Glass and electronic equipment

By preparing glass substrates with a specific ratio of oxides, the problems of ultra-thinness, high precision, and cost of PCB substrates in Mini/Micro LED display technology are solved. This provides glass substrates with high reflectivity, low coefficient of expansion, and excellent chemical stability, which are suitable for Mini LED backplanes.

CN118239678BActive Publication Date: 2026-06-30SICHUAN HONGKE INNOVATION TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SICHUAN HONGKE INNOVATION TECH CO LTD
Filing Date
2024-03-11
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing PCB substrates cannot meet the requirements of ultra-thin, high-precision circuit boards in Mini/Micro LED display technology, resulting in insufficient cost competitiveness, and the mechanical properties of glass substrates need to be improved.

Method used

By using a specific ratio of oxides, including a mixture of SiO2, Al2O3, Na2O, K2O, MgO, ZrO2, Li2O, B2O3, P2O5 and CaO, a glass substrate with high reflectivity, low expansion coefficient and excellent chemical stability is prepared to meet the requirements of Mini LED backplanes.

Benefits of technology

It provides high-gloss, acid and alkali resistant, low-expansion, and high thermal conductivity glass substrates suitable for Mini LED backplanes, with lower cost and meeting market requirements.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

This application provides a glass and an electronic device, relating to the field of glass. The raw materials of the glass include the following components by mass percentage of oxides: SiO2 57-62%, Al2O3 4-8%, Na2O 1-5%, K2O 0-3%, MgO 3-8%, ZrO2 0-2%, Li2O 0-3%, B2O3 0-5%, P2O5 5-10%, CaO 12-18%, ZnO 0-5%. This glass exhibits excellent acid resistance, alkali resistance, and water resistance. It also possesses high flatness, high reflectivity, low expansion, high thermal conductivity, and good chemical stability.
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Description

Technical Field

[0001] This application relates to the field of glass, and more specifically, to a glass and electronic device. Background Technology

[0002] The substrate is one of the fundamental components of a liquid crystal display device, primarily serving to support circuit elements and fix liquid crystal molecules. Currently, Mini LED panels are widely used in televisions, IT displays, and automobiles. As the market penetration rate of Mini LED panels continues to increase, the demand for upstream substrates is also growing. PCB substrates, as the mainstream substrate in the LED display market, have advantages such as mature technology and low cost. However, the abundant supply of PCB substrates has gradually diminished their advantages. This is because Mini / Micro LED display technology places increasingly higher demands on the precision of circuit boards, and if PCB substrates are to develop towards ultra-thin and high-precision designs, their costs will increase significantly, thus losing cost competitiveness. The market urgently needs a new material to replace it, and glass substrates have emerged as a solution. Glass substrates offer better thermal conductivity, lower thermal stability after heating, and less physical deformation. In particular, their smoothness and flatness are outstanding, effectively reducing the difficulty of mass transfer processes and improving yield. Under the same physical and electrical properties, glass substrates are also easier to make ultra-thin, making them more suitable for backlight applications. However, the mechanical properties of glass need further improvement. Summary of the Invention

[0003] The purpose of this application is to provide a glass and an electronic device that improves the mechanical properties of existing glass.

[0004] This application provides a technical solution.

[0005] A glass, the raw material of which comprises the following components in mass percentage of oxides: SiO2 57-62%, Al2O3 4-8%, Na2O 1-5%, K2O 0-3%, MgO 3-8%, ZrO2 0-2%, Li2O 0-3%, B2O3 0-5%, P2O5 5-10%, CaO 12-18%, ZnO 0-5%.

[0006] In other embodiments of this application, the P2O5 / CaO ratio is 0.3 to 0.6, calculated as a percentage of the oxides.

[0007] In other embodiments of this application, the value of (Al2O3+SiO2) / (Na2O+K2O+Li2O) is 20 to 28, based on the mass percentage of oxides.

[0008] In other embodiments of this application, the mass percentage of the above oxides, (Na2O+K2O) / (MgO+B2O3), is 0.2 to 0.5.

[0009] In other embodiments of this application, the glass described above satisfies the following conditions:

[0010] Reflectivity ≥ 92%, coefficient of thermal expansion ≤ 9*10 -6 K -1 The warpage rate is ≤0.01%.

[0011] In other embodiments of this application, the glass meets the following conditions: thermal conductivity at 90°C ≥ 1.2 W / mk, and bending resistance without chemical strengthening ≥ 150 MPa.

[0012] In other embodiments of this application, the glass meets the following conditions: acid resistance grade is S2, and alkali resistance grade is A2.

[0013] In other embodiments of this application, the glass meets the following condition: water resistance rating is HGB1.

[0014] In other embodiments of this application, the glass described above does not contain fluoride.

[0015] An electronic device includes: a printed circuit board and a rear housing, the printed circuit board being located within the rear housing. The rear housing comprises any of the aforementioned types of glass.

[0016] The beneficial effects of the glass and electronic equipment provided in the embodiments of this application are:

[0017] The glass provided in this application embodiment has high gloss and no "sandblasting" phenomenon. It has excellent acid, alkali, and water resistance. It also has high flatness, high reflectivity, low expansion, high thermal conductivity, and good chemical stability, meeting all the requirements of Mini LED backplane glass, and at a lower cost, it meets market demands. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall apply. Reagents or instruments whose manufacturers are not specified are all conventional products that can be purchased commercially.

[0019] This application provides an electronic device, which may include, for example, a tablet computer, mobile phone, e-reader, remote control, personal computer (PC), laptop computer, personal digital assistant (PDA), in-vehicle device, smart TV, wearable device, television set, and other electronic devices.

[0020] This application does not impose any special restrictions on the specific form of the above-mentioned electronic device. For ease of explanation, the following description uses a mobile phone as an example.

[0021] Electronic devices include Mini LED panels. A Mini LED panel comprises a substrate and circuitry disposed on the substrate. The performance of the glass substrate needs improvement.

[0022] The glass and electronic device of the present application embodiments are described in detail below.

[0023] A glass, the raw material of which comprises the following components in mass percentage of oxides: SiO2 57-62%, Al2O3 4-8%, Na2O 1-5%, K2O 0-3%, MgO 3-8%, ZrO2 0-2%, Li2O 0-3%, B2O3 0-5%, P2O5 5-10%, CaO 12-18%, ZnO 0-5%.

[0024] The components SiO2, P2O5, Al2O3, Na2O, MgO, K2O, ZrO2, Li2O, ZnO, B2O3, and CaO refer to compounds containing Si, P, Al, Na, Mg, K, Zr, Li, Zn, B, and Ca (e.g., carbonates, nitrates, sulfates, oxides, etc., containing the aforementioned elements). Under heating conditions, the SiO2, P2O5, Al2O3, Na2O, MgO, K2O, ZrO2, Li2O, ZnO, B2O3, and CaO are mixed evenly and then subjected to high-temperature melting (1500℃-1600℃), clarification and homogenization, molding, and annealing to obtain a milky white base glass. Then, according to the required dimensions, it is cut, CNC machined, ground, and polished to obtain the desired Mini LED milky white backplate glass.

[0025] The glass provided in this embodiment is milky white glass.

[0026] SiO2 is the main component that forms and connects silicon-oxygen tetrahedra to constitute the glass network structure, serving as the basic framework of glass. Because this technical solution incorporates P2O5 as an opacifier, P2O5 promotes the crystallization of SiO2 to form cristobalite. In severe cases, this results in coarse, large-particle crystals with an uneven surface, making the glass brittle, reducing its strength, and causing processing difficulties. Therefore, the amount of SiO2 added should not be too high, with a maximum of 62%. However, considering the chemical stability of the glass, the minimum addition should not be less than 57%. For example, based on the mass percentage of oxides, the amount of SiO2 can be 57%, 58%, 59%, 60%, 61%, 62%, etc.

[0027] To obtain highly reflective, milky-white glass, an opacifier is crucial. P2O5 is added to a silicate-based glass, dissolving in the glass melt at high temperatures and precipitating phosphate grains in the supersaturated melt upon cooling. In the embodiments of this application, the P2O5 content must be controlled between 5% and 10%. Below 5%, even if the glass undergoes phase separation, the droplet size is very small, resulting in weak opacity. Above 10%, the glass surface becomes rough, reducing gloss. For example, the amount of P2O5, by mass percentage of oxides, can be 5%, 6%, 7%, 8%, 9%, 10%, etc.

[0028] Al₂O₃ readily forms tetrahedral coordination, and [AlO₄] tetrahedral coordination helps to build a tighter network with [SiO₄] tetrahedra, making it an important component of the glass network structure. It also allows for minimal changes in the glass's geometry. The amount of Al₂O₃ added to milky white glass is 4–8%, preferably 4–6%. When its content exceeds 8%, it easily leads to poorer chemical stability of the glass, increases high-temperature viscosity, and increases melting difficulty, which is detrimental to production. Furthermore, it inhibits phosphate crystallization, making it difficult to achieve opacity. When its content exceeds 4%, it cannot improve the dispersion stability of the grains. For example, the amount of Al₂O₃, based on the mass percentage of oxides, can be 4%, 5%, 6%, 7%, 8%, etc.

[0029] Na₂O not only enhances the opacity of glass but also acts as a good flux in glass components. The addition amount of Na₂O is 1–5%, preferably 2–4%. When the Na₂O content exceeds 5%, it reduces the chemical stability of the glass and increases the coefficient of thermal expansion. When the Na₂O content is below 1%, it has no additive effect, fails to produce uniform grains, and does not improve the melting effect of the glass. For example, the amount of Na₂O, based on the mass percentage of oxides, can be 1%, 2%, 3%, 4%, 5%, etc.

[0030] The function of K2O is the same as that of Na2O. For example, based on the mass percentage of oxides, the amount of K2O provided in the embodiments of this application can be 0%, 0.5%, 1%, 2%, 3%, etc. Li2O also has an emulsifying effect, and the emulsifying effect of Li2O is better than that of Na2O and K2O. However, the cost of Li2O is higher than that of Na2O and K2O. For example, based on the mass percentage of oxides, the amount of Li2O provided in the embodiments of this application can be 0%, 0.5%, 1%, 2%, 3%, etc.

[0031] MgO can improve the meltability, strain point, and Young's modulus of glass, and reduce the coefficient of thermal expansion of glass. For example, the amount of MgO can be 3%, 4%, 5%, 6%, 7%, 8%, etc., by mass percentage of oxides.

[0032] Adding a small amount of B2O3 to the raw materials is beneficial for promoting phase separation, reducing the glass expansion coefficient and the upper limit of crystallization temperature, and thus improving crystallization performance. The optimal amount introduced is 0–5%. For example, the amount of B2O3, based on the mass percentage of oxides, can be 0%, 0.5%, 1%, 2%, 3%, 4%, 5%, etc.

[0033] ZrO2 not only has the best resistance to water and acids, but also the best resistance to alkalis. An appropriate amount of ZrO2 helps improve the chemical durability and hardness of glass. However, if the ZrO2 content is too high, on the one hand, the glass's devitrification resistance decreases, and on the other hand, its melt properties deteriorate, making forming difficult. For example, the amount of ZrO2, by mass percentage of oxides, can be 0%, 0.5%, 1%, or 2%.

[0034] ZnO serves as a network intermediate, integrating into the network structure to enhance emulsification and exhibiting good thermal stability, chemical stability, and mechanical strength. For example, the amount of ZnO can be 0%, 0.5%, 1%, 2%, 3%, 4%, 5%, etc., based on the mass percentage of the oxide.

[0035] CaO can precipitate as calcium phosphate crystals, increasing the opacity. However, if its content is too high, large crystal particles will precipitate, making the opaque glass difficult to process. Therefore, its content must be controlled according to the composition of the base glass. For example, the amount of CaO can be 12%, 13%, 14%, 15%, 16%, 17%, or 18% by mass percentage of oxides.

[0036] In some embodiments of this application, the P2O5 / CaO ratio is 0.3 to 0.6 by mass percentage of the oxides. For example, the P2O5 / CaO ratio is 0.3, 0.4, 0.5, or 0.6. Besides the amount of P2O5 affecting the emulsion opacity, the ratio of P2O5 to CaO also influences the emulsion opacity. When the P2O5 to CaO ratio is 0.3 to 0.6, both good emulsion opacity and ease of molding and processing are achieved.

[0037] In some embodiments of this application, it is necessary to control the ratio of the sum of SiO2 and Al2O3 to R2O, expressed as a mass percentage of oxides, i.e., the value of (Al2O3+SiO2) / (Na2O+K2O+Li2O) is 20-28. This results in higher glass strength, excellent chemical stability, and higher thermal conductivity. In some embodiments of this application, the value of (Al2O3+SiO2) / (Na2O+K2O+Li2O) can be 20, 21, 22, 23, 24, 25, 26, 27, or 28.

[0038] In some embodiments of this application, the value of (Na₂O+K₂O) / (MgO+B₂O₃) is 0.2 to 0.5, based on the mass percentage of oxides. This results in a glass with a low coefficient of thermal expansion. For example, the value of (Na₂O+K₂O) / (MgO+B₂O₃) is 0.2, 0.3, 0.4, 0.5, etc.

[0039] This application does not limit the thickness of the glass. For example, the thickness of the glass can be 0.2 to 8 mm, such as 0.2 mm, 0.3 mm, 0.5 mm, 1 mm, 2 mm, 3 mm, 5 mm, 7 mm, 8 mm, etc. It can be set according to actual needs.

[0040] In some embodiments of this application, the glass is fluoride-free. It is understood that in some embodiments, the fluoride content may be an impurity content. For example, the fluoride content in the glass is less than or equal to 0.05% by mass. This ensures safe production and minimizes harm to the environment, human health, and crops.

[0041] In some embodiments of this application, the glass satisfies the following conditions:

[0042] Reflectivity ≥ 92%, coefficient of thermal expansion ≤ 9*10-6K-1, warpage ≤ 0.01%, thermal conductivity ≥ 1.2W / mk (watts per meter per K) @ 90℃, and bending resistance without chemical strengthening ≥ 150Mpa.

[0043] The reflectance was measured using a CM-3600d spectrophotometer.

[0044] The coefficient of thermal expansion was measured using a DIL(2010STD) coefficient of thermal expansion meter.

[0045] The warpage was measured using a VME432 two-dimensional image measuring instrument.

[0046] Thermal conductivity was measured using a Netzsch-LFA 467HT laser thermal conductivity meter at a test temperature of 90°C and in a nitrogen atmosphere.

[0047] Four-point bending strength can be tested using a universal testing machine of model QJ-211S. The test conditions are: upper / lower span 20 / 40cm, lowering speed 10mm / min, and rod diameter 6mm.

[0048] The flexural strength without chemical strengthening refers to the flexural strength measured before chemical strengthening.

[0049] In some embodiments of this application, the glass meets the following conditions: acid resistance grade is S2, alkali resistance grade is A2, and water resistance grade is HGB1.

[0050] The acid resistance rating is determined according to DIN12116 standard.

[0051] DIN 12116 is a standard that measures the resistance of glass to decomposition when placed in an acidic solution. Simply put, DIN 12116 uses a weighed sample of polished glass with a known surface area, and then exposes the glass sample to a proportional amount of boiling 6M hydrochloric acid for 6 hours. The sample is then removed from the solution, dried, and weighed again. The mass loss of the glass upon exposure to the acidic solution is a measure of the sample's acid resistance; a smaller value indicates greater resistance. Test results are recorded in units of mass per surface area, specifically mg / dm³. 2 The DIN 12116 standard is divided into four independent levels. Level S1 indicates a maximum weight loss of 0.7 mg / dm³. 2 S2 level refers to a weight loss of 0.7 mg / dm³. 2 Up to 1.5 mg / dm 2 S3 level refers to a weight loss of 1.5 mg / dm³. 2 Up to 15 mg / dm 2 And S4 level refers to a weight loss greater than 15 mg / dm³. 2 .

[0052] The alkali resistance rating is determined according to ISO 695 standard.

[0053] ISO 695 standard measures the mass loss per unit area of ​​glass when placed in an alkaline solution. Specifically, ISO 695 uses a weighed, polished glass sample, which is placed in a boiling solution of 1 mol / L NaOH + 0.5 mol / L Na₂CO₃ for 3 hours. The sample is then removed from the solution, dried, and weighed again. The mass loss of the glass in the alkaline solution is a measure of the sample's alkali resistance; a smaller value indicates greater alkali resistance. Similar to DIN 12116, the results of ISO 695 are recorded in units of mass per surface area, specifically mg / dm². 2 The ISO 695 standard is divided into three levels. Level A1 indicates a maximum weight loss of 75 mg / dm³. 2 A2 level refers to a weight loss of 75 mg / dm³. 2 Up to 175 mg / dm 2 ; and A3 level refers to a weight loss greater than 175 mg / dm³. 2 .

[0054] The water resistance rating is determined according to ISO 719 standard.

[0055] ISO 719 standard is the determination of the mass loss per unit area of ​​glass when exposed to pure, CO2-free water. Specifically, the ISO 719 standard protocol uses pulverized glass grains, which are contacted with pure, CO2-free water at 98°C and 1 atmosphere for 30 minutes. The solution is then titrated colorimetrically with dilute HCl to neutralize the pH. The amount of HCl required to titrate to a neutral solution is then converted into an equivalent amount of Na₂O extracted from the glass, and recorded as the mass of Na₂O precipitated per gram of glass; a smaller value indicates greater water resistance. The ISO 719 standard is divided into five levels. HGB1 type refers to the maximum equivalent Na2O extracted, up to 31 μg; HGB2 type refers to the maximum equivalent Na2O extracted, exceeding 31 μg; HGB3 type refers to the maximum equivalent Na2O extracted, exceeding 62 μg; HGB4 type refers to the maximum equivalent Na2O extracted, exceeding 264 μg; and HGB5 type refers to the maximum equivalent Na2O extracted, exceeding 620 μg.

[0056] This application also provides a method for preparing the above-mentioned glass. The method includes thoroughly mixing raw materials and then placing them in a high-temperature furnace. The mixture undergoes processes such as melting, clarifying, forming, annealing, cutting, and polishing to obtain the glass. The specific steps are as follows:

[0057] (1) Weighing: Weigh the raw materials according to the proportion of each component in the example in Table 1, based on the mass percentage.

[0058] (2) Mixing: After accurately weighing the above raw materials according to the weight ratio, use a mixer to fully mix them to form a batch.

[0059] (3) Melting: First, heat the high temperature furnace to 1200℃, then add the obtained batch material to the quartz crucible, then put it into the muffle furnace and heat it to 1600℃ for 6 hours. During this period, use a stainless steel rod to stir and homogenize to obtain glass liquid.

[0060] (4) Annealing: Pour the molten glass into a mold on a stainless steel plate. After the glass is formed and demolded, place it in an annealing furnace for annealing. The annealing temperature is controlled at 650℃.

[0061] (5) The glass obtained in step (4) is processed by slicing, CNC machining, grinding, polishing and other processes, and then tested and analyzed.

[0062] The features and performance of this application will be further described in detail below with reference to the embodiments.

[0063] Examples 1 to 10

[0064] Examples 1 to 10 each provide a type of glass, the raw material formulation of which is shown in Table 1. Comparative Examples 1 to 5 each provide a type of glass, the raw material formulation of which is shown in Table 2.

[0065] Table 1

[0066]

[0067]

[0068] Table 2

[0069]

[0070] The glass provided in Examples 1 to 10 was measured, and the measurement results are shown in Table 3.

[0071] Table 3

[0072]

[0073]

[0074] The glass provided in Comparative Examples 1 to 5 was measured, and the measurement results are shown in Table 3.

[0075] Table 4

[0076]

[0077] As can be seen from Tables 3 and 4:

[0078] The glass provided in Examples 1-10 has a good milky white effect, high gloss, and no "sandblasting" phenomenon. The glass provided in Comparative Examples 1-5, such as Comparative Example 2, has "sandblasting", extremely poor surface condition, and becomes brittle, making it impossible to cut, grind, and polish, resulting in the inability to complete subsequent tests.

[0079] The glasses provided in Examples 1-10 exhibit excellent acid, alkali, and water resistance. Glasses not prepared according to the technical solution of this invention, particularly Comparative Example 5, have lower SiO2 content (below 54%) and abnormally high Na2O content, resulting in lower Na content in the glass. + With H in water + The reaction intensifies and damages the silicon-oxygen framework of the glass, causing all four bridging oxygen atoms around the Si atom to become OH, resulting in weight loss and decreased chemical stability of the glass.

[0080] Comparative Examples 1, 4, and 5 have an expansion coefficient >9*10 because (Na₂O+K₂O) / (MgO+B₂O₃) is outside the scope of this technology. - 6 K-1 Furthermore, (Al2O3+SiO2) / (Na2O+K2O+Li2O) is outside the scope of this technology, with a thermal conductivity of <1.2W / mk, making it unsuitable for use as the backplane glass for Mini LEDs.

[0081] The glass provided in Examples 1-10 meets all the requirements for Mini LED backplane glass, and is low in cost, which meets market requirements.

[0082] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A type of glass, characterized in that, The raw materials for the glass comprise the following components by mass percentage of oxides: SiO2 57-59%, Al2O3 5-8%, Na2O 1-5%, K2O 0-3%, MgO 3-8%, ZrO2 0.5-2%, Li2O 0.5-3%, B2O3 0.5-5%, P2O5 5-10%, CaO 12-18%, ZnO 0.5-5%; The glass satisfies the following conditions: Reflectivity ≥ 92%, coefficient of thermal expansion ≤ 9*10 -6 K -1 Warpage rate ≤ 0.01%; The value of (Al2O3+SiO2) / (Na2O+K2O+Li2O) is 20-28 based on the mass percentage of oxides. The value of (Na2O+K2O) / (MgO+B2O3) is 0.2 to 0.5 based on the mass percentage of oxides.

2. The glass according to claim 1, characterized in that, The P2O5 / CaO ratio is 0.3 to 0.6 by mass percentage of oxides.

3. The glass according to any one of claims 1-2, characterized in that, The glass meets the following conditions: thermal conductivity at 90℃ ≥ 1.2 W / mk, and bending resistance without chemical strengthening ≥ 150 MPa.

4. The glass according to any one of claims 1-2, characterized in that, The glass meets the following conditions: acid resistance grade is S2, and alkali resistance grade is A2.

5. The glass according to any one of claims 1-2, characterized in that, The glass meets the following conditions: water resistance rating is HGB1.

6. The glass according to any one of claims 1-2, characterized in that, The glass is fluorine-free.

7. An electronic device, characterized in that, The electronic device includes: a printed circuit board and a rear housing, wherein the printed circuit board is located within the rear housing; the rear housing includes the glass according to any one of claims 1-6.