Focal plane array non-uniformity correction method and device

Abstract

The present disclosure relates to a method and device for correcting the non-uniformity of a focal plane array, the method comprising: controlling the working temperature of a high and low temperature box to undergo a first and second temperature change process according to a preset temperature adjustment method; executing a first preset process in both the first temperature change process and the second temperature change process; the first preset process comprising: collecting the target surface temperature of the focal plane array according to a preset period, and dynamically adjusting the global bias and integration time according to the preset period with a preset range and a preset step length, and recording the target surface temperature, global bias and integration time at the same acquisition time as acquisition data; performing linear fitting on the response value of the pixel in the focal plane array and the acquisition data according to a preset mathematical model to obtain a fitting correction coefficient; and correcting the measured value of the focal plane array according to the preset mathematical model and the fitting correction coefficient. Through the technical solution disclosed in the present disclosure, the universality of the equipment and the accuracy of the correction are optimized, and the temperature drift problem is overcome.

Description

Technical Field

[0001] The disclosed embodiments relate to the field of infrared detection technology, and in particular to a method and device for correcting non-uniformity of a focal plane array. Background Art

[0002] Infrared thermal imaging technology is a technology that passively senses the thermal radiation of objects in the scene to form images. It has the characteristics of night vision and non-contact temperature measurement. In recent years, with the advancement of generation process technology, the use of infrared imaging systems has become more and more widespread. However, due to the manufacturing process and materials of the infrared focal plane array (IRFPA), it is difficult to make the response rate of the pixels in the focal plane detection array consistent, which will result in different response voltages given by different pixels of the detector facing a uniformly radiated target. The direct consequence is that the infrared image will produce non-uniformity, so it is necessary to correct the response of the pixels in the focal plane array.

[0003] At present, there are two main methods for IRFPA non-uniformity correction: one is the scene-based correction method, which uses the changes in actual scene information to instantly estimate the gain and offset of the detection pixel, and can adaptively track the drift of the detection pixel output. For example, neural network methods, time domain high-pass filtering algorithms, constant statistical averaging methods, etc. can be used. However, the scene-based correction method is heavily dependent on the changes in the scene, and the algorithm has a large amount of calculation. It is restricted by current hardware conditions and it is difficult to achieve real-time correction. Therefore, it is rarely used in engineering practice. The other is the correction method based on radiation source calibration. This method requires obtaining the calibration coefficients required for correction in advance, and then reading these data during the correction process and making corresponding processing. It has high accuracy and relatively simple algorithms. It is currently widely used in engineering practice. However, the existing calibration unblocked scheme is mainly based on the temperature of the blackbody radiation source for calibration. It does not fully consider the influence of the machine and environmental factors, has poor adaptability, and has poor correction effects on some scenes in actual tests. In addition, most of the calibration unblocked schemes are only calibrated for some specific temperature points. When the ambient temperature changes, the calibration result may have temperature drift errors, affecting the imaging effect.

[0004] Public Content

[0005] In view of this, the present disclosure provides a method and apparatus for correcting the non-uniformity of a focal plane array, which optimizes the universality of the device and the accuracy of correction and overcomes the problem of temperature drift.

[0006] In a first aspect, an embodiment of the present disclosure provides a method for correcting non-uniformity of a focal plane array, comprising:

[0007] The working temperature of the high and low temperature box is controlled to undergo a first temperature change process and a second temperature change process according to a preset temperature adjustment method; wherein the high and low temperature box contains relatively arranged equipment to be calibrated and a normal temperature uniform temperature surface, the first temperature change process is a process of rising from the lowest working temperature to the highest working temperature, and the second temperature change process is a process of falling from the highest working temperature to the lowest working temperature;

[0008] In both the first temperature change process and the second temperature change process, a first preset process is performed; wherein the first preset process includes: collecting the target surface temperature of the focal plane array according to a preset period, and dynamically adjusting the global bias and the integration time according to the preset period with a preset range and a preset step size, and recording the target surface temperature, the global bias and the integration time at the same collection time as collection data;

[0009] Performing linear fitting on the response values ​​of the pixels in the focal plane array and the collected data according to a preset mathematical model to obtain a fitting correction coefficient; wherein the preset mathematical model is composed of a linear polynomial;

[0010] The measured values ​​of the focal plane array are corrected according to the preset mathematical model and the fitting correction coefficient.

[0011] In some embodiments, in the preset mathematical model, the highest order term constituted by the integral time is a second order term or a third order term, and the highest order term constituted by the target surface temperature is a second order term or a third order term.

[0012] In some embodiments, the preset mathematical model is:

[0013]

[0014] in, is the response mean of the uncorrected pixel, G is the global bias, I is the integration time, T is the target surface temperature, the position coordinates of the pixel in the focal plane array are (i, j), V ij is the response value of the uncorrected pixel, a ij , b ij , c ij , d ij , e ij , f ij , g ij is the fitting correction coefficient.

[0015] In some embodiments, the correcting the measured value of the focal plane array according to the preset mathematical model and the fitting correction coefficient includes cyclically executing a second preset process; wherein the second preset process includes:

[0016] Acquire a first real-time target surface temperature, a first real-time global bias, a first real-time integration time and a response value of an uncorrected pixel when the device to be corrected is not blocked as measured acquisition data;

[0017] Substitute the measured acquisition data and the fitting correction coefficient into the preset mathematical model to obtain the pixel response value after initial correction.

[0018] In some embodiments, before the loop executes the second preset process, the method further includes:

[0019] Acquire the second real-time target surface temperature, the second real-time global bias, the second real-time integration time and the response value of the uncorrected pixel when the device to be corrected is powered on and shielded by the shielding sheet as basic acquisition data;

[0020] Substitute the basic acquisition data and the fitting correction coefficient into the preset mathematical model to obtain the pixel response value after basic correction.

[0021] In some embodiments, after obtaining the pixel response value after the initial correction, the second preset process further includes:

[0022] A secondary single-point correction is performed on the initially corrected pixel response value according to the basic corrected pixel response value to obtain a secondary corrected pixel response value.

[0023] In some embodiments, the secondary single-point correction is implemented using the following formula:

[0024]

[0025] in, is the pixel response value after the secondary correction, is the pixel response value after the initial correction, is the pixel response value after the basic correction, is the pixel response mean after the basic correction, and the position coordinate of the pixel in the focal plane array is (i, j).

[0026] In some embodiments, controlling the working temperature of the high and low temperature box according to a preset temperature adjustment method to undergo a first temperature change process and a second temperature change process includes:

[0027] The working temperature of the high and low temperature box is controlled to undergo the first temperature change process and the second temperature change process at a fixed temperature step at a preset time interval; wherein the temperature step is smaller than a preset temperature step.

[0028] In some embodiments, the method further comprises:

[0029] The operating temperature of the high and low temperature box is controlled to cover the preset operating temperature range of the device to be calibrated, and the response mean of the pixel is controlled to be within the preset response mean range.

[0030] In a second aspect, an embodiment of the present disclosure further provides a non-uniformity correction device for a focal plane array, comprising:

[0031] The temperature control module is used to control the working temperature of the high and low temperature box to undergo a first temperature change process and a second temperature change process according to a preset temperature adjustment method; wherein the high and low temperature box contains relatively arranged equipment to be calibrated and a normal temperature uniform temperature surface, the first temperature change process is a process of rising from the lowest working temperature to the highest working temperature, and the second temperature change process is a process of falling from the highest working temperature to the lowest working temperature;

[0032] A data acquisition module, configured to execute a first preset process in both the first temperature change process and the second temperature change process; wherein the first preset process includes: acquiring the target surface temperature of the focal plane array according to a preset period, dynamically adjusting the global bias and the integration time according to the preset period in a preset range and a preset step size, and respectively recording the target surface temperature, the global bias and the integration time at the same acquisition time as acquisition data;

[0033] A coefficient acquisition module, used for performing linear fitting on the response values ​​of the pixels in the focal plane array and the collected data according to a preset mathematical model to obtain fitting correction coefficients; wherein the preset mathematical model is composed of a linear polynomial;

[0034] A measurement correction module is used to correct the measured value of the focal plane array according to the preset mathematical model and the fitting correction coefficient.

[0035] The embodiment of the present disclosure provides a method for correcting the non-uniformity of a focal plane array, including: controlling the working temperature of a high and low temperature box to undergo a first temperature change process and a second temperature change process according to a preset temperature adjustment method; performing the first preset process in both the first temperature change process and the second temperature change process; wherein the first preset process includes: collecting the target surface temperature of the focal plane array according to a preset period, dynamically adjusting the global bias and the integration time according to the preset period with a preset range and a preset step length, and recording the target surface temperature, the global bias and the integration time at the same acquisition time as the acquisition data; performing linear fitting on the response value of the pixel in the focal plane array and the acquisition data according to a preset mathematical model to obtain a fitting correction coefficient; and correcting the measured value of the focal plane array according to the preset mathematical model and the fitting correction coefficient. Therefore, the embodiment of the present disclosure sets the fitting process to comprehensively consider the application scenarios of heating and cooling, which is conducive to improving the accuracy of the final fitting result, optimizing the universality of the equipment application, and modeling based on the general physical model of the thermal infrared detector, which can take into account most of the influencing factors of the machine and the environment in the entire imaging process, and greatly improves the scene temperature calibration range, overcoming the problem of temperature drift error that may occur during use. In addition, multiple factors that may affect the non-uniformity of the focal plane array are comprehensively considered to optimize the application universality of the corrected equipment and the accuracy of non-uniformity correction. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure, and a person skilled in the art can also obtain other drawings based on these drawings.

[0037] Figure 1 A flowchart of a method for correcting non-uniformity of a focal plane array provided in an embodiment of the present disclosure;

[0038] Figure 2 A specific flow chart of a parameter calibration method in a non-uniformity correction process provided by an embodiment of the present disclosure;

[0039] Figure 3 A specific flow chart of a method for frame-by-frame non-uniformity correction after parameter calibration provided by an embodiment of the present disclosure;

[0040] Figure 4 A schematic structural diagram of a non-uniformity correction device for a focal plane array provided in an embodiment of the present disclosure;

[0041] Figure 5 A schematic diagram of the structure of an electronic device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0042] In order to more clearly understand the above-mentioned purposes, features and advantages of the present disclosure, the present disclosure is further described in detail below in conjunction with the accompanying drawings and embodiments. It is understood that the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. The specific embodiments described herein are only used to explain the present disclosure, rather than to limit the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in the field belong to the scope of protection of the present disclosure.

[0043] Figure 1 A flowchart of a method for correcting non-uniformity of a focal plane array provided in an embodiment of the present disclosure. The method for correcting non-uniformity of a focal plane array can be applied in a scenario where non-uniformity correction of an infrared focal plane array is required. The infrared focal plane array constitutes a device to be corrected and can be performed by a non-uniformity correction device for a focal plane array provided in an embodiment of the present disclosure. The non-uniformity correction device for a focal plane array can be implemented in software and / or hardware. Figure 1 As shown, the non-uniformity correction method of the focal plane array includes:

[0044] S110. Control the working temperature of the high and low temperature box according to a preset temperature adjustment method to undergo a first temperature change process and a second temperature change process; wherein, the high and low temperature box contains relatively arranged equipment to be calibrated and a normal temperature uniform temperature surface, the first temperature change process is a process of rising from the lowest working temperature to the highest working temperature, and the second temperature change process is a process of dropping from the highest working temperature to the lowest working temperature.

[0045] In some embodiments, before controlling the working temperature of the high and low temperature box to undergo a first temperature change process and a second temperature change process according to a preset temperature adjustment method, the device to be calibrated and the normal temperature uniform temperature surface are first placed in the high and low temperature box, and the device to be calibrated and the normal temperature uniform temperature surface are arranged relative to each other, that is, the normal temperature uniform temperature surface is placed in front of the device to be calibrated. For example, a preset distance can be set between the normal temperature uniform temperature surface and the device to be calibrated, and the normal temperature uniform temperature surface can be set to be parallel to the front end surface of the device to be calibrated.

[0046] Specifically, the surface of the normal temperature uniform temperature surface is flat, has no reflection on the working frequency band of the device to be corrected, and is opaque. Therefore, the embodiment of the present disclosure adopts the normal temperature uniform temperature surface as the standard temperature surface, which effectively avoids problems such as external heat reflection and refraction, and minimizes the difference between the environment of the device to be corrected during calibration measurement and the environment during actual operation, which is beneficial to improving the accuracy of non-uniformity correction. In addition, the thermal radiation emissivity of the normal temperature uniform temperature surface can be set to be greater than the preset emissivity. A larger thermal radiation emissivity has a larger measurement value under the same conditions, which is beneficial to reducing the residual error when fitting the preset mathematical model later. It should be noted that the embodiment of the present disclosure does not limit the specific shape and specific structure of the normal temperature uniform temperature surface.

[0047] Specifically, the device to be calibrated can be with or without lens calibration. When the device to be calibrated is with lens calibration, the lens cap can also be directly used as the reference measurement target. At this time, the lens focal length needs to be adjusted to telephoto, which is conducive to reducing the pot cover phenomenon or central bright spot phenomenon formed by the lens.

[0048] In some embodiments, after the device to be calibrated and the normal temperature uniform temperature surface are placed in a high and low temperature box, the operating temperature of the high and low temperature box can be controlled to cover the preset operating temperature range of the device to be calibrated, and the response mean of the pixel in the focal plane array can be controlled to be within the preset response mean range.

[0049] Specifically, setting the working temperature of the high and low temperature chamber to cover the preset working temperature range of the equipment to be calibrated can greatly improve the scene temperature calibration range and cover the continuous temperature range of general usage scenarios. It overcomes the problem that most unobstructed calibration schemes only calibrate for some specific temperature points. When the ambient temperature changes, the calibration result may have a temperature drift error, which affects the imaging effect. It is beneficial to greatly reduce the temperature drift error that may occur during the use of the equipment to be calibrated.

[0050] Exemplarily, the preset operating temperature range of the device to be calibrated can be set, for example but not limited to -20°C to 60°C, and the operating temperature range of the high and low temperature box can be controlled to be also -20°C to 60°C. Corresponding to the operating temperature range of the high and low temperature box, the response mean of the pixel in the focal plane array is controlled to be within a preset response mean range, for example but not limited to between 3000 and 12000.

[0051] Specifically, the working temperature of the high and low temperature box traverses -20°C to 60°C, and similarly, the temperature of the normal temperature uniform temperature surface will also traverse -20°C to 60°C. Although the response values ​​of the pixels in the focal plane array are inconsistent at this time, preliminary rough adjustments can be made by adjusting the circuit structure and parameters of the focal plane array to ensure that the response mean of the pixels in the focal plane array meets the working requirements of the focal plane array, that is, to ensure that the response mean of the pixels in the focal plane array is between 3000 and 12000. In addition, when the working temperature range of the high and low temperature box is, for example, -20°C to 60°C, if the circuit adjustment for the focal plane array is too extreme, the response mean of the pixels in the focal plane array will exceed the range of 3000 to 12000, and these extreme values ​​cannot be processed using subsequent correction algorithms, so it is necessary to control the response mean of the pixels in the focal plane array to be within the preset response mean range.

[0052] In some embodiments, controlling the working temperature of the high and low temperature box to undergo a first temperature change process and a second temperature change process according to a preset temperature adjustment method may specifically include: controlling the working temperature of the high and low temperature box to undergo a first temperature change process and a second temperature change process at a fixed temperature step length at a preset time interval. The first temperature change process is a process of rising from the lowest working temperature to the highest working temperature, and the second temperature change process is a process of falling from the highest working temperature to the lowest working temperature.

[0053] Taking the first temperature change process as an example, that is, taking the temperature upward change process as an example, illustratively, the preset time is, for example but not limited to, 1 minute, and the fixed temperature step is, for example but not limited to, 0.3°C. The working temperature of the high and low temperature box is controlled to undergo the first temperature change process at a preset time interval with a fixed temperature step, that is, the working temperature of the high and low temperature box is controlled from the lowest working temperature to increase by 0.3°C per minute until it reaches the highest working temperature point. The lowest working temperature is, for example, -20°C, and the highest working temperature is, for example, 60°C, that is, the working temperature of the high and low temperature box is controlled to increase by 0.3°C per minute from -20°C to 60°C.

[0054] Similarly, the working temperature of the high and low temperature box is controlled to undergo a second temperature change process at a fixed temperature step at a preset time interval, that is, the working temperature of the high and low temperature box is controlled to drop from the highest working temperature at 0.3°C per minute until it drops to the lowest working temperature point, which will not be repeated here.

[0055] Therefore, the embodiment of the present disclosure is subsequently set to perform the first preset process in the first temperature change process and the second temperature change process, that is, the collection of subsequent fitting data is performed. Referring to the description of the first temperature change process and the second temperature change process in the above embodiment, the embodiment of the present disclosure collects both the fitting data in the temperature upward change process and the fitting data in the temperature downward change process. The detection properties or detection parameters of the focal plane array in the temperature upward change process and the temperature downward change process are different. The subsequent fitting data collected in the two temperature change processes are comprehensively fitted, which is equivalent to the fitting process comprehensively considering the application scenarios of heating and cooling, which is conducive to improving the accuracy of the final fitting result, and then improving the accuracy of the non-uniformity correction, so that the corrected device can be applied to both the application scenarios of heating and cooling in actual application, and the universality of the device application is optimized. In addition, the range from the lowest operating temperature to the highest operating temperature set in the embodiment of the present disclosure can cover the preset operating temperature range of the device to be calibrated, can greatly improve the scene temperature calibration range, cover the continuous temperature range of general use scenarios, and is conducive to greatly reducing the temperature drift error that may occur during the use of the device to be calibrated.

[0056] It should be noted that the high and low temperature box can be controlled to undergo the first temperature change process first and then the second temperature change process, or the high and low temperature box can be set to undergo the second temperature change process first and then the first temperature change process. The embodiment of the present disclosure does not limit the specific order in which the high and low temperature box undergoes the first temperature change process and the second temperature change process.

[0057] In some embodiments, the temperature step size can be set smaller than the preset temperature step size. Specifically, the temperature step size is set smaller than the preset temperature step size, that is, the fixed temperature step size is set smaller, so that the high and low temperature box can traverse more temperature collection points when undergoing the first temperature change process and the second temperature change process, that is, it can collect more sets of fitting data, which is conducive to improving the accuracy of the fitting results, and then improving the accuracy of the non-uniformity correction.

[0058] In some embodiments, before controlling the working temperature of the high and low temperature box to undergo the first temperature change process, the working temperature of the high and low temperature box can be controlled to be quickly cooled to the lowest working temperature, and a preset time, such as but not limited to 30 minutes, is waited to allow the body temperature of the device to be calibrated to be basically balanced before undergoing the first temperature change process to collect fitting data. Similarly, before controlling the working temperature of the high and low temperature box to undergo the second temperature change process, the working temperature of the high and low temperature box can be controlled to be quickly heated to the highest working temperature, and a preset time, such as but not limited to 30 minutes, is waited to allow the body temperature of the device to be calibrated to be basically balanced before undergoing the second temperature change process to collect fitting data.

[0059] S120. In the first temperature change process and the second temperature change process, a first preset process is executed; wherein the first preset process includes: collecting the target surface temperature of the focal plane array according to a preset period, and dynamically adjusting the global bias and integration time according to the preset period with a preset range and a preset step size, and recording the target surface temperature, global bias and integration time at the same collection time as collection data.

[0060] Specifically, taking the first temperature change process as an example, the target surface temperature of the focal plane array is collected at a preset period during the process of the working temperature of the high and low temperature box rising from the lowest working temperature to the highest working temperature at a fixed temperature step length at a preset time interval, for example, at a temperature of 0.3°C per minute. The target surface temperature of the focal plane array is linearly offset with the working temperature of the high and low temperature box. As the working temperature of the high and low temperature box continues to rise, the target surface temperature of the focal plane array is collected at a preset interval, for example, every 5 seconds. At the same time, each time the target surface temperature is collected, the global bias and integration time are dynamically adjusted with a preset range and a preset step length.

[0061] The global bias and integration time are dynamically adjusted with a preset range and a preset step size. The global bias can traverse 10 sets of values ​​according to its corresponding preset range and preset step size, for example, and the integration time can traverse 10 sets of values ​​according to its corresponding preset range and preset step size, for example. Then, each time a target surface temperature is collected, it is necessary to traverse an array consisting of 100 sets of global bias and integration time. If 10 sets of different target surface temperatures can be collected in the first temperature change process, the target surface temperature, global bias and integration time at the same collection time are recorded respectively as the collection data. The collection data contains a total of 1000 arrays, each of which includes three elements: target surface temperature, global bias and integration time.

[0062] It should be noted that the above embodiment only illustrates the number of groups of target surface temperature, global bias and integration time traversal, and does not limit the number of groups of each non-uniformity influencing factor traversal. The embodiment of the present disclosure does not specifically limit the number of groups of each non-uniformity influencing factor traversal. In addition, when setting the preset range and preset step size of the global bias, as well as the preset range and preset step size of the integration time, it is necessary to ensure that the response mean of the pixels in the focal plane array meets the preset requirements, for example, to ensure that the response mean of the pixels in the focal plane array is between 3000 and 12000.

[0063] Exemplarily, the preset period can be set to be greater than or equal to 5 seconds and less than or equal to 15 seconds. Taking the preset period equal to 5 seconds as an example, the target surface temperature of the focal plane array is collected once every 5 seconds. At the moment of collecting the target surface temperature, the global bias and integration time are dynamically adjusted with a preset range and a preset step size. It should be noted that the embodiment of the present disclosure does not limit the specific duration of the preset period.

[0064] The above embodiment describes in detail how to execute the first preset process in the first temperature change process. Corresponding to the second temperature change process, in the process where the working temperature of the high and low temperature box is preset at intervals of a fixed temperature step, for example, at a rate of 0.3°C per minute, and the data is collected in a specific manner, the same as the data collection method for the first temperature change process, which will not be repeated here.

[0065] Therefore, compared with only introducing a single influencing factor into the mathematical model for fitting correction, the embodiment of the present disclosure comprehensively considers multiple factors that may affect the non-uniformity of the focal plane array, that is, introduces multiple variables, including the target surface temperature, global bias and integration time of the focal plane array, which can more objectively reflect the thermal radiation characteristics of the device to be corrected in different environments and optimize the application universality of the corrected device. In addition, by introducing multiple variables, it is helpful to improve the accuracy of the fitting process, and then to improve the accuracy of the non-uniformity correction.

[0066] S130, performing linear fitting on the response values ​​of the pixels in the focal plane array and the collected data according to a preset mathematical model to obtain a fitting correction coefficient; wherein the preset mathematical model is composed of a linear polynomial.

[0067] In some embodiments, in the preset mathematical model, the highest order term formed by the integral time is a second order term or a third order term, and the highest order term formed by the target surface temperature is a second order term or a third order term.

[0068] In some embodiments, the preset mathematical model is:

[0069]

[0070] in, is the mean response of the uncorrected pixel, G is the global bias, I is the integration time, T is the target surface temperature, the position coordinates of the pixel in the focal plane array are (i, j), V ij is the response value of the uncorrected pixel, a ij , b ij , c ij , d ij , e ij , f ij , g ij In the above preset mathematical model, it is preferred to set the highest order term formed by the integral time as a second order term, and the highest order term formed by the target surface temperature as a second order term.

[0071] Specifically, the response value of the pixel in the focal plane array and the collected data are linearly fitted according to the preset mathematical model to obtain the fitting correction coefficient. The collected data mentioned here are the collected data obtained after executing step 120. Combined with the description of step 120 in the above embodiment, before obtaining the fitting correction coefficient, corresponding to the first temperature change process, that is, the temperature up process, a series of collected data can be obtained by executing the first preset process, for example, but not limited to obtaining 1000 groups of collected data, each group of collected data includes target surface temperature, global bias and acquisition time. Corresponding to the second temperature change process, that is, the temperature down process, a series of collected data can be obtained by executing the first preset process, for example, but not limited to obtaining 1000 groups of collected data, each group of collected data includes target surface temperature, global bias and acquisition time. Combined with all the collected data of the two temperature change processes, according to the description of the above embodiment, step 130 needs to combine, for example, 2000 groups of data, each group of collected data includes target surface temperature, global bias and acquisition time, to fit each pixel in the focal plane array using the preset mathematical model to obtain the fitting correction coefficient.

[0072] In addition, for the response value of the pixel in the focal plane array mentioned above, corresponding to the preset mathematical model, V ij That is, the response value of the pixel corresponding to the position coordinate (i, j) in the focal plane array before the non-uniform correction is performed. The focal plane array is a matrix composed of i rows of pixels and j columns of pixels. The response value V of each pixel is obtained. ij back, is the mean response value of the uncorrected pixels, which is the response value V of each pixel. ij As the working temperature of the high and low temperature box changes, the obtained V ij and Therefore, a set of known parameters can be set, including target surface temperature, global bias, integration time, response value of uncorrected pixel and response mean of uncorrected pixel, and all sets of known parameters can be substituted into the preset mathematical model. According to the description of the above embodiment, for example, 2000 sets of known parameters can be substituted into the preset mathematical model, and then all fitting correction coefficients can be obtained by least squares fitting, that is, a can be obtained. ij , b ij , c ij , d ij , e ij , f ij , g ij The specific value of the focal plane array is obtained, and the fitting coefficients obtained are saved in the file according to the pixel coordinate position for easy reading and use later, thus completing the parameter calibration process for the focal plane array.

[0073] The embodiment of the present disclosure sets an optimized preset mathematical model, and models it based on the general physical model of the thermal infrared detector. It can take into account most of the influencing factors of the machine and the environment in the entire imaging process, optimize the universality of the corrected device, and have a good non-uniformity correction effect on most scenes. In addition, the preset mathematical model is set to be composed of linear polynomials, and the algorithm is simple, which is conducive to improving the efficiency of the non-uniformity correction process. In addition, in the embodiment of the present disclosure, the initial calibration is only performed once, and the fitting correction coefficient obtained by solving can be used for a long time and has strong adaptability. In addition, by introducing the influencing factors of global bias and integration time, even if there are scenarios where the global bias and integration time need to be adjusted during actual use, the non-uniformity correction method provided by the embodiment of the present disclosure can still ensure the correction effect.

[0074] S140, correcting the measured values ​​of the focal plane array according to the preset mathematical model and the fitting correction coefficient.

[0075] In some embodiments, the measured values ​​of the focal plane array are corrected according to a preset mathematical model and a fitting correction coefficient, including a loop executing a second preset process; wherein the second preset process includes: obtaining a first real-time target surface temperature, a first real-time global bias, a first real-time integration time, and a response value of an uncorrected pixel when the device to be corrected is not obstructed as measured acquisition data; and substituting the measured acquisition data and the fitting correction coefficient into the preset mathematical model to obtain the pixel response value after initial correction.

[0076] Specifically, the device to be calibrated is not obstructed during subsequent actual use. For each frame image in the process, the second preset process is executed, and the non-uniformity correction is performed frame by frame using the saved fitting correction coefficient, that is, the second preset process is executed multiple times in a cycle until the non-uniformity correction is completed for all frame images obtained by the device to be calibrated.

[0077] Corresponding to the second preset process, step 130 in the above embodiment has solved the fitting correction coefficient in the preset mathematical model. When the device to be corrected is not blocked, the first real-time target surface temperature, the first real-time global bias, the first real-time integration time and the response value of the uncorrected pixel are obtained as the measured acquisition data, and the measured acquisition data and the fitting correction coefficient are substituted into the preset mathematical model, that is, the first real-time target surface temperature, the first real-time global bias, the first real-time integration time, the response value of the uncorrected pixel, and the solved fitting correction coefficient are substituted into the preset mathematical model, and the description of the preset mathematical model in the above embodiment is referred to, thereby obtaining the initial corrected pixel response value. For each pixel in the focal plane array, the preset mathematical model can be used to obtain the initial corrected pixel response value, thereby completing the point-by-point non-uniformity correction of the focal plane array.

[0078] In some embodiments, before the second preset process is executed in a loop, it also includes: obtaining the second real-time target surface temperature, the second real-time global bias, the second real-time integration time and the response value of the uncorrected pixel when the device to be corrected is powered on and blocked by a baffle as basic acquisition data, and substituting the basic acquisition data and the fitting correction coefficient into the preset mathematical model to obtain the pixel response value after basic correction.

[0079] Specifically, before the second preset process is cyclically executed, that is, before the initial non-uniformity correction is performed on the focal plane array, a basic image can be acquired when the device to be corrected is powered on and shielded by a baffle, and a second real-time target surface temperature T is acquired. now , the second real-time global bias G now , the second real-time integration time I now and the response value V of the uncorrected pixel ij , read the stored fitting correction coefficients, substitute all the above parameters into the preset mathematical model for point-by-point correction, and you can get the pixel response value after basic correction The specific calculation process satisfies the following formula:

[0080]

[0081] In some embodiments, after obtaining the pixel response value after the initial correction, the second preset process further includes: performing a secondary single-point correction on the pixel response value after the initial correction according to the pixel response value after the basic correction to obtain the pixel response value after the secondary correction.

[0082] Specifically, after obtaining the pixel response value after the initial correction, two steps are cyclically executed in the second preset process to realize non-uniform correction frame by frame until the non-uniformity correction is completed for all frame images obtained by the device to be corrected. The first step is to obtain the first real-time target surface temperature, the first real-time global bias, the first real-time integration time and the response value of the uncorrected pixel when the device to be corrected is unobstructed as the measured acquisition data, and substitute the measured acquisition data and the fitting correction coefficient into the preset mathematical model to obtain the pixel response value after the initial correction. The second step is to perform a secondary single-point correction on the pixel response value after the initial correction according to the pixel response value after the basic correction to obtain the pixel response value after the secondary correction.

[0083] The above-mentioned embodiment has described the first step in detail. After executing the first step to obtain the initial corrected pixel response value, the initial corrected pixel response value is subjected to a secondary single-point correction based on the basic corrected pixel response value obtained in the above-mentioned embodiment to obtain the secondary corrected pixel response.

[0084] In some embodiments, the secondary single-point correction is implemented using the following formula:

[0085]

[0086] in, is the pixel response value after secondary correction, is the pixel response value after initial correction, is the pixel response value after basic correction, is the pixel response mean after basic correction, and the position coordinate of the pixel in the focal plane array is (i, j).

[0087] Specifically, the difference between the pixel response value after basic correction and the pixel response mean after basic correction is used as the offset of single-point correction, and the pixel response value after initial correction is compensated by the aforementioned drift amount to obtain the pixel response value after secondary correction, thereby completing the first correction, that is, the secondary single-point correction of the pixel response value after initial correction. In the embodiment of the present disclosure, since there are many influencing factors of non-uniformity introduced and a mathematical modeling with a relatively simple algorithm is adopted, the result after initial correction cannot be infinitely close to the effect of single-point correction. Therefore, the embodiment of the present disclosure continues to perform secondary correction on the basis of initial correction. The secondary single-point correction process can further remove the residual non-uniformity of the focal plane array, reduce the deviation caused by the fitting process, and improve the accuracy of non-uniformity correction.

[0088] It should be noted that the correction process of the embodiment of the present disclosure may include only the initial correction process, or may include both the initial correction process and the secondary correction process, and the embodiment of the present disclosure does not specifically limit this.

[0089] In addition, the existing calibration-based technical solutions require a baffle on the device when performing real-time single-point correction. However, the regular blocking of the screen for correction affects the continuous and smooth output of the image and also affects the subsequent image processing algorithm. In addition, when the ambient temperature changes greatly, the temperature of the baffle itself is uneven and has a large difference with the ambient temperature, which will cause the corrected image to still have large image noise.

[0090] In response to the above technical problems, the embodiment of the present disclosure obtains the basic collected data when the device to be calibrated is powered on and blocked by the baffle only before cyclically executing the second preset process. The baffle only needs to be blocked once each time the device to be calibrated is powered on, which will not affect the smoothness of the picture and the subsequent algorithm effects, thereby realizing a quasi-unobstructed correction solution with the advantages of no delay and high real-time performance.

[0091] To clearly show the specific process corresponding to step 110 to step 130, Figure 2 The following is a specific flow chart of a parameter calibration method in a non-uniformity correction process provided by an embodiment of the present disclosure. Figure 2 As shown, the parameter calibration method includes:

[0092] S210. The equipment to be calibrated is shielded with a normal temperature uniform temperature surface and placed in a high and low temperature box, and the high and low temperature box is set to the required working temperature range.

[0093] S220, controlling the high and low temperature box to cool down the working temperature to the lowest temperature and stabilize it for a preset time.

[0094] S230, controlling the working temperature of the high and low temperature box to gradually rise to the highest temperature. In this process, the global bias and integration time are dynamically adjusted with a fixed step size, the pixel response value is collected, and the aforementioned collected data of the heating process is saved.

[0095] S240, controlling the working temperature of the high and low temperature box to gradually cool down from the highest temperature to the lowest temperature, and similarly dynamically adjusting the global bias and integration time with a fixed step size, collecting pixel response values, and saving the aforementioned collected data of the cooling process.

[0096] S250, combining all the collected data of the heating process and the cooling process, using a preset mathematical model to perform fitting to obtain a fitting correction coefficient, and saving it pixel by pixel.

[0097] To clearly show the specific process corresponding to step 140, Figure 3 The following is a specific flow chart of a method for correcting non-uniformity frame by frame after parameter calibration provided by an embodiment of the present disclosure. Figure 3 As shown, the frame-by-frame non-uniformity correction method after parameter calibration includes:

[0098] S310, after the device to be calibrated is powered on, a pre-calibrated basic image base is obtained by shielding with a shielding sheet, and the pre-calibrated basic image base is calibrated point by point using a preset mathematical model and the calibration result is saved as a post-calibrated basic image base'.

[0099] S320, when the device to be calibrated is not blocked subsequently, the pre-calibrated image img is obtained, the pre-calibrated image img is initially calibrated point by point using a preset mathematical model, and the correction result is saved as the initial corrected image img'.

[0100] S330 , using the corrected base image base′ to perform secondary single-point correction on the initial corrected image img′ to obtain a final correction result.

[0101] It should be noted that if Figure 3 As shown, step 320 and step 330 are executed in a loop, and the initial correction and secondary single-point correction of one frame image are completed in each loop. The end condition of the loop execution is that the initial correction and secondary single-point correction of all frame images are completed.

[0102] The embodiment of the present disclosure sets the fitting process to comprehensively consider the application scenarios of heating and cooling, which is conducive to improving the accuracy of the final fitting result, so that the calibrated device can be applied to both the application scenarios of heating and the application scenarios of cooling, and optimizes the universality of the device application. In addition, the embodiment of the present disclosure is modeled based on the general physical model of the thermal infrared detector, which can take into account most of the influencing factors of the machine and the environment during the entire imaging process, and greatly improves the scene temperature calibration range, covers the continuous temperature range of general use scenarios, overcomes the problem of temperature drift error that may occur during use, and can still ensure the correction effect after adjusting the bias and integration time. In addition, the initial calibration only needs to be performed once, and the fitting correction coefficient can be used for a long time with strong adaptability. Therefore, the embodiment of the present disclosure forms a comprehensive correction parameter table through comprehensive modeling and calibration under a wide range of continuous temperatures, which can automatically adapt to common working conditions, increase the adaptability to the temperature of the object being photographed, and finally stably output high-quality imaging pictures.

[0103] Figure 4 A schematic diagram of the structure of a non-uniformity correction device for a focal plane array provided in an embodiment of the present disclosure is shown in FIG. Figure 4 As shown, the non-uniformity correction device of the focal plane array includes a temperature control module 410, a data acquisition module 420, a coefficient acquisition module 430 and a measured correction module 440, wherein the temperature control module 410 is used to control the working temperature of the high and low temperature box to undergo a first temperature change process and a second temperature change process according to a preset temperature adjustment method; wherein the high and low temperature box contains relatively arranged equipment to be corrected and a normal temperature uniform temperature surface, wherein the first temperature change process is a process of rising from the lowest working temperature to the highest working temperature, and the second temperature change process is a process of falling from the highest working temperature to the lowest working temperature. The data acquisition module 420 is used to perform a first preset process in both the first temperature change process and the second temperature change process; wherein the first preset process includes: collecting the target surface temperature of the focal plane array according to a preset period, and dynamically adjusting the global bias and the integration time according to the preset period with a preset range and a preset step size, and recording the target surface temperature, the global bias and the integration time at the same collection time as the collection data. The coefficient acquisition module 430 is used to perform linear fitting on the response values ​​of the pixels in the focal plane array and the collected data according to a preset mathematical model to obtain fitting correction coefficients; wherein the preset mathematical model is composed of linear polynomials. The measured correction module 440 is used to correct the measured values ​​of the focal plane array according to the preset mathematical model and the fitting correction coefficients.

[0104] The disclosed embodiment provides a non-uniformity correction device for a focal plane array, and sets a fitting process to comprehensively consider application scenarios of heating and cooling, which is conducive to improving the accuracy of the final fitting result, so that the corrected device can be applied to both application scenarios of heating and cooling, and optimizes the universality of device application. In addition, the disclosed embodiment is modeled based on the general physical model of the thermal infrared detector, and most of the influencing factors of the machine and the environment in the entire imaging process can be taken into account, and the scene temperature calibration range is greatly improved, covering the continuous temperature range of general use scenarios, overcoming the problem of temperature drift error that may occur during use, and the correction effect can still be guaranteed after adjusting the bias and integration time. In addition, the initial calibration only needs to be performed once, and the fitting correction coefficient can be used for a long time, and has strong adaptability. Therefore, the disclosed embodiment forms a comprehensive correction parameter table through comprehensive modeling and calibration under a wide range of continuous temperatures, which can automatically adapt to common working conditions, increase the adaptability to the temperature of the object being photographed, and finally stably output high-quality imaging pictures.

[0105] Figure 5 The structure diagram of an electronic device provided by an embodiment of the present disclosure is shown in FIG. Figure 5 As shown, the electronic device includes: at least one processor 510, at least one memory 520 and at least one communication interface 530. The various components in the electronic device are coupled together through a bus system 540. The communication interface 530 is used to transmit information between external devices. It can be understood that the bus system 540 is used to achieve connection and communication between these components. In addition to the data bus, the bus system 540 also includes a power bus, a control bus and a status signal bus. However, for the sake of clarity, Figure 5 Various buses are labeled as bus system 540 .

[0106] It can be understood that the memory 520 in this embodiment can be a volatile memory or a non-volatile memory, or can include both volatile and non-volatile memories. In some embodiments, the memory 520 stores the following elements, executable units or data structures, or their subsets, or their extended sets: operating system and application programs. Among them, the operating system includes various system programs, such as a framework layer, a core library layer, a driver layer, etc., which are used to implement various basic services and process hardware-based tasks. The application program includes various applications, such as a media player (MediaPlayer), a browser (Browser), etc., which are used to implement various application services. The program for implementing the non-uniformity correction method of the focal plane array provided in the embodiment of the present disclosure can be included in the application program.

[0107] In the embodiment of the present disclosure, the processor 510 calls the program or instruction stored in the memory 520, specifically, the program or instruction stored in the application program, and the processor 510 is used to execute the steps of each embodiment of the non-uniformity correction method of the focal plane array provided in the embodiment of the present disclosure.

[0108] The non-uniformity correction method of the focal plane array provided in the embodiment of the present disclosure can be applied to the processor 510, or implemented by the processor 510. The processor 510 can be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by an integrated logic circuit of hardware in the processor 510 or an instruction in the form of software. The above-mentioned processor 510 can be a general-purpose processor, a digital signal processor (Digital Signal Processor, DSP), an application-specific integrated circuit (Application Specific Integrated Circuit, ASIC), a field programmable gate array (Field Programmable Gate Array, FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc.

[0109] The steps of the non-uniformity correction method of the focal plane array provided in the embodiment of the present disclosure can be directly embodied as being executed by a hardware decoding processor, or being executed by a combination of hardware and software units in the decoding processor. The software unit can be located in a mature storage medium in the art such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory, or an electrically erasable programmable memory, a register, etc. The storage medium is located in the memory 520, and the processor 510 reads the information in the memory 520 and completes the steps of the method in combination with its hardware.

[0110] The electronic device may also include one entity component or multiple entity components to implement correction of the non-uniformity of the focal plane array according to the instructions generated by the processor 510 when executing the non-uniformity correction method of the focal plane array provided in the embodiment of the present disclosure. Each entity component cooperates with the processor 510 and the memory 520 to implement the functions of the electronic device in this embodiment.

[0111] The present disclosure also provides a storage medium, such as a computer-readable storage medium, which stores a program or instruction. The program or instruction enables a computer to execute a method for correcting non-uniformity of a focal plane array, the method comprising:

[0112] The working temperature of the high and low temperature box is controlled to undergo a first temperature change process and a second temperature change process according to a preset temperature adjustment method; wherein the high and low temperature box contains relatively arranged equipment to be calibrated and a normal temperature uniform temperature surface, the first temperature change process is a process of rising from the lowest working temperature to the highest working temperature, and the second temperature change process is a process of falling from the highest working temperature to the lowest working temperature;

[0113] In both the first temperature change process and the second temperature change process, a first preset process is performed; wherein the first preset process includes: collecting the target surface temperature of the focal plane array according to a preset period, and dynamically adjusting the global bias and the integration time according to the preset period with a preset range and a preset step size, and recording the target surface temperature, the global bias and the integration time at the same collection time as collection data;

[0114] Performing linear fitting on the response values ​​of the pixels in the focal plane array and the collected data according to a preset mathematical model to obtain a fitting correction coefficient; wherein the preset mathematical model is composed of a linear polynomial;

[0115] The measured values ​​of the focal plane array are corrected according to the preset mathematical model and the fitting correction coefficient.

[0116] Optionally, when executed by a computer processor, the computer executable instructions may also be used to execute the technical solution of the focal plane array non-uniformity correction method provided by any embodiment of the present disclosure.

[0117] Through the above description of the implementation methods, the technical personnel in the relevant field can clearly understand that the present disclosure can be implemented by means of software and necessary general hardware, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present disclosure is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as a computer floppy disk, a read-only memory (ROM), a random access memory (RAM), a flash memory (FLASH), a hard disk or an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods of each embodiment of the present disclosure.

[0118] It should be noted that some of the individual steps described in the embodiments of the present disclosure include multiple implementation methods, and the different implementation methods between the supplements can be combined arbitrarily, all of which belong to the protection scope of the present disclosure.

[0119] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0120] The above are only specific embodiments of the present disclosure, so that those skilled in the art can understand or implement the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to these embodiments herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for correcting non-uniformity of a focal plane array, characterized in that: include: The working temperature of the high and low temperature box is controlled to undergo a first temperature change process and a second temperature change process according to a preset temperature adjustment method; wherein the high and low temperature box contains relatively arranged equipment to be calibrated and a normal temperature uniform temperature surface, the first temperature change process is a process of rising from the lowest working temperature to the highest working temperature, and the second temperature change process is a process of falling from the highest working temperature to the lowest working temperature; In both the first temperature change process and the second temperature change process, a first preset process is performed; wherein the first preset process includes: collecting the target surface temperature of the focal plane array according to a preset period, and dynamically adjusting the global bias and the integration time according to the preset period with a preset range and a preset step size, and recording the target surface temperature, the global bias and the integration time at the same collection time as collection data; According to a preset mathematical model, a comprehensive linear fitting is performed on the response value of the pixel in the focal plane array, the first acquisition data, and the second acquisition data to obtain a fitting correction coefficient, so that the corrected focal plane array is suitable for both heating and cooling application scenarios; wherein the preset mathematical model is composed of a linear polynomial, the first acquisition data is the acquisition data corresponding to the first temperature change process, the second acquisition data is the acquisition data corresponding to the second temperature change process, and the number of groups of acquisition data for comprehensive linear fitting is the sum of the number of groups of the first acquisition data and the number of groups of the second acquisition data; The measured values ​​of the focal plane array are corrected according to the preset mathematical model and the fitting correction coefficient.

2. The method for correcting non-uniformity of a focal plane array according to claim 1, characterized in that: In the preset mathematical model, the highest order term formed by the integral time is a second order term or a third order term, and the highest order term formed by the target surface temperature is a second order term or a third order term.

3. The method for correcting non-uniformity of a focal plane array according to claim 2, characterized in that: The preset mathematical model is: in, is the response mean of the uncorrected pixel, G is the global bias, I is the integration time, T is the target surface temperature, the position coordinates of the pixel in the focal plane array are (i, j), V ij is the response value of the uncorrected pixel, a ij , b ij , c ij , d ij , e ij , f ij , g ij is the fitting correction coefficient.

4. The method for correcting non-uniformity of a focal plane array according to claim 1, characterized in that: The step of correcting the measured value of the focal plane array according to the preset mathematical model and the fitting correction coefficient comprises cyclically executing a second preset process; wherein the second preset process comprises: Acquire a first real-time target surface temperature, a first real-time global bias, a first real-time integration time and a response value of an uncorrected pixel when the device to be corrected is not blocked as measured acquisition data; Substitute the measured acquisition data and the fitting correction coefficient into the preset mathematical model to obtain the pixel response value after initial correction.

5. The method for correcting non-uniformity of a focal plane array according to claim 4, characterized in that: Before the loop executes the second preset process, the method further includes: Acquire the second real-time target surface temperature, the second real-time global bias, the second real-time integration time and the response value of the uncorrected pixel when the device to be corrected is powered on and shielded by the shielding sheet as basic acquisition data; Substitute the basic acquisition data and the fitting correction coefficient into the preset mathematical model to obtain the pixel response value after basic correction.

6. The method for correcting non-uniformity of a focal plane array according to claim 5, characterized in that: After obtaining the pixel response value after the initial correction, the second preset process further includes: A secondary single-point correction is performed on the initially corrected pixel response value according to the basic corrected pixel response value to obtain a secondary corrected pixel response value.

7. The method for correcting non-uniformity of a focal plane array according to claim 6, characterized in that: The secondary single-point correction is achieved using the following formula: in, is the pixel response value after the secondary correction, is the pixel response value after the initial correction, is the pixel response value after the basic correction, is the pixel response mean after the basic correction, and the position coordinate of the pixel in the focal plane array is (i, j).

8. The method for correcting non-uniformity of a focal plane array according to claim 1, characterized in that: The method of controlling the working temperature of the high and low temperature box according to the preset temperature adjustment method to undergo a first temperature change process and a second temperature change process includes: The working temperature of the high and low temperature box is controlled to undergo the first temperature change process and the second temperature change process at a fixed temperature step at a preset time interval; wherein the temperature step is smaller than a preset temperature step.

9. The method for correcting non-uniformity of a focal plane array according to claim 1, characterized in that: Also includes: The operating temperature of the high and low temperature box is controlled to cover the preset operating temperature range of the device to be calibrated, and the response mean of the pixel is controlled to be within the preset response mean range.

10. A non-uniformity correction device for a focal plane array, characterized in that: include: The temperature control module is used to control the working temperature of the high and low temperature box to undergo a first temperature change process and a second temperature change process according to a preset temperature adjustment method; wherein the high and low temperature box contains relatively arranged equipment to be calibrated and a normal temperature uniform temperature surface, the first temperature change process is a process of rising from the lowest working temperature to the highest working temperature, and the second temperature change process is a process of falling from the highest working temperature to the lowest working temperature; A data acquisition module, configured to execute a first preset process in both the first temperature change process and the second temperature change process; wherein the first preset process includes: acquiring the target surface temperature of the focal plane array according to a preset period, dynamically adjusting the global bias and the integration time according to the preset period in a preset range and a preset step size, and respectively recording the target surface temperature, the global bias and the integration time at the same acquisition time as acquisition data; a coefficient acquisition module, configured to perform a comprehensive linear fitting on the response values ​​of the pixels in the focal plane array, the first acquisition data, and the second acquisition data according to a preset mathematical model to obtain a fitting correction coefficient, so that the corrected focal plane array is suitable for both heating and cooling application scenarios; wherein the preset mathematical model is composed of a linear polynomial, the first acquisition data is the acquisition data corresponding to the first temperature change process, the second acquisition data is the acquisition data corresponding to the second temperature change process, and the number of groups of acquisition data for comprehensive linear fitting is the sum of the number of groups of the first acquisition data and the number of groups of the second acquisition data; A measurement correction module is used to correct the measured value of the focal plane array according to the preset mathematical model and the fitting correction coefficient.

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