A semiconductor device cleaning apparatus and system

Abstract

The application provides a semiconductor device cleaning device and system, and relates to the technical field of semiconductor device cleaning. The application provides a semiconductor device cleaning device, which comprises a lifting mechanism, a sample placing mechanism, a cleaning mechanism and a drying mechanism. The sample placing mechanism is connected with the lifting mechanism, and the bottom of the sample placing mechanism is provided with a first cleaning hole. The cleaning mechanism is located below the sample placing mechanism, and the drying mechanism is located at the side of the sample placing mechanism. The cleaning mechanism is provided with a cleaning solvent. When in the cleaning state, the sample to be cleaned is placed in the sample placing mechanism, and the sample placing mechanism is immersed into the cleaning mechanism under the driving of the lifting mechanism, and the local part of the sample to be cleaned is in contact with the cleaning solvent through the first cleaning hole. After the cleaning is completed, the lifting mechanism is reset, and the sample to be cleaned is dried through the drying mechanism. The application has the advantage that the semiconductor device can be locally cleaned.

Description

Technical Field

[0001] This application relates to the field of semiconductor device cleaning technology, and more specifically, to a semiconductor device cleaning apparatus and system. Background Technology

[0002] In the production and research of semiconductor devices, it is necessary to clean the semiconductor devices to remove contaminants, compounds, and other dirt from the sample surface. Current technologies generally involve immersing the sample in a cleaning agent and then using auxiliary methods such as heating or ultrasound for cleaning.

[0003] However, existing cleaning methods mostly perform overall device cleaning, which cannot meet the requirements of some research projects that require partial or single-sided device cleaning. For example, when it is necessary to clean a certain component on a PCB (Printed Circuit Board), but other components on the board cannot be cleaned, existing cleaning equipment cannot meet this requirement.

[0004] In summary, existing cleaning devices have the problem of being unable to perform localized cleaning of semiconductor devices. Summary of the Invention

[0005] The purpose of this application is to provide a semiconductor device cleaning apparatus and system to solve the problem that existing technologies cannot perform local cleaning of semiconductor devices.

[0006] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows:

[0007] In a first aspect, embodiments of this application provide a semiconductor device cleaning apparatus, which includes a lifting mechanism, a sample placement mechanism, a cleaning mechanism, and a drying mechanism. The sample placement mechanism is connected to the lifting mechanism, and a first cleaning hole is provided at the bottom of the sample placement mechanism. The cleaning mechanism is located below the sample placement mechanism, and the drying mechanism is located on the side of the sample placement mechanism.

[0008] The cleaning mechanism contains a cleaning solvent. When the cleaning mechanism is in operation, the sample to be cleaned is placed in the sample placement mechanism, and the sample placement mechanism is immersed in the cleaning mechanism under the action of the lifting mechanism. A portion of the sample to be cleaned comes into contact with the cleaning solvent through the first cleaning hole.

[0009] After cleaning is completed, the lifting mechanism resets and the drying mechanism dries the sample to be cleaned.

[0010] Optionally, the semiconductor device cleaning apparatus further includes a suction nozzle mechanism located above the sample placement mechanism;

[0011] When in the cleaning state, the suction nozzle mechanism is used to adsorb the sample to be cleaned and place the sample to be cleaned in the sample placement mechanism;

[0012] After cleaning is completed, the suction nozzle mechanism is used to adsorb the sample to be cleaned and remove it from the sample placement mechanism.

[0013] Optionally, the lifting mechanism includes a first telescopic element, a second telescopic element, and a lifting base, wherein the first telescopic element, the second telescopic element, and the lifting base are connected in sequence, and the first telescopic element is telescopic relative to the second telescopic element, and the second telescopic element is telescopic relative to the lifting base; wherein...

[0014] The suction nozzle mechanism is mounted on the first telescopic element, and the sample placement mechanism is mounted on the second telescopic element.

[0015] Optionally, the suction nozzle mechanism includes a suction nozzle head and a hollow connecting rod, one end of which is connected to a vacuum device, and the other end of which is detachably connected to the suction nozzle head.

[0016] Optionally, the cleaning mechanism includes an annular body and a placement groove, the annular body being connected to the placement groove, and a cleaning solvent being disposed inside the annular body;

[0017] When in the cleaning state, the sample placement mechanism is placed in the placement groove and extends into the annular body.

[0018] Optionally, the semiconductor device cleaning apparatus further includes a heating mechanism connected to one end of the annular body;

[0019] When in the cleaning state, the heating mechanism heats the cleaning mechanism so that the cleaning solvent circulates along the annular body.

[0020] Optionally, the semiconductor device cleaning apparatus further includes a base mechanism, and the lifting mechanism, the cleaning mechanism, and the drying mechanism are all connected to the base mechanism.

[0021] Optionally, the semiconductor device cleaning apparatus further includes an anti-corrosion gasket, the anti-corrosion gasket being provided with a second cleaning hole, the anti-corrosion gasket being located at the bottom of the sample placement mechanism, and the orthographic projection area of ​​the second cleaning hole being located within the orthographic projection area of ​​the first cleaning hole.

[0022] Optionally, the drying mechanism includes a first drying element and a second drying element, which are arranged opposite to each other, and when the cleaning is completed, the air nozzles of the first drying element and the second drying element are both facing the sample to be cleaned.

[0023] On the other hand, this application also provides a semiconductor device cleaning system, which includes the semiconductor device cleaning apparatus described above.

[0024] Compared with the prior art, this application has the following advantages:

[0025] This application provides a semiconductor device cleaning apparatus, which includes a lifting mechanism, a sample placement mechanism, a cleaning mechanism, and a drying mechanism. The sample placement mechanism is connected to the lifting mechanism, and a first cleaning hole is provided at the bottom of the sample placement mechanism. The cleaning mechanism is located below the sample placement mechanism, and the drying mechanism is located to the side of the sample placement mechanism. A cleaning solvent is disposed inside the cleaning mechanism. When in the cleaning state, the sample to be cleaned is placed inside the sample placement mechanism, and the sample placement mechanism is immersed in the cleaning mechanism under the action of the lifting mechanism. A portion of the sample to be cleaned comes into contact with the cleaning solvent through the first cleaning hole. After cleaning is completed, the lifting mechanism resets, and the sample to be cleaned is dried by the drying mechanism. Because this application allows for partial contact between the sample to be cleaned and the cleaning solvent through the first cleaning hole of the sample placement mechanism when cleaning semiconductor devices, it enables localized cleaning of semiconductor devices.

[0026] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the semiconductor cleaning apparatus provided in an embodiment of this application.

[0029] Figure 2 This is a schematic diagram of the suction nozzle mechanism provided in an embodiment of this application.

[0030] Figure 3 This is a schematic diagram of the lifting mechanism provided in an embodiment of this application.

[0031] Figure 4 This is a schematic diagram of the sample placement mechanism provided in an embodiment of this application.

[0032] Figure 5This is a schematic diagram of the structure of the anti-corrosion gasket provided in the embodiment of this application.

[0033] Figure 6 This is a schematic diagram of the sample placement mechanism after placing the anti-corrosion gasket, as provided in an embodiment of this application.

[0034] Figure 7 This is a schematic diagram of the cleaning mechanism provided in an embodiment of this application.

[0035] Figure 8 This is a schematic diagram of the semiconductor device cleaning apparatus provided in the embodiments of this application when it is in the cleaning state.

[0036] Figure 9 This is a schematic diagram of the drying mechanism provided in an embodiment of this application.

[0037] Figure 10 This is a schematic diagram of the structure of the first drying element and the second drying element provided in the embodiments of this application.

[0038] Figure 11 This is a schematic diagram of the structure of the semiconductor device cleaning apparatus provided in this application when it holds the sample to be cleaned.

[0039] Figure 12 This is a schematic diagram of the structure of the semiconductor device cleaning apparatus provided in this application after the first telescopic element retracts downward.

[0040] Figure 13 This is a schematic diagram of the structure of the semiconductor device cleaning apparatus provided in this application after the second telescopic element retracts downward.

[0041] icon:

[0042] 100-Semiconductor device cleaning device; 110-Lifting mechanism; 111-First telescopic element; 112-Second telescopic element; 113-Lifting base; 120-Sample placement mechanism; 121-Connecting structure; 122-Placement cylinder; 123-First cleaning hole; 130-Cleaning mechanism; 131-Annular body; 132-Placement groove; 140-Drying mechanism; 141-First drying element; 142-Second drying element; 143-Air rod; 144-Air jet nozzle; 150-Sucking nozzle mechanism; 151-Connecting rod; 152-Sucking nozzle head; 160-Heating mechanism; 170-Base mechanism; 171-Control panel; 180-Anti-corrosion gasket; 181-Second cleaning hole. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0044] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0045] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0046] It should be noted that in this paper, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0047] In the description of this application, it should be noted that the terms "upper", "lower", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of this application is usually placed in. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0048] In the description of this application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0049] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0050] As described in the background section, current cleaning methods for semiconductor devices primarily involve overall cleaning, such as immersing the entire semiconductor device in a cleaning solvent. However, in certain specific scenarios, such as during production or research, it is necessary to clean specific areas of the semiconductor device.

[0051] As a specific example, consider a PCB board comprising components A, B, and C. During the research process, it's necessary to clean module B using a special solvent, such as an acidic solvent. However, this acidic solvent would cause surface corrosion of module A, affecting its performance. Therefore, a partial cleaning of the entire PCB board is required; that is, cleaning only module B with the acidic solvent, while excluding modules A and C.

[0052] In the existing technology, there is no device for local cleaning of semiconductor devices, which makes it impossible to achieve effective local cleaning of semiconductor devices under the above-mentioned operating conditions.

[0053] In view of this, in order to solve the above problems, this application provides a semiconductor device cleaning apparatus to achieve local cleaning of semiconductor devices.

[0054] The semiconductor device cleaning apparatus 100 provided in this application is described below by way of example:

[0055] As one implementation method, please refer to Figure 1 The semiconductor device cleaning apparatus 100 includes a lifting mechanism 110, a sample placement mechanism 120, a cleaning mechanism 130, and a drying mechanism 140. The sample placement mechanism 120 is connected to the lifting mechanism 110, and a first cleaning hole 123 is provided at the bottom of the sample placement mechanism 120. The cleaning mechanism 130 is located below the sample placement mechanism 120, and the drying mechanism 140 is located on the side of the sample placement mechanism 120. A cleaning solvent is arranged inside the cleaning mechanism 130. When in the cleaning state, the sample to be cleaned is placed inside the sample placement mechanism 120, and the sample placement mechanism 120 is immersed in the cleaning mechanism 130 under the action of the lifting mechanism 110. A portion of the sample to be cleaned comes into contact with the cleaning solvent through the first cleaning hole 123. After cleaning is completed, the lifting mechanism 110 is reset, and the sample to be cleaned is dried by the drying mechanism 140.

[0056] Understandably, when cleaning a semiconductor device using the semiconductor device cleaning apparatus 100 provided in this application, the sample to be cleaned (i.e., the semiconductor device to be cleaned) can be placed in the sample placement mechanism 120, and then the sample placement mechanism 120 can be lowered into the cleaning mechanism 130. Since the bottom of the sample placement mechanism 120 is provided with a first cleaning hole 123, when the sample placement mechanism 120 is lowered into the cleaning mechanism 130, only the position of the sample to be cleaned located in the first cleaning hole 123 can come into contact with the cleaning solvent, while the other positions cannot come into contact with the cleaning solvent. Therefore, when placing the sample to be cleaned, the position to be cleaned can be directly facing the first cleaning hole 123, while the other positions of the sample to be cleaned are blocked by the bottom of the sample placement mechanism 120, thereby achieving localized cleaning of the sample to be cleaned.

[0057] Of course, in one implementation, the semiconductor device cleaning apparatus 100 also includes a base mechanism 170, with the lifting mechanism 110, cleaning mechanism 130, and drying mechanism 140 all connected to the base mechanism 170. Furthermore, the base mechanism 170 can be hollow, allowing it to house relevant control or drive modules. For example, the drying mechanism 140 requires air jets, and its operation necessitates the use of motors, controllers, and other related structures; these electronic components can be housed within the base mechanism 170. Additionally, the base mechanism 170 is equipped with a control panel 171, which is connected to the control circuits of each mechanism.

[0058] The base mechanism 170 can be designed as a cuboid, which makes it easier to place different mechanisms.

[0059] Furthermore, as an implementation, the semiconductor device cleaning apparatus 100 also includes a suction nozzle mechanism 150, which is located above the sample placement mechanism 120. When in the cleaning state, the suction nozzle mechanism 150 is used to adsorb the sample to be cleaned and place the sample to be cleaned in the sample placement mechanism 120. After cleaning is completed, the suction nozzle mechanism 150 is used to adsorb the sample to be cleaned and remove it from the sample placement mechanism 120.

[0060] The suction nozzle mechanism 150 is used to more conveniently transfer the sample to be cleaned, for example, to transfer the sample to be cleaned into the sample placement mechanism 120, or to transfer the sample to be cleaned out of the sample placement mechanism 120.

[0061] As one implementation method, please refer to Figure 2The suction nozzle mechanism 150 includes a suction nozzle head 152 and a hollow connecting rod 151. One end of the connecting rod 151 is connected to a vacuum device, and the other end of the connecting rod 151 is detachably connected to the suction nozzle head 152. As shown in the figure, the connecting rod 151 can be L-shaped and connected to a vacuum pipeline. The vacuum device can be placed inside the base mechanism 170 and connected to the connecting rod 151 via a vacuum pipeline. The end of the connecting rod 151 is connected to the suction nozzle head 152, through which the sample to be cleaned can be adsorbed.

[0062] Furthermore, since the nozzle head 152 is detachably connected to the connecting rod 151, different models of nozzle heads 152 can be used according to different sample requirements. For example, for a 1cm*1cm sample to be cleaned, model a nozzle head 152 can be selected, while for a 2cm*2cm sample to be cleaned, model b nozzle head 152 can be selected, and the diameter of model b nozzle head 152 is larger than that of model a nozzle head 152.

[0063] To facilitate placing the sample to be cleaned within the sample placement mechanism 120 during the cleaning process, and to allow for removal of the sample from the sample placement mechanism 120 after cleaning, it is necessary to ensure relative movement between the suction nozzle mechanism 150 and the sample placement mechanism 120. Based on this, please refer to... Figure 3 The lifting mechanism 110 provided in this application can be a retractable cylinder, that is, the lifting mechanism 110 includes a first telescopic element 111, a second telescopic element 112 and a lifting base 113. The first telescopic element 111, the second telescopic element 112 and the lifting base 113 are connected in sequence, and the first telescopic element 111 can extend and retract relative to the second telescopic element 112, and the second telescopic element 112 can extend and retract relative to the lifting base 113; wherein, the suction nozzle mechanism 150 is installed on the first telescopic element 111, and the sample placement mechanism 120 is installed on the second telescopic element 112.

[0064] This configuration allows the suction nozzle mechanism 150 and the sample placement mechanism 120 to move relative to each other, while the sample placement mechanism 120 can move relative to the cleaning mechanism 130. Therefore, in the cleaning state, the suction nozzle mechanism 150 first adsorbs the sample to be cleaned, then moves downward relative to the sample placement mechanism 120, placing the sample at the bottom of the sample placement mechanism 120, ensuring that the area of ​​the sample to be cleaned is directly opposite the first cleaning hole 123. It should be noted that the suction nozzle mechanism 150 simultaneously provides downward pressure to the sample to ensure that only a portion of the sample comes into contact with the cleaning solvent. Furthermore, the sample placement mechanism 120 moves downward and is immersed in the cleaning mechanism 130, allowing only a portion of the sample to come into contact with the cleaning solvent through the first cleaning hole 123, thus achieving localized cleaning.

[0065] After cleaning is completed, the sample placement mechanism 120 rises with the second telescopic element 112, and the suction nozzle mechanism 150 also rises with the first telescopic element 111, adsorbing the sample to be cleaned and removing it from the sample placement mechanism 120.

[0066] Of course, the lifting mechanism 110 can also adopt other structures, such as two independent telescopic rods, both of which can move up and down relative to the base mechanism 170. The suction nozzle mechanism 150 and the sample placement mechanism 120 are respectively mounted on one telescopic rod, which is not limited here.

[0067] As one implementation method, please refer to Figure 4 The sample placement mechanism 120 includes a connecting structure 121 and a placement cylinder 122. A first cleaning hole 123 is provided at the bottom of the placement cylinder 122. The placement cylinder 122 is connected to one end of the connecting structure 121, and the other end of the connecting structure 121 is connected to a second telescopic element 112. Furthermore, to protect the sample to be cleaned, please refer to... Figure 5 The semiconductor device cleaning apparatus 100 also includes an anti-corrosion gasket 180, which is provided with a second cleaning hole 181. The anti-corrosion gasket 180 is located at the bottom of the sample placement mechanism 120, and the projected area of ​​the second cleaning hole 181 is located within the projected area of ​​the first cleaning hole 123.

[0068] In this application, the area of ​​the second cleaning hole 181 on the anti-corrosion gasket 180 is less than or equal to the area of ​​the first cleaning hole 123. On one hand, the anti-corrosion gasket 180 serves an anti-corrosion function, ensuring that parts of the sample that do not require cleaning do not come into contact with the cleaning solvent. On the other hand, by increasing the number of anti-corrosion gaskets 180, various sizes of second cleaning holes 181 can be prepared to accommodate different areas requiring localized cleaning, providing greater flexibility.

[0069] For example, when device a has an area of ​​1 cm² that needs to be cleaned. 2 The area that device b needs to be cleaned is 2 cm². 2 If both use the same anti-corrosion gasket 180, then the cleaning area of ​​device b is only 1 cm². 2 This does not meet the actual cleaning requirements. Conversely, when the area of ​​device a that needs to be cleaned is 2cm², 2 The area of ​​device b that needs to be cleaned is 1 cm². 2 If both use the same anti-corrosion gasket 180, then the cleaning area of ​​device b is 2cm². 2 It will clean away any excess material.

[0070] Therefore, by setting anti-corrosion gaskets 180 with second cleaning holes 181 of different areas, different anti-corrosion gaskets 180 can be replaced according to actual needs, which meets the actual usage requirements of the box.

[0071] Please see Figure 6 The diagram shows a schematic of the anti-corrosion gasket 180 installed at the bottom of the sample placement mechanism 120. The dotted line in the diagram represents the anti-corrosion gasket 180, and the second cleaning hole 181 on the anti-corrosion gasket 180 is opposite to the first cleaning hole 123 at the bottom of the sample placement mechanism 120. Therefore, it can be ensured that after the sample to be cleaned is placed, only the part of the sample to be cleaned will come into contact with the cleaning solvent, so as to achieve the purpose of local cleaning.

[0072] As one implementation method, please refer to Figure 7 The cleaning mechanism 130 includes an annular body 131 and a placement groove 132. The annular body 131 and the placement groove 132 are connected. The cleaning solvent is arranged inside the annular body 131. When in the cleaning state, the sample placement mechanism 120 is placed in the placement groove 132 and extends into the annular body 131.

[0073] In this application, the annular body 131 is provided as a square ring. The semiconductor device cleaning apparatus 100 also includes a fixing member, which is connected to the base mechanism 170 and the annular body 131 respectively, thereby fixing the annular body 131 to the base mechanism 170.

[0074] In addition, the semiconductor device cleaning apparatus 100 also includes a heating mechanism 160, which is connected to one end of the annular body 131; see also Figure 8 When in the cleaning state, the heating mechanism 160 heats the cleaning mechanism 130 so that the cleaning solvent circulates along the annular body 131.

[0075] When the heating mechanism 160 starts heating, the cleaning solvent in the annular body 131 will generate a hydrothermal circulation effect after being locally heated, and then start to circulate in the annular body 131 to clean the sample to be cleaned. It can also wash away the reactants and dirt that have been cleaned in time, increasing the cleaning effect. The cleaning time can be set according to actual needs.

[0076] Furthermore, to achieve a more thorough cleaning, the sample placement mechanism 120 extends to half its height within the annular body 131. According to fluid dynamics formulas, this arrangement allows for a higher flow rate of the cleaning solvent below the sample placement mechanism 120 because the channel cross-sectional area is smaller than other areas. This effectively flushes specific parts of the sample, improving the cleaning effect.

[0077] As one implementation method, please refer to Figure 9The drying mechanism 140 includes a first drying element 141 and a second drying element 142, which are arranged opposite to each other. After cleaning, the air nozzles 144 of both the first drying element 141 and the second drying element 142 are facing the sample to be cleaned. Furthermore, a control panel 171 is provided on the base mechanism 170, allowing the user to control the airflow of the first drying element 141 and the second drying element 142, as well as the lifting mechanism 110, through the control panel 171.

[0078] Please refer to Figure 10 Both the first drying element 141 and the second drying element 142 include an air rod 143 and an air nozzle 144, and the air rod 143 is L-shaped and connected to the base mechanism 170.

[0079] The first drying element 141 and the second drying element 142 spray hot air relative to each other to achieve convection, which can accelerate the drying speed of the sample to be cleaned.

[0080] Therefore, the working principle of the semiconductor device cleaning apparatus 100 provided in this application is as follows:

[0081] First, such as Figure 11 As shown, the corresponding cleaning solvent is added to the cleaning mechanism 130. Then, the nozzle device of the suction nozzle mechanism 150 is opened through the control panel 171 on the base mechanism 170. The sample to be cleaned is placed under the nozzle and sucked up using tweezers or other tools. In the figure, A represents the sample to be cleaned.

[0082] Please refer to the following: Figure 12 The first telescopic element 111 retracts downwards under the control panel 171. At this time, the sample to be cleaned is sucked up by the suction nozzle mechanism 150 and gradually moves downwards until it contacts the anti-corrosion gasket 180. Next, please refer to... Figure 13 The second shrinking element is controlled to move downward. During the movement, the positional relationship between the second shrinking element and the first shrinking element remains unchanged. The positional relationship between the fixedly connected suction nozzle structure and the sample placement cylinder 122 also remains unchanged, so that the sample to be cleaned is immersed in the cleaning agent and only contacts the cleaning agent through the first cleaning hole 123 and the second cleaning hole 181.

[0083] Then, the heating function is turned on via control panel 171, causing heating mechanism 160 to heat up. The cleaning solvent in cleaning mechanism 130, after being locally heated, will generate a hydrothermal circulation effect, circulating within cleaning mechanism 130 for cleaning. This also promptly washes away the reactants and dirt, increasing the cleaning effect. Of course, the cleaning time can be set according to actual needs. After cleaning is complete, lifting mechanism 110 automatically returns to its original position.

[0084] After the sample is cleaned and reset, the drying mechanism 140 sprays hot air from the nozzle 144. This patent features drying mechanisms 140 on both sides of the base, using convection airflow to accelerate the drying of the cleaned sample area. During the reset process, the second shrinking element first moves upwards, resetting to its original position. Figure 12 The structure then moves the first telescopic element 111 upwards, resetting to its original position. Figure 11 After forming the structure, it can be dried.

[0085] Based on the above implementation, this application embodiment also provides a semiconductor device cleaning system, which includes the semiconductor device cleaning apparatus 100 described above.

[0086] In summary, this application provides a semiconductor device cleaning apparatus, which includes a lifting mechanism, a sample placement mechanism, a cleaning mechanism, and a drying mechanism. The sample placement mechanism is connected to the lifting mechanism, and a first cleaning hole is provided at the bottom of the sample placement mechanism. The cleaning mechanism is located below the sample placement mechanism, and the drying mechanism is located to the side of the sample placement mechanism. A cleaning solvent is disposed inside the cleaning mechanism. When in the cleaning state, the sample to be cleaned is placed inside the sample placement mechanism, and the sample placement mechanism is immersed in the cleaning mechanism under the action of the lifting mechanism. A portion of the sample to be cleaned comes into contact with the cleaning solvent through the first cleaning hole. After cleaning is completed, the lifting mechanism resets, and the sample to be cleaned is dried by the drying mechanism. Because this application allows for partial contact between the sample to be cleaned and the cleaning solvent through the first cleaning hole of the sample placement mechanism when cleaning semiconductor devices, it enables localized cleaning of semiconductor devices.

[0087] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0088] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A semiconductor device cleaning apparatus, characterized in that, The semiconductor device cleaning apparatus includes a lifting mechanism, a sample placement mechanism, a cleaning mechanism, and a drying mechanism. The sample placement mechanism is connected to the lifting mechanism, and a first cleaning hole is provided at the bottom of the sample placement mechanism. The cleaning mechanism is located below the sample placement mechanism, and the drying mechanism is located on the side of the sample placement mechanism. The cleaning mechanism contains a cleaning solvent. When the cleaning mechanism is in operation, the sample to be cleaned is placed in the sample placement mechanism, and the sample placement mechanism is immersed in the cleaning mechanism under the action of the lifting mechanism. A portion of the sample to be cleaned comes into contact with the cleaning solvent through the first cleaning hole. After cleaning is completed, the lifting mechanism resets and the drying mechanism dries the sample to be cleaned. The semiconductor device cleaning apparatus further includes a suction nozzle mechanism, which is located above the sample placement mechanism; When in the cleaning state, the suction nozzle mechanism is used to adsorb the sample to be cleaned and place the sample to be cleaned in the sample placement mechanism; After cleaning is completed, the suction nozzle mechanism is used to adsorb the sample to be cleaned and remove it from the sample placement mechanism; The lifting mechanism includes a first telescopic element, a second telescopic element, and a lifting base. The first telescopic element, the second telescopic element, and the lifting base are connected sequentially, and the first telescopic element is retractable relative to the second telescopic element, and the second telescopic element is retractable relative to the lifting base. The suction nozzle mechanism is mounted on the first telescopic element, and the sample placement mechanism is mounted on the second telescopic element; The semiconductor device cleaning apparatus further includes an anti-corrosion gasket, which is provided with a second cleaning hole. The anti-corrosion gasket is located at the bottom of the sample placement mechanism, and the orthographic projection area of ​​the second cleaning hole is located within the orthographic projection area of ​​the first cleaning hole.

2. The semiconductor device cleaning apparatus as described in claim 1, characterized in that, The suction nozzle mechanism includes a suction nozzle head and a hollow connecting rod. One end of the connecting rod is connected to a vacuum device, and the other end of the connecting rod is detachably connected to the suction nozzle head.

3. The semiconductor device cleaning apparatus as described in claim 1, characterized in that, The cleaning mechanism includes an annular body and a placement tank, the annular body and the placement tank are connected, and a cleaning solvent is arranged inside the annular body; When in the cleaning state, the sample placement mechanism is placed in the placement groove and extends into the annular body.

4. The semiconductor device cleaning apparatus as described in claim 3, characterized in that, The semiconductor device cleaning apparatus further includes a heating mechanism, which is connected to one end of the annular body. When in the cleaning state, the heating mechanism heats the cleaning mechanism so that the cleaning solvent circulates along the annular body.

5. The semiconductor device cleaning apparatus as described in claim 1, characterized in that, The semiconductor device cleaning device also includes a base mechanism, and the lifting mechanism, the cleaning mechanism and the drying mechanism are all connected to the base mechanism.

6. The semiconductor device cleaning apparatus as described in claim 1, characterized in that, The drying mechanism includes a first drying element and a second drying element, which are arranged opposite to each other. After cleaning, the air nozzles of the first drying element and the second drying element are both facing the sample to be cleaned.

7. A semiconductor device cleaning system, characterized in that, The semiconductor device cleaning system includes the semiconductor device cleaning apparatus as described in any one of claims 1 to 6.

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