A method, device, equipment, medium and detection equipment for detecting a circuit board

Abstract

The present invention belongs to the technical field of electronic information engineering hardware, and particularly relates to a detection method, device, equipment, medium and detection equipment for a circuit board. This application obtains the circuit information on the back of the target circuit board and the current circuit information; determines the standard circuit information in the graphic database according to the circuit information; and detects the target circuit board according to the standard circuit information and the current circuit information. It realizes the automatic detection of the circuit board, saves a large amount of manpower and material resources, can better ensure the detection effect, and improves the detection efficiency at the same time.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic information engineering hardware, and particularly relates to a method, device, equipment, medium and detection equipment for detecting a circuit board. Background Art

[0002] As the main hardware used in electronic information engineering, the circuit board is the foundation for the development of electronic information engineering. Therefore, higher requirements are imposed on the circuit board, and it is necessary to ensure the correctness of the component layout and welding on the circuit board, as well as the firmness of the welding.

[0003] The welding of circuit board components needs to be carried out sequentially according to the positions of the various components indicated on the printed circuit of the circuit board. When welding, the component welding sequence usually follows the principles of starting with the difficult ones first, the lower ones first, and the surface-mounted ones first and then the inserted ones. The purpose is to facilitate welding and save time. First, weld the components with greater difficulty, mainly referring to the surface-mounted integrated chips with dense pins. Starting with the lower ones first and the surface-mounted ones first and then the inserted ones makes welding more convenient. For example, if the higher components are welded first, it may prevent the welding of other components, especially when there are many tall and dense components. After the circuit board welding is completed, it is usually necessary to inspect the welding integrity of the circuit board to detect whether there are any un-welded points on the current circuit board.

[0004] Currently, when inspecting a circuit board, the method usually adopted is manual observation. However, with the increasing complexity of the circuit board, the manual observation method will waste a large amount of manpower and material resources, and it is very easy to miss some points, and the efficiency is low. In addition, the manual detection method cannot accurately evaluate the circuit board, especially in terms of the welding effect of the circuit board. Summary of the Invention

[0005] In view of the above technical problems, the present invention provides a method, device, equipment, medium and detection equipment for detecting a circuit board. The present application obtains the line information and the current circuit information on the back of the target circuit board; determines the standard circuit information in the graphic database according to the line information; and detects the target circuit board according to the standard circuit information and the current circuit information. The automatic detection of the circuit board is realized, a large amount of manpower and material resources are saved, the detection effect can be better ensured, and the detection efficiency is improved at the same time.

[0006] To solve the above technical problems, the technical solutions adopted by the present invention include five aspects.

[0007] In the first aspect, a method for detecting a circuit board is provided, including: obtaining the line information and the current circuit information on the back of the target circuit board; determining the standard circuit information in the graphic database according to the line information; and detecting the target circuit board according to the standard circuit information and the current circuit information.

[0008] In some embodiments, the current circuit information includes: current solder joint distribution information and current component distribution information; the obtaining of the circuit information on the back of the target circuit board and the current circuit information includes: obtaining a component distribution diagram of the front of the target circuit board through an image acquisition device; obtaining a solder joint distribution diagram of the back of the target circuit board through the image acquisition device; determining the current component distribution information according to the component distribution diagram; and determining the circuit information and the current solder joint distribution information according to the solder joint distribution diagram.

[0009] In some embodiments, the standard circuit information includes: standard component distribution information and standard solder joint distribution information; the detecting of the target circuit board according to the standard circuit information and the current circuit information includes: determining whether the component distribution of the target circuit board is correct according to the standard component distribution information and the current component distribution information; and determining whether the solder joint distribution of the target circuit board is correct according to the standard solder joint distribution information and the current solder joint distribution information.

[0010] In some embodiments, when it is determined that both the solder joint distribution and the component distribution of the target circuit board are correct, the method further includes: obtaining solder joint state information of each solder joint on the target circuit board according to the standard solder joint distribution information; and detecting the target circuit board according to the standard circuit information and the solder joint state information.

[0011] In some embodiments, the obtaining of the solder joint state information of each solder joint on the target circuit board according to the standard solder joint distribution information includes: determining a solder joint state detecting device according to the standard solder joint distribution information; and obtaining the solder joint state information of each solder joint through the solder joint state detecting device.

[0012] In some embodiments, the solder joint state information includes: solder joint height information and solder joint gap degree; the standard circuit information further includes: a solder joint standard height range and a solder joint standard gap degree range; the detecting of the target circuit board according to the standard circuit information and the solder joint state information includes: determining a solder joint height standard rate of the target circuit board according to the solder joint height information of each solder joint and the solder joint standard height range; determining a solder joint gap standard rate of the target circuit board according to the solder joint gap degree of each solder joint and the solder joint standard gap degree; and determining whether the solder joint state of the target circuit board meets the standard according to the height standard rate and the solder joint gap standard rate.

[0013] In a second aspect, the present application provides a detection device for a circuit board, including: a first acquisition module configured to acquire line information and current circuit information on the back of a target circuit board; a first determination module configured to determine standard circuit information in a graphic database according to the line information; and a first execution module configured to detect the target circuit board according to the standard circuit information and the current circuit information.

[0014] In a third aspect, the present application proposes an electronic device, including: a memory and a processor, where a computer program is stored on the memory, and when the computer program is executed by the processor, it executes the method according to any one of the first aspect.

[0015] In a fourth aspect, the present application proposes a storage medium storing a computer program that can be executed by one or more processors, and the computer program can be used to implement the method according to any one of the first aspect.

[0016] In a fifth aspect, the present application provides a detection device for a circuit board, including: a component distribution detection camera, a solder joint distribution detection camera, a solder joint state detection device, and the electronic device according to the third aspect; the component distribution detection camera is configured to acquire a component distribution map on the front of a target circuit board and is electrically connected to the electronic device; the solder joint distribution detection camera is configured to acquire a solder joint distribution map on the back of the target circuit board and is electrically connected to the electronic device; the solder joint state detection device is configured to acquire solder joint height information and solder joint gap degree of each solder joint of the target circuit board and is electrically connected to the electronic device; the solder joint state detection device includes a plurality of light-emitting components and a plurality of photosensitive components; the light-emitting components and the photosensitive components are separated by solder joints, so that the photosensitive components receive light emitted by the light-emitting components on the other side of the solder joints, and during detection, each of the light-emitting components emits light alternately.

[0017] Advantageous effects of the present invention: The present application acquires line information and current circuit information on the back of a target circuit board; determines standard circuit information in a graphic database according to the line information; and detects the target circuit board according to the standard circuit information and the current circuit information. It realizes automatic detection of the circuit board, saves a large amount of manpower and material resources, can better ensure the detection effect, and improves the detection efficiency at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The scope of the present disclosure can be better understood by reading the following detailed description of exemplary embodiments in conjunction with the accompanying drawings. The accompanying drawings included are:

[0019] Figure 1 It is an overall flowchart of a method for detecting a circuit board provided by an embodiment of the present application;

[0020] Figure 2Block diagram of a circuit board detection device provided by an embodiment of the present application;

[0021] Figure 3 Schematic structural diagram of a circuit board detection device provided by an embodiment of the present application;

[0022] Figure 4 Block diagram of a solder joint state detection device provided by an embodiment of the present application. Detailed implementation manners

[0023] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings. The described embodiments should not be construed as limiting the present application. All other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present application.

[0024] In the following description, reference is made to "some embodiments", which describe a subset of all possible embodiments. However, it can be understood that "some embodiments" can be the same subset or different subsets of all possible embodiments, and can be combined with each other without conflict.

[0025] If similar descriptions such as "first / second / third" appear in the application documents, the following explanation is added. In the following description, the terms "first / second / third" are only used to distinguish similar objects and do not represent a specific order for the objects. It can be understood that "first / second / third" can be interchanged with a specific order or sequence when allowed, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0027] Embodiment 1:

[0028] Currently, when inspecting a circuit board, the method of manual observation is usually adopted. However, with the increasing complexity of the circuit board, the method of manual observation will waste a large amount of manpower and material resources, and it is very easy to miss something, and the efficiency is low. In addition, the method of manual detection cannot accurately evaluate the circuit board, especially in terms of the soldering effect of the circuit board.

[0029] Regarding the problems existing in the prior art, such as Figure 1As shown in the figure, the present application provides a method for detecting a circuit board. The method is applied to an electronic device, which can be a server, a mobile terminal, a computer, a cloud platform, etc. The functions realized by the device data processing in the embodiments of the present application can be implemented by a processor of the electronic device calling program code. Among them, the program code can be stored in a computer storage medium. The method for detecting the circuit board includes:

[0030] Step S1: Obtain the circuit information on the back of the target circuit board and the current circuit information.

[0031] The circuit board detection device in the present application includes a circuit board fixing structure. This fixing structure mainly fixes the periphery of the circuit board, making the upper and lower surfaces of the circuit board suspended. An element distribution camera and a solder joint distribution camera are respectively arranged on the upper and lower surfaces of the circuit board. By using the element distribution camera and the solder joint distribution camera to take pictures of the front and back sides of the circuit board respectively, an element distribution diagram and a solder joint distribution diagram can be obtained. The current circuit information includes: current element information and solder joint distribution information.

[0032] Therefore, in some embodiments, step S1 "Obtain the circuit information on the back of the target circuit board and the current circuit information" includes:

[0033] Step S11: Obtain the element distribution diagram of the front side of the target circuit board through an image acquisition device.

[0034] Step S12: Obtain the solder joint distribution diagram of the back side of the target circuit board through the image acquisition device.

[0035] Step S13: Determine the current element distribution information according to the element distribution diagram.

[0036] Step S14: Determine the circuit information and the current solder joint distribution information according to the solder joint distribution diagram.

[0037] Among them, the element distribution diagram contains the position information and shape information of each component. By extracting the features of the element distribution diagram, the position coordinates of each component and the shape of each component can be extracted, and then the current element information in the current circuit information can be obtained.

[0038] On the back of the circuit board, in addition to the pin solder joints of each component, tin lines etched on the circuit board in advance can also be seen. Therefore, similarly, after obtaining the solder joint distribution diagram, solder joint feature extraction and tin line feature extraction can be performed according to the solder joint distribution diagram. After the solder joint feature extraction, the current solder joint distribution information of the target circuit board can be obtained. Since the tin lines represent the connection situation of each component in the circuit board, the circuit information of the current circuit board can be obtained by performing tin line feature extraction on the solder joint distribution diagram.

[0039] Step S2: Determine the standard circuit information in the graphic database according to the circuit information.

[0040] There are various types of circuit boards to be detected, and the corresponding circuit information of different types of circuit boards is different. Therefore, in this application, the target circuit board can be identified through the circuit information. Since the detection is based on the standard circuit board, an image database is also preset in this application. The graphic database stores the standard circuit information of different types of circuit boards. The standard circuit information includes: standard component distribution information, standard solder joint distribution information, and the circuit information representing this type of circuit board. Therefore, after obtaining the circuit information, it is possible to retrieve in the image database according to the circuit information, and then obtain the standard circuit information corresponding to the target circuit board.

[0041] Of course, in some cases, for the identification of the circuit board, other identification methods can be used. For example, an obvious identification code can be set on the circuit board, and then the standard circuit information corresponding to the target circuit board can be determined through the identification code.

[0042] Step S3: Detect the target circuit board according to the standard circuit information and the current circuit information.

[0043] For the detection of the circuit board, it is first necessary to ensure that there are no component installation errors and no pin soldering omissions on the circuit board. Therefore, in some embodiments, step S3 "detect the target circuit board according to the standard circuit information and the current circuit information" includes:

[0044] Step S31: Determine whether the component distribution of the target circuit board is correct according to the standard component distribution information and the current component distribution information.

[0045] Step S32: Determine whether the solder joint distribution of the target circuit board is correct according to the standard solder joint distribution information and the current solder joint distribution information.

[0046] If there are component installation errors or pin soldering omissions during the detection, the error positions will be marked on the component distribution diagram and the solder joint distribution diagram according to the detection results, and the target circuit board will be marked as unqualified.

[0047] For a circuit board, the correct installation of components and the correct soldering of solder joints are basic guarantees and are relatively easy to detect. However, it is difficult to detect and control the soldering effect of the circuit board. And the soldering effect of the circuit board seriously affects the performance of the circuit board.

[0048] Therefore, in some embodiments, when it is determined that the component distribution and solder joint distribution of the target circuit board are both correct, the method further includes:

[0049] Step S4: Obtain the solder joint status information of each solder joint on the target circuit board according to the standard solder joint distribution information.

[0050] During the soldering process, it is possible that the solder joints are too small or too short, in which case the lifespan of the circuit board will be relatively low. Similarly, it is also possible that the solder joints are too large or too high, in which case there are risks when the circuit board is in use. Also, during the soldering process, there may be a situation where the soldering is not firm. In this case, it is possible that one side of the solder joint is soldered normally while there is a gap on the other side, which will further affect the service life of the circuit board. Moreover, when performing power-on detection, these problems cannot be detected either.

[0051] Therefore, in this application, it is also necessary to detect the status of the solder joints. The solder joint status information includes solder joint height information and solder joint gap degree information. Similarly, in the standard circuit information, there are also a solder joint standard height range and a solder joint standard gap degree range.

[0052] In some embodiments, step S4 "Obtain the solder joint status information of each solder joint on the target circuit board according to the standard solder joint distribution information" includes:

[0053] Step S41: Determine a solder joint status detection device according to the standard solder joint distribution information.

[0054] Step S42: Obtain the solder joint status information of each solder joint through the solder joint status detection device.

[0055] Since it involves the detection of each solder joint, and the solder joint parts of different circuit boards are different, the corresponding solder joint status detection devices are also different. Therefore, in this application, it is necessary to determine the solder joint status detection device for detecting the target circuit board according to the standard solder joint distribution information.

[0056] The solder joint status detection device in this application mainly includes a plurality of light-emitting components and photosensitive components, which are distributed on both sides of the solder joint. Then, the photosensitive component receives the light emitted by the light-emitting component. Since there is an obstruction by the solder joint, the height of the solder joint can be obtained. At the same time, when there is a gap between the solder joint and the circuit board, the light will enter the photosensitive component through the gap, and thus the gap degree of each solder joint can be obtained. Among them, in order to ensure that the obtained information is more accurate, the light-emitting components can be controlled to be turned on alternately, that is, the photosensitive components within a certain range receive the light emitted by only one light-emitting component at a time. Moreover, since there are many solder joints on the circuit board, and a single light-emitting component will irradiate more than one solder joint at a time, we can obtain the height information and gap degree of a solder joint at various irradiation angles, thereby making the detection effect of this application better.

[0057] Step S5: Detect the target circuit board based on the standard circuit information and the solder joint status information.

[0058] In some embodiments, step S5, "Detect the target circuit board based on the standard circuit information and the solder joint status information", includes:

[0059] Step S51: Determine the solder joint height standard rate of the target circuit board according to the solder joint height information and the solder joint standard height range of each solder joint.

[0060] Step S52: Determine the solder joint gap standard rate of the target circuit board according to the solder joint gap degree and the solder joint standard gap degree of each solder joint.

[0061] Step S53: Determine whether the solder joint status of the target circuit board meets the standard according to the height standard rate and the solder joint gap standard rate.

[0062] After obtaining the solder joint height information and the solder joint gap degree, the solder joint gap standard rate and the solder joint height standard rate of each target circuit board can be determined according to the solder joint standard height range and the solder joint gap standard rate, and then it can be determined whether the target circuit board meets the standard.

[0063] Embodiment 2:

[0064] Based on the foregoing embodiments, an embodiment of the present application provides a detection device for a circuit board. Each module included in the device and each unit included in each module can be implemented by a processor in a computer device; of course, it can also be implemented by specific logic circuits; in the implementation process, the processor can be a central processing unit (CPU, Central Processing Unit), a microprocessor (MPU, Microprocessor Unit), a digital signal processor (DSP, Digital Signal Processing), or a field programmable gate array (FPGA, Field Programmable Gate Array), etc.

[0065] As Figure 2 shown, a detection device for a circuit board includes: a first acquisition module 1, a first determination module 2, and a first execution module 3.

[0066] The first acquisition module 1 is used to acquire the line information and the current circuit information on the back of the target circuit board. The first determination module 2 is used to determine the standard circuit information in the graphic database according to the line information. The first execution module 3 is used to detect the target circuit board according to the standard circuit information and the current circuit information.

[0067] In some embodiments, the first acquisition module 1 includes: a second acquisition module, a third acquisition module, a second determination module, and a third determination module.

[0068] The second acquisition module is configured to acquire the component distribution diagram of the front side of the target circuit board through an image acquisition device. The third acquisition module is configured to acquire the solder joint distribution diagram of the back side of the target circuit board through the image acquisition device. The second determination module is configured to determine the current component distribution information according to the component distribution diagram. The third determination module is configured to determine the circuit information and the current solder joint distribution information according to the solder joint distribution diagram.

[0069] In some embodiments, the first execution module 3 includes: a fourth determination module and a fifth determination module.

[0070] The fourth determination module is configured to determine whether the component distribution of the target circuit board is correct according to the standard component distribution information and the current component distribution information. The fifth determination module is configured to determine whether the solder joint distribution of the target circuit board is correct according to the standard solder joint distribution information and the current solder joint distribution information.

[0071] In some embodiments, the device further includes: a fourth acquisition module and a second execution module.

[0072] The fourth acquisition module is configured to acquire the solder joint status information of each solder joint on the target circuit board according to the standard solder joint distribution information. The second execution module is configured to detect the target circuit board according to the standard circuit information and the solder joint status information.

[0073] In some embodiments, the fourth acquisition module includes: a sixth determination module and a fifth acquisition module.

[0074] The sixth determination module is configured to determine a solder joint status detection device according to the standard solder joint distribution information. The fifth acquisition module is configured to acquire the solder joint status information of each solder joint through the solder joint status detection device.

[0075] In some embodiments, the second execution module includes: a seventh determination module, an eighth determination module, and a third execution module.

[0076] The seventh determination module is configured to determine the solder joint height standard rate of the target circuit board according to the solder joint height information of each solder joint and the solder joint standard height range. The eighth determination module is configured to determine the solder joint gap standard rate of the target circuit board according to the solder joint gap degree of each solder joint and the solder joint standard gap degree. The third execution module is configured to determine whether the solder joint status of the target circuit board meets the standard according to the height standard rate and the solder joint gap standard rate.

[0077] Each module in the above-mentioned detection device for a circuit board can be implemented in whole or in part by software, hardware, and their combination. Each of the above modules can be embedded in the processor in the device in hardware form or be independent of it, or can be stored in the memory in the processing device in software form, so that the processor can call and execute the operations corresponding to each of the above modules. It should be noted that the division of modules in the embodiments of the present application is illustrative, only a logical function division, and there can be other division methods in actual implementation.

[0078] Embodiment 3:

[0079] In a third aspect, an electronic device is provided, including a storage and a processor. The storage stores a computer program, and when the processor executes the computer program, the steps of a method for detecting a circuit board are implemented.

[0080] Embodiment 4:

[0081] In a fourth aspect, a storage medium is provided. The computer program stored in the storage medium can be executed by one or more processors, and the computer program can be used to implement the steps of the method for detecting a circuit board according to any one of the first aspects.

[0082] Embodiment 5:

[0083] In a fifth aspect, as Figure 3 shown, the present application provides a circuit board detection device, including: a component distribution detection camera 100, a solder joint repair detection camera 300, a solder joint state detection device 200, and the electronic device as described in the third aspect.

[0084] The component distribution detection camera 100 is used to obtain the component distribution map on the front of the target circuit board and is electrically connected to the electronic device. The solder joint repair detection camera 300 is used to obtain the solder joint distribution map on the back of the target circuit board and is electrically connected to the electronic device. The solder joint state detection device 200 is used to obtain the solder joint height information and solder joint gap degree of each solder joint on the target circuit board and is electrically connected to the electronic device. The solder joint state detection device 200 includes a plurality of light-emitting components and a plurality of photosensitive components. The light-emitting components and the photosensitive components are separated by solder joints, so that the photosensitive components receive the light emitted by the light-emitting components on the other side of the solder joints, and when detecting, each of the light-emitting components emits light alternately.

[0085] The circuit board detection device in the present application further includes a circuit board fixing structure. This fixing structure mainly fixes the periphery of the circuit board, making the upper and lower surfaces of the circuit board suspended. A vision distribution camera and a solder joint distribution camera are respectively arranged on the upper and lower surfaces of the circuit board. By using the component distribution camera and the solder joint distribution camera to take pictures of the front and back sides of the circuit board respectively, the component distribution map and the solder joint distribution map can be obtained.

[0086] Among them, various types of solder joint state detection devices 200 are foldably mounted on the fixed structure. For different types of target circuit boards, different types of solder joint state detection devices 200 are applicable. When the solder joint state is not detected, the solder joint state detection device 200 is folded on the back of the support structure. When it is necessary to detect the solder joint state of the target circuit board, the corresponding solder joint state detection device 200 will be attached to the back of the target circuit board, so that the solder joints are surrounded by the solder joint state detection device 200, and then the solder joint height and solder joint gap of each solder joint can be obtained. Of course, for more convenient use, when the solder joint state detection device 200 is used, each light-emitting component will be connected to form a light-emitting band 201. Similarly, each photosensitive component will also be connected to form a photosensitive band 202. Moreover, for more convenient detection, the photosensitive band 202 and the light-emitting band 201 may be attached together. Therefore, the result of the solder joint state detection device 200 is as Figure 4 shown.

[0087] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, storage, database or other medium used in the various embodiments provided in the present application can include at least one of non-volatile and volatile memories. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory or optical memory, etc. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc.

[0088] It should be understood that the "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, the "in one embodiment" or "in an embodiment" that appears throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics may be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present application, the order numbers of the above processes do not mean the order of execution. The order of execution of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present application. The serial numbers of the embodiments of the present application are only for description and do not represent the advantages or disadvantages of the embodiments.

[0089] It should be noted that in this article, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device including the element.

[0090] In several embodiments provided by the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are only illustrative. For example, the division of the units is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units or components can be combined, or can be integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling or communication connection between the components shown or discussed with each other can be through some interfaces, and the indirect coupling or communication connection of the devices or units can be electrical, mechanical or other forms.

[0091] The units described as separate components above may or may not be physically separated, and the components shown as units may or may not be physical units; they can be located in one place or distributed to multiple network units; some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0092] In addition, each functional unit in the embodiments of the present application can be all integrated in a processing unit, or each unit can be separately used as a unit, or two or more units can be integrated in one unit; the above integrated units can be implemented in the form of hardware, or in the form of hardware plus software functional units.

[0093] Those of ordinary skill in the art can understand that all or part of the steps to implement the above method embodiments can be completed by hardware related to program instructions. The foregoing program can be stored in a computer-readable storage medium. When the program is executed, it performs the steps including those of the above method embodiments; and the foregoing storage medium includes: removable storage devices, read-only memories (ROMs), magnetic disks, or optical discs and other media that can store program codes.

[0094] Alternatively, if the above integrated units of the present application are implemented in the form of software function modules and sold or used as independent products, they can also be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the embodiments of the present application, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for causing a controller to execute all or part of the methods described in the various embodiments of the present application. And the foregoing storage medium includes: removable storage devices, ROMs, magnetic disks, or optical discs and other media that can store program codes.

[0095] As described above, the above are only the implementation manners of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A circuit board detection method, characterized in that: include: Get the line information and current circuit information on the back of the target circuit board; Determining standard circuit information in a graphic database according to the line information; Detecting the target circuit board according to the standard circuit information and the current circuit information; The standard circuit information includes: standard component distribution information and standard solder joint distribution information; the detecting the target circuit board according to the standard circuit information and the current circuit information includes: Determining whether the component distribution of the target circuit board is correct according to the standard component distribution information and the current component distribution information; Whether the solder point distribution of the target circuit board is correct according to the standard solder point distribution information and the current solder point distribution information; When it is determined that the solder joint distribution and the component distribution of the target circuit board are correct, the method further includes: Acquire solder point status information of each solder point on the target circuit board according to the standard solder point distribution information; Detecting the target circuit board according to the standard circuit information and the solder joint status information; The step of acquiring solder joint status information of each solder joint on the target circuit board according to the standard solder joint distribution information includes: Determine a welding spot state detection device according to the standard welding spot distribution information; Acquiring the soldering point status information of each soldering point through the soldering point status detection device; The solder joint status information includes: solder joint height information and solder joint gap degree; Among them, the solder joint status detection device includes multiple light-emitting components and multiple photosensitive components. When obtaining the solder joint status information of each solder joint, the light-emitting components and the photosensitive components are respectively arranged on both sides of the solder joint, so that the photosensitive component can receive the light emitted by the light-emitting component on the other side of the solder joint, and when working, each of the light-emitting components emits light alternately, thereby obtaining the solder joint height information and solder joint gap of each solder joint.

2. The method according to claim 1, characterized in that The current circuit information includes: current solder joint distribution information and current component distribution information; the circuit information and current circuit information on the back of the target circuit board are obtained, including: Acquire a component distribution map on the front side of the target circuit board by an image acquisition device; Acquire a solder joint distribution map on the back side of the target circuit board by using the image acquisition device; Determine the current component distribution information according to the component distribution diagram; The line information and the current soldering point distribution information are determined according to the soldering point distribution map.

3. The method according to claim 1, characterized in that The standard circuit information also includes: a standard height range of solder joints and a standard gap range of solder joints; and the detecting of the target circuit board according to the standard circuit information and the solder joint status information includes: Determine the solder point height standard rate of the target circuit board according to the solder point height information of each solder point and the solder point standard height interval; Determine the solder joint gap standard rate of the target circuit board according to the solder joint gap degree of each solder joint and the solder joint standard gap degree; Whether the solder joint state of the target circuit board meets the standard is determined according to the height standard rate and the solder joint gap standard rate.

4. A circuit board detection device, characterized in that: The method according to any one of claims 1 to 3 comprises: A first acquisition module is used to acquire line information and current circuit information on the back of the target circuit board; A first determining module, configured to determine standard circuit information in a graphic database according to the line information; The first execution module is used to detect the target circuit board according to the standard circuit information and the current circuit information.

5. An electronic device, characterized in that: include: A memory and a processor, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the method according to any one of claims 1 to 3 is executed.

6. A storage medium, characterized in that: The computer program stored in the storage medium can be executed by one or more processors, and the computer program can be used to implement the method according to any one of claims 1 to 3.

7. A circuit board detection device, characterized in that: include: A component distribution detection camera, a solder joint distribution detection camera, a solder joint status detection device, and an electronic device as claimed in claim 5; The component distribution detection camera is used to obtain a component distribution map on the front side of the target circuit board and is electrically connected to the electronic device; The solder point distribution detection camera is used to obtain a solder point distribution map on the back of the target circuit board and is electrically connected to the electronic device; The solder joint state detection device is used to obtain solder joint height information and solder joint gap of each solder joint of the target circuit board, and is electrically connected to the electronic device.

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