A horizontal three-layer co-extrusion device for producing medium-voltage PP cables

Abstract

This invention relates to the technical field of co-extrusion equipment, specifically to a horizontal three-layer co-extrusion equipment for producing medium-voltage PP cables. The equipment includes an X-ray imaging module, a control module, and a verification module. The X-ray imaging module detects the insulation extrusion layer, the semiconductor extrusion layer, and the outer sheath extrusion layer, and obtains the blurred area of ​​the cable cross-section and the total area of ​​the cable cross-section, transmitting these values ​​to the control module. The control module calculates a fuzziness index based on the blurred area and total area of ​​the cable cross-section and transmits the fuzziness index to the verification module. The verification module determines whether X-rays penetrate the cable cross-section perpendicularly based on the fuzziness index and feeds this information back to the X-ray imaging module. The X-ray imaging module adjusts the X-ray emission angle based on this information. This process helps improve the accuracy of the detection.

Description

Technical Field

[0001] This invention relates to the technical field of co-extrusion equipment, and more specifically to a horizontal three-layer co-extrusion equipment for producing medium-voltage PP cables. Background Technology

[0002] The horizontal three-layer co-extrusion device for medium-voltage PP cables refers to a type of equipment used to manufacture medium-voltage polypropylene (PP) cables. Its characteristic is that the insulation layer, semiconductor layer and outer sheath of the cable are extruded together in one step through a horizontal co-extrusion process to form a three-layer structure.

[0003] The advantage of a horizontal three-layer co-extrusion unit is that it can complete the extrusion process of multiple layers in one go, improving production efficiency. Furthermore, through the co-extrusion process, different layers can be better bonded together, forming a uniform and compact structure, thus improving the overall performance of the cable. This type of unit is commonly used in the production of medium-voltage cables, such as medium-voltage power cables used in industrial and construction fields.

[0004] Existing co-extrusion equipment includes an extrusion mechanism, a cooling mechanism, and a testing mechanism. The extrusion mechanism is used to heat the raw material and extrude it into an extruded layer of a specific shape. After extrusion, the extruded layer is quickly cooled by the cooling mechanism to ensure that it forms a good shape and structure. After cooling, the quality of the three-layer co-extruded material is tested by the testing mechanism. Generally, X-rays are used to perform non-destructive testing on the three-layer co-extruded structure to identify the materials of different layers and determine the quality of the co-extruded layer.

[0005] Application document CN108535291A discloses a cable inspection system based on X-ray digital imaging, including an X-ray source module, an image acquisition device, a transmission device, a control module, an alarm device, a wireless communication module, and an inspection management platform. The X-ray source module emits X-rays, creating an X-ray penetration area, which is then converted and absorbed by the image acquisition device. The image acquisition device is connected to the control module and is used to acquire images of power cables. The alarm device is connected to the control module and is used to provide alarm prompts for detected defective cables. The wireless communication module is connected to the control module and is used to achieve wireless connection between the control module and the inspection management platform.

[0006] Currently, it is difficult to determine whether X-rays penetrate the cross-section of the co-extruded layer perpendicularly during detection. When X-rays cannot penetrate perpendicularly, the acquired images will be distorted, reducing the accuracy of the detection. Summary of the Invention

[0007] The purpose of this invention is to improve the accuracy of testing. In view of the above-mentioned shortcomings, a horizontal three-layer co-extrusion device for producing medium-voltage PP cables is proposed.

[0008] The present invention adopts the following technical solutions:

[0009] A horizontal three-layer co-extrusion apparatus for producing medium-voltage PP cables, the apparatus comprising an X-ray imaging module, a control module, and an verification module;

[0010] The X-ray imaging module is used to detect the insulation extrusion layer, semiconductor extrusion layer, and outer sheath extrusion layer, and to obtain the blurred area of ​​the cable cross-section and the total area of ​​the cable cross-section, and transmits the blurred area of ​​the cable cross-section and the total area of ​​the cable cross-section to the control module.

[0011] The control module calculates the fuzzy index based on the fuzzy area of ​​the cable cross-section and the total area of ​​the cable cross-section, and transmits the fuzzy index to the confirmation module.

[0012] The confirmation module determines whether the X-rays penetrate the cable cross-section perpendicularly based on the fuzziness index, and feeds back the information on whether the X-rays penetrate the cable cross-section perpendicularly to the X-ray imaging module. The X-ray imaging module then adjusts the X-ray emission angle based on the information on whether the X-rays penetrate the cable cross-section perpendicularly.

[0013] Optionally, the X-ray imaging module includes an X-ray emission submodule, an X-ray detection submodule, and an image analysis submodule;

[0014] The X-ray emitting submodule is used to emit X-rays and make the X-rays penetrate the insulation extrusion layer, semiconductor extrusion layer, and outer sheath extrusion layer. When the confirmation module obtains information on whether the X-rays penetrate the cable cross-section perpendicularly, the X-ray emitting submodule changes the X-ray emission angle according to the information on whether the X-rays penetrate the cable cross-section perpendicularly.

[0015] The X-ray detection submodule is used to capture X-rays passing through the insulating extruded layer, semiconductor extruded layer, and outer sheath extruded layer and form a penetration image. It identifies the insulating extruded layer, semiconductor extruded layer, and outer sheath extruded layer based on the characteristics of different material layers and forms a cross-sectional image, and transmits the cross-sectional image to the image analysis submodule.

[0016] The image analysis submodule is used to analyze the cross-sectional image and obtain the blurred area of ​​the cable cross-section and the total area of ​​the cable cross-section, and transmit the blurred area of ​​the cable cross-section and the total area of ​​the cable cross-section to the control module.

[0017] Optionally, the image analysis submodule includes an area calculator, an image gradient analyzer, an image amplitude analyzer, and a fuzzy feature analyzer;

[0018] The area calculator calculates the fuzzy area of ​​the cable cross-section based on the cross-sectional image and transmits it to the control module;

[0019] The image gradient analyzer is used to calculate the gradient of the cross-sectional image, form a gradient image, and transmit it to the image amplitude analyzer;

[0020] The image amplitude analyzer performs amplitude calculations on the gradient image, forms an amplitude image, and transmits it to the fuzzy feature analyzer.

[0021] The fuzzy feature analyzer analyzes the amplitude image and highlights the fuzzy features through a fuzzy detection filter element. Based on the fuzzy features, it performs threshold processing to obtain the fuzzy region, and then calculates the fuzzy area of ​​the cable cross-section based on the fuzzy region and transmits it to the control module.

[0022] Optionally, when calculating the fuzzy index, the control module satisfies the following formula:

[0023]

[0024] Where mh is the fuzzy index, s mh s is the fuzzy area of ​​the cable cross-section. z This represents the total cross-sectional area of ​​the cable.

[0025] Optionally, the device may also include a thickness detection module, an area detection module, and a uniformity determination module;

[0026] The X-ray emitting submodule also sends a transmission signal to the X-ray detection submodule based on the information that X-rays penetrate the cable cross section vertically. The X-ray detection submodule then transmits the cross-sectional image to the thickness detection module and the area detection module based on the transmission signal.

[0027] The area detection module calculates the total area of ​​the cross-section of the insulating extruded layer, the semiconductor extruded layer, and the outer sheath extruded layer based on the cross-sectional image, and transmits the total area of ​​the cross-section of the insulating extruded layer, the semiconductor extruded layer, and the outer sheath extruded layer to the control module.

[0028] The control module calculates the total number of times the thickness of the insulation extruded layer section is detected, the total number of times the thickness of the semiconductor extruded layer section is detected, and the total number of times the thickness of the outer sheath extruded layer section is detected, based on the total area of ​​the insulation extruded layer section, the total area of ​​the semiconductor extruded layer section, and the total area of ​​the outer sheath extruded layer section, respectively, and transmits the total number of times the thickness of the insulation extruded layer section is detected, the total number of times the thickness of the semiconductor extruded layer section is detected, and the total number of times the thickness of the outer sheath extruded layer section is detected to the thickness detection module.

[0029] The thickness detection module calculates the cross-sectional thickness values ​​for each position of the insulation extrusion layer, semiconductor extrusion layer, and outer sheath extrusion layer based on the cross-sectional image, the total number of times the cross-sectional thickness of the insulation extrusion layer is detected, the total number of times the cross-sectional thickness of the semiconductor extrusion layer is detected, and the total number of times the cross-sectional thickness of the outer sheath extrusion layer is detected. The module then transmits these values ​​to the control module.

[0030] The control module calculates the average cross-sectional thickness of the insulating extruded layer based on the cross-sectional thickness value at each position corresponding to the insulating extruded layer and the total number of times the cross-sectional thickness of the insulating extruded layer is detected. It also calculates the average cross-sectional thickness of the semiconductor extruded layer based on the cross-sectional thickness value at each position corresponding to the semiconductor extruded layer and the total number of times the cross-sectional thickness of the semiconductor extruded layer is detected. Furthermore, it calculates the cross-sectional thickness error index of the insulating extruded layer based on the cross-sectional thickness value at each position corresponding to the insulating extruded layer and the average cross-sectional thickness of the insulating extruded layer. Finally, it calculates the cross-sectional thickness error index of the semiconductor extruded layer based on the cross-sectional thickness value at each position corresponding to the semiconductor extruded layer and the average cross-sectional thickness of the semiconductor extruded layer. Finally, it calculates the cross-sectional thickness error index of the outer sheath extruded layer based on the cross-sectional thickness value at each position corresponding to the insulating extruded layer and the average cross-sectional thickness of the semiconductor extruded layer. These three cross-sectional thickness error indices are then transmitted to the uniformity determination module.

[0031] The uniformity determination module determines whether the cross-sectional thickness of the insulating extruded layer, the semiconductor extruded layer, and the outer sheath extruded layer is uniform based on the cross-sectional thickness error index of the insulating extruded layer, the semiconductor extruded layer, and the outer sheath extruded layer.

[0032] Optionally, when the control module calculates the cross-sectional thickness error index of the insulating extruded layer, the cross-sectional thickness error index of the semiconductor extruded layer, and the cross-sectional thickness error index of the outer sheath extruded layer, the following formula is satisfied:

[0033]

[0034]

[0035]

[0036]

[0037]

[0038]

[0039]

[0040]

[0041]

[0042] Among them, HD jy This refers to the cross-sectional thickness error index of the insulating extruded layer. This represents the cross-sectional thickness value at the first position corresponding to the extruded insulating layer. Let be the cross-sectional thickness value at the a-th position corresponding to the insulating extruded layer. Δl represents the cross-sectional thickness at the A-th position corresponding to the insulating extruded layer. jy This represents the average cross-sectional thickness of the insulating extruded layer;

[0043] A represents the total number of times the cross-sectional thickness of the extruded insulating layer was tested;

[0044] ceil is the floor function, s jy This represents the total cross-sectional area of ​​the insulating extruded layer;

[0045] HD bdt This refers to the cross-sectional thickness error index of the semiconductor extruded layer. This represents the cross-sectional thickness value at the first position corresponding to the semiconductor extrusion layer. Let be the cross-sectional thickness value at the b-th position corresponding to the semiconductor extrusion layer. Δl represents the cross-sectional thickness at the B-th position corresponding to the semiconductor extrusion layer. bdt This represents the average thickness of the semiconductor extruded layer cross-section;

[0046] B represents the total number of times the cross-sectional thickness of the semiconductor extruded layer was measured;

[0047] s bdt This represents the total area of ​​the cross-section of the semiconductor extruded layer;

[0048] HD wh The cross-sectional thickness error index of the outer protective extrusion layer. This represents the cross-sectional thickness value at the first position corresponding to the extruded outer sheath layer. Let be the cross-sectional thickness value at the c-th position corresponding to the outer sheath extrusion layer. Let Δl be the cross-sectional thickness value at the Cth position corresponding to the outer sheath extrusion layer. wh This represents the average thickness of the extruded outer sheath layer.

[0049] C represents the total number of times the cross-sectional thickness of the extruded outer sheath layer was measured;

[0050] s wh This refers to the total area of ​​the cross-section of the outer protective extrusion layer.

[0051] The beneficial effects achieved by this invention are:

[0052] 1. The fuzzy index is calculated by the control module, and the information on whether X-rays penetrate the cable cross section perpendicularly can be obtained under the judgment of the confirmation module, which helps to improve the accuracy of detection.

[0053] 2. With the cooperation of the thickness detection module, area detection module, control module, and uniformity judgment module, information on whether the cross-sectional thickness of the insulation extrusion layer, the semiconductor extrusion layer, and the outer sheath extrusion layer is uniform can be obtained, which helps to improve the convenience of detection.

[0054] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0055] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0056] Figure 2 This is a schematic diagram of the X-ray imaging module in this invention;

[0057] Figure 3 This is a schematic diagram of the overall structure of Embodiment 2 of the present invention;

[0058] Figure 4 This is a schematic diagram of the visual detection module in Embodiment 2 of the present invention. Detailed Implementation

[0059] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention. Furthermore, the accompanying drawings of the present invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

[0060] Example 1: This example provides a horizontal three-layer co-extrusion device for producing medium-voltage PP cables, combined with... Figure 1 and Figure 2 As shown.

[0061] A horizontal three-layer co-extrusion apparatus for producing medium-voltage PP cables, the apparatus comprising an X-ray imaging module, a control module, and an verification module;

[0062] The X-ray imaging module is used to detect the insulation extrusion layer, semiconductor extrusion layer, and outer sheath extrusion layer, and to obtain the blurred area of ​​the cable cross-section and the total area of ​​the cable cross-section, and transmits the blurred area of ​​the cable cross-section and the total area of ​​the cable cross-section to the control module.

[0063] The control module calculates the fuzzy index based on the fuzzy area of ​​the cable cross-section and the total area of ​​the cable cross-section, and transmits the fuzzy index to the confirmation module.

[0064] The confirmation module determines whether the X-rays penetrate the cable cross-section perpendicularly based on the fuzziness index, and feeds back the information on whether the X-rays penetrate the cable cross-section perpendicularly to the X-ray imaging module. The X-ray imaging module then adjusts the X-ray emission angle based on the information on whether the X-rays penetrate the cable cross-section perpendicularly.

[0065] Specifically, when the fuzziness index is greater than or equal to the selection threshold of the fuzziness index, it means that X-rays cannot penetrate the cable cross section perpendicularly. When the fuzziness index is less than the selection threshold of the fuzziness index, it means that X-rays penetrate the cable cross section perpendicularly. The selection threshold of the fuzziness index is set by those skilled in the art based on the experimental precision. For example, the greater the experimental precision required for the experiment, the smaller the value of the corresponding selection threshold of the fuzziness index.

[0066] Optionally, the X-ray imaging module includes an X-ray emission submodule, an X-ray detection submodule, and an image analysis submodule;

[0067] The X-ray emitting submodule is used to emit X-rays and make the X-rays penetrate the insulation extrusion layer, semiconductor extrusion layer, and outer sheath extrusion layer. When the confirmation module obtains information on whether the X-rays penetrate the cable cross-section perpendicularly, the X-ray emitting submodule changes the X-ray emission angle according to the information on whether the X-rays penetrate the cable cross-section perpendicularly.

[0068] The X-ray detection submodule is used to capture X-rays passing through the insulating extruded layer, semiconductor extruded layer, and outer sheath extruded layer and form a penetration image. It identifies the insulating extruded layer, semiconductor extruded layer, and outer sheath extruded layer based on the characteristics of different material layers and forms a cross-sectional image, and transmits the cross-sectional image to the image analysis submodule.

[0069] The image analysis submodule is used to analyze the cross-sectional image and obtain the blurred area of ​​the cable cross-section and the total area of ​​the cable cross-section, and transmit the blurred area of ​​the cable cross-section and the total area of ​​the cable cross-section to the control module.

[0070] Specifically, when the ambiguity index is greater than or equal to the selection threshold of the ambiguity index, the X-ray emitting submodule changes by 2° in the forward or backward direction (with the axis of the cable as the forward and backward direction). The change refers to changing the extension direction of the X-ray emitted by the X-ray emitting submodule.

[0071] Optionally, the image analysis submodule includes an area calculator, an image gradient analyzer, an image amplitude analyzer, and a fuzzy feature analyzer;

[0072] The area calculator calculates the fuzzy area of ​​the cable cross-section based on the cross-sectional image and transmits it to the control module;

[0073] The image gradient analyzer is used to calculate the gradient of the cross-sectional image, form a gradient image, and transmit it to the image amplitude analyzer;

[0074] The image amplitude analyzer performs amplitude calculations on the gradient image, forms an amplitude image, and transmits it to the fuzzy feature analyzer.

[0075] The fuzzy feature analyzer analyzes the amplitude image and highlights the fuzzy features through a fuzzy detection filter element. Based on the fuzzy features, it performs threshold processing to obtain the fuzzy region, and then calculates the fuzzy area of ​​the cable cross-section based on the fuzzy region and transmits it to the control module.

[0076] Specifically, gradient refers to the direction and intensity of gray-level changes at each pixel in a cross-sectional image, thus obtaining the edge distribution of the cross-sectional image. An image gradient analyzer can use a first-order gradient operator. Amplitude refers to the magnitude of gray-level changes, which can measure the details in the image. An image amplitude analyzer can better capture edge information.

[0077] Optionally, when calculating the fuzzy index, the control module satisfies the following formula:

[0078]

[0079] Where mh is the fuzzy index, s mh s is the fuzzy area of ​​the cable cross-section. z This represents the total cross-sectional area of ​​the cable.

[0080] Specifically, the units for the fuzzy area of ​​the cable cross-section and the total area of ​​the cable cross-section are both square millimeters. The cable refers to the structure after three-layer co-extrusion, which includes an insulating extruded layer surrounding the conductor, a semiconductor extruded layer surrounding the insulating extruded layer, and an outer sheath extruded layer surrounding the semiconductor extruded layer.

[0081] Optionally, the device may also include a thickness detection module, an area detection module, and a uniformity determination module;

[0082] The X-ray emitting submodule also sends a transmission signal to the X-ray detection submodule based on the information that X-rays penetrate the cable cross section vertically. The X-ray detection submodule then transmits the cross-sectional image to the thickness detection module and the area detection module based on the transmission signal.

[0083] The area detection module calculates the total area of ​​the cross-section of the insulating extruded layer, the semiconductor extruded layer, and the outer sheath extruded layer based on the cross-sectional image, and transmits the total area of ​​the cross-section of the insulating extruded layer, the semiconductor extruded layer, and the outer sheath extruded layer to the control module.

[0084] The control module calculates the total number of times the thickness of the insulation extruded layer section is detected, the total number of times the thickness of the semiconductor extruded layer section is detected, and the total number of times the thickness of the outer sheath extruded layer section is detected, based on the total area of ​​the insulation extruded layer section, the total area of ​​the semiconductor extruded layer section, and the total area of ​​the outer sheath extruded layer section, respectively, and transmits the total number of times the thickness of the insulation extruded layer section is detected, the total number of times the thickness of the semiconductor extruded layer section is detected, and the total number of times the thickness of the outer sheath extruded layer section is detected to the thickness detection module.

[0085] The thickness detection module calculates the cross-sectional thickness values ​​for each position of the insulation extrusion layer, semiconductor extrusion layer, and outer sheath extrusion layer based on the cross-sectional image, the total number of times the cross-sectional thickness of the insulation extrusion layer is detected, the total number of times the cross-sectional thickness of the semiconductor extrusion layer is detected, and the total number of times the cross-sectional thickness of the outer sheath extrusion layer is detected. The module then transmits these values ​​to the control module.

[0086] The control module calculates the average cross-sectional thickness of the insulating extruded layer based on the cross-sectional thickness value at each position corresponding to the insulating extruded layer and the total number of times the cross-sectional thickness of the insulating extruded layer is detected. It also calculates the average cross-sectional thickness of the semiconductor extruded layer based on the cross-sectional thickness value at each position corresponding to the semiconductor extruded layer and the total number of times the cross-sectional thickness of the semiconductor extruded layer is detected. Furthermore, it calculates the cross-sectional thickness error index of the insulating extruded layer based on the cross-sectional thickness value at each position corresponding to the insulating extruded layer and the average cross-sectional thickness of the insulating extruded layer. Finally, it calculates the cross-sectional thickness error index of the semiconductor extruded layer based on the cross-sectional thickness value at each position corresponding to the semiconductor extruded layer and the average cross-sectional thickness of the semiconductor extruded layer. Finally, it calculates the cross-sectional thickness error index of the outer sheath extruded layer based on the cross-sectional thickness value at each position corresponding to the insulating extruded layer and the average cross-sectional thickness of the semiconductor extruded layer. These three cross-sectional thickness error indices are then transmitted to the uniformity determination module.

[0087] The uniformity determination module determines whether the cross-sectional thickness of the insulating extruded layer, the semiconductor extruded layer, and the outer sheath extruded layer is uniform based on the cross-sectional thickness error index of the insulating extruded layer, the semiconductor extruded layer, and the outer sheath extruded layer.

[0088] Specifically, when the cross-sectional thickness error index of the insulating extruded layer is greater than or equal to the selection threshold of the cross-sectional thickness error index of the insulating extruded layer, it indicates that the cross-sectional thickness of the insulating extruded layer is non-uniform; when the cross-sectional thickness error index of the insulating extruded layer is less than the selection threshold of ...

[0089] Specifically, in order to facilitate the detection by the area detection module and the thickness detection module, edge detection and contour extraction are performed on the cross-sectional image to better distinguish the insulation extrusion layer, semiconductor extrusion layer and outer sheath extrusion layer. Then, the positions of all points in the distinguished insulation extrusion layer area are identified and the centroid of the insulation extrusion layer is calculated. Based on the centroid, it is easier for the area detection module and the thickness detection module to detect.

[0090] Optionally, when the control module calculates the cross-sectional thickness error index of the insulating extruded layer, the cross-sectional thickness error index of the semiconductor extruded layer, and the cross-sectional thickness error index of the outer sheath extruded layer, the following formula is satisfied:

[0091]

[0092]

[0093]

[0094]

[0095]

[0096]

[0097]

[0098]

[0099]

[0100] Among them, HD jy This refers to the cross-sectional thickness error index of the insulating extruded layer. This represents the cross-sectional thickness value at the first position corresponding to the extruded insulating layer. Let be the cross-sectional thickness value at the a-th position corresponding to the insulating extruded layer. Δl represents the cross-sectional thickness at the A-th position corresponding to the insulating extruded layer. jy This represents the average cross-sectional thickness of the insulating extruded layer;

[0101] A represents the total number of times the cross-sectional thickness of the extruded insulating layer was tested;

[0102] ceil is the floor function, s jy This represents the total cross-sectional area of ​​the insulating extruded layer;

[0103] HD bdt This refers to the cross-sectional thickness error index of the semiconductor extruded layer. This represents the cross-sectional thickness value at the first position corresponding to the semiconductor extrusion layer. Let be the cross-sectional thickness value at the b-th position corresponding to the semiconductor extrusion layer. Δl represents the cross-sectional thickness at the B-th position corresponding to the semiconductor extrusion layer. bdt This represents the average thickness of the semiconductor extruded layer cross-section;

[0104] B represents the total number of times the cross-sectional thickness of the semiconductor extruded layer was measured;

[0105] s bdt This represents the total area of ​​the cross-section of the semiconductor extruded layer;

[0106] HD wh The cross-sectional thickness error index of the outer protective extrusion layer. This represents the cross-sectional thickness value at the first position corresponding to the extruded outer sheath layer. Let be the cross-sectional thickness value at the c-th position corresponding to the outer sheath extrusion layer. Let Δl be the cross-sectional thickness value at the Cth position corresponding to the outer sheath extrusion layer. wh This represents the average thickness of the extruded outer sheath layer.

[0107] C represents the total number of times the cross-sectional thickness of the extruded outer sheath layer was measured;

[0108] s wh This refers to the total area of ​​the cross-section of the outer protective extrusion layer.

[0109] Specifically, regarding the floor function, the following points should be noted: For example, when represented as ceil(unknown), if the unknown is positive and has a decimal part, ceil(unknown) will output the smallest integer not less than the unknown; if the unknown is negative and has a decimal part, ceil(unknown) will output the smallest integer not less than the unknown; if the unknown is an integer, ceil(unknown) will output the unknown itself. The cross-sectional thickness values ​​at the first position corresponding to the insulating extruded layer, the a-th position corresponding to the insulating extruded layer, the A-th position corresponding to the insulating extruded layer, and the semiconductor extruded layer... The units for the cross-sectional thickness values ​​at the first, b, and B positions of the semiconductor extruded layer, the first, c, and C positions of the outer sheath extruded layer are all millimeters. The units for the total cross-sectional area of ​​the insulation extruded layer, the semiconductor extruded layer, and the outer sheath extruded layer are all square millimeters. The positions of the insulation extruded layer, the outer sheath extruded layer, and the semiconductor extruded layer are not consistent in each test to improve the objectivity of the calculation.

[0110] The units mentioned above are just examples. Those skilled in the art can set different thickness value units according to actual needs when implementing this solution.

[0111] This embodiment solves the problem of low detection accuracy in traditional co-extrusion devices. Specifically, this embodiment calculates the fuzzy index through the control module and obtains information on whether X-rays penetrate the cable cross-section perpendicularly under the judgment of the confirmation module, which helps to improve the detection accuracy.

[0112] In addition, with the cooperation of the thickness detection module, area detection module, control module, and uniformity determination module, information on whether the cross-sectional thickness of the insulation extrusion layer, the cross-sectional thickness of the semiconductor extrusion layer, and the cross-sectional thickness of the outer sheath extrusion layer are uniform can be obtained, which helps to improve the convenience of detection.

[0113] Example 2: This example includes all the content of Example 1, and provides a horizontal three-layer co-extrusion device for producing medium-voltage PP cables, combined with... Figure 3 and Figure 4 As shown.

[0114] A horizontal three-layer co-extrusion apparatus for producing medium-voltage PP cables, the apparatus further comprising a vision inspection module, an information storage module, and a surface quality judgment module;

[0115] The visual inspection module is used to detect the surface of the extruded outer sheath to be tested and to obtain the damaged area and the total area of ​​the extruded outer sheath to be tested. The damaged area and the total area of ​​the extruded outer sheath to be tested are then transmitted to the control module.

[0116] The information storage module is used to store the bulging index of the surface of the extruded outer sheath layer to be tested and transmit it to the control module;

[0117] The control module calculates the integrity factor of the extruded outer sheath surface to be tested based on the bulging index, the damaged area, and the total area of ​​the extruded outer sheath surface to be tested, and then transmits the integrity factor of the extruded outer sheath surface to the surface quality judgment module.

[0118] The surface quality assessment module determines whether the surface quality of the outer sheath extrusion layer is qualified based on the integrity factor of the surface of the outer sheath extrusion layer to be tested.

[0119] Specifically, when the integrity factor of the extruded outer sheath surface to be tested is greater than or equal to the selection threshold of the integrity factor of the extruded outer sheath surface to be tested, it indicates that the surface quality of the extruded outer sheath is unqualified; when the integrity factor of the extruded outer sheath surface to be tested is less than the selection threshold of the integrity factor of the extruded outer sheath surface to be tested, it indicates that the surface quality of the extruded outer sheath is qualified. The selection threshold of the integrity factor of the extruded outer sheath surface to be tested shall be set by those skilled in the art according to the experimental precision.

[0120] Optionally, the visual inspection module includes an acquisition submodule, a preprocessing submodule, a feature extraction submodule, a damage identification submodule, and a data processing submodule;

[0121] The acquisition submodule is used to acquire an initial image of the surface of the extruded outer sheath layer to be tested and transmit the initial image to the preprocessing submodule;

[0122] The preprocessing submodule denoises the initial image and then transmits it to the feature extraction submodule;

[0123] The feature extraction submodule extracts the surface features of the outer sheath extrusion layer to be tested and transmits them to the damage identification submodule and the data processing submodule.

[0124] The damage identification submodule identifies the shape, location, and size of damage on the surface of the extruded outer sheath layer to be tested based on a threshold, and transmits this information to the data processing submodule.

[0125] The data processing submodule calculates the damaged area and total area of ​​the extruded outer sheath surface to be tested based on the surface of the outer sheath to be tested and the information on the shape, location and size of the damage on the surface, and then transmits the damaged area and total area of ​​the extruded outer sheath surface to the control module.

[0126] Optionally, when calculating the integrity factor of the extruded outer sheath surface to be tested, the control module satisfies the following formula:

[0127]

[0128] Where GB is the integrity factor of the surface of the extruded outer sheath layer to be tested, and mj ps The damaged area on the surface of the extruded outer sheath layer to be tested, mj z The total area of ​​the extruded outer sheath layer to be tested is denoted as rg, which is the bulging index of the extruded outer sheath layer to be tested. rg has the following values: rg = 0.3 or rg = 0.1. When rg = 0.3, a bulging sensation is felt when the surface of the extruded outer sheath layer to be tested is touched manually. In other cases, rg = 0.1.

[0129] Specifically, the units for the damaged area of ​​the outer extruded layer surface to be tested and the total area of ​​the outer extruded layer surface to be tested are both square millimeters. The "outer extruded layer to be tested" refers to the product that is cut after co-extrusion processing.

[0130] The above units are just examples. Those skilled in the art can set different area units according to actual needs when implementing this solution.

[0131] This embodiment solves the problem of the relatively simple detection of traditional co-extrusion devices. Specifically, this embodiment performs damage detection on the surface of the extruded outer sheath layer to be tested with the help of a vision inspection module, which helps to improve the objectivity of the detection.

[0132] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of protection of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the scope of protection of the present invention. Furthermore, the elements therein can be updated as technology develops.

Claims

1. A horizontal three-layer co-extrusion apparatus for producing medium-voltage PP cables, characterized in that, The device includes an X-ray imaging module, a control module, and a verification module; The X-ray imaging module is used to detect the insulation extrusion layer, semiconductor extrusion layer, and outer sheath extrusion layer, and to obtain the blurred area of ​​the cable cross-section and the total area of ​​the cable cross-section, and transmits the blurred area of ​​the cable cross-section and the total area of ​​the cable cross-section to the control module. The control module calculates the fuzzy index based on the fuzzy area of ​​the cable cross-section and the total area of ​​the cable cross-section, and transmits the fuzzy index to the confirmation module. The confirmation module determines whether the X-rays penetrate the cable cross-section perpendicularly based on the fuzziness index, and feeds back the information on whether the X-rays penetrate the cable cross-section perpendicularly to the X-ray imaging module. The X-ray imaging module then adjusts the X-ray emission angle based on the information on whether the X-rays penetrate the cable cross-section perpendicularly.

2. The horizontal three-layer co-extrusion apparatus for producing medium-voltage PP cables as described in claim 1, characterized in that, The X-ray imaging module includes an X-ray emission submodule, an X-ray detection submodule, and an image analysis submodule; The X-ray emitting submodule is used to emit X-rays and make the X-rays penetrate the insulation extrusion layer, semiconductor extrusion layer, and outer sheath extrusion layer. When the confirmation module obtains information on whether the X-rays penetrate the cable cross-section perpendicularly, the X-ray emitting submodule changes the X-ray emission angle according to the information on whether the X-rays penetrate the cable cross-section perpendicularly. The X-ray detection submodule is used to capture X-rays passing through the insulating extruded layer, semiconductor extruded layer, and outer sheath extruded layer and form a penetration image. It identifies the insulating extruded layer, semiconductor extruded layer, and outer sheath extruded layer based on the characteristics of different material layers and forms a cross-sectional image, and transmits the cross-sectional image to the image analysis submodule. The image analysis submodule is used to analyze the cross-sectional image and obtain the blurred area of ​​the cable cross-section and the total area of ​​the cable cross-section, and transmit the blurred area of ​​the cable cross-section and the total area of ​​the cable cross-section to the control module.

3. A horizontal three-layer co-extrusion apparatus for producing medium-voltage PP cables as described in claim 2, characterized in that, The image analysis submodule includes an area calculator, an image gradient analyzer, an image amplitude analyzer, and a fuzzy feature analyzer. The area calculator calculates the fuzzy area of ​​the cable cross-section based on the cross-sectional image and transmits it to the control module; The image gradient analyzer is used to calculate the gradient of the cross-sectional image, form a gradient image, and transmit it to the image amplitude analyzer; The image amplitude analyzer performs amplitude calculations on the gradient image, forms an amplitude image, and transmits it to the fuzzy feature analyzer. The fuzzy feature analyzer analyzes the amplitude image and highlights the fuzzy features through a fuzzy detection filter element. Based on the fuzzy features, it performs threshold processing to obtain the fuzzy region, and then calculates the fuzzy area of ​​the cable cross-section based on the fuzzy region and transmits it to the control module.

4. A horizontal three-layer co-extrusion apparatus for producing medium-voltage PP cables as described in claim 3, characterized in that, When the control module calculates the fuzzy index, it satisfies the following formula: Where mh is the fuzzy index, s mh s is the fuzzy area of ​​the cable cross-section. z This represents the total cross-sectional area of ​​the cable.

5. A horizontal three-layer co-extrusion apparatus for producing medium-voltage PP cables as described in claim 4, characterized in that, The device also includes a thickness detection module, an area detection module, and a uniformity determination module; The X-ray emitting submodule also sends a transmission signal to the X-ray detection submodule based on the information that X-rays penetrate the cable cross section vertically. The X-ray detection submodule then transmits the cross-sectional image to the thickness detection module and the area detection module based on the transmission signal. The area detection module calculates the total area of ​​the cross-section of the insulating extruded layer, the semiconductor extruded layer, and the outer sheath extruded layer based on the cross-sectional image, and transmits the total area of ​​the cross-section of the insulating extruded layer, the semiconductor extruded layer, and the outer sheath extruded layer to the control module. The control module calculates the total number of times the thickness of the insulation extruded layer section is detected, the total number of times the thickness of the semiconductor extruded layer section is detected, and the total number of times the thickness of the outer sheath extruded layer section is detected, based on the total area of ​​the insulation extruded layer section, the total area of ​​the semiconductor extruded layer section, and the total area of ​​the outer sheath extruded layer section, respectively, and transmits the total number of times the thickness of the insulation extruded layer section is detected, the total number of times the thickness of the semiconductor extruded layer section is detected, and the total number of times the thickness of the outer sheath extruded layer section is detected to the thickness detection module. The thickness detection module calculates the cross-sectional thickness values ​​for each position of the insulation extrusion layer, semiconductor extrusion layer, and outer sheath extrusion layer based on the cross-sectional image, the total number of times the cross-sectional thickness of the insulation extrusion layer is detected, the total number of times the cross-sectional thickness of the semiconductor extrusion layer is detected, and the total number of times the cross-sectional thickness of the outer sheath extrusion layer is detected. The module then transmits these values ​​to the control module. The control module calculates the average cross-sectional thickness of the insulating extruded layer based on the cross-sectional thickness value at each position corresponding to the insulating extruded layer and the total number of times the cross-sectional thickness of the insulating extruded layer is detected. It also calculates the average cross-sectional thickness of the semiconductor extruded layer based on the cross-sectional thickness value at each position corresponding to the semiconductor extruded layer and the total number of times the cross-sectional thickness of the semiconductor extruded layer is detected. Furthermore, it calculates the cross-sectional thickness error index of the insulating extruded layer based on the cross-sectional thickness value at each position corresponding to the insulating extruded layer and the average cross-sectional thickness of the insulating extruded layer. Finally, it calculates the cross-sectional thickness error index of the semiconductor extruded layer based on the cross-sectional thickness value at each position corresponding to the semiconductor extruded layer and the average cross-sectional thickness of the semiconductor extruded layer. Finally, it calculates the cross-sectional thickness error index of the outer sheath extruded layer based on the cross-sectional thickness value at each position corresponding to the insulating extruded layer and the average cross-sectional thickness of the semiconductor extruded layer. These three cross-sectional thickness error indices are then transmitted to the uniformity determination module. The uniformity determination module determines whether the cross-sectional thickness of the insulating extruded layer, the semiconductor extruded layer, and the outer sheath extruded layer is uniform based on the cross-sectional thickness error index of the insulating extruded layer, the semiconductor extruded layer, and the outer sheath extruded layer.

6. A horizontal three-layer co-extrusion apparatus for producing medium-voltage PP cables as described in claim 5, characterized in that, When the control module calculates the cross-sectional thickness error index of the insulating extruded layer, the semiconductor extruded layer, and the outer sheath extruded layer, it satisfies the following formula: Among them, HD jy This refers to the cross-sectional thickness error index of the insulating extruded layer. This represents the cross-sectional thickness value at the first position corresponding to the extruded insulating layer. Let be the cross-sectional thickness value at the a-th position corresponding to the insulating extruded layer. Δl represents the cross-sectional thickness at the A-th position corresponding to the insulating extruded layer. jy This represents the average cross-sectional thickness of the insulating extruded layer; A represents the total number of times the cross-sectional thickness of the extruded insulating layer was tested; ceil is the floor function, s jy This represents the total cross-sectional area of ​​the insulating extruded layer; HD bdt This refers to the cross-sectional thickness error index of the semiconductor extruded layer. This represents the cross-sectional thickness value at the first position corresponding to the semiconductor extrusion layer. Let be the cross-sectional thickness value at the b-th position corresponding to the semiconductor extrusion layer. Δl represents the cross-sectional thickness at the B-th position corresponding to the semiconductor extrusion layer. bdt This represents the average thickness of the semiconductor extruded layer cross-section; B represents the total number of times the cross-sectional thickness of the semiconductor extruded layer was measured; s bdt This represents the total area of ​​the cross-section of the semiconductor extruded layer; HD wh The cross-sectional thickness error index of the outer protective extrusion layer. This represents the cross-sectional thickness value at the first position corresponding to the extruded outer sheath layer. Let be the cross-sectional thickness value at the c-th position corresponding to the outer sheath extrusion layer. Let Δl be the cross-sectional thickness value at the Cth position corresponding to the outer sheath extrusion layer. wh This represents the average thickness of the extruded outer sheath layer. C represents the total number of times the cross-sectional thickness of the extruded outer sheath layer was measured; s wh This refers to the total area of ​​the cross-section of the outer protective extrusion layer.

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