Six-position carousel pick-and-place die attach device

Abstract

The application relates to a six-bit rotary table type pickup and bonding wafer device and relates to the technical field of RFID die bonding production, which comprises a fixing device, a driving device, a suction device and a pickup device. The fixing device comprises a workbench, the driving device comprises a fixing block, the fixing block is installed on the workbench and is rotationally connected with the workbench, the suction device comprises a supporting plate and a vacuum air inlet rotary joint, the supporting plate is fixedly connected with the fixing block, the supporting plate is provided with a suction assembly, the suction assembly comprises a limiting plate and a wafer suction nozzle, the limiting plate is elastically connected with the supporting plate, the wafer suction nozzle is installed on the limiting plate, and the vacuum air inlet rotary joint is in communication with the wafer suction nozzle; the pickup device comprises a downward pressing sliding module, the downward pressing sliding module comprises a sliding plate, the sliding plate is elastically slid with the workbench, and the sliding plate abuts against the supporting plate. The application has the effects that the RFID die bonding can be simultaneously picked up and bonded, and the production efficiency of the RFID die bonding is improved.

Description

Technical Field

[0001] This application relates to the technical field of RFID die bonding production, and in particular to a six-position rotary pickup and bonding device for wafers. Background Technology

[0002] With the continuous development of technology, the demand for RFID chip bonding is also increasing. RFID chip bonding generally consists of an antenna of 10-30 micrometers and an IC chip connected to the antenna feed point. RFID chip bonding can store relevant information and usually uses radio signals. When the tag receives the signal, it returns the signal to the reader, and the reader reads the information in the tag.

[0003] In related technologies, the speed of picking up and bonding RFID die bonding is the key to the equipment during the production of RFID die bonding. Existing die bonding components all use a module to drive the bonding head to move back and forth quickly between two positions: picking up the die and bonding the die, to complete the picking up and bonding of RFID die bonding and complete the production of related RFID die bonding.

[0004] Regarding the aforementioned technologies, single-head pick-and-place assembly components have only one die bonding head. It must reciprocate between picking up and bonding the die, thus making it impossible to simultaneously complete the die picking and bonding operations, which affects RFID die bonding production. Summary of the Invention

[0005] In order to simultaneously perform RFID die bonding and picking operations and improve the production efficiency of RFID die bonding, this application provides a six-position rotary pick-and-place die device.

[0006] This application provides a six-position rotary chip pickup and bonding device, which adopts the following technical solution:

[0007] A six-position rotary chip picking and bonding device includes a fixing device, a driving device, an adsorption device, and a picking device; the fixing device includes a worktable, the driving device includes a fixing block, the fixing block is mounted on the worktable and rotatably connected to the worktable;

[0008] The adsorption device includes a support plate and a vacuum intake rotary joint. The support plate is fixedly connected to the fixed block. An adsorption assembly is provided on the support plate. The adsorption assembly includes a limiting plate and a wafer suction nozzle. The limiting plate is elastically connected to the support plate. The wafer suction nozzle is installed on the limiting plate, and the vacuum intake rotary joint is connected to the wafer suction nozzle.

[0009] The picking device includes a downward sliding module, which includes a sliding plate. The sliding plate slides elastically with the worktable and abuts against the support plate.

[0010] By adopting the above technical solution, the worktable provides support for the installation of the fixed block, which in turn provides support for the adsorption device and the pickup device. The fixed block rotates, thereby driving the adsorption device to rotate. A support plate is fixed to the fixed block, providing support for the installation of the adsorption components. A sliding plate drives a limiting plate to slide elastically, providing support for the installation of the wafer suction nozzle. The wafer suction nozzle is connected to a vacuum intake rotary joint, thereby controlling the pickup of the wafer. Simultaneously, it rotates to the appropriate position, places the wafer down, and begins the next round of pickup, thus improving wafer production efficiency.

[0011] Optionally, the adsorption assembly further includes a suction nozzle sleeve rod, which is sleeved on the wafer suction nozzle and passes through the limiting plate and is rotatably connected to the limiting plate.

[0012] By adopting the above technical solution, the nozzle sleeve is installed on the limiting plate, and the nozzle sleeve provides support for the installation of the wafer nozzle, thereby enabling the wafer nozzle to be installed on the limiting plate and move vertically along the worktable.

[0013] Optionally, the picking device further includes a fixing plate, and the pressing sliding module further includes a cam. The fixing plate is fixed to the worktable, the sliding plate is provided with an abutment groove, the cam is located in the abutment groove and the cam is rotatably connected to the fixing plate, and the cam abuts against the side wall of the abutment groove.

[0014] By adopting the above technical solution, the fixed plate provides support for the installation of the sliding plate and also provides support for the installation of the cam. The abutment groove provides space for the placement of the cam. The cam rotates, thereby driving the sliding plate to reciprocate in the vertical direction, squeezing the limiting plate, and then driving the wafer suction nozzle to slide in the vertical direction to complete the wafer suction operation.

[0015] Optionally, the bottom of the sliding plate is provided with a contact block, and the contact block is fixedly connected to the sliding plate;

[0016] The side wall of the limiting plate is provided with a contact wheel, which is rotatably connected to the limiting plate and abuts against the contact block.

[0017] By adopting the above technical solution, the contact block is fixed to the sliding plate, thereby causing the contact block to reciprocate in the vertical direction. The limiting plate provides installation support for the contact wheel. The contact block drives the limiting plate to move in the vertical direction by contacting the contact wheel.

[0018] Optionally, guide grooves are provided at both ends of the contact block, and the depth of the guide grooves gradually decreases from the direction away from the contact block to the direction closer to the contact block.

[0019] By adopting the above technical solution, the guide groove is set and the depth of the guide groove gradually increases, which facilitates the rotation of the contact wheel to the bottom of the contact block, ensures the contact stability between the contact wheel and the contact block, and drives the limit plate to slide in the vertical direction.

[0020] Optionally, the pickup device further includes a detection component, which includes a mounting box and a camera. The mounting box is fixedly connected to the worktable, and a light source is provided inside the mounting box. The camera is fixedly connected to the worktable.

[0021] By adopting the above technical solution, the mounting box provides support for the installation of the light source and illuminates the wafer. The camera determines the position of the wafer picked up by the wafer pick-up nozzle, so that the wafer that meets the angle requirements can be used for subsequent related operations.

[0022] Optionally, the adsorption device further includes a correction component, which includes a correction synchronization wheel and a micro guide sleeve. The correction synchronization wheel is coaxially and fixedly connected to the micro guide sleeve and rotatably connected to the support plate. The suction nozzle sleeve rod passes through the micro guide sleeve and is slidably connected to the micro guide sleeve.

[0023] By adopting the above technical solution, the miniature guide sleeve provides support for the installation of the nozzle sleeve rod and also provides support for the installation of the alignment timing wheel. The alignment timing wheel rotates, which in turn drives the miniature guide sleeve to rotate, which in turn drives the internal nozzle sleeve rod and wafer nozzle to rotate, which in turn drives the wafer to rotate, thereby completing the wafer alignment.

[0024] Optionally, the correction assembly further includes a support wheel and a correction timing belt. The support wheel and the support plate are fixedly connected. The correction timing belt is sequentially wrapped around the support wheel and the correction timing wheel and meshes with the support wheel and the correction timing wheel.

[0025] By adopting the above technical solution, the alignment timing belt meshes with the support wheel and the alignment timing wheel. The support wheel rotates, which in turn drives the alignment timing wheel to rotate. The alignment timing wheel is fixed to the micro guide sleeve, which in turn drives the micro guide sleeve to rotate, thus completing the rotation of the wafer suction nozzle and the wafer.

[0026] Optionally, the adsorption device further includes a buffer spring, which is sleeved on the wafer suction nozzle. One end of the buffer spring is fixedly connected to the limiting plate, and the other end is fixedly connected to the wafer suction nozzle.

[0027] By adopting the above technical solution, a buffer spring is sleeved on the wafer pick-up nozzle. When the wafer pick-up nozzle moves excessively downward, it retracts into the nozzle sleeve, and the buffer spring is compressed. After the pick-up operation is completed, the buffer spring returns to its original length, thereby returning the wafer pick-up nozzle to its initial position.

[0028] Optionally, the adsorption device further includes a sleeve buffer spring, which is sleeved on the wafer suction nozzle. One end of the sleeve buffer spring is fixedly connected to the limiting plate, and the other end is fixedly connected to the wafer suction nozzle.

[0029] By adopting the above technical solution, when the limiting plate moves downward, it drives the wafer suction nozzle to move downward. The wafer suction nozzle is installed on the suction nozzle sleeve rod, which is installed on the micro guide sleeve. At this time, the micro guide sleeve may have some slippage. The sleeve rod buffer spring can buffer the vibration of the micro guide sleeve, thereby ensuring a stable connection between the correction synchronous pulley and the correction synchronous belt.

[0030] In summary, this application includes at least one of the following beneficial technical effects:

[0031] 1. By setting up an adsorption device, which is installed on a fixed block and rotates along the worktable, the adsorption device can rotate along the fixed block, thereby quickly completing the absorption and release of the wafer and improving work efficiency.

[0032] 2. By setting up detection components, the position of the picked-up wafers can be detected, thereby enabling wafers that meet the requirements to undergo subsequent related operations;

[0033] 3. By setting up a correction component, wafers with incorrect angles can be adjusted, thereby improving the convenience of wafer position adjustment and ensuring work efficiency. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application;

[0035] Figure 2 This is a schematic diagram of the cross-section of the fixed disk;

[0036] Figure 3 This is a schematic diagram of the adsorption component structure;

[0037] Figure 4 This is a schematic diagram of the detection component structure.

[0038] Reference numerals: 1. Fixing device; 11. Workbench; 111. Tabletop; 112. Table leg; 12. Support platform; 121. Horizontal plate; 122. Vertical plate; 2. Driving device; 21. First motor; 22. Fixing plate; 221. Ball bearing; 23. Mounting plate; 231. Observation port; 24. Fixing block; 3. Adsorption device; 31. Support plate; 311. Mounting hole; 32. Adsorption assembly; 321. Miniature guide sleeve; 322. Nozzle sleeve rod; 323. Limiting plate; 324. Buffer spring; 325. Wafer nozzle; 326. Contact 33. Rotary wheel; 331. Correction assembly; 332. Correction motor; 333. Support wheel; 334. Correction synchronous wheel; 335. Correction synchronous belt; 336. Sleeve rod buffer spring; 34. Vacuum air intake rotary joint; 4. Pickup device; 41. Fixing plate; 411. Sliding groove; 42. Second motor; 43. Downward sliding module; 431. Sliding plate; 432. Abutment groove; 433. Cam; 434. Contact block; 435. Guide groove; 44. Detection assembly; 441. Vertical rod; 442. Horizontal rod; 443. Mounting box; 443. Camera. Detailed Implementation

[0039] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.

[0040] This application discloses a six-position rotary chip pickup and bonding device.

[0041] Reference Figure 1 A six-position rotary chip picking and bonding device includes a fixing device 1, a driving device 2, an adsorption device 3, and a picking device 4.

[0042] Reference Figure 1 The fixing device 1 includes a workbench 11, which includes a tabletop 111 and table legs 112. In this embodiment, the tabletop 111 is preferably a rectangular plate and is horizontally arranged. The number of table legs 112 is preferably four, and the four table legs 112 are respectively located at each corner of the bottom wall of the tabletop 111. The table legs 112 are vertically arranged, and one end of the table legs 112 is fixedly connected to the tabletop 111 by welding, and the other end is fixedly connected to the ground by anchor bolts.

[0043] Reference Figure 1 The fixing device 1 also includes a support platform 12, which includes a horizontal plate 121 and two vertical plates 122. In this embodiment, the horizontal plate 121 is preferably a rectangular plate, and the length direction of the horizontal plate 121 is parallel to the length direction of the table surface 111. The horizontal plate 121 is horizontally arranged, and the two vertical plates 122 are located on both sides of the length direction of the horizontal plate 121. The vertical plates 122 are vertically arranged, and one end of the vertical plate 122 is fixedly connected to the horizontal plate 121 by screws, and the other end is fixedly connected to the table surface 111 by anchor bolts.

[0044] Reference Figure 1 The top wall of the horizontal plate 121 is provided with a mounting groove running vertically through it, preferably a rectangular groove.

[0045] Reference Figure 1 and Figure 2 The driving device 2 includes a first motor 21 and a fixed disk 22. In this embodiment, the first motor 21 is preferably a servo motor. The first motor 21 is located in the mounting slot, and the driving direction of the first motor 21 is vertically arranged. The housing of the first motor 21 is fixedly connected to the horizontal plate 121 by screws. In this embodiment, the fixed disk 22 is preferably a circular disk. The fixed disk 22 is fixedly connected to the bottom of the housing of the first motor 21 by screws. The top wall of the fixed disk 22 is coaxially provided with a through hole for accommodating the output shaft of the first motor 21.

[0046] Reference Figure 1 and Figure 2 The driving device 2 also includes a mounting plate 23. In this embodiment, the mounting plate 23 is preferably a hollow annular ring. The mounting plate 23 is located below the fixed plate 22, and the mounting plate 23 and the fixed plate 22 are coaxially arranged. The mounting plate 23 is coaxially fixedly connected to the output shaft of the first motor 21 by a key connection. The fixed plate 22 has a sliding groove on its end face near the mounting plate 23. In this embodiment, the sliding groove is preferably an annular groove, and the sliding groove is a T-shaped groove. The fixed plate 22 has multiple positioning grooves on the bottom wall of the horizontal section of the sliding groove, and the multiple positioning grooves are evenly distributed circumferentially along the axial direction of the fixed plate 22. Each positioning groove has a ball bearing 221 in its inner cavity. In this embodiment, the upper half of the ball bearing 221 is located outside the positioning groove and inside the sliding groove. The top wall of the mounting plate 23 is provided with a slider. In this embodiment, the slider is preferably an annular slider. The slider is located on the top wall of the mounting plate 23 and is coaxially arranged with the mounting ring. The slider is fixedly connected to the mounting plate 23 by screws. The slider is located in the slide groove and can rotate along the axis of the slide groove. The bottom wall of the slider abuts against the top wall of the ball 221 and is rotatably connected to the ball 221.

[0047] Reference Figure 1 and Figure 2 The sidewall of the mounting ring is provided with multiple observation ports 231 in the horizontal direction. In this embodiment, the observation ports 231 are preferably circular, and the multiple observation ports 231 are evenly distributed circumferentially along the axis of the output shaft of the first motor 21.

[0048] Refer to 1 and Figure 2 Below the mounting ring, there is a fixing block 24 and an adsorption device 3. In this embodiment, the fixing block 24 is preferably a hexagonal block. The fixing block 24 and the mounting ring are coaxially arranged, and the fixing block 24 is fixedly connected to the mounting ring by welding. In this embodiment, the number of adsorption devices 3 is preferably six, and each side wall of the fixing block 24 is provided with an adsorption device 3.

[0049] Reference Figure 1 , Figure 2 and Figure 3 The adsorption device 3 includes a support plate 31. In this embodiment, the support plate 31 is preferably a triangular plate. The support plate 31 is horizontally arranged and is fixedly connected to the fixing block 24 by screws.

[0050] Reference Figure 1 , Figure 2 and Figure 3 The support plate 31, located away from the fixing block 24, has a vertically extending mounting hole 311. An adsorption assembly 32 is located at the mounting hole 311. The adsorption assembly 32 includes a micro guide sleeve 321, a suction nozzle rod 322, a limiting plate 323, a buffer spring 324, and a wafer suction nozzle 325. The micro guide sleeve 321 is vertically positioned and passes through the inner cavity of the mounting hole 311. In this embodiment, the suction nozzle rod 322 is preferably a hollow circular tube. The suction nozzle rod 322 is vertically positioned and passes through the inner cavity of the micro guide sleeve 321, and can rotate with the micro guide sleeve 321. The limiting plate 323 is located below the mounting plate and is horizontally positioned. The limiting plate 323 is fixedly connected to the mounting plate via a telescopic rod. A limiting plate 323 has a limiting groove extending vertically through it. A suction nozzle sleeve 322 passes through the limiting groove and fits against its side wall. The suction nozzle sleeve 322 is rotatably connected to the limiting plate 323 and can move vertically with the limiting plate 323. A wafer suction nozzle 325 is located at the end of the suction nozzle sleeve 322 away from the micro guide sleeve 321 and can slide along the length of the suction nozzle sleeve 322. A buffer spring 324 is sleeved on the wafer suction nozzle 325, with one end fixedly connected to the wafer suction nozzle 325 by a screw and the other end fixedly connected to the limiting plate 323 by a screw.

[0051] Reference Figure 1 , Figure 2 and Figure 3 The end of the limiting plate 323 away from the telescopic rod is provided with a contact wheel 326, which is rotatably connected to the limiting plate 323 through a rotating shaft.

[0052] Reference Figure 1 , Figure 2 and Figure 3The adsorption device 3 also includes a correction assembly 33, which includes a correction motor 331, a support wheel 332, a correction synchronization wheel 333, a correction synchronization belt 334, and a sleeve buffer spring 335. In this embodiment, the correction motor 331 is preferably a servo motor. The correction motor 331 is fixedly connected to the mounting plate by screws. The rotation shaft of the correction motor 331 is vertically arranged, and the support wheel 332 is horizontally arranged and coaxially fixedly connected to the output shaft of the correction motor 331 by a key connection. The eccentric timing pulley 333 and the miniature guide sleeve 321 are coaxially arranged, and the eccentric timing pulley 333 is fixedly connected to the miniature guide sleeve 321 by a key connection. The eccentric timing belt 334 is sequentially wound around the eccentric timing pulley 333 and the support pulley 332, and meshes with the eccentric timing pulley 333 and the support pulley 332. The sleeve rod buffer spring 335 is vertically arranged, and one end of the sleeve rod buffer spring 335 is fixedly connected to the support plate 31 by a screw, and the other end is fixedly connected to the miniature guide sleeve 321 by a screw.

[0053] Reference Figure 1 , Figure 2 and Figure 3 The adsorption device 3 also includes a vacuum intake rotary joint 34, which is installed through the correction synchronous wheel 333 and is connected to the inner cavity of the wafer suction nozzle 325.

[0054] Reference Figure 1 , Figure 2 and Figure 3 Two pickup devices 4 are provided, and are respectively installed at both ends of the horizontal plate 121 along its length. Each pickup device 4 includes a fixing plate 41 and a second motor 42. In this embodiment, the fixing plate 41 is vertically arranged and fixedly connected to the horizontal plate 121 by screws. A through slot is provided through the fixing plate 41 in the horizontal direction. The second motor 42 is located on the end face of the fixing plate 41 away from the fixing block 24, and is horizontally arranged. In this embodiment, the second motor 42 is preferably a servo motor. The housing of the second motor 42 is fixedly connected to the fixing plate 41 by screws, and the output shaft of the second motor 42 passes through the through slot.

[0055] Reference Figure 1 , Figure 2 and Figure 3 The picking device 4 also includes a pressing sliding module 43, which includes a sliding plate 431. The sliding plate 431 is located on the end face of the fixed plate 41 away from the second motor 42. The sliding plate 431 is vertically arranged and slidably connected to the fixed plate 41. The fixed plate 41 has sliding grooves 411 on both sides along its length. The sliding grooves 411 are vertically arranged, and the inner cavity of the sliding groove 411 is provided with a sliding block. The sliding block can slide along the length of the sliding groove 411, and the sliding block is fixedly connected to the sliding plate 431 by screws.

[0056] Reference Figure 1 , Figure 2 and Figure 3 The sliding plate 431 is provided with an abutment groove 432 through the horizontal direction. In this embodiment, the abutment groove 432 is preferably a rectangular groove. The inner cavity of the abutment groove 432 is provided with a cam 433. The side wall of the cam 433 abuts against the side wall of the abutment groove 432, and the cam 433 is coaxially fixedly connected to the output shaft of the second motor 42 by a key connection.

[0057] Reference Figure 1 , Figure 2 and Figure 3 A contact block 434 is provided at the bottom of the end face of the sliding plate 431 away from the second motor 42. The contact block 434 is horizontally arranged. In this embodiment, the contact block 434 is preferably an L-shaped plate. The vertical section of the contact block 434 is attached to the sliding plate 431, and the horizontal section of the contact block 434 is located at the bottom of the vertical section and at the end face of the vertical section away from the second motor 42. The contact block 434 is fixedly connected to the sliding plate 431 by screws. In this embodiment, guide grooves 435 are provided at both ends of the bottom wall of the horizontal section of the contact block 434 along its length. In this embodiment, the depth of the guide grooves 435 gradually decreases from the direction away from the contact block 434 to the direction closer to the contact block 434.

[0058] Reference Figure 1 , Figure 2 and Figure 3 In this embodiment, the contact wheel 326 and the contact block 434 are electrically connected.

[0059] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 The pickup device 4 also includes a detection component 44, which includes a vertical rod 441, a horizontal rod 442, a reinforcing rib, a mounting box 443, and a camera 444. The vertical rod 441 is vertically arranged, and the horizontal rod 442 is horizontally arranged. One end of the vertical rod 441 is fixedly connected to the table surface 111 by screws, and the other end is fixedly connected to the horizontal rod 442. The reinforcing rib is located below the horizontal rod 442. One end of the reinforcing rib is fixedly connected to the horizontal rod 442 by screws, and the other end is fixedly connected to the vertical rod 441 by screws. In this embodiment, the mounting box 443 is preferably a hollow rectangular box with an open top. The mounting box 443 is fixedly connected to the top wall of the horizontal rod 442 away from the vertical rod 441 by screws. A light source is provided inside the mounting box 443. The camera 444 is fixedly connected to the horizontal rod 442 by screws.

[0060] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 In this embodiment, when the first motor 21 drives the mounting plate to rotate, it pauses at the mounting box 443, and the first motor 21, the second motor 42, the camera 444 and the correction motor 331 are electrically connected.

[0061] The implementation principle of a six-position rotary chip picking and bonding device in this application embodiment is as follows: the first motor 21 drives the fixed block 24 to rotate, thereby driving the adsorption device 3 to rotate.

[0062] When the wafer is rotated to the wafer position, the second click drives the cam 433 to rotate, which in turn drives the sliding plate 431 to slide. At this time, the contact block 434 contacts the contact wheel 326, causing the limiting plate 323 to move downward, so that the wafer suction nozzle 325 can pick up the wafer. When the wafer suction nozzle 325 moves too far downward, the buffer spring 324 works to protect the wafer suction nozzle 325. When the contact block 434 is no longer in contact with the contact wheel 326, the limiting plate 323 returns to its original position.

[0063] Subsequently, the support plate 31 rotates to the detection component 44, and the camera 444 determines the position of the wafer. Then, for unqualified wafers, correction is performed. The correction motor 331 drives the micro guide sleeve 321 to rotate through the cooperation of the support wheel 332 and the correction synchronous wheel 333, which in turn drives the wafer suction nozzle 325 to rotate, and performs the correction operation on the wafer.

[0064] The wafer is then released in the feeding zone to prepare for the next wafer pick-up.

[0065] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A six-position rotary pickup and bonding wafer device, characterized in that: It includes a fixing device (1), a driving device (2), an adsorption device (3), and a picking device (4); the fixing device (1) includes a worktable (11) and a support platform (12), the support platform (12) includes two vertical plates (122) and a horizontal plate (121) located on the two vertical plates (122); the driving device (2) includes a fixing block (24), the fixing block (24) is installed on the horizontal plate (121) and is rotatably connected to the horizontal plate (121); the fixing block (24) is a hexagonal block. The adsorption device (3) includes a support plate (31) and a vacuum inlet rotary joint (34). The support plate (31) is fixedly connected to the fixing block (24). An adsorption assembly (32) is provided at the support plate (31). The adsorption assembly (32) includes a limiting plate (323) and a wafer suction nozzle (325). The limiting plate (323) is connected to the support plate (31) through a telescopic rod. The wafer suction nozzle (325) is installed on the limiting plate (323), and the vacuum inlet rotary joint (34) is connected to the wafer suction nozzle (325). The picking device (4) includes a fixed plate (41) and a second motor (42). The fixed plate (41) is vertically arranged and fixedly connected to the horizontal plate (121). The fixed plate (41) has a through groove in the horizontal direction. The second motor (42) is located on the end face of the fixed plate (41) away from the fixed block (24) and is horizontally arranged. The housing of the second motor (42) is fixedly connected to the fixed plate (41), and the output shaft of the second motor (42) passes through the through groove. The picking device (4) also includes a pressing sliding module (43), which includes a sliding plate (431). The sliding plate (431) is located on the end face of the fixed plate (41) away from the second motor (42). The sliding plate (431) is vertically arranged and slidably connected to the fixed plate (41), and slides along the vertical length direction of the fixed plate (41). The sliding plate (431) is provided with an abutment groove (432) in the horizontal direction. The inner cavity of the abutment groove (432) is provided with a cam (433). The side wall of the cam (433) abuts against the side wall of the abutment groove (432), and the cam (433) is coaxially and fixedly connected to the output shaft of the second motor (42). A contact block (434) is provided at the bottom of the end face of the sliding plate (431) away from the second motor (42). The contact block (434) is horizontally set and is an L-shaped plate. The vertical section of the contact block (434) is attached to the sliding plate (431), and the horizontal section of the contact block (434) is located at the bottom of the vertical section and at the end face of the vertical section away from the second motor (42). The contact block (434) is fixedly connected to the sliding plate (431). Guide grooves (435) are provided at both ends of the bottom wall of the horizontal section of the contact block (434) along the length direction. The depth of the guide grooves (435) gradually decreases from the direction away from the contact block (434) to the direction closer to the contact block (434). The horizontal section of the contact block (434) has a structure that is wider at the top and narrower at the bottom. The side wall of the limiting plate (323) is provided with a contact wheel (326), which is rotatably connected to the limiting plate (323) through a rotating shaft, and the contact wheel (326) abuts against the contact block (434).

2. The six-position rotary pickup and bonding wafer device according to claim 1, characterized in that: The adsorption assembly (32) further includes a suction nozzle sleeve (322), which is sleeved on the wafer suction nozzle (325) and passes through the limiting plate (323) and is rotatably connected to the limiting plate (323).

3. A six-position rotary pickup and bonding wafer device according to claim 2, characterized in that: The picking device (4) further includes a detection component (44), which includes a mounting box (443) and a camera (444). The mounting box (443) is fixedly connected to the worktable (11), and a light source is provided inside the mounting box (443). The camera (444) is fixedly connected to the worktable (11).

4. A six-position rotary pickup and bonding wafer device according to claim 3, characterized in that: The adsorption device (3) further includes a correction component (33), which includes a correction synchronization wheel (333). The adsorption component (32) further includes a micro guide sleeve (321). The correction synchronization wheel (333) is coaxially and fixedly connected to the micro guide sleeve (321) and rotatably connected to the support plate (31). The suction nozzle rod (322) passes through the micro guide sleeve (321) and is slidably connected to the micro guide sleeve (321).

5. A six-position rotary pickup and bonding wafer device according to claim 4, characterized in that: The correction assembly (33) further includes a support wheel (332) and a correction timing belt (334). The support wheel (332) and the support plate (31) are fixedly connected. The correction timing belt (334) is wrapped around the support wheel (332) and the correction timing wheel (333) in sequence and meshes with the support wheel (332) and the correction timing wheel (333).

6. A six-position rotary pickup and bonding wafer device according to claim 4, characterized in that: The adsorption device (3) further includes a buffer spring (324), which is sleeved on the wafer suction nozzle (325). One end of the buffer spring (324) is fixedly connected to the limiting plate (323), and the other end is fixedly connected to the wafer suction nozzle (325).

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