Conveyance device for substrate grinding, conveyance apparatus, and substrate grinding apparatus

Abstract

The application discloses a carrying device for substrate grinding, a carrying equipment and a substrate grinding equipment. The carrying device for substrate grinding comprises a supporting part for moving a substrate, and a holding part installed on the supporting part for adsorbing the substrate. The holding part comprises a supporting frame fixedly arranged on the supporting part, a suction pad telescopically arranged on the supporting frame, and a ring-shaped suction disc fixedly arranged on the supporting frame and concentric with the suction pad. The holding part comprises a first adsorption mode for adsorbing the substrate through the suction pad and a second adsorption mode for adsorbing the substrate through the ring-shaped suction disc.

Description

Technical Field

[0001] This application belongs to the field of substrate processing technology, and more specifically, relates to a handling device, handling equipment, and substrate grinding equipment for substrate grinding. Background Technology

[0002] The ultra-precision thinning equipment mainly integrates ultra-precision grinding, CMP and cleaning modules, thickness deviation and surface defect control technology, so as to meet the needs of substrate ultra-precision thinning technology in 3D IC manufacturing, advanced packaging and other fields.

[0003] In ultra-precision thinning equipment, a robotic arm typically picks up the substrate using a small-sized suction pad and transports it to a suction device in the loading / unloading area. The suction device then carries the substrate on a rotary table to the grinding area for grinding. After grinding, the rotary table rotates again, returning the substrate to the loading / unloading area, where the robotic arm again picks it up from the suction device using a small-sized suction pad. After passing through a cleaning unit, the substrate is transferred to a substrate transfer table for subsequent polishing and other processes.

[0004] However, due to residual stress after grinding, the substrate still has some warping. The small-sized adsorption pad of the robot has limited adsorption capacity, which can easily lead to incomplete cleaning of the substrate or the substrate falling off. Summary of the Invention

[0005] This application provides a handling device, handling equipment, and substrate grinding equipment for substrate grinding, aiming to solve at least one of the technical problems existing in the prior art.

[0006] A first aspect of this application provides a transport device for substrate grinding, comprising: a support member for moving a substrate; and a holding member mounted on the support member for adsorbing the substrate. The holding member includes: a support frame fixedly disposed on the support member; an adsorption pad retractably disposed on the support frame; and an annular suction cup fixedly disposed on the support frame and concentric with the adsorption pad. The holding member includes a first adsorption mode in which the substrate is adsorbed through the adsorption pad, and a second adsorption mode in which the substrate is adsorbed through the annular suction cup.

[0007] In one embodiment, the support frame includes a support arm and a support base, and the adsorption pad is telescopically disposed on the support frame through the support base; the annular suction cup includes at least two annular sealing portions disposed on the support base, and an adsorption channel between the at least two annular sealing portions; the annular sealing portion protrudes from the surface of the support base, and the diameter of the annular sealing portion is smaller than the diameter of the substrate.

[0008] In one embodiment, the support frame further includes an elastic pressing portion disposed on the outer periphery of the annular suction cup, and its diameter is greater than or equal to the diameter of the substrate.

[0009] In one embodiment, the annular sealing portion and / or the elastic pressing portion is an annular sealing ring made of rubber material.

[0010] In one embodiment, the at least two annular sealing portions are two annular sealing portions. The outer peripheral diameter h1 of the outer annular sealing portion is equal to L, and the diameter h2 of the inner annular sealing portion satisfies the following condition: L / 3 < h2 < 3L / 5, where L is the diameter of the substrate.

[0011] In one embodiment, the support member includes a lifting component, and the lifting component includes a lifting structure and a rotating structure. The lifting structure is used to drive the holding member to lift, and the rotating structure is used to drive the holding component to rotate around the end of the support frame away from the adsorption pad as an axis.

[0012] In a second aspect of the embodiments of the present application, a handling device is provided, including an adsorption device and the handling device as described above.

[0013] In one embodiment, the support frame includes a support arm and a support base. The adsorption pad is telescopically disposed on the support frame through the support base; the annular suction cup includes at least two layers of annular sealing portions disposed on the support base, and a suction channel between the at least two layers of annular sealing portions; the annular sealing portion protrudes from the surface of the support base, and the diameter of the annular sealing portion is smaller than the diameter of the substrate.

[0014] In one embodiment, the at least two annular sealing portions are two annular sealing portions. The outer peripheral diameter h1 of the outer annular sealing portion is equal to L, and the diameter h2 of the inner annular sealing portion satisfies the following condition: L / 3 < h2 < 3L / 5, where L is the diameter of the substrate.

[0015] In a third aspect of the embodiments of the present application, a substrate grinding equipment is provided, including an adsorption device and the handling device as described above.

[0016] Advantages of the present application: When transporting a substrate that has not been ground to the adsorption device, the substrate can be adsorbed in the first adsorption mode through the telescopic adsorption pad; when removing the ground substrate from the adsorption device, the substrate can be adsorbed in the second adsorption mode through the annular suction cup. Since the annular suction cup has a large adsorption area and strong adsorption ability, it can尽量 avoid the situation of the substrate falling off when passing through the cleaning unit, and can提高 the upper limit of the flow rate and flow volume of the fluid sprayed by the cleaning unit, thereby improving the cleaning effect of the substrate. Description of the Drawings

[0017] The advantages of this application will become clearer and easier to understand through the detailed description in conjunction with the following accompanying drawings, which are merely illustrative and do not limit the scope of protection of this application, wherein:

[0018] Figure 1 This is a schematic diagram of the structure of an existing ultra-precision thinning device;

[0019] Figure 2 This is a schematic diagram of an existing method for handling and cleaning a substrate after grinding.

[0020] Figure 3 This is a schematic diagram of a conveying device for substrate grinding according to this application;

[0021] Figure 4 This is a schematic diagram of the structure of a holding component in a conveying device according to this application;

[0022] Figure 5 This is a bottom view of a holding component in a conveying device according to this application;

[0023] Figure 6 This is a bottom view of another holding component in a conveying device according to this application.

[0024] 1. Body; 2. Cleaning unit; 3. Imaging unit; 4. Substrate transfer worktable; 5. Substrate storage box before grinding; 6. Substrate storage box after grinding; 7. Substrate handling robot; 8. CMP handling robot; 9. CMP and cleaning unit; 10. Mounting beam; 11. Rotary table; 20. Rough grinding unit; 30. Fine grinding unit; 40. Adsorption device; 50. Grinding and handling robot; 51. Small-sized adsorption pad.

[0025] Support component 60, retaining component 70, support frame 71, support arm 711, support base 712, adsorption pad 72, annular suction cup 73, first annular sealing part 731, second annular sealing part 732, third annular sealing part 733, elastic pressing part 74. Detailed Implementation

[0026] The technical solutions described in this application will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of this application, used to illustrate the concept of this application; these descriptions are illustrative and exemplary, and should not be construed as limiting the implementation methods or the scope of protection of this application. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and description of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein.

[0027] The accompanying drawings in this specification are schematic diagrams used to illustrate the concept of this application and to schematically show the shapes of the various parts and their interrelationships. It should be understood that, in order to clearly show the structure of the various components of the embodiments of this application, the drawings are not drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.

[0028] The embodiments disclosed in this application generally relate to thinning equipment used in the semiconductor device manufacturing industry.

[0029] The ultra-precision thinning equipment mainly integrates ultra-precision grinding, CMP and cleaning modules, thickness deviation and surface defect control technology, so as to meet the needs of substrate ultra-precision thinning technology in 3D IC manufacturing, advanced packaging and other fields.

[0030] Backside thinning of the substrate refers to the high-precision grinding of semiconductor materials before packaging to reduce their morphology to a suitable shape, thereby reducing the packaging height, chip package volume, and improving the chip's thermal diffusion efficiency, electrical performance, and mechanical performance.

[0031] Figure 1 An exemplary structural schematic diagram of an ultra-precision thinning device is shown in the figure. It includes: a machine body 1, a cleaning unit 2, an imaging unit 3, a substrate transfer worktable 4, a pre-grinding substrate storage box 5, a post-grinding substrate storage box 6, a substrate handling robot 7, a CMP handling robot 8, a CMP and cleaning unit 9, a mounting beam 10, a rotary table 11, a rough grinding unit 20, a fine grinding unit 30, an adsorption device 40, and a grinding handling robot 50. All of the above components are mounted on the machine body 1.

[0032] When the substrate is processed by the ultra-precision thinning equipment, the substrate transport robot 7 first takes the substrate from the pre-grinding substrate storage box 5 and places it on the substrate transfer worktable 4. The imaging unit 3 takes pictures of the substrate, and the shape of the substrate before thinning can be determined by taking pictures.

[0033] The substrate transfer table 4 can move along the guide rail to directly below the grinding and handling robot 50. The grinding and handling robot 50 has a lifting mechanism and a horizontal rotation mechanism and can adsorb the substrate. The grinding and handling robot 50 can be used to transfer the substrate to the adsorption device 40 at the position of the transfer in and transfer out area A.

[0034] The adsorption device 40 is mounted on the rotary table 11 and is evenly arranged at 120° intervals along the circumference. The adsorption device 40 has a disc-shaped suction cup made of porous ceramic material, which can adsorb the substrate by drawing a vacuum.

[0035] The rotary table 11 can rotate at 120° intervals along the direction of arrow 12 via a drive mechanism (not shown). The rotary table 11 rotates 120° and the substrate enters the rough grinding processing area B from the loading / unloading area A, where it is rough-processed using the rough grinding unit 20. After the rough grinding is completed, the rotary table 11 rotates 120° again and the substrate enters the fine grinding processing area C, where it is fine-ground using the fine grinding unit 30. After the fine grinding is completed, the rotary table 11 rotates 120° again and the substrate returns to the loading / unloading area A.

[0036] The grinding and handling robot 50 picks up the wafer from the adsorption device 40, and after passing through the cleaning unit 2, it is transferred to the substrate transfer table 4. The CMP handling robot 8 picks up the wafer from the substrate transfer table 4 and transfers it to the CMP and cleaning unit 9. After CMP polishing and cleaning, it is transported by the substrate handling robot 7 to the grinding substrate storage box 6, thereby completing the thinning and polishing process of the substrate.

[0037] See Figure 2 The grinding and handling robot 50 can be equipped with a small-sized adsorption pad 51 at its center for adsorbing the substrate, thereby realizing the handling of the substrate in the above process. During the handling process, it can pass over the cleaning unit 2 to rinse the substrate through the nozzle 21. The dotted line in the figure shows the schematic rinsing range of the substrate rinsed by the nozzle 21.

[0038] However, after the substrate grinding is completed, when the adsorption device 40 releases the adsorption, due to the presence of residual stress, the substrate still has a certain degree of warping, which causes the small-sized adsorption pad 51 to not receive the rinsing of the nozzle 21 in a completely horizontal state when the substrate is adsorbed by the cleaning unit 2.

[0039] Due to the small size of the adsorption pads, the adsorption area and adsorption force are limited. During the rinsing process in the cleaning unit, since the substrate is not in a completely horizontal state, the impact force of the two fluids may cause the substrate to fall off. Furthermore, the insufficient adsorption force of the small-sized adsorption pads limits the flow rate and volume of the two fluids, resulting in poor substrate cleaning effect and affecting subsequent processes.

[0040] In view of this, this application provides another substrate handling solution. The handling solution will be described below through specific embodiments.

[0041] See Figure 3-6 The figure shows a conveying device for substrate grinding, which includes a support member 60 and a holding member 70.

[0042] The support member 60 is used to move the holding member 70, thereby moving the substrate.

[0043] See Figure 3 The support component 60 can drive the holding component 70 to rise, fall, and rotate, thereby driving the substrate to move.

[0044] The retaining component 70 is mounted on the supporting component 60 and is used to adsorb the substrate.

[0045] In this embodiment, see Figure 4 The holding component 70 includes: a support frame 71, fixedly disposed on the support component 60; an adsorption pad 72, retractably disposed on the support frame 71; and an annular suction cup 73, fixedly disposed on the support frame 71 and concentric with the adsorption pad 72. The holding component 70 includes a first adsorption mode in which the substrate is adsorbed by the adsorption pad 72, and a second adsorption mode in which the substrate is adsorbed by the annular suction cup 73.

[0046] In this embodiment, when transporting the substrate that has not yet been ground to the adsorption device, the substrate can be adsorbed using the first adsorption mode via the retractable adsorption pad 72; when removing the ground substrate from the adsorption device, the substrate can be adsorbed using the second adsorption mode via the annular suction cup 73. Because the annular suction cup 73 has a large adsorption area and strong adsorption capacity, it can minimize the risk of substrate falling off when passing through the cleaning unit, and can increase the upper limit of the flow rate and volume of the fluid sprayed from the cleaning unit, thereby improving the cleaning effect of the substrate.

[0047] In any embodiment of this application, the support frame 71 includes a support arm 711 and a support base 712, and the adsorption pad 72 is telescopically disposed on the support frame 71 through the support base 712; the annular suction cup 73 includes at least two annular sealing portions disposed on the support base 712, and an adsorption channel between the at least two annular sealing portions; the annular sealing portion protrudes from the surface of the support base 712, and the diameter of the annular sealing portion is smaller than the diameter of the substrate.

[0048] The adsorption pad 72 is telescopically mounted via the support frame 71, and the annular suction cup 73 is mounted via the support base 712, so that the adsorption pad 72 and the annular suction cup 73 do not interfere with each other.

[0049] Since there are residual contaminants on the surface of the substrate after grinding, the substrate surface is not easy to be adsorbed. In this application, by providing at least two layers of annular sealing parts on the support 712, it is easier to form a sealed environment, improve the adsorption effect, and reduce the adsorption difficulty.

[0050] The annular seal can be formed of a material that can contact and seal with the substrate, such as rubber.

[0051] Of course, in other implementations of this application, the annular suction cup 73 can also be a circular suction cup made of porous ceramic material, etc., and may not have an annular sealing part. As long as it can perform annular adsorption on the substrate, it is all within the protection scope of this application.

[0052] In any embodiment of the present application, the support frame 71 further includes an elastic pressing part 74, which is arranged on the outer periphery of the annular suction cup 73 and has a diameter greater than or equal to the diameter of the substrate. When transporting the ungrinded substrate to the adsorption device, the substrate may be warped, and the elastic pressing part 74 can assist the adsorption device to complete the adsorption of the substrate.

[0053] When the diameter of the elastic pressing part 74 is equal to the diameter of the substrate, the outer periphery of the substrate can be flattened to the adsorption device through the elastic pressing part 74, and the adsorption device can directly adsorb the flattened substrate.

[0054] When the diameter of the elastic pressing part 74 is greater than the diameter of the substrate, the elastic pressing part 74 can be in contact with the adsorption device to form a sealed environment. The adsorption device can make the sealed environment form a negative pressure. The elastic pressing part 74 is further applied with a downward suction force under the action of the negative pressure and is converted into a pressure on the substrate. The substrate is adsorbed by the adsorption device under the action of the negative pressure and the pressure.

[0055] In any embodiment of the present application, the annular sealing part and / or the elastic pressing part 74 is an annular sealing ring made of rubber material. Thus, the existing annular sealing ring made of rubber material can be directly used without increasing the cost of additional mold opening.

[0056] In order to control the deformation amount of the annular sealing part and the elastic pressing part 74, different rubber materials can be used for the annular sealing part and the elastic pressing part 74. For example, the elastic pressing part 74 uses a soft rubber material and the annular sealing part uses a hard rubber material.

[0057] In any embodiment of the present application, the at least two annular sealing parts are two annular sealing parts. The outer peripheral diameter h1 of the outer annular sealing part = L, and the diameter h2 of the inner annular sealing part meets the following conditions: L / 3 < h2 < 3L / 5, where L is the diameter of the substrate.

[0058] See Figure 5 , which shows a schematic diagram of the annular suction cup 73 having two annular sealing parts. As shown in the figure, the outer annular sealing part is specifically the first annular sealing part 731, and the inner annular sealing part is the second annular sealing part 732. The diameter of the first annular sealing part 731 is h1, and h1 = L, where L is the diameter of the substrate. Specifically, due to the certain thickness of the first annular sealing part 731, its diameter can specifically be based on the outermost side to ensure that the first annular sealing part 731 can be aligned with the outer periphery of the substrate, so that when the substrate is adsorbed through the second adsorption mode and passes through the cleaning unit, the cleaning liquid sprayed by the cleaning unit will not enter the surface where the substrate is adsorbed, avoiding the influence of the cleaning liquid on the adsorption effect.

[0059] See Figure 6, which shows a schematic diagram of the annular suction cup 73 having three annular sealing portions. As shown in the figure, it further includes a third annular sealing portion 733, and the diameter h3 of the third annular sealing portion 733 = (h1 + h2) / 2. By providing a plurality of annular sealing portions, the contact points between the annular sealing portions and the substrate can be increased to prevent substrate fragments.

[0060] Another embodiment of the present application provides a handling device, including an adsorption device and a handling device.

[0061] The handling device includes: a support member for driving the substrate to move; a holding member mounted on the support member for adsorbing the substrate; the holding member includes: a support frame fixedly provided on the support member; an adsorption pad telescopically provided on the support frame; an annular suction cup fixedly provided on the support frame and concentric with the adsorption pad; the holding member includes a first adsorption mode of adsorbing the substrate through the adsorption pad and a second adsorption mode of adsorbing the substrate through the annular suction cup.

[0062] Optionally, in any embodiment of the present application, the support frame includes a support arm and a support seat, and the adsorption pad is telescopically provided on the support frame through the support seat; the annular suction cup includes at least two layers of annular sealing portions provided on the support seat and a suction channel between the at least two layers of annular sealing portions; the annular sealing portion protrudes from the surface of the support seat, and the diameter of the annular sealing portion is smaller than the diameter of the substrate.

[0063] Optionally, in any embodiment of the present application, the support frame further includes an elastic pressing portion provided on the outer periphery of the annular suction cup, and its diameter is greater than or equal to the diameter of the substrate.

[0064] Optionally, in any embodiment of the present application, the annular sealing portion and / or the elastic pressing portion is an annular sealing ring made of rubber material.

[0065] Optionally, in any embodiment of the present application, the at least two annular sealing portions are two annular sealing portions, the outer peripheral diameter h1 of the outer annular sealing portion = L, and the diameter h2 of the inner annular sealing portion satisfies the following condition: L / 3 < h2 < 3L / 5, where L is the diameter of the substrate.

[0066] Optionally, in any embodiment of the present application, the support member includes a lifting structure and a rotating structure, the lifting structure is used to drive the holding member to lift, and the rotating structure is used to drive the holding component to rotate with the end of the support frame away from the adsorption pad as the axis.

[0067] The specific structure and usage method of the handling device can refer to the above embodiments and will not be elaborated here.

[0068] Another embodiment of this application provides a substrate grinding apparatus using the above-described conveying device. The specific structure of the substrate grinding apparatus can be found in [reference needed]. Figure 1 .

[0069] certainly, Figure 1 The present invention uses a two-stage grinding process as an example for illustration. In other implementations, the substrate grinding equipment may also include one or more grinding processes, all of which are within the scope of protection of this application.

[0070] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0071] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A conveying device for substrate grinding, characterized in that, Comprising: A supporting component for driving the substrate to move; A holding component mounted on the supporting component for adsorbing the substrate; The holding component includes: a support frame fixedly arranged on the supporting component; an adsorption pad telescopically arranged on the support frame; an annular suction cup fixedly arranged on the support frame and concentric with the adsorption pad; the holding component includes a first adsorption mode of adsorbing the substrate through the adsorption pad and a second adsorption mode of adsorbing the substrate through the annular suction cup; the support frame includes a support arm and a support seat, and the adsorption pad is telescopically arranged on the support frame through the support seat; the annular suction cup includes at least two layers of annular sealing parts arranged on the support seat and a suction channel between the at least two layers of annular sealing parts; the annular sealing part protrudes from the surface of the support seat, and the diameter of the annular sealing part is smaller than the diameter of the substrate; the support frame further includes an elastic pressing part arranged on the outer periphery of the annular suction cup, and its diameter is greater than or equal to the diameter of the substrate.

2. The conveying device according to claim 1, characterized in that, The annular sealing part and / or the elastic pressing part is an annular sealing ring made of rubber material.

3. The conveying device according to claim 1 or 2, characterized in that, The at least two layers of annular sealing parts are two annular sealing parts. The outer peripheral diameter h1 of the outer annular sealing part = L, and the diameter h2 of the inner annular sealing part meets the following conditions: L / 3 < h2 < 3L / 5, where L is the diameter of the substrate.

4. The conveying device according to claim 1, characterized in that, The supporting component includes a lifting structure and a rotating structure. The lifting structure is used to drive the holding component to lift, and the rotating structure is used to drive the holding component to rotate with the end of the support frame far away from the adsorption pad as the axis.

5. A handling device, characterized in that, Comprising an adsorption device and a handling device. The handling device includes: a supporting component for driving the substrate to move; a holding component mounted on the supporting component for adsorbing the substrate; the holding component includes: a support frame fixedly arranged on the supporting component; an adsorption pad telescopically arranged on the support frame; an annular suction cup fixedly arranged on the support frame and concentric with the adsorption pad; the holding component includes a first adsorption mode of adsorbing the substrate through the adsorption pad and a second adsorption mode of adsorbing the substrate through the annular suction cup; the support frame includes a support arm and a support seat, and the adsorption pad is telescopically arranged on the support frame through the support seat; the annular suction cup includes at least two layers of annular sealing parts arranged on the support seat and a suction channel between the at least two layers of annular sealing parts; the annular sealing part protrudes from the surface of the support seat, and the diameter of the annular sealing part is smaller than the diameter of the substrate; the support frame further includes an elastic pressing part arranged on the outer periphery of the annular suction cup, and its diameter is greater than or equal to the diameter of the substrate.

6. The handling equipment according to claim 5, characterized in that, The supporting component includes a lifting structure and a rotating structure. The lifting structure is used to drive the holding component to lift, and the rotating structure is used to drive the holding component to rotate with the end of the support frame far away from the adsorption pad as the axis.

7. A substrate grinding equipment, characterized in that, Comprising the handling device according to any one of claims 1 to 4.

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