A method for detecting the quality of DIP pin welding

Abstract

The present application relates to a method for inspecting the soldering quality of DIP pins, and relates to the technical field of DIP inspection methods. The method comprises the following steps: obtaining a visual image, which is an image of the DIP captured by a camera; obtaining a preset pin image; obtaining an image score based on the visual image and the preset pin image, which is used to determine the quality of the DIP pins from the outside; obtaining performance parameters of the DIP, which is used to obtain a performance score based on the performance parameters; and obtaining a quality score based on the performance score and the image score, which is used to classify the DIPs. By combining image inspection and performance inspection, DIPs can be accurately inspected and classified, and can be classified into qualified good products, defective products that can be repaired through reprocessing, and irreparable waste products. Furthermore, defects in the DIPs can be analyzed through image inspection and performance inspection, so that DIPs with the same defects can be processed together, thereby improving production efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of DIP detection methods, and in particular to a method for detecting the soldering quality of DIP pins. Background Art

[0002] A DIP (dual in-line package) is a type of electronic component packaging typically used to insert electronic components onto two sides of a PCB. It features two parallel rows of pins, typically fewer than 14, on either side of the PCB. This facilitates insertion of electronic components and interconnection with the circuitry on the PCB. DIP components typically require testing of soldered pins after packaging to ensure stable performance.

[0003] Currently, DIP components are typically inspected using electrical performance testing and thermal weld detection to test the soldering quality of the pins. Patent publication number CN114074080A discloses a DIP component inspection device comprising a loading assembly, a heating assembly, a high-temperature test assembly, a cooling assembly, a high-voltage test assembly, an electrical test assembly, a direction point detection assembly, a laser marking assembly, an optical printing surface detection assembly, and a good product receiving assembly, all connected in sequence by a handling assembly. A flip assembly is provided between the electrical test assembly and the direction point detection assembly, and defective product receiving assemblies are provided on the sides of the high-temperature test assembly, the high-voltage test assembly, the electrical test assembly, the direction point detection assembly, and the optical printing surface detection assembly. The present invention integrates multiple testing functions, including high-temperature testing, high-voltage testing, electrical testing, direction point detection, and optical printing surface detection, to perform comprehensive testing on DIP components. However, comprehensive testing is inefficient, and each test is based on fixed indicators, making it difficult to control test accuracy. Only products that pass all tests are obtained, while the rest are considered scrap and cannot be further distinguished. This results in DIP components being unable to be accurately distinguished, recycled, or reprocessed.

[0004] Invention patent publication number CN116678355A discloses a method, apparatus, device, and medium for checking the pin height of a DIP component. The method is applied to a PCB design application and includes: receiving component attribute information, board thickness information, and height limit information; importing the board thickness information, height limit information, and component attribute information into a pin length checking tool, the pin length checking tool being preconfigured in the PCB design application; extracting the pin length information of each DIP component from the component attribute information using the pin length checking tool; sequentially calculating, using the pin length checking tool, the pin protrusion length information of each DIP component relative to the board thickness information; comparing, using the pin length checking tool, the pin protrusion length information of each DIP component with the height limit information, and determining non-compliant DIP components based on the comparison results; and comparing the pin protrusion length information with the height limit information to determine whether a DIP component is compliant is not accurate. A non-matching DIP component may have better performance, while a matching DIP component may have poorer performance. Therefore, this application cannot accurately detect the true performance of DIP components. Summary of the Invention

[0005] In order to solve the problem of inability to accurately detect and classify DIPs during inspection, the present application provides a method for inspecting the soldering quality of DIP pins.

[0006] In the first aspect, the present application provides a method for detecting the quality of DIP pin soldering, which adopts the following technical solution:

[0007] A method for inspecting the soldering quality of DIP pins includes: acquiring a visual image, the visual image being an image of the DIP captured by a camera; acquiring a preset pin image; obtaining an image score based on the visual image and the preset pin image, the image score being used to judge the quality of the DIP pins from their appearance; acquiring performance parameters of the DIP, and obtaining a performance score based on the performance parameters; and obtaining a quality score based on the performance score and the image score, the quality score being used to classify the DIP.

[0008] By adopting the above technical solution, image inspection is usually used in the DIP inspection process. Image inspection is mainly used to detect appearance defects and structural problems, such as whether the pins are intact and whether the solder joints are clearly visible. It can avoid various defects in DIP chips, such as pin deflection, short circuit, open circuit, abnormal solder joints, etc. However, image inspection cannot accurately and directly determine the performance of the DIP. Therefore, performance testing of the DIP is required. However, the performance testing method is single and can only distinguish the performance of the DIP but cannot determine the reasons for the performance difference. Therefore, by combining image inspection and performance testing, DIPs can be accurately inspected and classified. DIPs can be divided into qualified good products, defective products that can be repaired through reprocessing, and irreparable waste products. In addition, the defects of the DIP can be analyzed through image inspection and performance testing, so that DIPs with the same defects can be processed together, which is conducive to improving DIP production efficiency and raw material utilization through accurate classification.

[0009] Optionally, the visual image includes an appearance image of the pin of the DIP to be inspected taken by a high-definition camera, an X-ray image taken by an X-ray detector, and an infrared image taken by an infrared imaging detector; the pin preset image includes a preset appearance image, a preset X-ray image, and a preset infrared image.

[0010] By adopting the above technical solution, visual images are the basis of image detection. By using images in different forms as visual images, the diversity and sufficiency of visual images used in image detection in the detection method can be improved, thereby improving the accuracy of image detection in judging the soldering quality of DIP pins.

[0011] Optionally, an image score is obtained based on the visual image and the pin preset image, specifically including: processing the visual image to obtain a pin image, wherein the size and orientation of the pin image are the same as those of the pin preset image; performing the same preset gridding on the pin image and the pin preset image, comparing the pin image and the pin preset image in each corresponding grid, and obtaining a grid score; obtaining grid weights corresponding to different grids according to the positions of different grids; and obtaining an image score according to the grid score and the grid weights of the corresponding grids.

[0012] By adopting the above technical solution, since it is necessary to compare images, the two images need to be adjusted to the same size and orientation. Grid-based comparison can make the image comparison process more accurate. Due to the different positions of the grids, the importance of the corresponding images in DIP pin welding is also different. For example, for pins with good solder joints but defects on the welding edges, the impact of edge defects on the image score should be reduced. Therefore, the grid scores obtained at different grid positions are weighted. This allows the image scores to more accurately and realistically reflect the specific welding conditions of the DIP pins, which is conducive to the detection method being able to accurately distinguish the DIP quality.

[0013] Optionally, obtain a pin preset image, including:

[0014] Step 1: Acquire a pin standard image, where the pin standard image is an image of a well-welded pin;

[0015] Step 2: Using the pin standard image as the pin preset image;

[0016] Step 3: Use the preset pin image to perform DIP pin soldering quality inspection to obtain an image score;

[0017] Step 4: Compare the image score and the performance score to obtain an improvement score;

[0018] Step 5: Adjust the pin preset image according to the improved score

[0019] Step 6: Repeat steps 3 to 5, and update the pin preset image after each detection.

[0020] By adopting the above technical solution, the pin preset image is used to compare the visual image. However, since there is no pin preset image that can be used for comparison in the initial state, the pin standard image is first used as the pin preset image for comparison. After each test, the image score and the performance score are compared to obtain the improved score and adjust the pin preset image. The pin preset image can be adjusted according to the performance test. Since the DIP performance is related to the DIP pin image, the pin preset image can better reflect the DIP performance after multiple adjustments, which is conducive to the accurate detection of the DIP.

[0021] Optionally, the performance parameters include electrical performance parameters and thermal break parameters, and generating the performance score based on the performance parameters specifically includes: obtaining a correction database; generating an electrical performance score based on the electrical performance parameters, and generating a thermal break score based on the thermal break parameters; obtaining a correction coefficient based on the electrical performance score and the thermal break score; and obtaining a performance score based on the electrical performance score, the thermal break score, and the correction coefficient.

[0022] By adopting the above technical solution, the performance test of DIP includes electrical performance test and thermal weld test. Multiple forms of performance test are performed on DIP and used as a reference for DIP test, which can improve the comprehensiveness of the test. By introducing a correction coefficient, the quality score can more accurately reflect the overall performance of DIP. When defective DIPs are subsequently classified, they can be classified according to the respectively generated electrical performance score and thermal weld score.

[0023] Optionally, obtaining the quality score based on the performance score and the image score includes: obtaining a preset image score range based on the performance score; determining whether the image score is within the preset image score range; if the image score is not within the preset image score range, marking the quality score as abnormal; if the image score is within the preset image score range, obtaining the quality score based on the image score and the performance score.

[0024] By adopting the above technical solution, since the image score and the new energy score have a certain reference value, when there is a large difference between the two, it indicates that there is a special situation. It may be that there is a deviation in the detection, or the DIP itself is in a special state. For example, the excellent performance cannot be sustained, or the pin surface is good but there are problems inside. By marking the anomaly, the abnormal DIP can be checked, so that the quality score can more accurately reflect the soldering quality of the DIP pin.

[0025] In a second aspect, the present application provides a detection system, using the above-mentioned DIP pin soldering quality detection method, comprising:

[0026] The first acquisition module acquires the visual image of the DIP;

[0027] The second acquisition module acquires the pin preset image;

[0028] an analysis module, which obtains an image score based on the pin image and the preset pin image, wherein the image score is used to judge the quality of the DIP pin from the appearance;

[0029] The third acquisition module obtains the performance parameters of the DIP;

[0030] A calculation module is configured to obtain a quality score based on the performance parameter and the image score.

[0031] In a third aspect, the present application provides an electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the method for detecting the pin welding quality of a DIP as described in any one of claims 1 to 6 is implemented.

[0032] In a fourth aspect, the present application provides a computer-readable storage medium that employs the following technical solutions:

[0033] A computer-readable storage medium stores instructions. When the instructions are executed, the above-mentioned DIP pin welding quality detection method is executed.

[0034] In summary, this application includes at least one of the following beneficial technical effects:

[0035] 1. By combining image detection and performance detection, DIP can be accurately detected and classified. On the one hand, mutual comparison can ensure the accuracy of detection, and on the other hand, it can reflect the DIP performance in many aspects, thereby making DIP more detailed classification. The detection can not only detect good products and waste products, but also detect defective products, and classify the defective products that can be reprocessed, which is convenient for subsequent processing, thereby improving DIP production efficiency;

[0036] 2. By adjusting the pin preset image in each test, the pin preset image can more accurately reflect the performance of the DIP, making the image score and quality score obtained in subsequent tests more accurate;

[0037] 3. By using multiple types of images and multiple performance tests, the DIP detection method can fully reflect the DIP performance, so that the detected DIP can be classified in more detail. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 It is a schematic diagram of the overall process of the embodiment of the present application. DETAILED DESCRIPTION

[0039] The following examples will help those skilled in the art further understand the purpose of this application, but are not intended to limit this application in any form. It should be noted that those skilled in the art may make several modifications and improvements without departing from the scope of this application. These modifications and improvements are all within the scope of this application.

[0040] In the following description, specific details such as specific system structures and techniques are provided for purposes of illustration rather than limitation to facilitate a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid obscuring the description of the present application with unnecessary detail.

[0041] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections thereof.

[0042] It will also be understood that the term "and / or" used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0043] As used in this specification and the appended claims, the term "if" can be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0044] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0045] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0046] In order to make the purpose, technical solutions and advantages of this application clearer, the customization method of the efficient learning plan of this application is explained below from the perspective of the customization device of the efficient learning plan. The customization device of the efficient learning plan can be an electronic device, which can be, for example, a mobile phone terminal, a computer terminal and other devices.

[0047] The present application is further described in detail below with reference to the accompanying drawings.

[0048] Reference Figure 1 , Figure 1This is a flowchart of an embodiment of a method for detecting the soldering quality of a DIP pin according to an embodiment of the present application, comprising the following steps:

[0049] S1. Acquire visual images.

[0050] Specifically, the visual image acquired by the device is an image of the DIP taken using a photographing device. The photographing process can be a transmission process of the DIP, so that the DIP can be continuously detected, thereby improving the detection efficiency; the DIP photographed by the photographing device needs to maintain the same angle or orientation, so that in the subsequent image comparison process, a pin image with the same angle and orientation as the preset pin image can be obtained from the photographed image.

[0051] More specifically, the shooting angle is from directly above the DIP. Since the picture taken from directly above is a top view of the DIP, even if the DIP is transported by a conveyor belt, the position of the DIP cannot be determined. The angle of the top view can still be adjusted subsequently so that the pin image can be used for comparison with the preset pin image.

[0052] The visual images include the appearance images of the pins of the DIP to be inspected taken by a high-definition camera, the X-ray images taken by an X-ray detector, and the infrared images taken by an infrared imaging detector.

[0053] Specifically, visual images can observe the external appearance of DIP, but in some DIP components, the pins will be partially blocked, and the complete pin welding situation cannot be obtained by directly photographing from the outside. Therefore, X-ray detectors and infrared imaging detectors are needed to photograph the pins so that the situation of the blocked parts of the pins can be observed. High-definition cameras, X-ray detectors and infrared imaging detectors can be arranged in sequence on the DIP transmission path, or one camera can be used to complete the shooting of the three images. The image information after shooting will be transmitted to the equipment for preprocessing and then compared with the preset image of the pins.

[0054] S2. Obtain the pin preset image.

[0055] Specifically, the pin preset image is used to compare with the pin image obtained after visual image preprocessing, so the pin preset image represents the pin appearance image of the DIP with better performance; the pin appearance image also needs to maintain a similar angle to the visual image to avoid difficulty in comparing the pin image obtained by the visual image and the pin preset image; since the visual image acquired by the device includes not only the appearance image taken by the camera, but also X-ray images and infrared images, the pin preset image also needs to include corresponding images for comparison. In addition, since some pin welding defects will not affect the performance of the pin, but more pin appearance data cannot be obtained in the early stage of detection, the pin preset image needs to be corrected and iterated as the detection progresses, so that the pin preset image can be closer. The following is a detailed explanation of obtaining the pin preset image.

[0056] The pin preset images include preset appearance images, preset X-ray images and preset infrared images.

[0057] Specifically, the preset appearance image is used to compare with the pin external light image, the preset X-ray image is used to compare with the X-ray image, and the preset infrared image is compared with the infrared image. Each set of comparisons will generate an image score, which can be superimposed with equal weights or different weights to obtain a total image score, for example, the appearance image accounts for 20%, the X-ray image and the infrared image each account for 40%.

[0058] The pinout revision iteration consists of the following steps:

[0059] Step 1: Obtain a pin standard image, where the pin standard image is an image of a well-welded pin.

[0060] Specifically, if the image detection includes detection of X-ray images and infrared images, the standard pin image also needs to include a standard pin X-ray image and a standard infrared image.

[0061] Step 2: Use the pin standard image as the pin preset image.

[0062] Specifically, since the modification iteration of the pin preset image requires an initial image and is iterated based on the initial image, the pin image with good welding is used as the pin standard image as the iteration basis of the pin preset image.

[0063] Step 3: Use the preset pin image to perform a DIP pin soldering quality inspection to obtain an image score.

[0064] Specifically, the method for obtaining the image score can refer to the method in S3.

[0065] Step 4: Compare the image score and the performance score to obtain an improved score.

[0066] Step 5: Adjust the pin preset image based on the improvement score and the pin image.

[0067] Specifically, the image score mainly reflects the difference between the pin image and the pin preset image, and is the data obtained based on the pin standard image, while the performance score is the difference between the actual performance of the pin and the ideal performance. By comparing the gap between the image and the performance respectively, the improvement score is obtained. The improvement score mainly reflects the gap between the performance and the ideal value, and the size of the gap between the image and the ideal value, so as to regress to the ideal pin preset image based on the improvement score and the pin image.

[0068] More specifically, the image score may be in a different form from the ideal score, and both or one of them need to be converted and compared. If the converted image score is less than the performance score, it indicates that the difference between the pin image and the pin preset image is greater than the gap between the performance score and the ideal performance score. Therefore, the pin preset image needs to be adjusted in the direction of the pin image change. If it is less than, the pin preset image needs to be adjusted in the opposite direction of the pin image change.

[0069] Step 6: Repeat steps 3 to 5, and update the pin preset image after each detection.

[0070] Specifically, compared with the ideal image, the ideal performance is clearer. Therefore, the pin preset image is improved and adjusted with the performance parameters as a reference, so that the pin preset image can gradually conform to the ideal pin image. Some defects in the pin image that do not affect the performance will be gradually accepted by the pin preset image during the improvement and adjustment process, so that in subsequent inspections, the impact of such defects on the image score will be reduced, which is conducive to the gradual accuracy of the image score.

[0071] S3. Obtain an image score based on the visual image and the pin preset image.

[0072] Specifically, the pin image obtained after visual image preprocessing is compared with the pin preset image to obtain the difference between the pin image and the pin preset image. The image score reflects the difference and can reflect the quality of the DIP observed from the appearance. It is then combined with the performance score to obtain a quality score, which reflects the overall quality of the DIP lead welding.

[0073] The visual image is processed to obtain a pin image, wherein the size and orientation of the pin image are the same as those of the pin preset image,

[0074] Specifically, if the visual image is a front view, top view or side view of the DIP, the top view needs to be rotated to the same direction as the pin preset image, and enlarged or reduced to make the pin image and the pin preset image adapt to each other. If the visual image is obtained from other angles, it is difficult to change it through subsequent rotation, and a fixed-angle pin image needs to be obtained by fixing the shooting angle.

[0075] The pin image and the pin preset image are gridded in the same way, the pin image and the pin preset image in each corresponding grid are compared, and a grid score is obtained.

[0076] Specifically, the gridding can be a 2*3 or 3*4 grid, and the density of the grid can be changed according to the required degree of fineness of the image score. After gridding, the pin image and the image in the corresponding grid in the pin preset image correspond to each other. By comparing the image difference in the corresponding grid, the grid score is obtained. The grid score can be a negative number, indicating that the difference between the pin image and the pin preset image is too large or too small; the size of the welded pin is larger than the welding defect on the pin. If accurate comparison and identification of the welding defect is required, the pin image and the pin preset image need to be enlarged or distinguished with a finer resolution, which will increase the operating load of the recognition device. Therefore, through gridding, the pin image and the pin preset image are separated into corresponding grids, so that the comparison can be divided into smaller parts, reducing the operating load of the recognition device. In addition, gridding can also make the grid scores of different grids weighted superposition by different grid positions, so as to obtain a more accurate image score.

[0077] The grid weights corresponding to different grids are obtained according to the positions of different grids.

[0078] The image score is obtained according to the grid score and the grid weight of the corresponding grid.

[0079] Specifically, the image within the grid may be a welding point or the edge of a pin. However, in order to ensure that the pin can be accurately detected, a complete comparative inspection of the pin is required. However, compared with the welding point, the edge of the pin is much less important. Therefore, the grid score is weighted by the grid position so that the image score can more truly reflect the actual quality of the pin welding observed from the outside.

[0080] S4. Obtain performance parameters of the DIP, and obtain a performance score based on the performance parameters.

[0081] Specifically, the performance parameters include electrical performance parameters and thermal welding parameters. The electrical performance parameters are obtained through electrical performance testing by applying current at both ends of the pins and measuring parameters such as the impedance and response speed of the pins. The thermal welding parameters are obtained through thermal welding testing by heating the pins based on the thermoelectric principle to detect whether the pin connections are good. The performance score of the DIP is obtained through the electrical performance parameters and thermal welding parameters.

[0082] An electrical performance score is generated based on the electrical performance parameters, and a thermal welding score is generated based on the thermal welding parameters.

[0083] Specifically, the electrical performance parameters and thermal break parameters are specific experimental parameters that need to be converted into electrical performance scores and thermal break scores that can be processed by the equipment. The electrical performance parameters may include multiple parameters, such as impedance size or response speed. It is necessary to generate consistent electrical performance scores and thermal break scores based on multiple electrical performance parameters and thermal break parameters, so that the performance of the DIP can be accurately reflected in the form of scores. The electrical performance scores and thermal break scores can be retained until the DIP classification stage as one of the classification bases.

[0084] Obtaining a revision database;

[0085] obtaining a correction factor from the correction database based on the electrical performance score and the thermal weld score;

[0086] A performance score is obtained based on the electrical performance score, the thermal weld score, and the correction factor.

[0087] Specifically, the correction database provides a correction coefficient for integrating the electrical performance score and the thermal weld score into the performance score. Depending on the difference between the electrical performance score and the thermal weld score, the correction coefficient will change accordingly, indicating that different values ​​of electrical performance scores and thermal weld scores have different impacts on the performance score.

[0088] More specifically, the correction factors include an electrical performance correction factor and a thermal break correction factor, which respectively represent the influence of the electrical performance score and the thermal break correction factor on the performance score. The electrical performance correction factor and the thermal break correction factor are both related to the numerical values ​​of the electrical performance score and the thermal break score, so that the performance score can more accurately reflect the performance test quality of the DIP pin welding.

[0089] S5. Obtain a quality score based on the performance score and the image score.

[0090] Specifically, the performance score and image score represent the quality reference obtained based on the performance test and the quality reference obtained based on the image analysis, respectively. By combining the two, the pin soldering quality of the DIP can be evaluated in multiple aspects and dimensions. Some DIPs may have good image scores but poor performance scores, and some DIPs may have good performance scores but poor image scores. By integrating the performance score and the performance score to obtain the quality score, the quality score of the two test results can be combined to select products with excellent quality in both tests, and select defective products with poor quality scores but remediable, as well as waste products that cannot be remedied.

[0091] A preset image score range is obtained based on the performance score.

[0092] Specifically, based on the size of the performance score, a preset image score range is generated. This preset image range is a reasonable range of the image score. By obtaining the preset image score range, detection results with a large difference between the image score and the performance score can be detected when generating the quality score, thereby avoiding the impact of detection errors on the detection results.

[0093] Determining whether the image score is within the preset image score range;

[0094] If the image score is not within the preset image score range, the quality score is marked as abnormal;

[0095] If the image score is within the preset image score range, the quality score is obtained based on the image score and the performance score.

[0096] Specifically, if the image score is not within the preset image score range, it indicates that there may be a large gap between the generated image score and the performance score obtained through performance testing due to recognition errors or comparison errors during the image detection process. By marking the quality score as abnormal, the DIP processing method can be manually judged. If it is judged to be a detection error, re-testing is performed. If it is judged that the DIP quality is defective, it is judged whether it can be repaired through reprocessing based on the pin image, electrical performance parameters, and thermal welding parameters obtained during the detection process.

[0097] More specifically, in the process of distinguishing DIP quality, DIPs with a quality score higher than a certain score can be determined as good products, and good products can be directly processed as products in the subsequent process. DIPs with a quality score lower than a certain score can be determined as waste products, and waste products can be directly scrapped or recycled. DIPs with scores between these two scores are defective products. The defective products are retrieved to generate image scores, electrical performance scores, and thermal weld scores during the detection process. The defective products are classified according to the image scores, electrical performance scores, and thermal weld scores, so that defective products of different categories can be processed in a unified manner. The DIPs can be classified more finely through the detection method, which is conducive to improving the yield and inspection efficiency of the DIPs.

[0098] An embodiment of the present application further provides a detection system, using the above-mentioned DIP pin soldering quality detection method, comprising:

[0099] The first acquisition module acquires the visual image of the DIP;

[0100] The second acquisition module acquires the pin preset image;

[0101] an analysis module, which obtains an image score based on the pin image and the preset pin image, wherein the image score is used to judge the quality of the DIP pin from the appearance;

[0102] The third acquisition module obtains the performance parameters of the DIP;

[0103] A calculation module is configured to obtain a quality score based on the performance parameter and the image score.

[0104] An embodiment of the present application further provides an electronic device. The electronic device of this embodiment may include: a memory and a processor.

[0105] The memory stores a computer program that can be loaded by the processor and execute the method in the above embodiment.

[0106] The processor and the memory are connected, for example, via a bus.

[0107] Optionally, the electronic device may further include a transceiver. It should be noted that in actual applications, the number of transceivers is not limited to one, and the structure of the computer device does not constitute a limitation on the embodiments of the present application.

[0108] A processor can be a CPU (Central Processing Unit), a general-purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof. It can implement or execute the various exemplary logic blocks, modules, and circuits described in conjunction with the disclosure of this application. A processor can also be a combination that implements computing functions, such as a combination of one or more microprocessors, or a combination of a DSP and a microprocessor.

[0109] A bus includes a path that transmits information between the components mentioned above. Examples include a PCI (Peripheral Component Interconnect) bus and an EISA (Extended Industry Standard Architecture) bus. Buses can be categorized as address buses, data buses, and control buses. For ease of illustration, the diagram uses a single thick line, but this does not imply a single bus or type of bus.

[0110] The memory may be a ROM (Read Only Memory) or other type of static storage device that can store static information and instructions, a RAM (Random Access Memory) or other type of dynamic storage device that can store information and instructions, or an EEPROM (Electrically Erasable Programmable Read Only Memory), a CD-ROM (Compact Disc Read Only Memory) or other optical disk storage, optical disc storage (including compact discs, laser discs, optical discs, digital versatile discs, Blu-ray discs, etc.), magnetic disk storage media or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and can be accessed by a computer, but is not limited to these.

[0111] The memory is used to store application code for executing the solution of the present application, and the execution is controlled by the processor. The processor is used to execute the application code stored in the memory to implement the content shown in the above method embodiment.

[0112] Computer devices include, but are not limited to, mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (personal digital assistants), PADs (tablet computers), PMPs (portable multimedia players), and in-vehicle terminals (e.g., in-vehicle navigation terminals), as well as fixed terminals such as digital TVs and desktop computers. They may also include servers. The electronic device in this embodiment is merely an example and should not limit the functionality or scope of use of the embodiments of this application.

[0113] The computer device of this embodiment can be used to execute the method of any of the above embodiments. Its implementation principles and technical effects are similar and will not be repeated here.

[0114] The present application also provides a computer-readable storage medium storing a computer program that can be loaded by a processor and execute the method in the above embodiment.

[0115] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the above embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the above embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0116] As used in the above embodiments, the term “when” may be interpreted to mean “if” or “after” or “in response to determining that” or “in response to detecting that”, depending on the context. Similarly, the phrases “upon determining that” or “if (stated condition or event) is detected” may be interpreted to mean “if determining that” or “in response to determining that” or “upon detecting (stated condition or event)” or “in response to detecting (stated condition or event)”, depending on the context.

[0117] Those skilled in the art will appreciate that all or part of the process steps in the above-described method embodiments can be implemented by a computer program instructing the relevant hardware. The program can be stored in a computer-readable storage medium, and when executed, the program can include the process steps in the above-described method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as ROM or random access memory (RAM), magnetic disks, or optical disks.

Claims

1. A method for detecting the soldering quality of DIP pins, characterized in that: include: Acquire a visual image, where the visual image is a DIP image captured by a shooting device; Get pin preset image; Obtaining an image score based on the visual image and a preset pin image, wherein the image score is used to judge the quality of the DIP pin from the appearance; Obtaining performance parameters of the DIP, and obtaining a performance score based on the performance parameters; Obtaining a quality score based on the performance score and the image score, wherein the quality score is used to classify DIP; The visual image includes an image of the pin appearance of the DIP to be inspected taken by a high-definition camera, an X-ray image taken by an X-ray detector, and an infrared image taken by an infrared imaging detector; The pin preset images include a preset appearance image, a preset X-ray image and a preset infrared image; An image score is obtained based on the visual image and the pin preset image, specifically including: Processing the visual image to obtain a pin image, wherein the size and orientation of the pin image are the same as those of the preset pin image; Performing the same preset gridding on the pin image and the pin preset image, comparing the pin image and the pin preset image in each corresponding grid, and obtaining a grid score; Obtain the grid weights corresponding to different grids according to the positions of different grids; An image score is obtained according to the grid score and the grid weight number of the corresponding grid; Get pin preset images, including: Step 1: Acquire a pin standard image, where the pin standard image is an image of a well-welded pin; Step 2: Using the pin standard image as the pin preset image; Step 3: Use the preset pin image to perform DIP pin soldering quality inspection to obtain an image score; Step 4: Compare the image score and the performance score to obtain an improvement score; Step 5: adjusting the pin preset image based on the improvement score and the pin image; Step 6: Repeat steps 3 to 5, and update the pin preset image after each detection.

2. The DIP pin welding quality detection method according to claim 1, characterized in that: The performance parameters include electrical performance parameters and thermal welding parameters. The performance score is obtained based on the performance parameters, specifically including: Generate an electrical performance score based on the electrical performance parameters, and generate a thermal welding score based on the thermal welding parameters; Obtaining a revision database; obtaining a correction factor from the correction database based on the electrical performance score and the thermal weld score; A performance score is obtained based on the electrical performance score, the thermal weld score, and the correction factor.

3. The DIP pin welding quality detection method according to claim 1, characterized in that: Obtaining a quality score based on the performance score and the image score includes: obtaining a preset image score range based on the performance score; Determining whether the image score is within the preset image score range; If the image score is not within the preset image score range, the quality score is marked as abnormal; If the image score is within the preset image score range, the quality score is obtained based on the image score and the performance score.

4. A detection system using the DIP pin soldering quality detection method according to any one of claims 1 to 3, characterized in that: include: The first acquisition module acquires the visual image of the DIP; The second acquisition module acquires the pin preset image; an analysis module, which obtains an image score based on the pin image and the preset pin image, wherein the image score is used to judge the quality of the DIP pin from the appearance; The third acquisition module obtains the performance parameters of the DIP; A calculation module is configured to obtain a quality score based on the performance parameter and the image score.

5. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the method for detecting the quality of DIP pin soldering according to any one of claims 1 to 3 is implemented.

6. A computer-readable storage medium, characterized in that The computer-readable storage medium stores instructions, and when the instructions are executed, the method for detecting the quality of DIP pin soldering according to any one of claims 1 to 3 is executed.

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