A multi-chip array integrated liquid structure with internal chip cooling

Abstract

The present invention proposes a multi-chip array liquid collection and distribution structure for internal cooling of chips, comprising: a multi-chip array, a bottom substrate, a secondary liquid collection substrate, a secondary liquid distribution substrate and a primary liquid collection and distribution substrate; low-temperature cooling liquid enters from the total liquid inlet of the primary liquid collection and distribution substrate, passes through the primary liquid distribution flow channel of the primary liquid collection and distribution substrate and the secondary liquid distribution flow channel of the secondary liquid distribution substrate for uniform flow distribution, and then enters the interior of each chip in the multi-chip array through the liquid inlet of the secondary liquid collection substrate and the liquid inlet of the bottom substrate for cooling, takes away the heat of the multi-chip array and turns into high-temperature cooling liquid, which is then cooled by the bottom substrate. The liquid enters the secondary liquid collection channel of the secondary liquid collection substrate through the liquid outlet of the secondary liquid collection substrate and the liquid outlet of the secondary liquid separation substrate, and enters the primary liquid collection channel of the primary liquid collection and separation substrate through the liquid outlet of the secondary liquid collection substrate and the liquid outlet of the secondary liquid separation substrate, and finally flows out from the total liquid outlet of the primary liquid collection and separation substrate; the present invention realizes the parallel flow channels of multiple chips and uniform flow distribution between chips through the design of two-stage liquid separation flow channels and two-stage liquid collection flow channels, ensures extremely high temperature uniformity of the multi-chip array, and has the advantages of small footprint and low power consumption, providing a solution for realizing efficient heat transport of multiple chips in a confined space.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic device cooling, and in particular relates to a multi-chip array centralized and distributed liquid structure for internal cooling of chips. Background Art

[0002] High-performance servers in data centers contain tens of thousands of chips. Failure to effectively and promptly reduce chip temperatures will lead to rapid performance degradation. To ensure stable operation of high-performance servers, high temperature uniformity is required across the multi-chip array. This requires a centralized and distributed liquid cooling structure to ensure uniform flow distribution across each chip, while also implementing direct liquid cooling within the chip itself to minimize temperature differences between chips.

[0003] Traditional multi-chip flow channels are primarily connected in series. While this ensures consistent flow rates for each chip, the water temperature continues to rise, leading to poor temperature uniformity and a sharp increase in pressure drop across the multi-chip array. Parallel flow channels can significantly reduce pressure drop and improve temperature uniformity across the multi-chip array compared to serial channels. However, existing multi-chip parallel flow channels require a large footprint and still suffer from poor pressure drop and temperature uniformity. There is an urgent need to develop a multi-chip flow channel structure and method with a small footprint, low pressure drop, and high temperature uniformity to provide a solution for efficient multi-chip heat transfer within confined spaces. Summary of the Invention

[0004] In response to the deficiencies in the prior art, the purpose of the present invention is to provide a multi-chip array liquid collection and distribution structure for internal chip cooling. By designing two-stage liquid collection channels and two-stage liquid collection channels, parallel flow channels of multiple chips and uniform flow distribution between chips are achieved, ensuring extremely high temperature uniformity of the multi-chip array. At the same time, it has the advantages of small footprint and low power consumption, providing a solution for achieving efficient heat transport of multiple chips in a confined space.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A multi-chip array liquid collection and separation structure for internal chip cooling, comprising, from bottom to top, a multi-chip array 1 in close contact, a bottom substrate 2, a secondary liquid collection substrate 3, a secondary liquid separation substrate 4, and a primary liquid collection and separation substrate 5;

[0007] The front surface of the multi-chip array 1 contacting the bottom substrate 2 is provided with a plurality of microchannels 6, and the back surface is provided with a plurality of integrated circuits 7 at positions corresponding to the microchannels 6. The low-temperature coolant in the microchannels 6 removes the heat generated by the integrated circuits 7 and turns into high-temperature coolant to directly cool the chips internally.

[0008] The bottom substrate 2 is provided with a plurality of bottom substrate liquid inlets 8 and a plurality of bottom substrate liquid outlets 9, and each microfluidic channel 6 of the multi-chip array 1 corresponds to one bottom substrate liquid inlet 8 and one bottom substrate liquid outlet 9;

[0009] The front side of the secondary liquid collecting substrate 3 contacting the secondary liquid separating substrate 4 is provided with a plurality of secondary liquid collecting substrate liquid inlets 10 and a plurality of secondary liquid collecting substrate liquid outlets 11, wherein the positions of the secondary liquid collecting substrate liquid inlets 10 and the liquid inlets 8 of the bottom substrate are in one-to-one correspondence and the sizes are the same, and the secondary liquid collecting substrate liquid outlets 11 are connected to the liquid outlet 9 of the bottom substrate; the back side is provided with a secondary liquid collecting flow channel 12, and the secondary liquid collecting flow channel 12 is connected to the liquid outlet 9 of the bottom substrate;

[0010] The front side of the secondary liquid-separating substrate 4 contacting the primary liquid-collecting substrate 5 is provided with a plurality of secondary liquid-separating substrate liquid inlets 13 and a plurality of secondary liquid-separating substrate liquid outlets 14, the secondary liquid-separating substrate liquid inlets 13 being connected to the secondary liquid-collecting substrate liquid inlet 10, the secondary liquid-separating substrate liquid outlets 14 being in one-to-one correspondence with the secondary liquid-collecting substrate liquid outlets 11 and having the same size; the back side is provided with a secondary liquid-separating flow channel 15, the secondary liquid-separating flow channel 15 being connected to the secondary liquid-collecting substrate liquid inlet 10;

[0011] The front side of the first-level liquid collecting and separating substrate 5 is provided with a total liquid inlet 16 and two total liquid outlets 17, which are connected to the second-level liquid separating substrate liquid inlet 13 and the second-level liquid separating substrate liquid outlet 14; the back side is provided with a first-level liquid collecting and separating flow channel, which includes a first-level liquid separating flow channel 18 connected to the second-level liquid separating substrate liquid inlet 13 and a first-level liquid collecting flow channel 19 connected to the second-level liquid separating substrate liquid outlet 14.

[0012] The multi-chip array 1 , the bottom substrate 2 , the secondary liquid collecting substrate 3 , the secondary liquid separating substrate 4 and the primary liquid collecting and separating substrate 5 are symmetrical in left-right and top-bottom directions.

[0013] The thickness of the secondary liquid collecting substrate 3, the secondary liquid separating substrate 4 and the primary liquid collecting and separating substrate 5 is the same, which is twice the thickness of the bottom substrate 2;

[0014] The depths of the secondary liquid collecting substrate liquid inlet 10 of the secondary liquid collecting substrate 3 and the secondary liquid separating substrate liquid outlet 14 of the secondary liquid separating substrate 4 are the same, which is twice the thickness of the bottom substrate 2; the depths of the remaining liquid inlets, liquid outlets and liquid collecting and separating flow channels of the bottom substrate 2, the secondary liquid collecting substrate 3, the secondary liquid separating substrate 4 and the primary liquid collecting and separating substrate 5 are all the same, which is the same as the thickness of the bottom substrate 2.

[0015] The microchannels 6 of the multi-chip array 1 are straight channels, zigzag channels, wavy channels or fin array channels, and have no heat dissipation enhancement structure or added cavity or fin structure inside.

[0016] The low-temperature coolant is injected into the edge of the microchannel 6 through the substrate liquid inlet 8 to form a local jet, which is ejected from the other side edge of the microchannel 6. The length of the bottom substrate liquid inlet 8 and the bottom substrate liquid outlet 9 is the same as the total width of the microchannel 6.

[0017] The secondary liquid collecting substrate outlet 11 of the secondary liquid collecting substrate 3, the secondary liquid separating substrate liquid inlet 13 and the secondary liquid separating substrate liquid outlet 14 of the secondary liquid separating substrate 4, and the total liquid inlet 16 and the total liquid outlet 17 of the primary liquid collecting and separating substrate 5 are rectangular or circular in shape.

[0018] The low-temperature coolant enters the primary liquid separation channel 18 of the primary liquid collection and separation substrate 5 through the total liquid inlet 16 of the primary liquid collection and separation substrate 5. In the primary liquid separation channel 18, it is first evenly distributed from the total liquid inlet 16 to four oblique channels, including an upper oblique channel and a lower oblique channel, and then connected in pairs to form two vertical straight channels. In each vertical straight channel, it is distributed to three liquid inlets, including the liquid inlets on both sides of the short flow after diversion and the middle liquid inlet of the long flow after diversion. The increase in flow resistance brought by the long flow can suppress the flow distribution with more middle liquid inlets caused by confluence, and the reduction in flow resistance brought by the short flow can suppress the flow distribution with fewer liquid inlets on both sides caused by only diversion, thereby ensuring uniform flow distribution among the three liquid inlets.

[0019] The low-temperature coolant enters the secondary liquid separation channel 15 of the secondary liquid separation substrate 4 through the six liquid inlets of the two vertical straight channels in the first-level liquid separation channel 18 of the first-level liquid collecting and separating substrate 5 and the six secondary liquid separation substrate liquid inlets 13 of the secondary liquid separation substrate 4. In the secondary liquid separation channel 15, the six secondary liquid separation substrate liquid inlets 13 are connected in pairs to form three horizontal channels, and each horizontal channel is connected to three vertical branch channels. The low-temperature coolant is distributed to three vertical branch channels in each horizontal channel, including the vertical branch channels on both sides of the short process after the diversion and the middle vertical branch channel of the long process after the diversion. The increase in flow resistance brought by the long process suppresses the more flow distribution in the middle vertical branch channel caused by the convergence, and the reduction in flow resistance brought by the short process suppresses the less flow distribution in the vertical branch channels on both sides caused by only the diversion, thereby ensuring uniform flow distribution in the three vertical branch channels.

[0020] Each vertical branch flow channel is connected to the secondary liquid collecting substrate liquid inlet 10 of four secondary liquid collecting substrates 3, wherein the four secondary liquid collecting substrate liquid inlets connected by the vertical branch flow channels on both sides include the two outer secondary liquid collecting substrate liquid inlets of the short flow path after the diversion from the vertical branch flow channel and the two inner secondary liquid collecting substrate liquid inlets of the long flow path after the diversion from the vertical branch flow channel. The low-temperature coolant will hit the outer wall surfaces of the vertical branch flow channels on both sides along the flow direction, and under the influence of the reaction force of the wall, it will flow more to the two inner secondary liquid collecting substrate liquid inlets. The increase in flow resistance brought by the long flow path suppresses the larger flow distribution of the two inner secondary liquid collecting substrate liquid inlets, and the reduction in flow resistance brought by the short flow path suppresses the smaller flow distribution of the two outer secondary liquid collecting substrate liquid inlets, thereby ensuring uniform flow distribution of the four secondary liquid collecting substrate liquid inlets connected by the vertical branch flow channels;

[0021] The low-temperature coolant enters each chip of the multi-chip array 1 through the secondary liquid collecting substrate liquid inlet 10 of the secondary liquid collecting substrate 3 and the bottom substrate liquid inlet 8 of the bottom substrate 2 to cool the chips, taking away the heat of the multi-chip array 1 and then turning into high-temperature coolant;

[0022] The high-temperature coolant enters the secondary liquid collecting channel 12 of the secondary liquid collecting substrate 3 through the bottom substrate liquid outlet 9 of the bottom substrate 2. In the secondary liquid collecting channel 12, every three of the nine vertical branch channels are interconnected to form three horizontal channels, including horizontal channels on both sides and a middle horizontal channel. The horizontal channels on both sides and the middle horizontal channel are interconnected through two vertical channels. The high-temperature coolant is collected into two liquid outlets in each vertical channel. The two liquid outlets are far away from the middle horizontal channel and close to the horizontal channels on both sides. The long flow path between the middle horizontal channel and the liquid outlet increases the flow resistance, suppressing the lower pressure of the middle horizontal channel caused by the connection of the middle horizontal channel with multiple liquid outlets. The short flow path between the horizontal channels on both sides and the liquid outlet reduces the flow resistance, suppressing the higher pressure of the horizontal channels on both sides caused by the connection of the horizontal channels with fewer liquid outlets, thereby reducing the pressure distribution difference between the horizontal channels on both sides and the middle horizontal channel, and preventing the horizontal channel pressure from being too low or too high, causing the flow rate of the connected chips to increase or decrease;

[0023] The high-temperature coolant enters the primary liquid collecting channel 19 of the primary liquid collecting and separating substrate 5 through the secondary liquid collecting substrate outlet 11 of the secondary liquid collecting substrate 3 and the secondary liquid separating substrate outlet 14 of the secondary liquid separating substrate 4, and finally flows out from the total liquid outlet 17 of the primary liquid collecting and separating substrate 5.

[0024] In the secondary liquid collecting substrate 3, the farther the secondary liquid collecting substrate outlet 11 is from the middle horizontal flow channel, the higher the pressure of the middle horizontal flow channel, and the smaller the flow of the connected chip. At the same time, the smaller the pressure of the horizontal flow channels on both sides, the greater the flow of the connected chip.

[0025] In the secondary liquid separation substrate 4, the farther the vertical branch flow channels on both sides are from the two inner liquid inlets, the less flow is distributed to the two inner liquid inlets, and the more flow is distributed to the two outer liquid inlets;

[0026] In the secondary liquid separation substrate 4, the farther the secondary liquid separation substrate liquid inlet 13 is from the middle vertical branch flow channel, the more flow distribution is distributed to the vertical branch flow channels on both sides, and the less flow distribution is distributed to the middle vertical branch flow channel;

[0027] In the first-level liquid collecting and distributing substrate 5 , the larger the angle between the upper oblique flow channel and the lower oblique flow channel, the more flow distribution is distributed to the liquid inlets on both sides, and the less flow distribution is distributed to the middle liquid inlet.

[0028] By adjusting the distance between the liquid outlet 11 of the secondary liquid collecting substrate and the middle horizontal flow channel, the distance between the vertical branch flow channels on both sides and the two inner liquid inlets, the distance between the liquid inlet 13 of the secondary liquid separation substrate and the middle vertical branch flow channel, and the angle between the upper oblique flow channel and the lower oblique flow channel, a flow regulation network of the multi-chip array is formed to achieve uniform flow distribution of the multi-chip array.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] The present invention realizes the parallel flow channels of multiple chips and uniform flow distribution between chips through the design of two-stage liquid separation channels and two-stage liquid collection channels, ensuring extremely high temperature uniformity of the multi-chip array. At the same time, it has the advantages of small footprint and low power consumption, providing a solution for achieving efficient heat transport of multiple chips in a confined space. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 Schematic diagram of the multi-chip array integrated liquid distribution structure for internal cooling of the chip;

[0032] Figure 2 Schematic diagram of the front and back structures of the multi-chip array;

[0033] Figure 3 Schematic diagram of the front and back structures of the bottom substrate;

[0034] Figure 4 Schematic diagram of the front and back structures of the secondary liquid collection substrate;

[0035] Figure 5 Schematic diagram of the front and back structures of the secondary liquid separation substrate;

[0036] Figure 6 Schematic diagram of the front and back structures of the first-level liquid collecting and distributing substrate;

[0037] Figure 7 is the maximum temperature distribution diagram of the multi-chip array;

[0038] Among them, 1. multi-chip array, 2. bottom substrate, 3. secondary liquid collection substrate, 4. secondary liquid separation substrate, 5. primary liquid collection and separation substrate, 6. microfluidic channel, 7. integrated circuit, 8. bottom substrate liquid inlet, 9. bottom substrate liquid outlet, 10. secondary liquid collection substrate liquid inlet, 11. secondary liquid collection substrate liquid outlet, 12. secondary liquid collection channel, 13. secondary liquid separation substrate liquid inlet, 14. secondary liquid separation substrate liquid outlet, 15. secondary liquid separation channel, 16. total liquid inlet, 17. total liquid outlet, 18. primary liquid separation channel, 19. primary liquid collection channel. DETAILED DESCRIPTION

[0039] Specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Although specific embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0040] It should be noted that certain words are used in the specification and claims to refer to specific components. Those skilled in the art should understand that technicians may use different nouns to refer to the same component. This specification and claims do not use the difference in nouns as a way to distinguish components, but use the difference in the functions of the components as the criterion for distinction. As mentioned throughout the specification and claims, "including" or "comprising" is an open term, so it should be interpreted as "including but not limited to". The subsequent description of the specification is a preferred embodiment of the present invention, but the description is based on the general principles of the specification and is not intended to limit the scope of the invention. The scope of protection of the present invention shall be as defined in the attached claims.

[0041] To facilitate understanding of the embodiments of the present invention, further explanation will be given below using specific embodiments as examples in conjunction with the accompanying drawings, and the accompanying drawings do not constitute a limitation on the embodiments of the present invention.

[0042] In one embodiment, if Figure 1As shown, a multi-chip array liquid collection and separation structure with internal chip cooling includes, from bottom to top, a multi-chip array 1, a bottom substrate 2, a secondary liquid collection substrate 3, a secondary liquid separation substrate 4 and a primary liquid collection and separation substrate 5 in close contact; the multi-chip array 1, the bottom substrate 2, the secondary liquid collection substrate 3, the secondary liquid separation substrate 4 and the primary liquid collection and separation substrate 5 are symmetrical left to right and up to down; the thickness of the secondary liquid collection substrate 3, the secondary liquid separation substrate 4 and the primary liquid collection and separation substrate 5 is 2 mm, which is twice the thickness of the bottom substrate 2; the depth of the secondary liquid collection substrate liquid inlet 10 of the secondary liquid collection substrate 3 and the secondary liquid separation substrate liquid outlet 14 of the secondary liquid separation substrate 4 are the same, which is twice the thickness of the bottom substrate 2, and the depth of the remaining liquid inlets, liquid outlets and liquid collection and separation channels of the bottom substrate 2, the secondary liquid collection substrate 3, the secondary liquid separation substrate 4 and the primary liquid collection and separation substrate 5 are all 1 mm, which is the same as the thickness of the bottom substrate 2; the side lengths of the bottom substrate 2, the secondary liquid collection substrate 3, the secondary liquid separation substrate 4 and the primary liquid collection and separation substrate 5 are all 85 mm.

[0043] In one embodiment, if Figure 2 As shown, the multi-chip array 1 is arranged in a 4×9 array, with a chip size of 10mm×10mm×0.725mm. A microchannel 6 is provided on the front side contacting the bottom substrate 2, and an integrated circuit 7 is provided on the back side. The low-temperature coolant in the microchannel 6 takes away the heat generated by the integrated circuit 7 and turns into high-temperature coolant, which directly cools the chip internally. The microchannel 6 of the multi-chip array 1 is a straight channel with a depth of 0.5mm, a length of 9mm, a width of 0.1mm, a rib width of 0.1mm, and no internal enhanced heat dissipation structure.

[0044] In one embodiment, if Figure 3 As shown, the bottom substrate 2 is provided with thirty-six bottom substrate liquid inlets 8 and thirty-six bottom substrate liquid outlets 9. The microfluidic channel 6 of each multi-chip array 1 corresponds to one bottom substrate liquid inlet 8 and one bottom substrate liquid outlet 9. The low-temperature coolant is injected into the edge of the microfluidic channel 6 through the bottom substrate liquid inlet 8 to form a local jet, which is ejected from the other side edge of the microfluidic channel 6. The length of the bottom substrate liquid inlet 8 and the bottom substrate liquid outlet 9 and the total width of the microfluidic channel 6 are both 8.9 mm, and the width of the liquid inlet 8 and the liquid outlet 9 is 1 mm.

[0045] In one embodiment, if Figure 4As shown, the front side of the secondary liquid collecting substrate 3 contacting the secondary liquid separation substrate 4 is provided with thirty-six secondary liquid collecting substrate liquid inlets 10 and four secondary liquid collecting substrate liquid outlets 11. The secondary liquid collecting substrate liquid inlets 10 correspond to the bottom substrate liquid inlets 8 in one-to-one position and have the same size. The secondary liquid collecting substrate liquid outlets 11 are connected to the bottom substrate liquid outlet 9. A secondary liquid collecting channel 12 is provided on the back side. The secondary liquid collecting channel 12 is connected to the bottom substrate liquid outlet 9. The liquid outlet 11 of the secondary liquid collecting substrate 3 is rectangular in shape and has a size of 8mm×6mm. The size of the secondary liquid collecting channel 12 has been Figure 4 Marked in the middle.

[0046] like Figure 4 As shown, the high-temperature coolant enters the secondary liquid collection channel 12 of the secondary liquid collection substrate 3 through the bottom substrate liquid outlet 9 of the bottom substrate 2. In the secondary liquid collection channel 12, every three of the nine vertical branch channels are interconnected to form three horizontal channels, including horizontal channels on both sides and a middle horizontal channel. The horizontal channels on both sides and the middle horizontal channel are interconnected through two vertical channels. The high-temperature coolant is collected at two liquid outlets in each vertical channel. The two liquid outlets are far away from the middle horizontal channel and close to the horizontal channels on both sides. The long flow path between the middle horizontal channel and the liquid outlet increases the flow resistance, which can suppress the lower pressure of the middle horizontal channel caused by the connection of multiple liquid outlets in the middle horizontal channel. The short flow path between the horizontal channels on both sides and the liquid outlet reduces the flow resistance, which can suppress the higher pressure of the horizontal channels on both sides caused by the connection of fewer liquid outlets on both sides, thereby reducing the pressure distribution difference between the horizontal channels on both sides and the middle horizontal channel, and preventing the horizontal channel pressure from being too low or too high, causing the flow rate of the connected chips to increase or decrease.

[0047] like Figure 4 As shown, in the secondary liquid collection substrate 3, the farther the secondary liquid collection substrate outlet 11 is from the middle horizontal flow channel, the higher the pressure of the middle horizontal flow channel, and the smaller the flow of the connected chip. At the same time, the smaller the pressure of the horizontal flow channels on both sides, the greater the flow of the connected chip.

[0048] In one embodiment, if Figure 5 As shown, the front side of the secondary liquid separation substrate 4 contacting the primary liquid collection substrate 5 is provided with six secondary liquid separation substrate liquid inlets 13 and four secondary liquid separation substrate liquid outlets 14, the secondary liquid separation substrate liquid inlet 13 is connected to the secondary liquid collection substrate liquid inlet 10, the secondary liquid separation substrate liquid outlet 14 corresponds to the secondary liquid collection substrate liquid outlet 11 in one-to-one position and has the same size, and the back side is provided with a secondary liquid separation channel 15, the secondary liquid separation channel 15 is connected to the secondary liquid collection substrate liquid inlet 10; the secondary liquid separation substrate liquid inlet 13 of the secondary liquid separation substrate 4 is rectangular in shape and has a size of 5mm×2.5mm, and the size of the secondary liquid separation channel 15 has been Figure 5 Marked in the middle.

[0049] like Figure 5As shown, the low-temperature coolant enters the secondary liquid separation channel 15 of the secondary liquid separation substrate 4 through the six secondary liquid separation substrate liquid inlets 13 of the secondary liquid separation substrate 4. In the secondary liquid separation channel 15, the six secondary liquid separation substrate liquid inlets 13 are connected in pairs to form three horizontal channels, and each horizontal channel is connected to three vertical branch channels. The low-temperature coolant is distributed to three vertical branch channels in each horizontal channel, including the vertical branch channels on both sides of the short process after the diversion and the middle vertical branch channel of the long process after the diversion. The increase in flow resistance brought by the long process can suppress the more flow distribution in the middle vertical branch channel caused by the convergence, and the reduction in flow resistance brought by the short process can suppress the less flow distribution in the vertical branch channels on both sides caused by the diversion only, thereby ensuring uniform flow distribution in the three vertical branch channels.

[0050] like Figure 5 As shown, each vertical branch flow channel is connected to the secondary liquid collecting substrate liquid inlet 10 of four secondary liquid collecting substrates 3, wherein the four liquid inlets connected by the vertical branch flow channels on both sides include the two outer liquid inlets of the short process after the diversion from the vertical branch flow channel and the two inner liquid inlets of the long process after the diversion from the vertical branch flow channel. The low-temperature coolant will hit the outer wall of the vertical branch flow channels on both sides along the flow direction, and will flow more to the two inner liquid inlets under the influence of the wall reaction force. The increase in flow resistance brought by the long process can suppress the larger flow distribution of the two inner liquid inlets, and the reduction in flow resistance brought by the short process can suppress the smaller flow distribution of the two outer liquid inlets, thereby ensuring uniform flow distribution of the four liquid inlets connected by the vertical branch flow channels.

[0051] like Figure 5 As shown, in the secondary liquid separation substrate 4, the farther the vertical branch flow channels on both sides are from the two inner liquid inlets, the less flow is distributed to the two inner liquid inlets, and the more flow is distributed to the two outer liquid inlets.

[0052] like Figure 5 As shown, in the secondary liquid separation substrate 4, the farther the secondary liquid separation substrate liquid inlet 13 is from the middle vertical branch flow channel, the more flow distribution is distributed to the vertical branch flow channels on both sides, and the less flow distribution is distributed to the middle vertical branch flow channel.

[0053] In one embodiment, if Figure 6 As shown, the front side of the first-level collecting and separating liquid substrate 5 is provided with a total liquid inlet 16 and two total liquid outlets 17, which are connected to the second-level separating liquid substrate liquid inlet 13 and the second-level separating liquid substrate liquid outlet 14; the back side is provided with a first-level collecting and separating liquid flow channel, which includes a first-level separating liquid flow channel 18 connected to the second-level separating liquid substrate liquid inlet 13 and a first-level collecting liquid flow channel 19 connected to the second-level separating liquid substrate liquid outlet 14; the total liquid inlet 16 and the total liquid outlet 17 of the first-level collecting and separating liquid substrate 5 are circular in shape, the diameter of the total liquid inlet 16 is 12 mm, the diameter of the total liquid outlet 17 is 8 mm, and the size of the first-level separating liquid flow channel 18 has been Figure 6Marked in the middle.

[0054] like Figure 6 As shown, the low-temperature coolant enters the first-level liquid separation channel 18 of the first-level liquid collection and separation substrate 5 through the total liquid inlet 16 of the first-level liquid collection and separation substrate 5. In the first-level liquid separation channel 18, it is first evenly distributed from the total liquid inlet 16 to four oblique channels, including an upper oblique channel and a lower oblique channel, and then connected in pairs to form two vertical straight channels. Three liquid inlets are distributed in each vertical straight channel, including the liquid inlets on both sides of the short process after diversion and the middle liquid inlet of the long process after diversion. The increase in flow resistance brought by the long process can suppress the flow distribution with more middle liquid inlets caused by convergence, and the reduction in flow resistance brought by the short process can suppress the flow distribution with fewer liquid inlets on both sides caused by only diversion, thereby ensuring uniform flow distribution of the three liquid inlets.

[0055] like Figure 6 As shown, the high-temperature coolant enters the primary liquid collecting channel 19 of the primary liquid collecting and separating substrate 5 through the secondary liquid collecting substrate outlet 11 of the secondary liquid collecting substrate 3 and the secondary liquid separating substrate outlet 14 of the secondary liquid separating substrate 4, and finally flows out from the total liquid outlet 17 of the primary liquid collecting and separating substrate 5.

[0056] like Figure 6 As shown, in the first-level liquid collecting and distributing substrate 5, the larger the angle between the upper oblique flow channel and the lower oblique flow channel, the more flow distribution is distributed to the liquid inlets on both sides, and the less flow distribution is distributed to the middle liquid inlet.

[0057] This embodiment forms a flow regulation network for the multi-chip array by adjusting the distance between the liquid outlet 11 of the secondary liquid collection substrate and the middle horizontal flow channel, the distance between the vertical branch flow channels on both sides and the two inner liquid inlets, the distance between the liquid inlet 13 of the secondary liquid separation substrate and the middle vertical branch flow channel, and the angle between the upper oblique flow channel and the lower oblique flow channel, thereby achieving uniform flow distribution for the multi-chip array.

[0058] This embodiment realizes the parallel flow channels of 36 chips and the uniform flow distribution among the chips by designing two-stage liquid separation flow channels and two-stage liquid collection flow channels. Figure 7 As shown in the figure, when the total power of the 36 chips is 10,000W, the total liquid inlet flow rate is 5L / min, and the inlet temperature is 15°C, the temperature difference between the chips is less than 1°C, ensuring extremely high temperature uniformity of the 36-chip array. At the same time, the footprint is only 85mm×85mm and the pressure drop is less than 70KPa, providing a solution for achieving efficient heat transport of multiple chips in confined spaces.

[0059] Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above-mentioned specific embodiments and application fields. The above-mentioned specific embodiments are merely illustrative and instructive, and are not restrictive. A person skilled in the art, guided by this specification and without departing from the scope of protection of the claims of the present invention, may also devise various forms, all of which fall within the scope of protection of the present invention.

Claims

1. A multi-chip array integrated liquid distribution structure with internal chip cooling, characterized by: From bottom to top, it includes a multi-chip array (1) in close contact, a bottom substrate (2), a secondary liquid collection substrate (3), a secondary liquid separation substrate (4), and a primary liquid collection and separation substrate (5); The front side of the multi-chip array (1) in contact with the bottom substrate (2) is provided with a plurality of microchannels (6), and the back side is provided with a plurality of integrated circuits (7) at positions corresponding to the microchannels (6). The low-temperature coolant in the microchannels (6) takes away the heat generated by the integrated circuits (7) and turns into high-temperature coolant, directly cooling the internal part of the chip. The bottom substrate (2) is provided with a plurality of bottom substrate liquid inlets (8) and a plurality of bottom substrate liquid outlets (9), and each microfluidic channel (6) of the multi-chip array (1) corresponds to one bottom substrate liquid inlet (8) and one bottom substrate liquid outlet (9); The front side of the secondary liquid collecting substrate (3) contacting the secondary liquid separation substrate (4) is provided with a plurality of secondary liquid collecting substrate liquid inlets (10) and a plurality of secondary liquid collecting substrate liquid outlets (11), wherein the positions of the secondary liquid collecting substrate liquid inlets (10) correspond to the positions of the bottom substrate liquid inlets (8) and are the same in size, and the secondary liquid collecting substrate liquid outlets (11) are connected to the bottom substrate liquid outlets (9); the back side is provided with secondary liquid collecting flow channels (12), and the secondary liquid collecting flow channels (12) are connected to the bottom substrate liquid outlets (9); The front side of the secondary liquid separation substrate (4) contacting the primary liquid collection substrate (5) is provided with a plurality of secondary liquid separation substrate liquid inlets (13) and a plurality of secondary liquid separation substrate liquid outlets (14), wherein the secondary liquid separation substrate liquid inlets (13) are connected to the secondary liquid collection substrate liquid inlets (10), and the secondary liquid separation substrate liquid outlets (14) correspond in position to the secondary liquid collection substrate liquid outlets (11) and have the same size; the back side is provided with a secondary liquid separation flow channel (15), wherein the secondary liquid separation flow channel (15) is connected to the secondary liquid collection substrate liquid inlets (10); The front side of the first-level liquid collecting and separating substrate (5) is provided with a total liquid inlet (16) and two total liquid outlets (17), which are connected to the second-level liquid separating substrate liquid inlet (13) and the second-level liquid separating substrate liquid outlet (14); the back side is provided with a first-level liquid collecting and separating flow channel, which includes a first-level liquid collecting flow channel (18) connected to the second-level liquid separating substrate liquid inlet (13) and a first-level liquid collecting flow channel (19) connected to the second-level liquid separating substrate liquid outlet (14).

2. The multi-chip array integrated liquid distribution structure for internal chip cooling according to claim 1, characterized in that: The multi-chip array (1), the bottom substrate (2), the secondary liquid collection substrate (3), the secondary liquid separation substrate (4) and the primary liquid collection and separation substrate (5) are symmetrical left-right and top-bottom.

3. The multi-chip array integrated liquid distribution structure for internal chip cooling according to claim 1, characterized in that: The secondary liquid collecting substrate (3), the secondary liquid separating substrate (4) and the primary liquid collecting and separating substrate (5) have the same thickness, which is twice the thickness of the bottom substrate (2); The depths of the secondary liquid collecting substrate liquid inlet (10) of the secondary liquid collecting substrate (3) and the secondary liquid separating substrate liquid outlet (14) of the secondary liquid separating substrate (4) are the same, which is twice the thickness of the bottom substrate (2); the depths of the remaining liquid inlets, liquid outlets and liquid collecting and separating flow channels of the bottom substrate (2), the secondary liquid collecting substrate (3), the secondary liquid separating substrate (4) and the primary liquid collecting and separating substrate (5) are all the same, which is the same as the thickness of the bottom substrate (2).

4. The multi-chip array integrated liquid distribution structure for internal chip cooling according to claim 1, characterized in that: The microchannel (6) of the multi-chip array (1) is a straight channel, a zigzag channel, a wavy channel or a fin array channel, and has no heat dissipation enhancement structure or added cavity or fin structure inside.

5. The multi-chip array integrated liquid distribution structure for internal chip cooling according to claim 1, characterized in that: Low-temperature cooling liquid is injected into the edge of the microchannel (6) through the substrate liquid inlet (8) to form a local jet, which is then ejected from the other side edge of the microchannel (6). The lengths of the bottom substrate liquid inlet (8) and the bottom substrate liquid outlet (9) are the same as the total width of the microchannel (6).

6. The multi-chip array integrated liquid distribution structure for internal chip cooling according to claim 1, characterized in that: The secondary liquid collecting substrate liquid outlet (11) of the secondary liquid collecting substrate (3), the secondary liquid separating substrate liquid inlet (13) and the secondary liquid separating substrate liquid outlet (14) of the secondary liquid separating substrate (4), and the total liquid inlet (16) and the total liquid outlet (17) of the primary liquid collecting and separating substrate (5) are rectangular or circular in shape.

7. The multi-chip array integrated liquid distribution structure for internal chip cooling according to claim 1, characterized in that: The low-temperature coolant enters the first-level liquid separation channel (18) of the first-level liquid collection and separation substrate (5) through the total liquid inlet (16) of the first-level liquid collection and separation substrate (5). In the first-level liquid separation channel (18), the coolant is first evenly distributed from the total liquid inlet (16) to four oblique channels, including an upper oblique channel and a lower oblique channel, and then connected in pairs to form two vertical straight channels. Three liquid inlets are distributed in each vertical straight channel, including two side liquid inlets of a short flow path after diversion and a middle liquid inlet of a long flow path after diversion. The increase in flow resistance brought by the long flow path can suppress the flow distribution with more middle liquid inlets caused by confluence, and the reduction in flow resistance brought by the short flow path can suppress the flow distribution with fewer two side liquid inlets caused by only diversion, thereby ensuring uniform flow distribution of the three liquid inlets. The low-temperature cooling liquid enters the secondary liquid separation channel (15) of the secondary liquid separation substrate (4) through the six liquid inlets of the two vertical channels in the first-level liquid separation channel (18) of the first-level liquid collection and separation substrate (5) and the six second-level liquid separation substrate liquid inlets (13) of the second-level liquid separation substrate (4). In the second-level liquid separation channel (15), the six second-level liquid separation substrate liquid inlets (13) are connected in pairs to form three horizontal channels, each horizontal channel is connected to three vertical branch channels, and the low-temperature cooling liquid is distributed to the three vertical branch channels in each horizontal channel, including the vertical branch channels on both sides of the short flow after the diversion and the middle vertical branch channel of the long flow after the diversion. The increase in flow resistance brought by the long flow suppresses the more flow distribution in the middle vertical branch flow channel caused by the confluence, and the decrease in flow resistance brought by the short flow suppresses the less flow distribution in the vertical branch flow channels on both sides caused by the diversion, thereby ensuring uniform flow distribution in the three vertical branch flow channels. Each vertical branch flow channel is connected to the secondary liquid collecting substrate liquid inlet (10) of four secondary liquid collecting substrates (3), wherein the four secondary liquid collecting substrate liquid inlets connected by the vertical branch flow channels on both sides include two secondary liquid collecting substrate liquid inlets on the outer side of the short flow path after the vertical branch flow channel is split and two secondary liquid collecting substrate liquid inlets on the inner side of the long flow path after the vertical branch flow channel is split. The low-temperature coolant will hit the outer wall surface of the vertical branch flow channels on both sides along the flow direction, and under the influence of the wall reaction force, it will flow more to the two secondary liquid collecting substrate liquid inlets on the inner side. The increase in flow resistance caused by the long flow path suppresses the larger flow distribution of the two secondary liquid collecting substrate liquid inlets on the inner side, and the decrease in flow resistance caused by the short flow path suppresses the smaller flow distribution of the two secondary liquid collecting substrate liquid inlets on the outer side, thereby ensuring uniform flow distribution of the four secondary liquid collecting substrate liquid inlets connected by the vertical branch flow channels; Low-temperature cooling liquid enters each chip of the multi-chip array (1) through the secondary liquid collecting substrate liquid inlet (10) of the secondary liquid collecting substrate (3) and the bottom substrate liquid inlet (8) of the bottom substrate (2) to cool the inside of each chip, taking away the heat of the multi-chip array (1) and then turning into high-temperature cooling liquid; The high-temperature coolant enters the secondary liquid collecting channel (12) of the secondary liquid collecting substrate (3) through the bottom substrate liquid outlet (9) of the bottom substrate (2). In the secondary liquid collecting channel (12), nine vertical branch channels are interconnected to form three horizontal channels, including two side horizontal channels and a middle horizontal channel. The two side horizontal channels and the middle horizontal channel are interconnected through two vertical channels. The high-temperature coolant is collected into two liquid outlets in each vertical channel. The two liquid outlets are far away from the middle horizontal channel and close to the two side horizontal channels. The long flow path between the middle horizontal channel and the liquid outlet increases the flow resistance, suppressing the lower pressure of the middle horizontal channel caused by the middle horizontal channel being connected to multiple liquid outlets. The short flow path between the two side horizontal channels and the liquid outlet reduces the flow resistance, suppressing the higher pressure of the two side horizontal channels caused by the two side horizontal channels being connected to fewer liquid outlets, thereby reducing the pressure distribution difference between the two side horizontal channels and the middle horizontal channel, and preventing the horizontal channel pressure from being too low or too high, causing the flow rate of the connected chips to increase or decrease. The high-temperature cooling liquid enters the primary liquid collecting channel (19) of the primary liquid collecting and separating substrate (5) through the secondary liquid collecting substrate liquid outlet (11) of the secondary liquid collecting substrate (3) and the secondary liquid separating substrate liquid outlet (14) of the secondary liquid separating substrate (4), and finally flows out from the total liquid outlet (17) of the primary liquid collecting and separating substrate (5).

8. The multi-chip array integrated liquid distribution structure for internal chip cooling according to claim 7, characterized in that: In the secondary liquid collecting substrate (3), the farther the secondary liquid collecting substrate liquid outlet (11) is from the middle horizontal flow channel, the higher the pressure of the middle horizontal flow channel, and the smaller the flow rate of the connected chip; at the same time, the smaller the pressure of the horizontal flow channels on both sides, the greater the flow rate of the connected chip.

9. The multi-chip array integrated liquid distribution structure for internal chip cooling according to claim 7, characterized in that: In the secondary liquid separation substrate (4), the farther the vertical branch flow channels on both sides are from the two inner liquid inlets, the less the flow distribution to the two inner liquid inlets is, and the more the flow distribution to the two outer liquid inlets is; In the secondary liquid separation substrate (4), the farther the secondary liquid separation substrate liquid inlet (13) is from the middle vertical branch flow channel, the more flow distribution is distributed to the vertical branch flow channels on both sides, and the less flow distribution is distributed to the middle vertical branch flow channel; In the first-level liquid collecting and distributing substrate (5), the larger the angle between the upper oblique flow channel and the lower oblique flow channel, the more the flow distribution of the liquid inlets on both sides is, and the less the flow distribution of the middle liquid inlet is.

10. The multi-chip array integrated liquid distribution structure for internal chip cooling according to claim 7, characterized in that: By adjusting the distance between the secondary liquid collecting substrate liquid outlet (11) and the middle horizontal flow channel, the distance between the vertical branch flow channels on both sides and the two inner liquid inlets, the distance between the secondary liquid separating substrate liquid inlet (13) and the middle vertical branch flow channel, and the angle between the upper oblique flow channel and the lower oblique flow channel, a flow regulation network of the multi-chip array is formed, thereby achieving uniform flow distribution of the multi-chip array.

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