Substrate handling system, handling apparatus, method for substrate thinning apparatus

Abstract

The application discloses a substrate carrying system, a carrying device and a method for a substrate thinning device. The substrate carrying system comprises an adapted holding component, a suction device and a controller. The holding component comprises a concentrically arranged suction pad and a ring-shaped suction disc. The holding component comprises a first suction mode for sucking the substrate through the suction pad and a second suction mode for sucking the substrate through the ring-shaped suction disc. The controller is used to control the holding component and the suction device to perform the following steps: the holding component sucks the substrate in the first suction mode and moves the substrate to a position opposite to the suction device; the suction device sucks the substrate and the suction pad of the holding component releases the substrate so that the substrate is moved by the suction device and is ground; the holding component sucks the substrate in the second suction mode and the suction device releases the ground substrate so that the ground substrate is carried out from the suction device and passes through a cleaning unit.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of substrate processing, and in particular, relates to a substrate carrying system, a carrying device and a method for a substrate thinning apparatus. BACKGROUND

[0002] In the ultra-precision thinning apparatus, ultra-precision grinding, CMP and cleaning modules, thickness deviation and surface defect control technologies are mainly integrated, so as to meet the demand for substrate ultra-precision thinning technology in the fields of 3D IC manufacturing and advanced packaging.

[0003] In the ultra-precision thinning apparatus, the substrate is generally taken by a small-size suction pad of a robot, carried to a suction device in a carrying-in and carrying-out area, and carried by the suction device on a rotary disc to rotate to a grinding processing area to grind the substrate. After grinding, the rotary disc is rotated again to make the substrate return to the carrying-in and carrying-out area, and the substrate is taken again by the small-size suction pad of the robot from the suction device, and then transmitted to a substrate transfer workbench after a cleaning unit to perform subsequent polishing.

[0004] However, due to the existence of residual stress after grinding, the substrate still has a certain warpage, and the suction capacity of the small-size suction pad of the robot is limited, so that the substrate is not cleaned or the substrate is easily dropped. SUMMARY

[0005] The embodiments of the present application provide a substrate carrying system, a carrying device and a method for a substrate thinning apparatus, which are intended to at least solve one of the technical problems existing in the prior art.

[0006] A first aspect of the embodiments of the present application provides a substrate carrying system for a substrate thinning apparatus, comprising an adapted holding component, a suction device and a controller; the holding component comprises a suction pad and an annular suction disc arranged concentrically, the holding component comprises a first suction mode of suctioning the substrate through the suction pad and a second suction mode of suctioning the substrate through the annular suction disc; the controller is used to control the holding component and the suction device to perform the following steps: the holding component is controlled to suction the substrate in the first suction mode, and the substrate is moved to a position opposite to the suction device; the carrying device is controlled to move to the suction device, so that the substrate abuts against the suction device; the suction device is controlled to suction the substrate, and the suction pad of the holding component is controlled to release the substrate, so as to move the substrate by the suction device and perform grinding; the holding component is controlled to suction the substrate in the second suction mode, and the suction device is controlled to release the substrate after grinding, so as to carry the substrate after grinding from the suction device and pass through a cleaning unit.

[0007] In one embodiment, the annular chuck comprises at least two annular sealing portions protruding from the adsorption surface of the holding member, and the diameter of the annular sealing portions is smaller than the diameter of the substrate. The controller is specifically configured to: move the holding member towards the adsorption device until the at least two annular sealing portions of the holding member abut against the substrate and form a second sealed cavity with the substrate; form a negative pressure in the suction passage between the at least two annular sealing portions to adsorb the substrate by a second adsorption mode, and release the ground substrate from the adsorption device; keep the holding member in the state of adsorbing the substrate by the second adsorption mode, and move the substrate out of the adsorption device and through the cleaning unit.

[0008] In one embodiment, the controller is specifically configured to: control the movement of the holding member towards the adsorption device so that the substrate abuts against the adsorption device; continue to control the movement of the holding member towards the adsorption device to compress the adsorption pad until the elastic pressing portion of the holding member abuts against the adsorption device and forms a first sealed cavity with the adsorption device, the outermost annular sealing portion and the substrate, so that the adsorption device adsorbs the substrate through the first sealed cavity.

[0009] In one embodiment, the controller is specifically configured to: form a negative pressure in the air source connected to the first sealed cavity in the adsorption device so that the adsorption device adsorbs the substrate, and release the substrate from the adsorption pad of the holding member.

[0010] In one embodiment, the holding member comprises a support frame comprising a support seat and a support arm, one end of the support arm is connected to a moving member, the other end is connected to the support seat, the adsorption pad is telescopically arranged on the support arm through the center of the support seat, and the annular chuck is fixedly arranged on the support seat.

[0011] In one embodiment, the support seat comprises a cover plate comprising a through hole for communicating with an air source, the cover plate forms an air cavity with the surface of the support seat; and the suction passage has one end between the at least two annular sealing portions and the other end communicating with the air cavity.

[0012] The second aspect of the embodiments of the present application provides a substrate carrying method applied to an adapted holding component and a suction device, comprising: enabling the suction pad of the holding component to suck the substrate in a first suction mode, and moving the substrate to a position opposite to the suction device, wherein the holding component comprises a ring-shaped suction disc and a retractable suction pad arranged concentrically; controlling the holding component to move towards the suction device, so that the substrate abuts against the suction device; enabling the suction device to suck the substrate, and enabling the suction pad of the holding component to release the substrate, so that the substrate is moved by the suction device and is ground; enabling the ring-shaped suction disc of the holding component to suck the substrate in a second suction mode, and enabling the suction device to release the ground substrate, so that the ground substrate is carried out from the suction device and passes through a cleaning unit.

[0013] In one embodiment, the ring-shaped suction disc comprises at least two ring-shaped sealing parts protruding from the suction surface of the holding component, and the diameters of the ring-shaped sealing parts are smaller than the diameter of the substrate, and the enabling the ring-shaped suction disc of the holding component to suck the substrate in the second suction mode, and enabling the suction device to release the ground substrate, so that the ground substrate is carried out from the suction device and passes through the cleaning unit, comprises: enabling the holding component to move towards the suction device until the at least two ring-shaped sealing parts of the holding component abut against the substrate and form a second sealing cavity with the substrate; enabling the suction passage between the ring-shaped sealing parts to form a negative pressure, so as to suck the substrate in the second suction mode, and enabling the suction device to release the ground substrate; enabling the holding component to keep the state of sucking the substrate in the second suction mode, and carrying the substrate out from the suction device and passing through the cleaning unit.

[0014] In one embodiment, the controlling the holding component to move towards the suction device so that the substrate abuts against the suction device comprises: controlling the holding component to move towards the suction device so that the substrate abuts against the suction device; and continuing to control the holding component to move towards the suction device so as to compress the suction pad until the elastic pressing part of the holding component abuts against the suction device, and forms a first sealing cavity with the suction device, the outermost ring-shaped sealing part and the substrate, so that the suction device sucks the substrate through the first sealing cavity.

[0015] A third aspect of the embodiments of the present application provides a carrying device for a substrate grinding device, comprising: a holding component and a suction device; the holding component comprises a support frame, a suction pad and a ring-shaped suction disc, the suction pad is arranged on the support frame in an extendable manner, the ring-shaped suction disc is fixedly arranged on the support frame, the suction pad and the ring-shaped suction disc are arranged concentrically, the holding component comprises a first suction mode of suctioning the substrate through the suction pad and a second suction mode of suctioning the substrate through the ring-shaped suction disc; the holding component is used for carrying the substrate to the suction device through the first suction mode, so that the substrate is suctioned and fixed by the suction device, and is used for carrying the ground substrate out of the suction device through the second suction mode and through a cleaning unit.

[0016] The embodiments of the present application have the following beneficial effects: the embodiments of the present application adopt the ring-shaped suction disc to suction the wafer through the second suction mode, the substrate suctioned by the ring-shaped suction disc does not deform, such as warping, by the suction device, the horizontal state of the substrate is ensured, and the suction effect is good; when passing through the cleaning unit, because the suction area of the ring-shaped suction disc is large and the wafer is horizontal, the substrate can be cleaned as much as possible without being dirty or falling off; in addition, the first sealing cavity can be formed by the ring-shaped sealing ring at the outermost layer of the ring-shaped suction disc, the substrate can be pressed towards the suction device, the suction device can suction the wafer, and the suction effect is improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] The advantages of the present application will become more apparent and more easily understood from the following detailed description, which is only illustrative and not restrictive of the present application, and which is best understood with reference to the following drawings, in which:

[0018] Figure 1 is a schematic diagram of an existing substrate thinning device;

[0019] Figure 2 is a schematic diagram of a grinding carrying manipulator 50 carrying a substrate through a cleaning unit;

[0020] Figure 3 is a schematic diagram of a substrate carrying system;

[0021] Figure 4 is a schematic diagram of a carrying device provided with a holding component;

[0022] Figure 5 is a flowchart of a carrying method;

[0023] Figure 6 is Figure 5 is a schematic diagram of a plurality of carrying states involved in the method shown in FIG. 8;

[0024] Figure 7 is Figure 5A schematic diagram of the specific process of step S3 in the method shown;

[0025] Figure 8 yes Figure 6 Enlarged view of point a in the image;

[0026] Figure 9 yes Figure 6 Enlarged view of point b in the image;

[0027] Figure 10 yes Figure 6 Enlarged view of point c in the image.

[0028] 1. Body; 2. Cleaning unit; 3. Imaging unit; 4. Substrate transfer worktable; 5. Substrate storage box before grinding; 6. Substrate storage box after grinding; 7. Substrate handling robot; 8. CMP handling robot; 9. CMP and cleaning unit; 10. Mounting beam; 11. Rotary table; 20. Rough grinding unit; 30. Fine grinding unit; 40. Adsorption device; 50. Grinding and handling robot; 51. Small-sized adsorption pad.

[0029] The components include: a handling device 60, a holding component 61, a support frame 611, a support arm 6111, a support base 6112, an adsorption pad 612, a spring 6121, a guide rod 6122, an annular suction cup 613, an annular sealing part 6131, an elastic pressing part 614, a cover plate 615, a through hole 616, an air chamber 617, a suction channel 618, a moving component 62, a lifting part 621, a lifting motor 6211, a transmission component 6212, a lead screw 6213, a guide rod 6214, a rotating part 622, an adsorption device 70, a suction cup 71, a negative pressure channel 72, and a suction groove 73. Detailed Implementation

[0030] The technical solutions described in this application will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of this application, used to illustrate the concept of this application; these descriptions are illustrative and exemplary, and should not be construed as limiting the implementation methods or the scope of protection of this application. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and description of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein.

[0031] The accompanying drawings in this specification are schematic diagrams used to illustrate the concept of this application and to schematically show the shapes of the various parts and their interrelationships. It should be understood that, in order to clearly show the structure of the various components of the embodiments of this application, the drawings are not drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.

[0032] In the ultra-precision thinning device, the ultra-precision grinding, CMP and cleaning modules, thickness deviation and surface defect control technology are mainly integrated, so as to meet the demand of substrate ultra-precision thinning technology in 3D IC manufacturing, advanced packaging and other fields.

[0033] Grinding of the back surface of the substrate refers to high-precision grinding of the semiconductor material before packaging, so that the morphology is reduced to a suitable form, so as to realize the purpose of reducing the packaging height, reducing the volume of the chip package, and improving the heat diffusion efficiency, electrical performance, mechanical performance and other purposes of the chip.

[0034] Figure 1 An exemplary structure diagram of an ultra-precision thinning device is shown, which includes a machine body 1, a cleaning unit 2, a shooting unit 3, a substrate transfer workbench 4, a pre-grinding substrate storage box 5, a post-grinding substrate storage box 6, a substrate handling robot 7, a CMP handling robot 8, a CMP and cleaning unit 9, a mounting beam 10, a rotary disc 11, a rough grinding unit 20, a fine grinding unit 30, an adsorption device 40, and a grinding handling robot 50. Each of the above parts is arranged on the machine body 1.

[0035] When the substrate is processed by the ultra-precision thinning device, the substrate handling robot 7 takes the substrate from the pre-grinding substrate storage box 5 and places it on the substrate transfer workbench 4. The shooting unit 3 takes a photo of the substrate, and the morphology of the substrate before thinning can be determined by the photo.

[0036] The substrate transfer workbench 4 can move along the guide rail to be directly below the grinding handling robot 50. The grinding handling robot 50 has a lifting mechanism and a horizontal rotating mechanism and can realize the adsorption of the substrate. The grinding handling robot 50 can transmit the substrate to the adsorption device 40 on the in-out area A position.

[0037] The adsorption device 40 is installed on the rotary disc 11 and is uniformly arranged at intervals of 120° in the circumferential direction. The adsorption device 40 has a disc-shaped suction cup made of porous ceramic material, which can realize the adsorption of the substrate by vacuumizing.

[0038] The rotary disc 11 can make a 120°-interval rotating motion in the direction of the arrow 12 by a driving mechanism not shown in the figure. When the rotary disc 11 rotates 120°, the substrate enters the rough grinding processing area B from the in-out area A, and the rough grinding unit 20 is used for rough machining. After the rough machining is completed, the rotary disc 11 rotates 120° again, and the substrate enters the fine grinding processing area C, and the fine grinding unit 30 is used for fine machining. After the fine grinding processing is completed, the rotary disc 11 rotates 120° again, and the substrate returns to the in-out area A.

[0039] The grinding transfer robot 50 takes the wafer from the adsorption device 40, and after passing through the cleaning unit 2, transfers the wafer to the substrate transfer worktable 4. The CMP transfer robot 8 takes the wafer from the substrate transfer worktable 4, and transfers the wafer to the CMP and cleaning unit 9. After CMP polishing and cleaning, the wafer is transported to the ground substrate storage box 6 by the substrate transfer robot 7, so as to complete the thinning and polishing process of the wafer.

[0040] Referring to Figure 2 , the grinding transfer robot 50 can be provided with a small-size adsorption pad 51 for adsorbing the substrate, for adsorbing the substrate, realizing the transfer of the substrate in the above process, and can pass through the cleaning unit 2 during the transfer process, so as to flush the substrate by the nozzle 21. The dashed line in the figure shows the schematic flushing range of the nozzle 21 flushing the substrate.

[0041] However, after the grinding of the substrate is completed, when the adsorption device 40 is released, due to the existence of residual stress, the substrate still has a certain warping, which causes that when the small-size adsorption pad 51 adsorbs the substrate passing through the cleaning unit 2, the substrate is not in a completely horizontal state to receive the flushing of the nozzle 21.

[0042] Due to the small size of the adsorption pad, the adsorption area and adsorption force are limited. During the flushing process of the cleaning unit, due to the fact that the substrate is not in a completely horizontal state, the impact force of the two fluids can cause the substrate to fall off; and due to the insufficient adsorption force of the small-size adsorption pad, the flow rate and flow of the two fluid ejection are limited, which causes poor cleaning effect of the substrate and affects the subsequent process.

[0043] Therefore, the present application provides another substrate transfer scheme. The transfer scheme will be described below through specific embodiments.

[0044] Embodiments disclosed in the present application generally relate to a thinning device used in the semiconductor device manufacturing industry.

[0045] Referring to Figures 3-10 , a substrate transfer system for a substrate thinning device is shown, which comprises an adapted holding component 61, an adsorption device 70 and a controller. The controller is not shown in the figure.

[0046] As shown in Figure 3 , the holding component 61 comprises a concentrically arranged adsorption pad 612 and an annular chuck 613. The holding component 61 comprises a first adsorption mode of adsorbing the substrate by the adsorption pad 612, and a second adsorption mode of adsorbing the substrate by the annular chuck 613. The concentrically arranged adsorption pad 612 and annular chuck 613 can make the holding component be circumferentially symmetrical when adsorbing the substrate, so as to ensure the adsorption effect.

[0047] As shown in Figure 3As shown, the adsorption device 70 includes a disc-shaped suction cup 71, a negative pressure channel 72 disposed on the suction cup 71, and an adsorption groove 73 disposed at the bottom of the suction cup 71. The adsorption groove 73 and the negative pressure channel 72 create a negative pressure on the suction cup 71, adsorbing the substrate. Figure 3 The downward arrow indicates the direction of airflow that creates negative pressure.

[0048] By maintaining the cooperation between component 61 and adsorption device 70, wafer handling can be achieved. The handling process is described below.

[0049] Specifically, such as Figure 3 As shown, the annular suction cup 613 includes at least two annular sealing portions 6131, each annular sealing portion 6131 protruding from the adsorption surface of the holding member 61, and the diameter of the annular sealing portion 6131 is smaller than the diameter of the substrate. Thus, the annular sealing portion 6131 abuts against the substrate surface to form a second sealed cavity, preventing the adsorption process from being affected by residual grinding contaminants on the substrate surface, facilitating adsorption and ensuring the adsorption effect.

[0050] Specifically, such as Figure 3 As shown, the holding component 61 includes a support frame 611, which includes a support base 6112 and a support arm 6111. One end of the support arm 6111 is connected to the moving component 62, and the other end is connected to the support base 6112. The adsorption pad 612 is telescopically disposed on the support arm 6111, passing through the center of the support base 6112. The annular suction cup 613 is fixedly disposed on the support base 6112. Thus, the adsorption pad 612 can be fixed by the support arm 6111, and the annular suction cup 613 can be disposed by the support base 6112, so that the adsorption pad 612 and the annular suction cup 613 are concentrically disposed and do not interfere with each other.

[0051] Specifically, the adsorption pad 612 is mounted on the support arm 6111 via a spring 6121 and a guide rod 6122. The extension length of the adsorption pad 612 can be controlled by controlling the length of the guide rod 6122.

[0052] Specifically, such as Figure 3 As shown, the support base 6112 includes a cover plate 615 above it. The cover plate 615 includes a through hole 616 for connecting to an air source. The cover plate 615 and the surface of the support base 6112 form an air cavity 617. The suction channel 618 has one end located between at least two annular sealing parts 6131 and the other end connected to the air cavity 617. Specifically, the suction channel 618 and the air cavity 617 can form a negative pressure in the second sealing cavity to achieve the adsorption of the substrate W.

[0053] like Figure 3As shown, the holding component 61 further comprises an elastic pressing portion 614, which can abut against the outer periphery of the adsorption device 70 and form a first sealing cavity with the adsorption device 70, the annular sealing portion 6131 of the outermost ring and the substrate W, so that the adsorption device 70 can adsorb the substrate W through the first sealing cavity. Specifically, the adsorption device 70 can form a negative pressure in the first sealing cavity through the suction groove 73 and the negative pressure channel 72, so as to adsorb the substrate W. At this time, the annular sealing portion 6131 of the outermost layer is also used to press the substrate W towards the adsorption device 70, so that the adsorption device 70 can smoothly adsorb the substrate W.

[0054] In addition, one end of the support arm 6111 of the holding component 61 is arranged on the moving component 62 of the conveying device, and the other end of the moving component 62 is fixedly arranged on the mounting beam of the substrate W thinning device. The holding component 61 can drive the substrate W to move under the driving of the moving component 62.

[0055] For example, referring to Figure 4 , a schematic view of a conveying device provided with a holding component 61 is shown. As shown, the conveying device 60 comprises a moving component 62, the upper part of the moving component 62 is used to be fixed on the mounting beam, and the other end is rotatably connected with the support arm 6111 of the holding component 61.

[0056] The moving component 62 can specifically comprise a lifting portion 621 and a rotating portion 622. The lifting portion 621 comprises a lifting motor 6211, a transmission member 6212 and a lead screw 6213. One end of the rotating portion 622 is connected with the lifting portion 621 through a guide rod 6214, so as to perform lifting movement under the driving of the lifting portion 621, as indicated by the up and down arrows in Figure 4 , the other end of the rotating portion 622 is rotatably connected with the support arm 6111 of the holding component 61, so as to drive the holding component 61 to rotate, as indicated by the arc-shaped arrow in Figure 4 .

[0057] The specific control flow and the multiple states of the holding component 61 and the adsorption device during the execution of the flow will be described below, as shown in Figure 5 , the controller is used to control the holding component 61 and the adsorption device to perform the following steps S1-S4.

[0058] S1, allowing the holding component to adsorb the substrate in a first adsorption mode and move the substrate to a position opposite to the adsorption device.

[0059] Referring to Figure 6 , the adsorption pad 612 of the holding component 61 adsorbs the substrate W in a first adsorption mode and moves to a position opposite to the adsorption device 70. In the present application, it moves to the position directly above the adsorption device 70.

[0060] S2, controlling the holding component to move towards the adsorption device, so that the substrate abuts against the adsorption device.

[0061] Referring to Figure 6 , the holding component 61 as a whole moves towards the adsorption device 70, i.e. moves downward, until the substrate W held by the holding component 61 abuts against the adsorption device 70.

[0062] S3, causing the adsorption device to adsorb the substrate, and causing the adsorption pad of the holding component to release the substrate, so as to move the substrate by the adsorption device and perform grinding.

[0063] Referring to Figure 6 , for example, after the adsorption device 70 adsorbs the substrate W and the adsorption pad 612 of the holding component 61 releases the substrate W, the holding component 61 can move upward, so that the adsorption device 70 moves the substrate W and performs grinding. The specific grinding process can refer to the above-mentioned embodiments, which will not be described here.

[0064] Optionally, in the embodiment, referring to Figure 3 , since the adsorption pad 612 is arranged to be retractable, the adsorption pad 612 can be extended and adsorb the substrate W, so as to prevent the adsorption effect of the adsorption pad 612 from being affected by the annular suction cup 613. Correspondingly, when step S3 is performed, referring to Figure 7 , the controller is specifically used for:

[0065] S31, controlling the holding component to move towards the adsorption device, so that the substrate abuts against the adsorption device.

[0066] S32, continuing to control the holding component to move towards the adsorption device, so as to compress the adsorption pad, until the elastic downward pressing part of the holding component abuts against the adsorption device, and forms a first sealing cavity together with the adsorption device, the annular sealing part of the outermost ring and the substrate.

[0067] S33, causing the adsorption device to adsorb the substrate through the first sealing cavity.

[0068] Thus, the adsorption pad of the holding component can release the substrate, and then the substrate is moved by the adsorption device and grinded.

[0069] The first sealing cavity formed can be as shown in Figure 8 .

[0070] Optionally, after the first sealing cavity is formed, the controller is specifically used for: causing the gas source in the adsorption device 70 which is communicated to the first sealing cavity to form a negative pressure, so that the adsorption device 70 adsorbs the substrate W, and causing the adsorption pad 612 of the holding component 61 to release the substrate W. At this time, the annular sealing part 6131 at the outermost side can be used to press the wafer towards the surface of the adsorption device 70, so as to assist the adsorption device 70 to adsorb the wafer.

[0071] S4, the holding component adsorbs the substrate by the second adsorption mode, and the adsorption device releases the ground substrate, so as to carry out the ground substrate from the adsorption device and pass through the cleaning unit.

[0072] Specifically, the holding component 61 moves towards the adsorption device 70, and under the condition that the substrate W is adsorbed by the adsorption device 70, see Figure 6 , the annular chuck 613 adsorbs the substrate W by the second adsorption mode. Since the substrate W is still adsorbed by the adsorption device 70, the substrate W adsorbed by the annular chuck 613 does not deform, such as warping, which ensures the horizontal state of the substrate W and has good adsorption effect.

[0073] After the annular chuck 613 of the holding component 61 adsorbs the substrate W, the ground substrate W can be carried out from the adsorption device 70 and pass through the cleaning unit. When passing through the cleaning unit, since the adsorption area of the annular chuck 613 is large and the wafer is horizontal, the substrate W can be cleaned as much as possible or the wafer can be avoided. The situation of falling off.

[0074] Referring to Figure 9 , a schematic view of the formed second sealed cavity is shown, as Figure 9 shown, the annular sealing part 6131 includes at least two, protruding from the adsorption surface of the holding component 61, and can be in abutment with the surface of the substrate W to form a second sealed cavity. The adsorption surface of the holding component 61 is specifically the lower surface of the support seat 6112.

[0075] At least two annular sealing parts 6131 include suction passages 618, which can form negative pressure in the second sealed cavity, so as to complete the adsorption of the substrate W. After the adsorption is completed, the substrate W can be carried through the cleaning unit. The schematic view after the adsorption is completed can be shown as Figure 10 .

[0076] Correspondingly, in the embodiment, when step S4 is performed, the controller is specifically configured to: move the holding component towards the adsorption device 70 until the at least two annular sealing parts 6131 of the holding component are in abutment with the substrate W and form a second sealed cavity with the substrate W; form negative pressure in the suction passage 618 between the at least two annular sealing parts 6131 to adsorb the substrate W by the second adsorption mode, and release the ground substrate W by the adsorption device 70; keep the state of the holding component adsorbing the substrate W by the second adsorption mode, and carry out the substrate W from the adsorption device 70 and pass through the cleaning unit.

[0077] In summary, the scheme provided in the application adopts the annular chuck 613 to adsorb the wafer through the second adsorption mode, and the substrate W adsorbed by the annular chuck 613 does not deform, such as warping, through the adsorption device 70, so as to ensure the horizontal state of the substrate W and have a better adsorption effect; when passing through the cleaning unit, since the adsorption area of the annular chuck 613 is large and the wafer is horizontal, the substrate W can be cleaned as much as possible to avoid the situation of not being cleaned or falling off; in addition, the first sealing cavity can be formed by the annular sealing ring at the outermost layer of the annular chuck 613, and the substrate W is pressed towards the adsorption device 70, so as to assist the adsorption device 70 to adsorb the wafer and improve the adsorption effect.

[0078] Another embodiment of the application also claims a carrying device for a substrate grinding device, comprising a holding component and an adsorption device; the holding component comprises a support frame, an adsorption pad and an annular chuck, the adsorption pad is arranged on the support frame in an extendable manner, and the annular chuck is fixedly arranged on the support frame; the adsorption pad and the annular chuck are concentrically arranged; the holding component comprises a first adsorption mode of adsorbing the substrate through the adsorption pad and a second adsorption mode of adsorbing the substrate through the annular chuck; the holding component is used for carrying the substrate to the adsorption device through the first adsorption mode, so that the substrate is adsorbed and fixed by the adsorption device, and is used for carrying the ground substrate out of the adsorption device through the second adsorption mode and passing through a cleaning unit.

[0079] The specific structure of the carrying device can refer to the above-mentioned embodiments, which will not be described here again.

[0080] Another embodiment of the application also provides a computer readable storage medium, which stores executable instructions, and the executable instructions are used to cause a processor to execute the executable instructions to implement the method.

[0081] Another embodiment of the application also provides a computer program product or a computer program, which comprises executable instructions stored in a computer readable storage medium; when a processor of an electronic device reads the executable instructions from the computer readable storage medium and executes the executable instructions, the method is implemented.

[0082] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0083] While the embodiments of the application have been shown and described, it is to be understood that the embodiments can be varied, modified, substituted and changed by those skilled in the art without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. A substrate handling system for a substrate thinning apparatus, characterized in that, The holding component, the adsorption device and the controller are adapted; The holding component comprises a concentrically arranged adsorption pad and a ring-shaped adsorption disc, the adsorption pad is located at the center of the ring-shaped adsorption disc, the holding component comprises a first adsorption mode of adsorbing the substrate through the adsorption pad and a second adsorption mode of adsorbing the substrate through the ring-shaped adsorption disc; The controller is used to control the holding component and the adsorption device to perform the following steps: The holding component adsorbs the substrate in the first adsorption mode and moves the substrate to a position opposite to the adsorption device; The controller controls the conveying device to move towards the adsorption device so that the substrate abuts against the adsorption device; The adsorption device adsorbs the substrate, and the adsorption pad of the holding component releases the substrate to move and be ground by the adsorption device; The holding component adsorbs the substrate in the second adsorption mode, and the adsorption device releases the ground substrate to carry the ground substrate out of the adsorption device and through the cleaning unit.

2. The substrate handling system of claim 1, wherein, The ring-shaped adsorption disc comprises at least two ring-shaped sealing parts, the ring-shaped sealing parts protrude from the adsorption surface of the holding component, and the diameters of the ring-shaped sealing parts are smaller than the diameter of the substrate, and the controller is specifically used to: The holding component moves towards the adsorption device until the at least two ring-shaped sealing parts of the holding component abut against the substrate and form a second sealing cavity with the substrate; A negative pressure is formed in the suction passage between the at least two ring-shaped sealing parts to adsorb the substrate in the second adsorption mode, and the adsorption device releases the ground substrate; The holding component keeps the state of adsorbing the substrate in the second adsorption mode and carries the substrate out of the adsorption device and through the cleaning unit.

3. The substrate handling system of claim 2, wherein The controller is specifically used to: The holding component moves towards the adsorption device so that the substrate abuts against the adsorption device; The holding component continues to move towards the adsorption device to compress the adsorption pad until the elastic pressing part of the holding component abuts against the adsorption device and forms a first sealing cavity with the adsorption device, the outermost ring-shaped sealing part and the substrate, so that the adsorption device adsorbs the substrate in the first sealing cavity.

4. The substrate handling system of claim 3, wherein The controller is specifically used to: The gas source connected to the first sealing cavity in the adsorption device forms a negative pressure, so that the adsorption device adsorbs the substrate, and the adsorption pad of the holding component releases the substrate.

5. The substrate handling system of claim 2, wherein, The holding component comprises a support frame, the support frame comprises a support seat and a support arm, one end of the support arm is connected with a moving component, the other end is connected with the support seat, the adsorption pad is telescopically arranged on the support arm through the center of the support seat, and the ring-shaped adsorption disc is fixedly arranged on the support seat.

6. The substrate handling system of claim 5, wherein, The support seat comprises a cover plate, the cover plate comprises a through hole for connecting the gas source, and the cover plate forms an air cavity with the surface of the support seat; The suction passage is connected between the at least two ring-shaped sealing parts at one end and the air cavity at the other end.

7. A substrate handling method applied to a matched holding member and a suction device, characterized by, The holding component, the adsorption device and the controller are adapted; The adsorption pad of the holding component adsorbs the substrate in a first adsorption mode, and moves the substrate to the position directly opposite the adsorption device. The holding component includes a concentrically arranged annular suction cup and a retractable adsorption pad, with the adsorption pad located at the center of the annular suction cup. Control the holding member to move toward the adsorption device so that the substrate comes into contact with the adsorption device; The adsorption device adsorbs the substrate, and the adsorption pad of the holding member releases the substrate, so that the adsorption device can move the substrate and perform grinding. The annular suction cup of the holding component is used to adsorb the substrate through the second adsorption mode, and the adsorption device is used to release the ground substrate so that the ground substrate can be removed from the adsorption device and passed through the cleaning unit.

8. The method of claim 7, wherein, The annular suction cup includes at least two annular sealing portions, each annular sealing portion protruding from the adsorption surface of the holding member, and the diameter of the annular sealing portion is smaller than the diameter of the substrate. The step of having the annular suction cup of the holding member adsorb the substrate through a second adsorption mode, and having the adsorption device release the ground substrate, so as to remove the ground substrate from the adsorption device and pass it through a cleaning unit, includes: Move the holding member toward the adsorption device until at least two annular sealing portions of the holding member abut against the substrate and form a second sealing cavity with the substrate; A negative pressure is formed in the suction channel between the annular sealing parts to adsorb the substrate through the second adsorption mode, and the adsorption device releases the ground substrate. The holding component is kept in the state of adsorbing the substrate through the second adsorption mode, and the substrate is moved out of the adsorption device and passed through the cleaning unit.

9. The method of claim 8, wherein, The control of moving the holding member toward the adsorption device so that the substrate abuts against the adsorption device includes: Control the holding member to move toward the adsorption device, so that the substrate comes into contact with the adsorption device; Continue to control the holding member to move toward the adsorption device to compress the adsorption pad until the elastic pressing part of the holding member abuts against the adsorption device and forms a first sealing cavity with the adsorption device, the outermost annular sealing part, and the substrate, so that the adsorption device adsorbs the substrate through the first sealing cavity.

10. A handling apparatus for a substrate grinding apparatus, characterized by, include: Holding components and adsorption devices; The holding component includes: a support frame, an adsorption pad, and an annular suction cup. The adsorption pad is retractably mounted on the support frame, and the annular suction cup is fixedly mounted on the support frame. The adsorption pad and the annular suction cup are concentrically arranged, with the adsorption pad located at the center of the annular suction cup. The holding component includes a first adsorption mode in which the substrate is adsorbed by the adsorption pad, and a second adsorption mode in which the substrate is adsorbed by the annular suction cup. The holding component is used to transport the substrate to the adsorption device in a first adsorption mode, so that the substrate is adsorbed and fixed by the adsorption device, and to remove the ground substrate from the adsorption device and pass it through the cleaning unit in a second adsorption mode.

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