Method and system for shape and property coordinated control of micro / nano optical elements formed by thermoimprinting

Abstract

This application provides a method and system for shape and property coordinated control of micro / nano optical elements formed by thermoforming. The method includes: acquiring shape error data and refractive index change data of a first micro / nano optical element generated during thermoforming; compensating the mold geometry model based on the shape error data and refractive index change data; determining whether the shape accuracy of a second micro / nano optical element meets preset shape accuracy requirements and whether the wavefront aberration meets preset wavefront aberration requirements; the second micro / nano optical element is obtained based on the compensated mold geometry model; if the preset shape accuracy requirements and / or preset wavefront aberration requirements are not met, the mold geometry model is compensated again until the shape accuracy and wavefront aberration of the second micro / nano optical element meet the preset shape accuracy requirements and preset wavefront aberration requirements. This application can reduce the impact of shape error and refractive index change on the second micro / nano optical element and reduce mold manufacturing costs.

Description

Technical Field

[0001] This application belongs to the field of micro-nano optics, and in particular relates to a method and system for shape and property coordinated control of micro-nano optical elements formed by thermo-embossing. Background Technology

[0002] In the field of micro-nano optics, thermal embossing technology, with its high efficiency and large-scale manufacturing capabilities, has become an important process for fabricating micro-nano structures on optical plastics and glass surfaces. However, despite its significant advantages, thermal embossing technology still faces a series of severe technical challenges in practical applications.

[0003] First, during the hot stamping process, due to the physical properties of materials such as plastics or glass, such as viscosity and flowability, micro- and nano-components are prone to problems such as insufficient filling, springback, and shrinkage during molding. These will directly cause errors in the shape of the microstructure and affect the optical performance of the component.

[0004] Secondly, temperature control during the hot stamping process is a complex and critical issue. Uneven temperature distribution or excessively rapid cooling rates can introduce residual stress into micro / nano optical components, leading to birefringence. This birefringence not only affects the light propagation path but also degrades the optical performance of the components.

[0005] Furthermore, residual stress also causes warping deformation of the component. This deformation not only changes the global surface shape of the component, but may also cause significant changes in the shape, size, and position of the microstructures closely packed on the thin plate component, further weakening the component's optical performance.

[0006] Furthermore, the structural relaxation of plastics or glass during the cooling process is also a problem that cannot be ignored. This structural relaxation may lead to changes in the refractive index of the component, thereby affecting the component's ability to transmit and modulate light.

[0007] In summary, the optical performance of micro / nano optical components is influenced not only by their surface macro- and micro-geometric features, but also by the combined effects of the material's inherent optical properties and various factors during the molding process. Therefore, molding quality has become a key bottleneck restricting the practical application of hot stamping technology. Summary of the Invention

[0008] This application provides a method and system for shape and property coordination control of micro-nano optical elements formed by hot embossing, which can solve the problems of insufficient filling, springback and shrinkage, and residual stress that cause the optical performance of micro-nano optical elements to deteriorate during hot embossing experiments.

[0009] In a first aspect, embodiments of this application provide a method for synergistic shape control of micro / nano optical elements formed by thermoimprinting, including:

[0010] Acquire shape error data and refractive index change data generated during the hot stamping process of the first micro / nano optical element;

[0011] The mold geometry model is compensated based on the shape error data and refractive index change data.

[0012] Determine whether the shape accuracy of the second micro / nano optical element meets the preset shape accuracy requirements, and whether the wavefront aberration meets the preset wavefront aberration requirements; the second micro / nano optical element is obtained based on the compensated mold geometry model;

[0013] If the preset shape accuracy requirements and / or preset wavefront aberration requirements are not met, the mold geometry model will be compensated again until the shape accuracy and wavefront aberration of the second micro / nano optical element meet the preset shape accuracy requirements and preset wavefront aberration requirements.

[0014] In one possible implementation of the first aspect, acquiring the shape error data and refractive index change data generated by the first micro / nano optical element during the hot stamping process includes:

[0015] Determine the optimal combination of hot stamping process parameters;

[0016] Based on the mathematical model and the optimal combination of hot embossing process parameters, the density change and shrinkage of the first micro-nano optical element during the hot embossing process are predicted respectively.

[0017] Based on the density change, the refractive index change is predicted, and the refractive index change data of the first micro / nano optical element is obtained.

[0018] Based on the shrinkage amount, the shape error data of the first micro / nano optical element is obtained.

[0019] In one possible implementation of the first aspect, determining the optimal combination of thermal embossing process parameters includes:

[0020] Factor screening experiments were conducted based on the importance of the optimization objectives according to the hot embossing process parameters to identify important hot embossing process parameters. The hot embossing process parameters include: heating rate, hot pressing temperature, holding time, hot pressing pressure, hot pressing time, holding time, and annealing rate. The optimization objectives include: micro / nano structure filling rate, warpage deformation, plate thickness, and residual stress.

[0021] Establish a regression model between the important hot embossing process parameters and the optimization objective;

[0022] Based on the regression model, the optimal combination of hot stamping process parameters is determined.

[0023] In one possible implementation of the first aspect, the step of conducting a factor screening experiment based on the importance of the optimization objective according to the hot embossing process parameters to screen out important hot embossing process parameters includes:

[0024] Orthogonal experiments for hot embossing were conducted using the Taguchi method, and analysis of variance or range was used to evaluate the importance of each hot embossing process parameter to the experimental results.

[0025] Based on the importance of each hot embossing process parameter to the experimental results, the important hot embossing process parameters are determined.

[0026] In one possible implementation of the first aspect, establishing a regression model between the important hot stamping process parameters and the optimization objective includes:

[0027] An analysis of variance was performed on the results of the first hot embossing molding experiment, and a regression model between the important hot embossing process parameters and the optimization objective was established based on the analysis results; wherein, the first hot embossing molding experiment was a hot embossing molding experiment based on the important hot embossing process parameters and conducted using the response surface methodology.

[0028] In one possible implementation of the first aspect, determining the optimal combination of thermal embossing process parameters based on the regression model includes:

[0029] Based on the regression model and the optimization objective, a multi-objective optimization function is defined for the NSGA-II optimization algorithm;

[0030] Based on the multi-objective optimization function of the NSGA-II optimization algorithm, an optimization solution set is determined; the optimization solution set includes multiple combinations of optimization parameters, which reflect the important hot stamping process parameters and their corresponding optimization objectives.

[0031] The surface quality of the first micro / nano optical element is evaluated, and the optimal parameter combination corresponding to the first micro / nano optical element with the best surface quality is determined as the optimal hot stamping process parameter combination; wherein, the first micro / nano optical element is obtained by performing a second hot stamping molding experiment based on the optimal parameter combination.

[0032] In one possible implementation of the first aspect, compensating the mold geometry model based on the shape error data and the refractive index change data includes:

[0033] Based on the refractive index change data, the initial compensation of the mold geometry model is performed;

[0034] Based on the shape error data, the mold geometry model that was initially compensated is then subjected to secondary compensation.

[0035] Secondly, embodiments of this application provide a shape-and-structure collaborative control system for micro / nano optical components formed by hot embossing, including: a first device, a micro / nano processing device, a hot embossing device, a first testing device, and a second testing device;

[0036] The first device is used to acquire shape error data and refractive index change data generated by the first micro-nano optical element during the hot stamping process;

[0037] The first device is also used to compensate the mold geometry model based on the shape error data and refractive index change data;

[0038] The micro / nano fabrication equipment is used to prepare a first mold based on the compensated mold geometry model;

[0039] The hot stamping equipment is used to prepare a second micro / nano optical element according to the first mold;

[0040] The first testing device is used to measure the shape accuracy of the second micro / nano optical element;

[0041] The second test device is used to measure the wavefront aberration of the second micro / nano optical element;

[0042] The first device or the first test device is further used to determine whether the shape accuracy of the second micro-nano optical element meets the preset shape accuracy requirements;

[0043] The first device or the second testing device is further used to determine whether the wavefront aberration of the second micro-nano optical element meets the preset wavefront aberration requirements; if it does not meet the preset shape accuracy requirements or preset wavefront aberration requirements, the mold geometry model is compensated again until the shape accuracy and wavefront aberration of the second micro-nano optical element meet the preset shape accuracy requirements and preset wavefront aberration requirements.

[0044] Thirdly, embodiments of this application provide a shape-property coordination control device for micro / nano optical elements formed by hot embossing, including: an acquisition module for acquiring shape error data and refractive index change data generated by the first micro / nano optical element during the hot embossing process.

[0045] The compensation module is used to compensate the mold geometry model based on the shape error data and refractive index change data.

[0046] The judgment module is used to determine whether the shape accuracy of the second micro-nano optical element meets the preset shape accuracy requirements and whether the wavefront aberration meets the preset wavefront aberration requirements. The second micro-nano optical element is obtained based on the compensated mold geometry model. If the preset shape accuracy requirements or preset wavefront aberration requirements are not met, the mold geometry model is compensated again until the shape accuracy and wavefront aberration of the second micro-nano optical element meet the preset shape accuracy requirements and preset wavefront aberration requirements.

[0047] Fourthly, embodiments of this application provide an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, it implements the thermo-imprinted micro / nano optical element shape-coordinated control method as described in any one of the first aspects.

[0048] Fifthly, embodiments of this application provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the thermo-imprinted micro / nano optical element shape and property coordinated control method as described in any one of the first aspects.

[0049] In a sixth aspect, embodiments of this application provide a computer program product that, when run on a terminal device, causes the terminal device to execute the thermo-embossed micro / nano optical element shape and property coordination control method described in any of the first aspects above.

[0050] It is understood that the beneficial effects of the second to sixth aspects mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here.

[0051] The beneficial effects of this application embodiment compared with the prior art are: the present application embodiment compensates the mold geometry model according to shape error data and refractive index change data, which can significantly reduce the influence of shape error and refractive index change on the second micro-nano optical element and produce micro-nano optical elements with high optical performance; on the other hand, it reduces the mold manufacturing cost. Attached Figure Description

[0052] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0053] Figure 1 This is a schematic flowchart of a method for shape and property coordinated control of micro / nano optical elements formed by hot embossing according to an embodiment of this application;

[0054] Figure 2 This is a schematic flowchart of another thermo-imprinted micro / nano optical element shape and property coordinated control method provided in an embodiment of this application;

[0055] Figure 3 This is a schematic flowchart of a method for determining the optimal combination of hot stamping process parameters according to an embodiment of this application;

[0056] Figure 4 This is a structural block diagram of a thermo-embossed micro / nano optical element shape and property coordination control device provided in one embodiment of this application. Detailed Implementation

[0057] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0058] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0059] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0060] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0061] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0062] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0063] This application provides a shape-coordinated control system for micro / nano optical components formed by hot embossing. The system includes: a first device, a micro / nano processing device, a hot embossing device, a first testing device, and a second testing device.

[0064] The first device is used to acquire shape error data and refractive index change data generated by the first micro-nano optical element during the hot embossing process.

[0065] For example, in the embodiments of this application, the first device may be a desktop computer, a laptop computer, a cloud server, or other device with computing capabilities.

[0066] Specifically, micro / nano optical elements refer to optical elements manufactured at the micro / nano scale. The first micro / nano optical element can be a single micro / nano optical element or a specific model of micro / nano optical element. For example, the first micro / nano optical element can be a microlens.

[0067] Specifically, shape errors can be caused by various factors. For example, during the hot stamping process, the physical properties of materials such as plastics or glass, such as viscosity and flowability, can lead to problems such as insufficient filling, springback, and shrinkage in micro- and nano-element molding, resulting in shape errors. Another example is that uneven temperature distribution or excessively rapid cooling rates can introduce residual stress into micro- and nano-optical elements, which can cause warping deformation. This deformation not only changes the overall surface shape of the element but may also cause significant changes to the shape, size, and position of microstructures densely packed on thin plate elements.

[0068] Specifically, refractive index changes can occur under various circumstances, such as structural relaxation, residual stress, and shape errors during the cooling process of plastics or glass, all of which can lead to changes in the refractive index of micro / nano optical elements. These refractive index changes and shape errors in micro / nano optical elements can cause wavefront aberrations, thus affecting the optical performance of the elements. Wavefront aberration refers to the deviation between the actual wavefront and the wavefront in its unbiased state.

[0069] Specifically, in the embodiments of this application, the shape error and refractive index change of the micro / nano optical element can be obtained from previous hot stamping molding experimental results, or predicted by a mathematical model, preferably a hot stamping finite element simulation model.

[0070] The first device is also used to compensate the mold geometry model based on the shape error data and refractive index change data.

[0071] It should be noted that the mold geometry model is a virtual 3D model, not a physical mold. This mold geometry model can be created using modeling software. By compensating for shape error data and refractive index variation data, the shape error and refractive index variation of the micro / nano optical components can be minimized.

[0072] The micro / nano fabrication equipment is used to prepare a first mold based on the compensated mold geometry model;

[0073] Specifically, micro / nano fabrication equipment is used to manufacture structures and devices with minute dimensions, capable of processing and manufacturing at the micrometer and nanometer scales. Micro / nano fabrication equipment can employ nanofabrication equipment (such as electron beam lithography machines), laser processing equipment, or photolithography equipment. Using micro / nano fabrication equipment and a mold geometry model, a first mold can be fabricated.

[0074] The hot stamping equipment is used to prepare a second micro / nano optical element based on the first mold.

[0075] Specifically, the thermal embossing equipment can be a nano-imprinting device. By using the thermal embossing equipment to perform thermal imprinting on the surface of components made of materials such as plastic or glass, a second micro-nano optical element can be obtained.

[0076] The first test device is used to measure the shape accuracy of the second micro / nano optical element.

[0077] Specifically, the first testing device can be a white light interferometer. The white light interferometer has very high measurement accuracy, reaching the nanometer or even sub-nanometer level. It has advantages such as high precision, non-contact measurement, and strong data processing capabilities, and can accurately measure the shape accuracy of the second micro-nano optical element.

[0078] The second test device is used to measure the wavefront aberration of the second micro / nano optical element.

[0079] Specifically, the second testing device can be a wavefront analyzer. By utilizing the principles of interference and image processing technology, the wavefront analyzer can accurately measure the shape and propagation characteristics of the wavefront, thereby obtaining the wavefront aberration of the second micro-nano optical element.

[0080] The first device or the first test device is further used to determine whether the shape accuracy of the second micro-nano optical element meets the preset shape accuracy requirements;

[0081] The first device or the second testing device is further used to determine whether the wavefront aberration of the second micro-nano optical element meets the preset wavefront aberration requirements;

[0082] If the preset shape accuracy requirements or preset wavefront aberration requirements are not met, the mold geometry model will be compensated again until the shape accuracy and wavefront aberration of the second micro-nano optical element meet the preset shape accuracy requirements and preset wavefront aberration requirements.

[0083] Specifically, "compensating the mold geometry again until the shape accuracy and wavefront aberration of the second micro / nano optical element meet the preset shape accuracy requirements and preset wavefront aberration requirements" should be understood as: repeatedly compensating the mold geometry based on the shape error data and refractive index change data; fabricating a first mold based on the compensated mold geometry; fabricating a second micro / nano optical element based on the first mold; measuring the shape accuracy of the second micro / nano optical element; measuring the wavefront aberration of the second micro / nano optical element; and determining whether the shape accuracy and wavefront aberration of the second micro / nano optical element meet the preset shape accuracy requirements and preset wavefront aberration requirements. This process is repeated once or multiple times until the shape accuracy and wavefront aberration of the second micro / nano optical element meet the preset shape accuracy requirements and preset wavefront aberration requirements, thereby obtaining a micro / nano optical element with high optical performance.

[0084] Specifically, in one embodiment, the process of determining whether the shape accuracy of the second micro / nano optical element meets the preset shape accuracy requirement is performed in a first testing device, so the first testing device can directly output a judgment result indicating whether the requirement is met. In another embodiment, the process of determining whether the shape accuracy of the second micro / nano optical element meets the preset shape accuracy requirement is performed in a first device, so the first device outputs a judgment result indicating whether the requirement is met. Similarly, the process of determining whether the wavefront aberration of the second micro / nano optical element meets the preset wavefront aberration can be performed in either a second testing device or a first device.

[0085] The control system described in this application enables the fabrication of high-performance micro / nano optical components, significantly reducing microstructure shape errors caused by insufficient filling, springback, and shrinkage during the hot-press molding process. It also reduces birefringence caused by residual stress and warping deformation of the components due to residual stress.

[0086] See Figures 1-2The method for synergistic shape control of micro / nano optical elements formed by thermoimprinting provided in this application specifically includes:

[0087] S110: Acquire shape error data and refractive index change data generated during the hot stamping process of the first micro / nano optical element.

[0088] Specifically, the first micro / nano optical element can be any single micro / nano optical element or a specific type of micro / nano optical element. The shape error and refractive index change of the first micro / nano optical element can be obtained from past hot stamping experiments, or predicted through mathematical models. The preferred mathematical model is the hot stamping finite element simulation model.

[0089] S120: Compensate the mold geometry model based on the shape error data and refractive index change data.

[0090] Optionally, hot-press finite element simulation can be performed to consider the influence of changes in the refractive index of optical plastics or glass on wavefront aberrations. The microstructure shape of the mold geometry model can be redesigned to achieve initial compensation of the mold microstructure shape, thereby reducing wavefront aberrations caused by changes in refractive index.

[0091] Using the mold geometry model that has undergone initial shape compensation, hot stamping finite element simulation is performed again to predict the shrinkage of the microstructure of the molded optical element. The microstructure shape design of the mold geometry model is then adjusted again to compensate for dimensional deviations.

[0092] S130: Determine whether the shape accuracy of the second micro / nano optical element meets the preset shape accuracy requirements and whether the wavefront aberration meets the preset wavefront aberration requirements; the second micro / nano optical element is obtained based on the compensated mold geometry model; if the preset shape accuracy requirements or preset wavefront aberration requirements are not met, the mold geometry model is compensated again until the shape accuracy and wavefront aberration of the second micro / nano optical element meet the preset shape accuracy requirements and preset wavefront aberration requirements.

[0093] Specifically, a first mold can be fabricated using a mold geometry model that has undergone secondary compensation. This first mold is a solid mold. A second micro / nano optical element can be fabricated using a hot-press molding experiment based on the first mold. Optionally, a white-light interferometer is used to measure the shape accuracy of the second micro / nano optical element, and a wavefront analyzer is used to measure its wavefront aberration. If the shape accuracy and wavefront aberration of the second micro / nano optical element meet preset shape accuracy and wavefront aberration requirements, the process ends, resulting in a high-performance micro / nano optical element. If the preset shape accuracy or wavefront aberration requirements are not met, steps S120-S130 are repeated until they are met or the process iterates to a predetermined number of times.

[0094] By compensating the mold geometry model based on shape error data and refractive index change data in this embodiment, the influence of shape error and refractive index change on the second micro / nano optical element can be greatly reduced. After several iterations, a micro / nano optical element with high optical performance can be fabricated. On the other hand, the mold manufacturing cost is reduced.

[0095] In some optional implementations, the acquisition of shape error data and refractive index change data generated by the first micro / nano optical element during the hot stamping process in S110 can be achieved in the following way:

[0096] S210: Determine the optimal combination of hot stamping process parameters.

[0097] Optionally, the optimal combination of hot embossing process parameters is obtained by analyzing past hot embossing molding experimental results. Preferably, in this embodiment, the optimal combination of hot embossing process parameters is determined based on a regression model between the hot embossing process parameters and the optimization objective.

[0098] S220: Based on the mathematical model and the optimal combination of hot embossing process parameters, predict the density change and shrinkage of the first micro-nano optical element during the hot embossing process.

[0099] For example, the mathematical model takes the hot embossing finite element simulation model as an example. The optimal combination of hot embossing process parameters is substituted into the hot embossing finite element simulation model to predict the density change and shrinkage of the first micro-nano optical element during the hot embossing process.

[0100] S230: Predict the refractive index change based on the density change to obtain the refractive index change data.

[0101] S240: Obtain the shape error data based on the shrinkage amount.

[0102] This embodiment determines the optimal combination of hot embossing process parameters and conducts hot embossing molding experiments using a mathematical model. This not only allows for relatively accurate prediction of refractive index change data and shape error data, but also enables the rapid acquisition of refractive index change data and shape error data.

[0103] Figure 3 This application discloses a method flowchart for determining the optimal combination of hot stamping process parameters, which includes:

[0104] S310: Based on the importance of the optimization objectives according to the hot embossing process parameters, a factor screening experiment is conducted to screen out important hot embossing process parameters; the hot embossing process parameters include: heating rate, hot pressing temperature, holding time, hot pressing pressure, hot pressing time, holding time, and annealing rate; the optimization objectives include: micro / nano structure filling rate, warpage deformation, plate thickness, and residual stress.

[0105] Factor screening experiments refer to the process of selecting factors with significant influence or correlation from numerous factors (i.e., hot embossing process parameters) when conducting research and analysis of hot embossing molding experiments, based on the optimization objectives.

[0106] Specifically, by selecting the thermal embossing process parameters that are important to the optimization objective, the number of important thermal embossing process parameters can be reduced, thereby reducing the subsequent computational load.

[0107] S320: Establish a regression model between the important hot embossing process parameters and the optimization objective.

[0108] Specifically, by analyzing the relationship between key hot embossing process parameters and the optimization objective, a regression model can be obtained. The regression model describes the relationship between key hot embossing process parameters and the optimization objective; this relationship can be represented by a regression equation. The regression model is a predictive model that predicts the value of the dependent variable (optimization objective) based on the values ​​of multiple independent variables (hot embossing process parameters).

[0109] S330: Determine the optimal combination of hot stamping process parameters based on the regression model.

[0110] Specifically, this embodiment uses a regression model to determine the optimal combination of hot embossing process parameters, which can efficiently and accurately calculate the optimal combination of hot embossing process parameters.

[0111] In some optional implementations, in S310, a factor screening experiment is conducted based on the importance of the optimization target according to the hot embossing process parameters to screen out important hot embossing process parameters. This can be achieved in the following way:

[0112] S410: Perform orthogonal experiments on hot embossing using the Taguchi method, and use analysis of variance or analysis of range to evaluate the importance of each hot embossing process parameter to the experimental results.

[0113] The Taguchi method, also known as the Taguchi approach, emphasizes minimizing the number of experiments while maximizing the information gained from experiments through orthogonal experimental design. In thermoimprint lithography, multiple process parameters may affect the quality of micro / nano optical components. Through orthogonal experimental design, the Taguchi method can rationally arrange the combination of these parameters, ensuring a comprehensive evaluation of the impact of each thermoimprint process parameter on the experimental results within a limited number of experiments. The goal of the Taguchi method is to find the optimal combination of thermoimprint parameters to maximize product quality or minimize production costs. In thermoimprint orthogonal experiments, by systematically testing different parameter combinations and combining the results of analysis of variance, it is possible to determine which parameters have a significant impact on the experimental results and to determine the optimal range of values ​​for these parameters.

[0114] Orthogonal experiments utilize orthogonal arrays to design, compare, and statistically analyze multi-factor, multi-level experiments, aiming to find better production conditions or optimal solutions with a small number of experiments.

[0115] There are two main analytical methods for analyzing orthogonal experimental data: range analysis and variance analysis.

[0116] Analysis of Variance (ANOVA), also known as "variance analysis," examines whether variations in different hot embossing process parameters significantly affect experimental results. By comparing the mean differences of experimental results at different parameter levels, it can be determined whether these differences are due to parameter variations rather than random error. ANOVA quantifies the impact of each process parameter on the experimental results. By decomposing the total variance (the difference between experimental results) into the variance and random error caused by each parameter, it can be determined which parameters have a greater impact on the experimental results. ANOVA can also be used to analyze the interactions between these parameters. For example, some parameters may have a small impact on the experimental results when acting alone, but have a significant impact when combined with other parameters. Based on the results of ANOVA, process parameters that have a significant impact on experimental results and their optimal value ranges can be identified. This helps optimize experimental conditions and improve the quality and performance of hot embossing products.

[0117] The range, also known as the range error or total range, denoted by R, refers to the difference between the maximum and minimum values ​​of a set of data. In orthogonal experiments, the range reflects the degree of difference in experimental results across different levels of a factor. By comparing the ranges of different thermal embossing process parameters, we can determine which parameters have the greatest impact on the experimental results and which have a smaller impact. Orthogonal experimental design ensures the independence of factors, meaning that changes in one factor are not affected by changes in other factors. This allows range analysis to accurately assess the impact of each factor on the experimental results. In an orthogonal experiment, the change in the mean of a factor at a certain level can be considered the effect of different levels of that factor. The range of the means of all levels of a factor can be considered the effect of that factor in the entire experiment. The larger the range, the greater the impact of that factor on the experimental results.

[0118] Specifically, the significance should be interpreted differently depending on whether it is an analysis of variance or an analysis of range. When it is an analysis of variance, the significance should be understood as statistical significance; when it is an analysis of range, the significance should be understood as the degree of influence.

[0119] S420: Determine the important hot embossing process parameters based on the importance of each hot embossing process parameter to the experimental results.

[0120] For example, the statistical significance of each thermal embossing process parameter is determined based on the p-value or F-value of the ANOVA results, and thermal embossing process parameters with p-values ​​less than a preset significance level threshold are identified as important thermal embossing process parameters; and / or the influence of each thermal embossing process parameter on the experimental results is determined based on the variance contribution rate, and thermal embossing process parameters with variance contribution rates greater than a preset variance contribution rate threshold are identified as important thermal embossing process parameters. In ANOVA, p-values ​​and F-values ​​can comprehensively assess the statistical significance of thermal embossing process parameters. The p-value is a parameter used to determine the result of a hypothesis test, representing the probability of the observed sample result or a more extreme result occurring when the null hypothesis is true. If the p-value is small, it indicates that the probability of the occurrence is small. The F-value is the statistic of the F-test, which is the ratio of the sum of squares of the differences between and within groups to the degrees of freedom. Significance is the significance level corresponding to the F-statistic; 0.001 indicates rejection of the null hypothesis, meaning that there is a significant difference between different levels of the single factor.

[0121] For example, the influence of each parameter on the experimental results can be determined based on the R value (parameter range value) of the range analysis results, and the ranking of the influence of the parameters on the experimental results can be obtained. The important hot stamping process parameters can be determined based on the ranking results.

[0122] In some optional implementations, S320: Establishing a regression model between the important hot stamping process parameters and the optimization objective can be achieved in the following way:

[0123] S510: Perform variance analysis on the results of the first hot embossing molding experiment, and establish a regression model between the important hot embossing process parameters and the optimization objective based on the analysis results; wherein, the first hot embossing molding experiment is a hot embossing molding experiment based on the important hot embossing process parameters and conducted using response surface methodology.

[0124] Response surface methodology (RSM) refers to the use of polynomial functions to approximate implicit limit state functions through a series of deterministic experiments. In hot embossing experiments, RSM aims to systematically design and analyze experiments to evaluate the impact of different hot embossing process parameters on the experimental results, and to optimize experimental conditions to obtain the best hot embossing effect.

[0125] Substituting the key hot embossing process parameters into the hot embossing molding experiment yielded the corresponding experimental results. In the hot embossing molding experiment, analysis of variance (ANOVA) was used to further evaluate the influence of each key hot embossing process parameter on the experimental results.

[0126] Specifically, the hot stamping experiment in this step can be either a real experiment or a simulation experiment, and this embodiment does not limit it.

[0127] In this embodiment, the response surface methodology is used to conduct the hot embossing experiment. The response surface methodology only considers the important hot embossing process parameters, thereby reducing the number of experiments.

[0128] In some alternative implementations, S330: Determining the optimal combination of hot stamping process parameters based on the regression model can be achieved in the following ways:

[0129] S610: Based on the regression model and the optimization objective, define a multi-objective optimization function for the NSGA-II optimization algorithm.

[0130] Specifically, NSGA-II (Nondominated Sorting Genetic Algorithm II) is a multi-objective optimization algorithm, an improvement and extension of the genetic algorithm. NSGA-II uses the ideas of genetic algorithms to solve multi-objective optimization problems.

[0131] In multi-objective optimization problems, there are usually multiple objective functions that need to be optimized simultaneously, and these objective functions may conflict or contradict each other. A multi-objective optimization function is a mathematical expression used to describe these objectives that need to be optimized simultaneously.

[0132] S620: Determine the optimization solution set according to the multi-objective optimization function of the NSGA-II optimization calculation; the optimization solution set includes multiple optimization parameter combinations, which reflect the important hot stamping process parameters and their corresponding optimization objectives.

[0133] For example, the Pareto solution set containing the optimal process parameters is computed by implementing the NSGA-II optimization strategy. First, under specific constraints (e.g., upper and lower limits of process parameters based on empirical values, i.e., randomly generating different temperatures, pressures, and imprinting times within a range), N-dimensional process parameters are randomly generated, and the corresponding responses (i.e., the output optimization objective) are calculated according to the objective function. The combination of these process parameters and responses constitutes a population of size N. Then, a fast non-dominated sorting method is used to generate the Pareto front, and each individual is ranked. Subsequently, the crowding distance of each individual is calculated based on the objective value. Based on these rankings and crowding distances, a binary tournament selection strategy is used to select the parent population. Afterward, through crossover and mutation, offspring of size N are generated from the parent population. Combinations and elite selection are performed on the parent and offspring populations. As a result, a new, better generation of size N is generated. The same process is repeated until the iteration ends. Finally, the final Pareto solution set (i.e., the optimal parameter combination) can be obtained and used in the hot embossing process to produce high-quality micro-nano optical components.

[0134] S630: Evaluate the surface quality of the first micro / nano optical element, and determine the optimal combination of parameters corresponding to the first micro / nano optical element with the best surface quality as the optimal combination of hot stamping process parameters; wherein, the first micro / nano optical element is obtained by performing a second hot stamping molding experiment based on the optimal combination of parameters.

[0135] Furthermore, before evaluating the surface quality of the first micro / nano optical element, a second hot-press molding experiment is performed to verify the feasibility of the optimal parameter combinations in the optimized solution set. Only those that pass verification are evaluated. Preferably, the optimal combination of process parameters is determined autonomously based on design criteria, rather than by subjective judgment.

[0136] This embodiment utilizes the above multi-objective optimization function to determine the optimal combination of hot stamping process parameters, achieving preliminary shape-related coordinated control of the fill rate, warpage, plate thickness, residual stress, etc., of the first micro / nano optical element. Based on this preliminary shape-related coordinated control, further compensation is performed using the mold geometry model, thereby further reducing shape errors and refractive index variations.

[0137] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0138] Corresponding to the thermo-imprinted micro / nano optical element shape and property coordinated control method described in the above embodiments, Figure 4The diagram shows a structural block diagram of a thermo-embossed micro / nano optical element shape and property coordination control device provided in an embodiment of this application. For ease of explanation, only the parts related to the embodiments of this application are shown.

[0139] Reference Figure 4 The device includes:

[0140] The acquisition module 401 is used to acquire shape error data and refractive index change data generated by the first micro-nano optical element during the hot stamping process.

[0141] The compensation module 402 is used to compensate the mold geometry model based on the shape error data and refractive index change data.

[0142] The judgment module 403 is used to determine whether the shape accuracy of the second micro-nano optical element meets the preset shape accuracy requirements and whether the wavefront aberration meets the preset wavefront aberration requirements; the second micro-nano optical element is obtained based on the compensated mold geometry model; if the preset shape accuracy requirements or preset wavefront aberration requirements are not met, the mold geometry model is compensated again until the shape accuracy and wavefront aberration of the second micro-nano optical element meet the preset shape accuracy requirements and preset wavefront aberration requirements.

[0143] It should be noted that the information interaction and execution process between the above-mentioned devices / units are based on the same concept as the method embodiments of this application. For details on their specific functions and technical effects, please refer to the method embodiments section, and they will not be repeated here.

[0144] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0145] This application also provides an electronic device, which includes: at least one processor, a memory, and a computer program stored in the memory and executable on the at least one processor, wherein the processor executes the computer program to implement the steps in any of the above method embodiments.

[0146] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps described in the various method embodiments above.

[0147] This application provides a computer program product that, when run on a mobile terminal, enables the mobile terminal to implement the steps described in the above-described method embodiments.

[0148] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of this application can be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include at least: any entity or device capable of carrying computer program code to a terminal device, a recording medium, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electrical carrier signal, a telecommunication signal, and a software distribution medium. Examples include USB flash drives, portable hard drives, magnetic disks, or optical disks. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electrical carrier signals or telecommunication signals.

[0149] Program code contained on a computer-readable medium may be transmitted using any suitable medium, including but not limited to wireless, wire, optical fiber, RF, etc., or any suitable combination thereof.

[0150] Computer program code for performing the operations of the embodiments of this application can be written in one or more programming languages ​​or a combination thereof. These programming languages ​​include object-oriented programming languages ​​such as Python, Java, Smalltalk, and C++, as well as conventional procedural programming languages ​​such as C or similar languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0151] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0152] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0153] In the embodiments provided in this application, it should be understood that the disclosed apparatus / network devices and methods can be implemented in other ways. For example, the apparatus / network device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0154] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0155] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for shape and property synergistic control of hot-stamp formed micro-nano optical elements, characterized in that, The method comprises the following steps: acquiring shape error data and refractive index change data generated by a first micro-nano optical element in a hot embossing process; compensating a mold geometry model according to the shape error data and the refractive index change data; judging whether the shape accuracy of a second micro-nano optical element meets a preset shape accuracy requirement and whether wavefront aberration meets a preset wavefront aberration requirement; the second micro-nano optical element is obtained according to the compensated mold geometry model; if the preset shape accuracy requirement and / or the preset wavefront aberration requirement are not met, the mold geometry model is compensated again until the shape accuracy and the wavefront aberration of the second micro-nano optical element meet the preset shape accuracy requirement and the preset wavefront aberration requirement; the acquiring of the shape error data and the refractive index change data generated by the first micro-nano optical element in the hot embossing process comprises: determining an optimal hot embossing process parameter combination; predicting the density change and the shrinkage of the first micro-nano optical element in the hot embossing process according to a mathematical model and the optimal hot embossing process parameter combination; predicting the refractive index change according to the density change to obtain the refractive index change data of the first micro-nano optical element; obtaining the shape error data of the first micro-nano optical element according to the shrinkage; the determination of the optimal hot embossing process parameter combination comprises: performing a factor screening experiment on the importance of a hot embossing process parameter to an optimization target to screen important hot embossing process parameters; the hot embossing process parameters include a heating rate, a hot embossing temperature, a holding time, a hot embossing pressure, a hot embossing time, a holding pressure time and an annealing rate; the optimization target includes a filling rate of a micro-nano structure, a warping deformation, a plate thickness and a residual stress; establishing a regression model between the important hot embossing process parameters and the optimization target; determining an optimal hot embossing process parameter combination according to the regression model; the determination of the optimal hot embossing process parameter combination according to the regression model comprises: defining a multi-objective optimization function for an NSGA-II optimization algorithm based on the regression model and the optimization target; determining an optimization solution set according to the multi-objective optimization function of the NSGA-II optimization algorithm; the optimization solution set includes a plurality of optimization parameter combinations, and the optimization parameter combinations reflect the important hot embossing process parameters and the corresponding optimization targets; evaluating the surface quality of a first micro-nano optical element, and determining the optimization parameter combination corresponding to the first micro-nano optical element with the best surface quality as the optimal hot embossing process parameter combination; wherein the first micro-nano optical element is obtained through a second hot embossing forming experiment according to the optimization parameter combination.

2. The method according to claim 1, wherein the method is a method for synergistically controlling the shape and the nanostructure of a hot-stamp molded micro / nano-optical element. the factor screening experiment on the importance of a hot embossing process parameter to an optimization target to screen important hot embossing process parameters comprises: performing a hot embossing orthogonal experiment by using a Taguchi method, and evaluating the importance of each hot embossing process parameter to an experimental result by using variance analysis or range analysis; determining important hot embossing process parameters according to the importance of each hot embossing process parameter to the experimental result. 3.The method according to claim 1, wherein, The regression model between the important hot embossing process parameters and the optimization target is established by: performing variance analysis on the results of the first hot embossing forming experiment, and establishing a regression model between the important hot embossing process parameters and the optimization target according to the analysis results; wherein the first hot embossing forming experiment is a hot embossing forming experiment based on the important hot embossing process parameters and using the response surface method.

4. The method according to any one of claims 1-3, wherein the method is a method for simultaneously controlling the shape and the periodicity of the micro-nano optical elements in hot-stamping molding. The compensation of the mold geometry model according to the shape error data and the refractive index change data includes: performing primary compensation of the mold geometry model according to the refractive index change data; performing secondary compensation of the mold geometry model according to the shape error data.

5. A system for shape and property co-control of hot-stamping formed micro-nano optical elements, characterized in that, The hot embossing forming micro-nano optical element shape-property collaborative control system is used to implement the method of any one of claims 1-4, and the hot embossing forming micro-nano optical element shape-property collaborative control system comprises: a first device, a micro-nano processing device, a hot embossing device, a first testing device, and a second testing device. The first device is used to obtain shape error data and refractive index change data generated by a first micro-nano optical element during a hot embossing forming process. The first device is also used to compensate a mold geometry model according to the shape error data and the refractive index change data. The micro-nano processing device is used to prepare a first mold according to the compensated mold geometry model. The hot embossing device is used to prepare a second micro-nano optical element according to the first mold. The first testing device is used to measure the shape accuracy of the second micro-nano optical element. The second testing device is used to measure the wavefront aberration of the second micro-nano optical element. The first device or the first testing device is also used to determine whether the shape accuracy of the second micro-nano optical element meets a preset shape accuracy requirement. The first device or the second testing device is also used to determine whether the wavefront aberration of the second micro-nano optical element meets a preset wavefront aberration requirement; if the shape accuracy or the wavefront aberration does not meet the preset shape accuracy requirement or the preset wavefront aberration requirement, the mold geometry model is compensated again until the shape accuracy and the wavefront aberration of the second micro-nano optical element meet the preset shape accuracy requirement and the preset wavefront aberration requirement.

6. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, The processor executes the computer program to implement the method of any one of claims 1-4.

7. A computer-readable storage medium storing a computer program, wherein the computer program comprises the following steps of: receiving a request for a resource from a client; determining whether the client is authorized to access the resource; and if the client is authorized to access the resource, providing the resource to the client. The computer program is executed by the processor to implement the method of any one of claims 1-4.

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