; 83. negative terminal; 84. three-phase terminal; 85. threaded hole; 9. temperature measuring part. DETAILED DESCRIPTION

[0033] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0034] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0036] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.

[0037] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more of the relevant listed items.

[0038] Power semiconductors such as IGBT modules require quality and performance testing during their production and processing. Prior to testing, the power terminals of the test equipment's main circuit must be electrically connected to the input and output terminals of the power semiconductor using cable-locking screws. However, this connection method can easily damage the power semiconductor, and the wiring process is cumbersome and time-consuming, impacting test results and efficiency.

[0039] In order to solve the above problems, Figures 1 to 7 As shown, the present invention first provides a crimping device, which can prevent power semiconductors from being damaged and improve test efficiency.

[0040] like Figure 2 As shown, specifically, the crimping device includes a supporting seat 1, a pressing assembly 2, an input assembly 3 and an output assembly 4, wherein: the supporting seat 1 is used to support the power semiconductor 8; the pressing assembly 2 can be raised and lowered relative to the supporting seat 1, and includes a main control board 21 and a probe board 22 electrically connected to the main control board 21, and the probe board 22 can be crimped to the signal terminal 81 of the power semiconductor 8; the input assembly 3 can be raised and lowered relative to the supporting seat 1, and includes a capacitor 31 and an input copper bus 32 electrically connected to the capacitor 31, and the input copper bus 32 can be crimped to the positive and negative terminals of the power semiconductor 8; the output assembly 4 can be raised and lowered relative to the supporting seat 1, and includes an output copper bus 41 electrically connected to an inductive load such as a motor (not shown) through a cable 42, and the output copper bus 41 can be crimped to the three-phase terminal 84 of the power semiconductor 8.

[0041] In the crimping device provided by an embodiment of the present invention, the power semiconductor 8 is first placed on the supporting seat 1, and then the input component 3, the output component 4 and the downward pressure component 2 are driven to descend relative to the supporting seat 1, so that the input copper bus 32 is crimped to the positive and negative terminals of the power semiconductor 8, the output copper bus 41 is crimped to the three-phase terminal 84 of the power semiconductor 8, and the probe board 22 is crimped to the signal terminal 81 of the power semiconductor 8. The capacitor 31 is used to store electrical energy and filter. After the capacitor 31 is energized, the stored electrical energy is applied to the power semiconductor 8 through the input copper bus 32 and the positive and negative terminals of the power semiconductor 8. The power semiconductor 8 withstands large current and high voltage when operating with an inductive load (which can be active or reactive). The main control board 21 controls parameters such as the switching frequency and output current of the power semiconductor 8 through the probe board 22 and the signal terminal 81. After the power semiconductor 8 converts uncontrollable electrical energy into controllable electrical energy, it is output to the load through the three-phase terminal 84 and the output copper bus 41. The input component 3 and the output component 4 can be electrically connected to the power semiconductor 8 by automatically crimping the copper busbar, without the need for the user to manually connect them using cable screws. The positive and negative terminals and the three-phase terminals 84 of the power semiconductor 8 are not easily damaged, thereby ensuring the accuracy of the test results. It can also simplify the operating steps, improve test efficiency, and facilitate assembly line operations.

[0042] Among them, the copper busbar can pass large current and withstand high voltage, and the contact area between the positive and negative terminals of the power semiconductor 8 and the three-phase terminal 84 is large, making the crimping more stable. In addition, the copper busbar has a strong physical bearing capacity and is not easily damaged during the crimping process, thereby extending its service life.

[0043] In addition, the input component 3 and the down-pressure component 2 are arranged separately, so that the capacitor 31 can be arranged close to the positive and negative terminals of the power semiconductor 8, so as to shorten the distance between the positive and negative poles of the capacitor 31 and the positive and negative terminals of the power semiconductor 8, thereby omitting the stacked copper busbars between the positive and negative poles of the capacitor 31 and the positive and negative terminals of the power semiconductor 8, simplifying the connection structure, reducing the number of parts, and improving the accuracy of the test results.

[0044] like Figure 2 and Figure 7As shown, the power semiconductor 8 includes three three-phase terminals 84, and the number of output copper bars 41 is three, which are arranged in a one-to-one correspondence with the three three-phase terminals 84, so that each output copper bar 41 can be crimped to the corresponding three-phase terminal 84, and the three output copper bars 41 are electrically connected to the load via three cables 42. The power semiconductor 8 also includes three positive terminals 82 and three negative terminals 83, and the number of input copper bars 32 is two. The two input copper bars 32 are respectively connected to the positive and negative poles of the capacitor 31, and the input copper bar 32 connected to the positive pole of the capacitor 31 can be crimped to the three positive terminals 82 of the power semiconductor 8, and the input copper bar 32 connected to the negative pole of the capacitor 31 can be crimped to the three negative terminals 83 of the power semiconductor 8. The side of the power semiconductor 8 facing the down-pressing assembly 2 is provided with a plurality of spaced signal terminals 81, and the probe plate 22 is provided with a plurality of probes corresponding to the signal terminals 81 on the side facing the support base 1, so that the probes of the probe plate 22 can be crimped to the corresponding signal terminals 81.

[0045] like Figure 1 As shown, the down-pressing assembly 2 also includes a driving plate 23 and a gate plate 24 that are arranged on the side of the probe plate 22 away from the supporting base 1 and are electrically connected to the probe plate 22. The driving plate 23 turns on or off the bridge arm of the power semiconductor 8 through PWM, and controls the high power by low power to achieve the conversion between DC and AC, while the gate plate 24 plays a key role in the speed of turning on and off the power semiconductor 8. Generally speaking, the larger the gate parameter, the slower the power semiconductor turns on, and vice versa. It can be understood that the present application uses the driving plate 23 and the gate plate 24 to work together to achieve the turning on and off of the power semiconductor 8 at a certain speed. Since the input component 3 is arranged separately from the pressing component 2, there is enough space above the probe board 22 to install the driving board 23 and the gate plate 24, which makes it easy for users to disassemble or replace the driving board 23 and the gate plate 24, and prevents users from touching the probe on the side of the probe board 22 facing the supporting seat 1 when installing or disassembling the driving board 23 and the gate plate 24, thereby avoiding injuries to the user's hands and damage to the probe, driving board 23 or gate plate 24.

[0046] like Figures 2 to 3 As shown, in the illustrated embodiment, the crimping device further includes a first driving member 6 for driving the input assembly 3 to rise and fall relative to the support base 1. The driving portion of the first driving member 6 is fixed relative to the support base 1, and the output portion of the first driving member 6 is connected to the input assembly 3. When the output portion of the first driving member 6 drives the input assembly 3 to descend, the two input copper bars 32 are respectively crimped onto the positive terminal 82 and the negative terminal 83 of the power semiconductor 8; when the output portion of the first driving member 6 drives the input assembly 3 to ascend, the two input copper bars 32 are separated from both the positive terminal 82 and the negative terminal 83 of the power semiconductor 8.

[0047] like Figures 2 to 3 As shown, the crimping device also includes a second driving member 7 for driving the output assembly 4 and the down-pressing assembly 2 to rise and fall relative to the supporting base 1. The driving portion of the second driving member 7 is fixed relative to the supporting base 1, the output portion of the second driving member 7 is connected to the down-pressing assembly 2, the output assembly 4 is arranged on the down-pressing assembly 2, and can rise and fall together with the down-pressing assembly 2. When the output portion of the second driving member 7 drives the down-pressing assembly 2 and the output assembly 4 to descend, the output copper bus 41 is crimped onto the three-phase terminal 84 of the power semiconductor 8, and the probe plate 22 is crimped onto the signal terminal 81 of the power semiconductor 8; when the output portion of the second driving member 7 drives the down-pressing assembly 2 and the output assembly 4 to rise, the output copper bus 41 is separated from the three-phase terminal 84 of the power semiconductor 8, and the probe plate 22 is separated from the signal terminal 81 of the power semiconductor 8.

[0048] The input assembly 3 is independently driven by the first driver 6, allowing it to be positioned close to the power semiconductor 8 and eliminating the need for additional components to connect it to the hold-down assembly 2, thereby simplifying the overall structure of the crimping device. The output assembly 4 and the hold-down assembly 2 are jointly driven by the second driver 7, eliminating a driver component, reducing the number of parts, avoiding an increase in the overall size of the crimping device, and saving energy.

[0049] In addition, the first driving member 6 and the second driving member 7 can be set as a cylinder, a hydraulic cylinder, etc., which can drive the input component 3, the output component 4 and the downward pressure component 2 to perform linear motion, and can apply a certain pressure to the input component 3, the output component 4 and the downward pressure component 2 to press the power semiconductor 8 onto the supporting seat 1, thereby ensuring the stability of the power semiconductor 8 during the test, and also ensuring that the input copper bus 32 can fit tightly with the positive terminal 82 and the negative terminal 83 of the power semiconductor 8, and the output copper bus 41 can fit tightly with the three-phase terminal 84 of the power semiconductor 8.

[0050] In another embodiment, three driving elements can be used to drive the input component 3, the output component 4 and the downward pressure component 2 to rise and fall relative to the supporting base 1 respectively, or one driving element can be used to drive the input component 3, the output component 4 and the downward pressure component 2 to rise and fall relative to the supporting base 1 together.

[0051] like Figures 2 to 3 As shown, because the power semiconductor 8 is subjected to high current and high voltage when operating with an inductive load, it generates a large amount of heat. To ensure the accuracy and safety of the test, the crimping device also includes a waterway plate 5 disposed on the support base 1. The waterway plate 5 is used to support the power semiconductor 8 and cool the power semiconductor 8. The waterway plate 5 is provided with cooling channels for the circulation of coolant. The coolant flowing in the cooling channels dissipates heat and cools the power semiconductor 8, so that the temperature of the power semiconductor 8 can be maintained within the normal operating temperature range.

[0052] In one embodiment, a groove connected to the cooling channel is provided on one side of the waterway plate 5 facing the down-pressure assembly 2, and the coolant in the cooling channel can flow into the groove, so that the lower surface of the power semiconductor 8 can directly contact the coolant, thereby improving the heat dissipation effect and heat dissipation efficiency. At this time, the pressure applied by the down-pressure assembly 2 to the power semiconductor 8 is greater than the water pressure in the waterway plate 5, so that the power semiconductor 8 can fit tightly with the edge of the groove notch of the waterway plate 5, ensuring the sealing between the power semiconductor 8 and the waterway plate 5 and avoiding coolant leakage. At the same time, it also enables the output copper bus 41 to fit more closely with the three-phase terminal 84 of the power semiconductor 8. Among them, the pressure applied by the down-pressure assembly 2 to the power semiconductor 8 is equal to the sum of the air pressure of the second driving member 7 and the gravity of the down-pressure assembly 2, that is, the sum of the air pressure of the second driving member 7 and the gravity of the down-pressure assembly 2 is greater than the water pressure in the waterway plate 5.

[0053] In another embodiment, the waterway plate 5 may not be provided with a groove, and the lower surface of the power semiconductor 8 is in contact with the upper surface of the waterway plate 5 so that the power semiconductor 8 can be cooled and dissipated by the coolant flowing inside the waterway plate 5 .

[0054] like Figures 2 to 3 As shown, the pressing assembly 2 further includes a pressing rod 25, which can press the power semiconductor 8 against the support base 1. The pressing rod 25 ensures the stability of the power semiconductor 8 during testing, preventing the power semiconductor 8 from shifting relative to the support base 1 and affecting the test results. Furthermore, since the contact area between the pressing rod 25 and the power semiconductor 8 is small, damage to the power semiconductor 8 is also avoided.

[0055] like Figure 3 and Figure 7 As shown, during actual use, the power semiconductor 8 can be fixed to the external device through screws, bolts and other fasteners and threaded holes 85 through threaded cooperation, and the number of threaded holes 85 is multiple, usually 8, and the multiple threaded holes 85 are arranged at intervals along the circumference of the power semiconductor 8 to ensure the stability and reliability of the connection between the power semiconductor 8 and the external device. The number of pressure rods 25 is also multiple, and they are arranged in a one-to-one correspondence with the threaded holes 85 of the power semiconductor 8, so that the power semiconductor 8 can be fixed to the support seat 1 by simulating fasteners during the test. The diameter of the pressure rod 25 is larger than the inner diameter of the threaded hole 85. The diameter of the pressure rod 25 can be 1.02 to 1.08 times the inner diameter of the threaded hole 85, preferably, 1.05 times. In this way, while ensuring the pressing effect, the contact area between the pressure rod 25 and the power semiconductor 8 is reduced, ensuring that the pressure rod 25 does not leave an indentation on the surface of the power semiconductor 8, avoiding damage to the power semiconductor 8.

[0056] like Figures 4 and 5As shown, each input copper busbar 32 includes a first connecting section 321, a first soft copper busbar 322, and a first crimping section 323 connected in sequence. The first connecting section 321 is electrically connected to the capacitor 31, and the first crimping section 323 can be crimped to the positive terminal 82 or the negative terminal 83 of the power semiconductor 8. Specifically, there are three first soft copper busbars 322 and three first crimping sections 323. The three first crimping sections 323 are respectively connected to the first connecting section 321 through the three first soft copper busbars 322, and are connected to the positive or negative terminal of the capacitor 31 through the first connecting section 321.

[0057] When the first driving member 6 drives the input assembly 3 to move downward relative to the supporting seat 1 until the first crimping section 323 contacts the positive terminal 82 or the negative terminal 83 of the power semiconductor 8, the first soft copper bus 322 will deform and act as a buffer to ensure that the positive terminal 82 or the negative terminal 83 of the power semiconductor 8 will not be damaged due to impact. In addition, the first soft copper busbar 322 and the first crimping section 323 will also have a reaction force toward the positive terminal 82 or the negative terminal 83 under the action of the earth's gravity, so that the first crimping section 323 can be completely fitted with the positive terminal 82 or the negative terminal 83 of the power semiconductor 8, avoiding the error in the accuracy of the first driving component 6 driving the input component 3 each time, resulting in poor contact between the first crimping section 323 and the positive terminal 82 or the negative terminal 83 of the power semiconductor 8, causing sparks, copper busbar overheating, blackening, etc., thereby ensuring the stability and reliability of the crimping between the first crimping section 323 and the positive terminal 82 or the negative terminal 83 of the power semiconductor 8, and ensuring that the power semiconductor 8 will not be damaged during the process of carrying large current and high voltage.

[0058] like Figure 5 As shown, the first soft copper busbar 322 includes a first bent section 3221, and the angle α between the extended lines at both ends of the first bent section 3221 is greater than or equal to 135°. In the un-crimped state, the angle α between the extended lines at both ends of the first bent section 3221 is greater than 135°. When the first crimping section 323 is crimped to the positive terminal 82 or the negative terminal 83 of the power semiconductor 8, the angle α between the extended lines at both ends of the first bent section 3221 approaches 135°. When the first bent section 3221 meets the aforementioned angle, the movement accuracy error of the first driver 6 can be better compensated in the crimped state, ensuring more stable contact between the first crimping section 323 and the positive terminal 82 or the negative terminal 83 of the power semiconductor 8. Furthermore, after the first crimping section 323 separates from the positive terminal 82 or the negative terminal 83 of the power semiconductor 8, the first bent section 3221 and the first crimping section 323 can promptly return to the un-crimped state.

[0059] like Figure 6As shown, each output copper busbar 41 includes a second connecting section 411, a second soft copper busbar 412, and a second crimping section 413, which are connected in sequence. The second connecting section 411 is electrically connected to the load, and the second crimping section 413 can be crimped onto the three-phase terminals 84 of the power semiconductor 8. Similarly, when the second driving member 7 drives the output assembly 4 to move downward relative to the supporting base 1 until the second crimping section 413 contacts the three-phase terminals 84 of the power semiconductor 8, the second soft copper busbar 412 deforms and acts as a buffer, ensuring that the three-phase terminals 84 of the power semiconductor 8 are not damaged by impact. In addition, the second soft copper busbar 412 and the second crimping section 413 will also have a reaction force toward the three-phase terminal 84 under the action of the earth's gravity, avoiding the error in the accuracy of the second driving member 7 driving the output component 4 each time, resulting in poor contact between the second crimping section 413 and the three-phase terminal 84 of the power semiconductor 8, causing sparks, copper busbar overheating, blackening, etc., thereby ensuring the stability and reliability of the crimping between the second crimping section 413 and the three-phase terminal 84 of the power semiconductor 8, and ensuring that the power semiconductor 8 will not be damaged in the process of carrying large current and high voltage.

[0060] like Figure 6 As shown, the second soft copper busbar 412 includes a second bent section 4121, and the angle β between the extended lines at both ends of the second bent section 4121 is greater than or equal to 90°. In the un-crimped state, the angle β between the extended lines at both ends of the second bent section 4121 is greater than 90°; when the second crimping section 413 is crimped to the three-phase terminal 84 of the power semiconductor 8, the angle β between the extended lines at both ends of the second bent section 4121 approaches 90°. When the second bent section 4121 meets the above-mentioned angle, it can better compensate for the movement accuracy error of the second driving member 7 in the crimped state, making the contact between the second crimping section 413 and the three-phase terminal 84 of the power semiconductor 8 more stable; and after the second crimping section 413 is separated from the three-phase terminal 84 of the power semiconductor 8, the second soft copper busbar 412 and the second crimping section 413 can also be promptly restored to the un-crimped state.

[0061] The first soft copper busbar 322 and the second soft copper busbar 412 can be produced and processed by using a nickel-laminated copper busbar process.

[0062] like Figure 2 As shown, the crimping device also includes a temperature measuring component 9 for detecting the temperature of the input copper bar 32 or the output copper bar 41, so as to remind the user and stop the test work when the temperature of the input copper bar 32 or the output copper bar 41 is too high, thereby ensuring the safety of the test.

[0063] The present invention also provides a test system including the aforementioned crimping device. The test system uses the crimping device to automatically crimp the input component 3, the output component 4, the down-pressing component 2, and the power semiconductor 8, thereby improving test efficiency and facilitating streamlined operations.

[0064] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0065] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of patent protection for the present application shall be determined by the appended claims.

Claims

1. A crimping device, characterized in that: include: A supporting base (1) for supporting a power semiconductor (8); A pressing assembly (2) is capable of rising and falling relative to the supporting seat (1), and comprises a main control board (21) and a probe board (22) electrically connected to the main control board (21), wherein the probe board (22) is capable of being pressed against a signal terminal (81) of the power semiconductor (8); An input assembly (3) capable of rising and falling relative to the support seat (1) and comprising a capacitor (31) and an input copper busbar (32) electrically connected to the capacitor (31), wherein the input copper busbar (32) can be crimped to the positive and negative terminals of the power semiconductor (8); and An output assembly (4) capable of rising and falling relative to the bearing seat (1) and comprising an output copper busbar (41) electrically connected to a load, wherein the output copper busbar (41) can be crimped to a three-phase terminal (84) of the power semiconductor (8); The input assembly and the pressing assembly are arranged separately, the crimping device further comprises a first driving member (6) for driving the input assembly (3) to rise and fall relative to the supporting seat (1), and the crimping device further comprises a second driving member (7) for driving the output assembly (4) and the pressing assembly (2) to rise and fall relative to the supporting seat (1).

2. The crimping device according to claim 1, wherein: The pressing assembly (2) further comprises a driving plate (23) and a gate plate (24) which are arranged on a side of the probe plate (22) away from the supporting seat (1) and are electrically connected to the probe plate (22).

3. The crimping device according to claim 1, wherein: The crimping device further comprises a waterway plate (5) arranged on the supporting seat (1), wherein the waterway plate (5) is used to support the power semiconductor (8) and cool the power semiconductor (8).

4. The crimping device according to claim 3, wherein: The pressing assembly (2) further comprises a pressing rod (25), and the pressing rod (25) is capable of pressing the power semiconductor (8) against the supporting seat (1).

5. The crimping device according to claim 4, characterized in that: There are multiple pressure rods (25) and they are arranged in one-to-one correspondence with the threaded holes (85) of the power semiconductor (8). The diameter of the pressure rod (25) is larger than the inner diameter of the threaded hole (85).

6. The crimping device according to claim 5, characterized in that: The pressure applied by the pressing component (2) to the power semiconductor (8) is greater than the water pressure in the waterway plate (5).

7. The crimping device according to claim 1, wherein: The input copper busbar (32) comprises a first connecting section (321), a first soft copper busbar (322), and a first crimping section (323) connected in sequence, the first connecting section (321) being electrically connected to the capacitor (31), and the first crimping section (323) being capable of being crimped to the positive and negative terminals of the power semiconductor (8); The output copper busbar (41) comprises a second connecting section (411), a second soft copper busbar (412), and a second crimping section (413) connected in sequence, the second connecting section (411) being electrically connected to the load, and the second crimping section (413) being capable of being crimped to a three-phase terminal (84) of the power semiconductor (8).

8. The crimping device according to claim 7, wherein: The first soft copper busbar (322) comprises a first bending section (3221), and the angle α between the extension lines of both ends of the first bending section (3221) is greater than or equal to 135°; and / or, The second soft copper busbar (412) comprises a second bending section (4121), and the angle β between the extension lines of both ends of the second bending section (4121) is greater than or equal to 90°.

9. A testing system, characterized in that: The invention comprises a crimping device as described in any one of claims 1 to 8.

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