A wire guide mechanism for medium wire cutting machine tool
By designing a wire guide mechanism of a medium-wire thread cutting machine tool including a "U"-shaped support frame, a moving frame, a wire guide frame and a guide column, the problem that the medium-wire thread cutting machine tool cannot cut the inclined surface of the metal material is solved, and the inclined guidance of the electrode wire and the satisfaction of various cutting needs is achieved.
CN118287776BActive Publication Date: 2025-03-18SUZHOU RUIJUN INTELLIGENT TECH CO LTD
Patent Information
- Application Number
- CN202410630717.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-21
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2044-05-21
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Figure CN118287776B_ABST
Abstract
The present invention relates to the technical field related to wire guides of medium-speed wire cutting machines, specifically a wire guide mechanism for medium-speed wire cutting machines, comprising a support frame in a "U"-shaped structure, wherein the lower movable frame and the upper movable frame are both connected to a rotating shaft rod for adjusting the angle of the wire guide frame; a row of wire guide frames are installed on the outside of the rotating shaft rod, and two wire guide rollers on the same vertical plane are installed inside the wire guide frame, and a conductor is installed on the outside of the wire guide frame, and the outside of the conductor is in contact with the electrode wire; a wire guide column for controlling the guide of the electrode wire is installed below the upper rightmost wire guide frame and above the lower rightmost wire guide frame. In the wire guide mechanism for medium-speed wire cutting machines, the inclined electrode wire in the wire guide mechanism can perform inclined cutting on metal materials, so that one side of the metal material after cutting is in an inclined surface state, so that the wire guide mechanism can meet different cutting requirements and increase the scope of use.
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Citation Information
Patent Citations
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