Storage device for hydrogen isotope gas

Abstract

Embodiments of the present application relate to the storage of hydrogen isotope gas, and in particular to a hydrogen isotope gas storage device, which comprises a container, a hydrogen storage material and a heat conduction assembly. The container is arranged to form a sealed cavity, which comprises an annular cavity at the lower part; the hydrogen storage material is arranged in the annular cavity and used to store hydrogen isotope gas; and the heat conduction assembly is arranged on the radial outer side and the radial inner side of the annular cavity and used to conduct the heat generated by the hydrogen storage material when storing hydrogen isotope gas to the outside of the container. The device provided by the embodiments of the present application arranges the heat conduction assembly on the radial outer side and the radial inner side of the annular cavity, so that the heat conduction effect of the heat conduction assembly on the heat generated by the hydrogen storage material when storing is good, which is conducive to reducing the temperature of the hydrogen storage material and improving the efficiency of the hydrogen storage material in storing hydrogen isotope gas.

Description

Technical Field

[0001] The embodiments of this application relate to the storage of hydrogen isotope gas, specifically to a hydrogen isotope gas storage device. Background Technology

[0002] The statements herein are provided merely as background information in connection with this application and do not necessarily constitute prior art.

[0003] Deuterium and tritium gas are important raw materials for nuclear fusion reactions. During the nuclear fusion reaction, deuterium and tritium gas are stored in storage devices in the deuterium-tritium gas storage and supply system (SDS). The storage devices can rapidly supply fuel to the deuterium-tritium fuel system of the nuclear fusion reaction according to the needs of the nuclear fusion reaction. Summary of the Invention

[0004] A brief overview of this application is provided below to offer a basic understanding of certain aspects thereof. It should be understood that this overview is not an exhaustive summary of the application. It is not intended to identify key or essential parts of the application, nor is it intended to limit its scope. Its purpose is merely to present certain concepts in a simplified form as a prelude to the more detailed description that follows.

[0005] This application provides a hydrogen isotope gas storage device, comprising a container, a hydrogen storage material, and a heat-conducting component. The container is configured to form a sealed cavity, including an annular cavity at the bottom. The hydrogen storage material is disposed within the annular cavity for storing hydrogen isotope gas. The heat-conducting component is disposed radially outside and radially inside the annular cavity to conduct heat generated by the hydrogen storage material during hydrogen isotope gas storage to the outside of the container. The device provided by this application, by distributing the heat-conducting component radially outside and radially inside the annular cavity, achieves good heat conduction of the hydrogen storage material during storage, which helps to reduce the temperature of the hydrogen storage material and improve the efficiency of hydrogen isotope gas storage. Attached Figure Description

[0006] Other objects and advantages of this application will become apparent from the following description of embodiments of this application with reference to the accompanying drawings, and will help to provide a comprehensive understanding of this application.

[0007] Figure 1 This is a cross-sectional schematic diagram of the apparatus provided in the embodiments of this application when storing hydrogen isotope gas.

[0008] Figure 2 This is a cross-sectional schematic diagram of the container and inlet / outlet pipes assembled according to an embodiment of this application.

[0009] Figure 3This is a cross-sectional schematic diagram of the assembled thermal conductive component and heating element provided in the embodiments of this application.

[0010] Figure 4 This is a cross-sectional schematic diagram of the device provided in the embodiments of this application when releasing hydrogen isotope gas.

[0011] Explanation of reference numerals in the attached figures:

[0012] 100. Device; 1001. Hydrogen storage material;

[0013] 10. Container; 101. Outer top plate; 1011. Air inlet / outlet vents; 102. Inner top plate; 103. Annular bottom plate; 104. Outer cylinder; 105. Inner cylinder; 11. Sealed cavity; 111. First cavity; 112. Second cavity; 113. Annular cavity; 114. Opening groove; 1141. Opening;

[0014] 21. First heat-conducting component; 211. Receiving groove; 22. Second heat-conducting component; 221. Second heat-conducting cylinder; 222. Second heat-conducting base plate; 2221. Positioning groove; 23. Annular groove; 231. Opening;

[0015] 30. Heating element;

[0016] 40. Cooling components; 41. Semiconductor cooling chip; 42. Thermal conductive components; 43. Heat dissipation components; 431. Heat dissipation fins; 432. Heat dissipation fan;

[0017] 50. Moving parts; 60. Cylinder filter; 70. Inlet and outlet air pipes; 80. Filter elements; 90. Insulation layer.

[0018] It should be noted that the accompanying drawings are not necessarily drawn to scale, but are shown only in a schematic manner without affecting the reader's understanding. Detailed Implementation

[0019] Exemplary embodiments of this application will be described below with reference to the accompanying drawings. For clarity and brevity, not all features of actual implementations are described in the specification. However, it should be understood that many implementation-specific decisions must be made in the development of any such actual embodiment to achieve the developer's specific goals, such as complying with constraints related to the system and business, and these constraints may vary depending on the implementation. Furthermore, it should be understood that while development work can be very complex and time-consuming, such development work is merely a routine task for those skilled in the art who benefit from the content of this application.

[0020] It should also be noted that, in order to avoid obscuring this application with unnecessary details, only the equipment structure and / or processing steps closely related to the solution according to this application are shown in the accompanying drawings, while other details that are not closely related to this application are omitted.

[0021] The storage device stores (or adsorbs) hydrogen isotope gas through its internal hydrogen storage material, and releases (or desorbs) the hydrogen isotope gas upon heating. The hydrogen storage material generates heat during storage, which raises its temperature and reduces its efficiency in storing or releasing hydrogen isotope gas. Therefore, it is necessary to remove the heat generated during the storage process. However, currently used extraction devices are not very effective at conducting heat, resulting in low efficiency in storing or releasing hydrogen isotope gas.

[0022] To address at least one aspect of the aforementioned technical problems, embodiments of this application provide a storage device for hydrogen isotope gas, such as... Figure 1 The diagram shows a cross-sectional view of the device 100 provided in an embodiment of this application when storing hydrogen isotope gas. The device 100 includes a container 10, a hydrogen storage material 1001, and a heat-conducting component. See also... Figure 2 The container 10 is configured to form a sealed cavity 11, which includes an annular cavity 113 located at the lower part. A hydrogen storage material 1001 is disposed within the annular cavity 113 for storing hydrogen isotope gas. A heat-conducting component is disposed on the radially outer and radially inner sides of the annular cavity 113 to conduct heat generated by the hydrogen storage material 1001 during hydrogen isotope gas storage to the outside of the container 10. The device 100 provided in the embodiments of this application, by disposing of the heat-conducting component on the radially outer and radially inner sides of the annular cavity 113, provides good heat conduction of the hydrogen storage material 1001 during storage, which helps to reduce the temperature of the hydrogen storage material 1001 and improve the efficiency of the hydrogen storage material 1001 in storing hydrogen isotope gas.

[0023] In some embodiments, the hydrogen isotope gas may be tritium.

[0024] In some embodiments, the hydrogen storage material 1001 can be LaNiAl material. LaNiAl material has the advantages of low temperature required to release hydrogen isotope gas, low tritium permeability, fast hydrogen absorption rate, and good helium fixation performance.

[0025] The hydrogen storage material 1001 can release the stored hydrogen isotope gas when the temperature rises. Because the lower part of the sealed cavity 11 is configured as an annular cavity 113, compared to a cylindrical sealed cavity 11, the device 100 provided in this application can achieve higher storage efficiency while making the volume of the sealed cavity 11 smaller. The smaller sealed cavity 11 allows for less retention of hydrogen isotope gas within it, thus reducing the amount of hydrogen isotope gas retained in the hydrogen storage material 1001, which facilitates a more thorough release of the hydrogen isotope gas from the hydrogen storage material 1001.

[0026] In some embodiments, the hydrogen storage material 1001 can be in powder form. The particle size can be 100-200 mesh. When the volume of the annular cavity 113 in the embodiments of this application is 100 ml, the hydrogen storage material 1001 can be 1000 g or more. The device 100 in the embodiments of this application can load more hydrogen storage material in a smaller volume and make the hydrogen storage material have a larger contact area.

[0027] See Figure 1 In some embodiments, the device 100 may further include a heating element 30, which provides heat to the hydrogen storage material 1001 when it releases stored hydrogen isotope gas. By providing heat to the hydrogen storage material 1001 through the heating element 30, the temperature of the hydrogen storage material 1001 can be raised to the desorption temperature, thereby enabling the hydrogen storage material 1001 to release or desorb its stored hydrogen isotope gas.

[0028] In some embodiments, the heat-conducting component is configured to conduct heat from the heating element 30 to the radially outer and radially inner sides of the annular cavity 113. The heat conduction via the heat-conducting component enables rapid heating of the hydrogen storage material 1001, which is beneficial for heating the hydrogen storage material 1001.

[0029] See Figure 1 and Figure 3 In some embodiments, the heat-conducting component may include a first heat-conducting element 21 disposed radially inside the annular cavity 113. An opening groove 114 is formed radially inside the annular cavity 113, and an opening 1141 is formed at the lower end of the opening groove 114. The first heat-conducting element 21 enters the opening groove 114 through the opening 1141.

[0030] The first heat-conducting element 21 is configured to form a receiving groove 211 with a bottom opening, and the heating element 30 is disposed in the receiving groove 211. In some embodiments, the heating element 30 is detachably inserted into the first heat-conducting element 21, and the first heat-conducting element 21 and the heating element 30 can be in a clearance fit, which facilitates the assembly and disassembly of the two and enables heat conduction between them.

[0031] In some embodiments, the first heat-conducting element 21 can be used to conduct heat from the heating element 30 to the radially inner side of the annular cavity 113.

[0032] In some embodiments, the heat-conducting assembly may further include a second heat-conducting element 22, which is configured to conduct heat with the first heat-conducting element 21. The second heat-conducting element 22 is disposed radially outside the annular cavity 113, and the second heat-conducting element 22 and the first heat-conducting element 21 are configured to jointly form an annular groove 23 with an opening 231 at the top. The annular cavity 113 of the container 10 is disposed within the annular groove 23. Specifically, the annular cavity 113 of the container 10 enters the annular groove 23 through the opening 231, while the first heat-conducting element 21 enters the opening groove 114 inside the annular cavity 113 through the opening 1141.

[0033] In some embodiments, the container 10 is detachably inserted into the annular groove 23, and the container 10 and the annular groove 23 are in clearance fit without welding. The container 10 as a whole can be assembled and disassembled with the annular groove 23 by plugging and unplugging, which facilitates the assembly and disassembly of the two and enables heat conduction between them.

[0034] In some embodiments, the second heat-conducting element 22 can be used to conduct heat from the heating element 30 to the radially outer side of the annular cavity 113. In some embodiments, the second heat-conducting element 22 can also be used to conduct heat generated by the hydrogen storage material 1001 when storing hydrogen isotope gas to the outside of the container 10.

[0035] In some embodiments, the second heat-conducting element 22 may include a second heat-conducting cylinder 221 and a second heat-conducting base plate 222 for closing the lower opening of the second heat-conducting cylinder 221. The second heat-conducting base plate 222 forms a positioning groove 2221, and the first heat-conducting element 21 is thermally disposed within the positioning groove 2221. The first heat-conducting element 21 may be clearance-fitted with the positioning groove 2221 to facilitate assembly and disassembly.

[0036] In some embodiments, both the first heat-conducting element 21 and the second heat-conducting element 22 are made of a heat-conducting material. For example, the heat-conducting material is copper.

[0037] See Figure 1 In some embodiments, the device 100 may further include a cooling assembly 40 for cooling the hydrogen storage material 1001 via a thermally conductive assembly.

[0038] In some embodiments, when the hydrogen storage material 1001 stores hydrogen isotope gas, the cooling component 40 can be used to cool the heat-conducting component, thereby accelerating the conduction of heat generated during the storage process of the hydrogen storage material 1001.

[0039] The cooling component 40 can be thermally connected to the second heat-conducting component 22, which exchanges heat generated by the hydrogen storage material 1001 when storing hydrogen isotope gas with the cooling component 40, thereby reducing the temperature of the hydrogen storage material 1001.

[0040] In some embodiments, when the hydrogen storage material 1001 needs to be cooled after releasing hydrogen isotope gas, the cooling component 40 can cool the heat-conducting component, thereby rapidly cooling the hydrogen storage material 1001.

[0041] In some embodiments, the cooling component 40 is disposed below the heat-conducting component. In some embodiments, the device 100 may further include a moving component 50, which is used to move the heat-conducting component and the cooling component 40 relative to or away from each other, so that the heat-conducting component can make thermal contact with the cooling component 40 or separate from it.

[0042] By incorporating a moving component, the heat-conducting component can be separated from the cooling component 40. This facilitates the transfer of heat from the heating component 30 to the hydrogen storage material 1001 via the heat-conducting component when the hydrogen storage material 1001 is heated by the heating component 30, thereby reducing the transfer of heat to the cooling component 40.

[0043] In some embodiments, the moving member 50 is rotatably disposed on the cooling assembly 40, and the heat-conducting assembly can rotate with the moving member 50 relative to the cooling assembly 40, and can make heat-conducting contact with or separate from the cooling assembly 40.

[0044] In some embodiments, the moving member 50 can be rotated to a horizontal state. When the moving member 50 is rotated to a horizontal state, the cooling component 40 and the heat-conducting component move relative to each other to bring the cooling component 40 and the heat-conducting component into contact.

[0045] like Figure 4 The diagram shows a cross-sectional view of the apparatus 100 provided in an embodiment of this application during the release of hydrogen isotope gas. In other embodiments, the moving member 50 can also rotate to a vertical position, and when the moving member 50 rotates to a vertical position, the cooling component 40 and the heat-conducting component move in opposite directions to separate the cooling component 40 and the heat-conducting component from each other.

[0046] See Figure 1 In some embodiments, when the hydrogen storage material 1001 stores hydrogen isotope gas, the moving part 50 rotates to a horizontal state, the cooling component 40 and the heat-conducting component come into contact with each other, and the heat generated by the hydrogen storage material 1001 when storing hydrogen isotope gas is conducted to the second heat-conducting component 22 and the first heat-conducting component 21, and exchanges heat with the cooling component 40, so as to reduce the temperature of the hydrogen storage material 1001, thereby increasing the rate at which the hydrogen storage material 1001 stores hydrogen isotope gas.

[0047] See Figure 4In some embodiments, when the hydrogen storage material 1001 releases hydrogen isotope gas, the moving part 50 rotates to a vertical state, the cooling component 40 and the heat conduction component separate from each other, and the heat conduction component conducts the heat from the heating component 30 to the hydrogen storage material 1001, so that the temperature of the hydrogen storage material 1001 rises, thereby enabling the hydrogen storage material 1001 to quickly release hydrogen isotope gas.

[0048] See Figure 1 and Figure 4 In some embodiments, the cooling assembly 40 may include a thermoelectric cooler 41, a heat-conducting element 42, and a heat sink 43. The thermoelectric cooler 41 has a cold end and a hot end facing each other; the heat-conducting element 42 is thermally connected to the cold end of the thermoelectric cooler 41 and faces the heat-conducting assembly; the heat sink 43 is used to dissipate heat from the hot end of the thermoelectric cooler 41.

[0049] In some embodiments, when the cooling component 40 needs to be cooled down, the cold end temperature of the thermoelectric cooler 41 decreases, and the cooling energy is transferred to the heat-conducting component through the heat-conducting element 12; the hot end temperature of the thermoelectric cooler 41 increases, and the heat from the hot end is dissipated to the outside through the heat sink 43.

[0050] When the hydrogen storage material 1001 releases hydrogen isotope gas, the heat from the heating element 30 is conducted to the heat-conducting component, resulting in a high temperature of the heat-conducting component. The temperature of the heat-conducting component may be higher than the operating temperature of the semiconductor cooling chip 41. Therefore, when the hydrogen storage material 1001 releases hydrogen isotope gas, the cooling component 40 and the heat-conducting component are separated to prevent the semiconductor cooling chip 41 from being damaged at high temperatures.

[0051] In some embodiments, after heating the hydrogen storage material 1001 to release hydrogen isotope gas, the temperature of the container 10 is high, requiring cooling to avoid affecting the storage of hydrogen isotope gas by the hydrogen storage material 1001 within the container 10. In some embodiments, a cooling assembly 40 can be used to cool the container 10. When cooling the container 10 using the cooling assembly 40, the semiconductor cooling chip 41 can be pre-cooled. Once the temperature of the container 10 reaches a preset temperature, the moving part 50 is rotated to a horizontal position, and the heat-conducting part 42 contacts the heat-conducting assembly to cool the container 10. The preset temperature can be, for example, 100°C.

[0052] When the hydrogen storage material 1001 releases hydrogen isotope gas, it is heated to 100℃~200℃. When cooling is required, the hydrogen storage material 1001 can first be allowed to cool down naturally. Since the cooling rate of the hydrogen storage material 1001 is relatively fast when the temperature is above 100℃, it can quickly cool down to below 100℃. However, when the temperature is below 100℃, the cooling rate of the hydrogen storage material 1001 is slower. At this time, using the semiconductor cooling chip 41 for cooling can rapidly reduce the temperature of the hydrogen storage material 1001, which helps to shorten the total cooling time.

[0053] See Figure 1 and Figure 4 In some embodiments, the heat sink 43 may include heat sink fins 431 and heat sink fan 432. The heat sink fins 431 can increase the heat dissipation area; the heat sink fan 432 can provide airflow to the heat sink fins 431, accelerate the convection of the heat sink fins 431, thereby improving the heat dissipation efficiency of the heat sink fins 431.

[0054] See Figure 2 In some embodiments, the container 10 may include an outer top plate 101, an inner top plate 102, an annular bottom plate 103, an outer cylinder 104, and an inner cylinder 105. The outer cylinder 104 is disposed radially outside the inner cylinder 105. The outer top plate 101 is used to close the top opening of the outer cylinder 104; the inner top plate 102 is used to close the top opening of the inner cylinder 105; the annular bottom plate 103 is used to close the annular opening between the outer cylinder 104 and the inner cylinder 105, forming a sealed cavity 11 together with the outer top plate 101, inner top plate 102, outer cylinder 104, and inner cylinder 105. The area between the inner cylinder 105 and the outer cylinder 104 forms an annular cavity 113. The inner cylinder 105 and the inner top plate 102 form an opening groove 114.

[0055] The device 100 provided in the embodiments of this application increases the heat conduction area by setting an inner cylinder 105 and an outer cylinder 104, which is beneficial to the heating and heat dissipation of the hydrogen storage material 1001.

[0056] See Figure 2In some embodiments, the device 100 may further include a cylindrical filter 60 disposed between the outer cylinder 104 and the inner cylinder 105. The two ends of the cylindrical filter 60 are connected to an outer top plate 101 and an annular bottom plate 103, respectively, to divide the sealed cavity 11 into a first cavity 111 located radially outward and a second cavity 112 located radially inward. In some embodiments, the outer top plate 101 is provided with an inlet / outlet vent hole 1011 for allowing hydrogen isotope gas to enter and exit the sealed cavity 11. The inlet / outlet vent hole 1011 communicates with the second cavity 112. In some embodiments, a hydrogen storage material 1001 is disposed in the first cavity 111. The cylindrical filter 60 increases the contact area between the hydrogen isotope gas and the hydrogen storage material 1001, which is beneficial for the hydrogen storage material 1001 to store hydrogen isotope gas.

[0057] See Figure 2 In some embodiments, the hydrogen storage material 1001 disposed in the first cavity 111 can form a thin powder layer radial structure with a large surface area, resulting in a faster rate of storing hydrogen isotope gas and a higher thermal conductivity.

[0058] In some embodiments, the thickness of the first cavity 111 may be less than 10 mm. The thickness of the second cavity 112 may be less than the thickness of the first cavity 111, thereby reducing the volume of the sealing cavity 11.

[0059] See Figure 2 In some embodiments, the device 100 further includes an inlet / outlet gas pipe 70, which is disposed at the inlet / outlet gas passage 1011 of the outer top plate 101, through which hydrogen isotope gas can enter and exit the second chamber 112.

[0060] See Figure 2 In some embodiments, the device 100 may further include a filter element 80 disposed at the inlet / outlet air passage 1011 to prevent the hydrogen storage material 1001 powder entering the second chamber 112 from entering the inlet / outlet air passage 70. In some embodiments, the filter element 80 is disposed inside the second chamber 112 covering the inlet / outlet air passage 1011.

[0061] The hydrogen storage material 1001 is usually blocked by the cylindrical filter 60 and remains in the first chamber 111. However, since the hydrogen storage material 1001 is in powder form, a small amount of the hydrogen storage material 1001 may pass through the cylindrical filter 60 and enter the second chamber 112. By setting the filter element 80, the hydrogen storage material 1001 powder entering the second chamber 112 can be prevented from entering the inlet and outlet gas pipes 70, thereby avoiding the blockage of the inlet and outlet gas pipes 70 by the hydrogen storage material 1001 powder.

[0062] See Figure 2In some embodiments, the device 100 may further include a heat insulation layer 90, which is disposed on the radial outer side of the second heat-conducting element 22 to insulate the container 10 and improve the heating efficiency of the heating element 30.

[0063] The insulation layer 90 can cover the upper end face and the side face of the second heat-conducting cylinder 221, but not the second heat-conducting base plate 222. Therefore, when the hydrogen storage material 1001 stores hydrogen isotope gas, the second heat-conducting base plate 222 can make thermal contact with the heat-conducting element 42, which is beneficial for heat exchange between them; when the hydrogen storage material 1001 releases hydrogen isotope gas, the insulation layer 90 helps reduce the heat diffusion from the second heat-conducting element 22 to the outside. In some embodiments, the insulation layer 90 can be made of ceramic or fiber, etc.

[0064] Regarding the embodiments of this application, it should also be noted that, without conflict, the embodiments of this application and the features in the embodiments can be combined with each other to obtain new embodiments.

[0065] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. The scope of protection of this application shall be determined by the scope of the claims.

Claims

1. A storage device for hydrogen isotope gas, characterized in that, include: A container configured to form a sealed cavity, the sealed cavity including an annular cavity located at the lower part; A hydrogen storage material is disposed within the annular cavity for storing the hydrogen isotope gas; A heat-conducting component is disposed on the radially outer and radially inner sides of the annular cavity to conduct the heat generated by the hydrogen storage material when storing hydrogen isotope gas to the outside of the container; The device further includes a heating element for providing heat to the hydrogen storage material when the hydrogen storage material releases the stored hydrogen isotope gas. The heat-conducting component is configured to conduct heat from the heating element to the radially outer and radially inner sides of the annular cavity; The device further includes a cooling component for cooling the hydrogen storage material via the heat-conducting component; The cooling component is located below the heat-conducting component. The device further includes: a moving component for moving the heat-conducting component and the cooling component relative to or away from each other, so that the heat-conducting component and the cooling component can make thermal contact or separate from each other; The cooling assembly includes: A semiconductor refrigeration chip having opposing cold and hot ends; A heat-conducting component is thermally connected to the cold end of the semiconductor cooling chip, and the heat-conducting component faces the heat-conducting assembly; A heat sink is used to dissipate heat from the hot end of the semiconductor cooling chip.

2. The apparatus according to claim 1, characterized in that, The thermally conductive component includes: A first heat-conducting element is disposed on the radial inner side of the annular cavity. The first heat-conducting element is configured to form a receiving groove with a bottom opening, and the heating element is disposed within the receiving groove.

3. The apparatus according to claim 2, characterized in that, The thermally conductive component also includes: A second heat-conducting element is provided, and the second heat-conducting element and the first heat-conducting element are configured to conduct heat. The second heat-conducting element is disposed on the radial outer side of the annular cavity, and the second heat-conducting element and the first heat-conducting element are configured to jointly form an annular groove with an upper opening, and the annular cavity of the container is disposed within the annular groove.

4. The apparatus according to claim 3, characterized in that, The second heat-conducting element includes a second heat-conducting cylinder and a second heat-conducting base plate for sealing the lower opening of the second heat-conducting cylinder. The second heat-conducting base plate forms a positioning groove, and the first heat-conducting element and the second heat-conducting base plate are thermally disposed in the positioning groove.

5. The apparatus according to claim 1, characterized in that, The container includes: an outer top plate, an inner top plate, an annular bottom plate, an outer cylinder, and an inner cylinder. The outer cylinder is located radially outside the inner cylinder, and the outer top plate is used to close the top opening of the outer cylinder. The inner top plate is used to close the top opening of the inner cylinder, and the annular bottom plate is used to close the annular opening between the outer cylinder and the inner cylinder, so as to form the sealed cavity together with the outer top plate, the inner top plate, the outer cylinder and the inner cylinder, wherein the area between the inner cylinder and the outer cylinder forms the annular cavity.

6. The apparatus according to claim 5, characterized in that, Also includes: A cylindrical filter is disposed between the outer cylinder and the inner cylinder. The two ends of the cylindrical filter are respectively connected to the outer top plate and the annular bottom plate to divide the sealing cavity into a first cavity located on the radially outer side and a second cavity located on the radially inner side. The outer top plate is provided with an inlet and outlet air passage for supplying hydrogen isotope gas to enter and exit the sealed cavity, and the inlet and outlet air passage is connected to the second cavity; The hydrogen storage material is disposed in the first cavity.

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