Vibration reduction control method, device and electronic equipment for electroplating equipment

Abstract

The present application provides a method, device and electronic device for vibration reduction control of electroplating equipment. The method comprises: obtaining the resonant frequency of the electroplating equipment; based on the resonant frequency, selecting the working frequency of the blade, the working frequency being equal to m times the resonant frequency, m being a real number within the numerical range (0, 0.5 and the working cycle of the blade being less than the process time of electroplating; wherein the working frequency is the frequency of the blade performing step-by-step reciprocating vibration in the electroplating chamber of the electroplating equipment. The method, device and electronic device for vibration reduction control of the electroplating equipment of the present application, according to the different resonant frequencies of different electroplating equipment, specifically controls the working frequency of the blade in the electroplating chamber of the electroplating equipment, as well as the vibration mode of the blade in different electroplating chambers, thereby greatly reducing the influence of the blade vibration, ensuring the stability of the substrate in the actual process environment, guaranteeing the processing quality of the substrate, and improving the substrate yield.

Description

Technical Field

[0001] The present application relates to the technical field of integrated circuit production and manufacturing, and in particular to a vibration reduction control method, device and electronic equipment for electroplating equipment. Background Art

[0002] With the rapid development of integrated circuit manufacturing technology, the chip area continues to increase, and the number of transistors in the chip has increased dramatically. There are even tens of thousands or even more than 10 billion transistors in a chip. The electroplating process has increasingly higher requirements for plating rate and output, and in the field of advanced packaging, higher uniformity within the chip is also required. In order to ensure stable mass transmission during the electroplating process and meet production capacity and quality requirements, a high-speed oscillating paddle assembly is introduced into the electroplating equipment. The paddle assembly includes multiple paddles parallel to the substrate surface. The paddles reciprocate to stir the plating solution and fully supply metal ions and plating solution additives to the substrate surface.

[0003] Please refer to the Figure 1 , Figure 1 The figure shows a schematic diagram of the structure of an electroplating device disclosed in the patent application number 202110154928.5. Figure 1 As shown, the electroplating equipment includes an electroplating tank 101, a substrate clamp 102 and a plurality of parallel strip-shaped paddles 103. The substrate clamp 102 is used to clamp the substrate 104, and the paddle 103 is located between the substrate 104 and the electrode (not shown) and is parallel to the substrate 104. During electroplating, the substrate 104 and the paddle 103 are immersed in the plating solution in the electroplating tank 101. Driven by the driving mechanism 105, the paddle 103 reciprocates in a direction parallel to the substrate 104 to stir the plating solution. The movement direction of the paddle 103 can be further limited by the guide rail 109 connected thereto. The driving mechanism 105 is connected to a controller 106, and the controller 106 controls the action of the driving mechanism 105 through a program, thereby controlling the movement of the paddle 103. Define a as the paddle width, b as the narrowest width of the gap between adjacent paddles, and refer to one of the movement modes of the paddle 103. Figure 2 . Figure 2 The figure shows the position change of the blade in one cycle when the blade vibrates in a step-by-step manner in the prior art. Figure 2It can be seen that in one working cycle, the movement of the blade 103 is divided into the following four steps: step 501, moving from the coordinate origin (black triangle) to the right to the coordinate Δ; step 502, moving to the left to the coordinate a; step 503, moving to the right to the coordinate Δ+a; step 504, moving back to the coordinate origin to the left. In one working cycle, the blade 103 moves alternately left and right. Since each corresponding point on the substrate 104 is blocked by the blade 103 for an equal amount of time, when the electric field is evenly distributed, each corresponding point on the substrate 104 receives an equal amount of electricity, so the electroplating height of each point is the same. In one working cycle, in order to ensure that the coordinate ranges covered by the blade 103 at each return position do not overlap with each other, it is required that Δ≥a+b, that is, Δ≥2a, so that the degree of stirring at each location in the electroplating is more balanced. In the electroplating process, after the blade 103 completes one working cycle, it immediately enters the next working cycle.

[0004] With the increasing demand for high-speed electroplating, high-speed tin-silver electroplating equipment has become a standard configuration after high-speed copper electroplating equipment, and more and more electroplating chambers with high-speed oscillating paddles are configured on the same electroplating equipment. Taking a certain electroplating equipment as an example, there were 8 copper electroplating chambers with paddles before, and now 4 tin-silver electroplating chambers with paddles have been added, with a total of 12 electroplating chambers equipped with paddles. However, the main frame of the electroplating equipment is bound to each other. When multiple electroplating chambers work at the same time, each electroplating chamber will vibrate, causing the various modules of the electroplating equipment to affect each other. At a certain frequency, the electroplating equipment resonates as a whole. At this time, the substrate in the electroplating chamber is prone to movement, and the movement data has been measured to be 0.5mm. Movement often causes substrate position misalignment alarms, affecting the normal processing of the substrate. After measurement, the resonant frequency when the electroplating equipment and the paddles reach resonance in this case is 1Hz. The periodic diagram of the electroplating equipment and the paddles reaching resonance is as shown below. Figure 3 shown.

[0005] As the requirements for electroplating uniformity become increasingly higher, the paddle 103 adopts the above-mentioned step-by-step reciprocating vibration mode. The vibration of the paddle 103 and the vibration of the electroplating equipment produce two vibration frequencies similar to the harmonics and carrier waves in electromagnetic waves. When the two frequencies are close, resonance is likely to occur. Once resonance occurs, the overall amplitude of the electroplating equipment will increase. The vibration of the electroplating equipment will be transmitted to each module of the machine through the main frame of the machine, causing the relevant components to vibrate passively. For example, the substrate loading box and substrate alignment device in the front-end module are affected by the jitter, causing the substrate position to shift. Even the robot itself will be affected, and there will be a risk of substrate falling or position shifting during high-speed movement. Summary of the Invention

[0006] In view of this, the embodiments of the present application provide a vibration reduction control method, device and electronic equipment for electroplating equipment, which at least partially solve the problems existing in the prior art, can reduce the vibration of the electroplating equipment during operation, and achieve the purpose of stabilizing the substrate process and equipment.

[0007] In a first aspect, an embodiment of the present application provides a vibration reduction control method for electroplating equipment, the method comprising:

[0008] Obtain the resonant frequency of the electroplating equipment;

[0009] Based on the resonant frequency, the operating frequency of the blade is selected, wherein the operating frequency is equal to m times the resonant frequency, where m is a real number in the range of (0, 0.5], and the duty cycle corresponding to the operating frequency of the blade is less than the process time of electroplating;

[0010] The operating frequency is the frequency at which the blade performs a step-by-step periodic motion in the electroplating chamber of the electroplating equipment.

[0011] According to a specific implementation of an embodiment of the present application, the electroplating equipment includes a pre-wetting chamber, an electroplating chamber, a cleaning chamber, a frame of the electroplating equipment, and a robot.

[0012] According to a specific implementation of the embodiment of the present application, the method further includes: after selecting an operating frequency of the blade, calculating, based on the operating frequency, a displacement Δ required for the blade to move forward once and then backward once using Formula 1;

[0013] Wherein, the formula 1 is:

[0014] Δ=L*mf*t1*R

[0015] in,

[0016] L represents the distance between the starting point and the end point of the blade during the step-by-step reciprocating vibration process;

[0017] f represents the resonant frequency of the electroplating equipment;

[0018] t1 represents the time it takes for the blade to move forward and then backward;

[0019] R represents the number of times the blade moves a distance of L during vibration in one working cycle.

[0020] According to a specific implementation of an embodiment of the present application, when the number of plating chambers of the electroplating equipment is even, the movement directions of the paddles in two adjacent plating chambers are opposite.

[0021] According to a specific implementation of an embodiment of the present application, when the number of plating chambers of the electroplating equipment is even, two adjacent plating chambers at the same horizontal height are defined as a group, and the paddles in the plating chambers in the same group move in opposite directions.

[0022] In a second aspect, a vibration reduction control method for an electroplating device is provided. When the number of electroplating cavities of the electroplating device is even, the movement directions of the paddles in two adjacent electroplating cavities are opposite.

[0023] According to a specific implementation of an embodiment of the present application, when the number of plating chambers of the electroplating equipment is even, two adjacent plating chambers at the same horizontal height are defined as a group, and the paddles in the plating chambers in the same group move in opposite directions.

[0024] In a third aspect, a vibration control device for electroplating equipment is provided, the device comprising:

[0025] an information acquisition unit, configured to acquire the resonance frequency of the electroplating equipment and send the resonance frequency of the electroplating equipment to the processing unit;

[0026] a processing unit, configured to receive the resonant frequency of the electroplating equipment sent by the information acquisition unit, and select an operating frequency of the paddle based on the resonant frequency of the electroplating equipment; the processing unit comprising: determining that the operating frequency of the paddle is equal to m times the resonant frequency, where m is a real number within a numerical range of (0, 0.5], and a duty cycle corresponding to the operating frequency of the paddle is less than a process time of the electroplating; wherein the operating frequency of the paddle is a frequency of the paddle performing a step-by-step periodic motion in the electroplating chamber of the electroplating equipment;

[0027] The control unit is used to control the operation of the blades according to the blade operating frequency selected by the processing unit.

[0028] According to a specific implementation method of an embodiment of the present application, the processing unit is also configured to calculate the displacement required for the blade to move forward once and then backward once based on the operating frequency of the blade, generate step instruction data for the blade based on the displacement required for the blade to move forward once and then backward once, and send the instruction data to the control unit.

[0029] According to a specific implementation of an embodiment of the present application, the control unit is further configured to receive step instruction data sent by the processing unit for the displacement required for the blade to move forward once and then backward once, and control the blade to move according to the instruction data.

[0030] According to a specific implementation of an embodiment of the present application, the electroplating equipment includes a pre-wetting chamber, an electroplating chamber, a cleaning chamber, a frame of the electroplating equipment, and a robot.

[0031] According to a specific implementation of the embodiment of the present application, the processing unit calculates the displacement required for the blade to move forward once and then backward once based on the operating frequency of the blade, including:

[0032] Use formula 1 to calculate the displacement Δ required for the blade to move forward and then backward once;

[0033] Wherein, the formula 1 is:

[0034] Δ=L*mf*t1*R

[0035] in,

[0036] L represents the distance between the starting point and the end point of the blade during the step-by-step reciprocating vibration process;

[0037] f represents the resonant frequency of the electroplating equipment;

[0038] t1 represents the time it takes for the blade to move forward and then backward;

[0039] R represents the number of times the blade moves a distance of L in one cycle of vibration.

[0040] In a fourth aspect, an electroplating device comprises the shock absorption control device described in any one of the third aspects.

[0041] According to a specific implementation of an embodiment of the present application, when the number of plating chambers of the electroplating equipment is even, the movement directions of the paddles in two adjacent plating chambers are opposite.

[0042] According to a specific implementation of an embodiment of the present application, when the number of plating chambers of the electroplating equipment is even, two adjacent plating chambers at the same horizontal height are defined as a group, and the paddles in the plating chambers in the same group move in opposite directions.

[0043] According to a fifth aspect, an electronic device is provided, comprising:

[0044] at least one processor; and,

[0045] a memory communicatively coupled to the at least one processor;

[0046] In which, the memory stores instructions executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the shock absorption control method of the electroplating equipment in any implementation of the first aspect or the second aspect mentioned above.

[0047] In the sixth aspect, a non-transitory computer-readable storage medium stores computer instructions, which are used to enable the computer to execute the shock absorption control method of the electroplating equipment in any implementation of the first aspect or the second aspect.

[0048] The vibration reduction control method, device and electronic equipment of the electroplating equipment of the present application specifically control the working frequency of the blades in the electroplating chamber of the electroplating equipment and the vibration mode of the blades in different electroplating chambers according to the different resonance frequencies of different electroplating equipment, thereby greatly reducing the impact of the blade vibration, ensuring the stability of the substrate in the actual process environment, guaranteeing the processing quality of the substrate, and improving the substrate yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0050] Figure 1 A schematic structural diagram of an electroplating device in the prior art is shown;

[0051] Figure 2 A schematic diagram showing the position change of a blade in one cycle when the blade vibrates in a step-by-step manner in the prior art is shown;

[0052] Figure 3 A schematic diagram of a cycle in which an electroplating device and a blade in the prior art reach resonance is shown;

[0053] Figure 4a A schematic flow chart of a vibration reduction control method for electroplating equipment according to an embodiment of the present invention is shown;

[0054] Figure 4b A schematic flow chart of a vibration reduction control method for electroplating equipment in another embodiment of the present invention is shown;

[0055] Figure 5a and Figure 5b A schematic diagram of the movement of the blades in an embodiment of the present invention is shown;

[0056] Figure 6 A schematic diagram of the vibration period of the blade when the operating frequency of the blade is 1 / 10 of the resonant frequency of the electroplating equipment in an embodiment of the present invention is shown;

[0057] Figure 7 A schematic diagram showing the movement of paddles in two electroplating chambers when the electroplating equipment has two electroplating chambers in an embodiment of the present invention is shown;

[0058] Figure 8 A schematic structural diagram of a vibration reduction control device for electroplating equipment in an embodiment of the present invention is shown;

[0059] Figure 9 shows a timing diagram of blade vibration control in adjacent electroplating cavities according to an embodiment of the present invention; and

[0060] Figure 10 A schematic diagram of the vibration period of the paddles in adjacent electroplating chambers in an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0061] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0062] The following describes the embodiments of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the features in the following embodiments and embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative work are within the scope of protection of this application.

[0063] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on this application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects described herein can be used to implement an apparatus and / or practice a method. In addition, other structures and / or functionalities other than one or more of all aspects described herein can be used to implement this apparatus and / or practice this method.

[0064] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The illustrations only show components related to the present application and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0065] Additionally, in the following description, specific details are provided to provide a thorough understanding of the examples. However, one skilled in the art will appreciate that the aspects described can be practiced without these specific details.

[0066] An embodiment of the present application provides a vibration reduction control method for electroplating equipment, the method comprising: obtaining the resonant frequency of the electroplating equipment; selecting the operating frequency of the blade based on the resonant frequency of the electroplating equipment, wherein the operating frequency of the blade is required to be equal to m times the resonant frequency of the electroplating equipment, where m is a real number within the numerical range of (0, 0.5], and the working cycle corresponding to the operating frequency of the blade is less than the process time of electroplating; wherein the operating frequency of the blade is the frequency of the blade performing a step-by-step periodic motion in the electroplating chamber of the electroplating equipment. The present invention controls the operating frequency of the blade according to the vibration frequency of the entire system during the operation of the electroplating equipment, so as to achieve the purpose of vibration reduction of the electroplating equipment and stabilization of the substrate during the process, thereby ensuring the processing yield of the substrate.

[0067] The vibration reduction control method for electroplating equipment provided by the present invention is introduced and explained in detail below through specific embodiments.

[0068] Please refer to Figure 4a , Figure 4a FIG. 1 is a flow chart showing a method for controlling vibration reduction of electroplating equipment according to an embodiment of the present invention. Figure 4a As shown, an embodiment of the present application provides a vibration reduction control method for electroplating equipment, comprising:

[0069] Step S100: obtaining the resonant frequency of the electroplating equipment;

[0070] Step S200: Based on the resonant frequency of the electroplating equipment, the operating frequency of the paddle is selected. The selection requires that the operating frequency is equal to m times the resonant frequency, where m is a real number in the numerical range of (0, 0.5], and the working cycle corresponding to the operating frequency of the paddle is less than the electroplating process time; wherein the operating frequency of the paddle is the frequency of the paddle performing a step-by-step periodic motion in the electroplating chamber of the electroplating equipment.

[0071] The value of m is less than or equal to 0.5. When m = 0.5, it indicates that the operating frequency of the blade is 0.5 times the resonant frequency of the electroplating equipment; when m = 0.1, it indicates that the operating frequency of the blade is 0.1 times the resonant frequency of the electroplating equipment; and when m = 0.01, it indicates that the operating frequency of the blade is 0.01 times the resonant frequency of the electroplating equipment. It should be understood that the smaller the value of m, the greater the difference between the operating frequency of the blade and the resonant frequency of the electroplating equipment, the less likely they are to resonate, and the better the vibration reduction effect. The specific value of m will be selected within the range of greater than 0 and less than or equal to 0.5 based on actual process requirements, and is not currently limited in the embodiments of the present invention.

[0072] It should be understood that the electroplating equipment includes but is not limited to a pre-wetting chamber, an electroplating chamber, a cleaning chamber, a frame of the electroplating equipment, a robot and other components. As long as the components are provided in the electroplating equipment, they are included in the system.

[0073] The embodiment of the present invention is described in detail by taking an electroplating device about to perform a high-speed copper electroplating process as an example.

[0074] It is determined that the electroplating equipment is about to perform a high-speed copper electroplating process. Before performing the process, the resonant frequency of the electroplating equipment is measured in advance. The resonant frequency data value of the electroplating equipment when performing the process is measured. In the embodiment of the present invention, the measured resonant frequency is 1 Hz. The resonant period diagram of the electroplating equipment is shown in FIG. Figure 3 As shown, the vibration period of the electroplating equipment is 1s and the resonance frequency is 1Hz.

[0075] The resonant frequency f=1Hz of the electroplating equipment obtained from step S100 is selected based on the resonant frequency f. Specifically, in order to ensure the stability of the substrate during the process, the operating frequency of the blade is required to be staggered with the resonant frequency of the electroplating equipment. The processing methods that can be selected are: reducing the operating frequency of the blade or increasing the operating frequency of the blade. The method adopted by the present invention is: making the operating frequency F of the blade less than the resonant frequency f of the electroplating equipment, which requires the operating frequency F of the blade to be as small as possible. However, in order to achieve uniform electroplating during the electroplating process, it is also necessary to consider the fact that the blade needs to complete at least one cycle in the electroplating chamber within one electroplating process time, so as to ensure that the cumulative time that each corresponding point on the substrate is blocked by the blade within one working cycle is equal. Therefore, on the basis of ensuring that the blade is infinitely close to reciprocating motion, the blade also needs to be able to complete one cycle within the preset electroplating process time. Therefore, when selecting, the operating frequency is required to be equal to m times the resonant frequency, where m is a real number in the numerical range (0, 0.5], that is, F=mf. Take the blade operating frequency F=mf.

[0076] Figure 4b FIG. 1 is a flow chart showing a method for controlling vibration reduction of electroplating equipment according to an embodiment of the present invention. Figure 4b As shown, a shock absorption control method for electroplating equipment provided by another embodiment of the present application also includes step S300: according to the working frequency F of the above-mentioned blade, the displacement required for the blade to move forward once and then backward once, that is, one back and forth step, is calculated, and the step instruction data of the blade is generated according to the displacement required to be generated for one back and forth step, and the blade is controlled to perform step-by-step back and forth stepping actions according to the instruction data.

[0077] For example, according to the m times of the resonant frequency f of the electroplating equipment determined in step S100 as the value of the operating frequency F of the blade, the displacement Δ required for the blade to move forward once and then backward once is calculated using Formula 1, where Formula 1 is expressed as:

[0078] Δ=L*mf*t1*R Formula (1)

[0079] Among them, Δ is the displacement generated by the paddle moving forward once and then backward once; L represents the distance between the starting point and the end point of the paddle in the process of step-by-step vibration, and L is a specific value determined according to the size of the actual machine; m is the working frequency of the paddle, which is a multiple of the resonant frequency, and is a constant value preset according to the actual process requirements; f represents the resonant frequency of the electroplating equipment, and this value is a known value before the process is executed; t1 represents the duration of each forward and backward movement of the paddle, that is, the time required for the paddle position to produce each Δ, and t1 is determined by the drive mechanism selected in the actual process. It is a known value during the calculation process, and this value can be adjusted by selecting the drive mechanism according to the actual process conditions; R is the number of times the paddle moves a distance of L in the vibration of one working cycle.

[0080] It is worth noting that, in the embodiment of the present invention, the end point of the blade's step-by-step reciprocating vibration process refers to the position farthest from the starting point that the blade can move during the movement.

[0081] Specifically, because frequency is the number of times a periodic change is completed per unit time, it is a quantity that describes the frequency of periodic motion. Then:

[0082]

[0083] Wherein, T is the time required for the blade to complete one working cycle in the electroplating chamber. In this embodiment, the time required for one working cycle refers to the time from when the blade starts to move until the accumulated time of each corresponding point on the substrate being blocked by the blade is equal for the first time. Figure 5a 、 Figure 5b and Figure 6 , divide a working cycle of the blade during the vibration process into R parts, R is 2 or 4, the starting point is point A, and the end point is point B. The end point B is the end point of the blade in the process of back and forth stepping, which refers to the position farthest from the starting point that the blade can move during the movement. The distance from point A to point B is L. During each R part of time, the displacement generated by the blade is one L.

[0084] As mentioned above, in order to avoid resonance between the paddle and the electroplating equipment, the working frequency of the paddle needs to be staggered with the resonant frequency of the electroplating equipment. The treatment methods that can be selected are: reducing the working frequency of the paddle or increasing the working frequency of the paddle. It is understandable that when the vibration frequency of the paddle is greater than or less than the resonant frequency of the electroplating equipment, it will not cause resonance between the paddle and the electroplating equipment, and the problem of substrate instability caused by resonance in the existing machine can be solved. It can be inferred that in order to achieve a better solution, in the embodiment of the present invention, the working frequency of the paddle is selected to be much greater than or much less than the resonant frequency. In the embodiment of the present invention, much greater than means that the working frequency of the paddle is at least 1.5 times the resonant frequency of the electroplating equipment; much less than means that the working frequency of the paddle is at most 0.5 times the resonant frequency of the electroplating equipment. Exemplarily, in the embodiment of the present invention, the working frequency of the paddle is selected to be much less than the resonant frequency for control. It is stipulated that for each L, the paddle needs to move back and forth N times in a step-by-step manner. When N is not an integer during the calculation process, it is automatically taken as a positive integer greater than N. It can be concluded that the paddle needs to move R*L, or R*N times, to complete one working cycle. The time spent by the paddle for each N steps is defined as t1. It should be understood that in this embodiment, each N step means: the paddle moves one step forward and one step backward in the electroplating chamber. Then:

[0085] T=R*N*t1Formula (3)

[0086] Combining formula (3) with formula (2) yields:

[0087]

[0088] The above formula can be transformed into:

[0089]

[0090] Then, in the process from the starting point A to the end point B or from the end point B to the starting point A, the displacement Δ generated by each forward and backward step of the blade is:

[0091]

[0092] The calculated Δ value is the displacement required for the blade to move forward and backward each time. The step instruction data of the blade is generated based on the calculated Δ value, and the blade is controlled to perform step-by-step reciprocating motion according to the instruction data.

[0093] Because the size of the machine is fixed, the time t1 required for the driving mechanism to drive the blade forward and backward for each step is fixed, and the distance L that the blade needs to travel in each working cycle can be preset. That is, after determining the working frequency of the blade, the displacement Δ generated by the blade forward and backward for each step is directly calculated to determine the control method of the blade. It can be concluded that in order to solve the problem of resonance between the blade and the electroplating equipment, which causes passive vibration of related components, affects the stability of the substrate, and further affects the processing yield of the substrate, the present invention calculates the displacement required for the blade to move forward and backward once in the step-by-step reciprocating step by step method by using the resonant frequency of the electroplating equipment. The vibration of the blade is controlled according to the calculated displacement value combined with the actual size of the machine, so as to avoid resonance during the electroplating process and stabilize the substrate.

[0094] Please refer to Figure 5a and Figure 5b , which shows a schematic diagram of the movement of the blades in an embodiment of the present invention. Figure 5a The figure shows the movement of the blade when R is 2; Figure 5b The diagram shows the movement of the blade when R is 4.

[0095] For example, please refer to Figure 5a In the embodiment of the present invention, L = 10 mm, f = 1 Hz, t1 is set to 0.1 s, the multiple relationship m between the operating frequency and the resonant frequency of the blade is 0.5, and within one cycle, L needs to be moved twice, R is 2, and the displacement Δ = 1 mm required for the blade to move forward once and then backward once can be calculated by formula (1).

[0096] After determining the displacement Δ=1mm required for the blade to move forward once and then backward once, the displacement Δ=1mm required for the blade to move forward once and then backward once is generated to generate the reciprocating stepping instruction data of the blade, and the blade is controlled to move according to the instruction data. Specifically, when the reciprocating stepping instruction data of the blade is Δ=1mm, the action of the blade can be controlled as follows: move 10mm from point A to point B, and then move 9mm from point B to point A. At this time, the distance 1mm from point A is used as the new starting point, and the new starting point is recorded as point A'. Move 10mm from point A' to point B, and then move 9mm in the opposite direction to point A', until the distance L (10mm) is completed and the end point B is reached. Then, starting from point B, move 10mm from point B to point A, and then move 9mm in the opposite direction to point B, with a step of Δ=1mm after each round trip, and repeat this process for 10 times to complete the 10mm journey.

[0097] For example, please refer to Figure 5bIn the embodiment of the present invention, L = 10 mm, f = 1 Hz, t1 is set to 0.1 s, the multiple relationship m between the operating frequency and the resonant frequency of the blade is 0.5, and within one cycle, L needs to be moved 4 times, R is 4, and the displacement Δ = 2 mm required for the blade to move forward once and then backward once can be calculated by formula (1).

[0098] After determining the displacement Δ=2mm required for the blade to move forward once and then backward once, generate the reciprocating stepping instruction data of the blade based on the displacement Δ=2mm required for the blade to move forward once and then backward once, and control the blade to move according to the instruction data. Specifically, when the reciprocating stepping instruction data of the blade is Δ=2mm, the movement process of the blade is divided into four processes: process ① is moving from point A to point B; process ② is moving from point B to point A; process ③ is moving from point A to point C; process ④ is moving from point C to point A; the way to control the movement of the blade in each process refers to Figure 5a It is controlled by the control method in , which will not be described in detail here.

[0099] In the actual process, in order to show the movement trend of the blade, please combine Figure 6 , Figure 6 A schematic diagram of the paddle oscillation period in an embodiment of the present invention is shown when the paddle's operating frequency is 1 / 10 of the electroplating equipment's resonant frequency f. 1 / 10 of the electroplating equipment's resonant frequency f is determined as the endpoint value of the maximum paddle operating frequency F. The figure shows that in this embodiment of the present invention, L is 10 mm, t1 is 0.1 s, and the paddle must travel a distance of 2 L in one cycle. R is 2, and Δ = 0.2 mm can be calculated using Equation (1).

[0100] After determining the displacement Δ=0.2mm required for the blade to move forward once and then back once, generate the reciprocating stepping instruction data of the blade by moving the blade forward once and then back once. The blade is controlled to move according to the instruction data. For details, please refer to Figure 6 , Figure 6 FIG. 1 shows a schematic diagram of the movement of the blades in an embodiment of the present invention. Figure 5a 、 Figure 6As shown in the figure, when the reciprocating stepping instruction data of the blade is Δ=0.2mm, the action mode of controlling the blade can be: moving 10mm from point A to point B, and then moving 9.8mm from point B to point A. At this time, the distance 0.2mm from point A is used as the new starting point, which is recorded as point A'. From point A', it moves 10mm to point B, and then moves 9.8mm in the opposite direction toward point A', with each step Δ=0.2mm, until the distance L (10mm) is completed and the end point B is reached. Then, starting from point B, it moves 10mm from point B to point A, and then moves 9.8mm in the opposite direction toward point B, with each step Δ=0.2mm, and so on. It is divided into 50 steps to complete the 10mm journey.

[0101] Furthermore, when the number of plating chambers of the electroplating equipment is even, the paddles in two adjacent plating chambers move in opposite directions, such as Figure 7 As shown, Figure 7 A schematic diagram shows the movement of paddles within two plating chambers in an embodiment of the present invention. In this embodiment, when the number of plating chambers is even, the paddles within the plating chambers can vibrate in the step-by-step manner described in the above embodiment. Alternatively, other vibration modes can be used, requiring the paddles within two adjacent plating chambers to move in opposite directions so that the vibration waves generated by the paddles within the adjacent plating chambers cancel each other out.

[0102] Furthermore, when the electroplating equipment has an even number of plating chambers, two adjacent plating chambers at the same height are defined as a group, and the paddles in the plating chambers of the same group move in opposite directions. The opposite movement directions can offset the vibration waves generated by the vibration, which can achieve a better shock absorption effect.

[0103] Corresponding to the above method embodiment, please refer to Figure 8 , Figure 8 FIG. 1 shows a schematic structural diagram of a vibration control device for electroplating equipment according to an embodiment of the present invention. Figure 8 As shown, an embodiment of the present application further provides a shock absorption control device for electroplating equipment, including: an information acquisition unit 310, a processing unit 320 and a control unit 330.

[0104] The information acquisition unit 310 is used to acquire the resonance frequency of the electroplating equipment and send the resonance frequency of the electroplating equipment to the processing unit 320;

[0105] The processing unit 320 is used to receive the resonant frequency of the electroplating equipment sent by the information acquisition unit 310, and select the operating frequency of the blade based on the resonant frequency of the electroplating equipment; including determining that the operating frequency of the blade is equal to m times the resonant frequency, where m is a real number in the numerical range of (0, 0.5], and the working cycle corresponding to the operating frequency of the blade is less than the process time of electroplating; wherein the operating frequency of the blade is the frequency of the blade performing step-by-step periodic motion in the electroplating chamber of the electroplating equipment. Similarly, the data selected for the m value is selected within the range of greater than 0 and less than or equal to 0.5 according to actual process requirements, and the specific value is not limited in the embodiment of the present invention.

[0106] Furthermore, the processing unit 320 is also configured to calculate the displacement required for the blade to move forward once and then backward once based on the operating frequency of the blade, generate step instruction data for the blade based on the displacement required for the blade to move forward once and then backward once, and send the instruction data to the control unit 330.

[0107] The control unit 330 is used to control the operation of the blades according to the blade operating frequency selected by the processing unit 320 .

[0108] Specifically, the control unit 330 receives step instruction data of the displacement required to be generated each time the blade moves forward once and then backward once, sent by the processing unit, and controls the blade to move according to the instruction data.

[0109] The processing unit 320 is further configured to calculate the displacement Δ required for the blade to move forward and backward each time based on the operating frequency of the blade using Formula 1;

[0110] Wherein, the formula 1 is:

[0111] Δ=L*mf*t1*R Formula (1)

[0112] in,

[0113] Δ is the displacement generated by the paddle moving forward once and then backward once; L represents the distance between the starting point and the end point of the paddle in the process of back and forth stepping, and L is a specific value determined according to the actual size of the machine; m represents the operating frequency of the paddle, which is a multiple of the resonant frequency and is a constant value preset according to the actual process requirements; f represents the resonant frequency of the electroplating equipment, and when the process to be performed is determined, this value is the determined known value; t1 represents the time it takes for the paddle to move forward and backward once, that is, the time required for the paddle position to produce each Δ, and t1 is determined by the drive mechanism selected in the actual process. It is a known value during the calculation process and can be adjusted by selecting the drive mechanism according to the actual process conditions; R is the number of times the paddle moves a distance of L in one cycle of vibration.

[0114] Furthermore, the electroplating equipment includes a pre-wetting chamber, an electroplating chamber, a cleaning chamber, a frame of the electroplating equipment, a robot and other components.

[0115] With the increasing demand for high-speed electroplating, high-speed tin-silver electroplating equipment has become a standard configuration after high-speed copper electroplating equipment. More and more electroplating chambers with high-speed oscillating paddles are configured on the same electroplating equipment. Taking a certain electroplating equipment as an example, there were 8 copper electroplating chambers before, and now 4 tin-silver electroplating chambers have been added, with a total of 12 electroplating chambers with paddles. As the requirements for electroplating uniformity become higher and higher, the paddle movement needs to adopt a step-by-step reciprocating oscillation mode, which further aggravates the vibration intensity. For this reason, the embodiment of the present application also provides an electroplating equipment, including the above-mentioned shock absorption control device.

[0116] Furthermore, when the number of plating cavities of the electroplating equipment is an even number, the paddles in two adjacent plating cavities move in opposite directions. The two adjacent plating cavities include not only adjacent in the same horizontal height direction, but also adjacent in the vertical height direction. Furthermore, in this embodiment, when the number of plating cavities of the electroplating equipment is an even number, two adjacent plating cavities at the same horizontal height are defined as a group, and the paddles in the plating cavities in the same group move in opposite directions. By making the paddles in two adjacent plating cavities oscillate in opposite directions, the paddles and the electroplating equipment are prevented from reaching resonance, thereby achieving the purpose of reducing the vibration of each module of the electroplating equipment and stabilizing the electroplating equipment.

[0117] Specifically, the vibration of the paddle is affected by the process status and control instructions in the electroplating chamber.

[0118] Next, combine Figure 7 、 Figure 8 and Figure 9 The control method for the opposite direction of the blade oscillation in two adjacent electroplating chambers is described in detail. Figure 7 The two adjacent electroplating chambers are chamber A and chamber B; the control steps for the opposite vibration directions of the blades in the two adjacent electroplating chambers include:

[0119] ①. The control unit 330 detects the process status of chamber A and chamber B;

[0120] When the process status of chamber A or chamber B is in process, the control unit 330 directly controls the paddles provided in chamber A and chamber B to move in opposite directions at the same moving speed and the same acceleration;

[0121] When the process status of chamber A is in progress and the process status of chamber B is idle, the control unit 330 also controls the paddles arranged in chambers A and B to move in opposite directions at the same moving speed and the same acceleration;

[0122] Similarly, when the process status of chamber B is in progress and the process status of chamber A is idle, the control unit 330 still controls the paddles set in chambers A and B to move in opposite directions at the same moving speed and the same acceleration;

[0123] ② The control unit 330 detects the control instructions of the drive mechanism connected to the blades in cavity A and cavity B. In this embodiment, the drive mechanism may be a motor;

[0124] When the control unit 330 detects that the control instruction of the driving mechanism connected to the blades in cavity A or cavity B is to start the driving mechanism to drive the blades to vibrate, the control unit 330 directly controls the blades set in cavity A and cavity B to move in opposite directions at the same moving speed and the same acceleration.

[0125] When the control unit 330 detects two adjacent electroplating chambers, the process status of any one of the exemplary electroplating chambers A and B is in the process-in-progress state; or

[0126] The control unit 330 detects two adjacent electroplating chambers. For example, when the control instruction of the driving mechanism connected to the paddle in any of the electroplating chambers A and B is to start the driving mechanism to drive the paddle to vibrate, the control unit 330 controls the paddles set in the two adjacent electroplating chambers to move in opposite directions at the same moving speed and the same acceleration, so that the vibration waves generated by the paddles in the adjacent electroplating chambers cancel each other out, avoiding resonance between the paddles and the electroplating equipment, so as to achieve the purpose of reducing the vibration of each module of the electroplating equipment and thus stabilizing the electroplating equipment. The control unit 330 will control the paddles in the electroplating chamber to stop vibrating only when and only when the control unit 330 detects that the process status of the two adjacent electroplating chambers is in an idle state and the control unit 330 detects that the control instruction of the driving mechanism connected to the paddle in the two adjacent electroplating chambers is off.

[0127] Specifically, if Figure 7 and Figure 9 As shown, Figure 9The following diagram shows a timing diagram for controlling the vibration of paddles in adjacent electroplating chambers according to an embodiment of the present invention. At time t1, the process states of both chambers A and B are in an idle state. The control instructions for the drive mechanisms connected to the paddles in chambers A and B are also off, and the paddles in each chamber are in a stopped state. The position instructions for the paddles in chambers A and B remain the same as in the initial state. During the time period t1-t2, the process state of chamber A changes to a process-in-progress state, while the process state of chamber B remains in an idle state. During the time period t1-t2, the control unit 330 receives a control instruction for the drive mechanism connected to the paddle in chamber A to start the drive mechanism to drive the paddle vibration, while the control instruction for the drive mechanism connected to the paddle in chamber B is off. At this time, the control unit 330 controls the paddles in chambers A and B to move in opposite directions at the same speed and with the same acceleration.

[0128] During the time period t2-t3, the control unit 330 detects that the process status of cavity A and cavity B are both in progress; and the control unit 330 detects that the control instruction of the driving mechanism connected to the blades in the two adjacent electroplating chambers is to start the driving mechanism to drive the blades to vibrate. At this time, the control unit 330 controls the blades in cavity A and cavity B to move in opposite directions at the same moving speed and the same magnitude of acceleration.

[0129] During the t3-t4 period, the control unit 330 detects that the process status of cavity A is idle, and the process status of cavity B is process in progress; the control unit 330 detects that the control instruction of the driving mechanism connected to the blades in cavity A is off, and the control instruction of the driving mechanism connected to the blades in cavity B is to start the driving mechanism to drive the blades to vibrate. At this time, the control unit 330 controls the blades in cavity A and cavity B to move in opposite directions at the same moving speed and the same acceleration.

[0130] During the t4-t5 period, the control unit 330 detects that the process status of cavity A and cavity B are both in progress. The control unit 330 detects that the control instructions of the driving mechanisms connected to the blades in cavity A and cavity B are both to start the driving mechanisms to drive the blades to vibrate. At this time, the control unit 330 controls the blades in cavity A and cavity B to move in opposite directions at the same moving speed and the same acceleration.

[0131] During the t5-t6 period, the control unit 330 detects that the process status of cavity A is idle, and the process status of cavity B is in progress. The control unit 330 detects that the control instruction of the driving mechanism connected to the blades in cavity A is off, and the control instruction of the driving mechanism connected to the blades in cavity B is to start the driving mechanism to drive the blades to vibrate. At this time, the control unit 330 controls the blades in cavity A and cavity B to move in opposite directions at the same moving speed and the same acceleration.

[0132] During the t6-t7 period, the control unit 330 detects that the process states of the two adjacent electroplating chambers A and B are both in an idle state and the control unit 330 detects that the control instructions of the driving mechanisms connected to the blades in the two adjacent electroplating chambers A and B are both closed; the control unit 330 controls the blades in the electroplating chamber to stop vibrating.

[0133] In the above process, the vibration period of the blades in cavity A and cavity B is as follows: Figure 10 As shown, Figure 10 A schematic diagram of the vibration period of the paddles in adjacent electroplating chambers in an embodiment of the present invention is shown.

[0134] An embodiment of the present application further provides an electronic device, comprising:

[0135] at least one processor; and

[0136] a memory communicatively coupled to the at least one processor;

[0137] In which, the memory stores instructions to be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the shock absorption control method of the electroplating equipment in the aforementioned method embodiment.

[0138] An embodiment of the present application also provides a non-transitory computer-readable storage medium, which stores computer instructions, and the computer instructions are used to enable the computer to execute the vibration reduction control method of the electroplating equipment in the aforementioned method embodiment.

[0139] An embodiment of the present application also provides a computer program product, which includes a computer program stored on a non-transitory computer-readable storage medium. The computer program includes program instructions, which, when executed by a computer, enable the computer to execute the shock absorption control method for the electroplating equipment in the aforementioned method embodiment.

[0140] When the damping control method of the electroplating equipment is implemented as a computer program, it can also be stored in a computer-readable storage medium as a product. For example, a computer-readable storage medium may include, but is not limited to, a magnetic storage device (e.g., a hard disk, a floppy disk, a magnetic strip), an optical disk (e.g., a compact disk (CD), a digital versatile disk (DVD)), a smart card, and a flash memory device (e.g., an electrically erasable programmable read-only memory (EPROM), a card, a stick, a key drive). In addition, the various storage media described herein can represent one or more devices and / or other machine-readable media for storing information. The term "machine-readable medium" may include, but is not limited to, wireless channels and various other media (and / or storage media) that can store, contain, and / or carry code and / or instructions and / or data.

[0141] It should be understood that the embodiments described above are merely illustrative. The embodiments described herein may be implemented in hardware, software, firmware, middleware, microcode, or any combination thereof. For hardware implementation, the processor may be implemented within one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, and / or other electronic units designed to perform the functions described herein, or a combination thereof.

[0142] Some aspects of the present application can be performed entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. The above hardware or software can be referred to as "data blocks", "modules", "engines", "units", "components" or "systems". The processor can be one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DAPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors or combinations thereof. In addition, various aspects of the present application may be expressed as computer products located in one or more computer-readable media, which include computer-readable program code. For example, computer-readable media may include, but are not limited to, magnetic storage devices (e.g., hard disks, floppy disks, tapes...), optical disks (e.g., compact disks CDs, digital versatile disks DVDs...), smart cards, and flash memory devices (e.g., cards, sticks, key drives...).

[0143] A computer-readable medium may include a propagated data signal embodying computer program code, for example, in baseband or as part of a carrier wave. The propagated signal may be in a variety of forms, including electromagnetic, optical, etc., or a suitable combination thereof. A computer-readable medium may be any computer-readable medium other than a computer-readable storage medium that can be connected to an instruction execution system, apparatus, or device to communicate, propagate, or transmit the program for use. The program code on the computer-readable medium may be transmitted via any suitable medium, including radio, cable, fiber optic cable, radio frequency signal, or similar medium, or any combination of the above.

[0144] The flowcharts and block diagrams in the accompanying drawings illustrate the possible implementation architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present disclosure. In this regard, each box in the flowchart or block diagram can represent a module, program segment, or a part of code, and the module, program segment, or a part of code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order than that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of the boxes in the block diagram and / or flowchart, can be implemented with a dedicated hardware-based system that performs the specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0145] The units involved in the embodiments described in this application may be implemented by software or hardware, wherein the name of a unit does not, in some cases, constitute a limitation on the unit itself.

[0146] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A vibration control method for electroplating equipment, characterized in that: include: Obtain the resonant frequency of the electroplating equipment; Based on the resonant frequency, the operating frequency of the paddle of the electroplating equipment is selected, wherein the operating frequency is equal to m times the resonant frequency, where m is a real number in the range of (0, 0.5], and the duty cycle corresponding to the operating frequency of the paddle is less than the process time of the electroplating; Wherein, the operating frequency is the frequency of the blade making a step-by-step periodic motion in the electroplating chamber of the electroplating equipment; After selecting the operating frequency of the blade, based on the operating frequency, the displacement Δ required for the blade to move forward once and then backward once is calculated using Formula 1. Step command data for the blade is generated based on the displacement required for the blade to move forward once and then backward once, and the blade is controlled to move according to the command data. Wherein, the formula 1 is: Δ=L*mf*t1*R in, L represents the distance between the starting point and the end point of the blade during the step-by-step reciprocating vibration process; f represents the resonant frequency of the electroplating equipment; t1 represents the time it takes for the blade to move forward and then backward; R represents the number of times the blade moves a distance of L during vibration in one working cycle.

2. The vibration control method for electroplating equipment according to claim 1, characterized in that: The electroplating equipment includes a pre-wetting chamber, an electroplating chamber, a cleaning chamber, an electroplating equipment frame, and a manipulator.

3. The vibration control method for electroplating equipment according to claim 1, characterized in that: When the number of the electroplating chambers of the electroplating equipment is even, the moving directions of the paddles in two adjacent electroplating chambers are opposite.

4. The vibration control method for electroplating equipment according to claim 3, characterized in that: When the number of plating chambers of the electroplating equipment is even, two adjacent plating chambers at the same level are defined as a group, and the moving directions of the paddles in the plating chambers in the same group are opposite.

5. A vibration control device for electroplating equipment, characterized in that: include: an information acquisition unit, configured to acquire the resonance frequency of the electroplating equipment and send the resonance frequency of the electroplating equipment to the processing unit; a processing unit, configured to receive the resonant frequency of the electroplating equipment sent by the information acquisition unit, and select an operating frequency of the paddle based on the resonant frequency of the electroplating equipment; the processing unit comprising: determining that the operating frequency of the paddle is equal to m times the resonant frequency, where m is a real number within a numerical range of (0, 0.5], and a duty cycle corresponding to the operating frequency of the paddle is less than a process time of the electroplating; wherein the operating frequency of the paddle is a frequency of the paddle performing a step-by-step periodic motion in the electroplating chamber of the electroplating equipment; a control unit, configured to control the operation of the blades according to the blade operating frequency selected by the processing unit; The processing unit is further configured to calculate the displacement required for the blade to move forward once and then backward once according to the operating frequency of the blade, generate step instruction data for the blade according to the displacement required for the blade to move forward once and then backward once, and send the instruction data to the control unit; The control unit is further configured to receive step instruction data of the displacement required for the blade to move forward once and then backward once, sent by the processing unit, and control the blade to move according to the instruction data; The processing unit calculates the displacement required for the blade to move forward once and then backward once according to the operating frequency of the blade, including: Use formula 1 to calculate the displacement Δ required for the blade to move forward and then backward once; Wherein, the formula 1 is: Δ=L*mf*t1*R in, L represents the distance between the starting point and the end point of the blade during the step-by-step reciprocating vibration process; f represents the resonant frequency of the electroplating equipment; t1 represents the time it takes for the blade to move forward and then backward; R represents the number of times the blade moves a distance of L in one cycle of vibration.

6. The vibration control device for electroplating equipment according to claim 5, characterized in that: The electroplating equipment includes a pre-wetting chamber, an electroplating chamber, a cleaning chamber, an electroplating equipment frame, and a manipulator.

7. An electroplating device, characterized in that: The device comprises a shock absorption control device as described in any one of claims 5 to 6.

8. The electroplating equipment according to claim 7, characterized in that: When the number of the electroplating chambers of the electroplating equipment is even, the moving directions of the paddles in two adjacent electroplating chambers are opposite.

9. The electroplating equipment according to claim 8, characterized in that: When the number of plating chambers of the electroplating equipment is even, two adjacent plating chambers at the same level are defined as a group, and the moving directions of the paddles in the plating chambers in the same group are opposite.

10. An electronic device, characterized in that: include: at least one processor; as well as, a memory communicatively coupled to the at least one processor; Wherein, the memory stores instructions to be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the vibration reduction control method for the electroplating equipment according to any one of claims 1 to 4.

11. A non-transitory computer-readable storage medium storing computer instructions, wherein the computer instructions are used to enable the computer to execute the vibration reduction control method of the electroplating equipment according to any one of claims 1 to 4.

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