Reverse coupled inductor and chip

Abstract

The embodiment of the present application provides a reverse coupling inductor and chip, which comprises: a magnetic package and a plurality of coils; the plurality of coils are wrapped in the magnetic package, the input end of the coil is connected to the input pad located on the first surface of the magnetic package through a first electrical connection part, the output end of the coil is connected to the output pad located on the second surface of the magnetic package through a second electrical connection part, the first surface of the magnetic package is opposite to the second surface, and different coils are connected to different input pads and output pads; the plurality of coils are reversely coupled when powered on. This solution can improve the speed of the dynamic response of the power supply when powering the processor core and reduce the electromagnetic interference caused by the inductor used.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of chip technology, and in particular to a reverse coupled inductor and a chip. Background Art

[0002] With the development of chip technology, the power consumption density of the CPU (Central Processing Unit) and GPU (Graphics Processing Unit) product lines is increasing, so there is an urgent need to split the power supply for the CPU and GPU. Under the split-core power supply architecture, the voltage regulator module (VRM) provides the CPU and GPU with appropriate voltages. The VRM includes a smooth voltage (BUCK) inductor for energy storage.

[0003] Currently, most VRMs on dies use air-core inductors (i.e., non-magnetic core inductors).

[0004] However, the input and output ends of the air-core inductor are located on the same side, resulting in a larger area of ​​the input and output loop (equivalent loop antenna) in the VRM. The energy radiated by the inductor is positively correlated with the area of ​​the input and output loop, which can lead to more serious electromagnetic interference (EMI) problems. Summary of the invention

[0005] In view of this, embodiments of the present application provide a reverse coupled inductor and a chip to at least partially solve the above problems.

[0006] According to a first aspect of an embodiment of the present application, a reverse coupled inductor is provided, comprising: a plurality of coils and a magnetic packaging material; the plurality of coils are coated in the magnetic packaging material, the input end of the coil is connected to an input pad located on a first surface of the magnetic packaging material via a first electrical connection portion, the output end of the coil is connected to an output pad located on a second surface of the magnetic packaging material via a second electrical connection portion, the first surface of the magnetic packaging material is opposite to the second surface, and different coils are connected to different input pads and output pads; the plurality of coils are reverse coupled when power is supplied.

[0007] According to a second aspect of an embodiment of the present application, a chip is provided, comprising: a packaging substrate, at least one processor core and at least one reverse-coupled inductor as described in the first aspect above; the reverse-coupled inductor is arranged in a receiving hole opened on the packaging substrate, the output pad included in the reverse-coupled inductor is connected to the output circuit on the first surface of the packaging substrate, the input pad included in the reverse-coupled inductor is connected to the input circuit on the second surface of the packaging substrate, and the first surface of the packaging substrate is opposite to the second surface; the processor core is connected to the output circuit on the first surface of the packaging substrate; the input circuit on the second surface of the packaging substrate is connected to a power supply.

[0008] It can be seen from the above technical solution that the reverse coupling inductor includes multiple coils wrapped in a magnetic packaging material, and the magnetic packaging material can be used as a magnetic core, so that the inductor itself has a large inductance value and coupling inductance value, the overall efficiency of the power supply is high, and the dynamic response is good. The input end of the coil is connected to the input pad, and the output end of the coil is connected to the output pad. The input pad and the output pad are respectively arranged on two corresponding surfaces of the magnetic packaging material. The reverse coupling inductor can be arranged in the packaging substrate so that the first surface of the magnetic packaging material is opposite to the power supply, and the second surface of the magnetic packaging material is opposite to the processor core, so that the input pad is connected to the power supply, and the output pad is connected to the processor core, so that the input line and the output line of the reverse coupling inductor do not need to go from one side of the reverse coupling inductor to the other side, reducing the area of ​​the input and output loops, thereby reducing electromagnetic interference problems and improving dynamic response capabilities. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0010] Figure 1 is a schematic diagram of a reverse coupled inductor according to an embodiment of the present application;

[0011] Figure 2 is a schematic diagram of the internal structure of a reverse coupled inductor according to an embodiment of the present application;

[0012] Figure 3 is a schematic diagram of a reverse coupled inductor according to another embodiment of the present application;

[0013] Figure 4 is a schematic diagram of the internal structure of a reverse coupled inductor according to another embodiment of the present application;

[0014] Figure 5is a schematic diagram of the internal structure of a reverse coupled inductor according to another embodiment of the present application;

[0015] Figure 6 is a schematic diagram of a coil according to an embodiment of the present application;

[0016] Figure 7 is a schematic diagram of a coil of another embodiment of the present application;

[0017] Figure 8 It is a schematic diagram of a chip according to an embodiment of the present application. DETAILED DESCRIPTION

[0018] The present application is described below based on embodiments, but the present application is not limited to these embodiments. In the detailed description of the present application below, some specific details are described in detail. It is possible for a person skilled in the art to fully understand the present application without the description of these details. In order to avoid confusing the essence of the present application, known methods, processes, and flows are not described in detail. In addition, the drawings are not necessarily drawn to scale.

[0019] Reverse coupled inductor

[0020] Figure 1 FIG. 1 is a schematic diagram of a reverse coupled inductor according to an embodiment of the present application. Figure 1 As shown, the reverse coupled inductor 100 includes a magnetic package 104 and a plurality of coils 102. The coils 102 are enclosed in the magnetic package 104, a plurality of input pads 110 are disposed on a first surface of the magnetic package 104, a plurality of output pads 112 are disposed on a second surface of the magnetic package 104, and the first surface and the second surface of the magnetic package 104 are opposite to each other.

[0021] The input end of the coil 102 is connected to the input pad 110 through the first electrical connection portion 106, and the output end of the coil 102 is connected to the output pad 112 through the second electrical connection portion 108. Different coils 102 are connected to different input pads 110, and different coils 102 are connected to different output pads 112. When the coil 102 is energized, the current flows from the input pad 110 through the first electrical connection portion 106 connected to the coil 102, and then flows from the input end of the coil 102 to the output end. The current flows out of the output end of the coil 102 and flows into the second electrical connection portion 108 connected to the coil 102. The current from the second electrical connection portion 108 flows to the connected output pad 112.

[0022] The coil 102 includes a spiral structure, and the coil 102 is wrapped in a magnetic packaging material 104. The magnetic packaging material 104 located in the spiral of the coil 102 serves as a magnetic core. When the coil 102 is energized, a magnetic field is generated based on the principle of electromagnetic induction. The spiral direction of some coils 102 in the plurality of coils 102 is opposite to the spiral direction of other coils 102. The magnetic field directions of the magnetic fields generated by the coils 102 with different spiral directions are opposite, so when the coils 102 in the reverse coupling inductor 100 are energized, the coils 102 are reversely coupled.

[0023] Since the power supply and the processor core are distributed on both sides of the packaging substrate, the input pad 110 and the output pad 112 are respectively arranged on the two corresponding surfaces of the magnetic packaging material 104, so the reverse coupling inductor 100 can be arranged in the packaging substrate, so that the first surface of the magnetic packaging material 104 is opposite to the power supply, and the second surface of the magnetic packaging material 104 is opposite to the processor core, the input pad 110 is connected to the power supply, and the output pad 112 is connected to the processor core, so that the input line and the output line of the reverse coupling inductor 100 do not need to be folded back, thereby reducing the area of ​​the input and output loops, and the transient inductance in the circuit becomes smaller, thereby improving the dynamic response capability.

[0024] In the embodiment of the present application, the reverse coupled inductor 100 includes a plurality of coils 102 which are encapsulated in a magnetic packaging material 104. The magnetic packaging material 104 can be used as a magnetic core, so that the reverse coupled inductor 100 has a large inductance value. The input end of the coil 102 is connected to the input pad 110, and the output end of the coil 102 is connected to the output pad 112. The input pad 110 and the output pad 112 are respectively arranged on two corresponding surfaces of the magnetic packaging material 104. The reverse coupled inductor 100 can be arranged in a packaging substrate so that the first surface of the magnetic packaging material 104 is opposite to the power supply, and the second surface of the magnetic packaging material 104 is opposite to the processor core, so that the input pad 110 is connected to the power supply, and the output pad 112 is connected to the processor core, so that the input line and the output line of the reverse coupled inductor 100 do not need to go around from one side of the reverse coupled inductor 100 to the other side, which reduces the area of ​​the input and output loops, thereby reducing the electromagnetic interference problem.

[0025] In a possible implementation, the reverse coupled inductor 100 may include two or more coils 102 , and the number of the coils 102 may be an odd number or an even number, which is not limited in the embodiment of the present application.

[0026] Figure 2 FIG. 1 shows a schematic diagram of the internal structure of a reverse coupled inductor according to an embodiment of the present application. Figure 2As shown, the reverse coupled inductor 100 includes a coil 1021 and a coil 1022. The input end of the coil 1021 is connected to the input pad 1101 through the first electrical connection portion 1061, and the output end of the coil 1021 is connected to the output pad 1121 through the second electrical connection portion 1081. The input end of the coil 1022 is connected to the input pad 1102 through the first electrical connection portion 1062, and the output end of the coil 1022 is connected to the output pad 1122 through the second electrical connection portion 1082.

[0027] In order to clearly show the relative positions of the components in the reverse coupled inductor 100, Figure 2 The reverse coupled inductor 100 is divided into a layer section 201, a layer section 202, and a layer section 203. The first electrical connection portion 1061 and the first electrical connection portion 1062 can be seen from the longitudinal cross-sectional view of the layer section 201, the coil 1021 and the coil 1022 can be seen from the longitudinal cross-sectional view of the layer section 202, and the second electrical connection portion 1081 and the second electrical connection portion 1082 can be seen from the longitudinal cross-sectional view of the layer section 203. The first electrical connection portion 1061 and the first electrical connection portion 1062 can be seen from the top view of the layer section 201, the coil 1021 and the coil 1022 can be seen from the top view of the layer section 202, and the second electrical connection portion 1081 and the second electrical connection portion 1082 can be seen from the top view of the layer section 203.

[0028] like Figure 2 As shown, input pads 1101 and 1102 are arranged on the lower surface of the magnetic packaging material 104, and output pads 1121 and 1122 are arranged on the upper surface of the magnetic packaging material 104. When coil 1021 is energized, the direction of the magnetic field generated is directed to the upper surface of the magnetic packaging material 104, and when coil 1022 is energized, the direction of the magnetic field generated is directed to the lower surface of the magnetic packaging material 104. Since the directions of the magnetic fields generated by coil 1021 and coil 1022 are opposite, coil 1021 and coil 1022 are reversely coupled.

[0029] In a possible implementation, the multiple coils 102 included in the reverse coupled inductor 100 may constitute at least two coil pairs, and different coil pairs include different coils 102. The coil pair includes a first coil and a second coil, and the first coil and the second coil included in the same coil pair are reversely coupled when powered on. Each coil pair is arranged in sequence along a direction perpendicular to the first surface of the magnetic packaging material 104.

[0030] Figure 3 FIG. 1 is a schematic diagram of a reverse coupled inductor according to another embodiment of the present application. Figure 3As shown, the reverse coupled inductor 100 includes a plurality of coil pairs 30, which are arranged in sequence along a direction perpendicular to the first surface of the magnetic package 104, and the first surface and the second surface of the magnetic package 104 are parallel and opposite to each other. Each coil pair 30 includes a first coil and a second coil with opposite spiral directions, and the first coil and the second coil are reversely coupled when energized.

[0031] In the embodiment of the present application, the reverse coupled inductor 100 includes a plurality of coil pairs, each coil pair includes two coils 102 that are reversely coupled when powered on, so that when the reverse coupled inductor 100 is powered on, the reverse coupling effect of the coils 102 can be improved, thereby ensuring that the reverse coupled inductor 100 has a larger inductance value. The plurality of coil pairs are arranged in sequence along a direction perpendicular to the first surface of the magnetic packaging material 104, so that the size of the reverse coupled inductor 100 in a direction parallel to the first surface of the magnetic packaging material 104 is small, thereby reducing the occupied area of ​​the reverse coupled inductor 100 and facilitating the deployment of the reverse coupled inductor 100.

[0032] In a possible implementation, the first coil and the second coil included in the coil pair are arranged in a direction parallel to the first surface of the magnetic packaging material, and the first coil and the second coil included in the same coil pair are equidistant from the first surface of the magnetic packaging material.

[0033] Taking the reverse coupled inductor 100 including two coil pairs as an example, Figure 4 FIG. 1 shows a schematic diagram of the internal structure of a reverse coupled inductor according to an embodiment of the present application. Figure 4 As shown, the reverse coupled inductor 100 includes a first coil pair and a second coil pair, the first coil pair includes a first coil 1021 and a second coil 1022, and the second coil pair includes a first coil 1023 and a second coil 1024. The first coil 1021, the second coil 1022, the first coil 1023 and the second coil 1024 are all arranged in a direction parallel to the first surface of the magnetic packaging material 104. In the first coil pair, the distances between the first coil 1021 and the second coil 1022 and the first surface of the magnetic packaging material 104 are equal, that is, in a direction perpendicular to the first surface of the magnetic packaging material 104, the first coil 1021 and the second coil 1022 are located in the same layer segment of the magnetic packaging material 104 (such as Figure 4 In the second coil pair, the first coil 1023 and the second coil 1024 are at equal distances from the first surface of the magnetic packaging material 104, that is, in a direction perpendicular to the first surface of the magnetic packaging material 104, the first coil 1023 and the second coil 1024 are located in the same layer segment of the magnetic packaging material 104 (e.g. Figure 4 Layer segment 404 in.

[0034] like Figure 4As shown, the input end of the first coil 1021 is connected to the input pad 1101 through the first electrical connection portion 1061, and the output end of the first coil 1021 is connected to the output pad 1121 through the second electrical connection portion 1081. The input end of the second coil 1022 is connected to the input pad 1102 through the first electrical connection portion 1062, and the output end of the second coil 1022 is connected to the output pad 1122 through the second electrical connection portion 1082. The input end of the first coil 1023 is connected to the input pad 1103 through the first electrical connection portion 1063, and the output end of the first coil 1023 is connected to the output pad 1123 through the second electrical connection portion 1083. The input end of the second coil 1024 is connected to the input pad 1104 through the first electrical connection portion 1124, and the output end of the second coil 1024 is connected to the output pad 1124 through the second electrical connection portion 1084.

[0035] In order to clearly show the relative positions of the components in the reverse coupled inductor 100, Figure 4 The reverse coupled inductor 100 is divided into a layer segment 401 , a layer segment 402 , a layer segment 403 , a layer segment 404 , and a layer segment 405 .

[0036] The first electrical connection 1061, the first electrical connection 1062, the first electrical connection 1063, and the first electrical connection 1064 can be seen from the longitudinal cross-sectional view of the layer segment 401. The first coil 1021, the second coil 1022, the first electrical connection 1063 (not shown), and the first electrical connection 1064 can be seen from the longitudinal cross-sectional view of the layer segment 402. The first electrical connection 1063, the first electrical connection 1064, the second electrical connection 1081, and the second electrical connection 1082 can be seen from the longitudinal cross-sectional view of the layer segment 403 (the second electrical connection 1081 is blocked by the first electrical connection 1063, and the second electrical connection 1082 is blocked by the first electrical connection 1064). The first coil 1023, the second coil 1024, the second electrical connection 1081 (not shown), and the second electrical connection 1082 can be seen from the longitudinal cross-sectional view of the layer segment 404. The second electrical connection 1081 , the second electrical connection 1082 , the second electrical connection 1083 and the second electrical connection 1084 can be seen from the longitudinal cross-sectional view of the layer segment 405 .

[0037] The first electrical connection 1061, the first electrical connection 1062, the first electrical connection 1063, and the first electrical connection 1064 can be seen from the top view of the layer section 401. The first coil 1021 and the second coil 1022 can be seen from the top view of the layer section 402. The first electrical connection 1063, the first electrical connection 1064, the second electrical connection 1081 and the second electrical connection 1082 can be seen from the top view of the layer section 403. The first coil 1023 and the second coil 1024 can be seen from the top view of the layer section 404. The second electrical connection 1081, the second electrical connection 1082, the second electrical connection 1083, and the second electrical connection 1084 can be seen from the top view of the layer section 405.

[0038] It should be noted that the first electrical connection portion can be bent to solve the problem of interference with other coils when the first electrical connection portion is connected to the input pad and the coil input end. For example, the first electrical connection portion 1063 can be bent to solve the problem of interference with the first coil 1021. The second electrical connection portion can be bent to solve the problem of interference with other coils when the second electrical connection portion is connected to the output pad and the coil output end. For example, the second electrical connection portion 1081 can be bent to solve the problem of reflection with the second coil 1024.

[0039] It should also be noted that the positions of the first coil and the second coil can be appropriately set to leave space for the first electrical connection part and / or the second electrical connection part to pass through, thereby solving the problem of interference between the first electrical connection part and / or the second electrical connection part and the coil.

[0040] like Figure 4 As shown, input pads 1101 , 1102 , 1103 , and 1104 are disposed on the lower surface of the magnetic packaging material 104 , and output pads 1121 , 1122 , 1123 , and 1124 are disposed on the upper surface of the magnetic packaging material 104 .

[0041] When the first coil 1021 is energized, the direction of the magnetic field generated points to the upper surface of the magnetic packaging material 104, and when the second coil 1022 is energized, the direction of the magnetic field generated points to the lower surface of the magnetic packaging material 104. Since the directions of the magnetic fields generated by the first coil 1021 and the second coil 1022 are opposite, the first coil 1021 and the second coil 1022 are reversely coupled.

[0042] When the first coil 1023 is energized, the direction of the magnetic field generated points to the lower surface of the magnetic packaging material 104, and when the second coil 1024 is energized, the direction of the magnetic field generated points to the upper surface of the magnetic packaging material 104. Since the directions of the magnetic fields generated by the first coil 1023 and the second coil 1024 are opposite, the first coil 1023 and the second coil 1024 are reversely coupled.

[0043] In an embodiment of the present application, the first coil and the second coil included in the coil pair are both arranged in a direction parallel to the first surface of the magnetic packaging material, and the distances between the first coil and the second coil included in the same coil pair and the first surface of the magnetic packaging material are equal, so that the size of the reverse coupling inductor in the direction perpendicular to the first surface of the magnetic packaging material is smaller, even if the reverse coupling inductor is thinner, thereby facilitating the deployment of the reverse coupling inductor.

[0044] In a possible implementation, the first coil and the second coil included in the coil pair are arranged in a direction parallel to the first surface of the magnetic packaging material, and the first coil and the second coil included in the same coil pair are arranged in sequence in a direction perpendicular to the first surface of the magnetic packaging material. In the direction perpendicular to the first surface of the magnetic packaging material, adjacent coils are reversely coupled when powered on.

[0045] Taking the reverse coupled inductor 100 including two coil pairs as an example, Figure 5 FIG. 1 shows a schematic diagram of the internal structure of a reverse coupled inductor according to an embodiment of the present application. Figure 5 As shown, the reverse coupled inductor 100 includes a first coil pair and a second coil pair, the first coil pair includes a first coil 1021 and a second coil 1022, and the second coil pair includes a first coil 1023 and a second coil 1024. The first coil 1021, the second coil 1022, the first coil 1023 and the second coil 1024 are all arranged in a direction parallel to the first surface of the magnetic packaging material 104. In the first coil pair, the first coil 1021 and the second coil 1022 are arranged in sequence in a direction perpendicular to the first surface of the magnetic packaging material 104, that is, in the direction perpendicular to the first surface of the magnetic packaging material 104, the first coil 1021 and the second coil 1022 are located in different layers in the magnetic packaging material 104, the first coil 1021 is located in the layer 502, and the second coil 1022 is located in the layer 503. In the second coil pair, the first coil 1023 and the second coil 1024 are arranged in sequence along the direction perpendicular to the first surface of the magnetic packaging material 104, that is, in the direction perpendicular to the first surface of the magnetic packaging material 104, the first coil 1023 and the second coil 1024 are located in different layers in the magnetic packaging material 104, the first coil 1023 is located in layer segment 504, and the second coil 1024 is located in layer segment 505.

[0046] like Figure 5As shown, the input end of the first coil 1021 is connected to the input pad 1101 through the first electrical connection portion 1061, and the output end of the first coil 1021 is connected to the output pad 1121 through the second electrical connection portion 1081. The input end of the second coil 1022 is connected to the input pad 1102 through the first electrical connection portion 1062, and the output end of the second coil 1022 is connected to the output pad 1122 through the second electrical connection portion 1082. The input end of the first coil 1023 is connected to the input pad 1103 through the first electrical connection portion 1063, and the output end of the first coil 1023 is connected to the output pad 1123 through the second electrical connection portion 1083. The input end of the second coil 1024 is connected to the input pad 1104 through the first electrical connection portion 1124, and the output end of the second coil 1024 is connected to the output pad 1124 through the second electrical connection portion 1084.

[0047] In order to clearly show the relative positions of the components in the reverse coupled inductor 100, Figure 5 The reverse coupled inductor 100 is divided into a layer segment 501 , a layer segment 502 , a layer segment 503 , a layer segment 504 , a layer segment 505 , and a layer segment 506 .

[0048] The first electrical connection 1061, the first electrical connection 1062, the first electrical connection 1063 and the first electrical connection 1064 can be seen from the longitudinal cross-sectional view of the layer segment 501. The first coil 1021, the first electrical connection 1062 (not shown), the first electrical connection 1063 (not shown) and the first electrical connection 1064 can be seen from the longitudinal cross-sectional view of the layer segment 502. The second coil 1022, the first electrical connection 1063 (not shown), the first electrical connection 1064 and the second electrical connection 1081 (not shown) can be seen from the longitudinal cross-sectional view of the layer segment 503. The second coil 1024, the first electrical connection 1063 (not shown), the second electrical connection 1081 (not shown) and the second electrical connection 1082 (not shown) can be seen from the longitudinal cross-sectional view of the layer segment 504. The first coil 1023, the second electrical connection 1081 (not shown), the second electrical connection 1082 and the second electrical connection 1084 (not shown) can be seen from the longitudinal cross-sectional view of the layer segment 505. The second electrical connection 1081 , the second electrical connection 1082 , the second electrical connection 1083 and the second electrical connection 1084 can be seen from the longitudinal cross-sectional view of the layer segment 505 .

[0049] From the top view of the layer section 501, the first electrical connection 1061, the first electrical connection 1062, the first electrical connection 1063, and the first electrical connection 1064 can be seen. From the top view of the layer section 502, the first coil 1021, the first electrical connection 1062, the first electrical connection 1063 (not shown), and the first electrical connection 1064 can be seen. From the top view of the layer section 503, the second coil 1022, the first electrical connection 1063, the first electrical connection 1064, and the second electrical connection 1081 can be seen. From the top view of the layer section 504, the second coil 1024, the first electrical connection 1063, the second electrical connection 1081 (not shown), and the second electrical connection 1082 can be seen. From the top view of the layer section 505, the first coil 1023, the second electrical connection 1081, the second electrical connection 1082, and the second electrical connection 1084 can be seen. The second electrical connection 1081 , the second electrical connection 1082 , the second electrical connection 1083 and the second electrical connection 1084 can be seen from the top view of the layer segment 505 .

[0050] It should be noted that the first electrical connection portion can be bent to solve the problem of interference with other coils when the first electrical connection portion is connected to the input pad and the coil input end. For example, the first electrical connection portion 1063 can be bent to solve the problem of interference with the first coil 1021. The second electrical connection portion can be bent to solve the problem of interference with other coils when the second electrical connection portion is connected to the output pad and the coil output end. For example, the second electrical connection portion 1081 can be bent to solve the problem of reflection with the second coil 1024.

[0051] It should also be noted that the positions of the first coil and the second coil can be appropriately set to leave space for the first electrical connection part and / or the second electrical connection part to pass through, thereby solving the problem of interference between the first electrical connection part and / or the second electrical connection part and the coil.

[0052] like Figure 5 As shown, input pads 1101, 1102, 1103 and 1104 are arranged on the lower surface of the magnetic packaging material 104, and output pads 1121, 1122, 1123 and 1124 are arranged on the upper surface of the magnetic packaging material 104. In a direction perpendicular to the first aspect of the magnetic packaging material 104, the first coil 1021, the second coil 1022, the second coil 1024 and the first coil 1023 are arranged in sequence.

[0053] When the first coil 1021 is energized, the direction of the magnetic field generated is directed to the upper surface of the magnetic packaging material 104, and when the second coil 1022 is energized, the direction of the magnetic field generated is directed to the lower surface of the magnetic packaging material 104. Since the directions of the magnetic fields generated by the first coil 1021 and the second coil 1022 are opposite, the first coil 1021 and the second coil 1022 are reversely coupled. When the second coil 1022 is energized, the direction of the magnetic field generated is directed to the lower surface of the magnetic packaging material 104, and when the second coil 1024 is energized, the direction of the magnetic field generated is directed to the upper surface of the magnetic packaging material 104. Since the directions of the magnetic fields generated by the second coil 1022 and the second coil 1024 are opposite, the second coil 1022 and the second coil 1024 are reversely coupled. When the second coil 1024 is energized, the direction of the magnetic field generated is directed to the upper surface of the magnetic packaging material 104, and when the first coil 1023 is energized, the direction of the magnetic field generated is directed to the upper surface of the magnetic packaging material 104. Since the directions of the magnetic fields generated by the second coil 1024 and the first coil 1023 are opposite, the second coil 1024 and the first coil 1023 are reversely coupled.

[0054] In an embodiment of the present application, the first coil and the second coil included in the coil pair are both arranged in a direction parallel to the first surface of the magnetic packaging material, and the first coil and the second coil included in the same coil pair are arranged in sequence in a direction perpendicular to the first surface of the magnetic packaging material. In the direction perpendicular to the first surface of the magnetic packaging material, adjacent coils are reversely coupled when energized, which facilitates the arrangement of the coils in the magnetic packaging material.

[0055] In one possible implementation, the coil includes a first conductive part and a second conductive part that are perpendicular to each other, both of which are rectangular sheet structures, and the first conductive part and the second conductive part are connected through a third conductive part of a fan-shaped sheet structure; one end of the first conductive part away from the third conductive part is connected to the first electrical connection part; and one end of the second conductive part away from the third conductive part is connected to the second electrical connection part.

[0056] Figure 6 Schematic diagram of a coil according to an embodiment of the present application. Figure 6 As shown, the coil 102 includes a first conductive portion 601 and a second conductive portion 602 that are perpendicular to each other. The first conductive portion 601 and the second conductive portion 602 are both rectangular sheet structures. The first conductive portion 601 and the second conductive portion 602 are connected through a third conductive portion 603 of a fan-shaped sheet structure. One end of the first conductive portion 601 away from the third conductive portion 603 is connected to the first electrical connection portion 106. One end of the second conductive portion 602 away from the third conductive portion 603 is connected to the second electrical connection portion 108.

[0057] When the coil 102 is energized, current flows from the first electrical connection portion 106 into the first conductive portion 601 , then from the first conductive portion 601 into the third conductive portion 603 , then from the third conductive portion 603 into the second conductive portion 602 , and then flows out from the second electrical connection portion 108 .

[0058] In an embodiment of the present application, the coil includes a first conductive part and a second conductive part arranged vertically, and the first conductive part and the second conductive part are connected by a third conductive part of a fan-shaped sheet structure, so that the structure of the coil is simple and the production difficulty is relatively low.

[0059] In a possible implementation, the coil may be a fan-shaped sheet structure, one end of the coil is connected to the first electrical connection portion, and the other end of the coil is connected to the second electrical connection portion.

[0060] Figure 7 FIG. 1 is a schematic diagram of a coil of another embodiment of the present application. Figure 7 As shown, the coil 102 is a fan-shaped sheet structure, one end of the coil 102 is connected to the first electrical connection portion 106 , and the other end of the coil 102 is connected to the second electrical connection portion 108 .

[0061] When the coil 102 is energized, the current flows from the first electrical connection portion 106 into the coil 102 , then flows from the coil 102 into the second electrical connection portion 108 , and then flows out from the second electrical connection portion 108 .

[0062] It should be noted that the fan-shaped sheet structure of the coil is only an example of an embodiment of the present application, and the coil may also be any other suitable structure, for example, the coil may also be an arc structure, an elliptical structure or a rectangular structure, etc.

[0063] In the embodiment of the present application, the coil is a fan-shaped sheet structure, which makes the structure of the coil simple and facilitates the manufacture of the coil, thereby reducing the manufacturing cost and difficulty of the reverse coupled inductor.

[0064] The shape of the magnetic field generated by the coil 102 when energized can be made simpler, thereby improving the effect of magnetic field cancellation.

[0065] In one possible implementation, the coil is Figure 6 or Figure 7 In the structure shown, the projection centers of the first coil and the second coil included in the same coil pair on the first surface of the magnetic packaging material are symmetrical.

[0066] In the embodiment of the present application, the projection centers of the first coil and the second coil included in the same coil pair on the first surface of the magnetic packaging material are symmetrical, which can enhance the reverse coupling effect of the first coil and the second coil in the same coil, thereby improving the performance of the reverse coupling inductor.

[0067] In a possible implementation, the coil may be made of conductive metal materials such as copper or photosensitive silver paste.

[0068] In the embodiment of the present application, when the material of the coil is copper alloy, the coil has better conductivity and can increase the speed at which current flows. When the material of the coil is photosensitive silver paste, it can have better stability while maintaining high conductivity.

[0069] In a possible implementation, the material of the magnetic packaging material may be a non-conductive magnetic material such as an iron-nickel alloy.

[0070] In an embodiment of the present application, the material of the magnetic packaging material can be a non-conductive iron-nickel alloy, so that the magnetic packaging material will not shunt the current flowing into the coil, thereby ensuring the integrity of the electrical signal transmitted by the reverse coupled inductor, and can also bind the magnetic field lines generated by the coil, thereby improving the self-inductance and mutual inductance of the reverse coupled inductor.

[0071] chip

[0072] Figure 8 FIG. 1 is a schematic diagram of a chip according to an embodiment of the present application. Figure 8 As shown, the chip 800 includes a packaging substrate 802 , at least one processor core 804 , and at least one reverse coupled inductor 100 as in any of the above embodiments.

[0073] The reverse coupled inductor 100 is arranged in a receiving hole opened on the packaging substrate 802. The output pad 112 included in the reverse coupled inductor 100 is connected to the output circuit 8021 on the first surface of the packaging substrate 802. The input pad 110 included in the reverse coupled inductor 100 is connected to the input circuit 8022 on the second surface of the packaging substrate 802. The first surface of the packaging substrate 802 is opposite to the second surface.

[0074] The output circuit 8021 on the first surface of the package substrate 802 is connected to the processor core 804 in the die. In an example, the output pad 112 is connected to the output capacitor included in the output circuit 8021, and the output capacitor is connected to the processor core 804 through a trace.

[0075] The input circuit 8022 on the second surface of the package substrate 802 may include a MOS transistor, etc. The input circuit 8022 is connected to the power supply 700 for supplying power to the processor core 804 .

[0076] In a working scenario of the chip 600, the power supply 700 supplies power to the packaging substrate 802, the reverse coupling inductor 100 connected to the output circuit 8021 on the first surface of the packaging substrate 802, and at least one processor core 804 connected to the output circuit 8021 on the first surface of the packaging substrate 802 through the input circuit 8022 on the second surface of the packaging substrate 802. When an external electrical signal flows into the packaging substrate 802, it is transmitted to the reverse coupling inductor 100 through the input circuit 8022 on the second surface of the packaging substrate 802. After the electrical signal flows through the reverse coupling inductor 100, it is output by the reverse coupling inductor 100 to the output circuit 8021 on the first surface of the packaging substrate 802. After that, the processor core 804 can obtain the electrical signal output by the reverse coupling inductor 100 through the output circuit 8021 on the first surface of the packaging substrate 802.

[0077] It should be noted that the embodiment of the present application does not limit the type and function of the chip 800. For example, the chip 800 may be a processing unit (Central Processing Unit, CPU) or a graphics processing unit (Graphics Processing Unit, GPU).

[0078] In the embodiment of the present application, the reverse coupled inductor 100 is arranged in a receiving hole opened on the packaging substrate, so that the first surface of the magnetic packaging material 104 is opposite to the power supply, and the second surface of the magnetic packaging material 104 is opposite to the processor core, so that the input pad 110 is connected to the power supply, and the output pad 112 is connected to the processor core, so that the input line and the output line of the reverse coupled inductor 100 do not need to go around from one side of the reverse coupled inductor 100 to the other side, thereby reducing the area of ​​the input and output loops, thereby reducing electromagnetic interference problems.

[0079] It should be pointed out that, according to the needs of implementation, the various components / steps described in the embodiments of the present application can be split into more components / steps, or two or more components / steps or partial operations of components / steps can be combined into new components / steps to achieve the purpose of the embodiments of the present application.

[0080] It should be noted that the user-related information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to sample data used to train the model, data used for analysis, stored data, displayed data, etc.) involved in the embodiments of the present disclosure are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data need to comply with relevant laws, regulations and standards of relevant countries and regions, and provide corresponding operation entrances for users to choose to authorize or refuse.

[0081] It should be understood that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to each other, and the embodiments focus on the differences from other embodiments. In particular, for the method embodiment, since it is basically similar to the method described in the device and system embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of other embodiments.

[0082] It should be understood that the above is a description of a specific embodiment of the present specification. Other embodiments are within the scope of the claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0083] It should be understood that an element described in singular form herein or shown in the drawings as only one does not limit the number of the element to one. In addition, modules or elements described or shown as separate herein may be combined into a single module or element, and modules or elements described or shown as single herein may be split into multiple modules or elements.

[0084] It should also be understood that the terms and expressions used herein are for description only, and one or more embodiments of this specification should not be limited to these terms and expressions. The use of these terms and expressions does not mean to exclude any equivalent features of the illustrations and descriptions (or parts thereof), and it should be recognized that various modifications that may exist should also be included in the scope of the claims. Other modifications, changes and substitutions may also exist. Accordingly, the claims should be deemed to cover all such equivalents.

Claims

1. A reverse coupled inductor, comprising: Magnetic packaging material and multiple coils; The plurality of coils are enclosed in the magnetic packaging material, the input end of the coil is connected to the input pad located on the first surface of the magnetic packaging material through a first electrical connection portion, and the output end of the coil is connected to the output pad located on the second surface of the magnetic packaging material through a second electrical connection portion, the first surface of the magnetic packaging material is opposite to the second surface, and different coils are connected to different input pads and output pads; The plurality of coils are reversely coupled when energized; The plurality of coils include at least two coil pairs, the coil pairs include a first coil and a second coil, and the first coil and the second coil included in the same coil pair are reversely coupled when powered on; The at least two coil pairs are arranged in sequence along a direction perpendicular to the first surface of the magnetic packaging material; The first coil and the second coil are arranged in a direction parallel to the first surface of the magnetic packaging material, and the first coil and the second coil included in the same coil pair are arranged in sequence in a direction perpendicular to the first surface of the magnetic packaging material; In a direction perpendicular to the first surface of the magnetic package material, adjacent coils are reversely coupled when energized.

2. The reverse coupled inductor according to claim 1, wherein: The coil comprises a first conductive part and a second conductive part which are perpendicular to each other, the first conductive part and the second conductive part are both rectangular sheet structures, and the first conductive part and the second conductive part are connected via a third conductive part with a fan-shaped sheet structure; One end of the first conductive portion away from the third conductive portion is connected to the first electrical connection portion; One end of the second conductive portion away from the third conductive portion is connected to the second electrical connection portion.

3. The reverse coupled inductor according to claim 1, wherein: The coil is a fan-shaped sheet structure, one end of the coil is connected to the first electrical connection part, and the other end of the coil is connected to the second electrical connection part.

4. The reverse coupled inductor according to claim 2 or 3, wherein: The first coil and the second coil included in the same coil pair are symmetrical in projection center on the first surface of the magnetic packaging material.

5. The reverse coupled inductor according to any one of claims 1 to 4, wherein: The material of the coil includes copper or photosensitive silver paste.

6. The reverse coupled inductor according to any one of claims 1 to 4, wherein: The material of the magnetic packaging material includes a non-conductive iron-nickel alloy.

7. A chip, comprising: A packaging substrate, at least one processor core and at least one reverse coupled inductor as claimed in any one of claims 1 to 6; The reverse coupling inductor is arranged in the receiving hole opened on the packaging substrate, the output pad included in the reverse coupling inductor is connected to the output circuit on the first surface of the packaging substrate, and the input pad included in the reverse coupling inductor is connected to the input circuit on the second surface of the packaging substrate, and the first surface and the second surface of the packaging substrate are opposite to each other; The processor core is connected to the output circuit on the first surface of the packaging substrate; The input circuit on the second surface of the package substrate is connected to a power source.

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